U.S. patent number 9,167,695 [Application Number 13/459,768] was granted by the patent office on 2015-10-20 for electronic device module.
This patent grant is currently assigned to Japan Display Inc.. The grantee listed for this patent is Takuya Asano, Masaki Kondoh. Invention is credited to Takuya Asano, Masaki Kondoh.
United States Patent |
9,167,695 |
Asano , et al. |
October 20, 2015 |
Electronic device module
Abstract
An electronic device module includes a first substrate having a
first wiring layer and a first alignment mark, the first alignment
mark being transparent in a visible region of the electromagnetic
spectrum, and a second substrate facing a part of the first
substrate and having a second wiring layer and a second alignment
mark facing the first alignment mark.
Inventors: |
Asano; Takuya (Aichi,
JP), Kondoh; Masaki (Kanagawa, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Asano; Takuya
Kondoh; Masaki |
Aichi
Kanagawa |
N/A
N/A |
JP
JP |
|
|
Assignee: |
Japan Display Inc. (Tokyo,
JP)
|
Family
ID: |
47155140 |
Appl.
No.: |
13/459,768 |
Filed: |
April 30, 2012 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20120293974 A1 |
Nov 22, 2012 |
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Foreign Application Priority Data
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May 17, 2011 [JP] |
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2011-110722 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
27/3276 (20130101); H05K 3/361 (20130101); H05K
1/0269 (20130101); H05K 1/144 (20130101); H05K
1/141 (20130101); H05K 2201/09918 (20130101); H05K
2201/0108 (20130101); H05K 2203/166 (20130101) |
Current International
Class: |
H05K
1/11 (20060101); H05K 1/14 (20060101); H05K
1/02 (20060101) |
Field of
Search: |
;361/784,777,779,802 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2004-317792 |
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Nov 2004 |
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JP |
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2006-040978 |
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Feb 2006 |
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JP |
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2006-119321 |
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May 2006 |
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JP |
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2007-273578 |
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Oct 2007 |
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JP |
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2008-010450 |
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Jan 2008 |
|
JP |
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2010-230808 |
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Oct 2010 |
|
JP |
|
Primary Examiner: Hoffberg; Robert J
Assistant Examiner: Dang; Hung
Attorney, Agent or Firm: Wolf, Greenfield & Sacks,
P.C.
Claims
What is claimed is:
1. An electronic device module comprising: a first substrate having
a first wiring layer and a first alignment mark, the first
alignment mark being transparent in a visible region of the
electromagnetic spectrum; and a second substrate facing a part of
the first substrate and having a second wiring layer and a second
alignment mark that is opaque in the visible region of the
electromagnetic spectrum and faces the first alignment mark, the
second substrate being placed on the first substrate disposed on an
X-Y plane, wherein the first alignment mark is configured to, from
a second substrate side, be visible by illumination in a Z
direction and be invisible by illumination in an inclined direction
relative to the Z direction, and wherein the second alignment mark
is configured to, from the second substrate side, be visible by
illumination in the inclined direction and be invisible by
illumination in the Z direction.
2. The electronic device module according to claim 1, wherein the
first and second alignment marks are formed from a conductive
film.
3. The electronic device module according to claim 2, wherein the
first wiring layer and the first alignment mark are formed from the
same conductive film and the second wiring layer and the second
alignment mark are formed from the same conductive film.
4. The electronic device module according to claim 1, wherein the
first and second alignment marks engage with each other.
5. The electronic device module according to claim 4, wherein one
of the first and second alignment marks has an annular portion;
wherein the other alignment mark has a circular portion fitting
into a region surrounded by the annular portion.
6. The electronic device module according to claim 4, wherein one
of the first and second alignment marks has one or more groove
portions; wherein the other alignment mark has a linear portion
extending along the one or more groove portions.
7. The electronic device module according to claim 6, wherein two
of each of the groove portions and the linear portions are
provided; wherein the two groove portions intersect each other in a
plane parallel to a substrate surface.
8. The electronic device module according to claim 6, wherein the
first alignment mark has the groove portion and the second
alignment mark has the linear portion; wherein the groove portion
extends on the first substrate and protrudes outward beyond an edge
of the second substrate.
9. The electronic device module according to claim 1, wherein the
first substrate is a panel substrate forming at least a part of a
touch panel or display panel; wherein the second substrate is a
printed board.
10. The electronic device module according to claim 9, wherein the
first substrate forms a part of the touch panel.
11. The electronic device module according to claim 9, wherein the
display panel has, on a pixel driving substrate in this order: a
liquid crystal display element; and a counter substrate as the
first substrate.
12. The electronic device module according to claim 9, wherein the
display panel has an organic electroluminescent element and a
sealing substrate in this order on a pixel driving substrate;
wherein the first substrate is the pixel driving substrate or the
sealing substrate on a light emitting side.
13. A method of producing an electronic device module, the
electronic device module including a first substrate having a first
wiring layer and a first alignment mark, the first alignment mark
being transparent in a visible region of the electromagnetic
spectrum, and a second substrate facing a part of the first
substrate and having a second wiring layer and a second alignment
mark that faces the first alignment mark and that is opaque in the
visible region, the method comprising: placing the second substrate
on the first substrate disposed on an X-Y plane; illuminating the
first substrate and the second substrate by a first light source
that directs light in a Z direction and by a second light source
that directs light in an inclined direction inclined relative to
the Z direction; taking an image of the first alignment mark and
the second alignment mark that are illuminated by the first light
source and the second light source; and aligning the first
substrate and the second substrate based on the image including the
first alignment mark and the second alignment mark.
