U.S. patent number 6,058,132 [Application Number 09/021,377] was granted by the patent office on 2000-05-02 for laser beam machining apparatus using a plurality of galvanoscanners.
This patent grant is currently assigned to Sumitomo Heavy Industries, Ltd.. Invention is credited to Keiji Iso, Takashi Kuwabara.
United States Patent |
6,058,132 |
Iso , et al. |
May 2, 2000 |
Laser beam machining apparatus using a plurality of
galvanoscanners
Abstract
In an optical path of a laser beam, a reflection mirror (11) is
located to divide the laser beam into two split laser beams. By the
use of the split laser beams, workpieces (17a, 17b) are
simultaneously processed.
Inventors: |
Iso; Keiji (Hiratsuka,
JP), Kuwabara; Takashi (Hiratsuka, JP) |
Assignee: |
Sumitomo Heavy Industries, Ltd.
(Tokyo, JP)
|
Family
ID: |
14909718 |
Appl.
No.: |
09/021,377 |
Filed: |
February 10, 1998 |
Foreign Application Priority Data
|
|
|
|
|
May 15, 1997 [JP] |
|
|
9-125422 |
|
Current U.S.
Class: |
372/108;
219/121.6; 372/15; 372/9; 372/99; 372/107; 372/104; 219/121.74;
219/121.61 |
Current CPC
Class: |
B23K
26/066 (20151001); B23K 26/0673 (20130101); B23K
26/067 (20130101) |
Current International
Class: |
B23K
26/067 (20060101); B23K 26/06 (20060101); H01S
003/08 (); B23K 026/00 () |
Field of
Search: |
;372/9,10,15,24,107,108,109,99
;219/121.6,121.61,121.74,121.76,121.77 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Healy; Brian
Attorney, Agent or Firm: Burns, Doane, Swecker & Mathis,
LLP
Claims
What is claimed is:
1. A laser machining apparatus comprising a laser oscillator for
producing a laser beam, beam splitter means for splitting said
laser beam into a plurality of split laser beams, and a plurality
of laser irradiating means for irradiating said split laser beams
to at least one object to be processed, wherein a plurality of
objects are processed by said plurality of split laser beams,
respectively, wherein each of said laser irradiating means
comprises a galvanoscanner formed by a combination of a plurality
of galvanomirrors to scan said object by said split laser beam.
2. A laser machining apparatus as claimed in claim 1, wherein said
beam splitter means comprises a half-split reflecting mirror having
two reflecting surfaces intersecting each other at an angle of
90.degree..
3. A laser machining apparatus as claimed in claim 1, wherein said
beam splitter means is of a half-split type and comprises a 50%
reflecting mirror having a half region as a reflecting surface and
the other half region as a transparent surface.
4. A laser machining apparatus as claimed in claim 1, wherein said
beam splitter means is of a half-split type and comprises an edge
mirror for reflecting a half of said laser beam in its sectional
area to a direction at an angle of 90.degree. with respect to an
optical axis of said laser beam.
5. A laser machining apparatus as claimed in claim 1, wherein said
beam splitter means is of a half-split type and comprises a 50%
reflecting surface for reflecting a half of said laser beam in
energy and for transmitting another half of said laser beam in
energy.
6. A laser machining apparatus as claimed in claim 1, wherein said
galvanoscanners, two in number, are arranged at positions
symmetrical with respect to said beam splitter means, said
apparatus being provided with two workstages for mounting said
objects in correspondence to said two
galvanoscanners, respectively.
7. A laser machining apparatus as claimed in claim 6, wherein each
of said two workstages is driven by a stage drive mechanism to be
movable on an X-Y plane.
8. A laser machining apparatus comprising a laser oscillator for
producing a laser beam, beam splitter means for splitting said
laser beam into a plurality of split laser beams, and a plurality
of laser irradiating means for irradiating said split laser beams
to at least one object to be processed, wherein a single object is
processed simultaneously by said plurality of split leaser beams
and each of said laser irradiating means comprises a galvanoscanner
formed by a combination of a plurality of galvanomirrors to scan
said objects by said split laser beam.
