U.S. patent number 9,829,607 [Application Number 15/082,740] was granted by the patent office on 2017-11-28 for optical member, display device including the same and manufacturing method thereof.
This patent grant is currently assigned to LG Innotek Co., Ltd.. The grantee listed for this patent is LG INNOTEK CO., LTD.. Invention is credited to Gwang Hei Choi, Sun Hwa Lee, Jeong Taek Oh.
United States Patent |
9,829,607 |
Lee , et al. |
November 28, 2017 |
Optical member, display device including the same and manufacturing
method thereof
Abstract
Disclosed are an optical member, a display device including the
same and a method of manufacturing the same. The optical member
includes a wavelength conversion layer; and a capping part covering
lateral sides of the wavelength conversion layer. The capping part
includes an organic substance and an inorganic substance to improve
the sealing function of the wavelength conversion layer.
Inventors: |
Lee; Sun Hwa (Seoul,
KR), Oh; Jeong Taek (Seoul, KR), Choi;
Gwang Hei (Seoul, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
LG INNOTEK CO., LTD. |
Seoul |
N/A |
KR |
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|
Assignee: |
LG Innotek Co., Ltd. (Seoul,
KR)
|
Family
ID: |
47041790 |
Appl.
No.: |
15/082,740 |
Filed: |
March 28, 2016 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20160209553 A1 |
Jul 21, 2016 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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14112862 |
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9322961 |
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PCT/KR2011/009872 |
Dec 20, 2011 |
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Foreign Application Priority Data
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Apr 21, 2011 [KR] |
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10-2011-0037543 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G02F
1/133524 (20130101); G02B 6/005 (20130101); G02B
1/10 (20130101); G02F 1/133603 (20130101); G02B
1/105 (20130101); G02F 1/1339 (20130101); G02F
1/133615 (20130101); G02F 1/133514 (20130101); G02B
1/14 (20150115); G02F 1/133614 (20210101); G02F
2201/50 (20130101); G02F 2202/108 (20130101) |
Current International
Class: |
G02B
23/16 (20060101); G02F 1/1339 (20060101); F21V
8/00 (20060101); G02F 1/1335 (20060101); G02B
5/124 (20060101); G02B 1/14 (20150101); G02B
1/10 (20150101) |
Field of
Search: |
;362/602,606,607,608,611,612,632,633,634 ;349/65 ;359/513,514 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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201188699 |
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Jan 2009 |
|
CN |
|
2 344 346 |
|
Jun 2000 |
|
GB |
|
2000-111721 |
|
Apr 2000 |
|
JP |
|
2009-76911 |
|
Apr 2009 |
|
JP |
|
10-2005-0100602 |
|
Oct 2005 |
|
KR |
|
10-2006-0125535 |
|
Dec 2006 |
|
KR |
|
200822357 |
|
May 2008 |
|
TW |
|
200822794 |
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May 2008 |
|
TW |
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200952547 |
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Dec 2009 |
|
TW |
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2010-256373 |
|
Nov 2010 |
|
TW |
|
201040588 |
|
Nov 2010 |
|
TW |
|
201105767 |
|
Feb 2011 |
|
TW |
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WO 2012/138038 |
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Oct 2012 |
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WO |
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Primary Examiner: Chwasz; Jade R
Attorney, Agent or Firm: Birch, Stewart, Kolasch &
Birch, LLP
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a Continuation Application of co-pending U.S.
application Ser. No. 14/112,862 file on Oct. 18, 2013, which is the
National Phase of PCT/KR2011/009872 filed on Dec. 20, 2011, which
claims priority under 35 U.S.C 119(a) to Patent Application No.
10-2011-0037543 filed in the Republic of Korea on Apr. 21, 2011,
all of which are hereby expressly incorporated by reference into
the present application.
Claims
What is claimed is:
1. An optical member comprising: a lower substrate; a wavelength
conversion layer on the lower substrate; an upper substrate on the
wavelength conversion layer; a first inorganic protective layer on
the lower substrate; a second inorganic protective layer on the
upper substrate; a first capping part on the first inorganic
protective layer; and a second capping part on the second inorganic
protective layer, wherein the wavelength conversion layer comprises
a host and wavelength conversion particles in the host, wherein the
wavelength conversion particles include quantum dots, wherein the
first capping part covers at least one side of the wavelength
conversion layer, wherein the second capping part covers at least
one side of the wavelength conversion layer, wherein the wavelength
conversion layer is disposed between the first capping part and the
second capping part, wherein the first capping part is disposed
between the lower substrate and the wavelength conversion layer,
wherein the second capping part is disposed between the upper
substrate and the wavelength conversion layer, wherein the first
capping part and the second capping part each include an
organic-inorganic composite, wherein the first inorganic protective
layer and the second inorganic protective layer include an oxide,
wherein the first inorganic protective layer is farther from the
wavelength conversion layer than the first substrate, and wherein
the second inorganic protective layer is farther from the
wavelength conversion layer than the second substrate.
2. The optical member of claim 1, wherein the first inorganic
protective layer is disposed on a bottom surface of the lower
substrate.
3. The optical member of claim 1, wherein the first capping part is
disposed on a bottom surface of the lower substrate, and wherein
the first inorganic protective layer is disposed between the lower
substrate and the first capping part.
4. The optical member of claim 1, further comprising a side capping
part extending between the first capping part and the second
capping part, wherein the side capping part is disposed on side
edges of the upper substrate and the lower substrate.
5. The optical member of claim 1, wherein at least one of the first
capping part and the second capping part includes one selected from
the group consisting of silicon oxide, silicon nitride, silicon
oxide nitride, silicon oxide carbide, aluminum oxide and niobium
oxide.
6. The optical member of claim 1, wherein at least one of the first
capping part and the second capping part contacts the wavelength
conversion layer.
7. A backlight assembly comprising: a light source; an optical
member converting the wavelength of the light emitted from the
light source; a light guide plate under the optical member; and a
reflective sheet under the light guide plate, wherein the optical
member comprises: a lower substrate; a wavelength conversion layer
on the lower substrate; an upper substrate on the wavelength
conversion layer; a first inorganic protective layer on the lower
substrate; a second inorganic protective layer on the upper
substrate; a first capping part on the first inorganic protective
layer; and a second capping part on the second inorganic protective
layer, wherein the wavelength conversion layer comprises a host and
wavelength conversion particles in the host, wherein the wavelength
conversion particles include quantum dots, wherein the first
capping part covers at least one side of the wavelength conversion
layer, wherein the second capping part covers at least one side of
the wavelength conversion layer, wherein the wavelength conversion
layer is disposed between the first capping part and the second
capping part, wherein the first capping part is disposed between
the lower substrate and the wavelength conversion layer, wherein
the second capping part is disposed between the upper substrate and
the wavelength conversion layer, wherein the first capping part and
the second capping part each include an organic-inorganic
composite, wherein the first inorganic protective layer and the
second inorganic protective layer each include an oxide, wherein
the first inorganic protective layer is farther from the wavelength
conversion layer than the first substrate, and wherein the second
inorganic protective layer is farther from the wavelength
conversion layer than the second substrate.
