U.S. patent number 7,835,083 [Application Number 12/035,487] was granted by the patent office on 2010-11-16 for disk structure, manufacturing method thereof and optical tweezers device using the same.
This patent grant is currently assigned to Benq Materials Corp.. Invention is credited to Chung-Cheng Chou, Long Hsu, Cheng-Hsien Liu, Chen Peng, Wai Wang, Fung-Hsu Wu.
United States Patent |
7,835,083 |
Peng , et al. |
November 16, 2010 |
Disk structure, manufacturing method thereof and optical tweezers
device using the same
Abstract
A disk structure is disposed in an optical tweezers device
including a light source for producing incident laser light. The
disk structure includes a first substrate, a second substrate and a
reflective layer. The second substrate is disposed with respect to
the first substrate. One of the first substrate and the second
substrate has at least one flow path. The reflective layer, which
is adhered to the second substrate, is disposed between the first
substrate and the second substrate. After the incident laser light
passes through the first substrate and then reaches the reflective
layer, the incident laser light is reflected back as reflective
laser light by the reflective layer to form reflective laser light.
A tweezers light field is formed in the flow path by both the
reflective laser light and the incident laser light.
Inventors: |
Peng; Chen (Taipei,
TW), Wu; Fung-Hsu (Taoyuan County, TW),
Chou; Chung-Cheng (Taoyuan County, TW), Wang; Wai
(Taoyuan County, TW), Hsu; Long (Hsinchu,
TW), Liu; Cheng-Hsien (Hsinchu, TW) |
Assignee: |
Benq Materials Corp. (Gueishan
Township, Taoyuan County, TW)
|
Family
ID: |
40346245 |
Appl.
No.: |
12/035,487 |
Filed: |
February 22, 2008 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20090040620 A1 |
Feb 12, 2009 |
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Foreign Application Priority Data
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Aug 10, 2007 [TW] |
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96129688 A |
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Current U.S.
Class: |
359/676 |
Current CPC
Class: |
C23C
14/5886 (20130101); C23C 14/046 (20130101); C23C
14/086 (20130101); C23C 14/205 (20130101); G02B
21/32 (20130101); B29L 2031/756 (20130101); B29K
2105/0008 (20130101); B29C 65/48 (20130101); B29L
2009/00 (20130101); G02B 5/0808 (20130101); B29C
65/52 (20130101); Y10T 156/10 (20150115); B29K
2305/02 (20130101); B29L 2031/7728 (20130101); B29K
2067/00 (20130101); B29K 2995/0026 (20130101); B29C
65/4825 (20130101); B29K 2305/14 (20130101); B29C
65/521 (20130101); B29K 2069/00 (20130101); B29C
66/45 (20130101); B29K 2033/12 (20130101); B29C
66/54 (20130101); B29L 2009/003 (20130101); B29K
2305/10 (20130101); B29C 65/4855 (20130101); B29K
2025/00 (20130101); B29K 2995/003 (20130101) |
Current International
Class: |
G02B
15/14 (20060101) |
Field of
Search: |
;359/676 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Sugarman; Scott J
Assistant Examiner: Patel; Vipin M
Attorney, Agent or Firm: Thomas, Kayden, Horstemeyer &
Risley
Claims
What is claimed is:
1. An optical tweezers device, comprising: a light source for
producing incident laser light; a disk structure, comprising: a
first substrate; a second substrate disposed with respect to the
first substrate, wherein one of the first substrate and the second
substrate has at least one flow path; and a reflective layer, which
is adhered to the second substrate, disposed between the first
substrate and the second substrate; and a focusing lens disposed at
a side of the first substrate, wherein after the incident laser
light sequentially passes through the focusing lens and the first
substrate and then reaches the reflective layer, the incident laser
light is reflected back as reflective laser light by the reflective
layer and a tweezers light field is formed in the flow path by both
the incident laser light and the reflective laser light.
2. The optical tweezers device according to claim 1, wherein the
focusing lens is a zoom lens.
3. The optical tweezers device according to claim 2, wherein the
zoom lens is a liquid lens.
4. The optical tweezers device according to claim 2, wherein the
zoom lens and the disk structure are capable of moving with respect
to each other.
5. The optical tweezers device according to claim 1, wherein the
disk structure further comprises: an adhesive layer disposed
between the first substrate and the reflective layer.
