U.S. patent number 6,036,587 [Application Number 08/728,688] was granted by the patent office on 2000-03-14 for carrier head with layer of conformable material for a chemical mechanical polishing system.
This patent grant is currently assigned to Applied Materials, Inc.. Invention is credited to Tsungan Cheng, John Prince, Robert D. Tolles.
United States Patent |
6,036,587 |
Tolles , et al. |
March 14, 2000 |
Carrier head with layer of conformable material for a chemical
mechanical polishing system
Abstract
A carrier head for a chemical mechanical polishing apparatus. A
layer of conformable material is disposed in a recess of the
carrier head to provide a mounting surface for a substrate. The
conformable material may be elastic and undergo normal strain in
response to an applied load. The carrier head may also include a
support fixture detachably connected to a backing fixture, a
retaining ring connected directly to the conformable material, and
a shield ring which projects over a portion of the layer of
conformable material.
Inventors: |
Tolles; Robert D. (Santa Clara,
CA), Cheng; Tsungan (Saratoga, CA), Prince; John (Los
Altos, CA) |
Assignee: |
Applied Materials, Inc. (Santa
Clara, CA)
|
Family
ID: |
24927903 |
Appl.
No.: |
08/728,688 |
Filed: |
October 10, 1996 |
Current U.S.
Class: |
451/288; 451/388;
451/398 |
Current CPC
Class: |
B24B
37/30 (20130101) |
Current International
Class: |
B24B
37/04 (20060101); B24B 007/22 () |
Field of
Search: |
;451/288,287,398,388,289,290,41 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
|
|
|
2 558 095 |
|
Jul 1985 |
|
FR |
|
61-25768 |
|
Feb 1986 |
|
JP |
|
224 3263 |
|
Sep 1990 |
|
JP |
|
Other References
Holley, et al.; Mounting Method For Single-Side Polishing; IBM
Technical Disclosure Bulletin, vol. 21, No. 10, Mar. 1979..
|
Primary Examiner: Rose; Robert A.
Attorney, Agent or Firm: Fish & Richardson
Claims
What is claimed is:
1. A carrier head for positioning a substrate on a polishing
surface in a chemical mechanical polishing apparatus,
comprising:
a base assembly having a recess;
a volume of conformable material disposed in and filling the recess
to provide a mounting surface for a substrate; and
a retaining ring connected to the mounting surface.
2. The carrier head of claim 1 wherein the retaining ring has
approximately the same thickness as the substrate.
3. The carrier head of claim 1 further comprising a shield
connected to the base assembly and projecting over a portion of the
conformable material.
4. The carrier head of claim 3 wherein the shield is thinner than
the retaining ring.
5. The carrier head of claim 3 wherein the shield surrounds the
retaining ring.
6. A carrier head for positioning a substrate on a polishing
surface in a chemical mechanical polishing apparatus,
comprising:
a base assembly having a recess;
a volume of conformable material disposed in and filling the recess
to provide a mounting surface for a substrate; and
a shield ring connected to the base assembly and projecting over a
portion of the layer of conformable material.
7. The carrier head of claim 6 wherein the base assembly has a rim
surrounding the recess, and the conformable material fills the
recess so that the mounting surface is flush with the rim.
8. The carrier head of claim 7 wherein an upper surface of the
shield ring is adjacent the rim and is flush with the conformable
material.
9. The carrier head of claim 6 the shield ring is positioned to
prevent the conformable material from extruding from the recess
when the substrate is pressed against the polishing surface.
10. The carrier head of claim 9, further comprising a loading
mechanism to apply a downward pressure to the base assembly.
11. A carrier head for positioning a substrate on a polishing
surface in a chemical mechanical polishing apparatus,
comprising:
a base assembly having a recess;
a layer of conformable material disposed in the recess to provide a
mounting surface for a substrate; and
a passageway formed through the layer of conformable material to
provide vacuum chucking of the substrate, wherein a diameter of the
passageway is selected so that the passageway collapses when a load
is applied to a substrate on the mounting surface.
12. The carrier head of claim 11, wherein a pump is connected to
the passageway to chuck the substrate to the mounting surface.
13. The carrier head of claim 12 wherein the passageway through the
layer of conformable material has a diameter such that it does not
collapse if the substrate is chucked to the mounting surface.
14. A carrier head for positioning a substrate on a polishing
surface in a chemical mechanical polishing apparatus,
comprising:
a base assembly having a movable section and a recess;
a layer of conformable material disposed in the recess to provide a
mounting surface for a substrate; and
a chucking mechanism to attach the substrate to the mounting
surface, the chucking mechanism including an actuating mechanism
connected to the movable section of the base assembly.
