U.S. patent number 9,466,424 [Application Number 14/340,422] was granted by the patent office on 2016-10-11 for paste for external electrode, multilayer ceramic electronic component, and method of manufacturing the same.
This patent grant is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The grantee listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Hang Kyu Cho, Doo Young Kim, Chung Eun Lee, Jong Ho Lee.
United States Patent |
9,466,424 |
Lee , et al. |
October 11, 2016 |
Paste for external electrode, multilayer ceramic electronic
component, and method of manufacturing the same
Abstract
A multilayer ceramic electronic component may include: a ceramic
body including a plurality of dielectric layers; internal
electrodes disposed in the ceramic body and having one ends exposed
to outer surfaces of the ceramic body; and external electrodes
disposed on the outer surfaces of the ceramic body to be connected
to the respective one ends of the internal electrodes and
containing a conductive metal and a conductive ceramic powder.
Inventors: |
Lee; Chung Eun (Suwon-Si,
KR), Kim; Doo Young (Suwon-Si, KR), Cho;
Hang Kyu (Suwon-Si, KR), Lee; Jong Ho (Suwon-Si,
KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon-Si, Gyeonggi-Do |
N/A |
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD. (Suwon-si, Gyeonggi-do, KR)
|
Family
ID: |
54355721 |
Appl.
No.: |
14/340,422 |
Filed: |
July 24, 2014 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20150318111 A1 |
Nov 5, 2015 |
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Foreign Application Priority Data
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Apr 30, 2014 [KR] |
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10-2014-0052866 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01G
4/232 (20130101); H01G 4/2325 (20130101); H01G
4/008 (20130101); H01G 4/248 (20130101); H01G
4/1218 (20130101); H01G 4/012 (20130101); H01G
4/12 (20130101); Y10T 29/42 (20150115); H01G
4/30 (20130101) |
Current International
Class: |
H01G
4/12 (20060101); H01G 4/008 (20060101); H01G
4/012 (20060101); H01G 4/248 (20060101); H01G
4/232 (20060101); H01G 4/30 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2 117 008 |
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Nov 2009 |
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EP |
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10-2003-0037351 |
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May 2003 |
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KR |
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10-2009-0106409 |
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Oct 2009 |
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KR |
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10-2012-0068622 |
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Jun 2012 |
|
KR |
|
Primary Examiner: Ferguson; Dion R
Attorney, Agent or Firm: McDermott Will & Emery LLP
Claims
What is claimed is:
1. A multilayer ceramic electronic component comprising: a ceramic
body including a plurality of dielectric layers; internal
electrodes disposed in the ceramic body and having one ends exposed
to outer surfaces of the ceramic body; and external electrodes
disposed on the outer surfaces of the ceramic body to be connected
to the respective one ends of the internal electrodes and
containing a conductive metal, a conductive ceramic powder having a
conductivity of 100 S/cm or more and a glass component, wherein the
conductive ceramic powder is included in an amount of 3 wt % to 20
wt % based on a total amount of the conductive metal, the
conductive ceramic powder, and the glass component.
2. The multilayer ceramic electronic component of claim 1, wherein
the conductive ceramic powder contains one or more of indium tin
oxide (ITO), lanthanum-doped strontium titanate (SLT), and
yttrium-doped strontium titanate (SYT).
3. A method of manufacturing a multilayer ceramic electronic
component, the method comprising: preparing a plurality of ceramic
green sheets; forming internal electrode patterns on the ceramic
green sheets; forming a ceramic body in which dielectric layers and
internal electrodes are alternately stacked, by stacking and
sintering the ceramic green sheets; applying a paste for an
external electrode containing a conductive ceramic powder having a
conductivity of 100 S/cm or more, a conductive metal powder and a
glass frit to outer surfaces of the ceramic body to be connected to
one ends of the internal electrodes; and forming external
electrodes by sintering the paste for an external electrode,
wherein the conductive ceramic powder is included in an amount of 3
wt % to 20 wt % based on a total amount of the metal powder, the
conductive ceramic powder, and the glass frit.
4. The method of claim 3, wherein the conductive ceramic powder
contains one or more of indium tin oxide (ITO), lanthanum-doped
strontium titanate (SLT), and yttrium-doped strontium titanate
(SYT).