6. The optical tweezers device according to claim 5, wherein the
adhesive layer is disposed between the first substrate and the
reflective layer by spin coating.
7. The optical tweezers device according to claim 5, wherein the
adhesive layer is made of anti-electrostatic transparent
adhesive.
8. The optical tweezers device according to claim 1, wherein the
reflective layer is made of silver, aluminum, copper or alloy.
9. The optical tweezers device according to claim 1, wherein the
first substrate is a transparent substrate.
10. The optical tweezers device according to claim 1, wherein the
reflective layer is disposed on the second substrate by sputtering
or vaporization deposition.
11. The optical tweezers device according to claim 1, wherein the
disk structure further comprises: a protective layer disposed
between the first substrate and the reflective layer and covering
the reflective layer.
12. The optical tweezers device according to claim 11, wherein the
protective layer is disposed between the first substrate and the
reflective layer by sputtering or vaporization deposition.
13. The optical tweezers device according to claim 11, wherein the
protective layer is made of indium tin oxide.
Description
This application claims the benefit of Republic of Taiwan, R.O.C.
application Serial No. 096129688, filed Aug. 10, 2007, the subject
matter of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates in general to a disk structure and a
manufacturing method thereof and an optical tweezers device using
the same, and more particularly to a disk structure having a
reflective layer, a manufacturing method thereof and an optical
tweezers device using the same.
2. Description of the Related Art
The application of the optical controlling technology includes
optical levitation and laser cooling and trapping, etc. With the
development of the optical controlling technology, an optical
tweezers device has been widely used in many fields, such as
micro-electro mechanical field, biological field or medicine field;
furthermore, the optical tweezers device with a single laser beam
presented by Arthur Ashkin et al. is applied frequently in this
field. The laser beam is focused within an optical tweezers device
by a lens with high numerical aperture (NA) ratio and high
magnification to control a nano-level particle at the focal point.
As the optical tweezers device controls the particle neither
touching nor invading it, the structure of the particle would not
be damaged. Therefore, the optical tweezers device can be
effectively used in controlling biological particles, such as
cells, blood cells, sperms, or microbes.
Presently, laser beam applications of optical tweezers can be
categorized into single laser beam and dual laser beam. In general,
when applying the single laser beam to the optical tweezers device,
the single laser beam has to pass through a lens with higher NA
ratio so as to get a larger force for controlling a particle.
However, a lens with high NA ratio is expensive. Mention of the
dual laser beam, although it doesn't need to be with a high NA
ratio lens, two single laser beams are still required to form the
dual laser beam. Therefore, the usage cost of the dual laser beam
is comparably high as well.
SUMMARY OF THE INVENTION
The invention is directed to a disk structure, a manufacturing
method thereof and an optical tweezers device using the same. The
disk structure has a reflective layer for reflecting the incident
laser light to form the reflective laser light. Thus, the incident
laser light and the reflective laser light controlling a movement
of a particle are treated as two single laser beams.
According to a first aspect of the present invention, a disk
structure is provided. The disk structure is disposed in an optical
tweezers device comprising a light source, which is for producing
incident laser light. The disk structure comprises a first
substrate, a second substrate and a reflective layer. The first
substrate has at least one flow path. The second substrate is
disposed with respect to the first substrate. The reflective layer
adhered to the second substrate is disposed between the first
substrate and the second substrate. After the laser light passes
through the first substrate and then reaches the reflective layer,
the incident laser light is reflected back as reflective laser
light by the reflective layer. A tweezers light field is formed in
the flow path by both the reflective laser light and the incident
laser light.
According to a second aspect of the present invention, a disk
structure is provided. The disk structure is disposed in an optical
tweezers device, which comprises a light source for producing
incident laser light. The disk structure comprises a first
substrate, a second substrate and a reflective layer. The second
substrate having at least one flow path is disposed with respect to
the first substrate. The reflective layer, which is adhered to the
second substrate, is disposed between the first substrate and the
second substrate. After the incident laser light passes through the
first substrate and then reaches the reflective layer, the incident
light is reflected by the reflective layer to form reflective laser
light. A tweezers light field is formed in the flow path by both
the reflective laser light and the incident laser light.
According to a third aspect of the present invention, a
manufacturing method of a disk structure is provided. The
manufacturing method comprises the following steps. Firstly, a
first substrate is formed with at least one flow path on it. Next,
a reflective layer is formed on a second substrate. Then, the first
substrate and the second substrate are adhered to each other. The
reflective layer is between the first substrate and the second
substrate.
