U.S. patent number 7,693,360 [Application Number 10/511,630] was granted by the patent office on 2010-04-06 for optoelectronic hybrid integrated module and light input/output apparatus having the same as component.
This patent grant is currently assigned to NEC Corporation. Invention is credited to Kazuhiko Kurata, Jun-ichi Sasaki, Takanori Shimizu, Takara Sugimoto.
United States Patent |
7,693,360 |
Shimizu , et al. |
April 6, 2010 |
Optoelectronic hybrid integrated module and light input/output
apparatus having the same as component
Abstract
On the back surface of a transparent plate having a light
extracting part for outputting lights to the outside, an electrode
for wiring, and an electrode for an electromagnetic shield, an
optical device is flip-chip mounted right under the light
extracting part, an a driver IC is flip-chip mounted at a desired
position with metal bumps. When currents driving the optical device
flow from the driver IC according to an electric logical signal
from the outside, an optical signal is emitted from the optical
device, and is output to the outside through the light extracting
part. The light extracting part may be provided with a light
coupling material or an optical axis converter.
Inventors: |
Shimizu; Takanori (Tokyo,
JP), Sugimoto; Takara (Tokyo, JP), Sasaki;
Jun-ichi (Tokyo, JP), Kurata; Kazuhiko (Tokyo,
JP) |
Assignee: |
NEC Corporation (Tokyo,
JP)
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Family
ID: |
29996674 |
Appl.
No.: |
10/511,630 |
Filed: |
April 18, 2003 |
PCT
Filed: |
April 18, 2003 |
PCT No.: |
PCT/JP03/04973 |
371(c)(1),(2),(4) Date: |
October 19, 2004 |
PCT
Pub. No.: |
WO04/001861 |
PCT
Pub. Date: |
December 31, 2003 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20050180679 A1 |
Aug 18, 2005 |
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Foreign Application Priority Data
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Jun 24, 2002 [JP] |
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2002-183219 |
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Current U.S.
Class: |
385/14; 385/129;
257/72; 257/56; 257/55; 257/54; 257/53; 257/21; 257/189; 257/184;
257/118; 257/117; 257/116; 257/115; 257/114; 257/113 |
Current CPC
Class: |
H01L
24/73 (20130101); H01S 5/0237 (20210101); H01S
5/02253 (20210101); H01L 25/167 (20130101); H01L
2224/73265 (20130101); H01L 2924/12042 (20130101); H01L
2924/14 (20130101); H01L 2924/3025 (20130101); H01L
2224/48091 (20130101); H01L 2224/16225 (20130101); H01L
2924/00014 (20130101); H01S 5/183 (20130101); H01L
2224/48227 (20130101); H01L 2224/32225 (20130101); H01L
2924/3011 (20130101); H01L 2224/05573 (20130101); H01S
5/02325 (20210101); H01L 2224/05568 (20130101); H01L
2224/48091 (20130101); H01L 2924/00014 (20130101); H01L
2224/73265 (20130101); H01L 2224/32225 (20130101); H01L
2224/48227 (20130101); H01L 2924/00 (20130101); H01L
2924/3011 (20130101); H01L 2924/00 (20130101); H01L
2924/3025 (20130101); H01L 2924/00 (20130101); H01L
2924/12042 (20130101); H01L 2924/00 (20130101); H01L
2924/14 (20130101); H01L 2924/00 (20130101); H01L
2924/00014 (20130101); H01L 2224/05599 (20130101) |
Current International
Class: |
G02B
6/12 (20060101); G02B 6/10 (20060101) |
Field of
Search: |
;385/14,129
;257/21,53-56,72,113-118,184-189,225-234,257-258,290-294,414,431-466,499-564 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
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|
|
|
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63-102390 |
|
May 1988 |
|
JP |
|
63-170141 |
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Nov 1988 |
|
JP |
|
64-50326 |
|
Feb 1989 |
|
JP |
|
2-159764 |
|
Jun 1990 |
|
JP |
|
2-196476 |
|
Aug 1990 |
|
JP |
|
02-291140 |
|
Nov 1990 |
|
JP |
|
05-121780 |
|
May 1993 |
|
JP |
|
6-69490 |
|
Mar 1994 |
|
JP |
|
6-54370 |
|
Jul 1994 |
|
JP |
|
6-310759 |
|
Nov 1994 |
|
JP |
|
06-340118 |
|
Dec 1994 |
|
JP |
|
7-178961 |
|
Jul 1995 |
|
JP |
|
11-305864 |
|
Nov 1999 |
|
JP |
|
2000-49414 |
|
Feb 2000 |
|
JP |
|
2000-321096 |
|
Nov 2000 |
|
JP |
|
2000-332354 |
|
Nov 2000 |
|
JP |
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WO 02/25335 |
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Mar 2002 |
|
WO |
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Other References
Japanese Office Action dated Sep. 9, 2004 with Partial English
Translation. cited by other.
