Temperature sensor for a leadless cardiac pacemaker Patent Grant Ostroff September 24, 2 [Ostroff; Alan]

Temperature sensor for a leadless cardiac pacemaker

Ostroff September 24, 2

Patent Grant 8543205

U.S. patent number 8,543,205 [Application Number 13/272,092] was granted by the patent office on 2013-09-24 for temperature sensor for a leadless cardiac pacemaker. This patent grant is currently assigned to Nanostim, Inc.. The grantee listed for this patent is Alan Ostroff. Invention is credited to Alan Ostroff.

United States Patent	8,543,205
Ostroff	September 24, 2013

Temperature sensor for a leadless cardiac pacemaker

Abstract

A leadless cardiac pacemaker comprises a housing, a plurality of electrodes coupled to an outer surface of the housing, and a pulse delivery system hermetically contained within the housing and electrically coupled to the electrode plurality, the pulse delivery system configured for sourcing energy internal to the housing, generating and delivering electrical pulses to the electrode plurality. The pacemaker further comprises a temperature sensor hermetically contained within the housing and adapted to sense temperature information, wherein the pacemaker can control electrical pulse delivery at least partly based on the temperature information.

Inventors:

Ostroff; Alan (Pleasanton, CA)

Applicant:

Name	City	State	Country	Type
Ostroff; Alan	Pleasanton	CA	US

Assignee:

Nanostim, Inc. (Sunnyvale, CA)

Family ID:

45925738

Appl. No.:

13/272,092

Filed:

October 12, 2011

Prior Publication Data


	Document Identifier	Publication Date
	US 20120089198 A1	Apr 12, 2012

Related U.S. Patent Documents


Application Number	Filing Date	Patent Number	Issue Date
61392382	Oct 12, 2010

Current U.S. Class:	607/21; 607/17; 607/9
Current CPC Class:	A61B 5/01 (20130101); A61N 1/36514 (20130101); A61N 1/3655 (20130101); A61N 1/37205 (20130101); A61N 1/3756 (20130101); A61B 5/686 (20130101)
Current International Class:	A61N 1/372 (20060101)
Field of Search:	;607/4,6,21,35,9,36,17 ;600/509

References Cited [Referenced By]