According to a fourth aspect of the present invention, a
manufacturing method of a disk structure is provided. The
manufacturing method comprises the following steps. Firstly, a
first substrate is provided. Next, a second substrate is formed
with at least one flow path on it. Then, a reflective layer is
formed on the second substrate. After that, the first substrate and
the second substrate are adhered to each other. The reflective
layer is between the first substrate and the second substrate.
According to a fifth aspect of the present invention, an optical
tweezers device is provided. The optical tweezers device comprises
a light source, a disk structure and a focusing lens. The light
source is used for producing incident laser light. The disk
structure comprises a first substrate, a second substrate and a
reflective layer. The first substrate has at least one flow path.
The second substrate is disposed with respect to the first
substrate. The reflective layer, which is adhered to the second
substrate, is disposed between the first substrate and the second
substrate. The focusing lens is disposed at a side of the first
substrate. After the incident laser light sequentially passes
through the focusing lens and the first substrate and then reaches
the reflective layer, the incident laser light is reflected by the
reflective layer to form reflective laser light. A tweezers light
field is formed in the flow path by both the reflective laser light
and the incident laser light.
According to a sixth aspect of the present invention, an optical
tweezers device is provided. The optical tweezers device comprises
a light source, a disk structure and a focusing lens. The light
source is used for producing incident laser light. The disk
structure comprises a first substrate, a second substrate and a
reflective layer. The second substrate having at least one flow
path is disposed with respect to the first substrate. The
reflective layer, which is adhered to the second substrate, is
disposed between the first substrate and the second substrate. The
focusing lens is disposed at a side of the first substrate. After
the incident laser light sequentially passes through the focusing
lens and the first substrate and then reaches the reflective layer,
the incident laser light is reflected by the reflective layer to
form reflective laser light. A tweezers light field is formed in
the flow path by both the reflective laser light and the incident
laser light.
The invention will become apparent from the following detailed
description of the preferred but non-limiting embodiments. The
following description is made with reference to the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a cross-sectional view of an optical tweezers device
according to a first embodiment of the invention;
FIGS. 2A-2D show the processes of the manufacturing method of the
disk structure in FIG. 1;
FIG. 3 is a flowchart of the manufacturing method of the disk
structure in FIG. 1;
FIG. 4 is a cross-sectional view of an optical tweezers device
according to a second embodiment of the invention;
FIGS. 5A-5F show the processes of the manufacturing method of the
disk structure in FIG. 4; and
FIG. 6 is a flowchart of the manufacturing method of the disk
structure in FIG. 4.
DETAILED DESCRIPTION OF THE INVENTION
A disk structure, a manufacturing method thereof and an optical
tweezers device using the same are disclosed in the invention. When
the incident laser light reaches a reflective layer of the disk
structure, a reflective laser light is formed by reflecting the
incident laser light from the reflective layer. A tweezers light
field is formed in the flow path of the disk structure by the
reflective laser light and the incident laser light to control a
movement of the particles in the flow path. In order to clearly
show the features of the present invention, some elements would be
omitted and the components in the drawings would be illustrated
simply.
First Embodiment
Referring to FIG. 1, a cross-sectional view of an optical tweezers
device according to a first embodiment of the invention is shown.
The present embodiment of the invention exemplifies an optical
tweezers device 200 including a light source 210, a disk structure
220 and a focusing lens 230. The light source 210 is used for
producing incident laser light L1. The disk structure 220 comprises
a first substrate 221, a second substrate 223 and a reflective
layer 225. The first substrate 221 has at least one flow path 221a.
The second substrate 223 is disposed with respect to the first
substrate 221. The reflective layer 225 is disposed between the
first substrate 221 and the second substrate 223, and the second
substrate 223 is fully covered by the reflective layer 225. The
focusing lens 230 is disposed at a side of the first substrate 221.
After the incident laser light L1 produced by the light source 210
sequentially passes through the focusing lens 230 and the first
substrate 221 and then reaches the reflective layer 225, a
reflective laser light is formed by reflecting the incident laser
light L1 from the reflective layer 225. Thus, a tweezers light
field is formed in the flow path 221a by both the reflective laser
light and the incident laser light L1.