15. The carrier head of claim 14 wherein the movable section is
positioned adjacent to the layer of conformable material and above
the mounting surface, and wherein the vertical motion of the
movable section forms a pocket between the substrate and the layer
of conformable material to chuck the substrate to the mounting
surface.
16. An apparatus for use with carrier head of a chemical mechanical
polishing apparatus, comprising:
a module magnetically and detachably connected to the carrier head,
the module including a recess; and
a layer of conformable material disposed in the recess to provide a
mounting surface for a substrate.
17. A carrier head for a chemical mechanical polishing apparatus,
comprising:
a housing;
a backing fixture movably connected to the housing, a volume
between the housing and backing fixture providing a pressurizable
chamber;
a module detachably connected to the backing fixture, the module
including a rigid support fixture with a recess formed therein and
a rim surrounding the recess, and a layer of conformable material
disposed in and filling the recess to provide a mounting surface
for a substrate, the mounting surface being flush with a bottom
surface of the rim.
18. The carrier head of claim 17, further comprising a retaining
ring connected to the mounting surface.
19. The carrier head of claim 17, further comprising a shield ring
connected to the backing fixture and projecting over a portion of
the layer of conformable material.
Description
BACKGROUND OF THE INVENTION
The present invention relates generally to chemical mechanical
polishing of substrates, and more particularly to a carrier head
for a chemical mechanical polishing system.
Integrated circuits are typically formed on substrates,
particularly silicon wafers, by the sequential deposition of
conductive, semiconductive or insulative layers. After each layer
is deposited, the layer is etched to create circuitry features. As
a series of layers are sequentially deposited and etched, the outer
or uppermost surface of the substrate, i.e., the exposed surface of
the substrate, becomes increasingly more non-planar. This
non-planar outer surface presents a problem for the integrated
circuit manufacturer. If the outer surface of the substrate is
non-planar, then a photoresist layer placed thereon is also
non-planar. A photoresist layer is typically patterned by a
photolithographic apparatus that focuses a light image onto the
photoresist. If the outer surface of the substrate is sufficiently
non-planar, then the maximum height difference between the peaks
and valleys of the outer surface may exceed the depth of focus of
the imaging apparatus, and it will be impossible to properly focus
the light image onto the outer substrate surface.
It may be prohibitively expensive to design new photolithographic
devices having an improved depth of focus. In addition, as the
feature size used in integrated circuits becomes smaller, shorter
wavelengths of light must be used, resulting in further reduction
of the available depth of focus. Therefore, there is a need to
periodically planarize the substrate surface to provide a
substantially planar layer surface.
Chemical mechanical polishing (CMP) is one accepted method of
planarization. This planarization method typically requires that
the substrate be mounted to a carrier or polishing head. The
exposed surface of the substrate is then placed against a rotating
polishing pad. The carrier provides a controllable load, i.e.,
pressure, on the substrate to push it against the polishing pad. In
addition, the carrier may rotate to provide additional motion
between the substrate and polishing pad. A polishing slurry,
including an abrasive and at least one chemically-reactive agent,
is distributed over the polishing pad to provide an abrasive
chemical solution at the interface between the pad and substrate. A
CMP process is fairly complex, and differs from simple wet sanding.
In a CMP process the reactive agent in the slurry reacts with the
outer surface of the substrate to form reactive sites. The
interaction of the polishing pad and abrasive particles with the
reactive sites results in polishing.
An effective CMP process has a high polishing rate and generates a
substrate surface which is finished (lacks small-scale roughness)
and flat (lacks large-scale topography). The polishing rate, finish
and flatness are determined by the pad and slurry combination, the
relative speed between the substrate and pad, and the force
pressing the substrate against the pad. Because inadequate flatness
and finish can create defective substrates, the selection of a
polishing pad and slurry combination is usually dictated by the
required finish and flatness. Given these constraints, the
polishing rate sets the maximum throughput of the polishing
apparatus.
The polishing rate depends upon the force pressing the substrate
against the pad. Specifically, the greater this force, the higher
the polishing rate. If the carrier head applies a non-uniform load,
i.e., if the carrier applies more force to one region of the
substrate than to another, then the high pressure regions will be
polished faster than the lower pressure regions. Therefore, a
non-uniform load may result in non-uniform polishing of the
substrate.
