Electronic equipment housing

Mazura , et al. January 29, 1

Patent Grant D314185

U.S. patent number D314,185 [Application Number 07/141,374] was granted by the patent office on 1991-01-29 for electronic equipment housing. This patent grant is currently assigned to Schroff GmbH. Invention is credited to Paul Mazura, Johann Stein.


United States Patent D314,185
Mazura ,   et al. January 29, 1991
**Please see images for: ( Certificate of Correction ) **

Electronic equipment housing

Claims

The ornamental design for an electronic equipment housing, as shown and described.
Inventors: Mazura; Paul (Karlsbad, DE), Stein; Johann (Pforzheim, DE)
Assignee: Schroff GmbH (Straubenhardt, DE)
Appl. No.: 07/141,374
Filed: January 7, 1988

Foreign Application Priority Data

Jul 9, 1987 [DE] MR X/4807
Current U.S. Class: D13/184
Field of Search: ;D13/40 ;361/331,379,380,381,390,415,429 ;312/330.1,257.1

References Cited [Referenced By]

U.S. Patent Documents
D212950 December 1968 Gruye et al.
D299465 January 1989 Helstab
4690286 September 1987 Horne et al.
Foreign Patent Documents
1282113 Nov 1968 DE

Other References

The Analog Device Housings on p. 7 of Electrical Review vol. 216 No. 3 1-25-85 Located in PTO Scientific Library. .
Aerotech Housings on p. 128 of Design News, 12-1-86 Located in the PTO Scientific Library..

Primary Examiner: Lucas; Susan J.
Assistant Examiner: Sincavage; Joel
Attorney, Agent or Firm: Spencer & Frank

Description



FIG. 1 is a perspective view of a first embodiment of an electronic equipment housing showing our design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is an elevational view of one side thereof, the other side being a mirror-image thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view of a second embodiment of an electronic equipment housing showing our new design, the top plan and bottom plan views being the same as FIGS. 5 and 6 respectively;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is an elevational view of one side thereof, the other side being a mirror-image thereof;

FIG. 11 is a perspective view of a third embodiment of an electronic equipment housing showing our new design, the top plan and bottom plan views being the same as FIGS. 5 and 6 respectively;

FIG. 12 is a front elevational view thereof;

FIG. 13 is a rear elevational view thereof;

FIG. 14 is an elevational view of one side thereof, the other side being a mirror-image thereof.

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