8. The backlight assembly of claim 7, wherein the first inorganic
protective layer is disposed on a bottom surface of the lower
substrate.
9. The backlight assembly of claim 7, wherein the first capping
part is disposed on a bottom surface of the lower substrate, and
wherein the first inorganic protective layer is disposed between
the lower substrate and the first capping part.
10. The backlight assembly of claim 7, further comprising a side
capping part extending between the first capping part and the
second capping part, wherein the side capping part is disposed on
side edges of the upper substrate and the lower substrate.
11. The backlight assembly of claim 7, wherein at least one of the
first capping part and the second capping part includes one
selected from the group consisting of silicon oxide, silicon
nitride, silicon oxide nitride, silicon oxide carbide, aluminum
oxide and niobium oxide.
12. The backlight assembly of claim 7, wherein at least one of the
first capping part and the second capping part contacts the
wavelength conversion layer.
13. A display device comprising: a light source; an optical member
converting the wavelength of the light emitted from the light
source; a light guide plate under the optical member; and a display
panel on the optical member wherein the optical member comprises: a
lower substrate; a wavelength conversion layer on the lower
substrate; an upper substrate on the wavelength conversion layer; a
first inorganic protective layer on the lower substrate; a second
inorganic protective layer on the upper substrate; a first capping
part on the first inorganic protective layer; and a second capping
part on the second inorganic protective layer, wherein the
wavelength conversion layer comprises a host and wavelength
conversion particles in the host, wherein the light source is
disposed under the light guide plate or is lateral to the light
guide plate, wherein the optical member is interposed between the
light guide plate and the display panel, wherein the display panel
is incident the light emitted from the optical member, wherein the
wavelength conversion particles include quantum dots, wherein the
first capping part covers at least one side of the wavelength
conversion layer, wherein the second capping part covers at least
one side of the wavelength conversion layer, wherein the wavelength
conversion layer is disposed between the first capping part and the
second capping part, wherein the first capping part is disposed
between the lower substrate and the wavelength conversion layer,
wherein the second capping part is disposed between the upper
substrate and the wavelength conversion layer, wherein the first
capping part and the second capping part each include an
organic-inorganic composite, wherein the first inorganic protective
layer and the second inorganic protective layer each include an
oxide, wherein the first inorganic protective layer is farther from
the wavelength conversion layer than the first substrate, and
wherein the second inorganic protective layer is farther from the
wavelength conversion layer than the second substrate.
14. The display device of claim 13, wherein at least one of the
first capping part and the second capping part includes parylene
resin.
15. The display device of claim 13 , wherein the first inorganic
protective layer is disposed on a bottom surface of the lower
substrate.
16. The display device of claim 13, wherein the first capping part
is disposed on a bottom surface of the lower substrate, and wherein
the first inorganic protective layer is disposed between the lower
substrate and the first capping part.
17. The display device of claim 13, further comprising a side
capping part extending between the first capping part and the
second capping part, wherein the side capping part is disposed on
side edges of the upper substrate and the lower substrate.
18. The display device of claim 13, wherein at least one of the
first capping part and the second capping part includes one
selected from the group consisting of silicon oxide, silicon
nitride, silicon oxide nitride, silicon oxide carbide, aluminum
oxide and niobium oxide.
19. The display device of claim 13, wherein at least one of the
first capping part and the second capping part contacts the
wavelength conversion layer.
Description
BACKGROUND
The disclosure relates to an optical member, a display device
including the same and a manufacturing method thereof.
Recently, flat display devices, such as an LCD (liquid crystal
display), a PDA (plasma display panel) or an OLED (organic light
emitting diode), have been increasingly developed instead of
conventional CRTs (cathode ray tubes).
Among them, the LCD includes a liquid crystal display panel having
a thin film transistor substrate, a color filter substrate and a
liquid crystal injected between the thin film transistor substrate
and the color filter substrate. Since the liquid crystal display
panel is a non-emissive device, a backlight unit is provided below
the thin film transistor substrate to supply light. Transmittance
of the light emitted from the backlight unit is adjusted according
to the alignment state of the liquid crystal.
The backlight unit is classified into an edge-illumination type
backlight unit and a direct-illumination type backlight unit
according to the position of a light source. According to the
edge-illumination type backlight unit, the light source is located
at a lateral side of a light guide plate.
The direct-illumination type backlight unit has been developed as
the size of the LCD has become enlarged. According to the
direct-illumination type backlight unit, at least one light source
is located below the liquid crystal display panel to supply the
light over the whole area of the liquid crystal display panel.
When comparing with the edge-illumination type backlight unit, the
direct-illumination type backlight unit can employ a large number
of light sources so that the high brightness can be achieved. In
contrast, the direct-illumination type backlight unit must have
thickness larger than thickness of the edge-illumination type
backlight unit in order to ensure brightness uniformity.
In order to solve the above problem, a quantum dot bar having a
plurality of quantum dots, which can convert blue light into red
light or green light, is positioned in front of a blue LED that
emits the blue light. Thus, as the blue light is irradiated onto
the quantum dot bar, the blue light, the red light and the green
light are mixed and the mixed light is incident into the light
guide plate, thereby generating white light.
If the white light is supplied to the light guide plate by using
the quantum dot bar, high color reproduction may be realized.
The backlight unit may include an FPCB (flexible printed circuit
board) provided at one side of the blue LED to supply signals and
power to the LEDs and a bonding member formed under the bottom
surface of the FPCB.
The display device capable of displaying various images using the
white light supplied to the light guide plate through the quantum
dot bar as the blue light is emitted from the blue LED has been
extensively used.
SUMMARY
The embodiment provides an optical member having improved
durability and reliability, a display device including the same and
a manufacturing method thereof.
An optical member according to the embodiment includes a wavelength
conversion layer; and a capping part covering lateral sides of the
wavelength conversion layer.
