High density component mounting back panel for electronic equipment

Description

FIG. 1 is a top, front perspective view of a high density component mounting back panel for electronic equipment showing our new design;

FIG. 2 is a bottom rear perspective view thereof;

FIg. 3 is an enlarged top plan view thereof, the mounted receptacle blocks being omitted for purposes of disclosure;

FIG. 4 is an enlarged bottom plan view thereof, the mounted elements being omitted for purposes of disclosure;

FIG. 5 is a side elevational view thereof;

FIG. 6 is a front elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

The characteristic feature of the invention is the front and rear surface ornamentation provided by dark areas of conductive material as shown in FIGS. 3 and 4 and the arrangement of receptacles upon the front and rear surfaces as shown in FIGS. 1, 2, and 5-7. The contrasting dark areas on the circuit board are omitted in FIGS. 1 and 2 for ease of illustration.

The receptacle blocks and the apertures thereon are partially shown for convenience of illustration, it being understood that the receptacles and apertures are continuous across the board and receptacles respectively as indicated by the broken lines.

Claims

The ornamental design for high density component mounting back panel for electronic equipment as shown and described.

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Inventors:	Littlefield; Bruce G. (Honeoye Falls, NY), Caplan; Jerome S. (Henrietta, NY), Breidenstein; Charles J. (Rochester, NY)
Assignee:	Redcom Laboratories, Inc. (Fairport, NY)
Appl. No.:	06/178,641
Filed:	August 15, 1980

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Current U.S. Class:	D13/147; D13/182
Field of Search:	;D13/24,41,12,99,40 ;339/17C,17M,18R,18B ;174/68.5 ;361/415,412,403,399

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References Cited [Referenced By]

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U.S. Patent Documents

3300686	January 1967	Johnson et al.
3838317	September 1974	Coyne
4160880	July 1979	Brey

Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: LuKacher; Martin