U.S. patent number 9,271,418 [Application Number 14/009,166] was granted by the patent office on 2016-02-23 for electronic module.
This patent grant is currently assigned to Robert Bosch GmbH. The grantee listed for this patent is Benjamin Bertsch, Holger Braun, Helmut Bubeck, Matthias Lausmann, Thomas Mueller, Ralf Schinzel, Klaus Voigtlaender. Invention is credited to Benjamin Bertsch, Holger Braun, Helmut Bubeck, Matthias Lausmann, Thomas Mueller, Ralf Schinzel, Klaus Voigtlaender.
United States Patent |
9,271,418 |
Braun , et al. |
February 23, 2016 |
Electronic module
Abstract
The invention relates to an electronic module comprising at
least one electronic or electric component (3), a base plate (4),
and a support plate (2), in particular a printed circuit board or a
substrate. Said support plate (2) is arranged on the base plate (4)
and comprises conductor paths. Said base plate (4) comprises a
blind hole-type recess (5) on a side oriented towards the support
plate (2). The component (3) is in contact on the support plate (2)
and is arranged in the recess (5) of the base plate (4).
Inventors: |
Braun; Holger (Stuttgart,
DE), Bubeck; Helmut (Beilstein, DE),
Lausmann; Matthias (Murr, DE), Schinzel; Ralf
(Marbach am Neckar, DE), Voigtlaender; Klaus (Wangen,
DE), Mueller; Thomas (Leonberg, DE),
Bertsch; Benjamin (Lichtenstein, DE) |
Applicant: |
Name |
City |
State |
Country |
Type |
Braun; Holger
Bubeck; Helmut
Lausmann; Matthias
Schinzel; Ralf
Voigtlaender; Klaus
Mueller; Thomas
Bertsch; Benjamin |
Stuttgart
Beilstein
Murr
Marbach am Neckar
Wangen
Leonberg
Lichtenstein |
N/A
N/A
N/A
N/A
N/A
N/A
N/A |
DE
DE
DE
DE
DE
DE
DE |
|
|
Assignee: |
Robert Bosch GmbH (Stuttgart,
DE)
|
Family
ID: |
45922646 |
Appl.
No.: |
14/009,166 |
Filed: |
February 29, 2012 |
PCT
Filed: |
February 29, 2012 |
PCT No.: |
PCT/EP2012/053420 |
371(c)(1),(2),(4) Date: |
October 01, 2013 |
PCT
Pub. No.: |
WO2012/130548 |
PCT
Pub. Date: |
October 04, 2012 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20140240927 A1 |
Aug 28, 2014 |
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Foreign Application Priority Data
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|
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Apr 1, 2011 [DE] |
|
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10 2011 006 632 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K
1/182 (20130101); F16H 61/0006 (20130101); H05K
7/20509 (20130101); H05K 7/06 (20130101); H05K
5/0082 (20130101); H05K 1/0203 (20130101); H05K
7/2039 (20130101); H05K 3/0061 (20130101); H05K
1/021 (20130101); H05K 1/0233 (20130101); B60Y
2400/30 (20130101); H05K 2201/10151 (20130101) |
Current International
Class: |
H05K
7/06 (20060101); H05K 7/20 (20060101); H05K
1/02 (20060101); F16H 61/00 (20060101); H05K
5/00 (20060101); H05K 3/00 (20060101); H05K
1/18 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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3326629 |
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Jan 1985 |
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19839843 |
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Mar 2000 |
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DE |
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19907949 |
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Sep 2000 |
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DE |
|
10051945 |
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Nov 2001 |
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DE |
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102004053958 |
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Sep 2005 |
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DE |
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102005002813 |
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Aug 2006 |
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DE |
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102006001890 |
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Aug 2007 |
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DE |
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102010025591 |
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Dec 2011 |
|
DE |
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1239710 |
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Sep 2002 |
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EP |
|
H04251969 |
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Sep 1992 |
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JP |
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H08148646 |
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Jun 1996 |
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JP |
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2001257306 |
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Sep 2001 |
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JP |
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2002026481 |
|
Jan 2002 |
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JP |
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2008000551 |
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Jan 2008 |
|
WO |
|
Other References
International Search Report for Application No. PCT/EP2012/053420
dated Jun. 5, 2012 (2 pages). cited by applicant.
|
Primary Examiner: Hoffberg; Robert J
Attorney, Agent or Firm: Michael Best & Friedrich
LLP
Claims
The invention claimed is:
1. An electronic module, comprising: at least one electronic or
electric component (3), a base plate (4) and a support plate (2),
said support plate (2) being arranged on the base plate (4) and
comprising conductor paths, wherein said base plate (4) comprises a
blind hole-type recess (5) on a side oriented towards the support
plate (2), wherein the at least one electronic or electric
component (3) is mounted on the support plate (2) and is arranged
in the recess (5) of the base plate (4), and wherein the support
plate (2) comprises a base area (20) and at least one connection
element (21), which is integrally formed with the base area (20)
and is positioned at a non-zero angle (.alpha.) to said base area
(20), a sensor (6) being arranged in the at least one connection
element (21).
