U.S. patent number 8,542,082 [Application Number 12/782,822] was granted by the patent office on 2013-09-24 for high-impedance line and detecting system having the same.
This patent grant is currently assigned to Hon Hai Precision Industry Co., Ltd., Tsinghua University. The grantee listed for this patent is Zheng-He Feng, Xu Gao, Zhan Li, Steven-Philip Marcher, Yong Yan, Zhi-Jun Zhang. Invention is credited to Zheng-He Feng, Xu Gao, Zhan Li, Steven-Philip Marcher, Yong Yan, Zhi-Jun Zhang.
United States Patent |
8,542,082 |
Gao , et al. |
September 24, 2013 |
High-impedance line and detecting system having the same
Abstract
A high-impedance line includes a plurality of windings
successively arranged. Each of the windings includes an upper
portion and a lower portion parallel to the upper portion. The
upper portions of each of the windings are electrically connected
to the lower portions of adjacent windings. A resistance unit
electrically connected between every two adjacent windings.
Inventors: |
Gao; Xu (Beijing,
CN), Zhang; Zhi-Jun (Beijing, CN), Feng;
Zheng-He (Beijing, CN), Marcher; Steven-Philip
(Beijing, CN), Li; Zhan (Beijing, CN), Yan;
Yong (Beijing, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Gao; Xu
Zhang; Zhi-Jun
Feng; Zheng-He
Marcher; Steven-Philip
Li; Zhan
Yan; Yong |
Beijing
Beijing
Beijing
Beijing
Beijing
Beijing |
N/A
N/A
N/A
N/A
N/A
N/A |
CN
CN
CN
CN
CN
CN |
|
|
Assignee: |
Tsinghua University (Beijing,
CN)
Hon Hai Precision Industry Co., Ltd. (New Taipei,
TW)
|
Family
ID: |
43924778 |
Appl.
No.: |
12/782,822 |
Filed: |
May 19, 2010 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20110102113 A1 |
May 5, 2011 |
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Foreign Application Priority Data
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Oct 30, 2009 [CN] |
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2009 1 0110162 |
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Current U.S.
Class: |
333/245;
333/236 |
Current CPC
Class: |
H01P
3/00 (20130101) |
Current International
Class: |
H01P
1/00 (20060101); H01P 3/00 (20060101) |
Field of
Search: |
;333/236,237,24R,238,245,246 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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0400885 |
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Dec 1990 |
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EP |
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380101 |
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Sep 1932 |
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GB |
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207834 |
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Jun 1993 |
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TW |
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M294675 |
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Jul 2006 |
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TW |
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200938017 |
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Sep 2009 |
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TW |
|
200941937 |
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Oct 2009 |
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TW |
|
Other References
Tables of AWG wire sizes, used since 1857,
http://en.wikipedia.org/wiki/American.sub.--wire.sub.--gauge. cited
by examiner.
|
Primary Examiner: Takaoka; Dean O
Assistant Examiner: Wong; Alan
Attorney, Agent or Firm: Altis & Wispro Law Group,
Inc.
Claims
What is claimed is:
1. A high-impedance line, comprising: a plurality of windings
successively arranged, each of the windings comprising an upper
portion and a lower portion parallel to the upper portion; the
upper portions of each of the windings being electrically connected
to the lower portions of adjacent windings; and a plurality of
resistance units, each of the plurality of resistance units being
electrically connected between two adjacent windings.
2. The line as claimed in claim 1, wherein a length of each of the
upper portions is less than or equal to 10 millimeters, and a
length of each of the lower portions is less than or equal to 10
millimeters.
3. The line as claimed in claim 1, wherein a diameter of each of
the upper portions is less than or equal to 0.2 millimeters, and a
diameter of each of the lower portions is less than or equal to 0.2
millimeters.
4. The line as claimed in claim 1, wherein in each of the windings,
a distance between the upper portion and the lower portion is less
than or equal to 2 millimeters.
5. The line as claimed in claim 1, wherein the upper portions are
substantially collinear, and the lower portions are substantially
collinear.
6. The line as claimed in claim 1, further comprising a first
connective portion electrically connected between every two
adjacent windings.
7. The line as claimed in claim 6, wherein in each two adjacent
windings, two adjacent upper portion and lower portion are
connected with one resistance unit, and the other two adjacent
upper portion and lower portion are connected with one connective
portion.
8. The line as claimed in claim 1, wherein a resistance of each of
the plurality of resistance units is greater than 500 ohms.
