U.S. patent number 6,715,937 [Application Number 10/214,591] was granted by the patent office on 2004-04-06 for optical module.
This patent grant is currently assigned to The Furukawa Electric Co., Ltd.. Invention is credited to Tomoya Kato, Masayuki Minamino, Takeo Shimizu.
United States Patent |
6,715,937 |
Minamino , et al. |
April 6, 2004 |
Optical module
Abstract
A semiconductor laser module 1 having a package 2 containing a
semiconductor laser device and lead pins 28 provided on both the
side surfaces of the package 2. Since a base end portion of the
lead pin 28 is fixed to the side surface at a position higher than
the bottom surface of the package 2, the lead pin 28 can be
laterally bent at a position higher than the bottom surface.
Therefore, the semiconductor laser module 1 can be mounted on the
surface of the wiring board 32 while the bottom surface of the
package 2 is in close contact with the wiring board 32. Thus, since
a heat radiation path from the bottom surface of the package 2 to
the wiring board 32 is secured, it is possible to reduce the
instability in the operating characteristic of the semiconductor
laser device due to the thermal effect.
Inventors: |
Minamino; Masayuki (Tokyo,
JP), Kato; Tomoya (Tokyo, JP), Shimizu;
Takeo (Tokyo, JP) |
Assignee: |
The Furukawa Electric Co., Ltd.
(Tokyo, JP)
|
Family
ID: |
28035472 |
Appl.
No.: |
10/214,591 |
Filed: |
August 9, 2002 |
Foreign Application Priority Data
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Mar 19, 2002 [JP] |
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2002-76860 |
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Current U.S.
Class: |
385/92 |
Current CPC
Class: |
G02B
6/4269 (20130101); G02B 6/4201 (20130101); H05K
3/3426 (20130101); Y02P 70/50 (20151101); Y02P
70/613 (20151101) |
Current International
Class: |
H05K
3/34 (20060101); G02B 6/42 (20060101); G02B
006/42 () |
Field of
Search: |
;385/49,88-94
;257/80-82,431-433 ;372/33-36 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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11095070 |
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Apr 1999 |
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JP |
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2001085551 |
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Mar 2001 |
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JP |
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2001127371 |
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May 2001 |
|
JP |
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2002359426 |
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Dec 2002 |
|
JP |
|
Primary Examiner: Sanghavi; Hemang
Assistant Examiner: Knauss; Scott A
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier
& Neustadt, P.C.
Claims
What is claimed is:
1. An optical module comprising: a package which contains an
optical semiconductor device optically connected to an optical
fiber via an optical system, said package having a bottom surface
to be faced to a predetermined wiring board and a pair of side
surfaces arranged on both the sides of the bottom surface and
extending in a direction crossing the bottom surface; lead pins
serving as conductors between the optical semiconductor device and
the wiring board, each of said lead pins having a base end portion
fixed at the side surface of said package and extending from the
base end portion to the outside of said package; and a fixing
region formed on the side surface of said package, in said fixing
region, the base end portion of said lead pin being fixed to the
position apart from the bottom surface of said package, thereby
allowing a part of said lead pin lower than the base end portion to
be detachable from the side surface of said package.
2. The optical module according to claim 1, further comprising: a
chamfer portion formed on said package, said chamfer portion being
formed by cutting off a corner portion between said fixing region
on the side surface of said package and the bottom surface of said
package.
3. The optical module according to claim 1, further comprising: a
notched groove formed on said package, said notched groove being
formed by cutting off the corner portion between said fixing region
on the side surface and the bottom surface of said package along a
longitudinal direction so as to extend in the longitudinal
direction.
4. The optical module according to claim 1, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in the
direction apart from the side surface of said package, and said
package is mounted to the wiring board in a state where the bottom
surface thereof is in close contact with a surface of the wiring
board.
5. The optical module according to claim 2, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in the
direction apart from the side surface of said package, and said
package is mounted to the wiring board in a state where the bottom
surface thereof is in close contact with a surface of the wiring
board.
6. The optical module according to claim 3, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in the
direction apart from the side surface of said package, and said
package is mounted to the wiring board in a state where the bottom
surface thereof is in close contact with a surface of the wiring
board.