|
Primary Examiner: Font; Frank G
Assistant Examiner: Chiem; Erin D
Attorney, Agent or Firm: McGinn IP Law Group, PLLC
Claims
What is claimed is:
1. An optoelectronic hybrid integrated module comprising: an
optical device for converting one of an optical signal into an
electric signal and an electrical signal into an optical signal; an
input/output IC for drive-controlling the optical device; and a
transparent base material having electric wiring and light
permeability, the transparent base material including a light
coupling means at a position substantially facing the optical
device, wherein the optical device and the input/output IC are
flip-chip mounted on a surface of the transparent base material
substantially aligned with the light coupling means, such that
light coupling is performed in a direction other than a direction
horizontal with respect to said transparent base material, wherein
light inputting/outputting between the optical device and an area
outside of the integrated module is carried out due to the light
permeability of the transparent base material, wherein the electric
wiring connects the optical device and the input/output IC so as to
transfer an electric signal between them, the electric wiring being
positioned on a surface of the transparent base material opposite
to the surface where the optical device is mounted, the electric
wiring being provided as a ground electrode and serving as an
electromagnetic shield for the optical device and the input/output
IC, wherein the optical device comprises at least one of a light
emitting device which converts an electrical current signal into an
optical signal and outputs said optical signal, and a light
receiving device which converts an optical signal into an
electrical current signal, wherein the input/output IC comprises at
least one of a driver IC that converts an electrical voltage signal
into an electrical current signal and outputs the electrical
current signal to the optical device and an amplifier IC which
converts the electrical current signal from the light receiving
device into an electrical voltage signal, and wherein light emitted
from said optical device, said optical device being flip-chip
mounted on a first surface of said transparent base material,
passes through said transparent base material approximately
perpendicular to the surface of said transparent base material and
is emitted from said transparent base material approximately
perpendicular to a second surface of said transparent base
material, the second surface comprising a surface opposite the
first surface.
2. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the transparent base material comprises a transparent
plate transmitting a light and the transparent plate comprises a
material having high permeability to a wavelength of the optical
device.
3. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the transparent base material comprises a flexible sheet
transmitting a light, and the flexible sheet comprises a material
having high permeability to a wavelength of the optical device.
4. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the light coupling means is integrally formed with the
transparent base material.
5. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the transparent base material includes an optical axis
converter which converts a direction of an optical axis with
reference to the light coupling means.
6. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the optical device and the input/output IC comprise an
interposer which comprises a holder and a heat spreader.
7. The optoelectronic hybrid integrated module, as claimed in claim
1, wherein the transparent base material is fixed to a holding
frame within which electric wiring is incorporated.
8. A light input/output apparatus comprising: an optoelectronic
hybrid integrated module and a logic LSI, wherein the
optoelectronic hybrid integrated module includes: an optical device
for converting one of an optical signal into an electric signal and
an electric signal into an optical signal; an input/output IC for
drive-controlling the optical device; and a transparent base
material having electric wiring and light permeability, the
transparent base material including a light coupling means at a
position substantially facing the optical device; wherein the
optical device and the input/output IC are flip-chip mounted on a
surface of the transparent base material substantially aligned with
the light coupling means, wherein light inputting/outputting
between the optical device and an outside of the module is carried
out due to the Light permeability of the transparent base material,
wherein the logic LSI controls an electric signal input into or
output from the optoelectronic hybrid integrated module, wherein
the optoelectronic hybrid integrated module and the logic LSI are
mounted on a same substrate, wherein the optical device comprises
at least one of a light emitting device which converts an
electrical current signal into an optical signal and outputs said
optical signal, and a light receiving device which converts an
optical signal into an electrical current signal, wherein the
input/output IC comprises at least one of a driver IC which
converts an electrical voltage signal into an electrical current
signal and outputs the electrical current signal to the optical
device and an amplifier IC which converts the electrical current
signal from the light receiving device into an electrical voltage
signal, and wherein light emitted from said optical device, said
optical device being flip-chip mounted on a first surface of said
transparent base material, passes through said transparent base
material approximately perpendicular to the surface of said
transparent base material and is emitted from said transparent base
material approximately perpendicular to a second surface of said
transparent base material, the second surface comprising a surface
opposite the first surface.
