U.S. patent number 6,667,497 [Application Number 10/271,532] was granted by the patent office on 2003-12-23 for led package.
This patent grant is currently assigned to Advanced Optoelectronic Technology. Invention is credited to Chuan-Ming Chang, Min-Huang Huang, Teng-Huei Huang, Tse-Min Mao.
United States Patent |
6,667,497 |
Huang , et al. |
December 23, 2003 |
LED package
Abstract
A LED package is comprised of a flat panel base and three LED
dies. The flat panel base is composed of a first golden film area,
a second golden film area, a third golden film area, a fourth
golden film area, a first connection area, and a second connection
area, wherein the first connection area and the second connection
area are connected to the first golden film area. The first LED die
is attached on the flat panel base by flip-chip mounting, wherein
an anode of the first LED die is connected to the first golden film
area, and a cathode of the first LED die is connected to the second
golden film area. The second LED die is attached on the flat panel
base by flip-chip mounting, wherein the second LED die is composed
of an anode connected to the first golden film area, and a cathode
connected to the fourth golden film area. The third LED die is
attached on the third golden film area; wherein the third LED die
is composed of an anode connected to the first golden film area by
a metallic wire, and a cathode connected to the third golden film
area.
Inventors: |
Huang; Teng-Huei (Hsinchu,
TW), Chang; Chuan-Ming (Hsinchu, TW), Mao;
Tse-Min (Taipei, TW), Huang; Min-Huang (Yuan Lin
Hsien, TW) |
Assignee: |
Advanced Optoelectronic
Technology (Hsinchu Hsien, TW)
|
Family
ID: |
29708483 |
Appl.
No.: |
10/271,532 |
Filed: |
October 17, 2002 |
Foreign Application Priority Data
|
|
|
|
|
Jun 21, 2002 [TW] |
|
|
91113659 A |
|
Current U.S.
Class: |
257/99; 257/81;
257/84; 257/89; 257/93; 257/E25.02 |
Current CPC
Class: |
H01L
25/0753 (20130101); H01L 33/62 (20130101); H01L
2924/0002 (20130101); H01L 2924/0002 (20130101); H01L
2924/00 (20130101) |
Current International
Class: |
H01L
29/72 (20060101); H01L 33/00 (20060101); H01L
31/0203 (20060101); H01L 29/66 (20060101); H01L
029/72 () |
Field of
Search: |
;257/432,433,448,459,81,84,89,93,99 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Wojciechowicz; Edward
Attorney, Agent or Firm: Troxell Law Office PLLC
Claims
What is claimed is:
1. A LED package comprising: a flat panel base, which is composed
of a first golden film area, a second golden film area, a third
golden film area, a fourth golden film area, a first connection
area, and a second connection area, wherein said first connection
area and said second connection area are connected to said first
golden film area; a first LED die attached on said flat panel base
by flip-chip mounting, wherein an anode of said first LED die is
connected to said first connection area and then to said first
golden film area, and a cathode of said first LED die is connected
to said second golden film area; a second LED die attached on said
flat panel base by flip-chip mounting, wherein said second LED die
is composed of an anode connected to said second connection area
and then to said first golden film area, and a cathode connected to
said fourth golden film area; a third LED die attached on said
third golden film area; wherein said third LED die is composed of
an anode connected to said first golden film area by a metallic
wire, and a cathode connected to said third golden film area.
2. The LED package of claim 1, wherein said LED package is a 0603
model package.
3. The LED package of claim 1, wherein said first LED die, said
second LED die, and said third LED die are attached on said flat
panel base by means of silver glue.
4. The LED package of claim 1, wherein said first golden film area
serves as a common anode of said LED package.
5. The LED package of claim 1, wherein said first LED die is a
blue-colored light emitting diode manufactured from InGaN.
6. The LED package of claim 1, wherein said second golden film area
serves as a cathode for blue color of the LED package.
7. The LED package of claim 1, wherein said second LED die is a
green-colored light emitting diode manufactured from InGaN.
8. The LED package of claim 1, wherein said third golden film area
serves as a cathode for green color of the LED package.