14. The method of claim 13, wherein: the first alignment mark is
configured to, from a second substrate side, be visible by
illumination in a Z direction and be invisible by illumination in
an inclined direction inclined relative to the Z direction, and the
second alignment mark is configured to, from a second substrate
side, be visible by illumination in the inclined direction and be
invisible by illumination in the Z direction.
Description
BACKGROUND
The present disclosure relates to an electronic device module
having electronic components mounted using a printed board, etc.,
for example.
In display devices such as liquid crystal display devices and
organic electroluminescent (referred to hereinafter as EL) devices,
a printed board (PWB, PCB) is bonded to a panel (more specifically,
a part of a substrate forming the panel) to mount an integrated
circuit and other electronic components.
At the time of mounting, the printed board is positioned on the
panel by aligning the alignment marks provided on the printed board
with the alignment marks provided on the panel and then connected
to the panel (see Japanese Unexamined Patent Application
Publication Nos. 2010-230808 and 2006-119321, for example).
SUMMARY
In the alignment techniques described in Japanese Unexamined Patent
Application Publication Nos. 2010-230808 and 2006-119321, both the
alignment marks provided on the panel (more specifically, pixel
driving substrate) and the alignment marks provided on the printed
board are formed from a metal film that is opaque to visible light.
At the time of mounting, the printed board is positioned on the
panel such that the corresponding alignment marks are aligned with
each other in face-to-face manner when the alignment marks are
viewed through the printed board, for example.
Recently, alignment techniques have been becoming increasingly
diversified and there is a demand for an alignment technique
suitable for panels made of a transparent conductive film, such as
touch panels, for example.
It is desirable to provide an electronic device module suitable for
mounting electronic components on a panel made of a transparent
conductive film.
An electronic device module according to an embodiment of the
present disclosure includes a first substrate having a first wiring
layer and a first alignment mark that is transparent in a visible
region of the electromagnetic spectrum and a second substrate
facing a part of the first substrate and having a second wiring
layer and a second alignment mark facing the first alignment
mark.
In the electronic device module according to this embodiment of the
present disclosure, when the second substrate having the second
wiring layer is mounted on the first substrate having the first
wiring layer, the second substrate is aligned with the first
substrate using the first transparent alignment mark and the second
alignment mark.
The electronic device module according to this embodiment of the
present disclosure allows the second substrate to be aligned with
the first substrate by making use of the first transparent
alignment mark. This makes it possible to realize an electronic
device module suitable for mounting electronic components on a
panel made of a transparent conductive film.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic plan view showing the configuration of main
components of an electronic device module according to an
embodiment of the present disclosure;
FIG. 2A is a schematic view illustrating the configuration of the
alignment marks and surroundings thereof on the panel substrate and
printed board shown in FIG. 1;
FIG. 2B is a schematic view illustrating the configuration of the
alignment mark on the printed board shown in FIG. 1;
FIG. 3 is an enlarged plan view schematically showing the
configuration of the alignment marks and surroundings thereof shown
in FIG. 1;
FIG. 4 is a schematic view illustrating illumination optics used
for alignment;
FIG. 5 is a schematic view showing visible images when illuminated
by the illumination optics shown in FIG. 4;
FIG. 6A is a schematic view showing a visible image when only the
printed board is placed and illuminated;
FIG. 6B is a schematic view showing a visible image when only the
panel substrate is placed and illuminated;
FIG. 7 is a schematic plan view showing the configuration of
alignment marks according to variation 1;
FIG. 8A is a schematic sectional view showing the configuration of
alignment marks according to variation 2-1;
FIG. 8B is a schematic sectional view showing the configuration of
alignment marks according to variation 2-2;
FIG. 8C is a schematic sectional view showing the configuration of
alignment marks according to variation 2-3;
FIG. 9A is a schematic view illustrating an alignment technique
according to variation 3;
FIG. 9B is a schematic view illustrating the alignment technique
according to variation 3;
FIG. 9C is a schematic view illustrating the alignment technique
according to variation 3;
FIG. 10A is a schematic view illustrating an alignment technique
according to variation 4;
FIG. 10B is a schematic view illustrating the alignment technique
according to variation 4;
FIG. 11 is a schematic sectional view showing a liquid crystal
display device according to application 1;
FIG. 12 is a schematic plan view showing the general structure of
the liquid crystal display panel shown in FIG. 11;
FIG. 13 is a schematic sectional view showing another liquid
crystal display device according to application 1;
FIG. 14A is a schematic sectional view showing an organic EL
display device according to application 2;
FIG. 14B is a schematic sectional view showing another organic EL
display device according to application 2;
FIG. 15A is a schematic sectional view showing a touch panel
according to application 3;
FIG. 15B is a schematic sectional view showing another touch panel
according to application 3;
FIG. 16 is a perspective view showing application 4;
FIG. 17A is a perspective view showing the front side of
application 5;
FIG. 17B is a perspective view showing the back side of application
5;
FIG. 18 is a perspective view showing application 6;
FIG. 19 is a perspective view showing application 7;
FIG. 20A is a front view of application 8 in opened state;
FIG. 20B is a side view of application 8 in opened state;
FIG. 20C is a front view of application 8 in closed state;
FIG. 20D is a left side view of application 8 in closed state;
FIG. 20E is a right side view of application 8 in closed state;
FIG. 20F is a top view of application 8 in closed state; and
FIG. 20G is a bottom view of application 8 in closed state.