9. The optoelectronic hybrid integrated circuit according to claim
1, wherein the optical device is sealed to the transparent base
material devoid of an air gap.
10. The optoelectronic hybrid integrated circuit according to claim
1, wherein only the optical device is sealed to the transparent
base material devoid of an air gap.
11. The optoelectronic hybrid integrated circuit according to claim
1, wherein the light coupling means comprises a convex lens formed
on the transparent base material.
12. The optoelectronic hybrid integrated circuit according to claim
8, wherein the electric wiring connects the optical device and the
input/output IC so as to transfer an electric signal between them,
the electric wiring being positioned on a surface of the
transparent base material opposite to the surface where the optical
device is mounted.
13. The optoelectronic hybrid integrated circuit according to claim
8, wherein, the electric wiring is provided as a ground electrode
and serves as an electromagnetic shield for the optical device and
the input/output IC.
14. The optoelectronic hybrid integrated module, as claimed in
claim 1, wherein the light coupling means improves light coupling
efficiency.
Description
TECHNICAL FIELD
The present invention relates to an optoelectronic hybrid
integrated module, and in particular, to an optoelectronic hybrid
integrated module in which an optical device, a driver IC and the
like are mounted.
BACKGROUND ART
In recent years, large-scale switching systems such as
large-capacity routers are required corresponding to an increase in
the capacity of communication networks. In such a case, limitation
of capacity, due to the distance of electrical connections or sizes
in the large-capacity connections between cabinets or inside a
cabinet, is concerned. This is because higher-speed and
higher-density electric signal wiring and delays in electric wiring
stand as bottlenecks in realizing higher performance, although
operating speed and integration scale have been improved along with
the developments in the IC and LSI techniques. As a technique to
solve this problem, an optical interconnection is drawing the
attention. As a configuration of a small and low-cost signal
input/output device using optical interconnection, it is effective
that the signal processing is performed by a logic LSI and
interfacing with the outside is performed by an optoelectronic
hybrid integrated module.
This type of optoelectronic hybrid integrated module has been so
configured as to combine a base material, on which an optical
device and a driver IC are mounted, and a case to which a light
extracting part such as a lens is provided. FIG. 9 shows a
schematic side sectional view of a conventional optoelectronic
hybrid integrated module.
As shown in FIG. 9, on a wiring substrate 98 in which interlayer
wiring 96 and wiring patterns are formed on the top and the back
surfaces, an optical device 91 for transmitting or receiving
optical signals is fixed with a solder, and the optical device 91
and the wiring of the wiring substrate 98 are connected by a metal
wire 97, and a driver IC 92 (an electric amplifier IC in the case
of receiver) for adjusting the current amplitude of the optical
device 91 is fixed in the same way and is electrically connected.
Further, on a case 93 made of a material such as covar or the like,
a light coupling means 94 such as a planar microlens is mounted.
Then, by mounting the case 93 on the wiring substrate 98, light
coupling between the optical device 91 and the outside is realized
through the light coupling means 94.
In the conventional optoelectronic hybrid integrated module,
however, the wiring substrate and the case, on which each component
is mounted separately, are used. For example, the optical device is
fixed and connected to the wiring substrate with a solder or by
wire bonding, the driver IC is fixed and connected to the wiring
substrate by soldering, and the lens is fixed to the case with an
adhesive or the like. Then, finally they are assembled as a whole.
This causes a problem of an increase in the number of components
and processes, and an increase in the mounting cost.
Further, in drawing out the wiring, a wider margin of the wiring is
required for wire-bonding the optical device, which causes a
problem that high-density mounting of the components becomes
difficult.
Further, in order to carry out electromagnetic shielding
effectively, the case is preferably made of metal such as covar,
which causes a problem of an increase in the cost.
Further, in extracting or taking in lights, since the lens and the
optical device are mounted separately, dispersion of the distance
between the lens and the optical device or their positions becomes
large, which causes a problem of dispersion of the optical outputs
themselves.