9. A laser machining apparatus as claimed in claim 8, -wherein said
beam splitter means comprises a half-split reflecting mirror having
two reflecting surfaces intersecting each other at an angle of
90.degree..
10. A laser machining apparatus as claimed in claim 8, wherein said
beam splitter means is of a half-split type and comprises a 50%
reflecting mirror having a half region as a reflecting surface and
the other half region as a transparent surface.
11. A laser machining apparatus as claimed in claim 8, wherein said
beam splitter means is of a half-split type and comprises an edge
mirror for reflecting a half of said laser beam in its sectional
area to a direction at an angle of 90.degree. with respect to an
optical axis of said laser beam.
12. A laser machining apparatus as claimed in claim 8, wherein said
beam splitter means is of a half-split type and comprises a 50%
reflecting surface for reflecting a half of said laser beam in
energy and for transmitting another half of said laser beam in
energy.
13. A laser machining apparatus as claimed in claim 8, wherein said
galvanoscanners, two in number, are arranged at positions
symmetrical with respect to said beam splitter means, said
apparatus being provided with a single workstage for mounting said
object.
14. A laser machining apparatus as claimed in claim 13, wherein
said workstage is driven by a stage drive mechanism to be movable
on an X-Y plane.
Description
BACKGROUND OF THE INVENTION
This invention relates to a laser beam machining apparatus and, in
particular, to a laser beam machining apparatus adapted to form a
fine via hole in a printed wiring board.
In recent years, a portable electronic apparatus such as a digital
camera, a video camera, and a mobile telephone set becomes more and
more compact in size and superior in function. As a consequence, a
printed wiring board contained in the electronic apparatus is
improved so as to increase the density of various components
mounted thereon and to reduce the lead pitch. In order to cope with
such improvement, a via hole formed in the printed wiring board is
required to have a diameter not greater than 0.3 mm.
Heretofore, a boring operation to form the via hole in the printed
wiring board is carried out by tool machining using an NC
(Numerical Control) drill or light exposure machining (photovia
technique). However, the NC drill can not form the via hole smaller
than 0.2 mm and is often broken. On the other hand, the photovia
technique can not form the via hole smaller than 0.15 mm and
requires a high material cost for light exposure.
In order to solve the above-mentioned disadvantages, proposal has
recently been made of a laser beam machining apparatus for boring
the via hole in the printed wiring board by the use of a laser
beam. The laser beam machining apparatus comprises a laser
oscillator for producing a pulsed laser beam. The laser beam
machining apparatus carries out the boring operation to a desired
depth by adjusting the number of laser pulses per via hole or the
laser energy per pulse. On the other hand, in order to obtain a
desired diameter of the via hole, a mask is arranged in an optical
path of the laser beam to define the diameter of the laser beam. By
reducing the diameter of the laser beam with the mask, the diameter
of the via hole is reduced.
Furthermore, machining by the laser beam gives no damage to a
metal. Thus, the laser beam machining apparatus is advantageous in
that the boring operation is performed without damaging a conductor
pattern formed on the printed wiring board.
The laser oscillator typically comprises an excimer laser. However,
the excimer laser has a relatively low working speed and therefore
requires a high running cost because of its low etch rate (boring
depth per pulse). In contrast, attention is directed to a TEA
(Transversely Excited Atmospheric Pressure) CO.sub.2 laser having a
narrow pulse width, a high peak power, and a high energy density.
If the laser beam machining apparatus uses the TEA CO.sub.2 laser
as the laser oscillator, the etch rate is as high as ten times or
more as compared with the excimer laser. It is therefore possible
to reduce the number of laser pulses required to form each via hole
and to increase the working speed.