U.S. Patent Documents


3199508	August 1965	Roth
3212496	October 1965	Preston
3218638	November 1965	Honig
3241556	March 1966	Zacouto
3478746	November 1969	Greatbatch
3603881	September 1971	Thornton
3727616	April 1973	Lenzkes
3757778	September 1973	Graham
3823708	July 1974	Lawhorn
3830228	August 1974	Foner
3835864	September 1974	Rasor et al.
3836798	September 1974	Greatbatch
3870051	March 1975	Brindley
3872251	March 1975	Auerbach et al.
3905364	September 1975	Cudahy et al.
3940692	February 1976	Neilson et al.
3943926	March 1976	Barragan
3946744	March 1976	Auerbach
3952750	April 1976	Mirowski et al.
4027663	June 1977	Fischler et al.
4072154	February 1978	Anderson et al.
4083366	April 1978	Gombrich et al.
4102344	July 1978	Conway et al.
4146029	March 1979	Ellinwood, Jr.
4151513	April 1979	Menken et al.
4151540	April 1979	Sander et al.
4152540	May 1979	Duncan et al.
4173221	November 1979	McLaughlin et al.
4187854	February 1980	Hepp et al.
4210149	July 1980	Heilman et al.
RE30366	August 1980	Rasor et al.
4223678	September 1980	Langer et al.
4250888	February 1981	Grosskopf
4256115	March 1981	Bilitch
4296756	October 1981	Dunning et al.
4310000	January 1982	Lindemans
4318412	March 1982	Stanly et al.
4336810	June 1982	Anderson et al.
4350169	September 1982	Dutcher et al.
4374382	February 1983	Markowitz
4406288	September 1983	Horwinski et al.
4411271	October 1983	Markowitz
4418695	December 1983	Buffet
4424551	January 1984	Stevenson et al.
4428378	January 1984	Anderson et al.
4440173	April 1984	Hudziak et al.
4442840	April 1984	Wojciechowicz, Jr.
4453162	June 1984	Money et al.
4481950	November 1984	Duggan
4513743	April 1985	van Arragon et al.
4516579	May 1985	Irnich
4522208	June 1985	Buffet
4524774	June 1985	Hildebrandt
4531527	July 1985	Reinhold, Jr. et al.
4543955	October 1985	Schroeppel
4550370	October 1985	Baker
4552127	November 1985	Schiff
4552154	November 1985	Hartlaub
4562846	January 1986	Cox et al.
4586508	May 1986	Batina et al.
4606352	August 1986	Geddes et al.
4607639	August 1986	Tanagho et al.
4612934	September 1986	Borkan
4625730	December 1986	Fountain et al.
4679144	July 1987	Cox et al.
4681111	July 1987	Silvian
4681117	July 1987	Brodman et al.
4702253	October 1987	Nappholz et al.
4719920	January 1988	Alt et al.
4722342	February 1988	Amundson
4750495	June 1988	Moore et al.
4763340	August 1988	Yoneda et al.
4763655	August 1988	Wirtzfeld et al.
4787389	November 1988	Tarjan
4791931	December 1988	Slate
4793353	December 1988	Borkan
4794532	December 1988	Leckband et al.
4802481	February 1989	Schroeppel
4809697	March 1989	Causey, III et al.
4827940	May 1989	Mayer et al.
4830006	May 1989	Haluska et al.
4844076	July 1989	Lesho et al.
4846195	July 1989	Alt
4860750	August 1989	Frey et al.
4875483	October 1989	Vollmann et al.
4880004	November 1989	Baker, Jr. et al.
4883064	November 1989	Olson et al.
4886064	December 1989	Strandberg
4896068	January 1990	Nilsson
4903701	February 1990	Moore et al.
4905708	March 1990	Davies
4926863	May 1990	Alt
4974589	December 1990	Sholder
4987897	January 1991	Funke
4995390	February 1991	Cook et al.
5010887	April 1991	Thornander
5012806	May 1991	De Bellis
5014701	May 1991	Pless et al.
5040533	August 1991	Fearnot
5040534	August 1991	Mann et al.
5040536	August 1991	Riff
5042497	August 1991	Shapland
5052399	October 1991	Olive et al.
5058581	October 1991	Silvian
5065759	November 1991	Begemann
5076270	December 1991	Stutz, Jr.
5076272	December 1991	Ferek-Petric
5085224	February 1992	Galen et al.
5086772	February 1992	Larnard et al.
5088488	February 1992	Markowitz et al.
5095903	March 1992	DeBellis
5109845	May 1992	Yuuchi et al.
5111816	May 1992	Pless et al.
5113859	May 1992	Funke
5113869	May 1992	Nappholz et al.
5133350	July 1992	Duffin
5135004	August 1992	Adams et al.
5170784	December 1992	Ramon et al.
5170802	December 1992	Mehra
5179947	January 1993	Meyerson et al.
5184616	February 1993	Weiss
5193539	March 1993	Schulman et al.
5193540	March 1993	Schulman et al.
5193550	March 1993	Duffin
5217010	June 1993	Tsitlik et al.
5247945	September 1993	Heinze et al.
5259394	November 1993	Bens
5267150	November 1993	Wilkinson
5282841	February 1994	Szyszkowski
5284136	February 1994	Hauck et al.
5291902	March 1994	Carman
5300093	April 1994	Koestner et al.
5304206	April 1994	Baker, Jr. et al.
5304209	April 1994	Adams et al.
5313953	May 1994	Yomtov et al.
5318596	June 1994	Barreras et al.
5331966	July 1994	Bennett et al.
5333095	July 1994	Stevenson et al.
5336244	August 1994	Weijand
5342401	August 1994	Spano et al.
5354317	October 1994	Alt
5358514	October 1994	Schulman et al.
5373852	December 1994	Harrison et al.
5383912	January 1995	Cox et al.
5383915	January 1995	Adams
5404877	April 1995	Nolan et al.
5405367	April 1995	Schulman et al.
5406444	April 1995	Selfried et al.
5411532	May 1995	Mortazavi
5411535	May 1995	Fujii
5411537	May 1995	Munshi et al.
5417222	May 1995	Dempsey et al.
5419337	May 1995	Dempsey et al.
5431171	July 1995	Harrison et al.
5446447	August 1995	Carney et al.
5456261	October 1995	Luczyk
5466246	November 1995	Silvian
5469857	November 1995	Laurent et al.
5480415	January 1996	Cox et al.
5481262	January 1996	Urbas et al.
5522876	June 1996	Rusink
5531779	July 1996	Dahl et al.
5531781	July 1996	Alferness et al.
5531783	July 1996	Glele et al.
5539775	July 1996	Tuttle et al.
5549654	August 1996	Powell
5549659	August 1996	Johansen et al.
5551427	September 1996	Altman
5556421	September 1996	Prutchi et al.
5562717	October 1996	Tippey et al.
5571143	November 1996	Hoegnelid et al.
5571148	November 1996	Loeb et al.
5579775	December 1996	Dempsey et al.
5586556	December 1996	Spivey et al.
5591217	January 1997	Barreras
5598848	February 1997	Swanson et al.
5649952	July 1997	Lam
5650759	July 1997	Hittman et al.
5654984	August 1997	Hershbarger et al.
5662689	September 1997	Elsberry et al.
5669391	September 1997	Williams
5674259	October 1997	Gray
5676153	October 1997	Smith et al.