7. The optical module according to claim 1, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in a
direction apart from the side surface of said package, an opening
is provided in the wiring board at a position to be faced to the
bottom surface of said package, and a heat sink is in close contact
with the bottom surface of said package through the opening of the
wiring board.
8. The optical module according to claim 2, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in a
direction apart from the side surface of said package, an opening
is provided in the wiring board at a position to be faced to the
bottom surface of said package, and a heat sink is in close contact
with the bottom surface of said package through the opening of the
wiring board.
9. The optical module according to claim 3, wherein the part of
said lead pin lower than the base end portion is fixed to the
surface of the wiring board in the state of being bent in a
direction apart from the side surface of said package, an opening
is provided in the wiring board at a position to be faced to the
bottom surface of said package, and a heat sink is in close contact
with the bottom surface of said package through the opening of the
wiring board.
10. A method of mounting an optical module on a wiring board,
comprising the steps of: arranging a package, which contains an
optical semiconductor device optically connected to an optical
fiber via an optical system, to face a bottom surface of the wiring
board; laterally bending lead pins whose base end portions are
adhered to both side surfaces of said package, said lead pins being
bent at a portion lower than the base end portion, and in this
state, setting a lower surface of said lead pin at a position above
a bottom surface of said package; and fixing the bent lead pin to
the surface of the wiring board, and bringing the bottom surface of
said package in close contact with the surface of the wiring
board.
11. A method of mounting an optical module on a wiring board,
comprising the steps of: arranging a package, which contains an
optical semiconductor device optically connected to an optical
fiber via an optical system, to face a bottom surface of the wiring
board; laterally bending lead pins whose base end portions are
adhered to both side surfaces of said package, said lead pins being
bent at a portion lower than the base end portion, and in this
state, setting a lower surface of said lead pin at a position above
a bottom surface of said package; and fixing the bent lead pin to
the surface of the wiring board, and bringing a heat sink in close
contact with the bottom surface of said package via an opening
formed in the wiring board at a position to be faced to the bottom
surface of said package.
12. The method of mounting an optical module according to claim 11,
wherein the bottom surface of said package is moved down in the
thickness direction of the wiring board through the opening, and
the heat sink is brought in close contact with the bottom surface
of said package at this position.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an optical module for use in
optical communication.
2. Description of the Related Art
An optical module of this kind has an optical semiconductor device
contained in a package, and the optical semiconductor device is
optically connected to an optical fiber via an optical system. The
optical semiconductor device is operated by supplying electric
power, and it can emit and receive laser light through the optical
system and the optical fiber.
The operating characteristic of the optical semiconductor device is
easily affected by the thermal effect. Therefore, it is important
for the optical module to effectively restrain the variation in the
operating characteristic of the optical semiconductor device inside
due to the heat generated in its operation. For the stabilization
of the operating characteristic of the semiconductor device against
the temperature fluctuation, the method of forcible cooling using a
thermo-module, which comprises a Peltier device, for example, and
the method of natural cooling using a heat sink are available. From
the standpoint of the power saving, the method using a heat sink is
preferable.
On the other hand, in respect of the optical communication
equipments using the optical module such as an optical amplifier
and a signal light source, the reduction in the entire size thereof
is required. Thus, the reduction in the mounting size of the
individual optical modules is also required. For example, when
employing the insertion mounting (also referred to as a "through
hole mounting") in which an optical module is inserted into a
wiring board, the so-called DIL (dual in-line) package is suitable
to achieve the reduction in the mounting size. In the DIL package,
several pairs of lead pins are provided on both the sides of the
package and each of the lead pins extends downward from the side
surface. Therefore, if the optical module is mounted with the lead
pins being inserted in the through hole of the wiring board, the
lead pins do not spread in the lateral direction. Therefore, the
mounting area thereof can be reduced.
On the other hand, the heat generated in the optical module is
usually radiated to the outside of the package through its bottom
surface serving as a heat radiation path. In the DIL package,
however, since the lead pins are protruded downward, it is
difficult to arrange the heat sink or the like immediately below
the package. Therefore, it is generally difficult to adopt the
cooling method using the heat sink or the like in the DIL
package.