9. The line as claimed in claim 1, wherein about half of the amount
of the upper portions are electrically connected with about half of
the amount of the lower portions to define a first transmission
line, the other upper portions are electrically connected with the
other lower portions to define a second transmission line; in each
two adjacent resistance units, one of the two adjacent resistance
units is electrically connected to the first transmission line, and
the other one of the two adjacent resistance units is electrically
connected to the second transmission line.
10. The line as claimed in claim 9, wherein the resistance units
electrically connected to the first transmission line and the
resistance units electrically connected to the second transmission
line are alternatively arranged.
11. The line as claimed in claim 9, wherein the number of the
resistance units electrically connected to the first transmission
line is equal to the number of the resistance units electrically
connected to the second transmission line.
12. A high-impedance line, comprising: a first transmission line; a
second transmission line intersected with the first transmission
line to form more than two windings; and a resistance unit
electrically connected between two adjacent windings.
13. The line as claimed in claim 12, wherein a resistance of the
first transmission line is substantially equal to a resistance of
the second transmission line.
14. The line as claimed in claim 12, wherein one resistance unit of
two adjacent resistance units is electrically connected to the
first transmission line, and the other resistance unit of the two
adjacent resistance units is electrically connected to the second
transmission line.
15. The line as claimed in claim 12, wherein the first transmission
line comprises a plurality of first portions; a first connective
portion connects two adjacent first portions; the second
transmission line comprises a plurality of second portions; a
second connective portion connects two adjacent second portions;
each of the first connective portions intersects one second
connective portion.
16. A detecting system, comprising: a signal detecting device for
detecting RF signals; a signal processing device; and a
high-impedance line electrically connected to the signal detecting
device and the signal processing device, the high-impedance line
comprising a plurality of windings successively arranged; wherein
each of the windings comprises a first portion and a second
portion; the first portions of two adjacent windings are
electrically connected to each other via a first resistance unit;
the second portions of two adjacent windings are electrically
connected to each other via a second resistance unit.
Description
CROSS-REFERENCE
This application claims all benefits accruing under 35 U.S.C.
.sctn.119 from China Patent Application No. 200910110162.X, filed
on Oct. 30, 2009 in the China Intellectual Property Office, the
disclosure of which is incorporated herein by reference.
BACKGROUND
1. Technical Field
The present disclosure relates to a high-impedance line and a
detecting system having the same.
2. Description of Related Art
Generally, a high-impedance line configured for shielding high
frequency signals includes two high-impedance transmission lines
parallel to each other. The high-impedance transmission lines are
formed by spraying several high impedance materials such as ferrite
and silicon repeatedly. Thus, a cost of the high-impedance line is
increased.
What is needed therefore, is a high-impedance line with low
cost.
BRIEF DESCRIPTION OF THE DRAWINGS
Many aspects of the embodiments can be better understood with
references to the following drawings. The components in the
drawings are not necessarily drawn to scale, the emphasis instead
being placed upon clearly illustrating the principles of the
embodiments. Moreover, in the drawings, like reference numerals
designate corresponding parts throughout the several views.
FIG. 1 is a schematic structural view of one embodiment of a
detecting system.
FIG. 2 is a schematic structural view of one embodiment of a
high-impedance line.
FIG. 3 is a schematic structural view of the high-impedance line,
in which resistance units of the high-impedance line are not shown
for clarity.
FIG. 4 is an exposed view of the high-impedance line shown in FIG.
2.
FIG. 5 is an equivalent circuit diagram of a distributed inductance
connected to the high-impedance line.
FIG. 6 is an equivalent circuit diagram of a distributed
capacitance connected to the high-impedance line.
FIG. 7 is an equivalent circuit diagram of the high-impedance
line.
DETAILED DESCRIPTION
The disclosure is illustrated by way of example and not by way of
limitation in the figures of the accompanying drawings in which
like references indicate similar elements. It should be noted that
references to "an" or "one" embodiment in this disclosure are not
necessarily to the same embodiment, and such references mean at
least one.
Referring to FIG. 1, a detecting system 100 includes a
high-impedance line 10, a circuit board 20, a signal detecting
device 30 and a signal processing device 40. The high-impedance
line 10, the signal detecting device 30, and the signal processing
device 40 are disposed on the circuit board 20. One end of the
high-impedance line 10 is electrically connected to the signal
detecting device 30, and the other opposite end of the
high-impedance line 10 is electrically connected to the signal
processing device 40.
