U.S. patent number D323,628 [Application Number 07/343,124] was granted by the patent office on 1992-02-04 for semiconductor wafer measuring instrument.
This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Itaru Takao.
United States Patent |
D323,628 |
Takao |
February 4, 1992 |
Semiconductor wafer measuring instrument
Claims
The ornamental design for a semiconductor wafer measuring
instrument, as shown and described.
Inventors: |
Takao; Itaru (Yamanashi,
JP) |
Assignee: |
Tokyo Electron Limited (Tokyo,
JP)
|
Appl.
No.: |
07/343,124 |
Filed: |
April 25, 1989 |
Current U.S.
Class: |
D10/46 |
Field of
Search: |
;D10/46,75,81
;269/13,14,20,21,296,903 ;324/158P
;414/222,225,589,590,627,673,752 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Dunkins; Bruce W.
Assistant Examiner: Davis; Antoine D.
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt
Description
FIG. 1 is a top, front and right side perspective view of a
semiconductor wafer measuring instrument showing my new design;
FIG. 2 is a front elevational view;
FIG. 3 is a right side elevational view, the left side elevational
view being a mirror image;
FIG. 4 is a top plan view;
FIG. 5 is a rear elevational view; and
FIG. 6 is a bottom plan view thereof.
* * * * *