5693076	December 1997	Kaemmerer
5694940	December 1997	Unger et al.
5694952	December 1997	Lidman et al.
5697958	December 1997	Paul et al.
5702427	December 1997	Ecker et al.
5725559	March 1998	Alt et al.
5728154	March 1998	Crossett et al.
5730143	March 1998	Schwarzberg
5735880	April 1998	Prutchi et al.
5738102	April 1998	Lemelson
5740811	April 1998	Hedberg et al.
5741314	April 1998	Daly et al.
5766231	June 1998	Erickson et al.
5792205	August 1998	Alt et al.
5810735	September 1998	Halperin et al.
5814076	September 1998	Brownlee
5814087	September 1998	Renirie
5814089	September 1998	Stokes et al.
5824016	October 1998	Ekwall
5871451	February 1999	Unger et al.
5876353	March 1999	Riff
5876425	March 1999	Gord et al.
5891178	April 1999	Mann et al.
5899928	May 1999	Sholder et al.
5935079	August 1999	Swanson et al.
5954761	September 1999	Machek et al.
5957861	September 1999	Combs et al.
5984861	November 1999	Crowley
5987352	November 1999	Klein et al.
5995876	November 1999	Kruse et al.
5999857	December 1999	Weijand et al.
6002969	December 1999	Machek et al.
6004269	December 1999	Crowley et al.
6061596	May 2000	Richmond et al.
6076016	June 2000	Feierbach
6080187	June 2000	Alt et al.
6093146	July 2000	Filangeri
6096065	August 2000	Crowley
6102874	August 2000	Stone et al.
6112116	August 2000	Fischell et al.
6115628	September 2000	Stadler et al.
6115630	September 2000	Stadler et al.
6115636	September 2000	Ryan
6119031	September 2000	Crowley
6125290	September 2000	Miesel
6125291	September 2000	Miesel et al.
6128526	October 2000	Stadler et al.
6129751	October 2000	Lucchesi et al.
6132390	October 2000	Cookston et al.
6132456	October 2000	Sommer et al.
6134459	October 2000	Roberts et al.
6134470	October 2000	Hartlaub
6139510	October 2000	Palermo
6141584	October 2000	Rockwell et al.
6141588	October 2000	Cox et al.
6141592	October 2000	Pauly
6144866	November 2000	Miesel et al.
6148230	November 2000	KenKnight
6152882	November 2000	Prutchi
6163723	December 2000	Roberts et al.
6164284	December 2000	Schulman et al.
6167310	December 2000	Grevious
6178349	January 2001	Kieval
6178356	January 2001	Chastain et al.
6185443	February 2001	Crowley
6185452	February 2001	Schulman et al.
6185464	February 2001	Bonner et al.
6188932	February 2001	Lindegren
6190324	February 2001	Kieval et al.
6198952	March 2001	Miesel
6201993	March 2001	Kruse et al.
6208894	March 2001	Schulman et al.
6208900	March 2001	Ecker et al.
6223081	April 2001	Kerver
6230059	May 2001	Duffin
6236882	May 2001	Lee et al.
6240321	May 2001	Janke et al.
6243608	June 2001	Pauly et al.
6248080	June 2001	Miesel et al.
6263245	July 2001	Snell
6265100	July 2001	Saaski et al.
6266554	July 2001	Hsu et al.
6266564	July 2001	Hill et al.
6272379	August 2001	Fischell et al.
6280409	August 2001	Stone et al.
6289229	September 2001	Crowley
6306088	October 2001	Krausman et al.
6310960	October 2001	Saaski et al.
6315721	November 2001	Schulman et al.
6324418	November 2001	Crowley et al.
6324421	November 2001	Stadler et al.
RE37463	December 2001	Altman
6343227	January 2002	Crowley
6343233	January 2002	Werner et al.
6347245	February 2002	Lee et al.
6358202	March 2002	Arent
6361522	March 2002	Scheiner et al.
6363282	March 2002	Nichols et al.
6364831	April 2002	Crowley
6370434	April 2002	Zhang et al.
6381492	April 2002	Rockwell et al.
6381493	April 2002	Stadler et al.
6381494	April 2002	Gilkerson et al.
6383209	May 2002	Crowley
6385593	May 2002	Linberg
6386882	May 2002	Linberg
6397100	May 2002	Stadler et al.
6402689	June 2002	Scarantino et al.
6405073	June 2002	Crowley et al.
6405083	June 2002	Rockwell et al.
6409674	June 2002	Brockway et al.
6409675	June 2002	Turcott
6412490	July 2002	Lee
6418346	July 2002	Nelson et al.
6423056	July 2002	Ishikawa et al.
6424866	July 2002	Mika et al.
6428484	August 2002	Battmer et al.
6434429	August 2002	Kraus et al.
6438410	August 2002	Hsu et al.
6438417	August 2002	Rockwell et al.
6442433	August 2002	Linberg
6444970	September 2002	Barbato
6445953	September 2002	Bulkes et al.
6458145	October 2002	Ravenscroft et al.
6459928	October 2002	Mika et al.
6459937	October 2002	Morgan et al.
6466820	October 2002	Juran et al.
6468263	October 2002	Fischell et al.
6470215	October 2002	Kraus et al.
6471645	October 2002	Warkentin et al.
6472991	October 2002	Schulman et al.
6477424	November 2002	Thompson et al.
6480733	November 2002	Turcott
6482154	November 2002	Haubrich et al.
6484055	November 2002	Marcovecchio
6484057	November 2002	Ideker et al.
6490487	December 2002	Kraus et al.
6496715	December 2002	Lee et al.
6498951	December 2002	Larson et al.
6500168	December 2002	Jellie
6501983	December 2002	Natarajan et al.
6512949	January 2003	Combs et al.
6512959	January 2003	Gomperz et al.
6522926	February 2003	Kieval et al.
6522928	February 2003	Whitehurst et al.
6539257	March 2003	KenKnight
6542781	April 2003	Koblish et al.
6556860	April 2003	Groenewegen
6558321	May 2003	Burd et al.
6564807	May 2003	Schulman et al.
6567680	May 2003	Swetlik et al.
6571120	May 2003	Hutten
6574509	June 2003	Kraus et al.
6574511	June 2003	Lee
6580946	June 2003	Struble
6580948	June 2003	Haupert et al.
6584351	June 2003	Ekwall
6584352	June 2003	Combs et al.
6589187	July 2003	Dirnberger et al.
6592518	July 2003	Denker et al.
6594523	July 2003	Levine
6597948	July 2003	Rockwell et al.
6597952	July 2003	Mika et al.
6609023	August 2003	Fischell et al.
6611710	August 2003	Gomperz et al.
6615075	September 2003	Mlynash et al.
6622043	September 2003	Kraus et al.
6647292	November 2003	Bardy et al.
6648823	November 2003	Thompson
6649078	November 2003	Yu
6654638	November 2003	Sweeney
6658285	December 2003	Potse et al.
6658297	December 2003	Loeb
6658301	December 2003	Loeb et al.
6659959	December 2003	Brockway et al.
6669631	December 2003	Norris et al.
6681135	January 2004	Davis et al.
6684100	January 2004	Sweeney et al.
6687540	February 2004	Marcovecchio
6687546	February 2004	Lebel et al.
6689117	February 2004	Sweeney et al.
