U.S. patent number 9,332,646 [Application Number 13/745,766] was granted by the patent office on 2016-05-03 for electronic package module and method of manufacturing the same.
This patent grant is currently assigned to Universal Global Scientific Industrial Co., Ltd., Universal Scientific Industrial (Shanghai) Co., Ltd.. The grantee listed for this patent is UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.. Invention is credited to Hsin-Chin Chang, Jen-Chun Chen.
United States Patent |
9,332,646 |
Chen , et al. |
May 3, 2016 |
Electronic package module and method of manufacturing the same
Abstract
An electronic package module includes a circuit board having a
supporting surface, at least one first electronic component, at
least one second electronic component, and at least one molding
compound. The first and second electronic components are mounted on
the supporting surface. The molding compound is disposed on the
supporting surface and covers the supporting surface partially. The
molding compound encapsulates the first electronic component yet
not the second electronic component.
Inventors: |
Chen; Jen-Chun (New Taipei,
TW), Chang; Hsin-Chin (Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD. |
Shanghai
Nantou County |
N/A
N/A |
CN
TW |
|
|
Assignee: |
Universal Scientific Industrial
(Shanghai) Co., Ltd. (Shanghai, CN)
Universal Global Scientific Industrial Co., Ltd. (Nantou
County, TW)
|
Family
ID: |
49999294 |
Appl.
No.: |
13/745,766 |
Filed: |
January 19, 2013 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20140126161 A1 |
May 8, 2014 |
|
Foreign Application Priority Data
|
|
|
|
|
Nov 2, 2012 [TW] |
|
|
101140726 A |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
25/16 (20130101); H05K 1/186 (20130101); H05K
3/30 (20130101); H01L 23/552 (20130101); H05K
3/284 (20130101); H05K 2203/1327 (20130101); H01L
2924/0002 (20130101); Y10T 29/4913 (20150115); H01L
23/3135 (20130101); H01L 2224/48091 (20130101); H01L
2924/181 (20130101); H05K 2201/1056 (20130101); H05K
2203/1316 (20130101); H01L 2924/1531 (20130101); H01L
2924/0002 (20130101); H01L 2924/00 (20130101); H01L
2924/181 (20130101); H01L 2924/00012 (20130101); H01L
2224/48091 (20130101); H01L 2924/00014 (20130101) |
Current International
Class: |
H05K
1/18 (20060101); H05K 3/30 (20060101); H05K
3/28 (20060101); H01L 25/16 (20060101); H01L
23/552 (20060101); H01L 23/31 (20060101) |
Field of
Search: |
;361/748 ;29/832
;174/521 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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19650255 |
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Jun 1998 |
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Aug 1998 |
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Apr 1999 |
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2007059846 |
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Mar 2007 |
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2007294828 |
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Nov 2007 |
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2008140870 |
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JP |
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2008288610 |
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Nov 2008 |
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JP |
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2010098077 |
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Apr 2010 |
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JP |
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2013179152 |
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Sep 2013 |
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JP |
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525630 |
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Mar 2003 |
|
TW |
|
200944086 |
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Oct 2009 |
|
TW |
|
201241581 |
|
Oct 2012 |
|
TW |
|
Primary Examiner: Norris; Jeremy C
Assistant Examiner: Milakovich; Nathan
Attorney, Agent or Firm: Foley & Lardner LLP Liu; Cliff
Z. Murch; Angela D.
Claims
What is claimed is:
1. An electronic package module comprising: a circuit board having
a supporting surface; at least one first electronic component
disposed on the supporting surface; at least one second electronic
component disposed on the supporting surface; and at least one
molding compound arranged on the supporting surface and partially
covering thereon, the molding compound solely encapsulating the at
least one first electronic component; wherein the at least one
molding compound includes an opening, and the at least one second
electronic component is disposed at the opening; and wherein the at
least one molding compound includes a top surface and a side
connecting the top surface, the side is positioned between the top
surface and the supporting surface, and the at least one molding
compound gradually shrinks from the top surface to the supporting
surface.
2. The electronic package module according to claim 1 further
comprising at least one shielding conductive layer covering the
molding compound, and the circuit board further includes at least
one grounding pad on the supporting surface connecting to the at
least one shielding conductive layer.