An optical member according to the embodiment includes a wavelength
conversion layer; and a capping part covering at least one side of
the wavelength conversion layer, wherein the capping part includes
an organic substance and an inorganic substance.
A display device according to the embodiment includes the optical
member.
A method for manufacturing an optical member according to the
embodiment includes the steps of forming a wavelength conversion
layer; and forming a capping part by simultaneously depositing an
organic substance and an inorganic substance on at least one side
of the wavelength conversion layer.
The optical member according to the embodiment includes the capping
part capable of covering the lateral sides of the wavelength
conversion layer. The capping part can prevent oxygen and/or
moisture from penetrating into the lateral sides of the wavelength
conversion layer.
Therefore, the optical member according to the embodiment may have
improved oxygen-resistance and moisture-resistance properties.
In addition, the capping part includes the organic substance and
the inorganic substance. Therefore, the capping part can
effectively protect the wavelength conversion layer from external
chemical impact.
Thus, the optical member according to the embodiment can
effectively protect wavelength conversion particles included in the
wavelength conversion layer while representing improved durability
and reliability.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view showing an LCD according to
the first embodiment;
FIG. 2 is a perspective view of a wavelength conversion sheet;
FIG. 3 is a sectional view taken along line A-A' of FIG. 2;
FIGS. 4 to 6 are views showing the procedure for manufacturing a
wavelength conversion sheet;
FIGS. 7 to 10 are sectional views showing modified examples of a
wavelength conversion sheet;
FIG. 11 is an exploded perspective view showing an LCD according to
the second embodiment;
FIG. 12 is a perspective view of a wavelength conversion member
according to the second embodiment;
FIG. 13 is a sectional view taken along line B-B' of FIG. 12;
FIG. 14 is a sectional view showing a light guide plate, a light
emitting diode, and a wavelength conversion member;
FIG. 15 is an exploded perspective view showing an LCD according to
the third embodiment;
FIG. 16 is a perspective view of a wavelength conversion member
according to the third embodiment;
FIG. 17 is a sectional view taken along line C-C' of FIG. 14;
and
FIG. 18 is a sectional view showing a light guide plate, a light
emitting diode, and a wavelength conversion member.
DETAILED DESCRIPTION OF THE EMBODIMENTS
In the description of the embodiments, it will be understood that
when a layer (or film), a region, a pattern, or a structure is
referred to as being "on" or "under" another substrate, another
layer (or film), another region, another pad, or another pattern,
it can be "directly" or "indirectly" on the other substrate, layer
(or film), region, pad, or pattern, or one or more intervening
layers may also be present. Such a position of the layer has been
described with reference to the drawings. The thickness and size of
each layer shown in the drawings may be exaggerated, omitted or
schematically drawn for the purpose of convenience or clarity. In
addition, the size of elements does not utterly reflect an actual
size.
FIG. 1 is an exploded perspective view showing an LCD according to
the first embodiment, FIG. 2 is a perspective view of a wavelength
conversion sheet, FIG. 3 is a sectional view taken along line A-A'
of FIG. 2, FIGS. 4 to 6 are views showing the procedure for
manufacturing a wavelength conversion sheet, and FIGS. 7 to 10 are
sectional views showing modified examples of a wavelength
conversion sheet.
Referring to FIGS. 1 to 10, the LCD according to the embodiment
includes a backlight unit 10 and a liquid crystal panel 20.
The backlight unit 10 supplies light to the liquid crystal panel
20. The backlight unit 10 serves as a surface light source so that
the light can be uniformly supplied to a bottom surface of the
liquid crystal panel 20.
The backlight unit 10 is disposed below the liquid crystal panel
20. The backlight unit 10 includes a bottom cover 100, a light
guide plate 200, a reflective sheet 300, a plurality of light
emitting diodes 400, a printed circuit board 401, and a plurality
of optical sheets 500.
The upper portion of the bottom cover 100 is open. The bottom cover
100 receives the light guide plate 200, the light emitting diodes
400, the printed circuit board 401, the reflective sheet 300, and
the optical sheets 500 therein.
The light guide plate 200 is disposed in the bottom cover 100 and
arranged on the reflective sheet 300. The light guide plate 200
guides the light upward by totally reflecting, refracting and
scattering the light incident thereto from the light emitting
diodes 400.
The reflective sheet 300 is disposed under the light guide plate
200. In more detail, the reflective sheet 300 is disposed between
the light guide plate 200 and the bottom surface of the bottom
cover 100. The reflective sheet 300 reflects the light upward as
the light is output downward from the bottom surface of the light
guide plate 200.
The light emitting diodes 400 serve as a light source for
generating the light. The light emitting diodes 400 are disposed at
one lateral side of the light guide plate 200. The light generated
from the light emitting diodes 400 is incident into the light guide
plate 200 through the lateral side of the light guide plate
200.
The light emitting diodes 400 may include a blue light emitting
diode generating the blue light or a UV light emitting diode
generating the UV light. In detail, the light emitting diodes 400
can emit the blue light having the wavelength band of about 430 nm
to 470 nm or the UV light having the wavelength band of about 300
nm to 400 nm.
The light emitting diodes 400 are mounted on the printed circuit
board 401. The light emitting diodes 400 can be disposed under the
printed circuit board 401. The light emitting diodes 400 are driven
by receiving a driving signal through the printed circuit board
401.
The printed circuit board 401 is electrically connected to the
light emitting diodes 400. The printed circuit board 401 can mount
the light emitting diodes 400 thereon. The printed circuit board
401 is disposed in the bottom cover 100.
The optical sheets 500 are disposed on the light guide plate 200.
The optical sheets 500 supplies the light to the liquid crystal
panel 20 by changing or enhancing the optical property of the light
output from the top surface of the light guide plate 200.
The optical sheets 500 include a wavelength conversion sheet 501, a
diffusion sheet 502, a first prism sheet 503 and a second prism
sheet 504.
The wavelength conversion sheet 501 is disposed on the light guide
plate 200. In more detail, the wavelength conversion sheet 501 is
interposed between the light guide plate 200 and the diffusion
sheet 502. The wavelength conversion sheet 501 guides the light
upward by changing the wavelength of the incident light.
For instance, if the light emitting diodes 400 are blue light
emitting diodes, the wavelength conversion sheet 501 converts the
blue light output upward from the light guide plate 200 into the
green light and the red light. In detail, the wavelength conversion
sheet 501 converts a part of the blue light into the green light
having the wavelength in the range of about 520 nm to about 560 nm,
and a part of the blue light into the red light having the
wavelength in the range of about 630 nm to about 660 nm.
