U.S. patent number 7,388,750 [Application Number 11/373,411] was granted by the patent office on 2008-06-17 for plasma display module.
This patent grant is currently assigned to Samsung SDI Co., Ltd.. Invention is credited to Hyuk Kim.
United States Patent |
7,388,750 |
Kim |
June 17, 2008 |
Plasma display module
Abstract
A plasma display module, which can effectively dissipate heat,
is disclosed. In one embodiment, the plasma display module includes
i) a plasma display panel that displays images using gas discharge,
ii) a chassis located on one surface of the plasma display panel to
support the plasma display panel and iii) a driving circuit unit
which is located on a surface of the chassis opposite to the plasma
display panel to generate electrical signals for driving the plasma
display panel, and includes at least one integrated circuit,
wherein the chassis includes at least one convex unit, and the at
least one integrated circuit is located on the convex unit of the
chassis.
Inventors: |
Kim; Hyuk (Suwon-si,
KR) |
Assignee: |
Samsung SDI Co., Ltd. (Suwon,
KR)
|
Family
ID: |
36994173 |
Appl.
No.: |
11/373,411 |
Filed: |
March 10, 2006 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20060214549 A1 |
Sep 28, 2006 |
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Foreign Application Priority Data
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Mar 12, 2005 [KR] |
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10-2005-0020791 |
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Current U.S.
Class: |
361/704; 257/711;
313/46; 165/80.2; 313/48; 361/707; 361/719; 165/185 |
Current CPC
Class: |
H05K
7/20963 (20130101) |
Current International
Class: |
H05K
7/20 (20060101); F28F 7/00 (20060101); H01J
61/52 (20060101); H01L 23/12 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Thompson; Gregory D
Attorney, Agent or Firm: Knobbe Martens Olson & Bear
LLP
Claims
What is claimed is:
1. A plasma display module, comprising: a plasma display panel that
displays images by way of gas discharge; a chassis having first and
second surfaces opposing each other, wherein the first surface of
the chassis is coupled to the plasma display panel; and a driving
circuit unit which is located on the second surface of the chassis
to generate electrical signals configured to drive the plasma
display panel, and includes at least one integrated circuit,
wherein the chassis further includes at least one convex unit, and
the at least one integrated circuit is located on one of each of
the at least one convex unit of the chassis, wherein the at least
one convex unit is part of the chassis and extends from the
chassis, wherein each of the at least one convex unit comprises a
top surface and two side surfaces extending from the chassis and
connected to the top surface, and wherein the heights of the two
side surfaces between the chassis and the top surface are
substantially the same as each other.
2. The plasma display module of claim 1, further comprising a heat
radiation sheet interposed between the convex unit of the chassis
and the at least one integrated circuit.
3. The plasma display module of claim 2, wherein the heat radiation
sheet is formed of a material containing an elastic polymer having
high flexibility and thermal conductivity.
4. The plasma display module of claim 1, wherein the at least one
integrated circuit is an intelligent power module (IPM) which is
formed of i) more than two different integrated circuits or ii) one
kind of integrated circuit and an independent circuit device.
5. The plasma display module of claim 1, wherein the at least one
integrated circuit has a heat generation unit located on the
surface of the at least one convex unit.
6. The plasma display module of claim 1, wherein the driving
circuit unit comprises at least one driving circuit substrate, and
wherein the driving circuit substrate is connected to the chassis
via at least one connection member so that there is a gap formed
between the chassis and the driving circuit substrate.
7. The plasma display module of claim 6, wherein the at least one
convex unit is located farther than the driving circuit substrate
from the plasma display panel, and wherein the height of the convex
unit is greater than the gap.
8. The plasma display module of claim 6, wherein the at least one
convex unit is located closer to the plasma display panel than the
driving circuit substrate is to the plasma display panel, and
wherein the convex unit is located within the gap.
9. A plasma display module, comprising: a plasma display panel that
displays images by way of gas discharge; a chassis having first and
second surfaces opposing each other, wherein the first surface of
the chassis is coupled to the plasma display panel; and a driving
circuit unit which is located on the second surface of the chassis
to generate electrical signals configured to drive the plasma
display panel, and includes at least one integrated circuit,
wherein the chassis further includes at least one convex unit, and
the at least one integrated circuit is located on the convex unit
of the chassis, wherein the driving circuit unit comprises at least
one driving circuit substrate, wherein the at least one convex unit
is located farther than the driving circuit substrate from the
plasma display panel, and wherein at least one hole is defined in
the driving circuit substrate, and wherein the at least one convex
unit protrudes from the driving circuit substrate via the at least
one hole.
