U.S. patent number 7,011,143 [Application Number 10/838,669] was granted by the patent office on 2006-03-14 for method and apparatus for cooling electronic components.
This patent grant is currently assigned to International Business Machines Corporation. Invention is credited to Joseph P. Corrado, John F. Eberth, Steven J. Mazzuca, Roger R. Schmidt, Takeshi Tsukamoto.
United States Patent |
7,011,143 |
Corrado , et al. |
March 14, 2006 |
Method and apparatus for cooling electronic components
Abstract
A modular fluid unit for cooling heat sources located on a rack,
the modular fluid unit comprising: a heat exchanger in fluid
communication a pump; and wherein the modular fluid unit is
mountable within the rack and is configurable to be in fluid
communication with a cold plate return manifold, a cold plate
supply manifold, and an end-user fluid supply. A method for cooling
electronic components in a rack, the method comprising: circulating
a first liquid from a cold plate to one of a plurality of heat
exchangers mounted within the rack; circulating a second liquid
from a second liquid supply to the one of a plurality of heat
exchangers; and transferring heat from the first liquid to the
second liquid at the one of a plurality of heat exchangers.
Inventors: |
Corrado; Joseph P. (Marlboro,
NY), Eberth; John F. (Verbank, NY), Mazzuca; Steven
J. (New Paltz, NY), Schmidt; Roger R. (Poughkeepsie,
NY), Tsukamoto; Takeshi (Ohtsu, JP) |
Assignee: |
International Business Machines
Corporation (Armonk, NY)
|
Family
ID: |
35238382 |
Appl.
No.: |
10/838,669 |
Filed: |
May 4, 2004 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20050247433 A1 |
Nov 10, 2005 |
|
Current U.S.
Class: |
165/80.4;
361/698; 165/292; 361/702; 165/104.33 |
Current CPC
Class: |
H05K
7/20645 (20130101); H05K 7/20781 (20130101); H05K
7/20281 (20130101); G06F 1/20 (20130101); G06F
2200/201 (20130101) |
Current International
Class: |
F28F
7/00 (20060101) |
Field of
Search: |
;165/80.4,104.33,104.34,122,48.1,279,292
;361/683,691,698-702,715-716,728-730 ;62/259.2,259.4
;257/714,716 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Duong; Tho
Attorney, Agent or Firm: Neff; Lily Cantor Colburn LLP
Claims
What is claimed is:
1. A modular fluid unit for cooling heat sources located on a rack,
the modular fluid unit comprising: a heat exchanger in fluid
communication with a pump and a first valve; and said modular fluid
unit mountable within the rack and configurable to be in fluid
communication with a cold plate return manifold, a cold plate
supply manifold, and a fluid supply; a first temperature sensor
configured to measure the temperature of a fluid flowing between
the first valve and the heat exchanger; a second temperature sensor
configured to measure the temperature of a fluid flowing between
the heat exchanger and the cold plate supply manifold; and a
pressure sensor configured to measure the pressure of the fluid
flowing between the heat exchanger and the cold plate supply
manifold.
2. The modular fluid unit of claim 1, wherein the heat exchanger is
a liquid heat exchanger.
3. The modular fluid unit of claim 1 further comprising a drip pan
configured to retain a liquid.
4. The modular fluid unit of claim 3 further comprising a sheet
metal housing in operable communication with the drip pan and
configured to enclose the pump, the heat exchanger and the first
valve.
5. The modular fluid unit of claim 1, configured to weigh less than
about 75 pounds.
6. The modular fluid unit of claim 1, where the pump comprises a
quick release inlet, and the heat exchanger comprises a quick
connect fluid supply inlet and a quick connect cold plate supply
outlet, and the first valve is in communication with a quick
connect fluid return outlet.
7. The modular fluid unit of claim 1, wherein the modular unit is
mountable in a rack that is about 22 inches wide by about 32 inches
deep and about 4 rack units high.
8. The modular fluid unit of claim 1, further comprising: a
controller in operable communication with the first temperature
sensor, second temperature sensor, pressure sensor, pump and first
valve.