In addition, if the light emitting diodes 400 are UV light emitting
diodes, the wavelength conversion sheet 501 converts the UV light
output from the top surface of the light guide plate 200 into the
blue light, the green light and the red light. In detail, the
wavelength conversion sheet 501 converts a part of the UV light
into the blue light having the wavelength in the range of about 430
nm to about 470 nm, a part of the UV light into the green light
having the wavelength in the range of about 520 nm to about 560 nm,
and a part of the UV light into the red light having the wavelength
in the range of about 630 nm to about 660 nm.
Therefore, the white light may be generated by the light passing
through the wavelength conversion sheet 501 without being converted
and the lights converted by the wavelength conversion sheet 501. In
detail, the white light can be incident into the liquid crystal
panel 20 through the combination of the blue light, the green light
and the red right.
The wavelength conversion sheet 501 is a wavelength conversion
member capable of converting the wavelength of the incident light.
That is, the wavelength conversion sheet 501 is an optical member
capable of converting the characteristic of the incident light.
As shown in FIGS. 2 and 3, the wavelength conversion sheet 501
includes a lower substrate 510, an upper substrate 520, a
wavelength conversion layer 530, a first inorganic protective layer
540, a second inorganic protective layer 550, and a capping part
560.
The lower substrate 510 is disposed under the wavelength conversion
layer 530. The lower substrate 510 may be transparent and flexible.
The lower substrate 510 adheres to the bottom surface of the
wavelength conversion layer 530.
The lower substrate 510 may include transparent polymer, such as
polyethyleneterephthalate (PET).
The upper substrate 520 is disposed on the wavelength conversion
layer 530. The upper substrate 520 may be transparent and flexible.
The upper substrate 520 adheres to the top surface of the
wavelength conversion layer 530.
The upper substrate 520 may include transparent polymer, such as
polyethyleneterephthalate (PET).
The wavelength conversion layer 530 is sandwiched between the upper
and lower substrates 520 and 510. The upper and lower substrates
520 and 510 support the wavelength conversion layer 530. The upper
and lower substrates 520 and 510 protect the wavelength conversion
layer 530 from external physical impact.
In addition, the upper and lower substrates 520 and 510 have low
oxygen and moisture permeability. Thus, the upper and lower
substrates 520 and 510 can protect the wavelength conversion layer
530 from external chemical penetration, such as oxygen and/or
moisture.
The wavelength conversion layer 530 is interposed between the upper
and lower substrates 520 and 510. The wavelength conversion layer
530 adheres to the top surface of the lower substrate 510 and the
bottom surface of the upper substrate 520.
The wavelength conversion layer 530 includes a plurality of
wavelength conversion particles 531 and a host layer 532.
The wavelength conversion particles 531 are disposed between the
upper and lower substrates 520 and 510. In more detail, the
wavelength conversion particles 531 are uniformly distributed in
the host layer 532 disposed between the upper and lower substrates
520 and 510.
The wavelength conversion particles 531 convert the wavelength of
the light emitted from the light emitting diodes 400. In detail,
the light is incident into the wavelength conversion particles 531
from the light emitting diodes 400 and the wavelength conversion
particles 531 convert the wavelength of the incident light. For
instance, the wavelength conversion particles 531 can convert the
blue light emitted from the light emitting diodes 400 into the
green light and the red light. That is, a part of the wavelength
conversion particles 531 converts the blue light into the green
light having the wavelength in the range of about 520 nm to about
560 nm and a part of the wavelength conversion particles 531
converts the blue light into the red light having the wavelength in
the range of about 630 nm to about 660 nm.
In addition, the wavelength conversion particles 531 can convert
the UV light emitted from the light emitting diodes 400 into the
blue light, the green light and the red light. That is, a part of
the wavelength conversion particles 531 converts the UV light into
the blue light having the wavelength in the range of about 430 nm
to about 470 nm, and a part of the wavelength conversion particles
531 converts the UV light into the green light having the
wavelength in the range of about 520 nm to about 560 nm. Further, a
part of the wavelength conversion particles 531 converts the UV
light into the red light having the wavelength in the range of
about 630 nm to about 660 nm.
In other words, if the light emitting diodes 400 are blue light
emitting diodes that emit the blue light, the wavelength conversion
particles 531 capable of converting the blue light into the green
light and the red light may be employed. In addition, if the light
emitting diodes 400 are UV light emitting diodes that emit the UV
light, the wavelength conversion particles 531 capable of
converting the UV light into the blue light, the green light and
the red light may be employed.
The wavelength conversion particles 531 may include a plurality of
quantum dots. The quantum dots may include core nano-crystals and
shell nano-crystals surrounding the core nano-crystals. In
addition, the quantum dots may include organic ligands bonded to
the shell nano-crystals. In addition, the quantum dots may include
an organic coating layer surrounding the shell nano-crystals.
The shell nano-crystals can be prepared as at least two layers. The
shell nano-crystals are formed on the surface of the core
nano-crystals. The quantum dots lengthen the wavelength of the
light incident into the core nano-crystals by using the shell
nano-crystals forming a shell layer, thereby improving the light
efficiency.
The quantum dots may include at least one of a group-II compound
semiconductor, a group-III compound semiconductor, a group-V
compound semiconductor, and a group-VI compound semiconductor. In
more detail, the core nano-crystals may include CdSe, InGaP, CdTe,
CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. In addition, the shell
nano-crystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS,
HgTe or HgS. The quantum dot may have a diameter of about 1 nm to
about 10 nm.
The wavelength of the light emitted from the quantum dots can be
adjusted according to the size of the quantum dot or the molar
ratio between the molecular cluster compound and the nano-particle
precursor in the synthesis process. The organic ligand may include
pyridine, mercapto alcohol, thiol, phosphine and phosphine oxide.
The organic ligand may stabilize the unstable quantum dots after
the synthesis process. Dangling bonds may be formed at the valence
band and the quantum dots may be unstable due to the dangling
bonds. However, since one end of the organic ligand is the
non-bonding state, one end of the organic ligand is bonded with the
dangling bonds, thereby stabilizing the quantum dots.
In particular, if the size of the quantum dot is smaller than the
Bohr radius of an exciton, which consists of an electron and a hole
excited by light and electricity, the quantum confinement effect
may occur, so that the quantum dot may have the discrete energy
level. Thus, the size of the energy gap is changed. In addition,
the charges are confined within the quantum dot, so that the light
emitting efficiency can be improved.