The focusing lens 230 of the optical tweezers device 200 is
disposed on the optical path between the light source 210 and the
disk structure 220, so that the incident laser light L1 produced by
the light source 210 sequentially passes through the focusing lens
230 and the first substrate 221 for reaching the reflective layer
225. In the present embodiment of the invention, the focusing lens
230 can be a zoom lens capable of adjusting the focal location to
have the position of the tweezers light field in the flow path 221a
changed. The zoom lens can be a liquid lens or preferably be an
electro-liquid lens. When different voltages are applied to an
electro-liquid lens, the surface curvature of the electro-liquid
lens would be changed so as to adjust the focal location
accordingly. Then, when an electro-liquid lens is used as the zoom
lens, the focal location of the zoom lens can be adjusted so as to
change the position of the tweezers light field in the flow path
221a. In addition, both the zoom lens and the disk structure 220
are movable to change the position of the tweezers light field in
the flow path 221a.
As illustrated in FIG. 1, the incident laser light L1 and the
reflective laser light are treated as a dual laser beam. At this
time, if at least one particle (not illustrated) is received in the
flow path 221a, the incident laser light L1 and the reflective
laser light can be used to control the movement of the particle in
the flow path 221a.
The conventional dual laser beam is formed by two single laser
beams with the identical intensity but the opposite directions.
Then, a particle can be controlled by an optical pressure balance
caused from the two single laser beams. As the two single laser
beams are produced separately by a device to form the dual laser
beam, the cost for using the dual laser beam is too high. Based on
the design of the optical tweezers device 200 and a single laser
beam (the incident laser light L1) applied to the optical tweezers
device 200, it provides the same effect as the dual laser beam for
controlling a particle via the optical pressure balance. As a
result, compared with the conventional dual laser beam, the optical
tweezers device 200 of the present embodiment of the invention has
the advantages of lower usage cost.
The disk structure 220 of the present embodiment of the invention
is further elaborated as follows. The disk structure 220 further
includes an adhesive layer 227 disposed between the first substrate
221 and the reflective layer 225. The reflective layer 225 is fully
covered by the adhesive layer 227 via spin coating. In order to
cover a flat surface of the second substrate 223 by the reflective
layer 225, the reflective layer 225 can be formed by sputtering or
vaporization disposition. Preferably, the reflective layer 225 is
formed on the second substrate 223 by sputtering.
In the present embodiment of the invention, the adhesive layer 227
can be made of anti-electrostatic adhesive, and the reflective
layer 225 can be made of silver, aluminum, copper or alloy. The
adhesive layer 227 is used for adhering the first substrate 221 and
the second substrate 223 and for preventing the clustering of the
electrostatic charges because of the material of the adhesive layer
227. In addition, the adhesive layer 227 is also used for
preventing the interaction between the reflective layer 225 and
particles or a solution contained in the flow path 221a.
When taking the processing of biological cells as an example:
generally, biological cells survive in a solution with a specific
pH value. If the reflective layer 225 directly contacts with the
solution in the flow path 221a, the reflective layer 225 may be
eroded. In addition, the metallic cations of the reflective layer
225 would easily affect the biological cells in the flow path 221a.
Thus, the adhesive layer 227 protects the biological cells in the
flow path 221a and the reflective layer 225 simultaneously. The
adhesive layer 227 of the disk structure 220 is preferably made of
a bio-compatible material when the application of the disk
structure 220 is related to the biological field.
Materials of the first substrate 221 and the adhesive layer 228
that the incident laser light L1 passes through should both be
transparent. That is, the first substrate 221 can be a transparent
substrate made of glass (SiO.sub.x), polymethylmethacrylate (PMMA),
polyethylene terephthalate (PET), poly carbonate (PC) or
polystyrene (PS). The adhesive layer 227 can be made of
anti-electrostatic adhesive which is transparent as well.
Furthermore, it should be taken into a consideration that the
material of the adhesive layer 227 can not affect the function of
the reflective layer 225 because of the directly contact of the
adhesive layer 227 and the reflective layer 225. Thus, the adhesive
layer 227 can be made of optical disc adhesive or optical pressure
sensitive adhesive which are transparent materials. The second
substrate 223 can be a transparent substrate or a non-transparent
substrate. The materials of the first substrate 221 and the second
substrate 223 are depended on a user's demands.
The manufacturing method of the disk structure 220 in FIG. 1 is
disclosed as follows. FIGS. 2A.about.2D show the processes of the
manufacturing method of the disk structure in FIG. 1. FIG. 3 is a
flowchart of the manufacturing method of the disk structure in FIG.