10. A plasma display module, comprising: a chassis configured to
support a plasma display panel, wherein the chassis includes at
least one protruding portion; and a plurality of integrated
circuits configured to drive the plasma display panel, wherein at
least one of the plurality of integrated circuits is located on one
of each of the at least one protruding portion of the chassis,
wherein the at least one protruding portion is part of the chassis
and extends from the chassis, wherein each of the at least one
protruding portion comprises a top surface and two side surfaces
extending from the chassis and connected to the top surface, and
wherein the heights of the two side surfaces between the chassis
and the top surface are substantially the same as each other.
11. The plasma display module of claim 10, further comprising a
heat radiation sheet formed between the at least one protruding
portion and the at least one integrated circuit.
12. The plasma display module of claim 10, further comprising a
driving circuit substrate connected to the chassis, wherein the
driving circuit substrate is connected to the chassis via at least
one connection member so that there is a gap formed between the
chassis and the driving circuit substrate.
13. A plasma display module, comprising: a chassis configured to
support a plasma display panel, wherein the chassis includes at
least one protruding portion; and a plurality of integrated
circuits configured to drive the plasma display panel, a driving
circuit substrate connected to the chassis, wherein at least one of
the plurality of integrated circuits is located on the at least one
protruding portion of the chassis, and wherein at least one hole is
defined in the driving circuit substrate, and wherein the at least
one integrated circuit protrudes from the driving circuit substrate
via the at least one hole.
14. The plasma display module of claim 12, wherein the protruding
portion is located closer to the plasma display panel than the
driving circuit substrate is to the plasma display panel, and
wherein the protruding portion is located within the gap.
15. The plasma display module of claim 10, wherein the chassis
further includes at least one recessed portion formed on the
opposite side of the chassis with respect to the at least one
protruding portion.
16. The plasma display module of claim 15, wherein the at least one
recessed portion is aligned with the at least one protruding
portion in a direction perpendicular to a selected surface of the
chassis.
17. The plasma display module of claim 10, wherein the plasma
display module is configured to dissipate heat generated from the
plurality of integrated circuits without the use of a heat
sink.
18. The plasma display module of claim 10, wherein the at least one
protruding portion is integrally formed with the chassis.
19. A method of using a plasma display module, comprising:
providing a chassis configured to support a plasma display panel,
wherein the chassis includes at least one protruding portion; and
driving the plasma display panel by way of a plurality of
integrated circuits, wherein at least one of the plurality of
integrated circuits is located on one of each of the at least one
protruding portion of the chassis, wherein the at least one
protruding portion is part of the chassis and extends from the
chassis, wherein each of the at least one protruding portion
comprises a top surface and two side surfaces extending from the
chassis and connected to the top surface, and wherein the heights
of the two side surfaces between the chassis and the top surface
are substantially the same as each other.
20. The method of claim 19, further comprising dissipating heat
generated from the at least one integrated circuit through the at
least one protruding portion of the chassis.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATION
This application claims the benefit of Korean Patent Application
No. 10-2005-0020791, filed on Mar. 12, 2005, in the Korean
Intellectual Property Office, the disclosure of which is
incorporated herein in its entirety by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a plasma display module, and more
particularly, to a plasma display module having an increased heat
dissipation efficiency.
2. Description of the Related Technology
A plasma display module is a flat display device that displays an
image using gas discharge, and has recently drawn attention since
it can be used for a large thin screen having a wide viewing
angle.
A plasma display module includes a plasma display panel composed of
first and second panels, a chassis located on one side of the
plasma display panel to support the plasma display panel, a driving
circuit unit located on a side opposite to the chassis to generate
an electrical signal that drives the plasma display panel, and a
circuit mounting element that mounts the driving circuit unit on
the chassis.
Electronic parts are located on the driving circuit unit, and
generate a great deal of heat, particularly integrated circuits. If
the heat is not appropriately dissipated to the environment, the
integrated circuits deteriorate, and the performance of the driving
circuit unit that includes the integrated circuits is diminished.
Therefore, a heat sink for heat dissipation is generally located in
close contact with each integrated circuit.
The integrated circuits can be classified into monolithic
integrated circuits, in which a semiconductor chip is mounted on a
patterned conductive layer, and intelligent power module (IPM)
devices in which passive devices, such as individual resistors and
capacitors, are mounted together with active devices such as
semiconductor chips, on a patterned conductive layer. However, due
to structural differences, the IPM device has a larger heat
generating area, and accordingly generates more heat than the
monolithic integrated circuit. Therefore, a heat sink alone, as in
the conventional plasma display module, cannot provide effective
heat dissipation from the IPM device.