5. The method of claim 3, wherein a particle size of the conductive
ceramic powder is 50 nm to 400 nm.
6. A paste for an external electrode comprising: a conductive metal
powder; a conductive ceramic powder having conductivity of 100 S/cm
or more; and a glass frit, wherein the conductive ceramic powder is
included in an amount of 3 wt % to 20 wt % based on a total amount
of the metal powder, the conductive ceramic powder, and the glass
frit.
7. The paste for an external electrode of claim 6, wherein the
conductive ceramic powder contains one or more of indium tin oxide
(ITO), lanthanum-doped strontium titanate (SLT), and yttrium-doped
strontium titanate (SYT).
Description
CROSS-REFERENCE TO RELATED APPLICATION
This application claims the benefit of Korean Patent Application
No. 10-2014-0052866 filed on Apr. 30, 2014, with the Korean
Intellectual Property Office, the disclosure of which is
incorporated herein by reference.
BACKGROUND
The present disclosure relates to a paste for an external
electrode, a multilayer ceramic electronic component, and a method
of manufacturing the same.
Generally, electronic components using ceramic materials, such as
capacitors, inductors, piezoelectric elements, varistors,
thermistors, and the like, include a ceramic body formed of a
ceramic material, internal electrodes formed in the ceramic body,
and external electrodes formed on surfaces of the ceramic body to
be connected to the internal electrodes.
In accordance with the electronization of various functions in
applications requiring high degrees of reliability and increases in
demands thereon, in response thereto, demands also have been made
for multilayer ceramic electronic components having high
reliability.
In connection with external electrodes of the multilayer ceramic
electronic component, implementation of densification of the
external electrode and adhesion properties with respect to internal
electrodes may be factors considered in order to implement high
reliability.
In addition, in order to implement electrical properties of the
multilayer ceramic electronic component, contact resistance between
the internal electrode and the external electrode needs to be
decreased.
RELATED ART DOCUMENT
(Patent Document 1) Korean Patent Laid-Open Publication No.
2012-0068622
SUMMARY
An exemplary embodiment in the present disclosure may provide a
paste for an external electrode, a multilayer ceramic electronic
component, and a method of manufacturing the same.
According to an exemplary embodiment in the present disclosure, a
multilayer ceramic electronic component may include: a ceramic body
including a plurality of dielectric layers; internal electrodes
disposed in the ceramic body and having one ends exposed to outer
surfaces of the ceramic body; and external electrodes disposed on
the outer surfaces of the ceramic body to be connected to the
respective one ends of the internal electrodes and containing a
conductive metal and a conductive ceramic powder.
The external electrodes may be formed of a paste for an external
electrode containing a conductive metal and a conductive ceramic
powder, and the conductive ceramic powder may be contained in the
external electrode in an amount of 3 wt % to 20 wt %.
According to an exemplary embodiment in the present disclosure, a
method of manufacturing a multilayer ceramic electronic component
may include: preparing a plurality of ceramic green sheets; forming
internal electrode patterns on the ceramic green sheets; forming a
ceramic body in which dielectric layers and internal electrodes are
alternately stacked, by stacking and sintering the ceramic green
sheets; applying a paste for an external electrode containing a
conductive ceramic powder and a conductive metal powder to outer
surfaces of the ceramic body to be connected to one ends of the
internal electrodes; and forming external electrodes by sintering
the paste for an external electrode.
BRIEF DESCRIPTION OF DRAWINGS
The above and other aspects, features and other advantages of the
present disclosure will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings, in which:
FIG. 1 is a perspective view showing a multilayer ceramic
electronic component 100 according to an exemplary embodiment of
the present disclosure;
FIG. 2 is a cross-sectional view taken along line A-A' of FIG.
1;
FIG. 3 is an enlarged view of part P of FIG. 2; and
FIG. 4 is a flow chart showing a method of manufacturing a
multilayer ceramic electronic component according to an exemplary
embodiment of the present disclosure.
DETAILED DESCRIPTION
Exemplary embodiments of the present disclosure will now be
described in detail with reference to the accompanying
drawings.
The disclosure may, however, be exemplified in many different forms
and should not be construed as being limited to the specific
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope of the disclosure to those skilled in
the art.