DETAILED DESCRIPTION OF EMBODIMENTS
An embodiment of the present disclosure will now be described with
reference to the drawings. The description will be given in the
following order:
1. Embodiment (an exemplary electronic device module having a panel
substrate with alignment marks formed from a transparent conductive
film and a printed board with alignment marks formed from a metal
film)
2. Variation 1 (an example in which alignment marks on the panel
substrate and printed board are reversed)
3. Variation 2 (other exemplary shapes of alignment marks)
4. Variation 3 (another exemplary alignment technique)
5. Variation 4 (another exemplary alignment technique)
6. Application 1 (exemplary installation of electronic device
module in liquid crystal display panel)
7. Application 2 (exemplary installation of electronic device
module in organic EL display panel)
8. Application 3 (exemplary installation of electronic device
module in touch panel)
9. Applications 4 to 8 (exemplary electronic apparatus)
Embodiment
[Configuration]
FIG. 1 schematically shows the configuration of main components of
an electronic device module according to an embodiment (electronic
device module 1). The electronic device module 1 has a printed
board 20 mounted on a part of a panel substrate 10. In the
embodiment of the present disclosure, the panel substrate 10 is a
specific example of a "first substrate" and the printed board 20 is
a specific example of a "second substrate". In this specification,
the terms "transparent" and "opaque" mean "transparent" and
"opaque" in a visible region, i.e., to visible light. The "visible
region" corresponds to the entirety or part of the wavelengths
visible to human eyes, of approximately 360 to 830 nm, for
example.
The panel substrate 10 is made of a glass substrate, for example,
and forms a part of a liquid crystal display device, organic EL
display device, or touch panel, for example, which will be
described later. The panel substrate 10 has a rectangular surface,
for example, and the printed board 20 is bonded to a peripheral
region thereof. On the panel substrate 10, a wiring layer 11 and
alignment marks 12 for alignment with the printed board 20 are
provided.
The wiring layer 11 includes a plurality of wirings 11a led out of
various semiconductor devices (not shown) such as a pixel driving
circuit provided on the panel substrate 10, for example, each
wiring 11a being electrically connected to a wiring layer 21
(wiring 21a) formed on the printed board 20. The wiring layer 11 is
made of a transparent conductive film, for example; more
specifically, it is made of a monolayer film including a single
layer of ITO (indium tin oxide), AZO (aluminum-doped zinc oxide),
or GZO (gallium-doped zinc oxide), or made of a laminated film
including two or more layers.
The alignment marks 12 (first alignment marks) are transparent;
more specifically, they are transparent to light of wavelengths in
the visible region of the electromagnetic spectrum, i.e., at least
some of the wavelengths in the range described above. The alignment
marks 12 are formed from a transparent conductive film, for
example. Preferably, the alignment marks 12 are formed from the
same transparent conductive film as the wiring layer 11. This
allows the wiring layer 11 and the alignment marks 12 to be formed
in the same process, if the wiring layer 11 is made of a
transparent conductive film, for example. More specifically, after
a transparent conductive film of ITO, for example, is deposited
over the entire surface of the panel substrate 10 by sputtering,
for example, photolithography and etching may be conducted using a
layout pattern for the wiring layer 11 and a photomask
corresponding to the shape (described later) of the alignment marks
12. This allows the wiring layer 11 and alignment marks 12 to be
formed simultaneously from the same transparent conductive film.
The alignment marks 12 are located in regions facing the alignment
marks 22 provided on the printed board 20, for example, and have
shapes that totally or partially engage with the corresponding
alignment marks 22, for example, for higher alignment accuracy. A
specific configuration of the alignment marks 12 will be described
later.
The printed board 20 has an integrated circuit, resistors,
capacitors, or other electronic components (not shown) provided on
a substrate, for example, and is used as a wiring connecting member
for mounting these electronic components on the panel substrate 10,
i.e., for wiring them to semiconductor devices on the panel
substrate 10. The printed board 20 is a flexible printed circuit
(FPC) board having a wiring layer 21 formed on an insulative film
of polyimide, for example. The wiring layer 21 includes a plurality
of wirings 21a, for example. These wirings 21a are provided on the
surface facing the panel substrate 10 and formed from an opaque
conductive film of copper (Cu), for example. The wirings 21a are
electrically connected to the wirings 11a provided on the panel
substrate 10.
Instead of being provided on the surface facing the panel substrate
10, the wiring layer 21 may extend through via holes and be
provided on the surface of the printed board 20 not facing the
panel substrate 10. Alternatively, the wiring layer 21 may be
provided on both surfaces of the printed board 20 instead of only
one surface. Although this exemplary configuration includes a set
of alignment marks 12, 22 provided at two locations corresponding
to corners of the printed board 20, the positions and number of
alignment marks are not particularly limited but depend on the
wiring layouts or other conditions of the panel substrate 10 and
printed board 20.
The printed board 20 has alignment marks 22 to be engaged with the
alignment marks 12 described above. The alignment marks 22 are
located on the surface facing the panel substrate 10, for example,
and are formed from an opaque metal film, for example. More
specifically, the alignment marks 22 are made of the same material
(copper, for example) as the wiring layer 21 and are formed
simultaneously with the wiring layer 21 in the same process.
Specific configurations of the alignment marks 22 and the above
alignment marks 12 will be described below.
(Alignment Marks 12, 22)
FIG. 2A is a schematic view illustrating an exemplary configuration
of the alignment marks 12, 22 and surroundings thereof on the panel
substrate 10 and printed board 20; FIG. 2B shows the alignment mark
22 as viewed from the panel substrate 10. FIG. 3 is an enlarged
plan view schematically showing the configuration of the alignment
marks 12, 22 and surroundings thereof in FIG. 1. As shown in FIG.
2A, the panel substrate 10 has, in addition to the wiring layer 11
and alignment marks 12, pads for connecting wirings (connection
pads 11b), for example, that electrically connect the plurality of
wirings 11a to the wirings 21a on the printed board 20.
