U.S. patent number 9,271,420 [Application Number 14/882,208] was granted by the patent office on 2016-02-23 for modular power device.
This patent grant is currently assigned to CHICONY POWER TECHNOLOGY CO., LTD.. The grantee listed for this patent is Chicony Power Technology Co., Ltd.. Invention is credited to Pei-Li Chang, Ping-Yu Chen, Yen-Ming Chen, Chi-Chang Ho, Yung-Hung Hsiao, Hao-Te Hsu, Chih-Hang Lee, Huei-Fang Lin, Shin-Bin Lin, Ju-Tang Lo, Yu-Hsuan Wu, Chia-Hsien Yen.
United States Patent |
9,271,420 |
Hsiao , et al. |
February 23, 2016 |
Modular power device
Abstract
A modular power device is used for mounting on a main plate. The
modular power device includes a first substrate, a driving module,
and a converting module. The first substrate has a first axial
direction and a second axial direction perpendicular to the first
axial direction. The driving module is located on one side of the
first substrate, the converting module is located on the other side
of the first substrate, and includes a second substrate parallel to
the main plate, wherein two opposite sides of the first substrate
are inserted into the main plate and the second substrate. A length
of the converting module is equal to that of the first substrate in
the first axial direction, and a width of the converting module is
smaller than a length of the first substrate in the first axial
direction.
Inventors: |
Hsiao; Yung-Hung (New Taipei,
TW), Lo; Ju-Tang (New Taipei, TW), Chen;
Yen-Ming (New Taipei, TW), Hsu; Hao-Te (New
Taipei, TW), Chang; Pei-Li (New Taipei,
TW), Yen; Chia-Hsien (New Taipei, TW), Lin;
Shin-Bin (New Taipei, TW), Wu; Yu-Hsuan (New
Taipei, TW), Lee; Chih-Hang (New Taipei,
TW), Lin; Huei-Fang (New Taipei, TW), Chen;
Ping-Yu (New Taipei, TW), Ho; Chi-Chang (New
Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
Chicony Power Technology Co., Ltd. |
New Taipei |
N/A |
TW |
|
|
Assignee: |
CHICONY POWER TECHNOLOGY CO.,
LTD. (New Taipei, TW)
|
Family
ID: |
49946392 |
Appl.
No.: |
14/882,208 |
Filed: |
October 13, 2015 |
Related U.S. Patent Documents
|
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
13647385 |
Oct 9, 2012 |
9198319 |
|
|
|
Foreign Application Priority Data
|
|
|
|
|
Jul 23, 2012 [TW] |
|
|
101126470 A |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K
7/2089 (20130101); H05K 7/2039 (20130101); H05K
7/026 (20130101); H05K 7/1432 (20130101); H05K
7/08 (20130101) |
Current International
Class: |
H05K
5/00 (20060101); H05K 7/08 (20060101); H05K
7/20 (20060101); H05K 7/02 (20060101) |
Field of
Search: |
;361/753,783,761 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Semenenko; Yuriy
Attorney, Agent or Firm: Shih; Chun-Ming HDLS IPR
Services
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATION
This application is a division of application Ser. No. 13/647,385
filed on Oct. 9, 2012, which claims priority to Taiwan Application
No. 101126470 filed Jul. 23, 2012. The entire disclosure is
incorporated herein by reference.
Claims
What is claimed is:
1. A modular power device is used for mounting on a main plate, the
modular power device comprising: a first substrate having a first
axial direction and a second axial direction perpendicular to the
first axial direction, one side of the first substrate inserted
into the main plate, such that the second axial direction is
perpendicular to the main plate; a driving module placed on one
side of the first substrate and electrically connected to the first
substrate; and a converting module located on the other side of the
first substrate and electrically connected to the driving module;
the converting module comprising: a second substrate parallel to
the main plate and the other side of the first substrate being
inserted into the second substrate; a converting unit placed on the
second substrate and electrically connected to the second
substrate; a controlling unit placed on the second substrate and
electrically connected to the second substrate; and an outputting
unit placed on the second substrate and electrically connected to
the second substrate; wherein a length of the converting module is
substantially equal to that of the first substrate in the first
axial, and a width of the converting module is smaller than a
length of first axial direction of the first substrate.
2. The modular power device in claim 1, further comprising a first
connecting post inserted into the second substrate and the main
plate for electrically connecting the second substrate and the main
plate.