3. The electronic package module according to claim 2, wherein the
at least one molding compound includes a top surface and a side
connecting to the top surface, the side is positioned between the
top surface and the supporting surface, and the at least one
shielding conductive layer covers the top surface and the side.
4. The electronic package module according to claim 1, wherein the
side of the molding compound slants from the top surface to the
supporting surface, and an included angle between the side of the
molding compound and the supporting surface is larger than 90
degrees.
5. The electronic package module according to claim 1, wherein the
at least one second electronic component is a photoelectric
component.
6. The electronic package module of claim 1, further comprising a
plurality of pads on the supporting surface, wherein the at least
one first electronic component electrically connects to at least
one of the plurality of pads by wire bonding, and the at least one
second electronic component electrically connects to at least one
other of the plurality of pads by flip chip bonding.
7. The electronic package module of claim 6, wherein the circuit
board has a bottom surface opposite to the supporting surface,
further comprising at least one pad disposed on the bottom
surface.
8. The electronic package module of claim 7, wherein the at least
one pad on the bottom surface electrically connects to at least one
of the pads on the supporting surface by at least one selected from
the group consisting of: a conductive blind via, a conductive
through hole and a conductive buried hole.
9. The electronic package module of claim 1, wherein the at least
one molding compound comprises an epoxy resin.
10. The electronic package module of claim 9, wherein the epoxy
resin comprises silicon oxide or aluminum oxide.
11. The electronic package module of claim 1, wherein the circuit
board is a diced circuit board unit.
12. The electronic package module of claim 1, wherein the at least
one molding compound is formed in a hollow region of a mask pattern
layer.
13. The electronic package module of claim 12, wherein the mask
pattern layer is formed by printing a paint layer on the supporting
surface and then curing the paint layer by heating or ultraviolet
treatment.
14. The electronic package module of claim 13, wherein the paint
layer is a positive or negative photoresist material.
15. The electronic package module of claim 1, wherein the circuit
board includes at least two layers of circuits.
16. The electronic package module of claim 2, wherein the at least
one shielding conductive layer is formed by at least one of the
following: spraying, electroplating, electroless plating, physical
vapor deposition (PVD) or chemical vapor deposition (CVD).
17. The electronic package module of claim 16, wherein the at least
one shielding conductive layer is formed by PVD, and is performed
by evaporation or sputtering.
18. The electronic package module of claim 2, wherein the at least
one shielding conductive layer fully covers the at least one
molding compound.
19. The electronic package module of claim 5, wherein the
photoelectric component is at least one selected from the group
consisting of: a CMOS Image Sensor, a Charge-Coupled Device (CCD),
and a light emitting diode (LED).
Description
BACKGROUND
1. Field of the Invention
The instant disclosure relates to an electronic component and
method of manufacturing the same; in particular, to an electronic
package module and method of manufacturing the same.
2. Description of Related Art
Typically, a conventional electronic package module includes a
circuit board and a plurality of electronic components disposed
thereon. The electronic components may be, for example, chip
packages, passive components or the like. In addition, the majority
of the electronic package modules further include molding compounds
to encapsulate the electronic components and provide protection of
the electronic components.
However, certain electronic components, especially photoelectric
components such as CMOS Image Sensors (CISs), Charge-Coupled
Devices (CCDs), Light Emitting Diodes (LEDs), or the like are not
suitable to be encapsulated by molding compounds. It is common that
the electronic package module which contains a photoelectric
component and a non-photoelectric component does not have molding
compound to ensure that the photoelectric components can be in
normal operation.
SUMMARY OF THE INVENTION
The instant disclosure is to provide an electronic package module
which includes a plurality of electronic components and a molding
compound. The molding compound only encapsulates at least one of
the electronic components and does not encapsulate all of the
electronic components.
The instant disclosure also provides a method of manufacturing the
aforementioned electronic package module.
