U.S. patent number D604,705 [Application Number D/324,573] was granted by the patent office on 2009-11-24 for heat dissipation device. This patent grant is currently assigned to Foxconn Technology Co., Ltd.. Invention is credited to Chun-Chi Chen, Yi-Qiang Wu.
United States Patent | D604,705 |
Wu , et al. | November 24, 2009 |
Inventors: | Wu; Yi-Qiang (Shenzhen, CN), Chen; Chun-Chi (Taipei Hsien, TW) |
---|---|
Assignee: | Foxconn Technology Co., Ltd.
(Tu-Cheng, Taipei Hsien, TW) |
Appl. No.: | D/324,573 |
Filed: | September 15, 2008 |
Current U.S. Class: | D13/179 |
Current International Class: | 1303 |
Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
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2007/0295488 | December 2007 | Fielding et al. |
2008/0017350 | January 2008 | Hwang et al. |
2009/0009969 | January 2009 | Chu |
2009/0056918 | March 2009 | Li et al. |
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