Further, when sealing is considered, since the module is divided
into the case and the wiring substrate, it is required to inject a
sealing material into the hollow portion of the divided package
consisting of the two parts. Moreover, since the lens is fixed with
an adhesive, hermetic sealing is also difficult.
DISCLOSURE OF THE INVENTION
It is an object of the present invention to provide an
optoelectronic hybrid integrated module in which the number of
components and the processes are reduced, so that the mounting cost
is suppressed. It is another object of the present invention to
provide an optoelectronic hybrid integrated module in which a
narrow margin of wiring is acceptable and the mounted components
can be arranged in high density. Further, it is another object of
the present invention to provide an optoelectronic hybrid
integrated module having a plate with which an electromagnetic
shield can be realized at low cost. Further, it is another object
of the present invention to provide an optoelectronic hybrid
integrated module in which dispersion of distance between a lens
and an optical device is suppressed, so that dispersion in the
optical output is small. Further, it is another object of the
present invention to provide an optoelectronic hybrid integrated
module in which sealing can be done relatively easily.
In order to achieve the aforementioned objects, an optoelectronic
hybrid integrated module according to the present invention
comprises: an optical device for converting optical signals into
electric signals and vice versa; an input/output IC for
drive-controlling the optical device; and a transparent base
material having electric wiring and light permeability. The module
is so configured that the optical device and the input/output IC
are flip-chip mounted on the transparent base material, and light
inputting/outputting between the optical device and the outside is
carried out due to the light permeability of the transparent base
material.
According to the present invention, the optical device which
converts light signals into electric signals and vice versa, and
the input/output IC for drive-controlling the optical device are
flip-chip mounted on the transparent base material having electric
wiring and light permeability. Further, light inputting/outputting
between the optical device and the outside is carried out due to
the light permeability of the transparent base material.
Therefore, the number of components and processes can be reduced,
so that the mounting cost can be suppressed. Further, a narrow
margin of wiring is acceptable, whereby the mounted components can
be arranged in high density.
Further, the electric wiring of the transparent base material can
electrically connect the optical device and the input/output IC and
also serve as an electromagnetic shield for the optical device and
the input/output IC.
Further, the optical device is configured as a light emitting
device which converts electric signals into optical signals and
outputs them, and the input/output IC is configured as a driver IC
which outputs electric signals to the optical device.
Alternatively, the optical device may be configured as a light
receiving device which converts optical signals into electric
signals, and the input/output IC may be configured as an electric
amplifier IC which amplifies electric signals from the light
receiving device.
Further, the transparent base material is formed of a transparent
plate which transmits lights, the transparent plate being made of a
material having high permeability to the wavelength of the optical
device. Alternatively, the transparent base material may be formed
of a flexible sheet which transmits lights, the flexible sheet
being made of a material having high permeability to the wavelength
of the optical device.
It is desirable that the transparent base material include a light
coupling means for improving light coupling efficiency provided at
a position facing the optical device. In this case, the light
coupling means may be integrally formed with the transparent base
material. Further, the transparent base material may include an
optical axis converter which converts the direction of the optical
axis with reference to the light coupling means.
Further, the optical device and the input/output IC have an
interposer as a holder and a heat spreader. Alternatively, it is
desirable that the transparent base material be fixed to a holding
frame within which electric wiring is incorporated.
Further, it is possible to configure a light input/output apparatus
using an optoelectronic hybrid integrated module of the present
invention. More specifically, a light input/output apparatus
according to the present invention comprises an optoelectronic
hybrid integrated module and a logic LSI. The optoelectronic module
includes: an optical device for converting optical signals into
electric signals and vice versa; an input/output IC for
drive-controlling the optical device; and a transparent base
material having electric wiring and light permeability. The
apparatus is so configured that the optical device and the
input/output IC are flip-chip mounted on the transparent base
material, and that light inputting/outputting between the optical
device and the outside is carried out due to the light permeability
of the transparent base material. Further, the apparatus is so
configured that the logic LSI controls electric signals input into
or output from the optoelectronic hybrid integrated module, and the
optoelectronic hybrid integrated module and the logic LSI are
mounted on the same substrate.
As described above, the present invention has such a configuration
that an optical device and an input/output IC are flip-chip mounted
on a transparent base material, and by utilizing the light
permeability of the transparent base material, light
inputting/outputting to/from the optical device is carried out.