SUMMARY OF THE INVENTION
The present invention disclosed and claimed herein, in one aspect
thereof, comprises an optical module. The optical module comprises
a package which contains an optical semiconductor device optically
connected to an optical fiber via an optical system, the package
having a bottom surface to be faced to a predetermined wiring board
and a pair of side surfaces arranged on both the sides of the
bottom surface and extending in the direction crossing the bottom
surface; lead pins serving as conductors between the optical
semiconductor device and the wiring board, each of the lead pins
having a base end portion fixed at the side surface of the package
and extending from this base end portion to the outside of the
package; and a fixing region formed on the side surface of the
package, in the fixing region, the base end portion of the lead pin
being fixed to the position apart from the bottom surface of the
package, thereby allowing the part of the lead pin lower than the
base end portion to be detachable from the side surface of the
package.
Further scope of applicability of the present invention will become
apparent from the detailed description given hereinafter. However,
it should be understood that the detailed description and specific
example, while indicating preferred embodiment of the invention,
are given by way of illustration only, since various changes and
modifications within the spirit and scope of the invention will
become apparent to those skilled in the art from this detailed
description.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention will become more fully understood from the
detailed description given hereinafter and the accompanying
drawings which are given by way of illustration only, and thus, are
not limitative of the present invention, and wherein:
FIG. 1 is a sectional view schematically showing a structure of a
semiconductor laser module;
FIG. 2A is a side view specifically showing the semiconductor laser
module according to the first embodiment;
FIGS. 2B and 2C are front views specifically showing the
semiconductor laser module according to the first embodiment:
FIG. 3 is a perspective view illustrating the first mounting
example of the semiconductor laser module;
FIG. 4 is a front view illustrating the first mounting example of
the semiconductor laser module;
FIGS. 5A and 5B are front views showing the semiconductor laser
module according to the prior art;
FIG. 6 is a perspective view illustrating the second mounting
example of the semiconductor laser module;
FIG. 7 is a front view illustrating the second mounting example of
the semiconductor laser module;
FIG. 8A is a side view specifically showing the semiconductor laser
module according to the second embodiment;
FIGS. 8B and 8C are front views specifically showing the
semiconductor laser module according to the second embodiment;
FIG. 9 is a perspective view illustrating the mounting example of
the semiconductor laser module according to the second
embodiment;
FIG. 10 is a front view illustrating the mounting example of the
semiconductor laser module according to the second embodiment;
FIG. 11A is a side view specifically showing the semiconductor
module according to the third embodiment;
FIGS. 11B and 11C are front views specifically showing the
semiconductor module according to the third embodiment;
FIG. 12A is a side view specifically showing the semiconductor
module according to the fourth embodiment;
FIGS. 12B and 12C are front views specifically showing the
semiconductor module according to the fourth embodiment; and
FIG. 13 is a front plan view illustrating an example of the through
hole mounting of the semiconductor laser module.
DETAILED DESCRIPTION
FIG. 1 schematically shows a semiconductor laser module 1 as an
example of an optical module. The semiconductor laser module 1 is
provided with a block-shaped package 2. The package 2 contains a
semiconductor laser device 3. The package 2 has a bottom plate 4
made of metal. A peripheral wall 6 made of ceramic is formed on the
bottom plate 4, and the peripheral wall 6 is in the shape of a
rectangular frame if viewed from above. Moreover, a top plate 8 is
provided on the peripheral wall 6, and the top plate 8 covers an
upper opening of the peripheral wall 6. Note that the bottom plate
4 has one edge portion projecting in the longitudinal direction,
and an insertion hole 10 is formed on the projected portion.
However, the projected portion of the bottom plate 4 is not
necessarily required. In addition, the material of the bottom plate
4 is not limited to metal and the bottom plate 4 made of ceramic
like the peripheral wall 6 can be used. Furthermore, the entire
peripheral wall 6 is not necessarily made of ceramic, and a part of
the peripheral wall 6 except that used to fix a later-described
lead pin can be made of metal.
A through hole 12 is formed on a part of the peripheral wall 6 in
the side opposite to the projected portion of the bottom plate 4.