Different from general fluorescent pigments, the fluorescent
wavelength of the quantum dot may vary depending on the size of the
particles. In detail, the light has the shorter wavelength as the
size of the particle becomes small, so the fluorescent light having
the wavelength band of visible ray can be generated by adjusting
the size of the particles. In addition, the quantum dot represents
the extinction coefficient higher than that of the general
fluorescent pigment by 100 to 1000 times and has the superior
quantum yield, so that strong fluorescent light can be
generated.
The quantum dots can be synthesized through the chemical wet
scheme. According to the chemical wet scheme, the particles are
grown by immersing the precursor material in the organic
solvent.
The host layer 532 surrounds the wavelength conversion particles
531. In detail, the wavelength conversion particles 531 are
uniformly distributed in the host layer 352. The host layer 532
includes polymer. The host layer 532 is transparent. That is, the
host layer 532 includes transparent polymer.
The host layer 532 is interposed between the lower substrate 510
and the upper substrate 520. In detail, the host layer 532 adheres
to the top surface of the lower substrate 510 and the bottom
surface of the upper substrate 520.
The first inorganic protective layer 540 is disposed below the
wavelength conversion layer 530. In detail, the first inorganic
protective layer 540 is disposed under the lower substrate 510. In
more detail, the first inorganic protective layer 540 is coated on
the bottom surface of the lower substrate 510.
The first inorganic protective layer 540 protects the wavelength
conversion layer 530 in association with the lower substrate 510.
In detail, the first inorganic protective layer 540 protects the
wavelength conversion layer 530 from external physical impact. In
addition, the first inorganic protective layer 540 prevents oxygen
and/or moisture from penetrating into the wavelength conversion
layer 530.
The first inorganic protective layer 540 has the refractive index
lower than that of the lower substrate 510. For instance, the first
inorganic protective layer 540 has the refractive index in the
range of 1.3 to 1.6.
Therefore, the first inorganic protective layer 540 performs the
optical damping function between the lower substrate 510 and the
capping part 560 and reduces the reflection at the bottom surface
of the lower substrate 510.
For instance, the first inorganic protective layer 540 may include
silicon oxide or silicon nitride.
The second inorganic protective layer 550 is disposed on the
wavelength conversion layer 530. In detail, the second inorganic
protective layer 550 is disposed on the upper substrate 520. In
more detail, the second inorganic protective layer 550 is coated on
the top surface of the upper substrate 520.
The second inorganic protective layer 550 protects the wavelength
conversion layer 530 in association with the upper substrate 520.
In detail, the second inorganic protective layer 550 protects the
wavelength conversion layer 530 from external physical impact. In
addition, the second inorganic protective layer 550 prevents oxygen
and/or moisture from penetrating into the wavelength conversion
layer 530.
The second inorganic protective layer 550 has the refractive index
lower than that of the upper substrate 520. For instance, the
second inorganic protective layer 550 has the refractive index in
the range of 1.3 to 1.6.
Therefore, the second inorganic protective layer 550 performs the
optical damping function between the upper substrate 520 and the
capping part 560 and reduces the reflection at the top surface of
the upper substrate 520.
For instance, the second inorganic protective layer 550 may include
silicon oxide or silicon nitride.
The first and second inorganic protective layers 540 and 550 may
perform the optical function, such as the anti-reflection function,
and seal the wavelength conversion layer 530 to protect the
wavelength conversion layer 530 from external physical and chemical
impact.
The capping part 560 is disposed at lateral sides of the wavelength
conversion layer 530. The capping part 560 covers the lateral sides
of the wavelength conversion layer 530. The capping part 560
directly makes contact with the lateral sides of the wavelength
conversion layer 530.
In addition, the capping part 560 covers the lateral sides of the
lower substrate 510, the lateral sides of the upper substrate 520,
the lateral sides of the first inorganic protective layer 540 and
the lateral sides of the second inorganic protective layer 550. In
more detail, the capping part 560 directly makes contact with the
lateral sides of the lower substrate 510, the lateral sides of the
upper substrate 520, the lateral sides of the first inorganic
protective layer 540 and the lateral sides of the second inorganic
protective layer 550.
The capping part 560 covers the top and bottom surfaces of the
wavelength conversion layer 530. In detail, the capping part 560
covers the bottom surface of the first inorganic protective layer
540 and the top surface of the second inorganic protective layer
550. In more detail, the capping part 560 is directly coated on the
bottom surface of the first inorganic protective layer 540 and the
top surface of the second inorganic protective layer 550.
As a result, the capping part 560 is coated on the whole surface of
the stack structure including the wavelength conversion layer 530,
the lower substrate 510, the upper substrate 520, the first
inorganic protective layer 540 and the second inorganic protective
layer 550.
The capping part 560 includes an organic substance and an inorganic
substance. For instance, the capping part 560 can be prepared as a
single layer including the organic substance and the inorganic
substance.
The capping part 560 may include the mixture of the organic
substance and the inorganic substance. For instance, the capping
part 560 mainly includes an organic substance and the inorganic
substance is uniformly distributed or doped in the organic
substance.
For example, as shown in FIG. 3, the inorganic substance fills fine
pores formed in the organic substance. That is, if the organic
substance is polymer, fine pores may be formed among polymer
molecules. The inorganic substance is filled in the fine pores.
The inorganic substance may include one selected from the group
consisting of Si.sub.XO.sub.Y, Si.sub.XN.sub.Y,
Si.sub.XO.sub.YN.sub.Z, Si.sub.XO.sub.YC.sub.Z, aluminum oxide or
Nb.sub.5O.sub.3.
The organic substance may include polymer. The organic substance
may include parylene resin, such as poly(para-xylene). For
instance, the parylene resin can be expressed as flowing chemical
formula 1.
##STR00001##
In chemical formula 1, R1, R2, R3 and R4 can be selected from the
group consisting of hydrogen, alkyl group, aryl group, hetero aryl
group and alkoxy group, respectively.
In more detail, the organic substance is poly(para-xylene) and the
inorganic substance is silicon oxide.
In addition, the capping part 560 may include an organic-inorganic
composite. In detail, the organic-inorganic composite can be
prepared by bonding the inorganic substance in the form of
molecules to the organic substance.
If the organic substance is poly(para-xylene) and the inorganic
substance is silicon oxide, the silicon oxide in the form of
molecules can be bonded to the poly(para-xylene). That is, the
capping part 560 may include silicon oxide-poly(para-xylene)
composite expressed as follows.
##STR00002##
In the above chemical formula, R1, R2, R3 and R4 can be selected
from the group consisting of hydrogen, alkyl group, aryl group,
hetero aryl group and alkoxy group, respectively.