SUMMARY OF CERTAIN INVENTIVE ASPECTS
One aspect of the present invention provides a plasma display
module that can effectively dissipate heat generated by an
integrated circuit through a chassis, by improving the heat
dissipation structure of the integrated circuit, such as an IPM
device, which generates much heat.
Another aspect of the present invention provides a plasma display
module that can reduce vibration generated by the integrated
circuit and noise resulting from the vibration, by locating a heat
radiation sheet having high flexibility and thermal conductivity
between the integrated circuit and the chassis.
Another aspect of the present invention provides a plasma display
module comprising: i) a plasma display panel that displays images
using gas discharge, ii) a chassis located on one surface of the
plasma display panel to support the plasma display panel and iii) a
driving circuit unit which is located on a surface of the chassis
opposite to the plasma display panel to generate electrical signals
for driving the plasma display panel, and includes at least one
integrated circuit, wherein the chassis includes at least one
convex unit, and the at least one integrated circuit is located on
the convex unit of the chassis.
In one embodiment, the plasma display module may further comprise a
heat radiation sheet interposed between the convex unit of the
chassis and the integrated circuit located on the convex unit of
the chassis.
In one embodiment, the heat radiation sheet may be formed of a
material containing an elastic polymer having high flexibility and
thermal conductivity.
In one embodiment, the integrated circuit located on the convex
unit of the chassis may be an intelligent power module (IPM) which
is formed of a combination of more than two different integrated
circuits or comprises one kind of integrated circuit and an
independent circuit device.
In one embodiment, the integrated circuit has a heat generation
unit located on the surface of the convex unit of the chassis.
In one embodiment, the driving circuit unit may comprise at least
one driving circuit substrate.
In one embodiment, the convex unit of the chassis may be located at
a higher elevation than the driving circuit substrate.
In one embodiment, the driving circuit substrate may comprise at
least one hole through which the convex unit of the chassis can
protrude.
In one embodiment, the convex unit of the chassis may be located at
a lower elevation than the driving circuit substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the present invention will be described with
reference to the attached drawings.
FIG. 1 is an exploded perspective view of a plasma display module
according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of an IPM device installed
on a convex unit of a chassis of FIG. 1, and a heat radiation
sheet.
FIG. 3 is a cross-sectional view taken along line III-III of FIG.
2.
FIG. 4 is a cross-sectional view of a modified version of the
chassis of FIG. 3.
FIG. 5 is a cross-sectional view (corresponding to the
cross-sectional view of FIG. 3) of a plasma display module
according to another embodiment of the present invention.
DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
Embodiments of the present invention will now be described more
fully with reference to the accompanying drawings, in which
exemplary embodiments of the invention are shown.
FIG. 1 is an exploded perspective view of a plasma display module
according to an embodiment of the present invention, FIG. 2 is an
exploded perspective view of an IPM device installed on a convex
unit of a chassis of FIG. 1, and a heat radiation sheet, and FIG. 3
is a cross-sectional view taken along line III-III of FIG. 2.
Referring to FIGS. 1 through 3, a plasma display module 10 includes
a plasma display panel 100 on which images are displayed.
The plasma display panel 100 can be one of various types. As an
example, the plasma display panel 100 can be a three-electrode,
alternating current, surface-discharge type plasma display panel.
In this case, the plasma display panel 100 includes a first panel
110 and a second panel 120. In one embodiment, the first panel 110,
although not shown in FIG. 1, includes a plurality of sustain
electrode pairs including stripe shaped X and Y electrodes, a first
dielectric layer covering the sustain electrode pairs, and a
protection layer coated on the surface of the first dielectric
layer.
The second panel 120 faces the first panel 110. In one embodiment,
although not shown in the drawing, the second panel 120 includes a
plurality of address electrodes crossing the sustain electrode
pairs, a second dielectric layer covering the address electrodes,
barrier ribs formed on the second dielectric layer to define
discharge cells in which discharge occurs and to prevent crosstalk,
and red, green, and blue phosphor layers coated in the discharge
cells defined by the barrier ribs.
Here, the discharge cells, respectively, correspond to the regions
where the sustain electrode pairs cross the address electrodes, and
are filled with a discharge gas.