In the drawings, the shapes and dimensions of elements may be
exaggerated for clarity, and the same reference numerals will be
used throughout to designate the same or like elements.
FIG. 1 is a perspective view showing a multilayer ceramic
electronic component 100 according to an exemplary embodiment of
the present disclosure, and FIG. 2 is a cross-sectional view taken
along line A-A' of FIG. 1.
Referring to FIGS. 1 and 2, the multilayer ceramic electronic
component 100 according to an exemplary embodiment of the present
disclosure may include a ceramic body 110; and external electrodes
131 and 132.
The ceramic body 110 may include an active layer as a portion
contributing to capacitance formation of a capacitor and upper and
lower cover layers formed on upper and lower portions of the active
layer as upper and lower margin parts, respectively. The active
layer may include dielectric layers 111 and internal electrodes 121
and 122 and be formed by stacking the dielectric layers 111 on
which the internal electrodes 121 and 122 are printed.
In an exemplary embodiment of the present disclosure, a shape of
the ceramic body 110 is not particularly limited, but may be
substantially a hexahedral shape. A difference in a thickness is
generated according to the sintering shrinkage of a ceramic powder
at the time of sintering a chip and the presence or absence of an
internal electrode pattern, and edge parts of the ceramic body are
polished, such that the ceramic body 110 does not have a perfect
hexahedral shape but may have a substantially hexahedral shape.
Directions of the ceramic body will be defined in order to clearly
describe exemplary embodiments of the present disclosure. L, W and
T shown in the accompanying drawings refer to a length direction, a
width direction, and a thickness direction, respectively. Here, the
thickness direction may be the same as a stacking direction in
which dielectric layers are stacked.
The internal electrodes 121 and 122 may be alternately stacked with
the dielectric layers 111 interposed therebetween and be insulated
from each other by the dielectric layers.
The internal electrodes 121 and 122 may include a first internal
electrode 121 and a second internal electrode 122, and one ends of
the internal electrodes 121 and 122 may be exposed to outer
surfaces of the ceramic body to thereby be electrically connected
to the external electrodes.
The internal electrodes may be electrically connected to the
external electrodes 131 and 132 through portions thereof exposed to
the outer surfaces of the ceramic body 110. The external electrode
may include a first external electrode 131 and a second external
electrode 132, the first internal electrode 121 may be electrically
connected to the first external electrode 131, and the second
internal electrode 122 may be electrically connected to the second
external electrode 132.
A thickness of the internal electrodes 121 and 122 and the number
of stacked internal electrodes 121 and 122 may be determined
according to the use thereof.
Further, a conductive metal contained in the first and second
internal electrodes 121 and 122 may be nickel (Ni), copper (Cu),
palladium (Pd), or an alloy thereof, but the present disclosure is
not limited thereto.
In this case, a thickness of the dielectric layers 111 may be
suitably changed according to a capacitance design of the
multilayer ceramic capacitor.
Further, the dielectric layers 111 may contain a ceramic powder
having high permittivity, for example, a barium titanate
(BaTiO.sub.3) based powder or a strontium titanate (SrTiO.sub.3)
based powder, or the like, but the present disclosure is not
limited thereto.
The upper and lower cover layers may have the same material and
configuration as those of the dielectric layers 111 except that
internal electrodes are not included therein. The upper and lower
cover layers may be formed by disposing a single or two or more
dielectric layers on upper and lower surfaces of the active layer
in a vertical direction, respectively, and serve to prevent the
internal electrodes 121 and 122 from being damaged by physical or
chemical stress.
The external electrodes 131 and 132 may be directly connected to
the internal electrodes 121 and 122 to secure electrical connection
between the external electrode and the internal electrode.
The external electrodes 131 and 132 may contain a conductive metal
30a, a conductive ceramic powder 30b, and a glass component 30c.
The external electrodes 131 and 132 may be formed of a paste for an
external electrode containing a metal powder, a conductive ceramic
powder, and a glass component. In the paste for an external
electrode, the glass component may be contained in a glass frit
form. The external electrodes may be sintered type electrodes
formed by sintering the paste for an external electrode.
FIG. 3 is an enlarged view of part P of FIG. 2.