Thereby, the number of components and processes can be reduced, so
that the mounting cost is suppressed. Further, a narrow margin of
wiring is acceptable, whereby the mounted components can be
arranged in high density. Moreover, a low-cost plate, in which an
electromagnetic shield is taken into account, can be realized,
dispersions in light outputs can be suppressed, and sealing can be
done relatively easily.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module according to a first
embodiment of the present invention.
FIG. 2 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module according to a second
embodiment in which an optical extracting part according to the
present invention includes a light coupling means such as a potting
lens.
FIG. 3 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module according to a third
embodiment in which the optical extracting part of the present
invention has been provided with a coupling means formed on a
transparent plate beforehand.
FIG. 4 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module according a forth
embodiment having such a configuration that an optical axis
converter is provided to the optical extracting part of the present
invention.
FIG. 5 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module according to a fifth
embodiment in which a transparent base material consists of a
flexible sheet.
FIG. 6 is a schematic side sectional view showing the configuration
of an optoelectronic hybrid integrated module of a sixth embodiment
in which a transparent plate of the present invention is fixed to a
holding frame.
FIG. 7 is a schematic side sectional view showing the configuration
of a light input/output apparatus according to a first embodiment
consisting of an optoelectronic hybrid integrated module and a
logic LSI.
FIG. 8 is a schematic side sectional view showing the configuration
of a light input/output apparatus according to a second embodiment
where heating of the logic LSI is discharged from the base material
side.
FIG. 9 is a schematic diagram showing the configuration of a
conventional optoelectronic hybrid integrated module.
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with
reference to the drawings. FIG. 1 is a schematic side sectional
view showing the configuration of an optoelectronic hybrid
integrated module of a first embodiment of the present
invention.
The optoelectronic hybrid integrated module according to the
embodiment shown in FIG. 1 uses a transparent plate 13 having a
light extracting part 14 for inputting/outputting lights between
the outside and an optical device 11, and electrodes 16, 17 wired
on the top and the back surfaces. On the back surface of the
transparent plate, the optical device 11 is flip-chip mounted with
metal bumps so as to be positioned right under the light extracting
part 14, and a driver IC is flip-chip mounted with metal bumps so
as to be positioned near the optical device 11. Here, the
transparent plate 13 is used as a transparent base material.
Although the light extracting part 14 constitute a light coupling
means for improving the light coupling efficient of the transparent
plate facing to the optical device, the light coupling means is not
limited to the configuration of the optical extracting part 14.
The optical device 11 consists of a light emitting device which
converts electric signals into optical signals and outputs them, or
a light receiving device which converts optical signals made
incident into electric signals. The optical device 11 may be formed
of the light emitting devices or the light receiving devices in the
form of plural arrays.
The driver IC 12 constitutes an input/output IC which outputs
electric signals to the light emitting device (optical device) 11.
The driver IC 12 is so configured as to output electric signals
controlled to the current amplitude required for driving the light
emitting device (optical device) 11, to the light emitting device,
corresponding to the modulating signals of the specified voltage.
In the case of the optical device 11 being a light receiving
device, the input/output IC is so configured as an electric
amplifier IC which electrically amplifying electric signals output
from the light receiving device (optical device) 11, and the
electric amplifier IC is used instead of the driver IC 12 shown in
the Figure. Further, a light receiving device is used as the
optical device 11, instead of the light emitting device. As for the
electric amplifier IC, a trans-impedance amplifier, a limiting
amplifier or the like is used.
The optoelectronic hybrid integrated module of the present
invention includes two modules, one of which includes a light
emitting device as described above so as to make lights from the
optical device to be emitted from the plate side, and the other
includes a light receiving device so as to make lights from the
outside of the plate incident to the optical device. However, the
basic configurations are same, and only the optical device and the
function of the input/output IC corresponding to the device are
different. Therefore, a mode including a light emitting device and
a driver IC is exemplary explained, which is also applied to
embodiments described hereinafter with reference to the drawings.
However, the present invention is not limited to this mode. Another
mode in which the light emitting device is substituted with a light
receiving device, and the driver IC is substituted with an electric
amplifier IC is also included in the scope of the present
invention.