Since the capping part 560 includes the organic-inorganic
composite, the bonding strength between the inorganic substance and
the organic substance can be enhanced. That is, the
organic-inorganic composite is formed between the organic substance
and the inorganic substance to enhance the bonding strength between
the inorganic substance and the organic substance.
In addition, the capping part 560 may further include a product,
which is produced through the chemical bonding between the
inorganic substance and the organic substance. For instance, the
capping part 560 may further include silicon-substituted
polymer.
In detail, if the organic substance is poly(para-xylene) and the
inorganic substance is silicon oxide, the silicon oxide reacts with
the poly(para-xylene), so the capping part 560 may include
silicon-substituted poly(para-xylene) as expressed by chemical
formula 2.
##STR00003##
In above chemical formula 2, R1, R2, R3 and R4 can be selected from
the group consisting of hydrogen, alkyl group, aryl group, hetero
aryl group and alkoxy group, respectively.
In this manner, since the capping part 560 includes the organic
substance and the inorganic substance, the capping part 560 may
have a close-pack structure. Thus, the capping part 560 can
effectively protect the wavelength conversion particles from oxygen
and/or moisture.
The capping part 560 may have a thickness in the range of about 0.1
.mu.m to about 100 .mu.m.
The capping part 560 protects the wavelength conversion layer 530
from the physical and/or chemical impact. In detail, the capping
part 560 can prevent moisture and/or oxygen from penetrating into
the top surface, the bottom surface, and the lateral sides of the
wavelength conversion layer 530.
Accordingly, the capping part 560 can prevent the wavelength
conversion particles 531 from being degenerated by the moisture
and/or oxygen while improving the reliability and durability of the
wavelength conversion sheet 501.
Referring to FIGS. 4 to 6, the wavelength conversion sheet 501 can
be formed through the following method.
As shown in FIG. 4, after the first inorganic protective layer 540
has been coated on the bottom surface of the lower substrate 510, a
resin composition including a plurality of wavelength conversion
particles 531 is coated on the lower substrate 510.
Then, the resin composition is cured by the UV ray, so that the
wavelength conversion layer 530 is formed.
Referring to FIG. 5, the upper substrate 520 coated with the second
inorganic protective layer 550 is laminated n the wavelength
conversion layer 530.
Referring to FIG. 6, the capping part 560 is formed on the outer
surface of the stack structure including the lower substrate 510,
the upper substrate 520, the wavelength conversion layer 530, the
first inorganic protective layer 540 and the second inorganic
protective layer 550. In detail, the capping part 560 is formed on
the lateral sides of the lower substrate 510, the upper substrate
520, the wavelength conversion layer 530, the first inorganic
protective layer 540 and the second inorganic protective layer 550,
the bottom surface of the first inorganic protective layer 540 and
the top surface of the second inorganic protective layer 550.
The capping part 560 can be formed by simultaneously depositing the
organic and inorganic substances on the outer surface of the stack
structure including the lower substrate 510, the upper substrate
520, the wavelength conversion layer 530, the first inorganic
protective layer 540 and the second inorganic protective layer
550.
The organic and inorganic substances can be deposited through the
physical vapor deposition process, the printing process, the spin
coating process or the spray coating process.
In addition, the organic and inorganic substances can be deposited
through the chemical vapor deposition process.
For instance, the capping part 560 may be formed through the
evaporation process. In detail, after the organic and inorganic
substances have been evaporated, the evaporated organic and
inorganic substances are deposited on the outer surface of the
stack structure including the lower substrate 510, the upper
substrate 520, the wavelength conversion layer 530, the first
inorganic protective layer 540 and the second inorganic protective
layer 550, so that the capping part 560 is formed.
For example, the capping part 560 can be formed by simultaneously
depositing silicon oxide and parylene polymer through the
evaporation process.
Thus, the capping part 560 includes the mixture of the silicon
oxide and parylene polymer.
In addition, the silicon oxide-parylene composite may be formed
while the silicon oxide and parylene polymer are being deposited.
That is, the capping part 560 may include the silicon
oxide-parylene composite.
In addition, the silicon oxide may chemically react with the
parylene polymer while the silicon oxide and parylene polymer are
being deposited. Thus, the silicon-substituted parylene polymer can
be formed. That is, the capping part 560 may include the
silicon-substituted parylene polymer.
Referring to FIG. 7, the wavelength conversion sheet 501 includes a
first capping part 561 and a second capping part 562. The first
capping part 561 may be coated on the top surface and the lateral
sides of the lower substrate 510, and the bottom surface and the
lateral sides of the first inorganic protective layer 540. In
addition, the first capping part 561 is interposed between the
wavelength conversion layer 530 and the lower substrate 510.
The second capping part 562 may be coated on the bottom surface and
the lateral sides of the upper substrate 520, and the top surface
and the lateral sides of the second inorganic protective layer 550.
In addition, the second capping part 562 is interposed between the
wavelength conversion layer 530 and the upper substrate 520.
The first and second capping parts 561 and 562 can be formed by
using a material the same as that of the capping part 560.
Due to the first and second capping parts 561 and 562, the moisture
and/or oxygen penetrating into the upper and lower portions of the
wavelength conversion layer 530 can be effectively blocked.
Referring to FIG. 8, the capping part 560 surrounds the lower
substrate 510, the wavelength conversion layer 530 and the first
inorganic protective layer 540. In detail, the capping part 560 is
coated on the lateral sides of the lower substrate 510, the
wavelength conversion layer 530 and the first inorganic protective
layer 540, the top surface of the wavelength conversion layer 530
and the bottom surface of the first inorganic protective layer
540.
That is, the capping part 560 directly covers the top surface and
the lateral sides of the wavelength conversion layer 530. In
detail, the capping part 560 is directly coated on the top surface
and the lateral sides of the wavelength conversion layer 530.
In order to form the wavelength conversion sheet 501 shown in FIG.
8, the capping part 560 is formed first and then the upper
substrate 520 is laminated on the capping part 560.
Referring to FIG. 9, the wavelength conversion layer 530 is
disposed on the top surface of the lower substrate 510. The
wavelength conversion layer 530 exposes a part of the top surface
of the lower substrate 510. The exposed top surface of the lower
substrate 510 may surround the wavelength conversion layer 530.
That is, when viewed from the top, the exposed top surface of the
lower substrate 510 has a closed loop shape.
The capping part 560 covers the wavelength conversion layer 530.
