U.S. patent number 7,458,815 [Application Number 11/393,389] was granted by the patent office on 2008-12-02 for module to couple to a plurality of backplanes in a chassis.
This patent grant is currently assigned to Intel Corporation. Invention is credited to Robert J. Albers, Edoardo Campini, Hassan Fallah-Adl.
United States Patent |
7,458,815 |
Fallah-Adl , et al. |
December 2, 2008 |
Module to couple to a plurality of backplanes in a chassis
Abstract
A chassis includes a plurality of slots to receive modules. The
chassis further includes a first backplane to couple to modules
that are received in the plurality of slots. The modules are to
couple to the first backplane via a first communication interface
on each module. The chassis also includes a second backplane to
couple to at least a subset of the modules via a second
communication interface on each of the subset of modules. One of
the backplanes may be located in an upper or lower air plenum and
used to interconnect modules slid along the slots from opposite
directions. Some of the module connectors may be retractable to
enable the modules to move into the chassis. The interface may be
electrical, optical inductive or capacitive.
Inventors: |
Fallah-Adl; Hassan (Chandler,
AZ), Campini; Edoardo (Mesa, AZ), Albers; Robert J.
(Folsom, CA) |
Assignee: |
Intel Corporation (Santa Clara,
CA)
|
Family
ID: |
38575894 |
Appl.
No.: |
11/393,389 |
Filed: |
March 30, 2006 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20070238326 A1 |
Oct 11, 2007 |
|
Current U.S.
Class: |
439/61; 361/695;
361/796 |
Current CPC
Class: |
H05K
7/1451 (20130101) |
Current International
Class: |
H01R
12/00 (20060101) |
Field of
Search: |
;439/61,64
;361/690-695,788,796 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Abrams; Neil
Attorney, Agent or Firm: Blakely, Sokoloff, Taylor &
Zafman LLP
Claims
What is claimed is:
1. A chassis comprising: a plurality of slots to receive modules; a
first backplane to couple to modules that are received in the
slots, the modules to couple via a first communication interface on
each module; a second backplane to couple to at least a subset of
the modules received in the slots, the subset of modules to couple
via a second communication interface on each of the subset of
modules; and two air plenums located above and below the slots,
wherein the first backplane is mounted in one of the air
plenums.
2. A chassis according to claim 1 further comprising: a third
backplane to couple to modules that are received in the slots, the
modules to couple via a third communication interface on each
module, wherein the first backplane is mounted in the air plenum
located above the slots and the third backplane is mounted in the
air plenum located below the slots.
3. A chassis according to claim 1, wherein the first backplane
couples to the first communication interface on each module through
at least one interconnect in the first communication interface.
4. A chassis according to claim 3, wherein the second backplane
couples to the second communication interface on each of the subset
of modules through at least one interconnect in the second
communication interface.
5. A chassis according to claim 3, wherein the interconnect
comprises the interconnect configured to couple in at least one
manner selected from the following group of: an impedance
controlled manner, an optical manner, an inductive manner and a
capacitive manner.
6. A chassis according to claim 5, wherein the second backplane
operates in compliance with the Advanced Telecommunications
Computing Architecture specification.
7. A chassis according to claim 1, wherein the second backplane and
the subset of modules received in the slots that couple to the
second backplane operate in compliance with the Advanced
Telecommunications Computing Architecture specification.
8. A method comprising: inserting a module in a slot in a chassis,
the module including a first communication interface to couple to a
first backplane and a second communication interface to couple to a
second backplane, both backplanes located within the chassis, the
chassis further including two air plenums located above and below
the plurality of slots, the second backplane mounted in one of the
air plenums; coupling in communication the module to another module
inserted in another slot in the chassis, the coupling in
communication via the module's communication interfaces; and
forwarding data between the module and the other module, the data
forwarded through at least one communication interface coupled to
the first backplane and/or through at least one communication
interface coupled to the second backplane.
9. A method according to claim 8, wherein coupling in communication
via the first communication interface to couple to the first
backplane includes: an interconnect configured to couple in an
impedance controlled manner.
10. A method according to claim 8, wherein coupling in
communication via the module's second communication interface
includes: an interconnect configured to couple in at least one
manner selected from the following group of: an impedance
controlled manner, an optical manner, an inductive manner and a
capacitive manner.