The transparent plate 13 is desirably made of a material such as
glass or silicon series having high permeability to the wavelength
of the optical device 11. The top surface of the light extracting
part 14 may be a flat surface if the beam divergence of the optical
device 11 is small. Further, the electrodes 16 and 17 disposed on
the top and the back surfaces of the transparent plate 13 are
formed by using the lithographic technique, after the electrode
material is deposited on the respective surfaces. The electrode 16
on the back surface is formed to electrically connect the optical
device 11 and the driver IC 12, and the driver IC 12 and the
outside, and to perform high-precision positioning of the optical
device 11 and the driver IC 12 by flip-chip mounting using the
metal bumps 15.
In this way, since the connection is realized with the flip-chip
mounting, space for connection required in the conventional wire
bonding is not needed, which enables high density mounting. On the
other hand, the electrode 17 on the top surface is formed to take a
part of the role of an electromagnetic shield as a ground
electrode. This enables the shield configuration to be realized
without using an expensive metal package as conventional examples.
Further, when resin sealing is performed, only the area around the
device mounted on the back surface of the transparent plate 13
should be sealed. By selecting appropriate resin material and
performing resin sealing between the transparent plate 13 and the
optical device 11 without air gap, sealing which never takes in
unintentional reflection or scattering can be realized. Thereby, a
step of injecting resin into the whole hollow part, which is
required in conventional divided packages, is not needed any
more.
Next, the operation of the optoelectronic hybrid integrated module
1, in the case of the optical device 11 being a light emitting
device, will be described. An electric logical signal of the
prescribed voltage is supplied from the outside to the driver IC
12, and at the same time, power supply voltage is provided to the
driver IC 12 through the electrode 16 on the transparent plate 13.
From the driver IC 12, a current corresponding to the outside
electric signal and having an amplitude required for driving the
optical device 11 (in this case, light emitting device) is input
into the optical device 11. Corresponding to the input current, an
optical signal is emitted from the optical device 11, and is output
to the outside through the light extracting part 14.
In the case of the optical device 11 being a light receiving
device, the optical device receives an optical signal made incident
from the outside through the light extracting part 14, and a
current generated by the light receiving device is converted into
voltage and is output to the outside with the prescribed voltage,
by an electric amplifier IC provided instead of the driver IC
12.
Next, a second embodiment according to the present invention will
be described with reference to the drawings. FIG. 2 is a schematic
side sectional view showing the configuration of an optoelectronic
hybrid integrated module according to the second embodiment in
which the light extracting part of the present invention includes a
light coupling material such as a potting lens.
A transparent plate 23 itself is formed of flat surfaces, and a
light coupling material 24, which is a light coupling means, is
formed by bonding a convex potting lens or microlens to the
transparent plate 23. Taking into account the thermal history in
the mounting step, it is desirable that the light coupling material
24 has a coefficient of thermal expansion (CTE) close to that of
the transparent plate 23. Further, since reflection is suppressed
by the bonded surface between the transparent plate 23 and the
lens, it is desirable that the refractive index of the lens be
similar to that of the transparent plate 23. Thereby, condensing
can be performed effectively even if the beam divergence is large.
The configuration except the light coupling material 24 being
provided, more specifically, an optical device 21, a driver IC 22,
a transparent plate 23, electrodes 26 and 27, and metal bumps 25
are same as that of the first embodiment, and the operations
thereof are also same as that of the first embodiment, therefore
the explanations are omitted.
Next, a third embodiment according to the present invention will be
described with reference to the drawings. FIG. 3 is a schematic
side sectional view showing the configuration of an optoelectronic
hybrid integrated module according to the third embodiment in which
the light extracting part of the present invention includes a
coupling unit which has been formed in the transparent plate
beforehand.
A transparent plate 33 is made of an Si substrate, polymer, glass
or the like, and a light coupling unit 34 is a lens formed in the
transparent plate 33 itself by etching or machining. In the case of
this transparent plate 33, the light coupling unit 34, that is, a
light coupling means, is integrally formed, whereby misalignment of
the optical axis of the light coupling means can be reduced
substantially comparing with that of the second embodiment. The
configuration except the light coupling unit 24 being provided,
more specifically, an optical device 31, a driver IC 32, a
transparent plate 33, electrodes 36 and 37, and metal bumps 35 are
same as that of the first embodiment, and the operations thereof
are also same as that of the first embodiment, therefore the
explanations are omitted.