According to one exemplary embodiment of the instant disclosure, an
electronic package module includes a circuit board, at least one
first electronic component, at least one second electronic
component and at least one molding compound. The circuit board has
a supporting surface. The first and second electronic components
are mounted on the supporting surface. The molding compound is
arranged on the supporting surface and partially covers the
supporting surface. The molding compound encapsulates at least one
first electronic component but does not encapsulate the second
electronic component.
According to another exemplary embodiment of the instant
disclosure, a method of manufacturing the electronic package module
is provided. Firstly, a circuit board assembly is provided. The
circuit board assembly includes a circuit board having a supporting
surface, at least one first electronic component and at least one
second electronic component. Then a mask pattern layer is formed on
the circuit board assembly. The first and second electronic
components are mounted on the supporting surface. The mask pattern
layer with at least one hollow region partially covers the
supporting surface. The first electronic component is positioned to
the hollow region. In addition, the mask pattern layer completely
covers the second electronic component. Subsequently, a molding
compound is formed in the hollow region and encapsulates the first
electronic component. After the formation of molding compound, the
mask pattern layer is removed, and thus the second electronic
component is exposed.
Therefore, the electronic package module includes the molding
compound encapsulating at least one of the electronic components.
Thus, the conventional electronic package module containing a
photoelectric component (for example, an image sensor or a light
emitting unit) can utilize the instant disclosure to allow partial
coverage for electronic components. In other words, the molding
compound can encapsulate the requisite electronic component and not
encapsulate the electronic component such as the photoelectric
component, which is not suitable to be encapsulated. Hence, the
molding compound does not affect the normal operation of the
photoelectric component and meanwhile protects the other electronic
components. Note that the instant disclosure is not limited to
protection of electronic components (regardless being encapsulated
or not) and other active or passive components can also be
applied.
In order to further understand the instant disclosure, the
following embodiments are provided along with illustrations to
facilitate the appreciation of the instant disclosure; however, the
appended drawings are merely provided for reference and
illustration, without any intention to be used for limiting the
scope of the instant disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A is a top schematic view of an electronic package module in
accordance with an embodiment of the instant disclosure.
FIG. 1B is a cross-sectional schematic view along line I-I in FIG.
1A.
FIGS. 2A to 2H are cross-sectional schematic views of FIG. 1B
showing a method of manufacturing the electronic package
module.
FIGS. 3A to 3C are cross-sectional schematic views showing a method
of manufacturing an electronic package module in accordance with
another embodiment of the instant disclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The aforementioned illustrations and following detailed
descriptions are exemplary for the purpose of further explaining
the scope of the instant disclosure. Other objectives and
advantages related to the instant disclosure will be illustrated in
the subsequent descriptions and appended drawings.
FIG. 1A is a top schematic view of an electronic package module in
accordance with an embodiment of the instant disclosure. FIG. 1B is
a cross-sectional schematic view along line I-I in FIG. 1A.
Attention now is invited to FIGS. 1A and 1B. The electronic package
module 100 includes a circuit board 110, at least one first
electronic component, at least one second electronic component and
at least one molding compound. Take FIG. 1A for example. The
electronic package module 100 includes a plurality of first
electronic components, a plurality of second electronic components
and a plurality of molding compounds. The first electronic
components are designated as 121a and 121b, while the second
electronic components are designated as 122a and 122b. The molding
compounds are designated as 130a and 130b.
However, in other embodiments, the quantity of the first electronic
component can be one. The second electronic component can be one,
and the molding compound can be one as well. That is to say, the
quantity of the first electronic component, the second electronic
component, or the molding compound can be one, two, or more than
two. The quantities of the first electronic component, the second
electronic component, and the molding compound are not limited to
FIG. 1A.
The circuit board 110 includes a supporting surface 110a. The first
electronic components 121a, 121b, and the second electronic
components 122a, 122b are mounted on the supporting surface 110a
and electrically connect to the circuit board 110 to permit
electrical signal transmission among the first electronic
components 121a, 121b, and the second electronic components 122a,
122b. Thus, the first electronic components 121a, 121b, and the
second electronic components 122a, 122b can work.