11. A method according to claim 10, wherein the second backplane
operates in compliance with the Advanced Telecommunications
Computing Architecture specification.
12. A method according to claim 11, wherein the first backplane
operates in compliance with the Time Division Multiplexing Fabric
to Interface Implementation (TFI-5) specification.
13. A system comprising: a chassis including a plurality of slots
to receive modules and a plurality of backplanes to include a first
and a second backplane, the chassis further including two air
plenums located above and below the plurality of slots, the second
backplane mounted in one of the air plenums; a module received in a
first slot of the plurality of slots; and another module received
in a second slot of the plurality of slots, the other module to
include: a first communication interface to couple the other module
to a first backplane in the chassis via an interconnect configured
to couple a fabric interface associated with the first
communication interface to a communication channel routed over the
first backplane to the module received in the first slot; and a
second communication interface to couple the other module to a
second backplane in the chassis via an interconnect.
14. A system according to claim 13, wherein the chassis includes a
third backplane and the other module includes a third communication
interface to couple the other module to the third backplane via an
interconnect.
15. A system according to claim 13, wherein the interconnect
comprises the interconnect configured to couple in at least one
manner selected from the following group of: an impedance
controlled manner, an optical manner, an inductive manner and a
capacitive manner.
16. A system according to claim 13, wherein the module received in
the first slot comprises a switch module.
17. A system according to claim 16, wherein the first backplane,
the switch module and the other module operate in compliance with
the Advanced Telecommunications Computing Architecture
specification.
Description
BACKGROUND
Modular platform systems are typically used in communication
networks where reliability is increased and cost reduced by the use
of interoperable pieces. Such interoperable pieces may include
modular platform shelves or chassis. Typically, each modular
platform chassis receives and couples in communication various
interoperable pieces or modules. These modules may include circuit
boards or mezzanine cards. These boards or mezzanine cards may
include, but are not limited to, blades, carrier boards, processing
boards, switches, hubs, etc. Other interoperable modules that are
received and coupled in a modular platform chassis may include
components such as fans, power equipment modules (PEM), field
replaceable units (FRUs), alarm boards, etc.
Some industry initiatives are seeking ways to standardize the way
modules in a modular platform system interoperate. One such
initiative is the PCI Industrial Computer Manufacturers Group
(PICMG), Advanced Telecommunications Computing Architecture (ATCA)
Base Specification, PICMG 3.0 Rev. 2.0, published Mar. 18, 2005,
and/or later versions of the specification ("the ATCA
specification"). Typically modules designed to operate according to
the ATCA specification are received in slots in a modular platform
chassis. These modules may then couple to a backplane via
communication interfaces that are associated with a fabric
interface.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 provides a partial view of an example modular platform
system with modules coupled to backplanes in an modular platform
chassis;
FIGS. 2A-B provide side views of a portion of the example modular
platform system with two backplanes in the modular platform
chassis;
FIGS. 3A-B provide additional side views of a portion of the
example modular platform system with two backplanes in the modular
platform chassis;
FIGS. 4A-C provide side views of a portion of the example modular
platform chassis with three backplanes;
FIG. 5A is an illustration of an example modular platform system
with a module to be received in an example modular platform
chassis;
FIG. 5B provides a side view of a portion of the example modular
platform system; and
FIG. 6 is a flow chart of an example method to insert the module
into the slot in the modular platform chassis to couple the module
to a plurality of backplanes.
DETAILED DESCRIPTION
As mentioned in the background, modules that are received in slots
in an ATCA compliant modular platform chassis may couple to a
backplane via communication interfaces that are associated with a
fabric interface. As a result, in one example, these modules may
couple in communication via the fabric interface to each other
through one or more communication channels that are routed over the
backplane. These communication channels may be used to forward data
from each module's fabric interface and then through portions of
the communication channel that are routed over the backplane and/or
through other elements in the ATCA modular platform chassis (e.g.,
switches or hubs). At least a portion of the data, for example, is
forwarded to other modules coupled to the backplane.
