U.S. patent number D772,962 [Application Number D/526,970] was granted by the patent office on 2016-11-29 for molding die for pipe bending.
This patent grant is currently assigned to SANGO CO., LTD.. The grantee listed for this patent is Sango Co., Ltd.. Invention is credited to Kentaro Nodu.
United States Patent |
D772,962 |
Nodu |
November 29, 2016 |
Molding die for pipe bending
Claims
CLAIM The ornamental design for a molding die for pipe bending, as
shown and described.
Inventors: |
Nodu; Kentaro (Nagakute,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Sango Co., Ltd. |
Miyoshi-shi, Aichi-ken |
N/A |
JP |
|
|
Assignee: |
SANGO CO., LTD. (Aichi-Ken,
JP)
|
Appl.
No.: |
D/526,970 |
Filed: |
May 14, 2015 |
Foreign Application Priority Data
|
|
|
|
|
Nov 26, 2014 [JP] |
|
|
2014-26378 |
|
Current U.S.
Class: |
D15/136 |
Current International
Class: |
1509 |
Field of
Search: |
;D15/135,136,137,138
;D23/266 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Palasik; Patricia
Attorney, Agent or Firm: Buchanan Ingersoll & Rooney
PC
Description
FIG. 1 is a left side, front and top perspective view of a molding
die for pipe bending showing my new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left side elevational view thereof.
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken line showing in the drawing figures is included to show
unclaimed subject matter only and forms no part of the claimed
design.
* * * * *