9. The modular fluid unit of claim 1, wherein the pressure sensor
is a pressure switch.
10. A system for cooling heat sources, the system comprising: a
rack for holding electronic components; a cold plate located
adjacent to a heat source located on the electronic components; a
cold plate supply manifold in fluid communication with the cold
plate; a cold plate return manifold in fluid communication with the
cold plate; a modular fluid unit mounted within the rack in fluid
communication with the cold plate supply manifold, the cold plate
return manifold and a fluid supply, said modular fluid unit further
comprising: a heat exchanger in fluid communication with a pump and
a first valve; a first temperature sensor configured to measure the
temperature of a fluid flowing between the first valve and the heat
exchanger; a second temperature sensor configured to measure the
temperature of a fluid flowing between the heat exchanger and the
cold plate supply manifold; and a pressure sensor configured to
measure the pressure of the fluid flowing between the heat
exchanger and the cold plate supply manifold.
11. The system of claim 10, further comprising a plurality of
modular fluid units mounted in a side by side configuration within
the rack.
12. The system of claim 10, wherein: the heat exchanger is in fluid
communication with the fluid supply and the cold plate supply
manifold; wherein the pump is in fluid communication with the cold
plate return manifold, and wherein the first valve is in fluid
communication with the fluid supply.
13. The system of claim 12, wherein the modular fluid unit further
comprises a drip pan configured to retain a liquid.
14. The system of claim 13, wherein the modular fluid unit further
comprises: a sheet metal housing in operable communication with the
drip pan and configured to enclose the pump, the heat exchanger and
the first valve.
15. The system of claim 13, wherein the heat exchanger is a liquid
heat exchanger.
16. The system of claim 12, wherein the modular fluid unit is
configured to weigh less than about 75 pounds.
17. The system of claim 12, wherein a plurality of the modular
fluid units are mountable in a side by side configuration within
the rack.
18. The system of claim 12, wherein the rack is about 22 inches
wide by about 32 inches deep and the modular fluid unit is less
than about 4 rack units high.
Description
BACKGROUND OF THE INVENTION
The presently disclosed method and apparatus are generally directed
to a cooling unit for the cooling of electronic components. More
particularly, the disclosed method and apparatus are directed to a
modular fluid cooling unit.
One of the possibilities for cooling electronic components is the
employment of arrays of air cooled heat sinks. Heat generated in an
electronic component is conducted into the heat sinks and
dissipated through the passage of a forced flow of ambient air
within high aspect ratio flow channels between the heat sinks. Data
centers with large computer and electronic systems vary greatly in
airflow, raised floor height, chilled air availability and floor
space. As a result, sometimes it is difficult to arrange air cooled
machines in patterns that will allow for effective cooling. Each
data center must be designed specifically to that data center's
environmental conditions. In many cases, the machines must be
spread out in order to prevent hot air recirculation. Other
problems include impractical under-floor air flow rates, harsh
environmental conditions, air conditioning power requirements, and
the footprint of massive chillers. In future machines, as power
levels per module increase, the combined heat dissipated by many
machines in a confined workspace, whether they are independent or
part of a large local area network (LAN), could exceed the capacity
of the room air conditioning system in which the systems are
placed. Refrigeration is an expensive alternative, but can also
have similar problems.
The forgoing, in combination with current widespread trends in
customer expectations for cooling computing systems which include:
(1) redundancy, (2) versatility in installation and operating
environment, (3) system expandability, (4) maintenance and system
modifications performed without loss of system availability, and
(5) reduction in the price per unit of computing capacity; creates
a relatively untenable landscape and therefore the art is in need
of improved cooling systems capable of resolving the need
issues.
SUMMARY OF THE INVENTION
The disclosed apparatus relates to a modular fluid unit for cooling
heat sources located on a rack, the modular fluid unit comprising:
a heat exchanger in fluid communication a pump; and wherein the
modular fluid unit is mountable within the rack and is configurable
to be in fluid communication with a cold plate return manifold, a
cold plate supply manifold, and an end-user fluid supply.