An additional consideration in the production of integrated
circuits is process and product stability. To achieve a high yield,
i.e., a low defect rate, each successive substrate should be
polished under substantially similar conditions. Each substrate
should be polished by approximately the same amount so that each
integrated circuit is substantially identical.
In view of the foregoing, there is a need for a chemical mechanical
polishing apparatus which optimizes polishing throughput, while
providing the desired flatness and finish. Specifically, the
chemical mechanical polishing apparatus should have a carrier head
which applies a substantially uniform load to the substrate.
SUMMARY OF THE INVENTION
In one aspect, the invention is directed to an apparatus for use
with a carrier head of a chemical mechanical polishing apparatus. A
module has a recess, and a layer of conformable material is
disposed in the recess to provide a mounting surface for a
substrate. The module is detachably connected to the carrier
head.
Implementations of the invention may include the following. The
carrier head may have a backing fixture, and a loading mechanism
may connect the backing fixture to the housing. The module may be
mechanically or magnetically connected to the carrier head. The
module may have a rim surrounding the recess, and the conformable
material may be flush with the rim.
In another aspect, the invention is directed to a carrier head for
positioning a substrate on a polishing surface in a chemical
mechanical polishing apparatus. A base assembly has a recess, and a
layer of conformable material is disposed in the recess to provide
a mounting surface for a substrate. A retaining ring is connected
to the mounting surface.
In another aspect, the carrier head has a base assembly, a layer of
conformable material, and a shield ring which is connected to the
base assembly and projects over a portion of the layer of
conformable material.
Implementations of the invention may include the following. The
retaining ring may be approximately the same thickness as the
substrate. The shield ring may surround, but be thinner than, the
retaining ring. An upper surface of the shield may be adjacent to
the rim of the base assembly and be flush with the conformable
material. The shield may be positioned to prevent the conformable
material from extruding when the substrate is pressed against the
polishing surface.
In another aspect, the carrier head has a base assembly, a layer of
conformable material, and a chucking mechanism to attach the
substrate to the mounting surface.
Implementations of the invention may include the following. The
chucking mechanism may include a pump and a passageway through the
layer of conformable material connecting the passageway to the
mounting surface. The passageway may have a diameter such that it
does not collapse if the pump applies suction to the passageway.
The chucking mechanism includes an actuating mechanism, and a
movable section of the base assembly may be connected to the
actuating mechanism. The vertical motion of the movable section may
form a pocket between a substrate and the layer of conformable
material to suction the substrate to the mounting surface.
In another aspect, the invention is directed to a carrier head
having a base assembly and a conformable material disposed in a
recess of the base assembly. The conformable material has a
durometer measurement selected to provide both elasticity and
normal strain in response to an applied load.
Implementations of the invention include the following. The
conformable material may have a durometer between about fifteen and
twenty-five, such as about twenty-one. The conformable material may
be substantially pure urethane. A sheet of non-adhesive material
may be attached to the underside of the conformable material to
provide the mounting surface.
Advantages of the invention include the following. The carrier head
includes a conformable layer that applies a uniform load to the
substrate. The conformable layer is chemically inert vis-a-vis the
polishing process. The carrier head is also able to vacuum chuck
the substrate to lift the substrate off the polishing pad.
Additional advantages of the invention will be set forth in the
description which follows, and in part will be obvious from the
description, or may be learned by practice of the invention. The
advantages of the invention may be realized by means of the
instrumentalities and combinations particularly pointed out in the
claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are incorporated in and constitute
a part of the specification, schematically illustrate the present
invention, and together with the general description given above
and the detailed description given below, serve to explain the
principles of the invention.
FIG. 1 is an exploded perspective view of a chemical mechanical
polishing apparatus.
FIG. 2 is a schematic top view of a carousel, with the upper
housing removed.
FIG. 3 is a cross-sectional view of the carousel of FIG. 2 along
line 3--3.
FIG. 4A is a schematic cross-sectional view of a carrier head
including bellows and a layer of conformable material in accordance
with the present invention.
FIG. 4B is a view of the carrier head of FIG. 4A in which the
bellows are replaced by a flexible membrane.
FIG. 5 is an exaggerated cross-sectional view of a substrate in
contact with the layer of conformable material of the carrier head
of FIG. 4A or FIG. 4B.
FIG. 6A is a schematic cross-sectional view of a carrier head
according to the present invention illustrating vacuum chucking
lines in the layer of conformable material.
FIG. 6B is a view of the carrier head of FIG. 6A in which the
vacuum chucking lines are closed by application of a load to the
carrier head.