However, even if the above-mentioned TEA CO.sub.2 laser is used,
the working speed is restricted. It is therefore desired to achieve
an improvement enabling reduction in working cost per via hole.
SUMMARY OF THE INVENTION
It is therefore an object of this invention to provide a laser beam
machining apparatus capable of considerably increasing a working
speed.
A laser beam machining apparatus according to this invention
comprises a laser oscillator for producing a laser beam, beam
splitter means for splitting the laser beam into a plurality of
split laser beams, and a plurality of laser irradiating means for
irradiating the split laser beams onto at least one object to be
processed.
According to an aspect of this invention, a plurality of objects
are processed by the plurality of split laser beams,
respectively.
According to another aspect of this invention, a single object is
processed simultaneously by the plurality of split laser beams.
BRIEF DESCRIPTION OF THE DRAWING
FIG. 1 is a block diagram showing the structure of a laser beam
machining apparatus according to a first embodiment of this
invention;
FIG. 2 is an enlarged view for describing the function of a
45.degree. reflection mirror illustrated in FIG. 1 as a beam
splitter;
FIG. 3 is a view for describing a cross section of a laser
beam;
FIG. 4 is a view for describing another beam splitter used instead
of the 45.degree. reflection mirror illustrated in FIG. 1;
FIG. 5 is a plan view of the beam splitter illustrated in FIG.
4;
FIG. 6 is a view for describing still another beam splitter used
instead of the 45.degree. reflection mirror illustrated in FIG.
1;
FIG. 7 is a view showing the structure of an X-Y scanner
illustrated in FIG. 1;
FIG. 8 is a side view showing the structure of a mask illustrated
in FIG. 1;
FIG. 9 is a front view showing a mask plate in the mask illustrated
in FIG. 8;
FIG. 10 is a front view showing a mask holder in the mask
illustrated in FIG. 8;
FIG. 11 is a schematic block diagram showing the structure of a
laser beam machining apparatus according to a second embodiment of
this invention; and
FIG. 12 is a view for describing yet another beam splitter used
instead of the 45.degree. reflection mirror illustrated in FIG.
1.
DESCRIPTION OF PREFERRED EMBODIMENT
In this invention, attention is directed to the following.
Specifically, a laser beam emitted from a laser oscillator
typically has a square or a
rectangular section with each side approximately equal to 10 mm.
The laser beam is reduced in its sectional area by the use of a
mask and thereafter irradiated onto an object to be processed. In
other words, only a part of the laser beam produced by the laser
oscillator is used for machining. In this invention, the laser beam
from the laser oscillator is divided into a plurality of split
laser beams without decreasing its peak power or energy density.
The split laser beams are used for laser machining of a plurality
of objects or for simultaneous laser machining of a single object.
As a result, a working speed can be increased.
Referring to FIG. 1, description will be made about a laser
machining apparatus according to a first embodiment of this
invention. In FIG. 1, a laser oscillator 10 in this embodiment
comprises a TEA CO.sub.2 laser. A pulsed laser beam produced by the
laser oscillator 10 is supplied to a reflection mirror 11 as a beam
splitter and divided in its sectional area into two split laser
beams. The split laser beams are deflected by 90.degree. in
opposite directions to be led to masks 13a and 13b (may simply be
depicted at 13), respectively. As will later be described in
detail, each of the masks 13a and 13b has at least one aperture for
defining a diameter of a via hole to be formed. The split laser
beams are reduced in diameter through the apertures in the masks
13a and 13b. The split laser beams passing through the masks 13a
and 13b are led to X-Y scanners 14a and 14b, respectively.