Typically, a single backplane in a modular platform chassis is
limited in the number of communication channels allocated to
forward data from a module that couples to it via a fabric
interface. For example, a type of ATCA compliant modular platform
chassis is designed to receive and couple in communication 16
modules. For this ATCA design, 14 modules or boards may be coupled
in communication through two switch modules. This configuration is
referred to in the ATCA specification as a dual-star fabric
topology. In a dual-star fabric topology, according to the ATCA
specification, no more than one communication channel is provided
to a non hub/switch module to forward data to another module via
its fabric interface when coupled to an ATCA backplane. A single
communication channel may result in a bottleneck for data forwarded
from this non hub/switch module. This bottleneck is problematic to
the throughput of data forwarded through a module's fabric
interface when the module is coupled to a single backplane and also
limits the throughput capability of a modular platform system.
In one example, a chassis includes a plurality of slots to receive
modules. The chassis includes a first backplane to couple to
modules that are received in the slots. The modules are to couple
via a first communication interface on each module. A second
backplane is also included in the chassis. The second backplane is
to couple to at least a subset of the modules. The subset of the
modules to couple via a second communication interface on each of
the subset of modules.
FIG. 1 provides a partial view of an example modular platform
system 100 with modules coupled to backplanes in modular platform
chassis 101. As depicted in FIG. 1, modules (e.g., front boards)
110, 120 and 130 are received in front slots 102C, 102H and 102K
from among front slots 102A-M. Modular platform chassis 101 is also
shown as including rear slots 104A-M to receive modules (e.g., rear
transition modules (RTMs). The partial view of modular platform
chassis 101 also shows lower air plenum 106B. As described below,
modular platform 100 also includes an upper air plenum 106A. These
upper and lower air plenums, for example, facilitate the flow of
air into and out of modular platform chassis 101.
In one implementation, modular platform chassis 101 includes a
plurality of backplanes to couple to modules that are received in
its front or rear slots. For example, the plurality of backplanes
includes backplanes 140 and 150. These backplanes may couple to
modules inserted or received in front slots 102A-M, (e.g., front
boards 110, 120 or 130) or in rear slots 104A-M (e.g., RTMs--not
shown).
Backplane 140, as depicted in FIG. 1, includes communication
interfaces 142A-M and power interface 145A-M. In one
implementation, communication interfaces 142A-M couple to
communication interfaces on modules received in front slots 102A-M.
For example, communication interface 142C couples to communication
interface 112 on front board 110. Power interfaces 145A-M, in one
example, provide power to modules received in front slots 102A-M.
For example, power interface 145C couples to power interface 115 on
front board 110 to provide power to front board 110.
Backplane 150, as depicted in FIG. 1, includes communication
interfaces 152A-M and 154A-M. In one implementation, communication
interfaces 152A-M couple to modules received in front slots 102A-M
and communication interfaces 154A-M couple to modules received in
rear slots 104A-M. For example, communication interfaces 152C and
152H couple to communication interfaces 112 and 122, respectively,
on front boards 110 and 120. In another example, communication
interfaces 154C and 154H may couple to communication interfaces on
RTMs (not shown) received in rear slots 104C and 104H,
respectively.
In one example, modular platform chassis 101 is designed to operate
in compliance with the ATCA specification. Additionally, backplane
140 and modules received in front slots 102A-M or rear slots 104A-M
(e.g., front boards 110, 120, 130 or RTMs) may also be designed to
operate in compliance with the ATCA specification, although this
disclosure is not limited to only ATCA complaint modular platform
chassis, backplanes and modules but may also apply to Compact
Peripheral Component Interface (cPCI), VersaModular Eurocard (VME),
or other types of industry standards governing the design and
operation of chassis, backplanes and modules. In addition, this
disclosure may also apply to proprietary chassis, backplanes and
modules designed to operate in a modular platform system.
In one implementation, communication interface 112 on front board
110 is to couple to backplane 140 in an ATCA backplane region
called "zone 2". The ATCA specification refers to zone 2 as the
data transport connector zone. In this implementation,
communication interface 112 is associated with a "base" interface
and a "fabric" interface that couple to backplane 140 via one or
more interconnects. The fabric interface associated with
communication interface 112 is used to forward data and/or
instructions through a communication channel, a portion of which is
routed over backplane 140. At least some of the data, for example,
is forwarded to other modules received in front slots 102A-M and/or
rear slots 104A-M.