The capping part 560 directly covers the top surface and the
lateral sides of the wavelength conversion layer 530. In detail,
the capping part 560 is directly coated on the top surface and the
lateral sides of the wavelength conversion layer 530.
In addition, the capping part 560 can directly make contact with
the top surface of the lower substrate 510. In detail, the capping
part 560 can directly make contact with the exposed top surface of
the lower substrate 510.
Further, as shown in FIG. 10, the first and second inorganic
protective layers 540 and 550 can be added to the wavelength
conversion sheet 501 shown in FIG. 9.
In detail, the first inorganic protective layer 540 is disposed on
the bottom surface of the lower substrate 510, and the second
inorganic protective layer 550 is formed on the capping part 560.
The first inorganic protective layer 540 is directly deposited on
the bottom surface of the lower substrate 510, and the second
inorganic protective layer 550 can be directly deposited on the top
surface of the capping part 560.
Referring again to FIG. 1, the diffusion sheet 502 is disposed on
the wavelength conversion sheet 501 to improve uniformity of light
passing through the diffusion sheet 502. The diffusion sheet 502
may include a plurality of beads.
The first prism sheet 503 is disposed on the diffusion sheet 502.
The second prism sheet 504 is formed on the first prism sheet 503.
The first and second prism sheets 503 and 504 may enhance the
linearity of light passing through the first and second prism
sheets 503 and 504.
The liquid crystal panel 20 is disposed on the optical sheets 500.
In addition, the liquid crystal panel 20 is disposed on the panel
guide 23. The liquid crystal panel 20 is guided by the panel guide
23.
The liquid crystal panel 20 displays images by adjusting intensity
of light passing through the liquid crystal panel 20. In detail,
the liquid crystal panel 20 is a display panel for displaying the
images by using the light emitted from the backlight unit 10. The
liquid crystal panel 20 includes a TFT substrate 21, a color filter
substrate 22 and a liquid crystal layer interposed between the two
substrates. In addition, the liquid crystal panel 20 includes
polarizing filters.
Although it is not shown in the drawings in detail, the TFT
substrate 21 includes a plurality of gate lines crossing a
plurality of data lines to form pixels and a thin film transistor
(TFT) is provided at each cross section such that the thin film
transistor can be connected to a pixel electrode of the pixel in
one-to-one correspondence. The color filter substrate 22 includes
color filters having R, G and B colors corresponding to the pixels,
a black matrix covering the gate lines, data lines and thin film
transistors within the limit of the color filters, and a common
electrode covering the above elements.
A driving PCB 25 is provided at an outer peripheral portion of the
LCD panel 210 to supply driving signals to the gate lines and data
lines.
The driving PCB 25 is electrically connected to the liquid crystal
panel 20 by a COF (chip on film) 24. The COF 24 may be replaced
with a TCP (tape carrier package).
As described above, since the wavelength conversion sheet 501
includes the capping part 560, the wavelength conversion layer 530
can be effectively protected. The capping part 560 can effectively
protect the wavelength conversion particles 531 from external
moisture and/or oxygen.
Thus, the wavelength conversion sheet 501 may have improved
reliability and durability, and the LCD according to the embodiment
may have improved performance and image quality.
FIG. 11 is an exploded perspective view showing an LCD according to
the second embodiment, FIG. 12 is a perspective view of a
wavelength conversion member according to the second embodiment,
FIG. 13 is a sectional view taken along line B-B' of FIG. 12, and
FIG. 14 is a sectional view showing a light guide plate, a light
emitting diode, and a wavelength conversion member. The description
of the previous embodiment will be incorporated in the description
of the present embodiment by reference. That is, the description
about the LCD according to the previous embodiment will be
incorporated in the description about the LCD according to the
present embodiment.
Referring to FIGS. 11 to 14, the LCD according to the present
embodiment includes a wavelength conversion member 600 instead of
the wavelength conversion sheet 501. The wavelength conversion
member 600 is interposed between the light emitting diodes 400 and
the light guide plate 200.
The wavelength conversion member 600 extends in one direction. In
detail, the wavelength conversion member 600 extends along one
lateral side of the light guide plate 200. In more detail, the
wavelength conversion member 600 may have a shape extending along
an incident surface of the light guide plate 200.
The wavelength conversion member 600 receives the light emitted
from the light emitting diodes 400 to convert the wavelength of the
light. For instance, the wavelength conversion member 600 converts
the blue light emitted from the light emitting diodes 400 into the
green light and the red light. In detail, the wavelength conversion
member 600 converts a part of the blue light into the green light
having the wavelength in the range of about 520 nm to about 560 nm,
and a part of the blue light into the red light having the
wavelength in the range of about 630 nm to about 660 nm.
In addition, the wavelength conversion member 600 can convert the
UV light emitted from the light emitting diodes 400 into the blue
light, the green light and the red light. In detail, the wavelength
conversion member 600 converts a part of the UV light into the blue
light having the wavelength in the range of about 430 nm to about
470 nm, a part of the UV light into the green light having the
wavelength in the range of about 520 nm to about 560 nm, and a part
of the UV light into the red light having the wavelength in the
range of about 630 nm to about 660 nm.
Therefore, the white light may be generated by the light passing
through the wavelength conversion member 600 and the lights
converted by the wavelength conversion member 600. In detail, the
white light can be incident into the light guide plate 200 through
the combination of the blue light, the green light and the red
right.
As shown in FIGS. 12 to 14, the wavelength conversion member 600
includes a lower substrate 610, an upper substrate 620, a
wavelength conversion layer 630, a first inorganic protective layer
640, a second inorganic protective layer 650, and a capping part
660.
As shown in FIG. 13, the lower substrate 610 is disposed under the
wavelength conversion layer 630. The lower substrate 610 is
transparent and flexible. The lower substrate 610 closely adheres
to the bottom surface of the wavelength conversion layer 630.
In addition, as shown in FIG. 14, the lower substrate 610 is
opposite to the light emitting diodes 400. In detail, the lower
substrate 610 is disposed between the light emitting diodes 400 and
the wavelength conversion layer 630.
As shown in FIG. 13, the upper substrate 620 is disposed on the
wavelength conversion layer 630. The upper substrate 620 is
transparent and flexible. The upper substrate 620 closely adheres
to the top surface of the wavelength conversion layer 630.
In addition, as shown in FIG. 14, the upper substrate 620 is
opposite to the light guide plate 200. In detail, the upper
substrate 620 is disposed between the light guide plate 200 and the
wavelength conversion layer 630.