The alignment marks 12 each include an annular-shaped mark (annular
portion 12a) and groove-shaped marks each having a unidirectionally
extending groove (groove portions 12b1, 12b2), for example. The
annular portion 12a has a circular aperture with a diameter d11
equal to or larger than the diameter d21 of the circular portion
22a (described later) of the alignment mark 22, for example. The
groove portions 12b1, 12b2 are located adjacent (connected) to or
spaced apart from the annular portion 12a. Here, the groove portion
12b1 is connected to the annular portion 12a, while the groove
portion 12b2 is distanced from the annular portion 12a. The groove
portions 12b1, 12b2 each include two rectangular marks disposed in
parallel with a predetermined space (groove width) therebetween,
for example. The width d12 of each of the groove portions 12b1,
12b2 is equal to or larger than the width d22 of the linear
portions 22b1, 22b2 (described later) of the alignment mark 22, for
example. The groove portions 12b1, 12b2 extend in two directions
orthogonal to each other, for example. The groove portions 12b1,
12b2 protrude outward beyond edges of the printed board 20 when the
printed board 20 is bonded to the panel substrate 10.
The alignment marks 22 each include a circular portion 22a and two
linear portions 22b1, 22b2, for example. As shown in FIG. 3, the
circular portion 22a is the portion that faces the annular portion
12a of the alignment mark 12, for example; more specifically, it is
the portion that fits into the aperture of the annular portion 12a,
for example. The linear portions 22b1, 22b2 are provided adjacent
(connected) to or spaced apart from the circular portion 22a. Here,
the linear portions 22b1, 22b2 are both connected to the circular
portion 22a. The linear portions 22b1, 22b2 extend in the same
directions as the corresponding groove portions 12b1, 12b2, for
example. The ends of the linear portions 22b1, 22b2 spaced apart
from the circular portion 22a reach edges of the printed board 20,
for example. The linear portions 22b1, 22b2 may or may not face the
groove portions 12b1, 12b2, as long as they extend along the groove
portions 12b1, 12b2 as described above. In this example, the linear
portion 22b1 is located in an area not facing the groove portion
12b1, while the linear portion 22b2 is partially located in an area
facing the groove portion 12b2 so as to fit into the groove portion
12b2.
In the above configuration, the alignment marks 12, 22 are aligned
with each other such that the circular portion 22a of the alignment
mark 22 faces the annular portion 12a of the alignment mark 12 and
fits into the aperture of the annular portion 12a and the linear
portions 22b1, 22b2 face and fit into the groove portions 12b1,
12b2. This suppresses positional shifts in the x and y directions
and rotations around the axis in the z direction (controls the
rotational angle .theta.), for example. Controlling the x, y, and
.theta. in this manner enables highly accurate alignment. When the
printed board 20 is bonded to the panel substrate 10, the groove
portions 12b1, 12b2 protrude outward beyond edges of the printed
board 20 and the linear portions 22b1, 22b2 reach edges of the
printed board 20. This provides good visibility during alignment
and improves alignment accuracy.
[Alignment Techniques]
The panel substrate 10 and printed board 20 are aligned with each
other with reference to the alignment marks 12, 22 as described
above such that the wiring layers 11, 21 are electrically
connected, and then soldered, for example, to each other. When
aligning the panel substrate 10 with the printed board 20,
illumination optics 110 as shown in FIG. 4, for example, may be
used.
The illumination optics 110 include two light sources 110A, 110B
oriented in different directions and a camera 111 and emit light
(visible light, such as white light, for example) to the panel
substrate 10 and the printed board 20 placed thereon from above the
printed board 20. Of the two light sources 110A, 110B, the light
source 110A is installed so as to provide frontal illumination to
the panel substrate 10 and printed board 20 placed in an xy plane
by directing light along the z axis. The light source 110B is
installed so as to provide oblique illumination to the panel
substrate 10 and printed board 20 placed in the xy plane by
directing light in a direction inclined relative to the z axis.
The light sources 110A, 110B are used during alignment of the
alignment mark 22 provided on the printed board 20 with the
alignment mark 12 provided on the panel substrate 10. More
specifically, both light sources 110A, 110B are turned on to
provide frontal and oblique illumination during alignment.
FIG. 5 schematically shows images that are visible when the light
source 110A (frontal) and light source 110B (oblique) are turned on
(lit) or off (unlit). Note that these images are viewed from above
the printed board 20 and the portions indicated by dotted lines are
visible through the printed board 20.
As shown in FIG. 5, when only frontal illumination is provided with
the light source 110A turned on and the light source 110B turned
off, the groove portions 12b1, 12b2 of the alignment marks 12 on
the panel substrate 10, i.e., portions not facing the printed board
20, become visible. On the other hand, the region in which the
printed board 20 overlaps the panel substrate 10 is shaded and the
annular portions 12a of the alignment marks 12, i.e., portions
facing the printed board 20, and the alignment marks 22 on the
printed board 20 itself become hardly visible.
Instead, when only oblique illumination is provided with the light
source 110A turned off and the light source 110B turned on, the
alignment marks 22 on the printed board 20 become visible through
the printed board 20. On the other hand, the region of the panel
substrate 10 not facing the printed board 20 is shaded and the
alignment marks 12 on the panel substrate 10 become hardly
visible.
Alternatively, when frontal and oblique illumination is provided
with both the light sources 110A, 110B turned on, the panel
substrate 10 and printed board 20 are not shaded and the alignment
marks 12, 22 become entirely visible.
FIG. 6A shows an image visible when only the printed board 20 is
placed and illuminated with only oblique illumination, while FIG.
6B shows an image visible when only the panel substrate 10 is
placed and illuminated with only frontal illumination. Thus, the
alignment marks 22 on the printed board 20 are visible under the
oblique illumination and the alignment marks 12 on the panel
substrate 10 are visible under the frontal illumination.
The illumination optics 110, when used during alignment, provide
good visibility of the alignment marks 12, 22 and facilitate
alignment.