3. The modular power device in claim 2, further comprising: an
electric layer attached to the second substrate and electrically
connected to the outputting unit; at least one second pillar
located between the second substrate and the main plate; and a
connecting component for connecting the conductive layer and the
second connecting post.
4. The modular power device in claim 1, further comprising: a first
isolating and thermal-dissipating board disposed at one side of the
first substrate; a second isolating and thermal-dissipating board
disposed at the other side of the first substrate; and a plurality
of fixing components penetrating the first isolating and
thermal-dissipating board and fastened on the second isolating and
thermal-dissipating board.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a power device. More particularly,
the present invention relates to a modular power device.
2. Description of Prior Art
Power supply devices are the essential components of industrial
equipment, and are used for converting alternating current (AC)
electric power into direct current (DC) electric power or providing
functions of bucking or boosting. A conventional power supply
device includes a flat circuit board, at least one converter and a
plurality of electrical components. The converter and the
electrical components are individually placed on the circuit board
and electrically connected to thereto via traces formed on the
circuit board.
While the demanded functions of industrial equipment increased, the
internal devices which are disposed within the industrial equipment
are increased accordingly. In order to sufficiently driving the
internal devices, the output power of the power supply device must
be increased simultaneously. When the outputting power of the power
supply device is increased, the tolerance (such as rated working
voltage) of the converter and the electronic components may also be
increased. The volume of part of electronic component, such as
capacitor, is direct proportion to the rated working voltage,
namely, the larger rated working voltage and the greater volume.
While the electronic components with greater volume are placed on
the circuit board, will occupy a lot of space in the circuit board,
this becomes the main reason of the high power supply system cannot
miniaturization.
SUMMARY OF THE INVENTION
It is an object to provide a modular power device with small
volume.
It is another object to provide a power system with the modular
power device mentioned above.
According to one aspect of the present invention is used for
mounted on a main plate. The module power device comprises a first
substrate, a driving module and a converting module. The first
substrate has a first axial direction and a second axial direction
substantially perpendicular to the first axial direction. The first
substrate is inserted into the main plate, such that the second
axial direction of the first substrate is perpendicular to the main
plate. The driving module is placed on one side of the first
substrate and electrically connected to the first substrate. The
converting module is located on the other side of the first
substrate and electrically connected to the driving module. A
length of the converting module is substantially equal to that of
the first substrate in the first axial direction, and a width of
the converting module is smaller than a length of the first
substrate in the first axial direction. The converting module
comprises a second substrate, a converting unit, a controlling
unit, and an output unit. The second substrate is parallel to the
main plate and the other side of the first substrate is inserted
into the second substrate. The converting unit is placed on the
second substrate and is electrically connected to the second
substrate. The controlling unit is placed on the second substrate
and is electrically connected to the second substrate. The
outputting unit is placed on the second substrate and is
electrically connected to the second substrate.
In the present invention, the first substrate of the modular power
device is directly inserted into the main plate and substantially
perpendicular to the main plate. The driving module and the
converting module are respectively located at two side of the first
substrate, and the driving module is directly is placed on first
substrate. Thereby, the volume of the modular power device can be
substantially reduced, and prevent outputting electric power by
interference from inputting electric power. Besides, the route for
transmitting current is also reduced.
BRIEF DESCRIPTION OF DRAWING
The features of the invention believed to be novel are set fourth
with particularity in the appended claims. The invention itself
however may be best understood by reference to the following
detailed description of the invention, which describes certain
exemplary embodiments of the invention, taken in conjunction with
the accompanying drawings in which:
FIG. 1 is a perspective view of a modular power device according to
a first embodiment of the present invention.
FIG. 2 is a perspective view of a modular power device and a main
plate according to a first embodiment of the present invention.
FIG. 3 is an assemble view of the modular power device and the main
board according to the first embodiment of the present
invention.
FIG. 4 is a perspective view of a power system according to a first
embodiment of the present invention.
FIG. 5 is a perspective view of a modular power device according to
a second embodiment of the present invention.
FIG. 6 is a perspective view of a modular power device and a main
plate according to a second embodiment of the present
invention.
FIG. 7 is an assemble view of the modular power device and the main
plate according to the second embodiment of the present
invention.
FIG. 8 is a perspective view of a modular power device according to
a third embodiment of the present invention.
FIG. 9 is a perspective view of a modular power module and a main
plate according to the third embodiment of the present
invention.
FIG. 10 is a perspective view of a modular power module according
to a fourth embodiment of the present invention.
FIG. 11 is a perspective view of a modular power device and a main
plate according to the fourth embodiment of the present
invention.