9. The LED package of claim 1, wherein said second LED die is a
red-colored light emitting diode.
10. The LED package of claim 1, wherein said fourth golden film
area serves as a cathode for red color of the LED package.
11. A LED package comprising: a flat panel base, which is composed
of a first golden film area, a second golden film area, a third
golden film area, a fourth golden film area, a first connection
area, and a second connection area, wherein said first connection
area and said second connection area are connected to said first
golden film area; a first LED die attached on said flat panel base
by flip-chip mounting, wherein a cathode of said first LED die is
connected to said first connection area and then to said first
golden film area, and an anode of said first LED die is connected
to said second golden film area; a second LED die attached on said
flat panel base by flip-chip mounting, wherein said second LED die
is composed of a cathode connected to said second connection area
and then to said first golden film area, and an anode connected to
said fourth golden film area; a third LED die attached on said
third golden film area; wherein said third LED die is composed of a
cathode connected to said first golden film area by a metallic
wire, and an anode connected to said third golden film area.
12. The LED package of claim 11, wherein said LED package is a 0603
model package.
13. The LED package of claim 11, wherein said first LED die, said
second LED die, and said third LED die are attached on said flat
panel base by means of silver glue.
14. The LED package of claim 11, wherein said first golden film
area serves as common cathode of said LED package.
15. The LED package of claim 11, wherein said first LED die is a
blue-colored light emitting diode manufactured from InGaN.
16. The LED package of claim 11, wherein said second golden film
area serves as an anode for blue color of the LED package.
17. The LED package of claim 11, wherein said second LED die is a
green-colored light emitting diode manufactured from InGaN.
18. The LED package of claim 11, wherein said third golden film
area serves as an anode for green color of the LED package.
19. The LED package of claim 11, wherein said second LED die is a
red-colored light emitting diode.
20. The LED package of claim 11, wherein said fourth golden film
area serves as an anode for red color of the LED package.
21. A method of forming a LED package, comprising: providing a flat
panel base; forming a first golden film area, a second golden film
area, a third golden film area, a fourth golden film area, a first
connection area, and a second connection area on said flat panel
base; attaching a first LED die, a second LED die, and a third LED
die on said flat panel base by using silver glue; and wire-bonding
an electrode of a third LED die to a common electrode of said LED
package.
22. A method of claim 21, further comprising a step of forming a
PCB by using a glue plate and a mold.
23. A method of claim 21, further comprising a step of cutting a
PCB by using a cutter.
24. A method of claim 21, further comprising a step of performing a
step of classification by inputting a stable current into the LED
package.
Description
BACKGROUND OF THE INVENTION
1. Field of Invention
The present invention relates to a packaging design for light
emitting diode (LED), more particularly, to a LED package contains
three LED dies.
2. Description of Related Art
Light emitting diode (LED) is a junction diode formed by an
epitaxial P-type layer and an epitaxial N-type layer on a heavily
doped semiconductor compound base. The diode further includes an
ohmic metallic contact on the P-type and N-type layers. LED is
mainly packaged within an epoxy or a metallic housing. Visible LED
are generally used in display screens, automobile braking lights,
scanners, indicator lights for equipment and so on.
Surface-mount device LED (SMD LED) was developed in the early
1980s. For assembling SMD LED, the chip is glued or eutectic bonded
to a metallic system carrier, what is referred to as a leadframe,
namely on a central part or island thereof given standard
components or, respectively, standard ICs, and wires are bonded to
the chip. The chip is also completely enveloped with a plastic
molding compound in an injection molding process such that only the
ends of the system carrier serving as outer terminals project
therefrom.
SMD LEDs have several of specification, such as 1206M(3.0 mm*1.5
mm*0.7 mm), 1206P (with a size of 3.0 mm*1.5 mm*0.7 mm), 0805M
(with a size of 2.0 mm*1.2 mm*0.6 mm), and 0603M (with a size of
1.6 mm*0.8 mm*0.5 mm). Because the 0603M model is especially small
in size, only single light emitting diode could be contained in the
LED package in accordance with the prior art.