The disclosed system relates to cooling heat sources, the system
comprising: a rack for holding electronic components; a cold plate
located adjacent to a heat source located on the electronic
components; a cold pate supply manifold in fluid communication with
the cold plate; a cold plate return manifold in fluid communication
with the cold plate; and a modular fluid unit mounted within the
rack in fluid communication with the cold plate supply manifold,
the cold plate return manifold and an end-user fluid supply.
Another embodiment of the disclosed system relates to cooling heat
sources, the system comprising: a first rack for holding a modular
fluid unit; a second rack for holding electronic components; a cold
plate located adjacent to a heat source on the second rack; a cold
pate supply manifold in fluid communication with the first cold
plate; a cold plate return manifold in fluid communication with the
first cold plate; and wherein the modular fluid unit mounted within
the first rack is in fluid communication with the cold plate supply
manifold, the cold plate return manifold, and an end-user fluid
supply.
A further embodiment of the disclosed system relates to cooling
heat sources, the system comprising: a rack for holding electronic
components; an air fin and tube heat exchanger located adjacent to
a heat source located on the electronic components; a supply
manifold in fluid communication with the air fin and tube heat
exchanger; a return manifold in fluid communication with the air
fin and tube heat exchanger; a modular fluid unit mounted within
the rack in fluid communication with the supply manifold, the
return manifold and an end-user fluid supply.
The disclosed method relates to cooling electronic components in a
rack, the method comprising: circulating a first liquid from a cold
plate to one of a plurality of heat exchangers mounted within the
rack; circulating a second liquid from a second liquid supply to
the one of a plurality of heat exchangers; and transferring heat
from the first liquid to the second liquid at the one of a
plurality of heat exchangers.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring to the exemplary drawings wherein like elements are
numbered alike in the several Figures:
FIG. 1 is a schematic diagram of the disclosed system;
FIG. 2 is a perspective view of the disclosed apparatus;
FIG. 3 is a perspective view of the disclosed apparatus with covers
on;
FIG. 4 is a perspective view of the system and rack;
FIG. 5 is another perspective view of the system and rack from FIG.
4; and
FIG. 6 is flowchart illustrating one embodiment of the disclosed
method.
DETAILED DESCRIPTION
Disclosed herein is a liquid cooling mechanism for electronic
and/or computer systems using fluid from a central supply.
Embodiments hereof are configured as a modular cooling apparatus
that can be easily installed and removed from a rack. Further, the
disclosed modular cooling apparatus is stackable (either vertically
or horizontally), i.e. it can be placed in a redundant
configuration with another modular cooling apparatus. In such a
redundant configuration, one of the modular cooling apparatuses can
be shut down, while the other modular cooling apparatus remains in
operation. This allows for the servicing or replacing of one of the
cooling apparatuses, without the necessity of shutting down the
electronic and/or computer system.
Referring to FIG. 1, a schematic diagram of an embodiment of a
disclosed fluid cooling system 10 is shown. A first valve 18 is in
fluid communication with a fluid supply 14 and in fluid
communication with a heat exchanger 22. The first valve 18 may be
any valve suitable to control the flow of a fluid through a
flowpath of the heat exchanger 22. The first valve 18 may comprise
a proportional valve and electronic actuator. One commercially
available proportional valve and actuator is made available by
Johnson Controls, Milwaukee, Wis. (Part Number: VG7241GT+7125G). Of
course other suitable proportional valves and actuators may be
used. The fluid may be any suitable fluid that can be used in a
heat exchanger. Some considerations for selecting a proper fluid
are: heat absorption properties, heat dissipation properties,
corrosion considerations, and leak effect considerations. In one
embodiment, the fluid is chilled water. The temperature of the
chilled water should be such that it will provide enough heat
transfer for heated water coming from the heat sources, e.g.
electronic components. In one embodiment, the proper heat transfer
will occur if the temperature of the chilled water is between about
4 degrees Celsius and about 16 degrees Celsius. The fluid cooling
system 10 comprises a first temperature sensor 26 configured to
measure the temperature of the fluid between first valve 18 and the
heat exchanger 22. The temperature sensor may be selected from any
of a number of temperature sensors suitable to measure a fluid used
between the first valve 18 and heat exchanger 22.