The circuit board 110 includes a plurality of pads 112a, 112b. The
second electronic component 122a can electrically connect to the
pad 112a by flip-chip, and the first electronic component 121a can
electrically connect to the pad 112b by wire bonding as shown in
FIG. 1B. Likewise, the second electronic component 122a can
electrically connect to the pads 112a by wire bonding, whereas the
first electronic component 121 can electrically connect to the pads
112b by flip-chip. That is to say, the connection arrangement
between the first, second electronic components 121a, 122a and the
circuit board 110 is not limited to FIG. 1B.
The circuit board 110 can be a double side circuit board with two
layers of circuits or a multilayer circuit board with more than two
layers of circuits. The circuit board 110 further includes a
circuit board bottom surface 110b opposite to the supporting
surface 110a and a plurality of pads 112c on the circuit board
bottom surface 110b. The pads 112c can be electrically connect to
another circuit board, such as printed circuit board. The pads 112c
can electrically connect to pads 112a and 112b by the conductive
blind vias, conductive through holes or conductive buried
holes.
The molding compounds 130a and 130b are mounted on the supporting
surface 110a. Each of the molding compounds 130a and 130b partially
covers the supporting surface 110a and encapsulates at least one
first electronic component. For example, the molding compound 130a
encapsulates one first electronic component 121a, and the molding
compound 130b encapsulates eight first electronic components 121b.
Nevertheless, the molding compounds 130a and 130b do not
encapsulate and do not contact any of the second electronic
components 122a and 122b.
Moreover, the second electronic components 122a and 122b which are
not encapsulated by the molding compounds 130a and 130b may be
photoelectric components such as image sensors or light emitting
units. The image sensor can be such as a CMOS Image Sensor or a
Charge-Coupled Device (CCD). The light emitting unit may be such as
a Light Emitting Diode (LED). However, the second electronic
components 122a, 122b are not limited to the aforementioned
photoelectric components. The second electronic components 122a and
122b may be active or passive components.
Take FIGS. 1A and 1B for example. The molding compound 130a has an
opening 138a. Two second electronic components 122b are arranged
inside the opening 138a. In other words, the molding compound 130a
surrounds the second electronic components 122b and is not in
contact with the second electronic components 122b. Furthermore,
the embodiment in FIG. 1A shows two second electronic components
122b arranged inside the opening 138a. However, the quantity of the
second electronic components 122b inside the opening 138a can be
one or at least three in other embodiment. Therefore, the quantity
of the second electronic components 122b at the opening 138a is not
limited by FIG. 1A. In addition, a person skilled in the art should
understand that when the molding compound 130a does not have
opening 138a, the second electronic components 122b are absent in
the molding compound 130a.
The second electronic components 122a can be disposed between the
molding compounds 130a and 130b. Specifically, a region S1 is
defined by the molding compounds 130a, 130b and the supporting
surface 110a. The second electronic component 122a is mounted on
the supporting surface 110a of the region S1. Thus, the molding
compound 130a and 130b do not encapsulate the second electronic
components 122a and are not in contact with the second electronic
components 122a.
It is worth mentioned that in the embodiment shown in FIG. 1A, only
one second electronic component 122a is disposed in the region S1.
However, the quantity of the second electronic component 122a
disposed in the region S1 can be two or more than two so that the
quantity of the second electronic component 122a is not restricted
to that shown in FIG. 1A.
The electronic package module 100 may further include at least one
shielding conductive layer 140. In the instant embodiment, the
electronic package module 100 includes two shield conductive layers
140. One of the shielding conductive layers 140 covers the molding
compound 130a while the other one covers the molding compound 130b.
Furthermore, the shield conductive layers 140 completely cover the
molding compounds 130a and 130b.
Take FIGS. 1A and 1B for example. The molding compound 130a has a
top surface 132a and sides 134a, 136a both connected to the top
surface 132a. The sides 134a and 136a are positioned between the
top surface 132a and the supporting surface 110a. The side 136a is
the side wall of the opening 138a whereas the side 134a is the
outer surface of the molding compound 130a as shown in FIGS. 1A and
1B.
The shielding conductive layer 140 completely covers the top
surface 132a and the sides 134a, 136a. Hence, the shielding
conductive layer 140 fully covers the molding compound 130a.
Similarly, the other shielding conductive layer 140 completely
covers the top surface and the sides of the molding compound 130b.