In one embodiment, a chassis 30 is located on one side of the
plasma display panel 100, and at least includes a convex unit 30a
for heat dissipation on the opposite side of the plasma display
panel 100. In one embodiment, the convex unit 30a of the chassis 30
can be integrally formed with the chassis 30 by, for example, a
deep drawing method. In another embodiment, the convex unit 30a,
after the chassis 30 and the convex unit 30a are separately
manufactured, can be coupled to the chassis 30 by way of coupling
elements such as bolts.
The chassis 30 prevents the plasma display panel 100 from becoming
too hot by dissipating heat from the plasma display panel 100, and
from being deformed due to heat or damaged by external impact.
One surface of the chassis 30 can be coupled to the plasma display
panel 100 by an adhesion member 135 such as double-sided tape.
The chassis 30 generally has sufficient strength to support and
prevents the plasma display panel 100 from being deformed or
damaged. To reinforce the chassis 30, the plasma display module 10
can include a reinforcing member 90 located on the opposing surface
of the chassis 30 as shown in FIG. 1.
In one embodiment, the plasma display module 10 can include a heat
radiation sheet 130 located between the chassis 30 and the plasma
display panel 100 and contacting the surface of the plasma display
panel 100 facing the chassis 30, to prevent the plasma display
panel 100 from accumulating heat when the plasma display panel 100
is driven. In one embodiment, the heat radiation sheet 130 is
formed of an aluminum sheet, a copper sheet, or a thermal
conductive resin.
A driving circuit unit 140 is located on the opposing surface of
the chassis 30 as shown in FIG. 1, to drive the plasma display
panel 100. For this purpose, the driving circuit unit 140 includes
various electronic parts (not shown) to apply electrical signals
for displaying images and to supply power to the plasma display
panel 100. In one embodiment, the driving circuit unit 140 is
electrically connected to the plasma display panel 100 through
signal transmitting elements 31 and 32 to transmit signals to the
plasma display panel 100. The signal transmitting elements 31 and
32 can be flexible printed cable (FPC), tape carrier package (TCP),
or chip on film (COF).
The electronic parts included in the driving circuit unit 140, as
depicted in FIGS. 2 and 3, may include an intelligent power module
(IPM) device 150. The IPM device 150 can have various structures,
such as a combination of more than two different kinds of
integrated circuit or a combination of one kind of integrated
circuit and an independent circuit device. As an example, as
depicted in FIG. 3, the IPM device 150 includes a metal substrate
151 formed of aluminum, an insulating layer 152 formed on the
surface of the metal substrate 151, a patterned conductive layer
153 formed on the insulating layer 152, and a plurality of devices
154 connected to the conductive layer 153. In one embodiment, the
metal substrate 151, the insulating layer 152, the conductive layer
153, and the devices 154 are accommodated in a cover unit 155
formed of, for example, a resin. The cover unit 155 covers the
surface of the metal substrate 151 on which the insulating layer
152 is formed. In this embodiment, an inner space of the cover unit
155 is filled with an insulating filler 156, and a lead 157
connected to the conductive layer 153 in the cover unit 155 is
extending to the outside to be connected to the driving circuit
unit 140.
Since the IPM device 150 includes a plurality of devices 154, a
significant amount of heat is generated when the plasma display
module 10 is in operation. As discussed above, to dissipate the
heat through heat exchange with ambient air, the convex unit 30a of
the chassis 30 is located on one surface of the IPM device 150
facing the outer surface of the metal substrate 151 as shown in
FIGS. 3-5. Therefore, the installation of a heat radiation member
such as a heat sink, as in a conventional plasma display module, is
unnecessary.
In one embodiment, the heat generation unit 150a of the IPM device
150 is located on the surface of the convex unit 30a of the chassis
30.
The driving circuit unit 140 includes at least one driving circuit
substrate 141. The driving circuit substrate 141 includes various
electronic parts except for integrated circuits that generate a
great deal of heat, such as the IPM device 150. The integrated
circuits that generate much heat, such as the IPM device 150, are
located on the convex unit 30a of the chassis 30, and are
electrically connected to the driving circuit substrate 141 by
connection elements such as leads 157.
In one embodiment, the convex unit 30a may be located higher than
the driving circuit substrate 141 as shown in FIG. 3. In this
embodiment, the integrated circuits such as the IPM device 150 can
be easily mounted on the convex unit 30a of the chassis 30, thereby
simplifying the overall configuration of the driving circuit unit
140.
In this embodiment, at least one hole 141a may be formed in the
driving circuit substrate 141 so that the convex unit 30a of the
chassis 30 can protrude through. In one embodiment, the number of
holes 141a formed in the driving circuit substrate 141 are equal to
the number of integrated circuits which are mounted on the convex
units 30a and protrude from the driving circuit substrate 141 via
the at least one hole 141a.