Still referring to FIG. 1, the heat exchanger is also in fluid
communication with a fluid return 30. The fluid cooling system 10
is configured such that a proper pressure differential between the
fluid supply 14 and fluid return 30 will provide enough pressure to
sustain the flow of the fluid from the fluid supply 14 through the
valve 18 and a path of the heat exchanger 22 back to the fluid
return 30. In one embodiment, enough pressure to sustain a flow of
fluid will be available if the fluid supply has a pressure
difference between supply side and return side ranging from about 1
pounds per square inch (PSI) to about 30 PSI. In another
embodiment, enough pressure to sustain a flow of fluid will be
available if the pressure difference between supply side and return
side ranges from about 3 PSI to about 15 PSI. The heat exchanger 22
is also in fluid communication with a cold plate supply manifold
34. Measuring the pressure in the fluid flow between the heat
exchanger 22 and cold plate supply manifold 34 is a pressure sensor
62. The heat exchanger 22 may be any suitable heat exchanger that
can be used to cool cold plates used to transfer heat from heat
sources. In one embodiment, the heat exchanger 22 is an ITT
Standard, Cheektowaga, N.Y., Brazepak model BP410-40. The heat
exchanger 22 may be sized to handle heat loads up to about 20
kilowatt (kW) at about 20 gallons per minute (GPM). The heat
exchanger 22, may be a liquid heat exchanger, that is the fluids
used to transfer heat within the heat exchanger 22 are liquid. Of
course, the heat exchanger may be sized differently according to
design specifications based on the cooling needs of the heat
sources. A second temperature sensor 42 is configured to measure
the temperature of the fluid between the heat exchanger 22 and the
cold plate supply manifold 34. In one embodiment the first and
second temperature sensors 26, 42 may be Omega, Stamford, Conn.,
resistance temperature detector (RTD) plug probe sensors with
National Pipe Tapered Thread (NPT) fittings.
The cold plate supply manifold 34 is in fluid communication with
one or more cold plates 46. The one or more cold plates 46 are also
in fluid communication with a cold plate return manifold 50. The
cold plate return manifold 50 may be in fluid communication with an
optional reservoir 54. The cold plate supply manifold 34 supplies
fluid to the cold plates 46. The fluid leaves the cold plates 46
and enters the cold plate return manifold 50. The cold plates are
located adjacent to one or more heat sources throughout the
computer system. The manifolds 34, 50 can be configured for
numerous different flow paths to circulate across numerous cold
plates 46.
The cold plate return manifold 50 is in fluid communication with a
pump 58. The optional reservoir 54 is configured to provide enough
pressure head and volume to prevent the pump 58 from cavitating. Of
course, in some embodiments the manifold 50 may be configured to
provide enough pressure head and volume to obviate the need for a
reservoir 54. The pump 58 is also in fluid communication with the
heat exchanger 22.
A controller 28 is a device that is configured to run a control
algorithm which controls, based upon signals the controller 28
receives, the operation of the first valve 18, and the operation of
the pump 58 to satisfy the cooling requirements of the heat sources
located throughout the computer and/or electronic system. Such
signals include, but are not limited to signals received from the
temperature sensors 26, 42, signals from the pressure sensor 62,
signals from the leak detectors 66, and signals from a reservoir
sensor. Therefore, the controller 28 is in operable communication
with one or more the following non-exhaustive list of components:
the first valve 18; the first temperature sensor; the second
temperature sensor; the pump 58; and one or more leak detectors 66
located within the system 10. Additionally the controller may be
configurable to provide an alarm when certain values exceed or fall
below programmed set points and/or if one or more of the leak
detectors 66 detect a leak. In one embodiment, the controller 28
may be an MDA-RM card supplied by IBM, Poughkeepsie, N.Y.
The fluid used on the cold plate side of the fluid cooling system
10 may be any fluid suitable for cooling the cold plates 46 and
transferring heat in the heat exchanger 22. Such a fluid may
include, but need not be limited to: water, propylene glycol,
ethylene glycol or combinations thereof.