Therefore, the shielding conductive layers 140 entirely blanket the
molding compounds 130a and 130b. In addition, the shielding
conductive layers 140 may be in contact with the top surface 132a,
the sides 134a, 136a and both the top and the sides of the molding
compound 130b.
The shielding conductive layers 140 may be a conductive film formed
by deposition so the shielding conductive layers 140 cover the
molding compounds 130a and 130b conformably. The means of the
deposition may be spraying, electroplating, electroless plating,
Physical Vapor Deposition (PVD) or Chemical Vapor Deposition (CVD).
The PVD may be evaporation or sputtering.
The molding compounds 130a and 130b are fully covered by the
shielding conductive layers 140 so the shielding conductive layers
140 can envelop the first electronic components 121a and 121b
within the molding compounds 130a and 130b. Thus, the shielding
conductive layers 140 can block Electro-Magnetic Interference
(EMI), thereby attenuating the influence on the first electronic
components 121a and 121b from EMI.
In addition, the circuit board 110 may have a plurality of
grounding pads 112g mounted on the supporting surface 110a. The
shielding conductive layers 140 connect to the grounding pads 112g
which are grounded. For example, the grounding pads 112g
electrically connect to the ground plane (not shown) of the circuit
board 110. The shielding conductive layers 140 are grounded via the
grounding pads 112g. Thus, the function of the shielding conductive
layers 140 for blocking EMI can be enhanced.
It is worth mentioned that although the circuit board 110 includes
a plurality of grounding pads 112g as shown in FIGS. 1A and 1B, the
quantity of the grounding pads 112g is not limited thereto. A
single grounding pad 112g is also acceptable.
The molding compounds 130a and 130b only encapsulate the first
electronic components 121a and 121b except the second electronic
components 122a and 122b. The conventional electronic package
module containing a photoelectric component, such as an image
sensor or a light emitting unit, and the other electronic
components may adapt the design of the electronic package module
100 to selectively encapsulate certain components. The molding
compounds do not affect the operation of the photoelectric
component, and the other electronic components are still under
protection. It is noted that the electronic package module 100 may
include only one molding compound 130a or 130b or more than two
molding compounds and is not limited to the instant embodiment.
The preceding description is mainly mentioned the structure of the
electronic package module 100. The method of manufacturing the
electronic package module 100 is described herein with reference to
FIGS. 2A to 2G.
Attention now is invited to FIG. 2A. In the method of manufacturing
the electronic package module 100, firstly, a mask pattern layer
150 is formed on the circuit board assembly 10. The circuit board
assembly 10 refers to a circuit board with a plurality of
electronic components mounted thereon. Specifically, the circuit
board assembly 10 includes a circuit board 110', at least one first
electronic component and at least one second electronic component.
The first and second electronic components are mounted on a
supporting surface 110a' of the circuit board 110'. That is to say,
before the mask pattern layer 150 is formed, the first and second
electronic components are mounted on the circuit board 110'
already.
Although only one first electronic component 121a and one second
electronic component 122a are mounted on the supporting surface
110a' shown in FIG. 2A, the first electronic component 121b and the
second electronic component 122b are also mounted on the supporting
surface 110a'. A person skilled in the art should understand that
the first electronic components 121a, 121b and the second
electronic components 122a, 122b are all mounted on the supporting
surface 110a' as the layout shown in FIG. 1A, according to common
knowledge in the field.
In the instant embodiment, the circuit board 110' is in similar
structure as the circuit board 110 shown in FIG. 1B, and the
circuit board 110' includes a plurality of grounding pads 112g.
However, the difference between the circuit boards 110' and 110
arises from the dimension. The dimension of the circuit board 110'
is larger than that of the circuit board 110.
Specifically, the circuit board 110 may be the circuit board unit
obtained by dicing (i.e. singulating) the circuit board 110'. The
circuit board 110' may be a circuit panel or a strip. In other
embodiments, the circuit board 110' may be identical to the circuit
board 110. That is to say, the circuit board 110' can be an already
diced circuit board unit.