In line with the through hole 12, a lens housing 14 and a fiber
support member 16 are sequentially connected on the peripheral wall
6 in this part. A condenser lens 18 is contained in the lens
housing 14, and a ferrule 19 is contained in the fiber support
member 16. Note that an optical fiber 20 is inserted in the ferrule
19.
In the package 2, a block 22 made of Cu--W is arranged on the
bottom plate 4, and the block 22 is fixed to the bottom plate 4 by
use of Sn--Pb solder. Moreover, the above-mentioned semiconductor
laser device 3 is placed on the block 22 via a carrier 24 made of
AlN. The semiconductor laser device 3 is die-bonded by use of
Au--Sn solder. Similarly, the carrier 24 is fixed to the block 22
by use of Au--Sn solder.
A primary lens 26 is set in an upright state between the
semiconductor laser device 3 and the through hole 12. More
specifically, the primary lens 26 is set with its optical axis
being horizontal. The laser light emitted from the semiconductor
laser device 3 is converted into a parallel light through the
primary lens 26, and the parallel light is irradiated to the
through hole 12. Then, the parallel light is condensed at the
condenser lens 18 and introduced into the optical fiber 20. Thus,
the semiconductor laser device 3 is optically connected to the
optical fiber 20 through the optical system consisting of the
primary lens 26 and the condenser lens 18.
In the semiconductor laser module 1 having a structure shown in
FIG. 1, the total thermal resistance from the bottom surface of the
package 2 to the device 3 except that of the semiconductor laser
device 3 itself is about 8.degree. C./W. In this case, assuming
that the heat radiated from the device 3 is about 0.5W, the
temperature of the device 3 is expected to increase by about
4.degree. C.
FIGS. 2A to 2C specifically show the lead pin 28 in the
semiconductor laser module 1 according to the first embodiment.
Four pairs of the lead pins 28 are provided to both the side
surfaces of the package 2, and four lead pins 28 form one line
along each side surface. Thus, the lead pins 28 form two lines each
on the respective side surfaces of the package 2, and all of the
lead pins 28 extend downward from the side surface. For that, the
package 2 is a so-called DIL package. Note that, in the illustrated
example, four pairs of the lead pins 28, more specifically, the
total of eight pins are provided. However, the number of the lead
pins 28 is not limited to this.
Four plating patterns 30 for use in the soldering are formed on
each side surface of the package 2. The arrangement of these
plating patterns 30 is determined depending on the number of the
lead pins 28 to be attached (FIG. 2A). The base end portion of the
lead pin 28 is widened to form a square-shaped pad providing a
predetermined soldering area each corresponding to the plating
pattern 30.
Each of the plating patterns 30 has a rectangular shape formed
along the longitudinal direction of the lead pin 28, and the lower
end thereof is positioned above the bottom surface of the package
2. Thus, each of the lead pins 28 is soldered within the range of
the plating pattern 30, and the base end portion thereof is fixed
to the side surface of the package 2 at a position above the bottom
surface of the package 2. Therefore, the part of the end base
portion of the lead pin 28 positioned higher than the lower end of
the plating pattern 30 is the region fixed to the plating pattern
30 by soldering. That is, such a part is a fixing region S (FIG.
2B).
Furthermore, the fixing region S allows the part of the lead pin 28
lower than the base end portion to be detachable from the side
surface of the package 2 without fixing it to the side surface of
the package 2. Therefore, when bending the lead pin 28 laterally,
the part of the lead pin 28 lower than the base end portion and
outside the fixing region S can be detached from the side surface
of the package 2, and the lead pin 28 can be bent laterally at the
position above the bottom surface (FIG. 2C). Note that, in the case
of the surface mounting of the semiconductor laser module 1, the
distance d between the bottom surface of the package 2 and the
lower surface of the bent lead pin 28 is preferably, for example,
0.2 mm or more.
FIGS. 3 and 4 show an example of the case where the semiconductor
laser module 1 is surface mounted on a wiring board 32 according to
the first embodiment. The first mounting example is implemented by,
for example, the following mounting method.