Several of the above recited components, discussed with respect to
FIG. 1, comprise a modular fluid unit 70. The modular fluid unit
comprises: the first valve 18; the heat exchanger 22; the first
temperature sensor 26; the second temperature sensor 42; the pump
58 and the controller 28. Additionally, one or more leak detectors
66 will be located within the modular fluid unit 74 and be in
operable communication with the controller 28.
As shown in FIG. 2, the modular fluid unit may be configured to fit
in a support structure for equipment needing cooling, such as a
rack. FIG. 2 shows a perspective view of an embodiment of a modular
fluid unit 70. A pump inlet 72 and a pump outlet 76 are shown in
fluid communication with the pump 58. The pump inlet 72 is also in
fluid communication with a cold plate return manifold 50 (not shown
in this view, refer back to FIG. 1). The pump outlet 76 is in fluid
communication with a heat exchanger first inlet 80, which in turn
is in fluid communication with the heat exchanger 22. The heat
exchanger 22 is also in fluid communication with a heat exchanger
first outlet 84, a heat exchanger second inlet 88 and a heat
exchanger second outlet 92. The heat exchanger first outlet 84 is
in fluid communication with a cold plate supply outlet 86, which in
turn is in fluid communication with the cold plate supply manifold
34 (not shown). The pressure sensor 62 is configured to measure the
pressure between the heat exchanger first outlet 84 and the cold
plate supply manifold 34. In one embodiment, the pressure sensor 62
may be a pressure switch that is triggered if a loss of pressure is
detected, e.g. when the pressure falls below 10 psi, the pressure
switch will indicate a problem. There is also a second temperature
sensor 42 configured to measure the temperature between the heat
exchanger first outlet 84 and the cold plate supply manifold 34.
The fluid supply 14 (not shown) is in fluid communication a fluid
supply inlet 96. The fluid supply inlet is in fluid communication
with the first valve 18. The first valve 18 is in fluid
communication with the heat exchanger second inlet 88. The first
temperature sensor 26 is configured to measure the temperature
between the first valve 18 and the heat exchanger second inlet 88.
The heat exchanger second outlet 92 is in fluid communication with
a fluid return outlet 100. The modular fluid unit 70 also comprises
a drip pan 104, which is configured to retain any liquid condensate
or liquid that may leak from other components in the modular fluid
unit 70. One leak detector 66 is shown partially obstructed by the
fluid return outlet 100. Another leak detector may be located near
the pump 58 (not shown in this view) or wherever a leak detector is
desired. A leak detector is employed to enhance probability that a
leak is detected early. It will be understood, however, that a
single leak detector can be used and may be placed in a low spot of
the drip pan 104. The modular fluid unit 70 can be configured to be
mountable at any storage rack, and in one embodiment is sized to be
mountable in a 22 inch by 32 inch rack that has four rack units (U)
(each rack unit is 1.75 inches) of height. The pump inlet 72, cold
plate supply outlet 86, fluid supply inlet 96 and fluid return
outlet 100 may all comprise quick connect couplings for fast
coupling and de-coupling with little or no leaking of the
fluid.
FIG. 3 shows a perspective view of the modular fluid unit 70 with a
cover 108 over most of the components. The drip pan 104 and cover
108 may be fabricated from sheet metal or other material capable of
performing the duties of each of these components, specifically
supporting the other components of the unit 70, providing a cover
to the other components of the unit 70, providing noise and
vibration reduction and containing leaks to some degree.
FIG. 4 shows a perspective view of a rack 112 with a first modular
fluid unit 70, and a redundant modular fluid unit 270, both located
at the bottom of the rack 112. Having a redundant modular fluid
unit 270 allows for passive and/or active control switching so that
either one of the two modular fluid units 70, 270 can be removed
and serviced while the other modular fluid unit keeps the cooling
system operating. For clarity, the rack 112 is shown without any
computer components, electronic components, or cold plates
installed. The cold plate return manifold 50 is shown attached to
the rack 112. A portion of the cold plate supply manifold 34 can be
seen through an opening in the rack 112. The cold plate return
manifold is in fluid communication with the reservoir 54. In fluid
communication with the cold plate return manifold 50 is one or more
cold plate return connectors 116. Each of the cold plate return
connectors are in fluid communication with one or more cold plates
46 (not shown). There are two outlets 120, 124 from the cold plate
return manifold 50, a first outlet 120 and a second outlet 124.