Referring to FIG. 2, the high-impedance line 10 includes a first
transmission line 11 and a second transmission line 12 insulated
from the first transmission line 11. Both the first and second
transmission lines 11 and 12 can be disposed on the circuit board
20. The first transmission line 11 can intersect with the second
transmission line 12 many times to form a plurality of windings 13.
In one embodiment, the high-impedance line 10 includes ten windings
13.
Referring to FIG. 3 and FIG. 4, the first transmission line 11 can
include a plurality of first upper portions 111a, a plurality of
first lower portions 111b, a plurality of first connective portions
112, and a plurality of first resistance units 113. The first upper
portions 111a and the first lower portions 111b can be parallel to
each other. The first upper portions 111a align with each other,
and the first lower portions 111b align with each other. Two
adjacent first upper portions 111a and first lower portion 111b can
be electrically connected to each other by one first connective
portion 112 or by one first resistance unit 113. A distance between
two adjacent and disconnected first lower portions 111b can be
larger than a length of each of the first upper and lower portions
111a and 111b. A distance between two adjacent and two disconnected
first upper portions 111a can be larger than the length of each of
the first upper and lower portions 111a and 111b. One first
resistance unit 113 can replace each of the first connective
portions 112. Alternatively, one first resistance unit 113 can be
disposed on each of the first connective portions 112. In one
embodiment, as shown in FIG. 2, about half of the first resistance
units 113 are electrically connected to adjacent first upper
portion 111a and first lower portion 111b, and about half of the
first connective portions 112 are electrically connected to the
adjacent first upper portions 111a and first lower portions 111b.
The first connective portions 112 and the first resistance units
113 can be electrically connected to the first transmission line 11
alternatively. In one embodiment, the first upper portions 111a and
the first lower portions 111b are substantially parallel to each
other. A distance between every two adjacent first upper portions
111a and first lower portions 111b can be substantially the
same.
The first upper and lower portions 111a and 111b and the first
connective portions 112 can include a conductive material such as
metal, conductive polymers, metallic carbon nanotubes, and indium
tin oxide (ITO). In one embodiment, the conductive material is a
metallic material such as gold, silver, copper. The first upper and
lower portions 111a and 111b and the first connective portions 112
can have a strip shape, rod shape, bar shape, wire shape, or yarn
shape. For example, the first upper and lower portions 111a and
111b and the first connective portions 112 can be metal wires, or
metal strips. The first upper and lower portions 111a and 111b and
the first connective portions 112 can also be metal strip shaped
films or layers printed on the circuit board 20. The first upper
and lower portions 111a and 111b and the first connective portions
112 can be formed by means of screen printing or spraying. A length
of each of the first upper and lower portions 111a and 111b can be
less than or equal to 10 millimeters. A diameter or a thickness of
each of the first upper and lower portions 111a and 111b can be
less than or equal to 0.2 millimeters. A resistance of each of the
first resistance units 113 can be greater than or equal to 500
ohms. In one embodiment, the resistance of each of the first
resistance units 113 is greater than or equal to 1000 ohms.
The second transmission line 12 can have the same structure, shape,
material and size as the first transmission line 11. The second
transmission 12 can include a plurality of second upper and lower
portions 121a and 121b, a plurality of second connective portions
122, and a plurality of second resistance units 123. A second
connective portion 122 or a second resistance unit 123 can
electrically connect two adjacent second upper and lower portion
121a and 121b to each other. Referring to FIG. 2 and FIG. 3, the
first upper portions 111a and the second lower portions 121b can be
parallel to and correspond to each other. The first lower portions
111b and the second upper portions 121a can be parallel to and
correspond to each other. The second upper and lower portions 121a
and 121b can have the same structure, shape, material, length, and
diameter as the first upper and lower portions 111a, 111b. The
second connective portions 122 and the first connective portions
112 can be parallel to and correspond to each other. The second
connective portions 122 can have the same structure, shape,
material and size as the first connective portions 112. The second
resistance units 123 and the first resistance units 113 can
correspond to each other. The second resistance units 123 can have
the same structure, shape, material, size and resistance as the
first resistance units 113. The second connective portions 122 or
the second resistance units 123 can intersect with the first
connective portions 112 or the first resistance units 113 to form
the windings 13 of the high-impedance line 10.