FIG. 12 is a perspective view of a power system according to a
second embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of the present invention will be described
with reference to the drawings.
Referring to FIG. 1 to FIG. 3, FIG. 1 is a perspective view of a
modular power device according to a first embodiment of the present
invention, FIG. 2 is a perspective view of a modular power module
and a main plate according to a first embodiment of the present
invention, and FIG. 3 is an assemble view of the module power
device and the main plate according to the first embodiment of the
present invention. The modular power device 1 is used for mounting
on a main plate 50. The main plate 50 has a plurality of grooves 52
for the modular power device 1 to be inserted therein. The main
plate 50 may be a printed circuit board (PCB) or a substrate
provided with conductive traces (not shown), and the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the main plate 50 may also be combined PCB
with copper slice or other material with good electrical
conductivity.
The modular power device 1 includes a first substrate 10, a driving
module 20 and a converting module 30. The driving module 20 is
placed on one side of the first substrate 10 and electrically
connected to the first substrate 10. The converting module 30 is
located on the other side of the first substrate 10 and
electrically connected to the driving module 20.
The first substrate 10 is a PCB or a substrate provided with
conductive traces (not shown). In more particular, the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the first substrate 10 may also be combined
PCB with copper slice or other material with good electrical
conductivity.
The first substrate 10 has a first axial direction A1 and a second
axial direction A2 substantially perpendicular to the first axial
direction A1. In this embodiment, the first axial direction A1 is
lengthwise direction of the first substrate 10, and the second
axial direction A2 is widthwise direction of the first substrate
10. The first substrate 10 is inserted into the main plate 50, such
that the second axial direction A2 of the first substrate 10 is
substantially perpendicular to a board 54 of the main plate 50. An
end of the first substrate 10 has at least one pillar 102. The
first substrate 10 can include one or more pillars 102. As
non-limiting examples, the first substrate 10 includes two pillars
102. The pillars 102 are inserted into the grooves 52, such that
the first substrate 10 is substantially perpendicular to the main
plate 50 and electrically connected thereto.
The driving module 20 is directly placed on the first substrate 10
and electrically connected thereto for receiving electric power
inputting to the modular power device 10 and driving the modular
power device 10. The driving module 20 includes at least one
converter 200, at least one switching component 202 and a plurality
of active or passive components 204. The driving module 20 can
include one or more converters 200 and switch components 202,
respectively. As a non-limiting example, the driving module 20 of
the modular power device 1 includes two converters 200 and four
switch components 202. In preferably, each switch component 202 is
metal-oxide-semiconductor field-effect transistor (MOSFET). The
converters 200, the switching components 202 and the active or
passive components 204 collectively construct a driving
circuit.
The converting module 30 receives voltage source outputted by the
driving module 20 and provides a function of voltage converting for
reducing voltage value of the voltage source. A length of the
converting module 30 is substantially equal to that of the first
substrate 10 in the first axial direction A1, and a width of the
converting module 30 is smaller than a length of first substrate 10
in the first axial direction A1.
The converting module 30 includes a second substrate 300, a third
substrate 310, a fourth substrate 320, a converting unit 330, a
controlling unit 340, a signal-transmitting unit 350, an outputting
unit 360, a first connector 370, a second connector 380, a third
connector 390 and a fourth connector 400.
The converting unit 330 is placed on a board of the first substrate
10 (which is opposite to where the driving module 20 is disposed)
and is used for receiving the electric power outputted by the
driving module 20. The converting unit 330 includes at least one
converter 332 and multiple active or passive components (not shown)
for collectively constructing a power modulating circuit.
The first connector 370 is mounted on the first substrate 10 which
is the same side where the converting module 330 is placed, and
electrically connected to the first substrate 10.
The second substrate 300 may be a PCB or a substrate provided with
conductive traces (not shown). In more particular, the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the second substrate 300 may also be
combined PCB with copper slice or other material with good
electrical conductivity. In preferably, the second substrate 300 is
multi-layer (more than or equal to two layers) circuit board. The
second substrate 300 is inserted into the main plate 50 and
electrically connected thereto, such that the second substrate 300
is parallel to the first substrate 10. In addition, one end of the
second substrate 300 has at least one pillar 302. The second
substrate 300 can include one or more pillars 302. As a
non-limiting example, the second substrate 300 includes two pillars
302. The pillars 302 are inserted into the grooves 52, such that
the second substrate 300 is perpendicular to the main plate 50 and
electrically connected thereto.