After the formation of mask pattern layer 150, the mask pattern
layer 150 partially covers the supporting surface 110a'. The mask
pattern layer 150 does not cover the hollow region of the first
electronic components 121a and 121b whereas the second electronic
components 122a and 122b are fully covered thereby. Take FIG. 2A
for example. The first electronic component 121a is within the
hollow region 150e so the mask pattern layer 150 does not coat or
contact the first electronic component 121a. In contrast, the mask
pattern layer 150 completely covers the second electronic component
122a.
Moreover, the quantity of the hollow region (such as hollow region
150e) is the same as the total quantity of the molding compounds
130a and 130b. The mask pattern layer 150 may have one or more
hollow regions.
In the embodiment shown in FIG. 2A, the mask pattern layer 150 has
an upper surface 150t and a corresponding lower surface 150b. The
lower surface 150b is in contact with the circuit board assembly 10
and gradually shrinks toward the upper surface 150t. Thus the area
of the upper surface 150t is smaller than that of the lower surface
150b which results in a slanting side 150s connecting the top and
lower surfaces 150t, 150b. The slanting side 150s and the lower
surface 150b together form an included angle A1 smaller than
90.degree. as shown in FIG. 2A.
The mask pattern layer 150 may be formed by different means. In the
instant embodiment, the mask pattern layer 150 is formed by mold
printing. Specifically, please refer to FIGS. 2A to 2C. Firstly, a
template 160 is atop the circuit board assembly 10 acting as a
cover. A paint layer is printed onto the circuit board 110'. The
paint layer may be conventional print or positive, negative
photoresist materials. FIG. 2B shows a top schematic view of the
template 160. FIG. 2C shows a schematically cross-sectional view
along the line II-II in FIG. 2B. The template 160 shown in FIG. 2A
is a cross-sectional view along the line II-II in FIG. 2B. The
template 160 has a plurality of hollow regions 162 corresponding to
the second electronic components 122a and 122b (please refer to
FIG. 1A). In the aforementioned printing process, the paint layer
passes through the hollow regions 162 and blankets the second
electronic components 122a and 122b except the first electronic
components 121a and 121b.
Subsequently, the paint layer is cured. The paint layer is cured to
become the mask pattern layer 150 by heating or ultraviolet
treatment. During the cure, the template 160 may remain on the
circuit board assembly 10 to cover the circuit board 10. After the
paint layer is cured, the template 160 is removed, and the hollow
region 150e is formed. In addition, in the instant embodiment, the
mask pattern layer 150 may contain silicon oxide such as silicon
dioxide in the composition.
It is worth mentioned that template 160 may have at least one plate
160a and at least one wall 160b. The plate 160a connects to the
wall 160b and has template slanting sides 160s. In the formation of
the mask pattern layer 150, the template slanting sides 160s are in
contact with the paint layer and form the slanting sides 150s of
the mask pattern layer 150 as shown in FIGS. 2A and 2C.
Note that in the instant embodiment, the mask pattern layer 150 is
formed by template 160 printing. In other embodiments, the mask
pattern layer 150 may be formed without the template 160.
Specifically, the mask pattern layer 150 may use template 160 as
cover and be formed by spraying. The mask pattern layer 150 may be
formed by different ways and is not limited to the instant
embodiment.
Attention is now invited to FIG. 2D. A mold compound is formed
within the hollow region 150e to encapsulate the first electronic
components so all the first electronic components 121a and 121b of
the electronic package module 100 are encapsulated by the mold
compound (as the mold compound 130a' shown in FIG. 2D). The mold
compound may be formed by dispenser and the primary material
thereof can be epoxy. The epoxy may contain silicon oxide,
aluminium oxide or the like. Furthermore, the mold compound is only
formed on the hollow region and not expanding beyond. Therefore, in
general the mold compound does not cover the upper surface 150t of
the mask pattern layer 150.
Take FIG. 2D for example. The mold compound 130a' is formed inside
the hollow region 150e, encapsulates at least one first electronic
component 121a and covers at least one grounding pad 112g as well
as part of the supporting surface 110a'; however, the upper surface
150t of the mask pattern layer is not covered. The thickness H1 of
the mold compound 130a' corresponding to the supporting surface
110a' is thinner than the thickness H2 of the mask pattern layer
150 corresponding to the supporting surface 110a' so as to prevent
the mold compound 130a' from exceeding and covering the upper
surface 150t.