6690959	February 2004	Thompson
6694191	February 2004	Starkweather et al.
6695885	February 2004	Schulman et al.
6697672	February 2004	Andersson
6697677	February 2004	Dahl et al.
6699200	March 2004	Cao et al.
6702857	March 2004	Brauker et al.
6704602	March 2004	Berg et al.
6711440	March 2004	Deal et al.
6716238	April 2004	Elliott
6721597	April 2004	Bardy et al.
6728572	April 2004	Hsu et al.
6728574	April 2004	Ujhelyi et al.
6731976	May 2004	Penn et al.
6731979	May 2004	MacDonald
6733485	May 2004	Whitehurst et al.
6735474	May 2004	Loeb et al.
6735475	May 2004	Whitehurst et al.
6738670	May 2004	Almendinger et al.
6741877	May 2004	Shults et al.
6741886	May 2004	Yonce
6746404	June 2004	Schwartz
6754538	June 2004	Linberg
6760620	July 2004	Sippens Groenewegen
6764446	July 2004	Wolinsky et al.
6768923	July 2004	Ding et al.
6783499	August 2004	Schwartz
6785576	August 2004	Verness
6786860	September 2004	Maltan et al.
6792314	September 2004	Byers et al.
6799069	September 2004	Weiner et al.
6804559	October 2004	Kraus et al.
6804561	October 2004	Stover
6809507	October 2004	Morgan et al.
6811533	November 2004	Lebel et al.
6813519	November 2004	Lebel et al.
6821154	November 2004	Canfield et al.
6823217	November 2004	Rutten et al.
6824512	November 2004	Warkentin et al.
6829508	December 2004	Schulman et al.
6839596	January 2005	Nelson et al.
6848052	January 2005	Hamid et al.
6850801	February 2005	Kieval et al.
6862465	March 2005	Shults et al.
6862480	March 2005	Cohen et al.
6865420	March 2005	Kroll
6869404	March 2005	Schulhauser et al.
6871099	March 2005	Whitehurst et al.
6878112	April 2005	Linberg et al.
6879695	April 2005	Maltan et al.
6879855	April 2005	Schulman et al.
6882875	April 2005	Crowley
6889081	May 2005	Hsu
6893395	May 2005	Kraus et al.
6895279	May 2005	Loeb et al.
6895281	May 2005	Amundson et al.
6896651	May 2005	Gross et al.
6897788	May 2005	Khair et al.
6901294	May 2005	Whitehurst et al.
6901296	May 2005	Whitehurst et al.
6907285	June 2005	Denker et al.
6907293	June 2005	Grill et al.
6912420	June 2005	Scheiner et al.
6917833	July 2005	Denker et al.
6925328	August 2005	Foster et al.
6931327	August 2005	Goode, Jr. et al.
6999821	February 2006	Jenney et al.
7001372	February 2006	Richter
7023359	April 2006	Goetz et al.
7146222	December 2006	Boling
7146225	December 2006	Guenst et al.
7164950	January 2007	Kroll et al.
7181505	February 2007	Haller et al.
7187971	March 2007	Sommer et al.
7200437	April 2007	Nabutovsky et al.
7212870	May 2007	Helland
7289853	October 2007	Campbell et al.
7363090	April 2008	Halperin et al.
7558631	July 2009	Cowan et al.
7565195	July 2009	Kroll et al.
7616991	November 2009	Mann et al.
7630767	December 2009	Poore et al.
7634313	December 2009	Kroll et al.
7848823	December 2010	Drasler et al.
7937148	May 2011	Jacobson
7945333	May 2011	Jacobson
8010209	August 2011	Jacobson
2001/0031999	October 2001	Carter et al.
2002/0032467	March 2002	Shemer et al.
2002/0077686	June 2002	Westlund et al.
2002/0116028	August 2002	Greatbatch et al.
2002/0147488	October 2002	Doan et al.
2003/0141995	July 2003	Lin
2003/0158584	August 2003	Cates et al.
2003/0163184	August 2003	Scheiner et al.
2003/0199941	October 2003	Nielsen et al.
2004/0011366	January 2004	Schulman et al.
2004/0059392	March 2004	Parramon et al.
2004/0116939	June 2004	Goode
2004/0133242	July 2004	Chapman et al.
2004/0143262	July 2004	Visram et al.
2004/0147973	July 2004	Hauser
2004/0167587	August 2004	Thompson
2004/0172116	September 2004	Seifert et al.
2004/0193223	September 2004	Kramer et al.
2004/0249417	December 2004	Ransbury et al.
2004/0260349	December 2004	Stroebel
2005/0038474	February 2005	Wool
2005/0043765	February 2005	Williams et al.
2005/0075682	April 2005	Schulman et al.
2005/0096702	May 2005	Denker et al.
2005/0131478	June 2005	Kim et al.
2005/0149138	July 2005	Min et al.
2005/0165465	July 2005	Pianca et al.
2005/0267555	December 2005	Marnfeldt et al.
2005/0288722	December 2005	Eigler et al.
2006/0064149	March 2006	Belacazar et al.
2006/0085039	April 2006	Hastings et al.
2006/0085041	April 2006	Hastings et al.
2006/0085042	April 2006	Hastings et al.
2006/0105613	May 2006	Carroll
2006/0108335	May 2006	Zhao et al.
2006/0121475	June 2006	Davids et al.
2006/0135999	June 2006	Bodner et al.
2006/0136004	June 2006	Cowan et al.
2006/0161222	July 2006	Haubrich et al.
2006/0241705	October 2006	Neumann et al.
2006/0247750	November 2006	Seifert et al.
2006/0282150	December 2006	Olson et al.
2007/0016263	January 2007	Armstrong et al.
2007/0043414	February 2007	Fifer et al.
2007/0088394	April 2007	Jacobson
2007/0088396	April 2007	Jacobson
2007/0088397	April 2007	Jacobson
2007/0088398	April 2007	Jacobson
2007/0088400	April 2007	Jacobson
2007/0123923	May 2007	Lindstrom et al.
2007/0142709	June 2007	Martone et al.
2007/0179552	August 2007	Dennis et al.
2007/0270675	November 2007	Kane et al.
2007/0276004	November 2007	Hirsch et al.
2007/0276444	November 2007	Gelbart et al.
2007/0293904	December 2007	Gelbart et al.
2008/0004535	January 2008	Smits
2008/0021532	January 2008	Kveen et al.
2008/0039738	February 2008	Dinsmoor et al.
2008/0086168	April 2008	Cahill
2008/0091255	April 2008	Caparso et al.
2008/0119911	May 2008	Rosero
2008/0243218	October 2008	Bottomley et al.
2008/0269591	October 2008	Halperin et al.
2009/0082827	March 2009	Kveen et al.
2009/0082828	March 2009	Ostroff
2009/0149902	June 2009	Kumar et al.
2009/0171408	July 2009	Solem
2010/0069983	March 2010	Peacock et al.
2010/0198288	August 2010	Ostroff
2010/0249828	September 2010	Mavani et al.
2010/0292541	November 2010	Hashiba et al.
2010/0305653	December 2010	Lund et al.
2010/0305656	December 2010	Imran et al.
2010/0312332	December 2010	Forster et al.
2011/0004117	January 2011	Neville et al.
2011/0071586	March 2011	Jacobson
2011/0077708	March 2011	Ostroff
2011/0208260	August 2011	Jacobson
2011/0218587	September 2011	Jacobson
2011/0282423	November 2011	Jacobson