Effects
As described above, the electronic device module 1 according to the
present embodiment allows the printed board 20 to be aligned with
the panel substrate 10 making use of the transparent alignment
marks 12 on the panel substrate 10 when the printed board 20 is
mounted on the panel substrate 10. This enables the realization of
an electronic device module suitable to mount electronic components
on a panel formed from a transparent conductive film, for example,
such as a liquid crystal display panel, organic EL display panel,
or touch panel, which will be described later.
For example, when the alignment marks 12 are formed from the same
transparent conductive film as the wiring layer 11, the wiring
layer 11 and alignment marks 12 can be simultaneously formed in the
same process. The illumination optics 110 providing frontal and
oblique illumination as described above provide good visibility and
facilitate alignment even if the alignment marks 12 are
transparent.
When the alignment marks 12, 22 are shaped so as to engage with
each other, the alignment accuracy can be enhanced. For example,
the alignment marks 12 are each provided with annular portion 12a
and groove portions 12b1, 12b2, while the alignment marks 22 are
each provided with the circular portion 22a and linear portions
22b1, 22b2 that can fit into the annular portion 12a and groove
portions 12b1, 12b2. This suppresses relative positional offset
between the panel substrate 10 and the printed board 20, such as
shift of the printed board 20 from a desired position in the xy
plane and rotation around the z axis, for example, and thus enables
accurate alignment.
With the printed board 20 bonded to the panel substrate 10, the
groove portions 12b1, 12b2 protrude outward beyond edges of the
printed board 20 and the linear portions 22b1, 22b2 reach the edges
of the printed board 20. This provides good visibility during
alignment and thus improves alignment accuracy.
Variations (variations 1 to 4) of the above embodiment will now be
described. Variations 1, 2 relate to other exemplary configurations
of the alignment marks, while variations 3, 4 relate to other
exemplary alignment techniques. The same components as the above
embodiment will be denoted with the same reference characters and
description thereof will be omitted as appropriate.
<Variation 1>
FIG. 7 schematically shows the configuration of alignment marks
(alignment marks 12A, 22A) according to variation 1. In this
variation, the alignment marks on the panel substrate 10 and
printed board 20 have a configuration reversed from the
configuration of the alignment marks in the above embodiment. More
specifically, the alignment marks 12A on the panel substrate 10
have a configuration similar to the alignment marks 22 on the
printed board 20 in the above embodiment, while the alignment marks
22A on the printed board 20 have a configuration similar to the
alignment marks 12 on the panel substrate 10 in the above
embodiment.
For example, the alignment marks 22A provided together with the
wiring layer 21 (not shown in FIG. 7), etc. on the printed board 20
are opaque and formed from the same metal film as the wiring layer
21. The alignment marks 22A on the printed board 20 each include an
annular-shaped mark (annular portion 22c) and groove-shaped marks
each having a unidirectionally extending groove (groove portions
22d1, 22d2), for example. The annular portions 22c each have a
circular aperture with a diameter equal to or larger than the
diameter of the circular portion 12c (described later) of the
alignment mark 12A, for example. The groove portions 22d1, 22d2 are
located adjacent (connected) to or spaced apart from the annular
portion 22c. Here, the groove portion 22d1 is connected to the
annular portion 22c, while the groove portion 22d2 is distanced
from the annular portion 22c. The groove portions 22d1, 22d2 each
include two rectangular marks disposed in parallel with a
predetermined space (groove width) therebetween. The width of each
of the groove portions 22d1, 22d2 is equal to or larger than the
width of the linear portions 12d1, 12d2 (described later) of the
alignment mark 12A, for example. The groove portions 22d1, 22d2
extend in two directions orthogonal to each other, for example. The
ends of the groove portions 22d1, 22d2 spaced apart from the
annular portion 22c reach edges of the printed board 20, for
example.
On the other hand, the alignment marks 12A provided together with
the wiring layer 11, connection pads (not shown in FIG. 7), etc. on
the panel substrate 10 are transparent and formed from the same
transparent conductive film as the wiring layer 11, for example.
The alignment marks 12A on the panel substrate 10 each include a
circular portion 12c and two linear portions 12d1, 12d2, for
example. The circular portion 12c is the portion that faces the
annular portion 22c of the alignment mark 22A, for example; more
specifically, it is the portion that fits into the aperture of the
annular portion 22c, for example. The linear portions 12d1, 12d2
are located adjacent (connected) to or spaced apart from the
circular portion 12c. Here, the linear portions 12d1, 12d2 are both
connected to the circular portion 12c. The linear portions 12d1,
12d2 extend in the same directions as the groove portions 22d1,
22d2 facing them, for example. The linear portions 12d1, 12d2
protrude outward beyond edges of the printed board 20 when the
printed board 20 is bonded to the panel substrate 10. The linear
portions 12d1, 12d2 may or may not face the groove portions 22d1,
22d2, as long as they extend along the corresponding groove
portions 22d1, 22d2 as described above. In this variation, the
linear portions 12d1, 12d2 are located in a region partially facing
the groove portion 22d2 so as to fit into the groove portion
22d2.
In such a configuration as described above, the annular portion 22c
of the alignment mark 22A faces the circular portion 12c of the
alignment mark 12A such that the circular portion 12c fits into the
aperture of the annular portion 22c, for example, to enable
alignment in the x and y directions. On the other hand, the linear
portions 12d1, 12d2 of the alignment mark 12A face the
corresponding groove portions 22d1, 22d2 of the alignment mark 22A
such that the linear portions 12d1, 12d2 fit into the corresponding
groove portions 22d1, 22d2 to suppress the rotation around the z
axis by controlling the rotational angle .theta.. Controlling the
x, y, and .theta. in this manner enables highly accurate
alignment.