In one embodiment, the convex unit 30a is located to face the outer
surface of the metal substrate 151 of the mounted integrated
circuits as shown in FIGS. 3-5. In one embodiment, the convex unit
30a may be sized to correspond to the outer surface of the metal
substrate 151.
In another embodiment, a heat radiation sheet 131 may further be
located between the convex unit 30a of the chassis 30 and the
integrated circuits.
In this embodiment, the heat radiation sheet 131 prevents the
integrated circuits from being damaged by mechanical pressure when
they directly contact the convex unit 30a of the chassis 30. The
heat radiation sheet 131 effectively dissipates heat generated by
the integrated circuits through the convex unit 30a of the chassis
30. In one embodiment, the heat radiation sheet 131 may be formed
of a material that includes an elastic polymer having high
flexibility and thermal conductivity.
Also, the integrated circuits such as the IPM device 150 generate a
great deal of vibration and noise when the plasma display module is
driven. However, as described above, since the heat radiation sheet
131 is formed of a highly flexible and conductive material such as
an elastic polymer, the heat radiation sheet 131 absorbs the
vibration and noise.
FIG. 4 is a cross-sectional view of a modified version of the
chassis of FIG. 3. Except for the shape of the chassis, elements
have the same configuration as in FIG. 3, and thus, like reference
numerals refer to like elements.
In one embodiment, as shown in FIG. 4, a concave unit 30b is
further formed on the rear surface of the chassis 30 aligned with
the convex unit 30a formed on the upper surface of the chassis 30.
Accordingly, the chassis 30 of FIG. 4 differs from the chassis 30
of FIG. 3 in that the convex unit 30a does not protrude from the
driving circuit substrate 141 and the concave unit 30b is further
provided on the opposite side of the chassis 30. However, in the
FIG. 3 embodiment, the chassis 30 may further include a concave
unit on the opposite side of the chassis 30 (not shown). The
concave unit 30b allows the material for forming the chassis 30 to
be saved by as much as the volume of the concave unit 30b. In the
FIG. 4 embodiment, since the convex unit 30a does not protrude from
the driving circuit substrate 141, there is no need to form the
hole 141a in the driving circuit substrate 141 as in FIG. 3.
FIG. 5 is a cross-sectional view (corresponding to the
cross-sectional view of FIG. 3) of a plasma display module
according to another embodiment of the present invention. Like
reference numerals refer to like elements in FIGS. 3 and 4.
The difference between the embodiments of FIGS. 5 and FIG. 3 is
that unlike the convex unit 30a of the chassis 30 of FIG. 3, the
convex unit 30a of the chassis 30 in FIG. 5 is located at a lower
elevation than the driving circuit substrate 141.
In the FIG. 5 embodiment, as in the FIG. 4 embodiment, the convex
unit 30a does not protrude upward through the driving circuit unit
140, but is lower than the driving circuit substrate 141.
Therefore, there is no need to form the hole 141a in the driving
circuit substrate 141 as in FIG. 3.
The main path of heat dissipated to the outside from heat
generation units of the integrated circuits in the plasma display
module 10 according to embodiments of the present invention will
now be described.
As depicted in FIGS. 3 through 5, a great deal of heat is generated
by the integrated circuits such as the IPM device 150 when the
plasma display module 10 is driven. The heat is transmitted to the
convex unit 30a of the chassis 30 through the heat radiation sheet
131, and dissipated into the air through the plane surface of the
chassis 30.
In one embodiment, the plasma display module can effectively
dissipate heat generated by the integrated circuits through a
chassis, by improving the heat radiation structure of the
integrated circuits that generate a significant amount of heat.
Accordingly, the degradation of the integrated circuits can be
prevented, thereby securing the reliability of the driving circuit
unit.
In another embodiment, the plasma display module can reduce the
vibration and noise generated by the integrated circuits, since a
heat radiation sheet formed of a material having high flexibility
and thermal conductivity is located between the integrated circuits
and the chassis, and can readily ground leads of the devices.
While the above description has pointed out novel features of the
invention as applied to various embodiments, the skilled person
will understand that various omissions, substitutions, and changes
in the form and details of the device or process illustrated may be
made without departing from the scope of the invention. Therefore,
the scope of the invention is defined by the appended claims rather
than by the foregoing description. All variations coming within the
meaning and range of equivalency of the claims are embraced within
their scope.
* * * * *