Foreign Patent Documents


1741465	Jan 2007	EP
05-245215	Sep 1993	JP
06/507096	Mar 2006	JP
06/516449	Jul 2006	JP
WO93/12714	Jul 1993	WO
WO2004/012811	Feb 2004	WO
WO 2006/065394	Jun 2006	WO
WO 2007/047681	Apr 2007	WO
WO 2007/059386	May 2007	WO
WO 2008/058265	May 2008	WO

Other References

US. Appl. No. 10/891,747 entitled "System and method for synchronizing supplemental pacing pulses generated by a satellite pacing device with primary pulses delivered by a separate pacing device," filed Jul. 14, 2004 (abandoned prior to pub.: CIP of this app. is U.S. Pat. 7,630,767). cited by applicant .
Beeby et al.; Micromachined silicon generator for harvesting power from vibrations; (Proceedings) PowerMEMS 2004; Kyoto, Japan; pp. 104-107; Nov. 28-30, 2004. cited by applicant .
Bordacher et al.; Impact and prevention of far-field sensing in fallback mode switches; PACE; vol. 26 (pt. II); pp. 206-209; Jan. 2003. cited by applicant .
Brandt et al.; Far-field QRS complex sensing: prevalence and timing with bipolar atrial leads; PACE; vol. 23; pp. 315-320; Mar. 2000. cited by applicant .
Brown, Eric S.; The atomic battery; Technology Review: Published by MIT; 4 pgs.; Jun. 16, 2005. cited by applicant .
Irnich et al.; Do we need pacemakers resistant to magnetic resonance imaging; Europace; vol. 7; pp. 353-365; Feb. 2005. cited by applicant .
Irnich; Electronic security systems and active implantable medical devices; Journal of PACE; vol. 25; No. 8; pp. 1235-1258; Aug. 2002. cited by applicant .
Luechinger et al.; Force and torque effects of a 1.5-tesla MRI scanner of cardiac pacemakers and ICDs; Journal of PACE; vol. 24; No. 2; pp. 199-205; Feb. 2001. cited by applicant .
Luechinger et al.; In vivo heating of pacemaker leads during magnetic resonance imaging; European Heart Journal; vol. 26; pp. 376-383; Feb. 2005. cited by applicant .
Luchinger ; Safety aspects of cardiac pacemakers in magnetic resonance imaging; Dissertation submitted to the Swiss Federal Institute of Technology Zurich; 137 pages; 2002 (month unavailable). cited by applicant .
Nyenhuis et al.; MRI and Implanted Medical Devices: Basic Interactions with an emphasis on heating; vol. 5; No. 3; pp. 467-480; Sep. 2005. cited by applicant .
Shellock et al.; Cardiac pacemaker: in vitro assessment at 1.5 T; Am Heart J; vol. 151; No. 2; pp. 436-43; Feb. 2006. cited by applicant .
Khairkhahan et al.; U.S. Appl. No. 13/272,074 entitled "Delivery catheter systems and methods," filed Oct. 12, 2011. cited by applicant .
Khairkhahan et al.; U.S. Appl. No. 13/272,082 entitled "Leadless cardiac pacemaker with anti-unscrewing feature," filed Oct. 12, 2011. cited by applicant .
Khairkhahan et al.; U.S. Appl. No. 13/324,781 entitled "Delivery Catheter Systems and Methods," filed Dec. 13, 2011. cited by applicant .
Jacobson et al.; U.S. Appl. No. 13/277,151 entitled "Leadless cardiac pacemaker with conducted communication," filed Oct. 19, 2011. cited by applicant .
Khairkhahan et al.; U.S. Appl. No. 13/324,802 entitled "Pacemaker Retrieval Systems and Methods ," filed Dec. 13, 2011. cited by applicant .
Khairkhahan et al.; U.S. Appl. No. 13/331,922 entitled "Leadless Pacemaker with Radial Fixation Mechanism ," filed Dec. 20, 2011. cited by applicant.

Primary Examiner: Stoklosa; Joseph
Attorney, Agent or Firm: Shay Glenn LLP

Parent Case Text

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Patent Application No. 61/392,382, filed Oct. 12, 2010, titled "Temperature Sensor for a Leadless Cardiac Pacemaker", which application is incorporated herein by reference in its entirety.

This application incorporates herein by reference in their entirety for all purposes the following patent applications, all by Peter M. Jacobson: U.S. Patent Publication Nos. (1) U.S.2007/0088394A1, (2) U.S.2007/0088396A1, (3) U.S.2007/0088397A1, (4) U.S.2007/0088398A1, (5) U.S.2007/0088400A1, (6) U.S.2007/0088405A1, (7) U.S.2007/0088418A1, and International Publication No. WO/2007/047681A2.

Claims

What is claimed is:

1. A leadless cardiac pacemaker comprising: a hermetic housing adapted and configured to be disposed in a chamber of a human heart; a battery disposed in the housing; at least two electrodes supported by the housing; a temperature sensor disposed in the housing but not bonded to the housing; and a controller disposed in the housing and adapted to sense intracardiac information using the two electrodes and deliver stimulation energy from the battery to the electrodes using temperature information from the temperature sensor.

2. The leadless cardiac pacemaker of claim 1 wherein the temperature sensor comprises a thermistor.

3. The leadless cardiac pacemaker of claim 2 wherein the thermistor is mounted on a header assembly of the housing.

4. The leadless cardiac pacemaker of claim 1 wherein the controller comprises an ASIC and the temperature sensor comprises a semiconductor temperature sensor incorporated into the ASIC.

5. The method of claim 1 wherein the temperature sensor is not thermally bonded to the housing.

6. A method for providing electrical pacing signals to a patient's heart comprising: sensing intracardiac information via two electrodes in contact with tissue within a chamber of the heart and supported by a hermetic housing disposed within the chamber; providing electrical stimulation signals to the heart at a stimulation rate using the electrodes; sensing temperature with a temperature sensor disposed in the housing but not bonded to the housing; and adjusting the stimulation rate of electrical stimulation signals using a controller disposed within the housing based on the temperature.