FIG. 7A is a schematic cross-sectional view of a carrier head
according to the present invention incorporating a
vertically-movable cylinder for forming a vacuum pocket.
FIG. 7B is view of the carrier head of FIG. 7A in which the
vertically-movable cylinder has been positioned to form a vacuum
pocket.
FIG. 8 is a schematic cross-section view of another embodiment of a
carrier head according to the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
Referring to FIG. 1, one or more substrates 10 will be polished by
a chemical mechanical polishing (CMP) apparatus 20. A complete
description of CMP apparatus 20 may be found in U.S. patent
application Ser. No. 08/549,336, by Perlov, et al. filed Oct. 27,
1996, entitled CAROUSEL PROCESSING SYSTEM FOR CHEMICAL MECHANICAL
POLISHING, and assigned to the assignee of the present invention,
the entire disclosure of which is hereby incorporated by
reference.
According to the invention CMP apparatus 20 includes a lower
machine base 22 with a table top 23 mounted thereon and removable
upper outer cover (not shown). Table top 23 supports a series of
polishing stations 25a, 25b and 25c, and a transfer station 27.
Transfer station 27 forms a generally square arrangement with the
three polishing stations 25a, 25b and 25c. Transfer station 27
serves multiple functions of receiving individual substrates 10
from a loading apparatus (not shown), washing the substrates,
loading the substrates into carrier heads (to be described below),
receiving the substrates from the carrier heads, washing the
substrates again, and finally transferring the substrates back to
the loading apparatus.
Each polishing station 25a-25c includes a rotatable platen 30 on
which is placed a polishing pad 32. If substrate 10 is an
eight-inch (200 mm) diameter disk, then platen 30 and polishing pad
32 will be about twenty inches in diameter. Platen 30 is preferably
a rotatable aluminum or stainless steel plate connected by
stainless steel platen drive shaft (not shown) to a platen drive
motor (not shown). For most polishing processes, the drive motor
rotates platen 30 at thirty to two-hundred revolutions per minute,
although lower or higher rotational speeds may be used.
Referring to FIG. 5, polishing pad 32 is a composite material with
a roughened polishing surface 34. Polishing pad 32 may be attached
to platen 30 by a pressure-sensitive adhesive layer 39. Polishing
pad 32 may have a fifty mil thick hard upper layer 36 and a fifty
mil thick softer lower layer 38. Upper layer 36 is preferably a
material composed of polyurethane mixed with other fillers. Lower
layer 38 is preferably a material composed of compressed felt
fibers leached with urethane. A common two-layer polishing pad,
with the upper layer composed of IC-1000 and the lower layer
composed of SUBA-4, is available from Rodel, Inc., located in
Newark, Del. (IC-1000 and SUBA-4 are product names of Rodel,
Inc.).
Referring again to FIG. 1, each polishing station 25a-25c may
further include an associated pad conditioner apparatus 40. Each
pad conditioner apparatus 40 has a rotatable arm 42 holding an
independently rotating conditioner head 44 and an associated
washing basin 46. The conditioner apparatus maintains the condition
of the polishing pad so it will effectively polish any substrate
pressed against it while it is rotating.
A slurry 50 containing a reactive agent (e.g., deionized water for
oxide polishing), abrasive particles (e.g., silicon dioxide for
oxide polishing) and a chemically reactive catalyzer (e.g.,
potassium hydroxide for oxide polishing), is supplied to the
surface of polishing pad 32 by a slurry supply tube 52. Sufficient
slurry is provided to cover and wet the entire polishing pad 32.
Two or more intermediate washing stations 55a and 55b are
positioned between neighboring polishing stations 25a, 25b and 25c.
The washing stations rinse the substrates as they pass from one
polishing station to another.
A rotatable multi-head carousel 60 is positioned above lower
machine base 22. Carousel 60 is supported by a center post 62 and
rotated thereon about a carousel axis 64 by a carousel motor
assembly located within base 22. Center post 62 supports a carousel
support plate 66 and a cover 68. Multi-head carousel 60 includes
four carrier head systems 70a, 70b, 70c, and 70d. Three of the
carrier head systems receive and hold substrates, and polish them
by pressing them against the polishing pad 32 on platen 30 of
polishing stations 25a-25c. One of the carrier head systems
receives a substrate from and delivers the substrate to transfer
station 27.
The four carrier head systems 70a-70d are mounted on carousel
support plate 66 at equal angular intervals about carousel axis 64.
Center post 62 allows the carousel motor to rotate the carousel
support plate 66 and to orbit the carrier head systems 70a-70d, and
the substrates attached thereto, about carousel axis 64.