Referring to FIG. 3, the external electrodes may contain the
conductive metal 30a, the conductive ceramic powder 30b, and the
glass component 30c.
The conductive metal 30a contained in the external electrode may
mainly serve to transfer a current applied to the external
electrodes 131 and 132 to the internal electrodes 121 and 122.
The conductive metal may be nickel (Ni), copper (Cu), palladium
(Pd), gold (Au), silver (Ag), or an alloy thereof, but the present
disclosure is not limited thereto.
The glass component 30c may be contained in order to densify the
external electrode. The glass component may contain SiO.sub.2 based
glass, B.sub.2O.sub.3 based glass, or both of the SiO.sub.2 based
glass and B.sub.2O.sub.3 based glass, but is not limited
thereto.
For example, the glass component may contain a composition of
aSiO.sub.2-bB.sub.2O.sub.3-cR.sup.1.sub.2O or
aSiO.sub.2-bB.sub.2O.sub.3-dR.sup.2O, but is not limited thereto.
R.sup.1 may be selected from a group consisting of lithium (Li),
sodium (Na), and potassium (K), R.sup.2 may be selected from a
group consisting of magnesium (Mg), calcium (Ca), strontium (Sr),
and barium (Ba), and a, b, c, and d may be appropriately adjusted
depending on desired physical properties of the glass
component.
Contents of the conductive metal 30a and the glass component 30c
may be appropriately adjusted according to properties of the
external electrode.
The conductive ceramic powder 30b may serve to delay the sintering
of the paste for an external electrode when the external electrode
is formed by a sintering process.
In the case in which the sintering of the paste for an external
electrode is excessively rapidly performed, it may be difficult to
implement densification of the external electrode, and the external
electrode may not be closely adhered to the ceramic body but be
delaminated from the ceramic body.
Generally, since a ceramic material has a high melting point as
compared to glass or a metal contained in an external electrode, in
the case of sintering the paste for an external electrode
containing the ceramic powder to form the external electrode, a
sintering rate of the external electrode may be decreased.
However, since a general ceramic material has non-conductivity, in
the case in which non-conductive ceramic powder is contained in the
paste for an external electrode, contact resistance between the
internal electrode and the external electrode may be increased.
Particularly, the non-conductive ceramic powder contained in the
external electrode is present in an exposed portion of the internal
electrode, a contact portion between the internal electrode and the
external electrode, a contact area between the internal electrode
and a conductive metal of the external electrode may be decreased,
such that contact resistance between the internal electrode and the
external electrode may be increased, and equivalent series
resistance (ESR) of a multilayer ceramic electronic component may
be increased.
According to an exemplary embodiment of the present disclosure, the
external electrodes 131 and 132 contain the conductive ceramic
powder 30b, such that the sintering rate of the external electrode
may be decreased, and defects in which contact resistance between
the internal electrodes 121 and 122 and the external electrodes 131
and 132 is increased may be solved.
It is preferable that conductivity of the conductive ceramic powder
30b may be 100 S/cm or more in order to decrease contact
resistance. The conductive ceramic powder 30b may contain one or
more of indium tin oxide (ITO), lanthanum-doped strontium titanate
(SLT), and yttrium-doped strontium titanate (SYT), but is not
limited thereto.
According to an exemplary embodiment of the present disclosure, the
external electrodes 131 and 132 may contain the conductive ceramic
powder 30b in an amount of 3 wt % to 20 wt %. In the case in which
the content of the conductive ceramic powder contained in the
external electrode is less than 3 wt %, an effect of delaying the
sintering of the external electrode may be insignificant, such that
a delamination defect of the external electrode may occur, and in
the case in which the content of the conductive ceramic powder
contained in the external electrode is greater than 20 wt %,
contact resistance between the internal electrode and the external
electrode may be increased.
The conductive ceramic powder 30b contained in the multilayer
ceramic electronic component according to an exemplary embodiment
of the present disclosure has conductivity, but since the
conductive ceramic powder has a level of conductivity lower than
that of the metal and may increase resistance due to grain
boundaries formed between the metal and the ceramic powder, the
external electrodes 131 and 132 may contain the conductive ceramic
powder in an amount of 20 wt % or less.