Each of the windings 13 can include one first upper portion 111a
and one second lower portion 121b parallel to the first upper
portion 111a, or include one first lower portion 111b and one
second upper portion 121a. A distance between the first upper
portion 111a and the second lower portion 121b corresponding to the
same winding 13 can be less than or equal to 2 millimeters. A
distance between the first lower portion 111b and the second upper
portion 121a corresponding to the same winding 13 can be less than
or equal to 2 millimeters. In one embodiment, the distance between
the first upper portion 111a and the second lower portion 121b is
less than or equal to 0.2 millimeters, and the distance between the
first lower portion 111b and the second upper portion 121a is less
than or equal to 0.2 millimeters. The first resistance units 113
and the second resistance units 123 can be disposed between the
windings 13. A number of the first resistance units 113 can be
equal to a number of the second resistance units 123; thus, a
resistance of the first transmission line 11 can be equal to a
resistance of the second transmission line 12. In one embodiment,
the first resistance units 113 and the second resistance units 123
are alternately disposed between windings 13. A resistance of each
of the windings 13 can be substantially equal to each other to
ensure each of the windings 13 can have a determined
resistance.
When the high-impedance line 10 is in operation and receives a
radio frequency signal (RF signal), the high-impedance line 10
defines a distributed inductance and a distributed capacitance
therein. The distributed inductance can be formed among the first
upper and lower portions 111a and 111b and the second upper and
lower portions 121a and 121b. The distributed capacitance can be
formed between the first upper portions 111a, and the second lower
portions 121b, or formed between the first lower portions 111b and
the second upper portions 121a.
An equivalent circuit diagram of the distributed inductance, and
the first upper and lower portions 111a and 111b and the second
upper and lower portions 121a, 121b can be shown in FIG. 5. An
inductance of the distributed inductance can be defined as L, and a
frequency of the RF signal can be defined as .omega., a reactance
formed by the distributed inductance can be shown by the formula
Z=j.omega.t. Thus, the greater the frequency .omega. of the RF
signals, the greater the reactance Z formed by the distributed
inductance, and the greater the impedance of the high-impedance
line 10.
An equivalent circuit diagram of the distributed capacitance, and
the first upper portions 111a and the second lower portions 121b
can be shown in FIG. 6. An capacitance of the distributed
inductance can be defined as C; a reactance Z formed by the
distributed capacitance can be shown by the formula
.omega..times..times. ##EQU00001## Thus, the greater the frequency
.omega. of the RF signals, the less the reactance Z formed by the
distributed capacitance, and the greater the impedance of the
high-impedance line 10.
An equivalent circuit diagram of the high-impedance line 10 can be
shown in FIG. 7. The impedance of the high-impedance line 10 formed
by the distributed inductances, the distributed capacitances, the
first resistance units 113, and the second resistance units 123,
can be increased with the frequency .omega. of the RF signal. Thus,
the high-impedance line 100 can be capable of shielding high
frequency signals in RF signals. In one embodiment, the
high-impedance line 100 is capable of shielding signals with a
frequency substantially greater than 850 MHZ.
The circuit board 20 can be configured for fixing the
high-impedance line 10. The first upper and lower portions 111a and
111b, the second upper and lower portions 121a and 121b and the
first and second connective portions 121 and 122 can be fixed on
the circuit board 20 by means of printing or welding. The first and
second resistance units 113 and 123 can be fixed on the circuit
board 20 by means of welding or adhering. The circuit board 20 can
be a panel or a printed circuit board (PCB). In one embodiment, the
circuit board 20 is the PCB. The PCB can provide electrical
connection among the high-impedance line 100 and other electrical
elements such as the signal detecting device 30, and the signal
processing device 40.
The signal detecting device 30 can be configured for detecting RF
signals and inputting the RF signals to the high-impedance line 10.
The high-impedance line 10 can converted the RF signals to signal
envelops. The signal detecting device 30 can be a Hearing Aid
Compatibility (HAC) probe or a detecting device detecting RF
signals.
The signal processing device 40 can be configured for receiving
signal envelopes converted by the high-impedance line 10. The
signal processing device 40 can be an Analog-digital converter
(ADC), a central processing unit (CPU) or other data-processing
equipment.
Finally, it is to be understood that the above-described
embodiments are intended to illustrate rather than limit the
disclosure. Variations may be made to the embodiments without
departing from the spirit of the disclosure as claimed. Elements
associated with any of the above embodiments are envisioned to be
associated with any other embodiments. The above-described
embodiments illustrate the scope of the disclosure but do not
restrict the scope of the disclosure.
* * * * *
References