Attention now is invited to FIGS. 2D and 2E. After the formation of
the mold compound, the mold compound is cut to form a plurality of
trenches exposing the grounding pads 112g and part of the
supporting surface 110a' (for example, the trench T1 shown in FIG.
2E). Additionally, laser cutter can also be utilized in the cutting
process. The laser beam L1 which conducts the cutting process can
be green laser. Nevertheless, the cutting process may be conducted
by different ways such as machine slicing.
The trenches follow about the outline of the mold compounds 130a
and 130b as shown in FIG. 1A. For example, one of the trenches
substantially resembles the opening 138a outline of the mold
compound 130a. In FIG. 2E, after the cutting of the mold compound
130a', the trench T1 is formed and resembles the side 134a outline
of the mold compound 130a as shown in FIG. 1A.
After the cutting of the mold compound, in addition to the
trenches, the mold compounds 130a and 130b are formed as shown in
FIG. 1A. Part of the mold compound 130a' remains on the mask
pattern layer 150 being mold compound residues 130a''. In general,
the mold compound residues 130a'' attach to the slanting sides 150s
of the mask pattern layer 150 yet not the grounding pad 112g.
Attention is now invited to FIG. 2F. The shielding conductive layer
140 is formed after the cutting. The shielding conductive layer 140
extends toward all the trenches (including the trench T1) and
connects to the grounding pads 112g. The shielding conductive layer
140 may be formed by deposition such as spraying, electroplating,
electroless plating, PVD, or CVD. The PVD may be evaporation or
sputtering.
The shielding conductive layer 140 may further cover the mold
compound residues 130a'' along with mask pattern layer 150 and
touch mask pattern layer 150. The shielding conductive layer 140
covers part of the mask pattern layer 150 and exposes the
remaining. Take FIG. 2F for example. The shielding conductive layer
140 stretches from the mold compound 130a'' along the slanting side
150s to the upper surface 150t. In this way, the shielding
conductive layer 140 covers the region of slanting side 150s where
the mold compound residues 130a'' are not attached, and the upper
surface 150t nearby. Hence, the shielding conductive layer 140
contacts the upper surface 150t and slanting side 150s of the mask
pattern layer 150 and the remaining upper surface 150t is
exposed.
Attention now is invited to FIGS. 2F and 2G After the formation of
shielding conductive layer 140, the mask pattern layer 150 is
removed to expose the second electronic components 122a and 122b
(not shown in FIG. 2G) and part of the supporting surface 110a'.
The mask pattern layer 150 may be removed by dissolving in solvent.
The solvent may be acetone or bromopropane. Although the shielding
conductive layer 140 covers the mask pattern layer 150, the upper
surface 150t of the mask pattern layer 150 is partially exposed.
Therefore the solvent is in contact with the mask pattern layer 150
and dissolves the mask pattern layer 150. In addition, the mold
compound residues 130a'' are not attached to the grounding pads
112g so as the mask pattern layer 150 is removed, the mold compound
residues 130a'' are swept as well.
Attention is now invited to FIGS. 2G and 2H. Subsequently, a cutter
C1 is used to dice the circuit board 110' to form the electronic
package module 100. To this step, the electronic package module 100
is completed as shown in FIG. 2H. In the instant embodiment, the
cutter C1 is used to dice the circuit board 110' and the dicing
method is not limited thereto. For example, laser beam can be used
to dice the circuit board 110'.
Furthermore, the circuit board 110' may be equivalent to the
circuit board 110. That is to say, the circuit board 110' shown in
FIG. 2A may be diced circuit board unit so after the removal of the
mask pattern layer 150, the electronic package module 100 is
completed without proceeding with dicing.
FIGS. 3A to 3C show cross-sectional view of the method of
manufacturing the electronic package module in accordance of
another embodiment. Attention now is invited to FIG. 3C. The
electronic package module 200 is similar to the electronic package
module 100. For example, the electronic package module 200 includes
at least one first electronic component 121a and at least one
second electronic component 122a. The difference between the
electronic package modules 100 and 200 are described herein.