Each carrier head system 70a-70d includes a polishing or carrier
head 100. Each carrier head 100 independently rotates about its own
axis, and independently laterally oscillates in a radial slot 72
formed in carousel support plate 66. A carrier drive shaft 74
connects a carrier head rotation motor 76 to carrier head 100
(shown by the removal of one-quarter of cover 68). There is one
carrier drive shaft and motor for each head.
Referring to FIG. 2, in which cover 68 of carousel 60 has been
removed, carousel support plate 66 supports the four carrier head
systems 70a-70d. Carousel support plate includes four radial slots
72, generally extending radially and oriented 90.degree. apart.
Radial slots 72 may either be close-ended (as shown) or open-ended.
The top of support plate supports four slotted carrier head support
slides 80. Each slide 80 aligns along one of the radial slots 72
and moves freely along a radial path with respect to carousel
support plate 66. Two linear bearing assemblies bracket each radial
slot 72 to support each slide 80.
As shown in FIGS. 2 and 3, each linear bearing assembly includes a
rail 82 fixed to carousel support plate 66, and two hands 83 (only
one of which is illustrated in FIG. 3) fixed to slide 80 to grasp
the rail. Two bearings 84 separate each hand 83 from rail 82 to
provide free and smooth movement therebetween. Thus, the linear
bearing assemblies permit the slides 80 to move freely along radial
slots 72.
A bearing stop 85 anchored to the outer end one of the rails 82
prevents slide 80 from accidentally coming off the end of the
rails. One of the arms of each slide 80 contains an unillustrated
threaded receiving cavity or nut fixed to the slide near its distal
end. The threaded cavity or nut receives a worm-gear lead screw 86
driven by a slide radial oscillator motor 87 mounted on carousel
support plate 66. When motor 87 turns lead screw 86, slide 80 moves
radially. The four motors 87 are independently operable to
independently move the four slides along the radial slots 72 in
carousel support plate 66.
A carrier head assembly or system, each including a carrier head
100, a carrier drive shaft 74, a carrier motor 76, and a
surrounding non-rotating shaft housing 78, is fixed to each of the
four slides. Drive shaft housing 78 holds drive shaft 74 by paired
sets of lower ring bearings 88 and a set of upper ring bearings 89.
Each carrier head assembly can be assembled away from polishing
apparatus 20, slid in its untightened state into radial slot 72 in
carousel support plate 66 and between the arms of slide 80, and
there tightened to grasp the slide.
A rotary coupling 90 at the top of drive motor 186 couples two or
more fluid or electrical lines 92 into two or more channels 94 in
drive shaft 74. Channels 94 are used, as described in more detail
below, to pneumatically power carrier head 100, to vacuum-chuck the
substrate to the bottom of the carrier head and to actuate a
retaining ring against the polishing pad.
During actual polishing, three of the carrier heads, e.g., those of
carrier head systems 70a-70c, are positioned at and above
respective polishing stations 25a-25c. Carrier head 100 lowers a
substrate into contact with polishing pad 32, and slurry 50 acts as
the media for chemical mechanical polishing of the substrate or
wafer. The carrier head 100 uniformly loads the substrate against
the polishing pad.
The substrate is typically subjected to multiple polishing steps,
including a main polishing step and a final polishing step. For the
main polishing step, usually performed at station 25a, carrier head
100 applies a force of approximately four to ten pounds per square
inch (psi) to substrate 10. At subsequent stations, carried head
100 may apply more or less force. For example, for a final
polishing step, usually performed at station 25c, carrier head 100
may apply a force of about three psi. Carrier motor 76 rotates
carrier head 100 at about thirty to two-hundred revolutions per
minute. Platen 30 and carrier head 100 may rotate at substantially
the same rate.
Generally, carrier head 100 holds the substrate against the
polishing pad and evenly distributes a downward pressure across the
back surface of the substrate. The carrier head also transfers
torque from the drive shaft to the substrate and ensures that the
substrate does not slip from beneath the carrier head during
polishing.
Referring to FIG. 4A, carrier head 100 includes a housing assembly
102, a loading mechanism 104 and a base assembly 106. The drive
shaft 74 is connected to housing assembly 102. Loading mechanism
104 connects housing assembly 102 to base assembly 106. The loading
mechanism applied a load, i.e., a downward pressure, to base
assembly 106. The base assembly 106 transfers the downward pressure
from loading mechanism 104 to substrate 10 to push the substrate
against the polishing pad. Base assembly 106 includes a conformable
layer 108 to evenly distribute the downward pressure across the
back surface of the substrate. Each of these components will be
described in greater detail below.