The controlling unit 340 is placed on the second substrate 300 and
electrically connected thereto. The controlling unit 340 includes a
plurality of controlling components 342, which can be active or
passive components, for collectively constructing a circuit with
controllable function. However, the controlling components 342 can
be an integrated circuit (IC) with function of control.
The second connector 380 is mounted on the second substrate 300 and
electrically connected to the controlling unit 340. In this
embodiment, the second connector 380 is mounted on a lateral side
of the second substrate 300 which is faced to where the first
substrate 10 is disposed.
The third substrate 310 may be a PCB or a substrate provided with
conductive traces (not shown). In more particular, the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the third substrate 310 may also be combined
PCB with copper slice or other material with good electrical
conductivity. The third substrate 310 is disposed between the first
substrate 10 and the second substrate 300, and is parallel to the
first substrate 10. The signal-transmitting unit 350 including a
plurality of electronic components 352 for constructing a
signal-transmitting circuit is placed on the third substrate 310
and electrically connected thereto.
The third connector 390 is mounted on the third substrate 310 and
electrically connected thereto. The third connector 390 is
assembled with the first connector 370, such that the
signal-transmitting unit 350 is electrically connected to
converting unit 330.
The fourth connector 400 is mounted on the third substrate 310 and
electrically connected thereto. The fourth connector 400 is
assembled with the second connector 380, such that the
signal-transmitting unit 359 is electrically connected to the
controlling unit 340.
The fourth substrate 320 may be a PCB or a substrate provided with
conductive traces (not shown. In more particular, the substrate
mentioned above may be copper substrate, aluminum substrate,
ceramic substrate or other substrate with good thermal
conductivity. However, the fourth substrate 320 may also be
combined PCB with copper slice or other material with good
electrical conductivity. The fourth substrate 320 is disposed at
one side of the second substrate 300 which is opposite to where the
third substrate 310 is disposed, and is substantially parallel to
the second substrate 300. The fourth substrate 320 is inserted into
the main plate 50 and electrically connected thereto. One end of
the fourth substrate 320 includes at least one pillar 322.
The fourth substrate 320 can includes one or more pillars 322. As a
non-limiting example, the fourth substrate 320 includes three
pillars 322. The pillars 322 are inserted into the grooves 52, such
that the fourth substrate 320 is perpendicular to the main plate 50
and electrically connected thereto.
The outputting unit 360 including at least one inductor 362 and at
least one capacitor 364 is placed on the fourth substrate 320 and
electrically connected thereto. The outputting unit 360 can
includes one or more inductors 362 and capacitors 364,
respectively. As non-limiting example, the outputting unit 360
includes two inductors 362 and two capacitors 364. The inductors
362 and the capacitors 364 are collectively constructing a
.pi.-type filter for stabilizing outputting current and reducing
outputting noise.
In the practical application, the user can adjust the
specifications (such as rated working voltage) of the driving
module 20, the converting unit 330, the controlling unit 340, the
signal-transmitting unit 350 and the outputting unit 360 according
to demanded outputting power, and the user can respectively insert
the first substrate 10, the second substrate 300, the third
substrate 310 and the fourth substrate 320 (where the driving
module 20, the converting unit 330, the controlling unit 340, the
signal-transmitting unit 350 and the outputting unit 360 is
disposed) into the main plate 50 and electrically connected to the
main plate 50, and then assemble the first connector 370 and the
second connector 380 with the third connector 390 and the fourth
connector 400, respectively, such that the converting unit 330 can
electrically connect to the controlling unit 340 via the
signal-transmitting unit 350. Therefore, the electric power
inputting from the modular power device 1 can be converted into a
demanded electric power, and outputted from the outputting unit
360. For this result, the modular power device 1 has advantages of
easily fabricating and easily modulating specifications.
To sum up, the modular power device 1 has advantage of small
volume, and the arrangement of the modular power device 1 can
effectively isolate the outputting unit 360 from the converting
unit 330, so as to reduce outputting power by interference from
inputting power, and then stabilize outputting electric power.
Besides, the space formed between each two substrate allows air
flowing therethrough, such that the heat dissipating effect can be
enhanced.
Reference is made to FIG. 4, which is a perspective view of a power
system according to a first embodiment of the present invention.
The power system includes a main plate 50 and a plurality of
modular power devices 1 mentioned above. The modular power devices
1 are mounted on the main plate 50 and electrically connected
thereto. In this embodiment, the power system includes, for
example, two modular power devices 1, and the modular power devices
1 electrically connected in parallel are arranged in an alignment
manner.