Although not shown, a conductive resin layer containing conductive
particles and an epoxy resin may be selectively disposed on the
external electrodes 131 and 132.
In addition, a plating layer containing tin may be selectively
formed on the external electrodes in order to improve adhesive
properties with solder at the time of mounting the multilayer
ceramic electronic component on a board.
For example, the conductive resin layer may be disposed on the
external electrodes 131 and 132, and the plating layer may be
formed on the conductive resin layer.
In the multilayer ceramic electronic component according to an
exemplary embodiment of the present disclosure, the external
electrodes may contain the conductive ceramic powder, such that
densification of external electrodes may be implemented, and an
increase in the contact resistance between the internal electrode
and the external electrode may be suppressed.
A paste for an external electrode according to another exemplary
embodiment of the present disclosure may contain a metal powder; a
conductive ceramic powder, and a glass frit.
The external electrode of the multilayer ceramic electronic
component as described above may be formed of the paste for an
external electrode according to the present exemplary embodiment.
That is, the paste for an external electrode according to the
present exemplary embodiment may be a paste for forming the
external electrode of the multilayer ceramic electronic component
as described above.
In describing the paste for an external electrode according to the
present exemplary embodiment, a description overlapped with the
description of the external electrode of the multilayer ceramic
electronic component as described above will be omitted or briefly
provided, and a difference therebetween will be mainly
described.
The metal powder contained in the paste for an external electrode
may be formed of nickel (Ni), copper (Cu), palladium (Pd), gold
(Au), silver (Ag), or an alloy thereof, but the present disclosure
is not limited thereto.
The glass frit may be contained in order to densify the external
electrode. The glass component may contain SiO.sub.2 based glass,
B.sub.2O.sub.3 based glass, or both of the SiO.sub.2 based glass
and B.sub.2O.sub.3 based glass, but is not limited thereto.
Electrical conductivity of the conductive ceramic powder may be 100
S/cm or more.
According to an exemplary embodiment of the present disclosure, a
particle size of the conductive ceramic powder may be 50 nm to 400
nm.
In the case in which the particle size of the conductive ceramic
powder in the paste for an external electrode is less than 50 nm, a
debindering reaction may be hindered at the time of sintering the
external electrode, thereby causing defects such as an electrode
defect, or the like. In the case in which the particle size of the
conductive ceramic powder is greater than 400 nm, intervals between
metal powder particles contained in the paste for an external
electrode may be increased, thereby hindering densification of the
external electrode.
The conductive ceramic powder may be contained in an amount of 3 wt
% to 20 wt % based on the total amount of the metal powder, the
glass frit, and the conductive ceramic powder.
The conductive ceramic powder may contain one or more of indium tin
oxide (ITO), lanthanum-doped strontium titanate (SLT), and
yttrium-doped strontium titanate (SYT).
The paste for an external electrode may further contain a solvent
for adjusting viscosity if necessary.
FIG. 4 is a flowchart showing a method of manufacturing a
multilayer ceramic electronic component according to an exemplary
embodiment of the present disclosure.
Referring to FIG. 4, a method of manufacturing a multilayer ceramic
electronic component according to an exemplary embodiment of the
present disclosure may include: preparing a plurality of ceramic
green sheets (S1); forming internal electrode patterns on the
ceramic green sheets (S2); forming a ceramic body (S3); applying a
paste for an external electrode onto outer surfaces of the ceramic
body (S4); and forming an external electrode (S5).
The preparing of the plurality of ceramic green sheets (S1) may be
performed by applying slurry containing a dielectric powder to
carrier films and drying the same.
The forming of the internal electrode patterns (S2) may be
performed by printing a paste for an internal electrode onto the
ceramic green sheets, but a method of forming the internal
electrode patterns is not limited thereto.
The forming of the ceramic body (S3) may be performed by stacking
the ceramic green sheets on which the internal electrode patterns
are formed, stacking the ceramic green sheets on which the internal
electrode patterns are not formed on upper and lower portions of
the stacked ceramic green sheets in order to form cover layers to
forma ceramic multilayer body, and then sintering the ceramic
multilayer body.
The method may further include, before a sintering process,
compressing the multilayer body, and cutting the compressed
multilayer body so that one ends of the internal electrode patterns
are alternately exposed to cut surfaces.