7. The method of claim 6 wherein the sensing step comprises sensing the temperature with a thermistor.

8. The method of claim 7 wherein the sensing step comprises sensing the temperature with a thermistor mounted on a header assembly of the housing.

9. The method of claim 6 wherein the sensing step comprises sensing the temperature with a semiconductor temperature sensor incorporated into an ASIC containing the controller.

10. The method of claim 6 wherein the temperature sensor is not thermally bonded to the housing.

Description

INCORPORATION BY REFERENCE

All publications and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference.

FIELD

This disclosure generally relates to leadless cardiac pacemakers. More specifically, this disclosure describes the use of temperature sensors in leadless cardiac pacemakers.

BACKGROUND

Cardiac pacing by an artificial pacemaker provides an electrical stimulation of the heart when the heart's own natural pacemaker and/or conduction system fails to provide synchronized atrial and ventricular contractions at rates and intervals sufficient for a patient's health. Such antibradycardial pacing provides relief from symptoms and even life support for hundreds of thousands of patients.

The rate of stimulation provided by a pacemaker may need to be adjusted to match the level of the patient's physical activity. Prior rate responsive pacemakers have relied on, among other parameters, central venous temperature to indicate the need to adjust stimulation rates up or down. Prior devices often used temperature sensors connected to the pacemaker body by a lead extending from the pacemaker body's location outside of the heart to a temperature sensor located within the patient's heart. Two examples of prior rate-responsive pacemakers may be found in U.S. Pat. No. 5,411,535 and U.S. Patent Publication No. 2007/0088400.

SUMMARY OF THE DISCLOSURE

In one embodiment, a leadless cardiac pacemaker is provided comprising a hermetic housing adapted and configured to be disposed in a chamber of a human heart, a battery disposed in the housing, at least two electrodes supported by the housing, a temperature sensor supported by the housing, and a controller disposed in the housing and adapted to sense intracardiac information using the two electrodes and deliver stimulation energy from the battery to the electrodes using temperature information from the temperature sensor.

In some embodiments, the temperature sensor comprises a thermistor. In one embodiment, the thermistor is bonded to an interior surface of the housing. In some embodiments, the thermistor is mounted on a header assembly of the housing.

In one embodiment of the pacemaker, the controller comprises an ASIC and the temperature sensor comprises a semiconductor temperature sensor incorporated into the ASIC.

In one embodiment, the leadless cardiac pacemaker further comprises a bonded thermal path between the temperature sensor and the housing. In one embodiment, the bonded thermal path is a thermal pad.

In some embodiments, the temperature sensor is disposed within the housing. In other embodiments, the temperature sensor is not directly attached to the housing. In yet another embodiment, the temperature sensor is disposed outside of the can.

A method for providing electrical pacing signals to a patient's heart is also provided, comprising sensing intracardiac information via two electrodes in contact with tissue within a chamber of the heart and supported by a hermetic housing disposed within the chamber, providing electrical stimulation signals to the heart at a stimulation rate using the electrodes, sensing temperature with a temperature sensor supported by the housing, and adjusting the stimulation rate of electrical stimulation signals using a controller disposed within the housing based on the temperature.

In some embodiments, the sensing step comprises sensing the temperature with a thermistor. In other embodiments, the sensing step comprises sensing the temperature with a thermistor bonded to an interior surface of the housing. In additional embodiments, the sensing step comprises sensing the temperature with a thermistor mounted on a header assembly of the housing. In yet another embodiment, the sensing step comprises sensing the temperature with a semiconductor temperature sensor incorporated into an ASIC containing the controller. In another embodiment, the sensing step comprises sensing the temperature with a temperature sensor disposed within the housing. In one embodiment, the sensing step comprises sensing the temperature with a temperature sensor disposed outside the housing.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features of the invention are set forth with particularity in the claims that follow. A better understanding of the features and advantages of the present invention will be obtained by reference to the following detailed description that sets forth illustrative embodiments, in which the principles of the invention are utilized, and the accompanying drawings of which:

FIG. 1 shows a leadless cardiac pacemaker including a temperature sensor.

FIG. 2 illustrates a temperature sensor disposed within a hermetic housing of a leadless cardiac pacemaker.

FIG. 3 illustrates a semiconductor temperature sensor integrated into an ASIC in a leadless cardiac pacemaker.

FIG. 4 illustrates another embodiment of a semiconductor temperature sensor integrated into an ASIC in a leadless cardiac pacemaker.

FIGS. 5A and 5B illustrate one embodiment of a leadless cardiac pacemaker with a thermistors temperature sensor.

FIG. 6 is one embodiment of a thermal circuit for use in a leadless cardiac pacemaker.

FIG. 7 illustrates a thermal model based on the thermal circuit of FIG. 6.

FIG. 8 illustrates a thermal model based on one embodiment of the temperature sensor of FIGS. 5A-5B.

FIG. 9 illustrates a thermal model based on another embodiment of the temperature sensor of FIGS. 5A-5B.

FIG. 10 illustrates a thermal model based on yet another embodiment the temperature sensor of FIGS. 5A-5B.

FIG. 11 illustrates a thermal model based on one embodiment of the temperature sensor of FIGS. 5A-5B.

FIG. 12 illustrates a thermal model based on another embodiment of the temperature sensor of FIGS. 5A-5B.

FIG. 13 is another embodiment of a thermal circuit for use in a leadless cardiac pacemaker.

FIG. 14 illustrates a thermal model based on the thermal circuit of FIG. 13.

DETAILED DESCRIPTION OF THE INVENTION

This disclosure relates to a rate responsive leadless cardiac pacemaker or other leadless biostimulator. The leadless biostimulator can be implanted within a chamber of the patient's heart. Instead of measuring central venous temperature using a temperature sensor on a lead extending from the biostimulator housing, embodiments of the rate responsive leadless biostimulator of this disclosure can employ a temperature sensor supported by the biostimulator housing. The leadless biostimulator of this disclosure can use the measured temperature to adjust the rate of its electrical stimulation signals using a controller disposed within the housing.