Therefore, when the power system is operated with light load, only
one modular power device 1 is activated for reducing outputting
electric power. When the power system is operated with heavy load,
a plurality of modular power devices 1 are activated to increase
outputting electric power. In addition, when activate more modular
power devices 1, the controlling units 340 of the modular power
devices 1 can collectively construct the function of phase-shift,
such that the effect of power system can be enhanced, and the
outputting ripple current is reduced. For this result, the power
system can achieve optimal efficiency wherever operating with light
load or heavy load, and prevent the problem of pool efficiency of
high power system as operating with light load.
Referring to FIG. 5 to FIG. 7, FIG. 5 is a perspective view of a
modular power device according to a second embodiment of the
present invention, FIG. 6 is a perspective view of a modular power
device and a main plate according to a second embodiment of the
present invention, and FIG. 7 is an assemble view of the modular
power device and the main plate according to the second embodiment
of the present invention. The modular power device 1a is similar to
the modular power device 1 mentioned above, and the same reference
numbers are used in the drawings and the description to refer to
the same parts.
The modular power device 1a further includes an intermediate plate
40. The intermediate plate 40 may be a PCB or a substrate provided
with conductive traces (not shown). In more particular, the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the intermediate plate 40 may also be
combined PCB with copper slice or other material with good thermal
conductivity. A plurality of accommodating slots 41 are formed on
the intermediate plate 40.
In addition, one end the second substrate 300a which is opposite to
where the pillars 302 are formed has at least one rib 304. The
second substrate 300a can includes one or more ribs 304. As
non-limited example, the second substrate 300a includes four ribs
304. The ribs 304 are inserted into the accommodating slots 41
formed on the intermediate plate 40, such that the second substrate
300a is substantially perpendicular to the intermediate plate 40
and electrically connected thereto.
One end of the fourth substrate 320a which is opposite to where the
pillars 322 are formed has at least one rib 324. The fourth
substrate 320a can includes one or more ribs 324. As non-limiting
example, the fourth substrate 320a includes four ribs 324. The ribs
324 are inserted into the accommodating slots 41, such that the
fourth substrate 320a is substantially perpendicular to the
intermediate plate 320a and electrically connected thereto.
Each converter 332a of the converting unit 330a has at least one
protrusion 3322a. The converter can include one or more protrusions
3322a. As non-limiting example, each converter 330a includes two
protrusions 3322a. The protrusions 3322a are inserted into the
accommodating slots 41 of the intermediate plate 40, and then
electrically connect the intermediate plate 40 and the converting
unit 330a.
Thereby, the controlling unit 340 placed on the second substrate
300a and the outputting unit 360 placed on the fourth substrate
320a are electrically connected to the converting unit 330a and the
driving module 20 via the main plate 50 and the intermediate plate
40. Preferably, the potentials transmitted by the main plate 50 and
the intermediate plate 40 are different in level.
The function and relative description of other components of the
module power device 1a is the same as that of first embodiment
mentioned above and are not repeated here, and the modular power
device 1a can fulfill the functions as the modular power device 1
does.
Besides, a power system may be constructed by the main plate 50 and
a plurality of modular power devices 1a. The arrangement of the
modular power devices 1a is the same as the modular power devices 1
mentioned above and its description is not repeated here.
Referring to FIG. 8 and FIG. 9, FIG. 8 is respectively a
perspective view of a modular power device according to a third
embodiment of the present invention, and FIG. 9 is an assemble view
of a modular power device according to the third embodiment of the
present invention. The modular power device 1b is similar to the
modular power device 1a mentioned above, and the same reference
numbers are used in the drawings and the description to refer to
the same parts.
It should be noted that the second substrate 300b is a multi-layer
circuit board and a plurality of engaging slots 306b are formed
thereon for disposing a plurality of electric layers 308a therein.
Preferably, a plurality of engaging parts 307b are respectively
formed on a wall of each engaging slot 306b for fastening each
electric layer 308b. Each electric layer 308b is made of capper or
other material with good electrical conductivity and used as
current transmitting routes.
The intermediate plate 40b includes a multi-layer circuit board
400b, a first metallic layer 402b and the second metallic layer
404b. Multiple through holes 401b are formed on the multi-layer
circuit board 400b. The first metallic layer 402b and the second
metallic layer 404b are made of copper or other material with good
electrical conductivity and used as current transmitting
routes.