As in this variation, the shapes of the alignment marks 12A, 22A
may have shapes reversed from the shapes of the alignment marks 12,
22 in the above embodiment. This variation can provide the same
effects as the above embodiment.
<Variation 2>
FIGS. 8A to 8C show exemplary configurations of alignment marks
according to variation 2 (variations 2-1 to 2-3). For simplicity,
FIGS. 8A to 8C show only the shapes of the alignment marks and a
part of the printed board 20. The alignment marks on the printed
board 20 are illustrated by hatching. In the variations 2-1 to 2-3,
the alignment marks 12B to 12D on the panel substrate 10 do not
have the annular portion 12a provided in the above embodiment and
the alignment marks 22B to 22D on the printed board 20 do not have
the circular portion 22a provided in the above embodiment. Such an
exemplary configuration will now be described in detail.
(Variation 2-1)
As shown in FIG. 8A, the alignment mark 12B has two groove portions
12f1, 12f2 extending in two directions orthogonal to each other.
The groove portions 12f1, 12f2 are distanced from each other and
only partially face linear portions 22f1, 22f2 described later. The
groove portions 12f1, 12f2 protrude outward beyond edges of the
printed board 20. The corresponding two linear portions 22f1, 22f2
of the alignment mark 22B extend along the above groove portions
12f1, 12f2. The linear portions 22f1, 22f2 intersect with each
other, forming a cross as a whole.
(Variation 2-2)
As shown in FIG. 8B, the alignment mark 12C has two groove portions
12g1, 12g2 extending in two directions orthogonal to each other.
The groove portions 12g1, 12g2 intersect with each other so as to
be connected with each other at a single point and are shaped so as
to face the entirety of linear portions 22g1, 22g2 described later.
The groove portions 12g1, 12g2 protrude outward beyond edges of the
printed board 20. The corresponding two linear portions 22g1, 22g2
of the alignment mark 22C extend along the above groove portions
12g1, 12g2. The linear portions 22g1, 22g2 are connected with each
other in a L-shape as a whole.
(Variation 2-3)
As shown in FIG. 8C, the alignment mark 12D has two groove portions
12h1, 12h2 extending in two directions orthogonal to each other.
The groove portions 12h1, 12h2 have angular U-shaped contours and
face parts of linear portions 22h1, 22h2 described later. The
groove portions 12h1, 12h2 protrude outward beyond edges of the
printed board 20. The corresponding two linear portions 22h1, 22h2
of the alignment mark 22D extend along the above groove portions
12h1, 12h2. In this variation, the linear portions 22h1, 22h2 are
distanced from each other.
As in the above variations 2-1 to 2-3, the alignment marks may not
have such an annular portion and circular portion as described
above. The groove portions extending in two directions, for
example, and the corresponding linear portions can suppress
positional shifts in the xy plane and rotations around the z axis
and enable alignment at an accuracy substantially equivalent to the
above embodiment.
In the above embodiment, the visibility of the alignment marks is
improved by providing frontal and oblique illumination during
alignment; alignment can also be achieved by subjecting captured
images to a predetermined process and confirming the positions of
the alignment marks as in the following variations 3 and 4.
<Variation 3>
FIGS. 9A to 9C are schematic views illustrating an alignment
technique according to variation 3. Description will be given
citing the alignment marks 12, 22 in the above embodiment. First,
the alignment mark 12 on the panel substrate 10 is photographed as
shown in FIG. 9A. More specifically, with only the panel substrate
10 placed under oblique illumination as shown in FIG. 6B by turning
on only the light source 110B of the illumination optics 110 shown
in FIG. 4, an image of the alignment mark 12 is captured using the
camera 111. Although the image may be captured under frontal
illumination using only the light source 110A, a better result can
be obtained when the light source 110B is used. Subsequently, the
position of the alignment mark 12 (position of the center (C(x, y))
of the annular portion 12a, for example) is extracted in a
geometrical manner, for example, on the basis of the captured image
as shown in FIG. 9B. Then, with the position of the camera 111
fixed, the extracted position C is displayed on the shooting screen
F1 as shown in FIG. 9C, and the printed board 20 is placed on the
panel substrate 10 such that the circular portion 22a on the
printed board 20 is superimposed on the position C. Although the
alignment mark 12 including the annular portion 12a and groove
portions 12b1, 12b2 and the alignment mark 22 including the
circular portion 22a and linear portions 22b1, 22b2 are described
here for illustrative purposes, the alignment technique according
to this variation enables alignment without using the groove
portions 12b1, 12b2 and linear portions 22b1, 22b2. This means that
alignment can be achieved using only the annular portion 12a and
circular portion 22a.
<Variation 4>
FIGS. 10A and 10B are schematic views illustrating an alignment
technique according to variation 4. Description will be given again
citing the alignment marks 12, 22 in the above embodiment. First,
the alignment mark 12 on the panel substrate 10 is photographed as
shown in FIG. 10A. More specifically, as in the above variation 3,
by placing only the panel substrate 10 and turning on only the
light source 110A of the illumination optics 110 shown in FIG. 4,
for example, an image of the alignment mark 12 is captured using
the camera 111. Then, with the position of the camera 111 fixed and
with only the light source 110B turned on to provide only oblique
illumination, a semi-transparent image D of the captured image of
the alignment mark 12 is displayed on the shooting screen F1 and
the printed board 20 is placed on the panel substrate 10 such that
the alignment mark 22 on the printed board 20 is superimposed on
the semi-transparent image D as shown in FIG. 10B.
Applications 1 to 8 of the electronic device module described in
the above embodiment and variations 1 to 4 will now be described.