Some embodiments of a leadless biostimulator may include a hermetic housing disposed in a chamber of a human heart, a battery disposed in the housing, at least two electrodes supported by the housing, a temperature sensor supported by the housing and a controller disposed in the housing. The controller can be adapted to sense intracardiac information using the two electrodes and to deliver stimulation energy from the battery to the electrode using temperature information from the temperature sensor. The temperature sensor may be supported by the leadless biostimulator housing in any manner consistent with the thermal time constant requirements of the system. The temperature sensor may be a thermistor or a semiconductor temperature sensor incorporated into the controller.

In order to use central venous temperature as the metabolic parameter for a rate response algorithm, the leadless biostimulator may be able to sense and respond to changes in central venous temperatures within a clinically significant period of time, such as less than 30 seconds. Since the leadless biostimulator will be disposed in contact with the patient's blood within the patient's heart, the biostimulator design can provide a heat conduction path from the blood to the temperature sensing element whose time constant is sufficiently small to allow the sensor to reach its final value within the chosen clinically significant time. Thus, for example, if the desired clinically significant time is 30 seconds, the thermal time constant of the temperature sensing components might be chosen to be 10 seconds.

FIG. 1 shows a leadless cardiac pacemaker or leadless biostimulator 1. Biostimulator 1 can include a housing 6 having a header section 2 made from an electrically insulating material and extending from a hermetic can 3 and 4 made from, e.g., titanium. Can section 3 can be electrically insulated, and can section 4 may not insulated so that it can serve as an electrode. An electronics compartment within the cans 3 and 4 can contain the electronic components necessary for operation of the biostimulator, including a battery and a controller. A helical fixation device 5 can extend through a passage in can 3 into and through header 2 as shown. In some embodiments, the fixation device 5 can comprise an electrode, and in other embodiments a distal electrode can be separate from the helical fixation device. Other details of leadless biostimulators may found in the copending applications referenced above and incorporated by reference herein.

In the embodiment of FIG. 1, a thermistor 7 can disposed in header 2. The thermistors can include at least two thermistors leads for electrically connecting the thermistors 7 to the controller of the leadless biostimulator. In this embodiment, at least one of the thermistor leads can extend through a feedthrough in can section 3 to a controller within the can. The other thermistor lead may be electrically connected to the can, or can alternatively pass through a feedthrough into the interior of the can. In this embodiment, thermistor 7 can be in contact with an interior surface of header 2 and thus can be in thermal contact with blood surrounding the biostimulator through header 2. The controller inside housing 6 can be adapted to sense intracardiac information using electrodes 4 and 5 and to deliver stimulation energy from the battery to electrodes on the leadless biostimulator using temperature information from the thermistor 7. In some embodiments, the rate of stimulation provided by a pacemaker may need to be adjusted to match the level of the patient's physical activity or temperature. For example, the temperature information can determine the temperature of the patient and adjust the rate of stimulation to account for temperature variations due to fever or exercise.

In the embodiment of FIG. 2, the temperature sensor can be a thermistor 126 disposed within a hermetic can 100 of the housing. As shown in this cross-sectional view, thermistor 126 can be bonded so as to be thermally connected to an inside surface of hermetic can 100, and the thermistors can connect to ASIC controller 120 via leads 128 and substrate 124. Thus, thermistor 126 can be configured to sense the temperature of blood surrounding the biostimulator through housing 100. Other elements within hermetic can 100 include the ASIC substrate 124, other electronic components 122, and a battery (not shown). At least two electrodes can be supported by, and exterior to, the housing as in the embodiment of FIG. 1. In some embodiments, the ASIC 120 can be adapted to sense intracardiac information using the electrodes and to deliver stimulation energy from the battery to one of the electrodes using temperature information from the thermistor 126.

In the embodiment of FIG. 3, the temperature sensor can be a semiconductor temperature sensor integrated into ASIC 124. A thermally conductive pad 125 can extend from the temperature sensor in ASIC 124 to an interior surface of housing 100. Thus, the temperature sensor can sense the temperature of blood surrounding the biostimulator through housing 100 with conductive pad 125. As in the embodiment of FIG. 2, at least two electrodes can be supported by, and exterior to, the housing. The ASIC 120 can be adapted to sense intracardiac information using the electrodes and to deliver stimulation energy from the battery to one of the electrodes using temperature information from the integrated temperature sensor.

The embodiment of FIG. 4 is similar to that of FIG. 3, but omits the thermally conductive pad. Thus, the temperature sensor integrated into ASIC 120 senses the temperature of blood surrounding the biostimulator via the thermal resistance between the ASIC 120 and the can 100. Similarly, in this embodiment, the ASIC 120 can be adapted to sense intracardiac information using the electrodes and to deliver stimulation energy from the battery to one of the electrodes using temperature information from the integrated temperature sensor.

EXAMPLE 1

Tests were conducted to see how thermal response times compared among some of these embodiments. FIGS. 5A and 5B show a first prototype assembly having a housing 200 made from a tube capped off at ends 202 and 204 with silicone. The tube can be an 8 mm stainless steel tube, for example. A thermistor 206 was encapsulated with cyanoacrylate to bond it to the inside of housing 200 within the silicone at end 204. Silicone grease was applied between the thermistor and the housing wall contact point. Wires 208 extending from thermistor 206 were insulated. The cavity 210 within housing 200 was filled with water. Housing 200 had a 7 mm diameter and 25.5 mm length. The silicone at end 204 extended 6.5 mm into housing 200.

Two beakers were filled with 500 ml of distilled water and immersed a thermistor in each beaker to monitor temperature. The second beaker was then placed on a hot plate/stirrer and the temperature was adjusted approximately 10.degree. C. higher than the first beaker. The stirrer ran to agitate the solution. The prototype assembly was immersed in the first beaker for at least 5 minutes and transferred the prototype assembly to the second beaker in less than 1 second. The temperature was recorded from all three sensors (one on each beaker and one on the prototype assembly) for a sample rate greater or equal to 1 second/sample for at least 1 minute after transferring the prototype assembly to the second beaker. It was verified that the temperature in the second beaker does not change by more than 5% during the course of the procedure.