The above-described bottom surface of the package 2 in the
semiconductor laser module 1 is faced to the corresponding mounting
surface of the wiring board 32. In this case, the positional
relationship therebetween is as follows: assuming that the wiring
board 32 is laid down, each of the lead pins 28 is laterally bent
at the position above the bottom surface of the package 2. In this
state, the lead pins 28 are soldered to the wiring board 32, and
the bottom surface of the package 2 is in close contact with the
surface of the wiring board 32, thereby obtaining the state of the
surface mounting shown in FIGS. 3 and 4. In this case, since the
lead pins 28 are laterally bent at the position above the bottom
surface of the package 2, it is easy to bring the bottom surface of
the package 2 in close contact with the mounting surface of the
wiring board 32 when soldering the lead pins 28 to the wiring board
32. Note that, in this case, it is preferable to interpose grease
between the bottom surface of the package 2 and the wiring board 32
because the interposition of the grease can improve the efficiency
of heat radiation from the package 2 to the wiring board 32.
According to the first mounting example described above, by
bringing the bottom surface of the package 2 in close contact with
the wiring board 32, the heat radiation path from the bottom
surface to the wiring board 32 can be secured. In this case, since
the wiring board 32 can be used as a heat sink, the efficient
cooling of the semiconductor laser device 3 in the package 2 can be
achieved, and thus, the operating characteristic thereof can also
be sufficiently stabilized. Note that, in the first embodiment, the
temperature of the device 3 increases by about 6.degree. C.
Accordingly, it can be expected that the thermal resistance in the
wiring board 32 and the contact surfaces of the wiring board 32 and
the package 2 is about 0.5.degree. C./W. In addition, since the
bottom surface of the package 2 is in close contact with the wiring
board 32, the height of the optical semiconductor module 1 when
mounted can be reduced, which contributes to the downsizing
thereof.
The usefulness of the optical semiconductor module 1 having the
fixing region S becomes more apparent by the comparison with the
prior art described below.
More specifically, as shown in FIG. 5A as a soldering region B, in
the conventional DIL package, the lead pins 280 are soldered to the
side surface of the package 200 till the lower end of the side
surface (till a position equal to the bottom surface in terms of
the vertical direction) with no space therebetween. Therefore, when
laterally bending the lead pins 280, the bending position thereof
is inevitably positioned lower than the bottom surface of the
package 200, and the lead pins 280 cannot be laterally bent at the
position higher than that position. Therefore, if the conventional
lead pins 280 are bent laterally, the module 100 cannot be surface
mounted while the bottom surface of the package 200 is in close
contact with the wiring board 320.
Furthermore, in the case of using the conventional lead pins 280,
the superfluous solder when soldering the lead pins 280 moves down
on the side surface and reaches the bottom surface of the package
200. As a result, fillets 282 are formed between the lead pins 280
and the bottom surface of the package 200. Consequently, in the
case of the insertion mounting of the conventional module 100 into
the wiring board 320, the bottom surface of the package 200 is
inevitably floated from the surface of the wiring board 320 due to
the interference of the fillet 282 as shown in FIG. 5B.
In this respect, no fillet exists between the lead pin 28 and the
bottom surface of the package 2 in the semiconductor laser module
according to the first embodiment, and the bottom surface is kept
flat. Therefore, it is possible to securely bring the bottom
surface of the package 2 in close contact with the wiring board 32
in both cases of the insertion mounting and the surface
mounting.
FIG. 6 shows the second example of mounting the semiconductor laser
module 1. In this mounting example, a part of the wiring board 32
immediately below the module 1 is cut out. Thus, an opening 33 is
formed in the wiring board 32 at a position to which the bottom
surface of the package 2 was to contact. In addition, a heat sink
34 made of aluminum is in close contact with the bottom surface of
the package 2 through the opening 33. The heat sink 34 is formed in
a convex shape, and the convex portion in its center has a width
slightly wider than that of the bottom plate 4. Moreover, the heat
sink 34 spreads from the central convex portion to both the sides
thereof, and the wing parts thereof extend under the wiring board
32. Note that the shape and material of the heat sink 34 are not
particularly limited.