The applying of the paste for an external electrode onto the outer
surfaces of the ceramic body (S4) may be performed using the
above-mentioned paste for an external electrode according to
another exemplary embodiment of the present disclosure. Application
of the paste for an external electrode may be performed by dipping
the ceramic body into the paste for an external electrode, but is
not limited thereto.
Then, the forming of the external electrodes (S5) may be performed
by sintering the paste for an external electrode applied onto the
ceramic body.
Experimental Example
The following Table 1 shows data obtained by observing an electrode
delamination defect rate and a contact defect rate of an external
electrode depending on a content of a conductive ceramic powder
contained in the external electrode.
In the present Experimental Example, ceramic bodies each having a
size of about 1.0 mm.times.0.5 mm.times.0.5 mm
(length.times.width.times.thickness (L.times.W.times.T), a 1005
size, a tolerance range of .+-.0.2 mm) were used. In the present
Experimental Example, each thickness of the internal electrodes was
1.2 .mu.m, the number of stacked internal electrodes was about 200,
and one end portions of the internal electrodes were exposed to
both side surfaces of the ceramic body in a length direction.
The external electrode was formed using a paste for an external
electrode containing a copper powder having a particle size of
about 500 nm as a conductive metal, indium tin oxide (ITO) having a
particle size of about 100 nm as a conductive ceramic powder, and a
glass frit having a particle size of about 1 .mu.m, and indium tin
oxide (ITO) was contained in the paste for an external electrode to
have contents shown in the following Table 1 in the formed external
electrode.
A weight ratio of the contained copper powder and glass frit was
about 90:10.
The external electrode was formed to have a thickness of about 35
.mu.m by applying and sintering the paste for an external electrode
onto the ceramic body.
In the following Table 1, the electrode delamination defect rate
was measured by observing the number of multilayer ceramic
electronic components in which a delamination defect occurs at an
interface between the ceramic body and the external electrode after
sintering the external electrode among 100 multilayer ceramic
electronic components, and the contact defect rate was measured by
observing the number of multilayer ceramic electronic component of
which implemented capacitance was less than 90% of the designed
capacitance among 100 multilayer ceramic electronic component.
TABLE-US-00001 TABLE 1 Content of Conductive Electrode Delamination
Contact Defect Sample ceramic powder Defect Rate (ea/ea) Rate
(ea/ea) 1* 0 25/100 0/100 2* 1 12/100 0/100 3* 2 4/100 0/100 4 3
0/100 0/100 5 4 0/100 0/100 6 5 0/100 0/100 7 6 0/100 0/100 8 7
0/100 0/100 9 8 0/100 0/100 10 9 0/100 0/100 11 10 0/100 0/100 12
11 0/100 0/100 13 12 0/100 0/100 14 13 0/100 0/100 15 14 0/100
0/100 16 15 0/100 0/100 17 16 0/100 0/100 18 17 0/100 0/100 19 18
0/100 0/100 20 19 0/100 0/100 21 20 0/100 0/100 22* 21 0/100 3/100
23* 22 0/100 4/100 24* 23 0/100 6/100 25* 24 0/100 6/100 26* 25
0/100 7/100 27* 26 0/100 10/100 28* 27 0/100 13/100 29* 28 0/100
12/100 30* 29 0/100 15/100 31* 30 0/100 19/100 *indicates
Comparative Examples.
Referring to Table 1, it may be confirmed that in the case of
samples 1 to 3 in which the content of the conductive ceramic
powder contained in the external electrode was less than 3 wt %,
the electrode delamination defect occurred, and in the case of
samples 22 to 31 in which the content of the conductive ceramic
powder contained in the external electrode was greater than 20 wt
%, the contact defect of the external electrode occurred, such that
the capacitance implementation rate was decreased.
As set forth above, according to exemplary embodiments of the
present disclosure, the paste for an external electrode capable of
forming the external electrode having excellent electrical
properties, the multilayer ceramic electronic component having
excellent electrical properties, and the method of manufacturing
the same may be provided.
While exemplary embodiments have been shown and described above, it
will be apparent to those skilled in the art that modifications and
variations could be made without departing from the spirit and
scope of the present disclosure as defined by the appended
claims.
* * * * *