Housing assembly 102 may be formed of aluminum or stainless steel.
The housing assembly is generally circular in shape to correspond
the circular configuration of the substrate to be polished. The top
surface of the housing assembly may include a cylindrical hub 120
having a threaded neck 122. To connect drive shaft 74 to carrier
head 100, two dowel pins 124 may be inserted into matching dowel
pin holes in hub 120 and a flange 96. Then, a threaded perimeter
nut 98 is screwed onto threaded neck 122 to firmly attach carrier
head 100 to drive shaft 74. When drive shaft 74 rotates, dowel pins
124 transfer torque to housing assembly 102 to rotate the carrier
head about the same axis as the drive shaft.
At least two conduits 126 and 128 extend through hub 120. There may
be one conduit for each channel 94 in drive shaft 74. When carrier
head 100 is attached to drive shaft 74, the dowel pins align the
carrier head so that conduits 126 and 128 connect to channels 94.
O-rings (not shown) may be positioned in hub 120 surrounding each
conduit 126 and 128 to form a fluid-tight seal between the conduits
to the channels.
Loading mechanism 104 forms a vertically-movable seal between
housing assembly 102 and base assembly 106 and defines a pressure
chamber 130. A gas, such as air, is pumped into and out of pressure
chamber 130 through conduit 126 to control the load applied to base
assembly 106. When air is pumped into pressure chamber 130, base
assembly 106 is forced downwardly to bring substrate 10 into
contact with polishing pad 32. When air is pumped out of pressure
chamber 130, base assembly is lifted upwardly to remove the
substrate from polishing pad 32.
Loading mechanism 104 may include a cylindrical bellows 132 which
is bolted or fixed to housing assembly 102 and base assembly 106 to
form pressure chamber 130. Bellows 132 may be a stainless steel
cylinder which expands or contracts depending upon whether a gas is
supplied to or removed from pressure chamber 130. Bellows 132 may
include upper and lower support plates 134 and 136 which are bolted
or otherwise secured to housing assembly 102 and a base assembly
106, respectively. A cylindrical seal 138 may fit into a
circumferential groove 112 on rim 110 of housing 102 and in a
circumferential groove 139 in an upwardly-extending wall portion
118 of, base assembly 106. The seal 138 surrounds and protects
bellows 132 from the corrosive effects of slurry 50. When housing
assembly 102 is rotated, bellows 132 transfers torque from the
housing assembly to the base assembly, causing it to also rotate.
However, because the bellows are flexible, base assembly 106 can
pivot with respect to the housing assembly about an axis parallel
to the surface of the polishing pad to remain substantially
parallel to the polishing pad surface.
Base assembly 106 includes a rigid backing fixture or plate 150 and
a detachable module 152 which is attached to the underside of
backing plate 150. Backing plate 150 may be generally disk-shaped
to match the configuration of substrate 10, and may be formed of a
metal such as aluminum or stainless steel. Module 152 includes a
rigid support fixture or cup 154, conformable layer 108, an annular
shield ring 160, and an annular retaining ring 162. Each of these
elements will be discussed in detail below.
Module 152 may be removably attached to backing plate 150 by
various attachment mechanisms, such as bolts, screws, key and key
slot combination, vacuum chucking, or magnets. As such, module 152
can be detached and replaced if it is damaged or worn out. In
addition, it may be replaced to change the polishing parameters.
For example, different modules may incorporate conformable layers
with different durometer measurements. The different modules may
also have different retaining ring widths or retaining ring
heights. The height and width of the retaining ring affects the
polishing rate near the edge of the substrate. These module
features can be selected to provide an optimal polishing
performance.
Cup 154 may be formed of aluminum or stainless steel and may have
an outer lip or rim 156 which projects downwardly to surround a
recess. The conformable layer 108 is disposed within the recess so
that the bottom surface of the conformable layer is substantially
flush with the bottom surface of rim 156. The recess may be
approximately one-eighth to one-quarter inch deep.
The conformable layer 108 is made of a visco-elastic material that
has a substantially homogeneous density. Conformable layer 108 is
elastic; i.e., it will return to its original shape when an applied
load is removed. Conformable layer 108 is slightly compressible. In
addition, conformable layer 108 undergoes normal strain; i.e., it
will redistribute its mass in directions normal to an applied load.