1.
Firstly, as illustrated in FIG. 2A, at least one flow path 221a of
the first substrate 221 is formed in the step 501. In the step 501,
the first substrate 221 which has the flow path 221a with it can be
formed by injection molding, casting, laser cutting or etching.
Next, as illustrated in FIG. 2B, the reflective layer 225 is formed
on the second substrate 223 in the step 503. In the step 503, the
reflective layer 225 is formed on the second substrate 223 by
sputtering or vaporization disposition. Preferably, the reflective
layer 225 is formed by sputtering.
Then, as illustrated in FIG. 2C, the adhesive layer 227 is formed
on the reflective layer 225 in the step 505. In step the 505, the
adhesive layer 227 is formed on the reflective layer 225 by spin
coating.
After that, as illustrated in FIG. 2D, the first substrate 221 and
the second substrate 223 are adhered to each other in the step 507.
The reflective layer 225 is positioned between the first substrate
221 and the second substrate 223. When the disk structure 220 is
incorporated with the light source 210 and the focusing lens 230 in
FIG. 1, the incident laser light L1 produced by the light source
210 and the reflective laser light reflected by the reflective
layer 225 can be used for controlling the movement of the particles
in the flow path 221a. As the disk structure 220 can be
manufactured by the ordinary manufacturing process of optical
disks, the device for manufacturing the optical disks can be used
to manufacture the disk structure 220 as well. In other words, the
manufacturing cost of the disk structure 220 is relatively
reduced.
Second Embodiment
Compared with the optical tweezers device 200 in the first and the
second embodiments, the difference is the location of the flow
path. Referring to FIG. 4, a cross-sectional view of an optical
tweezers device according to a second embodiment of the invention
is shown. The present embodiment of the invention exemplifies the
optical tweezers device 300 including a light source 310, a disk
structure 320 and a focusing lens 330. In addition to a first
substrate 321, a second substrate 323 disposed with respect to the
first substrate 321, an adhesive layer 327 and a reflective layer
325, the disk structure 320 further includes a protective layer
329. Furthermore, there is at least one flow path 323a positioned
at the second substrate 323. The incident laser light L2 produced
by the light source 310 sequentially passes through the focusing
lens 330, the first substrate 321, the adhesive layer 327 and the
protective layer 329 and then reaches the reflective layer 325. A
reflective laser light is formed by reflecting the incident laser
light L2 from the reflective layer 325, so that a tweezers light
field is formed in the flow path 323a by both the reflective laser
light and the incident laser light L2. Thus, the incident laser
light L2 and the reflective laser light are as a dual laser beam.
At this time, if at least one particle (not illustrated) is
received in the flow path 323a, the incident laser light L2 and the
reflective laser light can be used to control the movement of the
particle in the flow path 323a.
The focusing lens 330 can be a zoom lens such as a liquid lens. The
liquid lens is capable of adjusting the focal location so as to
change the position of the tweezers light field in the flow path
323a. In addition, the zoom lens and the disk structure 320 are
movable to adjust the position of the tweezers light field in the
flow path 323a.
In the present embodiment of the invention, the reflective layer
325 fully covers the surface, which has at least one flow path 323a
positioned thereon, of the second substrate 323. The reflective
layer 325 is made of silver, aluminum, copper or alloy. When taking
the processing of biological cells in the flow path 323a of the
disk structure 320 as an example: generally, biological cells
survive in a solution with a specific pH value. Thus, if the
reflective layer 325 is not properly protected, the reflective
layer 325 made of metallic material would expose to the flow path
323a and directly contact with the solution in the flow path 323a.
Under such situation, the reflective layer 325 may be eroded
because of the solution, and the biological cells would be easily
affected by the metallic cations of the reflective layer 325 as
well. To avoid the interaction between the biological cells and the
solution in the flow path 323a and reflective layer 325, the
protective layer 329 is preferably formed between the first
substrate 321 and the reflective layer 325. In addition, the
reflective layer 325 is fully covered by the protective layer 329,
so that the reflective layer 325 is separated from both the
solution and the biological cells in the flow path 323a. The
protective layer 329 is made of indium tin oxide (ITO), for
example.