The first metallic layer 402b is attached to a lower surface of the
multi-layer circuit board 400b, and a plurality of first holes 403b
corresponding to the through holes 401b are formed thereon. The
second metallic layer 404b is attached to an upper surface of the
multi-layer circuit board 400b, and a plurality of second holes
405b corresponding to the through holes 401b are formed
thereon.
The protrusions 3322a of the converters 332a and the ribs 304b of
the second substrate 300b are inserted into the through holes 401b,
the first holes 403b and the second holes 405b, and electrically
connected to the intermediate plate 40b.
The fourth substrate 320a includes a flat part 322b and a bent part
324b. The flat part 322b is parallel to the first substrate 10 and
has a plurality of pillars 323b for inserting into the main plate
50, such that the firth substrate 320b is electrically connected to
the main plate 50. The bent part 324b is substantially
perpendicular to the flat part 322b and a plurality of openings
325b are formed thereon. A plurality of pins 363b of each inductor
362b of outputting unit 360b are inserted into the openings 325b of
the fourth substrate 320b, the through holes 401b of the
intermediate plate 40b, the first holes 403b and the second holes
405b, such that the fourth substrate 320b is electrically connected
to the intermediate plate 40b.
The modular power device 1b further comprises a carrier 42, a first
isolating and thermal-dissipating board 44, a second isolating and
thermal-dissipating board 46, a plurality of fixing component 48
and a fifth substrate 49. The carrier 42 includes a first board
420, a second board 422, a connecting part 424 and a shoulder-part
426. The first board 420 is disposed adjacent to the first
substrate 10, and the second board 422 is disposed adjacent to the
second substrate 300b. In his embodiment, the first board 420 and
the second board 422 are of rectangular shape, a length of the
second board 422 is substantially equal to that of the first board
420, and a width of the second board 422 is smaller than that of
the first board 420. The connecting part 424 is located at one end
of the first board 420 and the second board 422 and connected
thereof. The first board 420, the second board 422 and the
connecting part 424 collectively construct an accommodating space
425 for accommodating the converter 332a of the converting unit
330a, so as to prevent the converters 332a from electromagnetic
interference produced by the converters 200 of the driving module
20. The connecting part 424 further includes a plurality of
supporting components 427 for inserting into the main plate 50. The
shoulder-part 426 is disposed on one end of the first board 420,
which is opposite to where the connecting part 424 is disposed, and
extending toward a direction where the first substrate 10 is
disposed for disposing the carrier 42 on the first substrate 10.
The first isolating and thermal-dissipating board 44 is disposed in
one side of the first substrate 10, the second isolating and
thermal-dissipating board 46 is disposed on the other side of the
first substrate 10. The fixing component 48 penetrates the first
isolating and thermal-dissipating board 44 and is fastened on the
second isolating and thermal-dissipating board 46 so as to provide
electromagnetic isolating effect and thermal-dissipating
effect.
The fifth substrate 49 is disposed at one side of the second
substrate 300b which is opposite to where the first substrate 10 is
disposed. The fifth substrate 49 is a PCB or a substrate provided
with conductive traces (not shown). In more particular, the
substrate mentioned above may be copper substrate, aluminum
substrate, ceramic substrate or other substrate with good thermal
conductivity. However, the fifth substrate 49 may also be combined
PCB with copper slice or other material with good thermal
conductivity. Preferably, the fifth substrate 49 is multi-layer
(more than or equal to two layers) circuit board. At least one
pillar 490 is formed at one end of the fifth substrate 49. The
fifth substrate 49 can include one or more pillars 490. As
non-limiting example, the fifth substrate 49 includes two pillars
490. The pillars 490 are inserted into the intermediate plate 40b
and electrically connected thereto. At least one rib 494 formed on
the other end of the fifth substrate 49 is inserted into the main
plate 50 and electrically connected to the main plate 50.
The fifth substrate 49 further includes at least one electric layer
492 for functioning as routes of current transmitting. The
controlling unit 340 is simultaneously disposed on the second
substrate 300b and the fifth substrate 49 and electrically
connected thereto. For this result, the controlling elements of the
controlling unit 340 can disposed with intervals for enhancing the
effect of thermal-dissipation.
The function and relative description of other components of the
module power device 1b is the same as that of second embodiment
mentioned above and are not repeated here, and the modular power
device 1b can fulfill the functions as the modular power device 1a
does.