In one example, an ATCA compliant modular platform chassis 101 is
configured in a dual-star fabric topology. As mentioned above, a
single communication channel is provided to a module coupled to an
ATCA compliant backplane to forward data from the non hub/switch
module's fabric interface through that single communication
channel. So in this example, communication interface 112 on front
board 110 couples to communication interface 142C and data is
forwarded from the fabric interface associated with communication
interface 142C and then through portions of the communication
channel routed over backplane 140. At least a portion of the data,
in this dual-star example, is forwarded through switch or hub
modules and then to other modules that are coupled to backplane 140
(e.g., front boards 120 or 130) or to modules remotely located to
modular platform chassis 101.
In one implementation, as described in more detail below,
communication interfaces 152A-M and 154A-M on backplane 150 may
couple to communication interfaces on modules received in front
slots 102A-M or rear slots 104A-M. This may provide additional
communication channels for these modules to forward data from
fabric interfaces associated with their communication interfaces
coupled to these backplane 150 communication interfaces. For
example, a fabric interface associated with communication interface
114 on front board 110 couples to a communication channel routed
over backplane 150 via communication interface 152C. Data, for
example, is forwarded through the fabric interface and then through
the communication channel routed to communication interface 152C
and over backplane 150 and then possibly through/to other modules
coupled to either backplane 140 or backplane 150.
In one implementation, a fabric interface for a module received in
modular platform chassis 101 may be designed to support one or more
packet-based communication protocols. Several packet-based
communication protocols, for example, are associated with and/or
described by sub-set specifications to the ATCA specification and
are typically referred to as the "PICMG 3.x specifications." The
PICMG 3.x specifications include, but are not limited to,
Ethernet/Fibre Channel (PICMG 3.1), Infiniband (PICMG 3.2),
StarFabric (PICMG 3.3), PCI-Express/Advanced Switching (PICMG 3.4),
Advanced Fabric Interconnect/S-RapidIO (PICMG 3.5) and Packet
Routing Switch (PICMG 3.6).
In one example, a fabric interface associated with communication
interface 112 or a fabric interface associated with communication
interface 124 may support a communication protocol described in a
PICMG 3.x specification. This PICMG 3.x specification support, for
example, is to facilitate the forwarding of data and/or
instructions from front board 110 and through portions of the
communication channels routed over backplanes 140 or 150.
In other implementations, a fabric interface for a module received
in modular platform chassis 101 may be designed to support other
types of communication protocols. For example, the fabric interface
may support time division multiplexing (TDM) and/or frequency
division multiplexing (FDM). A fabric interface that supports TDM,
for example, may operate in compliance with one or more industry
standards associated with optical interconnects. One such industry
standard is the Optical Internetworking Forum (OIF), TFI-5: TDM
Fabric to Framer Interface Implementation, published September,
2003 and/or later versions ("the TFI-5 specification").
In one example, fabric interfaces associated with communication
interfaces on modules that couple to backplane 140 in modular
platform chassis 101 operate in compliance with one or more
packet-based PICMG 3.x specifications. In this example, fabric
interfaces associated with communication interfaces on modules that
couple to backplane 150 operate in compliance with a TDM-based
standard such as the TFI-5 specification. Thus, in this example,
packet-based communication protocols are used to forward data from
modules via communication channels routed over backplane 140 and
TDM-based communication protocols are used to forward data from
modules via communication channels routed over backplane 150.
In one implementation, at least a portion of the backplanes in
modular platform chassis 101 may be either active or passive
backplanes. For example, a passive backplane may operate in
accordance with the ATCA specification and thus includes little to
no active circuitry or logic that is resident on the backplane. An
active backplane, for example, may be a backplane that includes
active circuitry or logic that is resident on the backplane.
FIG. 2A provides a side view of a portion of modular platform
system 100 with two backplanes in modular platform chassis 101. As
portrayed in FIG. 2A, in one example, the first backplane is
backplane 140 and another backplane is backplane 150. In one
example, backplane 150 is located or mounted just above front board
110 and RTM 210 at the lower portion of upper air plenum 106A.
Backplane 150, in one example, is designed to be as narrow as
possible to reduce the obstruction of air flow as it moves from air
inlet 205 to air outlet 207. As described below, backplane 150 may
also be placed or mounted at the upper portion of lower air plenum
106B.