Applications 1 to 3 relate to exemplary panels into which the
electronic device module is incorporated and applications 4 to 8
relate to exemplary electronic apparatus.
<Application 1>
FIG. 11 is a schematic sectional view of main components of a
liquid crystal display device according to application 1 (liquid
crystal display device 50). The liquid crystal display device 50
includes a liquid crystal display panel 50A and a backlight 51. The
liquid crystal display panel 50A includes a TFT substrate 52, a CF
substrate 54, and a liquid crystal layer 53 sealed therebetween. In
such a configuration, illumination light from the backlight 51 is
modulated in accordance with a video signal in the liquid crystal
display panel 50A and displayed as video light above the CF
substrate 54 described later. FIG. 12 is a plan view showing the
configuration of the liquid crystal display panel 50A.
The backlight 51 is a light source emitting light toward the liquid
crystal layer 53 and includes a plurality of LEDs (light emitting
diodes), CCFLs (cold cathode fluorescent lamps), etc., for example.
The backlight 51 is driven by a backlight driving unit (not shown)
to control the lit and unlit states of the backlight 51.
In the liquid crystal display panel 50A, a plurality of pixels (R
(red), G (green), and B (blue) subpixels, for example) are arranged
in a matrix in an effective display area S, for example. On the TFT
substrate 52, a pixel electrode is provided for each pixel, and a
peripheral circuitry for driving the pixels for display, including
a signal line-driving circuit 52a, scanning line-driving circuit
52b, etc., for example, is provided in the periphery (frame area)
surrounding the effective display area S. A timing control unit,
backlight driving unit, and a video signal processing circuit (not
shown) for subjecting the video signal, for example, to a
predetermined correction process are also provided on the TFT
substrate 52. The scanning line-driving circuit 52b
line-sequentially drives the pixels at a predetermined timing,
while the signal line-driving circuit 52a supplies a video voltage
to the pixels on the basis of the video signal.
On the CF substrate 54, color filters and a black matrix are
provided, for example, in addition to a counter electrode common to
each pixel. On the CF substrate 54, the counter electrode and
wiring layer are formed from a transparent conductive film such as
ITO, for example. The panel substrate 10 described above can
preferably be used as the CF substrate 54. More specifically, in
the liquid crystal display panel 50A, the printed board 20 is
mounted on the light emission surface of the CF substrate 54. The
CF substrate 54 may protrude outward beyond an edge of the TFT
substrate 52, for example, and the printed board 20 may be mounted
on the surface of this protruding area of the CF substrate 54
facing the liquid crystal layer 53.
More specifically, alignment marks 12 as described above are
provided on the CF substrate 54. In this case, when the counter
electrode is formed from a transparent conductive film, the
transparent conductive film may be patterned in the frame area, for
example, with a predetermined shape as described above, i.e.,
including the annular portions 12a and groove portions 12b1, 12b2,
for example.
Note that the panel substrate 10 described above is not limited to
such a CF substrate 54, but may be any substrate that forms part of
the liquid crystal display panel 50A. The panel substrate 10 may be
formed from the TFT substrate 52, for example, as shown in FIG. 13.
The surface on which the printed board 20 is mounted is not limited
to a particular surface and may be either one of the principal
surfaces of the panel substrate 10. Alternatively, the printed
board 20 may be mounted on both principal surfaces, i.e., front and
back of the panel substrate 10.
<Application 2>
FIGS. 14A and 14B are sectional views schematically showing the
configurations of main components of the organic EL display device
according to application 2 (organic EL display device 60). The
organic EL display device (organic EL display panel) 60 has a
driving substrate 61, a sealing substrate 63, and an organic EL
layer 62 sealed therebetween. In such a configuration, a drive
current in accordance with the video signal is applied to the
organic EL layer 62 through the driving substrate 61 to emit light.
The light thus emitted is taken out as video light through the top
of the sealing substrate 63 or through the bottom of the driving
substrate 61. FIG. 14A shows a so-called top emission type light
emitting organic EL display panel in which light is taken out
through the top of the sealing substrate 63. In such an organic EL
display panel, the printed board 20 may be mounted on the sealing
substrate 63 as the panel substrate 10 described above. FIG. 14B
shows a so-called bottom emission type organic EL display panel in
which light is taken out through the bottom of the driving
substrate 61. In such an organic EL display panel, the printed
board 20 may be mounted on the driving substrate 61 as the panel
substrate 10 described above. In the bottom emission type, where
electrodes and a wiring layer are formed from a transparent
conductive film on the driving substrate 61, the alignment mark 12
may be formed from this transparent conductive film.
Note that the surface on which the printed board 20 is mounted is
not particularly limited and the printed board 20 may be mounted on
any of the principal surfaces of the sealing substrate 63 and
driving substrate 61.
<Application 3>
FIGS. 15A and 15B are sectional views schematically showing the
configurations of main components of a touch panel according to
application 3 (touch panel 70). The touch panel 70 is a capacitive
touch panel, for example, and is externally attached to a display
device 73 or the like. The touch panel 70 includes a drive-side
substrate 71, a detection-side substrate 72, and a capacitive
element formed therebetween, for example, and has electrodes and
wirings formed from a transparent conductive film on both the
drive-side substrate 71 and the detection-side substrate 72. In
such a touch panel 70, the drive-side substrate 71 (FIG. 15A) or
the detection-side substrate 72 (FIG. 15B) may be used as the panel
substrate 10 described above. The alignment mark 12 can be formed
from the transparent conductive film.
A cover glass may be bonded to a surface of such a touch panel 70,
i.e., to the upper surface of the detection-side substrate 72. The
printed board 20 may be mounted on this cover glass as the panel
substrate 10 described above.