Next, a fourth embodiment according to the present invention will
be described with reference to the drawings. FIG. 4 is a schematic
side sectional view showing the configuration of an optoelectronic
hybrid integrated module according to the fourth embodiment having
such a configuration that an optical axis converter is provided at
the light extracting part of the present invention.
The optical axis converter 44, which may be formed by mounting a
micro mirror or the like on a transparent plate 43 or by processing
the transparent plate 43 itself so as to be a metal mirror, is
capable of converting the optical axis by, for example, 90 degrees
from the vertical direction to the horizontal direction, as shown
in FIG. 4. Further, if the beam divergence of an optical device 41
causes a problem, the mirror part can be formed to be a concave
mirror so as to have a condensing function.
The configuration except the optical axis converter 44 being
provided, more specifically, an optical device 41, a driver IC 42,
a transparent plate 43, electrodes 46 and 47, and metal bumps 45
are same as that of the first embodiment, and the operations
thereof are also same as that of the first embodiment, therefore
the explanations are omitted.
Next, a fifth embodiment according to the present invention will be
described with reference to the drawings. FIG. 5 is a schematic
side sectional view showing the configuration of an optoelectronic
hybrid integrated module according to the fifth embodiment in which
the transparent base material of the present invention consists of
a flexible sheet. The configurations of a light extracting part 54,
an optical device 51 and a driver IC 52 are same as those of the
first to the fourth embodiments.
The present embodiment has a characteristic that inputs of electric
signals from the outside (or outputs of electric signals to the
outside) are carried out through a flexible sheet 53, which is the
transparent base material. Although the configuration corresponding
to the first embodiment is shown here, the present embodiment may
have such a configuration that a light coupling material is
provided to a light extracting part 54 as the second to the forth
embodiments, that a light coupling material is provided or formed,
or that an optical axis converter is provided or formed.
Further, by keeping the heights of the optical device 51 and the
driver IC 52 to the same level, an interposer 58 as a holder and a
heat spreader for the optical device 51 and the driver IC 52, can
be arranged in the lower part, which improves heat discharging and
holding functions. Although the state of the interposer 58 being
provided is shown here, it may not be provided.
The interposer may be provided to an optoelectronic hybrid
integrated module having a transparent plate as a transparent base
material described in the first to the fourth embodiments. The
configurations and the operations are same as that of the first
embodiment except that the transparent base material consists of a
flexible sheet and an interposer having heat dissipating and
holding functions is provided, therefore the explanations are
omitted.
Next, a sixth embodiment according to the present invention will be
described with reference to the drawings. FIG. 6 is a schematic
side sectional view showing the configuration of an optoelectronic
hybrid integrated module according to the sixth embodiment in which
the transparent plate of the present invention is fixed to a
holding frame.
Around the lower side of the transparent plate 63, a holding frame
68 having interlayer wiring 69 in mounted, surrounding an optical
device 61 and a driver IC 62. However, light extracting is same as
that of the first to the fourth embodiments, like the fifth
embodiment.
The present invention has a characteristic that
inputting/outputting of electricity is carried out by the
interlayer wiring 69 incorporated in the holding frame 68, which
enables electrical connections from the lower side. Further, the
interlayer wiring 69 may incorporate passive components and be
embedded in the holding frame 62. Fixing of the holding frame 62
and the transparent plate 63 can be achieved solely with electrical
connections, without adjusting the optical axis like conventional
art. Although an example of the transparent base material being the
transparent plate 63 is described here, a holding frame can be
provided in the same way to an optoelectronic hybrid integrated
module in which the transparent base material is a flexible sheet.
Further, a configuration combining an interposer and a holding
frame is also acceptable.
An optical device 61, a driver IC 62, a transparent plate 63, a
light extracting part 64, electrodes 66 and 67, and metal bumps 65
are same as those of the first embodiment, and the operations are
also same as those of the first embodiment, therefore the
explanations are omitted.
Next, a first embodiment of a light input/output apparatus, which
is a signal processing module using the optoelectronic hybrid
integrated module of the present invention, will be described with
reference to the drawings. FIG. 7 is a schematic side sectional
view showing the configuration of a light input/output apparatus of
the first embodiment formed of an optoelectronic hybrid integrated
module and a logic LSI.