In addition to lower air plenum 106B depicted in FIG. 1 for modular
platform chassis 101, FIG. 2A depicts an upper air plenum 106A. In
one example, lower air plenum 106B has an air inlet 205 and upper
air plenum 106A has an air outlet 207. In one implementation, fan
222 is located in upper air plenum 106A and pulls air from air
inlet 205 to air outlet 207 to cool elements contained within
modular platform chassis 101. This disclosure is not limited to
only a fan located in an upper air plenum. The fan may be located
anywhere within modular platform chassis 101 to move air to cool
elements within modular platform chassis 101.
As described above for FIG. 1, front board 110 includes
communication interfaces 112 and 114 that couple to communication
interfaces on these two backplanes. Also, FIG. 2A shows a module
210 (e.g., an RTM) coupled to front board 110. RTM 210, in one
example, couples to backplane 150 via communication interface 214
and couples to front board 110 via RTM interface 212.
In one implementation, front board 110, backplane 140 and RTM 210
are each designed to operate in compliance with the ATCA
specification. As a result, RTM interface 212 on RTM 210 couples to
front board 110 via RTM interface 117 in another ATCA connector
zone ("zone 3"). In this implementation, RTM 210 receives power
when coupled to front board 110 through RTM interface 212. The
power, for example, is provided through power feeds (not shown)
routed from RTM interface 117. The RTM interfaces on front board
110 and RTM 210, for example, are also associated with at least one
fabric interface to forward data over a communication channel
between RTM 210 and front board 110.
In one example, communication interface 214 on RTM 210 is
associated with a fabric interface through which data is forwarded
when communication interface 214 is coupled to backplane 150. Data,
for example, is forwarded through this fabric interface and then
through portions of a communication channel routed over backplane
150 and through/to other modules coupled to either backplane 140 or
backplane 150. As mentioned above, the fabric interface may operate
in compliance with one or more communication protocols.
In one implementation, various interconnects are configured to
couple the fabric interface associated with the communication
interfaces on front board 110 and RTM 220 to communication channels
routed over backplanes 140 and 150. These interconnects are
portrayed in FIG. 2A as interconnects 112A-E, 114A and 214A. At
least one interconnect from among interconnects 112A-E, for
example, couples a fabric interface associated with communication
interface 112 to a communication channel routed over backplane
140.
In one example, an interconnect is configured to couple a fabric
communication interface to a communication channel routed over
backplane 140 and/or 150 in an impedance controlled manner (e.g.,
via copper-based traces). In another example, the interconnect is
configured to couple via other manners such as in an optical (e.g.,
via optical paths), inductive or capacitive manner. These
interconnect configurations, for example, may incorporate the use
of micro electromechanical systems (MEMS) which may be fabricated
using silicon manufacturing technologies.
In one example of an interconnect configured to couple a fabric
communication interface to a communication channel in an optical
manner includes a two-dimensional (2-D), MEMS-controllable micro
lens array that has been integrated with a
Vertical-Cavity-Surface-Emitting-Laser (VCSEL) array and a
photodiode array. The VCSEL/photodiode arrays, for example, may be
packaged in a flip-chip assembly. In one example, the
VCSEL/photodiode arrays allow an interconnect to implement an
electrical-to-optical conversion and conversely an
optical-to-electrical conversion of data forwarded/received through
the communication channel coupled to the fabric interface in an
optical manner.
In one example of an interconnect configured to couple in an
inductive manner, the interconnect includes an out-of-plane,
three-turn spiral with micro (very small) coil dimensions. For an
example of an interconnect configured to couple in a capacitive
manner, the interconnect includes a parallel plate, area-tunable,
MEMS capacitor. Although the disclosure is not limited to only the
above mentioned interconnect configurations to couple a fabric
interface to a communication channel in an impedance controlled,
optical, inductive or capacitive manner.
In one example, interconnects 112A-E for an ATCA compliant front
board 110 and backplane 140 are high density, impedance controlled
connectors as described in the ATCA specification. In this example,
based on front board 110's insertion in front slot 102C,
interconnects 112A-E couple with communication interface 142C. As a
result, a fabric interface associated with communication interface
112 is coupled to a communication channel routed over backplane
140.