As will later be described in detail, each of the X-Y scanners 14a
and 14b is for making each split laser beam scan over an object to
be processed. One of the split laser beams from the X-Y scanner 14a
passes through a processing lens 15a and is irradiated onto a
workpiece 17a placed on a workstage 16a. Likewise, the other split
laser beam from the X-Y scanner 14b passes through another
processing lens 15b and is irradiated onto another workpiece 17b
placed on another workstage 16b. As well known, each of the
processing lenses 15a and 15b is a laser beam focusing lens which
may be called an f.theta. lens. Practically, each of the processing
lenses 15a and 15b is a combination of a plurality of convex and
concave lenses and is accommodated in a cylindrical housing. Such a
combination is called an f.theta. lens assembly. For convenience of
illustration, the f.theta. lens assembly is represented by a single
processing lens. A combination of the f.theta. lens assembly and
the X-Y scanner may be called a laser irradiation unit. Each of the
workpieces 17a and 17b as the object to be processed is, for
example, a printed wiring board.
The workstage 16a is driven by a stage drive mechanism 18a having
an X-axis drive mechanism and a Y-axis drive mechanism and is
movable on an X-Y plane. Thus, the workpiece 17a can be moved on
the X-Y plane to be adjusted in position. Likewise, the workstage
16b is driven by a stage drive mechanism 18b having an X-axis drive
mechanism and a Y-axis drive mechanism and is movable on an X-Y
plane. Thus, the workpiece 17b can be moved on the X-Y plane to be
adjusted in position.
Referring to FIG. 2, the reflection mirror 11 has two reflecting
surfaces 11a and 11b intersecting each other at an angle
90.degree.. The laser beam is incident to the reflection mirror 11a
in such a manner that an incidence area on the reflecting surface
11a is equal to that on the reflecting surface 11b. As a result,
the reflection mirror 11 divides the laser beam incident thereto
equally in its sectional area. For example, the laser beam having a
square section of 12.times.12 (mm) is equally divided into the two
split laser beams each of which has a rectangular section of
6.times.12 (mm), as illustrated in FIG. 3. Each of the masks 13a
and 13b reduces each split laser beam through the aperture having a
diameter which is determined depending upon a reduction rate M and
the diameter of the via hole and which is typically between 1 and 2
mm. The aperture in each of the masks 13a and 13b has a diameter
sufficiently smaller than the sectional area of the split laser
beam. Therefore, no disadvantage is caused as a result of division
of the laser beam into the two split laser beams.
According to the similar principle, the laser beam can be equally
divided into three split laser beams by the use of a
triangular-pyramid reflection mirror having three reflecting
surfaces. Likewise, the laser beam can be split into four split
laser beams by the use of a rectangular-pyramid reflection mirror
having four reflecting surfaces.
Referring to FIGS. 4 and 5, another beam splitter will be
described. In the example illustrated in the figure, the beam
splitter comprises a 50% reflection mirror 21 for dividing the
laser beam into the two split laser beams. As illustrated in FIG.
5, the 50% reflection mirror 21a comprises a reflecting portion 21a
and a transparent portion 21b. The reflecting portion 21a occupies
a half region of the 50% reflection mirror 21 which region is
coated with a reflecting material. Another half region serves as
the transparent portion 21b of a total-transmission type. As a
result, the laser beam incident to the 50% reflection mirror 21 can
be equally divided in its sectional area.
The laser beam may be divided into three in the manner mentioned
above. In this case, a 33% reflection mirror is combined with the
50% reflection mirror. The 33% reflection mirror comprises a
reflecting portion which occupies a 33% region of the 33%
reflection mirror. A remaining region serves as the transparent
region. The laser beam transmitted through the transparent region
is divided into two laser beams by the use of the 50% reflection
mirror.
FIG. 6 shows still another beam splitter. In the example
illustrated in the figure, the beam splitter comprises an edge
mirror 31. The edge mirror 31 has a reflecting surface 31a forming
an angle 45.degree. with respect to an optical axis of the laser
beam. The edge mirror 31 can reflect a half of the laser beam in
its sectional area to a direction of 90.degree. with respect the
optical axis of the laser beam.
This embodiment is characterized in that the laser beam can be
divided by the use of any one of the above-mentioned reflection
mirrors without decreasing the energy density of the laser
beam.