Referring now to FIGS. 16 to 20G, applications 4 to 8 will be
described. The electronic device module 1, liquid crystal display
device 50, and organic EL display device 60 according to the above
embodiment, etc., are applicable to electronic apparatus in all
areas, such as television apparatus, digital cameras,
notebook-sized personal computers, mobile terminal devices such as
mobile telephones, or video cameras. An electronic apparatus having
a touch sensor function can be realized by incorporating the touch
panel 70 described above as a module in such an electronic
apparatus. Thus, the display apparatus according to the above
embodiment, etc., are applicable to electronic apparatus in all
areas that display internally generated or externally input video
signals as images or videos.
(Application 4)
FIG. 16 is a perspective view of a television apparatus according
to application 4. This television apparatus is equipped with a
video display screen unit 300 including a front panel 310 and a
filter glass 320, for example. The video display screen unit 300 is
equivalent to the display device according to the above embodiment,
etc.
(Application 5)
FIGS. 17A and 17B are perspective views of a digital camera
according to application 5. This digital camera is equipped with a
flash light emitting unit 410, display unit 420, menu switch 430,
and shutter button 440, for example. The display unit 420 is
equivalent to the display device according to the above embodiment,
etc.
(Application 6)
FIG. 18 is a perspective view of a notebook-sized personal computer
according to application 6. This notebook-sized personal computer
is equipped with a main body 510, keyboard 520 for inputting
characters, etc., and a display unit 530 for displaying images, for
example. The display unit 530 is equivalent to the display device
according to the above embodiment, etc.
(Application 7)
FIG. 19 is a perspective view of a video camera according to
application 7. This video camera has a main body 640, a lens 620
provided on the front side of the main body 610 for photographing
the subject, a photographing start/stop switch 630, and a display
unit 640, for example. The display unit 640 is equivalent to the
display device according to the above embodiment, etc.
(Application 8)
FIGS. 20A to 20G are perspective views of a mobile telephone
according to application 8. This mobile telephone has an upper
casing 710 and a lower casing 720 connected with each other by a
connection unit (hinge unit) 730, for example, as well as a display
740, subdisplay 750, picture light 760, and a camera 770. The
display 740 or subdisplay 750 is equivalent to the display device
according to the above embodiment, etc.
The present disclosure has been described citing the embodiment,
variations, and applications, but the present disclosure is not
limited to the above embodiment, etc., and various variations may
be made to the present disclosure. For example, the alignment mark
22 provided on the surface of the printed board 20 facing the panel
substrate 10 in the above embodiment, etc., may be provided on the
surface of the printed board 20 not facing the panel substrate
10.
Although in the above embodiment, etc., specific shapes of the
alignment marks provided on the panel substrate and printed board
are described for illustrative purposes, these alignment marks are
not limited to the shapes described above and may adopt various
shapes. For example, a configuration with a circular mark fitting
into a circular aperture of an annular portion has been described
by way of example in the above embodiment, etc., but the mark may
not necessarily be circular in shape and may be polygonal such as
square.
The embodiment of the present disclosure may have a configuration
as described in items (1) to (13) below:
(1) An electronic device module including a first substrate having
a first wiring layer and a first alignment mark transparent in a
visible region of the electromagnetic spectrum, and a second
substrate partially facing the first substrate and having a second
wiring layer and a second alignment mark facing the first alignment
mark; (2) The electronic device module according to item (1) above,
wherein the second alignment mark is opaque in the visible region
of the electromagnetic spectrum; (3) The electronic device module
according to item (1) or (2) above, wherein the first and second
alignment marks are formed from conductive films; (4) The
electronic device module according to any one of items (1) to (3)
above, wherein the first wiring layer and the first alignment mark
are formed from a conductive film and the second wiring layer and
the second alignment mark are formed from another conductive film;
(5) The electronic device module according to any one of items (1)
to (4) above, wherein the first and second alignment marks engage
with each other; (6) The electronic device module according to any
one of items (1) to (5) above, wherein one of the first and second
alignment marks has an annular portion and the other alignment mark
has a circular portion that fits into the region surrounded by the
annular portion; (7) The electronic device module according to any
one of items (1) to (6) above, wherein one of the first and second
alignment marks has one or more groove portions and the other
alignment mark has a linear portion extending in the same direction
as the one or more groove portions; (8) The electronic device
module according to any one of items (1) to (7) above, wherein two
of each of the groove portions and the linear portions are provided
and the two groove portions intersect each other in a plane
parallel to the substrate surface; (9) The electronic device module
according to any one of items (1) to (8) above, wherein the first
alignment mark has the groove portions and the second alignment
mark has the linear portions, the groove portions extending on the
first substrate and protruding outward beyond an edge of the second
substrate; (10) The electronic device module according to any one
of items (1) to (9) above, wherein the first substrate is a panel
substrate forming at least a part of a touch panel or display panel
and the second substrate is a printed board; (11) The electronic
device module according to any one of items (1) to (10) above,
wherein the first substrate forms a part of the touch panel; (12)
The electronic device module according to item (10) above, wherein
the display panel has a liquid crystal display element and a
counter substrate as the first substrate in this order on a pixel
driving substrate; and (13) The electronic device module according
to item (10) above, wherein the display panel has an organic
electroluminescent element and a sealing substrate in this order on
the pixel driving substrate, the first substrate being the pixel
driving substrate or sealing substrate located on the light
emitting side.
The present disclosure contains subject matter related to that
disclosed in Japanese Priority Patent Application JP 2011-110722
filed in the Japan Patent Office on May 17, 2011, the entire
contents of which are hereby incorporated by reference.
It should be understood by those skilled in the art that various
modifications, combinations, sub-combinations and alterations may
occur depending on design requirements and other factors insofar as
they are within the scope of the appended claims or the equivalents
thereof.
* * * * *