The durometer measurement of the conformable layer must be
carefully selected. If the durometer measurement is too low, the
material will lack elasticity. On the other hand, if the durometer
measurement is too high, the material will not undergo normal
strain. Conformable layer 108 may have a durometer measurement of
between approximately fifteen to twenty-five on the Shore scale.
Preferably, conformable layer 108 has a durometer measurement of
about twenty-one on the Shore scale. The conformable material may
have an adhesive surface so that it adheres to the walls of cup
154. In addition, it should be resistant to heat and be chemically
inert vis-a-vis the polishing process. An appropriate conformable
material is a urethane material available from Pittsburgh Plastics
of Zelienopal, Pa. Module 152 may be manufactured by pouring liquid
urethane into cup 154 and curing it to form layer 109.
Referring to FIG. 5, conformable layer 108 permits substrate 10 to
shift or pivot to accommodate changes in the surface of the
polishing pad. Conformable layer 108 deforms to match the back side
of substrate 10 and evenly distribute the load from loading
mechanism 104 to the substrate. For example, if substrate 10 is
warped, conformable layer 108 will, in effect, conform to the
contours of the warped substrate.
A thin sheet 158 of a low-friction material may be laminated to the
outer surface of conformable layer 108 to provide a low-friction
substrate mounting surface 164. The sheet 158 may be a seven mil
thick film of urethane having a durometer measurement of
approximately eighty-three on the Shore scale. Sheet 158 permits
the conformable material layer 108 to closely conform to the back
side of substrate 10 but prevents the substrate from adhering to
the conformable material. Sheet 158 is sufficiently thin that
substrate 10 may be considered to be in direct contact with
conformable layer 108.
Referring to FIG. 4A, module 152, as previously noted, also
includes shield ring 160 and retaining ring 162. Shield ring 160 is
formed of a rigid material such as aluminum or stainless steel and
is positioned below comformable layer 108 to be substantially flush
with the bottom surface of rim 156 and the conformable layer.
Shield ring 160 holds conformable layer 108 with the recess of cup
154 when a load is applied to substrate 10. Shield ring 160 may be
appropriately secured to rim 156 such as by screws or bolts (not
shown).
Retaining ring 162 is an annular rigid ring, positioned within the
circumference of shield ring 160. Retaining ring 162 may be
adhesively attached directly to conformable layer 108. Retaining
ring 162 may be formed of a hard plastic or ceramic material.
Retaining ring 162 is separated from shield ring 160 by a small gap
"r" so that the retaining ring may shift or pivot to accommodate
variations in the vertical height of the surface of polishing pad
32. In operation, substrate 10 fits into a circular recess defined
by retaining ring 162 and abuts mounting surface 164 of the
conformable layer. Retaining ring 162 and substrate 10 have
substantially the same thickness, so that retaining ring 162 also
contacts polishing pad 32. The shear force created by the relative
velocity between substrate 10 and polishing pad 32 tends to push
the substrate from beneath carrier head 10. Retaining ring 162
prevents substrate 10 from moving from beneath base assembly
106.
Referring to FIG. 4B, in another embodiment, in which similar parts
are referred to with primed numbers, loading mechanism 104' may
include a flexible membrane 140 instead of a bellows. Flexible
membrane 140 may be an annular sheet of silicone approximately
sixty mils thick, with inner and outer edges 142 and 144. The inner
edge 142 is clamped between an inner clamp ring 146 and base
assembly 106', whereas outer edge 144 is clamped between an outer
clamp ring 148 and housing assembly 102'. The clamp rings attach
the flexible membrane to the housing assembly and the base assembly
to form pressure chamber 130'. Flexible membrane 140 acts as a
diaphragm which rolls or unrolls, depending upon the vertical
distance across pressure chamber 130'.
Housing assembly 102' includes two opposing flanges 114 which
project downwardly from rim 110. Each flange 114 may have a
rectangular slot 115. A torque pin 116 extends through each
rectangular slot 115 and is secured in a receiving recess 117 in
upward-extending wall portion 118' of backing plate 150 of base
assembly 106'. The width of rectangular slot 115 is comparable to
the width of torque pin 116 so that the pin cannot move
horizontally in the slot. When drive shaft 74 rotates housing
assembly 102', torque pins 116 transfer torque from the housing
assembly to the base assembly. The height of rectangular slot 115
is greater than the height of torque pin 116 so that the pin can
move vertically in the slot. Thus, base assembly 106' must rotate
with housing assembly 102', but it is free to move vertically with
respect to the housing assembly.