Referring to FIG. 7, the X-Y scanner 14a will be described. The X-Y
scanner 14a is a so-called galvano-scanner comprising a combination
of two galvano-mirrors 14-1 and 14-2. As well known, the
galvanomirror 14-1 comprises a reflection mirror 14-1a and a drive
mechanism 14-1b for rotating the reflection mirror 14-1a. Likewise,
the galvanomirror 14-2 comprises a reflection mirror 14-2a and a
drive mechanism 14-2b for rotating the reflection mirror 14-2b. The
two reflection mirrors 14-1a and 14-2a are independently rotated in
accordance with the principle of driving a galvanometer so as to
continuously irradiate the split laser beam depicted at L.sub.B to
a plurality of desired positions on the workpiece 17a through the
processing lens 15a. The X-Y scanner 14b is similar in structure to
the X-Y scanner 14a.
Referring to FIGS. 8 through 10, a preferred example of the mask 13
will be described. The mask 13 comprises a disk-shaped mask plate
13-1, a mask holder 13-2, and a drive portion 13-3. The mask plate
13-1 has a plurality of apertures H1 through H16 different in
diameter and equiangularly spaced in a circumferential direction.
The mask holder 13-2 has an area slightly greater than that of the
mask plate 13-1. The mask holder 13-2 serves to hold the mask plate
13-1 and has a plurality of windows W1 through W8 formed in those
regions corresponding to the apertures H1 through H16 of the mask
plate 13-1. The drive portion 13-3 rotates a combination of the
mask plate 13-1 and the mask holder 13-2 integrally coupled to each
other.
The mask 13 is positioned so that, when the mask plate 13-1 is
rotated, each of the apertures H1 through H16 passes across an
optical path of the laser beam. In other words, the mask plate 13-1
has a rotation axis parallel to the optical path of the laser beam.
In addition, the optical path of the laser beam is positioned on a
virtual circle connecting centers of the apertures H1 through H16
and depicted by a dash-and-dot line in FIG. 9. The mask 13 further
comprises a two-axis micromanipulator mechanism for fine adjustment
of its position, although not illustrated in the figure. By the
two-axis micromanipulator mechanism, the position of either a
combination of the mask plate 13-1 and the mask holder 13-2 or a
whole of the mask 13 further including the drive portion 13-3 is
finely adjusted in parallel to a plane of the mask plate 13-1. As a
result, the center positions of the apertures are finely adjusted
in correspondence to the optical path of the laser beam.
The mask plate 13-1 is formed by a metal material such as an SUS or
copper. In this case, a part of the laser beam incident to the mask
plate 13-1 at a region except one aperture is reflected as a
reflected laser beam. In order to avoid the influence of the
reflected laser beam upon other optical components located within
the optical path of the laser beam, irregular reflection is
required. Taking this into consideration, the mask plate 13-1 is
subjected to surface treatment such as shot basting. The diameters
of the apertures in the mask plate 13-1 are designed in accordance
with the principle of the mask projection technique. Specifically,
the diameters of the apertures are designed so that excellent
workability is obtained with respect to resin such as epoxy and PI
typically used in a high-density multilayer printed wiring board
and that the energy density (fluence) of a working surface is on
the order of 10 J/cm.sup.2. In this embodiment, the reduction rate
(M) is designed to be on the order of 10. In this case, when the
aperture H10 of the mask plate 13-1 is selected, the via hole
having a diameter of 0.1 mm is formed. The reduction rate (M) can
be selected to a desired value by varying the distance between the
mask plate 13-1 and the processing lens.