The measured temperatures were compared with a thermal model based on the thermal circuit shown in FIG. 6. The results are shown in FIG. 7. The model time constants are derived by minimizing the RMS error in Tm(t)-Tt(t) over all time. For each experiment the derived time constants are given. In this case the thermal time constant between the bath and thermistor was determined to be 4.3 seconds.

Let: t=time since immersion in bath; Th=bath temperature; Tc=start temperature; Tm(t)=thermistor temperature, measured; Tt(t)=thermistor temperature, simulated; Te(t)=adhesive+silicone temperature, simulated; .tau.bt=bath-to-thermistor time constant; .tau.be=bath-to-adhesive+silicone time constant; .tau.te=thermistor-to-adhesive+silicone time constant.

Then:

.function.e.tau..times..times. ##EQU00001## .function.e.tau..times..times. ##EQU00001.2## .function..times..times..function..times..times..function..times..times..- tau..times..times..times..times..times..function..times..times..tau..times- ..times..times..times..times..times. ##EQU00001.3##

EXAMPLE 2

Another test was conducted using a prototype similar to that of FIGS. 5A-5B but using much less cyanoacrylate adhesive to bond the thermistor to the can. The same test protocol was used as in Example 1. The results are shown in FIG. 8. The thermal time constant between the bath and thermistor was determined to be 3.0 seconds.

EXAMPLE 3

A test was conducted using the test protocol of Example 1 with a prototype similar to that of FIGS. 5A-5B but filled with air instead of water. The results are shown in FIG. 9. The thermal time constant between the bath and thermistor was determined to be 4.0 seconds and therefore the thermal mass of the battery is not expected to greatly change these results.

EXAMPLE 4

A test was conducted using the test protocol of Example 1 with a prototype similar to that of FIGS. 5A-5B but with an air gap between the silicone plug and the adhesive/thermistor, and using only a very small amount of cyanoacrylate adhesive to bond the thermistor to the can. The results are shown in FIG. 10. The thermal time constant between the bath and thermistor was determined to be 3.4 seconds.

EXAMPLE 5

A test was conducted using the test protocol of Example 1 with a prototype similar to that of FIGS. 5A-5B but with the thermistor floating in, not bonded to, the can and with the can filled with air instead of water. The results are shown in FIG. 11. The thermal time constant between the bath and thermistor was also determined to be 5.5 seconds.

EXAMPLE 6

A test was conducted using the test protocol of Example 1 with a prototype similar to that of FIGS. 5A-5B but with the thermistor floating in the can, with the insulated wires leading from the thermistor contained within a straw to further insulate the wires from the bath temperature, and with the can filled with air instead of water. The results are shown in FIG. 12. The thermal time constant between the bath and thermistor was determined to be 11.8 seconds.

EXAMPLE 7

A test was conducted using the test protocol of Example 1 with a prototype similar to that of FIGS. 5A-5B but with the thermistor bonded to a semiconductor chip within the can. The chip dimensions were 4 mm.times.5 mm.times.20 mils. The semiconductor/thermistor assembly was wrapped in one layer of polyimide tape, and the thermistor wires were thermally insulated from the bath using a straw. The can was filled with air, not with water. In this simulation, the model was altered to allow the semiconductor chip (simulating an ASIC) to gain heat from the bath at a first time constant, the thermistor to gain heat from the ASIC at a second time constant, and the thermistor to lose heat to the wires at a third time constant. The thermal model is shown in FIG. 13. The results of this test are shown in FIG. 14. The bath to ASIC time constant was determined to be 12.9 seconds. This test suggests that the thermal time constant between an integrated AISC thermal sensor with no specific thermal connection between the can and ASIC provides acceptable thermal results within the housing of a leadless cardiac pacemaker.

In some embodiments, the temperature sensor may be a thermistor, a semiconductor temperature sensor, or part of an ASIC containing the controller. The sensed temperature is used by the leadless stimulator control circuitry to adjust a rate of electrical stimulation provided by the biostimulator to the patient's heart.

The temperature sensor may sense temperate in a range between 36.degree. C. to 42.degree. C. The low end of the temperature range allows for normal body temperature (37.degree. C.), less circadian variations and less a dip in temperature due to exercise. The high end of the temperature range allows for normal body temperature, plus fever, plus the increase in temperature due to exercise. The resolution may be about 0.023.degree. C. This represents better than 1/5.sup.th of the smallest anticipated dip amplitude during exercise (0.15.degree. C.).

Unless defined otherwise, all technical terms used herein have the same meanings as commonly understood by one of ordinary skill in the art of cardiac technologies. Specific methods, devices, and materials may be described in this application, but any methods and materials similar or equivalent to those described herein can be used in the practice of the present invention. While embodiments of the invention have been described in some detail and by way of exemplary illustrations, such illustration is for purposes of clarity of understanding only, and is not intended to be limiting. Various terms have been used in the description to convey an understanding of the invention; it will be understood that the meaning of these various terms extends to common linguistic or grammatical variations or forms thereof. It will also be understood that when terminology referring to devices, equipment, or drugs that have been referred to by trade names, brand names, or common names, that these terms or names are provided as contemporary examples, and the invention is not limited by such literal scope. Terminology that is introduced at a later date that may be reasonably understood as a derivative of a contemporary term or designating of a hierarchal subset embraced by a contemporary term will be understood as having been described by the now contemporary terminology. Further, while some theoretical considerations have been advanced in furtherance of providing an understanding of the invention, the claims to the invention are not bound by such theory. Moreover, any one or more features of any embodiment of the invention can be combined with any one or more other features of any other embodiment of the invention, without departing from the scope of the invention. Still further, it should be understood that the invention is not limited to the embodiments that have been set forth for purposes of exemplification, but is to be defined only by a fair reading of claims that are appended to the patent application, including the full range of equivalency to which each element thereof is entitled.

* * * * *