Each of the outlets are in fluid communication (not shown) with one
of the modular fluid units 70, 270. For instance, the first outlet
120 may be in fluid communication (not shown) with the pump inlet
72 of the modular fluid unit 70, and the second outlet 124 may be
in fluid communication (not shown) with the pump inlet 272 of the
other modular fluid unit 270. The cold plate return manifold 50
also has a capped end 121. The cap may be removed and fluid may be
added at the capped end 121.
FIG. 5 shows a view of the rack 112 where the cold plate supply
manifold 34 is plainly visible. Although mostly obstructed, a
portion of the cold plate return manifold 50 can be seen through an
opening in the rack 112. The cold plate supply manifold 34 is shown
attached to the rack 112. In fluid communication with the cold
plate supply manifold 34 is one or more cold plate supply
connectors 128. Each of the cold plate supply connectors is in
fluid communication with one or more cold plates 46 (not shown).
There are two inlets 132, 136 from the cold plate supply manifold
34, a first outlet 132 and a second outlet 136. Each of the inlets
132, 136 are in fluid communication (not shown) with one of the
modular fluid units 70, 270. For instance, the first outlet 132 may
be in fluid communication (not shown) with the cold plate supply
outlet 86, and the second outlet 136 may be in fluid communication
(not shown) with a cold plate supply outlet 286 of the modular
fluid unit 270. Quick connect couplings on the manifolds 34, 50
permit convenient attachment/detachment of rack hoses without loss
of liquid. The cold plate supply manifold 34 also has a capped end
122. The cap may be removed and fluid may be added at the capped
end 122.
In one embodiment, the modular fluid unit can be stacked in a rack
separate from other racks which have components that need to be
cooled. The modular fluid unit can then supply cooling water to the
other racks.
In another embodiment, the modular fluid unit can be used to supply
cooling water to an air fin and tube heat exchangers, which can be
used to cool the air within an electronics rack, instead of using a
cold plate.
The disclosed modular fluid control units are mounted within a
rack, as opposed to being a stand alone unit, occupying floor
space. Since the modular fluid control units are installed in the
rack, the modular fluid control units can be used in any layout
regardless of what type of raised floor, if any, the racks are
located on. Since the modular fluid control units are modular, they
can be quickly removed and installed into racks, thus limiting
machine downtime. Additionally, since two fluid control units can
be used in one rack, it is possible to run these units redundantly.
In such a configuration, one of the two fluid control units can be
serviced without having to shut down the computer system. The
modular fluid control units can be configured to weigh less than
about 75 pounds, thereby qualifying the modular fluid control units
for only a two man lift.
Although it will be apparent to one of ordinary skill in the art
from the foregoing, it is pointed out that from a high level
perspective, the method disclosed may be illustrated in the
embodiment of the method shown in FIG. 6. At process block 150, a
first fluid is circulated from a cold plate to one of a plurality
of heat exchangers. At process block 154, a second fluid is
circulated from a second fluid supply to a one of a plurality of
heat exchangers. At process block 158, heat is transferred from the
first fluid to the second fluid at one of the plurality of heat
exchangers.
The use of the terms first, second, etc. do not denote any order or
importance, but rather the terms first, second, etc. are used to
distinguish one element from another.
While the disclosed apparatus and method has been described with
reference to a preferred embodiment, it will be understood by those
skilled in the art that various changes may be made and equivalents
may be substituted for elements thereof without departing from the
scope of the disclosed apparatus and method. In addition, many
modifications may be made to adapt a particular situation or
material to the teachings of the disclosed apparatus and method
without departing from the essential scope thereof. Therefore, it
is intended that the disclosed apparatus and method not be limited
to the particular embodiment disclosed as the best mode
contemplated for carrying out this disclosed apparatus and method,
but that the disclosed apparatus and method will include all
embodiments falling within the scope of the appended claims.
* * * * *