Heat dissipation device
Wu , et al. November 24, 2
U.S. patent number D604,705 [Application Number D/324,573] was granted by the patent office on 2009-11-24 for heat dissipation device. This patent grant is currently assigned to Foxconn Technology Co., Ltd.. Invention is credited to Chun-Chi Chen, Yi-Qiang Wu.
| United States Patent | D604,705 |
| Wu , et al. | November 24, 2009 |
Heat dissipation device
Claims
CLAIM The ornamental design for a heat dissipation device, as shown and described.
| Inventors: | Wu; Yi-Qiang (Shenzhen, CN), Chen; Chun-Chi (Taipei Hsien, TW) |
|---|---|
| Assignee: | Foxconn Technology Co., Ltd.
(Tu-Cheng, Taipei Hsien, TW) |
| Appl. No.: | D/324,573 |
| Filed: | September 15, 2008 |
| Current U.S. Class: | D13/179 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/179 ;165/80.3,104.33,151,122,185 ;257/706,707,718-722 ;361/687,695,697,700,702,704,709,710,711,719 |
References Cited [Referenced By]
U.S. Patent Documents
| D475354 | June 2003 | Wang |
| 2005/0133199 | June 2005 | Lo |
| 2007/0095508 | May 2007 | Xia et al. |
| 2007/0295488 | December 2007 | Fielding et al. |
| 2008/0017350 | January 2008 | Hwang et al. |
| 2009/0009969 | January 2009 | Chu |
| 2009/0056918 | March 2009 | Li et al. |
Attorney, Agent or Firm: Niranjan; Frank R.
Description
FIG. 1 is a perspective view of a heat dissipation device showing our new design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a left-side, elevational view thereof.
FIG. 5 is a right-side, elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines shown in the figures are included for the purpose of illustrating portions of the heat dissipation device that form no part of the claimed design.
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