Furthermore, in the second mounting example, it is possible to put
the package 2 into the opening 33 of the wiring board 32 so as to
bring the bottom surface of the package 2 in close contact with the
heat sink 34 at a position lower than the upper surface of the
wiring board 32. In this case, since the bottom surface of the
package 2 moves downward in the thickness direction of the wiring
board 32, the fixing region S of the lead pin 28 is provided at a
position higher than that in the first mounting example (FIG. 2B),
and thus, the above-mentioned distance d is increased in comparison
to that in the first mounting example.
The second mounting example is implemented by, for example, the
following mounting method.
The mounting method in this case is the same as that in the first
mounting example in that the semiconductor laser module 1 shown in
FIG. 2 is used. However, in the second mounting example, the
opening 33 is formed by cutting off the part of the wiring board 32
which the bottom surface of the package 2 was to contact, and the
heat sink 34 is brought into contact with the bottom surface
through the opening 33, additionally. Note that either of the
processes described below can be used for arranging the heat sink
34 into the opening 33. The first process is that, after soldering
the lead pins 28 to the wiring board 32, the heat sink 34 is
arranged in the opening 33. The second process is that, after the
heat sink 34 is arranged in the opening 33, the bottom surface of
the package 2 is brought in contact with it and then the lead pins
28 are soldered.
According to the second mounting example, the efficiency of the
heat radiation from the bottom surface of the package 2 is enhanced
by using the heat sing 34 having larger heat capacity, and thus,
the semiconductor laser device 3 can be cooled without fail. In
addition, in the case where the package 2 is moved down in the
thickness direction of the wiring board 32, the mounting height
from the wiring board 32 can be reduced.
FIGS. 8A to 8C show the semiconductor laser module according to the
second embodiment. In this embodiment, chamfer portions 36 are
provided on both the side surfaces of the package 2, that is, on
the lower portion of the side wall 6. These chamfer portions 36 are
formed by obliquely cutting the corner portions between the bottom
surface of the package 2 and the fixing region S of the lead pins
28. As a result, the plating patterns 30 are formed on both the
side surfaces of the package 2 above the chamfer portions 36.
Moreover, both the edge portions of the bottom plate 4 almost
correspond to the borders of the chamfer portions 36 (FIG. 8B).
As shown in FIGS. 8B and 8C, the chamfer portion 36 forms a space
between the bottom and side surfaces of the package 2 and the
fixing region S. Therefore, the access to the lead pin 28 is
facilitated owing to the space, and the process for bending the
lead pin 28 is further facilitated.
FIGS. 9 and 10 show an example of the case where the semiconductor
laser module 1 according to the second embodiment is surface
mounted. Also in this mounting example, the lead pins 28 can be
laterally bent from the package 2 and soldered to the wiring board
32, and the bottom surface of the package 2 can be brought in close
contact with the mounting surface of the wiring board 32.
FIG. 11 shows the semiconductor module 1 according to the third
embodiment. In this embodiment, the package 2 does not have the
metal bottom plate. Instead of the metal bottom plate, the bottom
plate 4 and the side wall 6 are integrally formed by laminating
ceramic materials. Moreover, chamfer portions 36 are formed in each
of the lower corner portions between the bottom surface and both
the side surfaces. Similarly to the second embodiment, these
chamfer portions 36 are formed by obliquely cutting the corner
portions between the fixing region S of the lead pins 28 and the
bottom surface of the package 2. As a result, the plating patterns
30 are formed on both the side surfaces of the package 2 above the
chamfer portions 36.
As shown in FIGS. 11B and 11C, also in the third embodiment, the
chamfer portion 36 forms a space between the bottom and side
surfaces of the package 2 and the fixing region S, thereby the
process for laterally bending the lead pin 28 is facilitated.
Furthermore, FIG. 12 shows the semiconductor laser module 1
according to the fourth embodiment. In this embodiment, instead of
the chamfer portions 36 described in the third embodiment, notched
grooves 38 are formed in each of the corner portions. The notched
grooves 38 are formed by cutting the corner portions on both the
sides along the longitudinal direction. By the notched groove 38,
the corner portion between the fixing region S of the lead pin 28
and the bottom surface are cut off. As a result, the plating
patterns 30 are formed on both the side surfaces of the package 2
above the notched grooves 38.