In one implementation interconnect 114A on front board 110 and
interconnect 214A on RTM 210 are configured to be vertically
retractable. For example, prior to the insertion of front board 110
in slot 102C on modular platform chassis 101, interconnect 114A may
be in a retracted position. Once inserted, interconnect 114A may
change its retracted position such that it couples with
communication interface 152C on backplane 150. This coupling may
include coupling in an impedance controlled manner or, as described
above, may include coupling with an interconnect configured to
couple in an optical, an inductive or a capacitive manner. Thus,
for example, a fabric interface associated with communication
interface 114 is coupled to a communication channel routed over
backplane 150 via the vertically retractable interconnect 114A.
In another implementation, interconnect 114A and interconnect 214A
are not configured to be vertically retractable but are configured
to couple to communication interface 152C or 154C once inserted in
slot 102C. This coupling may include coupling in an impedance
controlled manner or, as described above, may include a coupling in
an optical, an inductive or a capacitive manner.
FIGS. 2B provides another side view of a portion of modular
platform system 100 with two backplanes in modular platform chassis
101. Similar to FIG. 2A, in one example, one backplane is backplane
140 and another backplane is backplane 150. However, FIG. 2B
depicts backplane 150 as located or mounted at the upper portion of
lower air plenum 106B. As shown in FIG. 2B, in one example, front
board 110 and RTM 210's communication interfaces 114 and 214,
respectively, are now located to couple to backplane 150 in this
position.
FIG. 3A provides an additional side view of a portion of modular
platform system 100 with a first backplane and a second wide
backplane in modular platform chassis 101. As shown in FIG. 3A, in
one example, the first backplane is backplane 140 as depicted in
FIG. 1 and FIGS. 2A-B. In this example, a wide backplane 350
replaces a narrow backplane 150 and is placed or mounted at the
upper portion of upper air plenum 106A. Thus, in this example,
backplane 350's placement in this position lessens the need to
maintain a narrow backplane to reduce the obstruction of air flow
as if moves from air inlet 205 to air outlet 207. A wider
backplane, for example, may increase the quantity and types of
communication channels supported and/or routed through the wider
backplane.
In one example, interconnect 114A for communication interface 114
is configured to include a flexible signal medium. This flexible
signal medium includes, but is not limited to, a flexible circuit,
a ribbon cable, a coaxial cable or an optical glass/plastic fiber.
The flexible signal medium, for example is used to couple
communication interface 114 to a communication channel that is
routed over backplane 350. In one implementation, as shown in FIG.
3A, interconnect 114A passes through opening 119 on front board 110
and opening 319C on modular platform chassis 101. Interconnect 114A
may then couple to communication interface 352C on backplane 350.
As a result, interconnect 114C couples a fabric interface
associated with communication interface 114 to a communication
channel that is routed over backplane 350. This coupling may
include a coupling in either an impedance controlled, optical,
inductive or capacitive manner.
In one example, interconnect 214A is configured to couple in an
optical manner to a fabric interface associated with communication
interface 214 to a communication channel that is routed to
communication interface 154C and over backplane 350. For example,
interconnect 214A includes VCSEL/photodiode arrays. Interconnect
214A, for example, is configured to use these VCSEL/photodiode
arrays to couple the fabric interface to the communication channel
via an optical path. This optical path, for example, includes
plastic or glass fibers and/or plastic or glass waveguides that may
propagate an optical signal from the VCSEL/photodiode arrays using
either single wavelength or wavelength division multiplexing (WDM).
In one example, this optical path is routed from interface 214,
through the space/gap in upper air plenum 106A and to communication
interfaces 154C without the use of flexible signal mediums or
retractably configured interconnects.
In other examples, both interconnects 114A and 214A are configured
to include flexible signal mediums or both are configured to
include VCSEL/photodiode arrays to couple in an optical manner
without the use of flexible signal mediums or retractably
configured interconnects. In yet other examples, interconnects 114A
and 214A are configured to couple in combinations of other types of
coupling manners (e.g., impedance controlled, inductive,
capacitive, etc.) that may include the use of flexible signal
mediums, retractable interconnects or optical pathways routed
though spaces or gaps in air plenums.