As soon as the rapid development of mobile phones and PDAs
(Personal Digital Assistants), there is a request to develop
colorful LED panels to display colorful images. Therefore, it is
necessary to develop a LED package with three (3) light emitting
diodes (generally red, blue, and green).
However, particularly for the smallest 0603M model, the
conventional LED package can contain only one die, so it is
impossible to generate colorful images. Therefore, in order to
display colorful images, it is very important for the LED package
industry to create a package assembly containing at least a red, a
blue, and a green light emitting diodes.
SUMMARY OF THE INVENTION
It is the main object of the present invention to provide a LED
package with three different light emitting diodes (red, blue, and
green).
The second object of the present invention is to disclose a LED
package.
The third object of the present invention is to provide a method
for manufacturing a LED package.
The first embodiment of the present invention discloses a LED
package, which is comprised of a flat panel base and three LED
dies. The flat panel base is composed of a first golden film area,
a second golden film area, a third golden film area, a fourth
golden film area, a first connection area, and a second connection
area, wherein the first connection area and the second connection
area are connected to the first golden film area. The first LED die
is attached on the flat panel base by flip-chip mounting, wherein
an anode of the first LED die is connected to the first golden film
area, and a cathode of the first LED die is connected to the second
golden film area. The second LED die is attached on the flat panel
base by flip-chip mounting, wherein the second LED die is composed
of an anode connected to the first golden film area, and a cathode
connected to the fourth golden film area. The third LED die is
attached on the third golden film area; wherein the third LED die
is composed of an anode connected to the first golden film area by
a metallic wire, and a cathode connected to the third golden film
area.
The second embodiment of the present invention discloses a LED
package, which is comprised of a flat panel base and three LED
dies. The flat panel base is composed of a first golden film area,
a second golden film area, a third golden film area, a fourth
golden film area, a first connection area, and a second connection
area, wherein the first connection area and the second connection
area are connected to the first golden film area. The first LED die
is attached on the flat panel base by flip-chip mounting, wherein a
cathode of the first LED die is connected to the first golden film
area, and an anode of the first LED die is connected to the second
golden film area. The second LED die is attached on the flat panel
base by flip-chip mounting, wherein the second LED die is composed
of a cathode connected to the first golden film area, and an anode
connected to the fourth golden film area. The third LED die is
attached on the third golden film area; wherein the third LED die
is composed of a cathode connected to the first golden film area by
a metallic wire, and an anode connected to the third golden film
area.
The process flow of the method of manufacturing a LED package
according to the present invention is also disclosed. A flat panel
base is first provided. Thereafter, the first golden film area, the
second golden film area, the third golden film area, the fourth
golden film area, the first connection area, and the second
connection area are formed on the flat panel base. After that, the
first LED die, the second LED die, and the third LED die are
attached on the flat panel base by means of silver glue.
Next, the anode or cathode of the third LED die is connected to the
common anode or common cathode of the LED package by wire
bonding.
Thereafter, a PCB is formed by using a glue plate and a mold, and
then the PCB is cut by using a cutter. Finally, a step of
classification is performed by inputting a stable current into the
LED package.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention. In the
drawings,
FIG. 1 schematically illustrates the top-view diagram of the LED
package according to the first embodiment of the present
invention;
FIG. 2 schematically illustrates the top-view diagram of the LED
package according to the second embodiment of the present
invention;
FIG. 3 discloses the process flow of the method of manufacturing a
LED package according to the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The present invention relates to a packaging design for light
emitting diode (LED), more particularly, to a LED package contains
three LED dies.
First please refer to FIG. 1, which schematically illustrates the
top-view diagram of the LED package according to the first
embodiment of the present invention. The LED package is composed of
a flat panel base 10, the first LED die 40a, the second LED die
40b, and the third LED die 40c.
The flat panel base 10 is composed of a first golden film area 20a,
a second golden film area 20b, a third golden film area 20c, a
fourth golden film area 20d, a first connection area 30a, and a
second connection area 30b. The first connection area 30a and the
second connection area 30b are connected to the first golden film
area 20a.