The wavelength conversion layer 630 is interposed between the lower
substrate 610 and the upper substrate 620. The wavelength
conversion layer 630 is sandwiched between the upper and lower
substrates 620 and 610. The wavelength conversion layer 630 has the
feature substantially equal to the feature of the wavelength
conversion layer 530 according to the previous embodiment.
The first inorganic protective layer 640 is disposed below the
wavelength conversion layer 630. In detail, the first inorganic
protective layer 640 is disposed under the lower substrate 610. In
more detail, the first inorganic protective layer 640 is coated on
the bottom surface of the lower substrate 610.
The second inorganic protective layer 650 is disposed on the
wavelength conversion layer 630. In detail, the second inorganic
protective layer 650 is disposed on the upper substrate 620. In
more detail, the second inorganic protective layer 650 is coated on
the top surface of the upper substrate 620.
The capping part 660 is disposed at lateral sides of the wavelength
conversion layer 630. The capping part 660 covers the lateral sides
of the wavelength conversion layer 630. The capping part 660 may
cover the whole lateral sides of the wavelength conversion layer
630. The capping part 660 may directly make contact with the
lateral sides of the wavelength conversion layer 630.
The capping part 660 covers the lateral sides of the lower
substrate 610, the upper substrate 620, the first inorganic
protective layer 640, and the second inorganic protective layer
650. In detail, the capping part 660 directly makes contact with
the lateral sides of the lower substrate 610, the upper substrate
620, the first inorganic protective layer 640, and the second
inorganic protective layer 650.
The capping part 660 covers the top surface and the bottom surface
of the wavelength conversion layer 630. In detail, the capping part
660 covers the bottom surface of the first inorganic protective
layer 640 and the top surface of the second inorganic protective
layer 650. In more detail, the capping part 660 may be directly
coated on the bottom surface of the first inorganic protective
layer 640 and the top surface of the second inorganic protective
layer 650.
As a result, the capping part 660 is coated on the whole outer
surface of the stack structure including the wavelength conversion
layer 630, the lower substrate 610, the upper substrate 620, the
first inorganic protective layer 640 and the second inorganic
protective layer 650.
The capping part 660 includes an organic substance and an inorganic
substance. For instance, the capping part 660 can be prepared as a
single layer including the organic substance and the inorganic
substance.
The capping part 660 may include the mixture of the organic
substance and the inorganic substance. For instance, the capping
part 660 mainly includes an organic substance and the inorganic
substance is uniformly distributed or doped in the organic
substance.
The capping part 660 is substantially identical to the capping part
560 of the previous embodiment.
In addition, the layer structure of the wavelength conversion
member 600 can be variously modified as shown in FIGS. 7 to 10.
In the LCD according to the present embodiment, the wavelength
conversion layer 630 has a relatively small size. Thus, a smaller
amount of wavelength conversion particles 631 can be used when
manufacturing the LCD according to the present embodiment.
Therefore, the LCD according to the present embodiment can reduce
the usage of the wavelength conversion particles 631 and can be
manufactured at the low cost.
FIG. 15 is an exploded perspective view showing an LCD according to
the third embodiment, FIG. 16 is a perspective view of a wavelength
conversion member according to the third embodiment, FIG. 17 is a
sectional view taken along line C-C' of FIG. 14, and FIG. 18 is a
sectional view showing a light guide plate, a light emitting diode,
and a wavelength conversion member. The description of the previous
embodiment will be incorporated in the description of the present
embodiment by reference. That is, the description about the LCD
according to the previous embodiment will be incorporated in the
description about the LCD according to the present embodiment.
Referring to FIGS. 15 to 18, the LCD according to the present
embodiment includes a plurality of wavelength conversion members
700. The wavelength conversion members 700 correspond to the light
emitting diodes 400, respectively.
In addition, the wavelength conversion members 700 are disposed
between the light emitting diodes 400 and the light guide plate
200. In detail, each wavelength conversion member 700 is disposed
between the corresponding light emitting diode 400 and the light
guide plate 200.
The wavelength conversion members 700 convert the wavelength of the
light emitted from the corresponding light emitting diode 400. The
wavelength conversion members 700 are divided into first wavelength
conversion members for converting the light emitted from the light
emitting diodes 400 into the light having a first wavelength, such
as the green light, and second wavelength conversion members for
converting the light into the light having a second wavelength,
such as the red light.
The wavelength conversion members 700 have a surface area larger
than a surface area of the light emitting diodes 400. Thus, most of
the light emitted from the light emitting diodes 400 can be
incident into the corresponding wavelength conversion member
700.
In addition, as shown in FIGS. 16 to 18, the wavelength conversion
member 700 includes a lower substrate 710, an upper substrate 720,
a wavelength conversion layer 730, a first inorganic protective
layer 740, a second inorganic protective layer 750 and a capping
part 760.
The features of the lower substrate 710, the upper substrate 720,
the wavelength conversion layer 730, the first inorganic protective
layer 740, the second inorganic protective layer 750 and the
capping part 760 are substantially identical to the features
described in the previous embodiments.
In the LCD according to the present embodiment, the wavelength
conversion layer 730 has a relatively small size. Thus, a smaller
amount of wavelength conversion particles 731 can be used when
manufacturing the LCD according to the present embodiment.
Therefore, the LCD according to the present embodiment can reduce
the usage of the wavelength conversion particles 731 and can be
manufactured at the low cost.
In addition, the features of each wavelength conversion member 700
can be modified suitably for the corresponding light emitting
diode. Thus, the LCD according to the embodiments may have the
improved brightness and uniform color reproduction
characteristic.
Any reference in this specification to "one embodiment," "an
embodiment," "example embodiment," etc., means that a particular
feature, structure, or characteristic described in connection with
the embodiment is included in at least one embodiment of the
invention. The appearances of such phrases in various places in the
specification are not necessarily all referring to the same
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with any embodiment, it
is submitted that it is within the purview of one skilled in the
art to effects such feature, structure, or characteristic in
connection with other ones of the embodiments.
Although embodiments have been described with reference to a number
of illustrative embodiments thereof, it should be understood that
numerous other modifications and embodiments can be devised by
those skilled in the art that will fall within the spirit and scope
of the principles of this disclosure. More particularly, various
variations and modifications are possible in the component parts
and/or arrangements of the subject combination arrangement within
the scope of the disclosure, the drawings and the appended claims.
In addition to variations and modifications in the component parts
and/or arrangements, alternative uses will also be apparent to
those skilled in the art.
The display device according to the embodiments can be used in the
display field.
* * * * *