FIG. 3B provides another side view of a portion of modular platform
system 100 with first backplane and a second wide backplane in
modular platform chassis 101. Similar to FIG. 3A, in one example,
the first backplane is backplane 140 and the second narrow
backplane is backplane 350. However, FIG. 2B depicts backplane 350
at the bottom portion of the lower air plenum 106B. As shown in
FIG. 3B, in one example, front board 10 and RTM 210's communication
interfaces 114 and 214, respectively, are now located to couple to
backplane 350 in this position.
Although not depicted in FIGS. 3A-B, in one example, interconnect
114A may be configured to couple communication interface 114 to
communication interface 152C via a flexible signal medium that is
routed between front board 110 and RTM 210. In this example,
communication interface 114 is possibly located closer to RTM
interface 117 to reduce the length of the flexible signal medium.
Additionally, communication interface 152C may be moved to further
reduce the length of the flexible signal medium.
FIGS. 4A-C provide side views of a portion of modular platform
system 100 with three backplanes in modular platform chassis 101.
FIG. 4A depicts modular platform chassis 101 with backplane 140 and
two example narrow backplanes, backplane 150A and backplane 150B.
FIG. 4B shows backplane 140 and two example wide backplanes,
backplane 350A and backplane 350B. FIG. 4C portrays backplane 140
and an example combination of a wide and a narrow backplane,
backplane 350 and backplane 150, respectively.
In one example, backplanes located or mounted in upper air plenum
106A include communication interfaces 152A-M and 154A-M to couple
to communication interfaces on modules received in front slots
102A-M or rear slots 104A-M. In this example, backplanes located or
mounted in lower air plenum 106B include communication interfaces
156A-M and 158A-M to couple to communication interfaces on the
modules received in the front and rear slots.
In one example, for each of the three backplane combinations, front
board 110 and RTM 210 include communication interfaces 114, 116 and
224, 226, respectively, to couple to either the two narrow, two
wide or a combination of wide and narrow backplanes. As depicted in
FIGS. 4A-C these communication interfaces couple to communication
interfaces 152C and 154C for a backplane mounted in upper air
plenum 106A and couple to communication interfaces 156C and 158C
for a backplane mounted in lower air plenum 106B. As described
above, for interconnects 114A and 224A, an interconnect may be
configured to couple a fabric interface to a communication channel
via combinations of various interconnect configurations (e.g.,
retractable, flexible signal medium, optical path) to couple in
different manners (e.g., impedance controlled, optical, inductive,
capacitive).
FIG. 5A is an illustration of an example modular platform system
500 with front board 110 to be received in modular platform chassis
501. As shown in FIG. 5A, modular platform chassis 501 includes
front slots 502A-P. In one example, similar to modular platform
chassis 101, as described above, modular platform chassis 501
includes a plurality of backplanes to couple to communication
interfaces on modules inserted in slots in modular platform chassis
501. Although not shown in FIG. 5A, in one example, modular
platform chassis 501 also includes rear slots 504A-P to receive
modules (e.g., RTMs) from the rear.
In one example, modular platform chassis 501 includes openings
519A-P. Openings 519A-P may facilitate the routing of an
interconnect from a front board inserted in slots 502A-P to a
backplane in modular platform chassis 501. For example, as shown in
FIG. 5A, interconnect 514A is configured to include a flexible
signal medium that is routed through opening 519B.
FIG. 5B, provides a side view of a portion of modular platform
system 500 with front board 110 received in front slot 502L of
modular platform chassis 501. As shown in FIG. 5B, modular platform
chassis 501 includes three backplanes, backplane 540, backplane 550
and backplane 560. In one implementation, backplane 540 is a
backplane similar to the backplane 140 described above. In that
regard, backplane 540, for example, is designed in compliance with
the ATCA specification.
As shown in FIG. 5B, backplane 550 is a wide backplane located at
the upper portion of upper air plenum 506A. In one example,
backplane 550 includes communication interfaces 552A-P and 554A-P
to couple to communication interfaces on modules received in
modular platform chassis 501's front slots 502A-P and rear slots
504A-P, respectively. In one example, similar to that described for
FIG. 3A above, interconnect 114A is configured to include a
flexible signal medium that is used to couple a fabric interface
associated with communication interface 114 to a communication
channel routed to communication interface 552L and over backplane
550. As described above, interconnect 214A for communication
interface 214 on RTM 210, for example, may be configured to couple
a fabric interface to a communication channel routed to
communication interface 554L and over backplane 550.