The first golden film area 20a serves as the common anode of the
LED package. The second golden film area 20b serves as the cathode
for blue color of the LED package. The third golden film area 20c
works as the cathode for green color of the LED package. The fourth
film area 20d works as the cathode for the red color of the LED
package.
The first LED die 40a is a blue-colored light emitting diode
manufactured from InGaN. The first LED die 40a is attached on the
flat panel base 10 by flip-chip mounting. The anode of the first
LED die 40a is connected to the first connection area 30a and then
to the first golden film area 20a. The cathode of the first LED die
40a is connected to the second golden film area 20b.
The second LED die 40b is a green-colored light emitting diode
manufactured from InGaN. The second LED die 40b is attached on the
flat panel base 10 by flip-chip mounting. The anode of the second
LED die 40b is connected to the second connection area 30b, and
then to the first golden film area 20a. The cathode of the second
LED die 40b is connected to the fourth golden film area 20d.
The third LED die 40c is a red-colored light emitting diode
attached on the third golden film area 20c. The anode of the third
LED die 40c is connected to the first golden film area 20a by a
metallic wire 50. The cathode of the third LED die 40c is connected
to the third golden film area 20c.
According to a preferred embodiment of the present invention, the
LED package can specially be a 0603 model package.
Please then to FIG. 2, which schematically illustrates the top-view
diagram of the LED package according to the second embodiment of
the present invention. The LED package is composed of a flat panel
base 10, the first LED die 40a, the second LED die 40b, and the
third LED die 40c.
The flat panel base 10 is composed of a first golden film area 20a,
a second golden film area 20b, a third golden film area 20c, a
fourth golden film area 20d, a first connection area 30a, and a
second connection area 30b. The first connection area 30a and the
second connection area 30b are connected to the first golden film
area 20a.
The first golden film area 20a serves as the common cathode of the
LED package. The second golden film area 20b serves as the anode
for blue color of the LED package. The third golden film area 20c
works as the anode for green color of the LED package. The fourth
film area 20d works as the anode for the red color of the LED
package.
The first LED die 40a is a blue-colored light emitting diode
manufactured from InGaN. The first LED die 40a is attached on the
flat panel base 10 by flip-chip mounting. The cathode of the first
LED die 40a is connected to the first connection area 30a and then
to the first golden film area 20a. The anode of the first LED die
40a is connected to the second golden film area 20b.
The second LED die 40b is a green-colored light emitting diode
manufactured from InGaN. The second LED die 40b is attached on the
flat panel base 10 by flip-chip mounting. The cathode of the second
LED die 40b is connected to the second connection area 30b, and
then to the first golden film area 20a. The anode of the second LED
die 40b is connected to the fourth golden film area 20d.
The third LED die 40c is a red-colored light emitting diode
attached on the third golden film area 20c. The cathode of the
third LED die 40c is connected to the first golden film area 20a by
a metallic wire 50. The anode of the third LED die 40c is connected
to the third golden film area 20c.
According to a preferred embodiment of the present invention, the
LED package can specially be a 0603 model package.
Referring then to FIG. 3, the process flow of the method of
manufacturing a LED package according to the present invention is
disclosed. A flat panel base 10 is first provided (step 101).
Thereafter, the first golden film area 20a, the second golden film
area 20b, the third golden film area 20c, the fourth golden film
area 20d, the first connection area 30a, and the second connection
area 30b are formed on the flat panel base 10 (step 102). After
that, the first LED die 40a, the second LED die 40b, and the third
LED die 40c are attached on the flat panel base by means of silver
glue (step 103).
Next, the anode or cathode of the third LED die 40c is connected to
the common anode or common cathode of the LED package by means of
wire bonding (step 104).
Thereafter, a PCB is formed by using a glue plate and a mold (step
105), and then the PCB is cut by using a cutter (step 106).
Finally, a step of classification is performed by inputting a
stable current into the LED package (step 107).
While the present invention has been described with the reference
to a preferred embodiment thereof, those skilled in the art will
appreciate various changes in form and detail may be made without
departing from the intended scope of the present invention as
defined in the appended claims.
* * * * *