A light input/output apparatus 10 of the first embodiment shown in
FIG. 7 includes: an optoelectronic hybrid integrated module 101 of
the present invention, and a logic LSI 102 for controlling electric
signals being input into or output from the module, which are
mounted on a substrate 104 in which electrodes 105 are arranged
between layers and on the surface.
The optoelectronic hybrid integrated module 101 shown in FIG. 7 has
the configuration of the optoelectronic hybrid integrated module 5
according to the aforementioned fifth embodiment, and the
optoelectronic hybrid integrated module 101 and the logic LSI 102
are electrically connected with each other by a flexible sheet 103
so as to exchange electric signals.
The voltage signal level of inputs/outputs of the optoelectronic
hybrid integrated module 101 is defined by the driver IC
incorporated in the optoelectronic hybrid integrated module 101,
whereby the logic LSI 102 can be designed similar to the general
LSIs. Although a case of one optoelectronic hybrid integrated
module 101 being provided is shown in FIG. 7, plural modules may be
provided. Further, an electrical connection from the logic LSI 102
to each module may be performed separately with each flexible sheet
103.
Although the optoelectronic hybrid integrated module 5 of the fifth
embodiment using a flexible sheet has been described as the
optoelectronic hybrid integrated module 101, optoelectronic hybrid
integrated modules according to the first to the fourth and the
sixth embodiments may be used, and the connection between
optoelectronic hybrid integrated modules and the logic LSI may be
performed with a metal wire or electrodes in the substrate 104.
Next, a second embodiment according to a light input/output
apparatus which is a signal processing module using an
optoelectronic hybrid integrated module of the present invention
will be described with reference to the drawings. FIG. 8 is a
schematic side sectional view showing the configuration of a light
input/output apparatus according to the second embodiment in which
heating of a logic LSI is discharged from the substrate side.
A light input/output apparatus 20 according to the second
embodiment includes a discharging means such as thermal metal vias
or the like under the logic LSI 202 in the substrate 204, whereby
heating can be discharged from the substrate side.
The electrical connection between the optoelectronic hybrid
integrated module 201 and the logic LSI 202 is carried out with a
flexible sheet 203 constituting the optoelectronic hybrid
integrated module 201. Further, electrical connection between the
logic LSI 202 and an electrode 205 in the substrate 204 is carried
out by a metal wire 206. In the embodiment, optoelectronic hybrid
integrated modules according to the first to the forth and the
sixth embodiments using transparent plates may be used, and
connection between the optoelectronic hybrid integrated module and
the logic LSI may be carried out with a metal wire or an electrode
in the substrate 204.
EXAMPLE
A specific example of the optoelectronic hybrid integrated module 1
shown in FIG. 1 will be described. The optical device 11 was a
vertical cavity surface emitting laser (VCSEL) with an oscillation
wavelength of 850 nm, and was flip-chip mounted on the transparent
plate using AuSn solder as the metal bumps 15. As the transparent
plate 13, one having high light permeability to the oscillation
wavelength of 850 nm of the optical device 11 was selected. The
driver IC 12 controlled input currents to the optical device 11
according to electric signals of 3.125 Gb/s differentially input
from the outside. The amplitude of currents supplied to the optical
device 11 was about several mA, and the maximum output was -1 dBm.
Since the optical device 11 and the light extracting part 14 were
flip-chip mounted, the coupling effect was -3.+-.0.3 dB.
INDUSTRIAL AVAILABILITY
As described above, the following effects have been achieved with
the optoelectronic hybrid integrated module according to the
present invention.
1) The number of components and processes can be reduced, so that
the mounting cost can be suppressed. This is due to the
configuration in which an optical device and a driver IC or an
electric amplifier IC are flip-chip mounted on a transparent base
material having wiring and a light extracting function.
2) The narrow margin of the wiring is acceptable, whereby the
mounted component can be arranged in high density, due to the
optical device and the driver IC being flip-chip mounted.
3) An electromagnetic shield can be realized at low cost, due to a
ground electrode being formed on the transparent base material,
which also serves as an electromagnetic shield.
4) Dispersion of distance between the lens and optical device can
be suppressed, whereby dispersion in the light output can be
reduced, due to an optical device being flip-chip mounted on the
transparent base material having a light extracting function.
5) Only a gap between each device and the transparent base material
is to be sealed, which can be done relatively easily. This is due
to the fact the optical device and the driver IC are mounted
collectively on the transparent base material.
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