As portrayed in FIG. 5B, backplane 560, in one example, is a narrow
backplane located or mounted at the top portion of lower air plenum
506B. However, in this example, unlike the example narrow
backplanes described above, backplane 560 does not couple to
communication interfaces on modules received in rear slots 504A-P.
For example, backplane 560 includes communication interfaces 566A-P
to couple to communication interfaces on modules received in front
slots 502A-P. In one implementation, the exclusion of a
communication interface to couple to a module received in the rear
slots allows for a narrower backplane that may further reduce the
obstruction of airflow through modular platform chassis 501.
In one example, interconnect 116A in communication interface 116 is
configured to couple a fabric interface associated with
communication interface 116 to a communication channel routed to
communication interface 566L and over backplane 560. As described
above, interconnect 116A, for example, is configured to couple via
various manners (e.g., impedance controlled, optical, inductive,
capacitive).
FIG. 6 is a flow chart of an example method to insert a module into
a slot in a modular platform chassis to couple the module to a
plurality of backplanes. In one implementation, the example method
is implemented when front board 110 is inserted in slot 502L in
modular platform chassis 501 as described for FIGS. 5A-B. In this
example implementation, backplane 540 in modular platform chassis
501 operates in compliance with the ATCA specification.
Additionally, the fabric interface associated with communication
interface 112 on front board 110 operates in compliance with the
ATCA specification.
The process begins in block 610, where in one example, front board
110 is inserted in front slot 502L of modular platform chassis
501.
In block 620, in one example, front board 110 couples to the
backplanes in modular platform chassis 101. For example,
communication interface 112 couples to communication interface 542L
on backplane 540. Interconnects 112A-E, for example, are configured
to couple a fabric interface associated with communication
interface 112 to a communication channel routed over backplane 540.
The communication channel, for example, to couple front board 110
in communication with other modules received or inserted in modular
platform chassis 501's front slots.
As described above for FIG. 5B, in one example, interconnect 114A
is used to couple communication interface 114 on front board 110 to
communication interface 552L on backplane 550. This coupling, for
example, uses an interconnect 114A configured to include a flexible
signal medium to couple a fabric interface associated with
communication interface 114 to a communication channel routed
through backplane 550 in either an impedance controlled, optical,
inductive or capacitive manner. Also as described above,
interconnect 116A can be configured to couple a fabric interface
associated with communication interface 116 to a communication
channel routed to communication interface 556L and over backplane
560.
In block 630, in one example, data is forwarded between front board
110 and one or more other modules inserted or received in other
slots in modular platform chassis 501. At least portions of this
data, for example, is forwarded from the fabric interfaces
associated with communication interfaces 112, 114 and 116 and then
through portions of the communication channels routed over
backplanes 540, 550 and 560, respectively.
In one implementation, fabric interfaces associated with
communication interfaces (e.g., 512) that couple to backplane 540
utilize one or more packet-based, communication protocols as
described in the PICMG 3.x specifications and backplane 540
supports or operates in compliance with these PICMG 3.x
specifications. In one example, the fabric interfaces included in
communication interfaces (e.g., 514 and 516) that couple to
backplanes 550 and 560 utilize either packet-based (PICMG 3.x) or
TDM-based (TFI-5) communication protocols. This utilization is
based, for example, on what type of communication protocol
backplanes 550 and 560 are designed to support (e.g., PICMG 3.x or
TFI-5).
The process then starts over, for example, when another module is
inserted in a slot on modular platform chassis 501.
In the previous descriptions, for the purpose of explanation,
numerous specific details were set forth in order to provide an
understanding of this disclosure. It will be apparent that the
disclosure can be practiced without these specific details. In
other instances, structures and devices were shown in block diagram
form in order to avoid obscuring the disclosure.
References made in this disclosure to the term "responsive to" are
not limited to responsiveness to only a particular feature and/or
structure. A feature may also be "responsive to" another feature
and/or structure and also be located within that feature and/or
structure. Additionally, the term "responsive to" may also be
synonymous with other terms such as "communicatively coupled to" or
"operatively coupled to," although the term is not limited in his
regard.
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