As discussed above, carrier head 100 may lift substrate 10 away
from polishing pad 32 in order to move the substrate from one
polishing station to another. In addition, the substrate may be
ejected from carrier head 100 to return the substrate to transfer
station 27 (see FIG. 1). Specifically, carrier head 100 may
vacuum-chuck or pressure-eject the substrate to or from mounting
surface 164, as explained in more detail below.
The carrier head includes several fluid lines which permit a gas,
such as air, to flow into and out of base assembly 106 to
vacuum-chuck or pressure-eject the substrate. Because base assembly
106 and housing assembly 102 can move vertically relative to each
other, flexible fluid conduits are used to link conduit 128 to a
passageway 170 in backing plate 150. As shown in FIG. 4A, the
flexible fluid conduit may be a metal bellows 172. The metal
bellows can expand and contract to match the distance across
chamber 130. Alternately, as shown in FIG. 4B, the flexible fluid
conduit may be a plastic tubing 174 positioned within chamber 130.
The plastic tubing may, for example, be wrapped in a half, a
three-quarter, a full turn. When base assembly 106 moves relative
to the housing assembly, the tubing coils or uncoils to match the
distance across chamber 130.
Referring to FIG. 6A, in one implementation, passageway 170 is
connected to one or more passages 176 of cup 154. In addition,
vacuum-chucking passages 180 extend through conformable layer 108
from passages 176 in cup 154 to mounting surface 164. Each vacuum
chucking passage 180 is simply a hole in the conformable layer. The
hole is large enough so that it does not collapse when a vacuum is
applied but small enough so that it does collapse when a load is
applied to the substrate.
A pump 182 is connected via fluid line 921 channel 94, conduit 128,
conduit 172, passageway 170, passages 176, and vacuum-chucking
passages 180 to mounting surface 164. If a vacuum is applied to
passages 180 by pump 182, substrate 10 will be vacuum-chucked to
mounting surface 164. If air is forced into passages 180 by pump
182, substrate 10 will be ejected from mounting surface 164.
Referring to FIG. 6B, when substrate 10 is positioned against
polishing pad 32 and a load is applied, conformable layer 108 will
be compressed and vacuum-chucking passages 180 will collapse. Thus,
the passages do not significantly affect the distribution of the
load across the backside of the substrate. When the load is
removed, conformable layer 108 will return to its normal state and
vacuum-chucking passages 180 will reopen. Each vacuum-chucking
passage 180 should be between approximately one-eighth and
one-quarter of an inch in diameter.
Referring to FIGS. 7A and 7B, in another implementation, substrate
10 is vacuum-chucked to carrier head 100 by the formation of a
vacuum pocket. As shown in FIG. 7A, module 152 may include a
vertically-movable disk 190. Conformable layer 108 may be
adhesively attached to disk 190. Disk 190 has a diameter less than
that of the substrate, and it may be connected to the activating
mechanism of an air cylinder 192. Air cylinder 192 may be
positioned in cup portion 154, and it 192 may be powered by a pump
182. The pump is connected to the air cylinder by the flexible
conduit, passageway 170, and passages 176. The actuating mechanism
of air cylinder 192 may move disk 190 between a first position in
which the disk is flush with a bottom surface 194 of base 178 of
cup 154 (see FIG. 7A) and a second position in which the disk has
been drawn upwardly away from the substrate. In the second
position, the portion of conformable layer 108 beneath the disk
will be pulled upwardly. Since the edges of conformable layer 108
remain in contact with substrate 10, whereas the center of
conformable layer 108 is drawn away from the center of substrate
10, a vacuum pocket 198 is formed between the substrate and the
conformable layer. This vacuum pocket vacuum-chucks the substrate
to the carrier head.
A conformable layer in accordance with the present invention may be
incorporated into various other carrier head designs, such as the
one described in U.S. patent application Ser. No. 08/637,208 by
Zuniga et al., filed on Apr. 24, 1996, entitled CARRIER HEAD DESIGN
FOR A CHEMICAL MECHANICAL POLISHING APPARATUS, assigned to the
assignee of the subject application, the entire disclosure of which
is hereby incorporated by reference.
Referring specifically to FIG. 8, such a carrier head 200 includes
a housing assembly 202, a base assembly 204 and a retaining ring
assembly 206. A conformable layer 208, similar in composition and
structure to the conformable layer described above, may be adhered
or attached to a surface 218 of base assembly 204 to provide a
substrate mounting surface 210.
The present invention has been described in terms of a preferred
embodiment. The invention however, is not limited to the embodiment
depicted and described. Rather, the scope of the invention is
defined by the appended claims.
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