2. The electronic module according to claim 1, characterized in
that at least one sensor (6, 8) is arranged on a side of the
support plate (2) facing away from the base plate (4).
3. The electronic module according to claim 1, characterized in
that the at least one electronic or electric component (3) is an
interference suppression component.
4. The electronic module according to claim 3, characterized in
that the interference suppression component is arranged on the
support plate (2) facing the base plate (4) in proximity of a
component in which interference is to be suppressed.
5. The electronic module according to claim 1, characterized in
that the at least one electronic or electric component (3) is a HDI
printed circuit board.
6. The electronic module according to claim 1, characterized in
that a cavity (5a) of the recess (5) is completely or partially
filled with a sealing compound.
7. The electronic module according to claim 1, characterized in
that the base plate (4) is embodied as a cooling plate.
8. The electronic module according to claim 1, characterized in
that the at least one electronic or electric component (3) arranged
in the recess (5) is fixedly bonded in said recess (5) by means of
an adhesive.
9. The electronic module according to claim 1, further comprising a
reinforcing element (7) which supports the connection element
(21).
10. The electronic module according to claim 1, characterized in
that the support plate (2) is a printed circuit board or a
substrate.
11. The electronic module according to claim 1, characterized in
that the base plate (4) is embodied as a cooling plate made from
aluminum.
12. The electronic module according to claim 1, characterized in
that a cavity (5a) of the recess (5) is completely or partially
filled with a sealing compound which has a very good thermal
conductivity.
Description
BACKGROUND OF THE INVENTION
The present invention relates to an electronic module and in
particular to a transmission control module for motor vehicles.
In the prior art, a plurality of sensors is required at multiple
locations, for example, in the case of transmission control systems
in order to acquire different signals, as, e.g., temperature,
pressure and rotational speed. Feed lines to said sensors consist,
for example, of flex foils or cables and are connected to the
transmission controller which typically comprises a small printed
circuit board. As a result, a very large assembly outlay is
incurred and the necessary connections between sensors and printed
circuit board are relatively expensive. In addition, a large number
of procedural steps, as, e.g., bonding, soldering, welding or
adhesive bonding, are required. It would therefore be desirable to
provide a cost effective electronic module which particularly can
be used in transmission control systems of motor vehicles.
SUMMARY OF THE INVENTION
The inventive electronic module has in contrast the advantage that
a cost effective and simply designed module can be produced, which
in particular makes a modular design for applications in different
motor vehicles possible. In addition, an overall construction
height of the module can be reduced in accordance with the
invention. This is achieved according to the invention by virtue of
the fact that the electronic module comprises a base plate and a
support plate, on which support plate an electronic or electric
component is arranged. The support plate is thereby arranged on the
base plate, and said base plate comprises a blind hole-type recess
for receiving at least one electronic or electric component on a
side oriented towards the support plate. The component is connected
to the support plate, in particular to a printed circuit board or
substrate, and is arranged in the recess in the base plate. This
facilitates a reduction of the total construction height of the
module as well as a side protection of the component arranged in
the recess.
A sensor is furthermore preferably arranged on a side of the
support plate facing away from the base plate. The sensor can
preferably be a pressure sensor or a temperature sensor or a
position sensor or an attitude sensor.
The electronic component arranged in the recess is furthermore
preferably an interference suppression assembly. In a particularly
preferred manner, the interference suppression assembly is thereby
arranged on the support plate at a rear position in relation to a
component in which interference is to be suppressed. As a result,
it is especially possible for shielding measures by said
interference suppression assembly to be provided directly at a
source of electromagnetic interferences. Said interference
suppression assembly particularly achieves a high suppression of
interference as a result of the close proximity thereof to a
component in which interference is to be suppressed.
According to a further preferred embodiment of the invention, the
electronic component which is arranged in the recess in the base
plate is a small modular printed circuit board. Said modular
printed circuit board can thereby be arranged in a well protected
manner on the support plate.
A sealing compound furthermore preferably completely fills a cavity
of the recess of the base plate. In so doing, the sealing compound
is preferably made from a material which has very good thermal
conductivity properties.
In a particularly preferred manner, the base plate is designed as a
cooling plate and in particular as a sheet metal plate or an
aluminum plate.