Besides, a power system may be constructed by the main plate 50 and
a plurality of modular power devices 1b. The arrangement of the
modular power devices 1b is the same as the modular power devices 1
mentioned above and the description thereof is not repeated
here.
Referring to FIG. 10 and FIG. 11, FIG. 9 is a perspective view of a
modular power device and main plate according to a fourth
embodiment of the present invention, and FIG. 10 is an assemble
view of a modular power device and main plate according to the
fourth embodiment of the present invention. The modular power
device 6 is used for mounting on a main plate 50. The main plate 50
has a plurality of grooves 52 through which the modular power
device 6 is inserted therein. The main plate 50 may be a printed
circuit board (PCB) or a substrate provided with conductive traces
(not shown), and the substrate mentioned above may be copper
substrate, aluminum substrate, ceramic substrate or other substrate
with good thermal conductivity. However, the main plate 50 may also
be combined PCB with copper slice or other material with good
electrical conductivity.
The modular power device 6 includes a first substrate 60, a driving
module 70 and a converting module 80. The converting module 70 is
placed on one side of the first substrate 60 and electrically
connected the first substrate 60. The converting module 80 is
located at the other side of the first substrate 60, and
electrically connected to the driving module 70.
The first substrate 60 may be a (PCB) or a substrate provided with
conductive traces (not shown), and the substrate mentioned above
may be copper substrate, aluminum substrate, ceramic substrate or
other substrate with good thermal conductivity. However, the first
substrate 60 may also be combined PCB with copper slice or other
material with good thermal conductivity. The first substrate 60 has
a first axial direction A1 and a second axial direction A2
substantially perpendicular to the first axial direction A1. In
this embodiment, the first axial direction A1 is lengthwise
direction of the first substrate 60, and the second axial direction
A2 is widthwise direction of the first substrate 60. The first
substrate 60 is inserted into the main plate 50, such that the
second axial direction A2 of the first substrate 60 is
substantially perpendicular to a board 54 of the main plate 50. An
end of the first substrate 60 has at least one pillar 602. The
first substrate 60 can include one or more pillars 602. As
non-limiting examples, the first substrate 60 includes two pillars
602. The pillars 602 are inserted into the grooves 52, such that
the first substrate 60 is substantially perpendicular to the main
plate 50 and electrically connected thereto.
The driving module 70 is directly placed on the first substrate 60
and electrically connected thereto. The driving module 70 receives
electric power inputting to the modular power device 6 and drives
thereof. The driving module 70 includes at least one converter 700,
at least one switch 702 and a plurality of active and passive
components 704. The driving module 70 can include one or more
converters 700 and switch components 702, respectively. As a
non-limiting example, the driving module 70 includes two converters
700 and four switches 702, and each switch 702 is MOSFET. The
converters 700, the switches 702 and the active or passive
components 704 collectively construct a driving circuit.
The converting module 80 receives voltage source passing through
the driving module 70 and provides the function of voltage
converting so as to reduce the voltage value of the voltage source.
A length of the converting module 80 is substantially equal to that
of the first substrate 60 in the first axial direction A1, and a
width of the converting module is smaller than a length of the
first substrate 60 in the first axial direction A1.
The converting module 80 includes a second substrate 800, at least
one conductive layer 810, a converting unit 830, a controlling unit
840, an outputting unit 860, a first connecting post 870, two
second connecting posts 880 and an electric layer 890.
The second substrate 800 is disposed opposite to the main plate 50.
The second substrate 800 may be a PCB or a substrate provided with
conductive traces (not shown), and the substrate mentioned above
may be copper substrate, aluminum substrate, ceramic substrate or
other substrate with good thermal conductivity. However, the second
substrate 800 may also be combined PCB with copper slice or other
material with good thermal conductivity. Preferably, the second
substrate 800 is multi-layer (more than or equal to two layers)
circuit board.
The conductive layer 810 is made of copper of other material with
good electrical conductivity. The conductive layer 810 is attached
to the second substrate 800 for functioning as route of current
transmission. Preferably, a containing slot (not shown) is formed
on the second substrate 800 for containing the conductive layer 810
and fastening the conductive layer 810.
The converting unit 830, the controlling unit 840 and the
outputting unit 860 are placed on the second substrate 800 and
electrically connected thereto. The converting unit 830 receives
the power outputted by the driving module 70 and converts the
outputted power into a demand voltage value. The converting unit
830 includes at least one converter 832 and a plurality of action
or passive components (not shown). The converter 832 and the active
or passive components collectively construct a voltage-converting
circuit.