As disclosed above, the reflective layer 325 is formed on the
surface, which has at least one flow path 323a, of the second
substrate 323, and the reflective layer 325 is fully covered by the
protective layer 329. Thus, in order to reserve the original shape
and space of the flow path 323a, the protective layer 329 and the
reflective layer 325 are formed by sputtering or vaporization
deposition, so that the protective layer 329 and the reflective
layer 325 are formed according to the shape of the flow path 323a.
Preferably, the protective layer 329 and the reflective layer 325
are formed by sputtering.
The incident laser light L2 produced by the light source 310
sequentially passes through the focusing lens 330 and the first
substrate 321, the adhesive layer 327 and the protective layer 329
of the disk structure 320 to reach the reflective layer 325.
Therefore, the components (the focusing lens 330, the first
substrate 321, the adhesive layer 327 and the protective layer 329)
that the laser light L2 passes through are made of transparent
material. The protective layer 329 can be made of indium tin oxide.
As indium tin oxide is a transparent metallic oxide, indium tin
oxide can prevent the clustering of the electrostatic charges at
the second substrate 323. Although the material of the protective
layer 329 exemplifies indium tin oxide, the protective layer 329
can be made of other transparent materials capable of preventing
the clustering of the electrostatic charges. Moreover, the disk
structure 320 can be used for containing a biological cell and
thereby the protective layer 329 is preferably made of a
bio-compatible material.
The manufacturing method of the disk structure 320 in FIG. 4 is
disclosed as follows. FIG. 5A.about.5F show the processes of the
manufacturing method of the disk structure in FIG. 4. FIG. 6 is a
flowchart of the manufacturing method of the disk structure in FIG.
4.
Firstly, as illustrated in FIG. 5A, the first substrate 321 is
provided in the step 601.
Next, as illustrated in FIG. 5B, the second substrate 323 with at
least one flow path 323a is formed in the step 603. In the step
603, the second substrate 323 with at least one flow path 323a is
formed by injection molding, casting, laser cutting or etching.
Then, as illustrated in FIG. 5C, the reflective layer 325 is formed
on the second substrate 323 in the step 605. In order to keep the
shape and the space of the flow path 323a unchanged, the reflective
layer 325 on the second substrate 323 can be formed by sputtering
or vaporization deposition. Preferably, in the step 605, the
reflective layer 325 is formed by sputtering.
After that, as illustrated in FIG. 5D, the protective layer 329 is
formed on the reflective layer 325 in the step 607. Similar to the
step 605, the protective layer 329 on the reflective layer 325 can
be formed by sputtering or vaporization deposition, so that the
shape and the space of the flow path 323a can keep unchanged.
Preferably, in the step 607, the protective layer 329 is formed by
sputtering.
Then, as illustrated in FIG. 5E, the adhesive layer 327 is formed
on the first substrate 321 in the step 609. Because the adhesive
layer 327 is adhered to a flat surface of the first substrate 321,
the adhesive layer 327 is formed on the first substrate 321 by spin
coating in the step 609.
After that, as illustrated in FIG. 5F, the first substrate 321 and
the second substrate 323 are adhered to each other in the step 611.
The reflective layer 325 is between the first substrate 321 and the
second substrate 323. When the disk structure 320 is incorporated
with the light source 310 and the focusing lens 330 in FIG. 4, the
incident laser light L2 produced by the light source 310 and the
reflective laser light reflected by the reflective layer 325 can be
used for controlling the movement of the particles in the flow path
323a. As the disk structure 320 can be manufactured by the ordinary
manufacturing process of optical disks, the device for
manufacturing the optical disks can be used to manufacture the disk
structure 320 as well. In other words, the manufacturing cost of
the disk structure 320 is effectively reduced.
According to the disk structure, the manufacturing method thereof
and the optical tweezers device using the same disclosed in the
above embodiments, the movement of the particles in the flow path
is controllable by a dual laser beam formed by the incident laser
light produced by the light source and the reflective laser light
reflected by the reflective layer. The disk structure can be
manufactured by the ordinary manufacturing process of an optical
disk. Therefore, the disk structure can be manufactured by the
existing devices.
While the invention has been described by way of example and in
terms of a preferred embodiment, it is to be understood that the
invention is not limited thereto. On the contrary, it is intended
to cover various modifications and similar arrangements and
procedures, and the scope of the appended claims therefore should
be accorded the broadest interpretation so as to encompass all such
modifications and similar arrangements and procedures.
* * * * *