According to a further preferred embodiment of the invention, the
support plate comprises a base area and at least one connection
element, which is a part of the base area and is positioned at an
angle to said base area, a component, in particular a sensor, being
arranged in the connection element. Said connection element is thus
formed from a part of the support plate and is tilted upwards at
the desired angle, preferably 90.degree., to the base area. In
particular, a simple and cost-effective production of the
electronic module can thereby be facilitated. This results from the
fact that the electronic component can be equipped in the plane of
the base area by means of surface technology, the connection
element is then exposed from said base area and finally said
connection element together with the component is bent at the
desired angle out of the plane of said base area. Support plates
are basically commercial substrates, in particular multi-layered
substrates, for example substrates having at least one copper layer
and at least one insulation layer. The connection element is
preferably milled from the base area. In so doing, the connection
element has, for example, a width of 3-7 mm starting from the
intended bending line in the substrate. The connection element is
pivoted upward in a radius along the intended bending line.
Experiments show that such commercial substrates withstand multiple
bending without incurring damage.
A support element is furthermore preferably provided which supports
the connection element. The support element can, for example, be
fastened to the connection element using clips.
BRIEF DESCRIPTION OF THE DRAWINGS
A preferred exemplary embodiment of the invention is described
below in detail with reference to the accompanying drawings. In the
drawings:
FIG. 1 shows a schematic, perspective and partially cutaway view of
an electronic module according to an exemplary embodiment of the
invention, and
FIG. 2 shows a sectional view of a section of the electronic module
from FIG. 1.
DETAILED DESCRIPTION
An electronic module 1 according to a preferred exemplary
embodiment is described below in detail with reference to the FIGS.
1 and 2. As can be seen in FIG. 1, the electronic module 1
comprises a support plate 2 which can, e.g., be a printed circuit
board or a substrate. A variety of components can be arranged on
the support plate according to need. The electronic module 1
further comprises a base plate 4, which is an aluminum plate in
this exemplary embodiment. The support plate 2 is thereby laminated
to one side of the base plate 4.
The base plate 4 further comprises a blind hole-type recess 5 on a
side oriented towards the support plate 2. As can especially be
seen in FIG. 2, the electronic or electric component 3 is thereby
attached to the support plate 2 such that it protrudes into the
cavity 5a of the recess 5. The recess 5 is designed having such a
depth that the component 3 is completely accommodated. In this
exemplary embodiment, the components 3 are designed as interference
suppression components. An interference suppression of the other
components disposed, for example, above the interference
suppression components can thus result directly at an interference
source and has a high interference suppression effect because of
short connecting paths.
It should further be noted that the cavity 5a of the recess 5 can
also be partially or completely filled with a sealing compound or
paste or an adhesive.
As can further be seen from FIG. 1, An HDI printed circuit board
(HDI: high density interconnect) can, for example, be disposed in a
further recess 5. Such HDI printed circuit boards are compactly
designed printed circuit boards with high packing density. The HDI
printed circuit board 10 can, for example, be disposed in the
recess 5 by means of a slug-up configuration so that rapid heat
dissipation into the base plate 4 is possible. In order to reliably
fix the modular printed circuit board 10, said board can also
further be fixed to the bottom and/or side walls of the recess 5
using an adhesive.
As can further be seen from FIG. 1, additional electronic
components, such as, for example, a pressure sensor 8, can be
disposed at arbitrary positions on the support plate 2. In
addition, the reference numeral 9 denotes a plug connector.
As can further be seen from FIG. 1, the support plate 2 comprises a
base area as well as a plurality of connection elements 21. The
connection elements 21 are bent upwards from the base area at an
angle .alpha. of 90.degree.. Depending on the length of the
connection elements, sensors 6, which are arranged in an end region
of each connection element 21, are thereby disposed in the space
relative to the base area 20. The reference numeral 7 denotes a
separate reinforcing element which is fixed to the base plate 4 and
supports the connection elements. The connection elements and the
reinforcing elements 7 can, for example, be connected by means of
clips. It should be noted that instead of using the reinforcing
elements 7, it is in principle also possible for a region of the
base plate 4 corresponding to the connection element to be exposed
and to be tilted upwards together with said connection element. The
connection elements 21 are preferably separated from the base area
20 by means of a milling process. In so doing, a milling process on
one side can be sufficient if the connection element is formed on
an edge region of the support plate 2 (in FIG. 1 the connection
element 21 on the far left); or a milling process is carried out on
three sides (in FIG. 1 the central connection element 21). Hence, a
modular design can be achieved, whereby the electronic module 1
according to the invention is particularly suitable as a
transmission control module, which can be adapted to different
variants, for example to different motor vehicles. In so doing,
assembly costs and processing costs, such as bonding, soldering,
welding or adhesive bonding of electronic components, can
particularly be reduced.
* * * * *