The controlling unit 840 is used for controlling the operating
state of the modular power device 6. The controlling unit 840
includes multiple controlling components for constructing a
controlling circuit. However, the controlling unit 840 may be a
integrate circuit (IC) with controlling function. The outputting
unit 860 includes at least one inductor 862 and at least one
capacitor 864. The outputting unit 860 can include one or more
inductors 862 and capacitors 864, respectively. As non-limiting
example, the outputting unit 860 includes two inductors 862 and
four capacitors 864. The inductors 862 and the capacitor 864
collectively construct a .pi.-type filter for stabilizing
outputting current and reducing outputting noise.
The first connecting post 870 is located between the main plate 50
and the second substrate 800, and inserted into the grooves 52 of
the main plate 50 and the through hole 801 of the second substrate
800, and electrically connected to the main plate 50 and the second
substrate 800.
The electric layer 980 is made of copper of other material with
good electrical conductivity. The electric layer 810 is attached to
the second substrate 800 for providing connective path between the
outputting unit 860 and the second substrate 800, and then current
can flow between the outputting unit 860 and the second substrate
800. A plurality of buckles 891 are formed on the electric layer
980, the buckles 891 are locked on a plurality of positioning slots
802 formed on the second substrate 800 for achieving the effect of
position and enhancing the connecting strength of the electric
layer 890 and the second substrate 800. In this embodiment, the
electric layer 890 is of T-shape. In the practical application, the
profile of the electric layer 890 may be adjusted by demand.
The electric layer 890 is connected to each second post 880 through
at least one connecting component 892. The connecting component 892
is preferably rivet for riveting the electric layer 890 to one end
of each second connecting post 880, such that current can transmit
between the electric layer 890 and the second connecting posts 880.
The other end of each second connecting post 880 is inserted into
the groove 52 of the main plate 50 and electrically connected to
the main plate 50, such that electric power can transmit between
the main plate 50 and the second substrate 800 via second
connecting posts 880. Preferably, the potentials transmitted by the
second connecting posts 880 and the first connecting post 870 are
different in level.
The modular power device 6 further comprises a first isolating and
thermal-dissipating board 94, a second isolating and
thermal-dissipating board 96 and a plurality of fixing components
98. The first isolating and thermal-dissipating board 94 is
disposed in one side of the first substrate 60, the second
isolating and thermal-dissipating board 96 is disposed on the other
side of the first substrate 60. The fixing components 98 penetrate
the first isolating and thermal-dissipating board 94 and fastened
on the second isolating and thermal-dissipating board 96 so as to
provide electromagnetic isolating and thermal-dissipating
effect.
To sun up, the modular power device 6 has advantage of small volume
and air can flow therein to enhance heat dissipating effect.
In the practical application, the user can adjust the
specifications (such as rated working voltage) of the driving
module 70, the converting unit 830, the controlling unit 840 and
the outputting unit 860 according to demanded outputting power.
Therefore, the electric power inputting from the modular power
device 6 can be converted into a demanded electric power, and
output from the outputting unit 860. For this result, the modular
power device 6 has advantages of easily fabricating and easily
modulating specifications.
Reference is made to FIG. 12, which is a perspective view of a
power system according to a second embodiment of the present
invention. The power system includes a main plate 50 and a
plurality of modular power devices 6 mentioned above. The modular
power devices 6 are mounted on the main plate 50 and electrically
connected thereto. In this embodiment, the power system includes,
for example, two modular power devices 6, and the modular power
devices 6 electrically connected in parallel are mounted on the
main plate 50 in an alignment manner.
Therefore, when the power system is operated with light load, only
one modular power device 6 is activated for reducing outputting
electric power. When the power system is operated with heavy load,
a plurality of modular power devices 6 are activated to increase
outputting electric power. In addition, when activate more modular
power devices 6, the controlling units 840 of the modular power
device 6 can collectively construct the function of phase-shift,
such that the effect of power system can be enhanced, and the
outputting current ripple can be reduced. For this result, the
power system can achieve optimal efficiency wherever operating with
light load or heavy load, and prevent the problem of pool
efficiency of high power system as operating with light load.
Although the present invention has been described with reference to
the foregoing preferred embodiment, it will be understood that the
invention is not limited to the details thereof. Various equivalent
variations and modifications can still occur to those skilled in
this art in view of the teachings of the present invention. Thus,
all such variations and equivalent modifications are also embraced
within the scope of the invention as defined in the appended
claims.
* * * * *