As shown in FIG. 3C, the electronic package module 200 includes at
least one molding compound 230 and one circuit board 210. The first
electronic components 121a and the second electronic components
122a are mounted on the supporting surface 212a of the circuit
board 210. The difference between the electronic package modules
100 and 200 arises from that the electronic package module 200 may
not include grounding pads 112g. The cross-section of the molding
compound 230 is different from that of the molding compounds 130a
and 130b. In addition, the electronic package module 200 does not
include shielding conductive layer 140. It is worth mentioned that
in the instant embodiment, the circuit board may have grounding
pads 112g, and the grounding pad addition thereon is not limited
thereto.
The molding compound 230 has a top surface 230a, a molding compound
bottom surface 230b opposite thereto and a side 230s connecting
between the top surface 230a and the molding compound bottom
surface 230b. The molding compound bottom surface 230b is in
contact with the supporting surface 212a so the side 230s is
arranged between the top surface 230a and the supporting surface
212a. The molding compound 230 gradually shrinks from the top
surface 230a to the supporting surface 212a. Therefore the area of
the top surface 230a is larger than that of the molding compound
bottom surface 230b, and the side 230s is slanting. The included
angle A2 between the side 230s and the supporting surface 212a is
larger than 90.degree..
The method of manufacturing the electronic package module 200 is
similar to the previous embodiment (i.e. electronic package module
100). The difference between the method of manufacturing the
electronic package modules 100 and 200 is discussed herein with the
reference to FIGS. 3A to 3C. The identical features are not
repeated herein.
Attention now is invited to FIG. 3A. In the method of manufacturing
the electronic package module 200, firstly, the mask pattern layer
150 is formed on a circuit board assembly 20. The circuit board
assembly 20 includes a circuit board 210', at least one first
electronic component 121a and at least one second electronic
component 122a.
The first electronic components 121a and the second electronic
components 122a are mounted on the supporting surface 212a' of the
circuit board 210'. The mask pattern layer 150 covers the second
electronic component 122a yet not the first electronic component
121a. In addition, the mask pattern layer 150 is formed by the same
way as described previously so the slanting side 150s is also
present in FIG. 3A.
Subsequently, the molding compound 230 which encapsulates the first
electronic component 121a is formed. The molding compound 230 is
formed by the same way as the molding compounds 130a and 130b. The
mask pattern layer 150 has slanting side 150s, and the molding
compound 230 is in contact with the slanting side 150s so to form
the slanting side 230s of the molding compound 230.
Then, after the formation of the molding compound 230, the step of
dicing the molding compound 230 is omitted while the mask pattern
layer 150 is removed straightaway to expose the second electronic
component 122a. The removal of the mask pattern layer 150 is
described previously.
Attention now is invited to FIGS. 3B and 3C. The cutter C1 or laser
beam is used to dice the circuit board 210' to form the circuit
board 210. The electronic package module 200 is then completed as
shown in FIG. 3C. Additionally, the circuit board 210' may be
equivalent to the circuit board 210. That is to say, the circuit
board 210' may be an already diced circuit board unit. Thus after
the removal of the mask pattern layer 150, the electronic package
module 200 is completed without dicing the circuit board 210'. In
other words, the dicing step shown in FIG. 3B may be ignored.
In summary, the instant disclosure provides an electronic package
module including the molding compound which encapsulates at least
one electronic component thereon. The conventional electronic
package module containing photoelectric components (such as image
sensor or light emitting unit), and the others may adapt the layout
of the instant disclosure to allow partial encapsulation and
exposure to the photoelectric components. Hence, the molding
compound does not affect the photoelectric component operation and
protects the other components. The instant disclosure may cooperate
with different electronic components (for example, active or
passive components) and not limited to the aforementioned
electronic components.
The descriptions illustrated supra set forth simply the preferred
embodiments of the instant disclosure; however, the characteristics
of the instant disclosure are by no means restricted thereto. All
changes, alternations, or modifications conveniently considered by
those skilled in the art are deemed to be encompassed within the
scope of the instant disclosure delineated by the following
claims.
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