U.S. patent number D314,185 [Application Number 07/141,374] was granted by the patent office on 1991-01-29 for electronic equipment housing.
This patent grant is currently assigned to Schroff GmbH. Invention is credited to Paul Mazura, Johann Stein.
United States Patent |
D314,185 |
Mazura , et al. |
January 29, 1991 |
**Please see images for:
( Certificate of Correction ) ** |
Electronic equipment housing
Claims
The ornamental design for an electronic equipment housing, as shown
and described.
Inventors: |
Mazura; Paul (Karlsbad,
DE), Stein; Johann (Pforzheim, DE) |
Assignee: |
Schroff GmbH (Straubenhardt,
DE)
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Appl.
No.: |
07/141,374 |
Filed: |
January 7, 1988 |
Foreign Application Priority Data
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Jul 9, 1987 [DE] |
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MR X/4807 |
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Current U.S.
Class: |
D13/184 |
Field of
Search: |
;D13/40
;361/331,379,380,381,390,415,429 ;312/330.1,257.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
The Analog Device Housings on p. 7 of Electrical Review vol. 216
No. 3 1-25-85 Located in PTO Scientific Library. .
Aerotech Housings on p. 128 of Design News, 12-1-86 Located in the
PTO Scientific Library..
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Primary Examiner: Lucas; Susan J.
Assistant Examiner: Sincavage; Joel
Attorney, Agent or Firm: Spencer & Frank
Description
FIG. 1 is a perspective view of a first embodiment of an electronic
equipment housing showing our design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is an elevational view of one side thereof, the other side
being a mirror-image thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view of a second embodiment of an
electronic equipment housing showing our new design, the top plan
and bottom plan views being the same as FIGS. 5 and 6
respectively;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is an elevational view of one side thereof, the other side
being a mirror-image thereof;
FIG. 11 is a perspective view of a third embodiment of an
electronic equipment housing showing our new design, the top plan
and bottom plan views being the same as FIGS. 5 and 6
respectively;
FIG. 12 is a front elevational view thereof;
FIG. 13 is a rear elevational view thereof;
FIG. 14 is an elevational view of one side thereof, the other side
being a mirror-image thereof.
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