As shown in FIGS. 12B and 12C, also in the fourth embodiment, the
notched groove 38 forms a space between the bottom and side
surfaces of the package 2 and the fixing region S, thereby the
process for laterally bending the lead pin 28 is facilitated.
In the case where the semiconductor laser module 1 according to the
third and fourth embodiments is surface mounted on the wiring board
32, the mounting example thereof will be almost identical to that
of the second embodiment (see FIGS. 9 and 10). However, in the
semiconductor laser module 1 according to the third and fourth
embodiments, the metal bottom plate 4 is not provided, and instead,
the bottom surface of the ceramic bottom plate 4 serves as the
bottom surface of the package 2. Also in this mounting example,
since the heat radiation path from the bottom surface of the
package 2 to the wiring board 32 is formed, the heat radiation
efficiency of the semiconductor laser device 3 can be enhanced.
Particularly, since the chamfer portions 36 and the notched grooves
38 are formed in the semiconductor module 1 according to the third
and fourth embodiments, the problem that the superfluous solder
when soldering the lead pins 28 to the side surface of the package
2 moves down on the side surface and reaches the bottom surface of
the package 2 can be prevented. Therefore, the bottom surface of
the package 2 is kept flat, and the contact between the package 2
and the wiring board 32 is further increases.
Furthermore, the mounting examples shown in FIGS. 6 and 7 are also
applicable to the semiconductor laser modules 1 according to the
second to fourth embodiments. In this case, the opening 33 of the
wiring board 32 and the heat sink 34 remain unchanged, and the
shape of the package 2 is changed into that of the semiconductor
laser module 1 according to the second to fourth embodiments. By
applying these mounting examples, the advantages such as the
enhancement in the heat radiation efficiency of the heat sink 34
and the downsizing in the mounting height can be achieved in the
semiconductor laser module 1 according to the second to fourth
embodiments.
Note that, in the mounting examples described above, the cases of
the surface mounting are exemplified. However, as shown in FIG. 13,
the insertion mounting into the wiring board 32 without bending the
lead pins 28 is also applicable to the semiconductor laser module 1
according to the embodiments. In this case, since no fillet is
formed on the bottom surface of the package 2 as described above,
even if the metal bottom plate is not used in the package 2, the
bottom surface of the package 2 can be brought in contact with the
wiring board 32.
In the foregoing, the descriptions of the embodiments have been
made. Essentially, more advantageous effects can be achieved by the
present invention in comparison to the prior art. For example,
according to the present invention, even the optical module having
the DIL package can be mounted on the surface of the wiring board.
In this case, the bottom surface of the package is brought in close
contact with the wiring board and the heat sink, thereby greatly
enhancing the heat radiation efficiency. Thus, the change in the
characteristic of the optical semiconductor device due to the
temperature fluctuation can be restrained, and it is possible for
the optical semiconductor device to exert the stabilized
performance.
Furthermore, in the present invention, since the bottom surface of
the package is in contact with the wiring board, the downsizing in
the mounting height of the optical module can be achieved.
Particularly, in the case of the surface mounting, since the lead
pins do not project into the rear surface of the wiring board, the
clearance between the rear surface and the outside container can be
minimized. Therefore, the big advantage of the downsizing in the
entire size of the outside container can be achieved. Furthermore,
the opening is formed in the wiring board and the bottom surface of
the package is set into the opening, by which the mounting height
from the wiring board can be reduced.
The semiconductor laser module 1 and the mounting method thereof
according to the embodiments described above are preferable
examples, and the present invention is not limited to them. For
example, the concrete structure of the optical module is not
limited to that shown in FIG. 1, and the one lens system can be
used as the components consisting of the optical system. Moreover,
the optical semiconductor device is not limited to the
light-emitting device, and the light-receiving device can be also
used.
Furthermore, the specification and application of the optical
module are not particularly limited, and the present invention is
applicable to the optical modules used for various
applications.
Other than these, all of the components described with reference to
the drawings are only the examples, and the modifications and
replacement thereof can be made as needed.
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