The diameter of the via hole currently used is typically equal to
0.1 mm. In this connection, the apertures H1 through H16 formed in
the mask plate 13-1 have diameters most of which are selected
within a range between 1 and 2 mm and some of which are slightly
greater or smaller than the above-mentioned range. For example, H1:
8 mm, H2: 6 mm, H3: 4 mm, H4: 3 mm, H5: 2 mm, H6: 1.8 mm, H7: 1.6
mm, H8: 1.4 mm, H9: 1.2 mm, H10: 1.0 mm, H11: 0.9 mm, H12: 0.8 mm,
H13: 0.7 mm, H14: 0.6 mm, H15: 0.5 mm, and H16: 0.4 mm. These
apertures are successively arranged counterclockwise from the
greatest.
The drive portion 13-3 rotates the mask plate 13-1 under control of
a main control unit which is not illustrated in the figure.
Specifically, the main control unit selects a particular one of the
apertures corresponding to the diameter of the via hole with
reference to drill data set by an operator and master data such as
a CAD file, and makes the mask plate 13-1 rotate so that the
particular aperture is positioned in the optical path of the laser
beam. Generally, the diameter of the via hole is specified by a T
code in the drill data. In this embodiment, the mask plate 13-1 is
rotated in accordance with the T code so as to select a desired
diameter of the via hole.
Turning back to FIG. 1, the X-Y scanners 14a and 14b are preferably
located to be symmetrical with respect to the reflection mirror 11.
This is because the laser beam has a beam divergence angle. The
beam divergence angle is a nature such that a laser beam is
increased in diameter with an increase in length of its optical
path. With the above-mentioned symmetrical arrangement, the
distances from a beam emission port of the laser oscillator 10 to
the working surfaces of the workpieces 17a and 17b can easily be
rendered equal to each other. As a result, the energy densities of
the split laser beams on the working surfaces can be made equal to
each other.
At any rate, in this embodiment, the laser beam from the laser
oscillator 10 is divided into the two split laser beams without
decreasing its energy density to lead the split laser beams to the
two laser irradiation units. Then, the two workpieces 17a and 17b
are subjected to exactly same boring operations. As a result, the
working speed of boring can be doubled. Therefore, the working cost
per aperture can considerably be reduced. It is noted here that the
X-Y scanners 14a and 14b may scan the workpieces 17a and 17b in
same boring patterns or in different boring patterns.
Referring to FIG. 11, a laser machining apparatus according to a
second embodiment of this invention will be described. The laser
machining apparatus in this embodiment is different from the first
embodiment in that the apparatus has a single workstage 16. The
laser machining apparatus makes the X-Y scanners 14a and 14b
simultaneously scan a single workpiece 17 placed on the workstage
16 to perform simultaneous boring operations. For convenience of
illustration, the X-Y scanners 14a and 14b scan both peripheral
sides of the workpiece 17 in the figure. However, the X-Y scanners
14a and 14b can be disposed adjacent to each other. It will
therefore be understood that adjacent regions of the workpiece 17
can be simultaneously scanned for boring. Again, the X-Y scanners
14a and 14b may scan the workpiece 17 in same boring patterns or in
different boring patterns.
Referring to FIG. 12, the beam splitter may be implemented by an
energy split type. A beam splitter 41 is of a half-split type and
comprises a 50% reflecting surface. The 50% reflecting surface
reflects a half of the laser beam in energy. Another half of the
laser beam in energy is transmitted through the 50% reflecting
surface.
This invention is most effective if it is applied to the TEA
CO.sub.2 laser. However, this invention is also applicable to any
existing laser machining apparatus such as a CO.sub.2 laser, a YAG
laser, and an excimer laser. The laser beam may be a pulse wave or
a continuous wave. This invention is particularly adapted to
process a printed wiring board or a flexible printed wiring board
but is also applicable to any other object such as resin or
glass.
As described in the foregoing, the laser beam from one laser
oscillator is divided into a plurality of the split laser beams
without decreasing the energy density and the split laser beams are
led to a plurality of the laser irradiation units. Thus, the laser
machining apparatus according to this invention can considerably
increase the working speed because the workpiece or workpieces are
simultaneously processed with the split laser beams. As a result,
the working cost can be considerably reduced.
* * * * *