U.S. patent number 5,755,278 [Application Number 08/799,185] was granted by the patent office on 1998-05-26 for heat sink attached to a heat plate.
This patent grant is currently assigned to Fanuc, Ltd.. Invention is credited to Tatsuo Shinohara, Makoto Takeshita.
United States Patent |
5,755,278 |
Shinohara , et al. |
May 26, 1998 |
Heat sink attached to a heat plate
Abstract
A heat sink attached to a heat plate comprising a heat plate (1)
produced by sticking two aluminum plates (11, 12) to each other,
leaving a closed path (13) therebetween for confining a heat
exchange medium therein, and of which the bottom is attached by an
object to be cooled, a cooling fin (2) which is stuck to the upper
region of the heat plate (1), and a flange (4) for mounting the
assembly of the heat plate (1) and the cooling fin 92), wherein the
surface of the heat plate (1) on which the cooling fin (2) is to be
attached, is even and the cooling fin (2) and the flange (4) are a
one-piece structure fabricated by employing die casting.
Inventors: |
Shinohara; Tatsuo (Minamitsuru,
JP), Takeshita; Makoto (Minamitsuru, JP) |
Assignee: |
Fanuc, Ltd. (Yamanashi,
JP)
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Family
ID: |
26565403 |
Appl.
No.: |
08/799,185 |
Filed: |
February 12, 1997 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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491903 |
Sep 29, 1995 |
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Foreign Application Priority Data
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Dec 8, 1993 [JP] |
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5-308090 |
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Current U.S.
Class: |
165/104.33;
174/15.2; 257/715; 257/E23.103; 361/700 |
Current CPC
Class: |
F28F
3/02 (20130101); H01L 21/4882 (20130101); H01L
23/3672 (20130101); H01L 2924/0002 (20130101); H01L
2924/0002 (20130101); H01L 2924/00 (20130101) |
Current International
Class: |
F28F
3/00 (20060101); F28F 3/02 (20060101); H01L
21/02 (20060101); H01L 21/48 (20060101); H01L
23/367 (20060101); H01L 23/34 (20060101); F28D
015/02 (); H05K 007/20 () |
Field of
Search: |
;165/80.3,104.21,104.33,185 ;174/15.2 ;257/715 ;361/699,700 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1284506 |
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Dec 1968 |
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DE |
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63-200347 |
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Dec 1988 |
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JP |
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1-157491 |
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Oct 1989 |
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JP |
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2-110296 |
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Apr 1990 |
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JP |
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2-54065 |
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Apr 1990 |
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JP |
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6-85480 |
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Mar 1994 |
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JP |
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Primary Examiner: Leo; Leonard R.
Attorney, Agent or Firm: Staas & Halsey
Parent Case Text
This application is a continuation of application Ser. No.
08/491,903, filed Sep. 29, 1995, now abandoned.
Claims
What is claimed is:
1. A heat sink assembly comprising:
a heat plate structure comprising first and second aluminum plates,
each having attachment surfaces,
said first and second aluminum plates being attached to each other
with said attachment surfaces thereof in contacting
relationship,
said first aluminum plate having an entire planar surface opposite
said attachment surface of said first aluminum plate, and wherein
said attachment surface of said first aluminum plate has an entire
planar surface,
at least one of said plates being configured to provide a closed
path for confining a heat exchange medium located between said
first and second aluminum plates to bring said heat exchange medium
into contact with each of said first and second aluminum plates
during circulation of said heat exchange medium, said path being
oriented so that said heat exchange medium circulates therethrough
in a vertical direction between said first and second aluminum
plates; and
a one-piece structure comprising a cooling fin and a flange, said
cooling fin having an entire surface directly attached to a portion
of said planar surface of said first aluminum plate so that another
portion of said planar surface remains available for direct
attachment to an entire surface of an object to be cooled;
whereby said cooling fin and said object to be cooled are directly
attached by screws to said planar surface of said first aluminum
plate.
2. A heat sink attached to a heat plate according to claim 1,
wherein said flange has a slot for receiving said another portion
of said heat plate.
Description
FIELD OF THE INVENTION
This invention relates to an improvement applicable to a heat sink
attached to a heat plate. More specifically, this invention relates
to an improvement developed for decreasing the production cost of a
heat sink attached to a heat plate by decreasing number of the
parts to be employed for production thereof, and by enabling the
production thereof without employing an aluminum soldering
process.
BACKGROUND OF THE INVENTION
A heat sink attached to a heat plate is available in the prior art.
A heat plate is defined as a small sized vertical type heat
exchanger produced by sticking two aluminum plates with an
adhesive, together leaving a closed path for allowing a medium for
heat exchange, such as Freon or the like, to flow therein. When
employed, a heat plate is placed in the vertical position to allow
the heat exchange medium, such as Freon, to circulate in the
vertical direction within the closed path, to allow heat exchange
to occur between the gas of the heat exchange medium, which is
inclined to go upward, and the liquid of the heat exchange medium,
which is inclined to go downward. In this manner, a heat plate
transmits heat from an object to be cooled, which is attached to
the bottom of the heat plate, toward a cooling fin etc., which is
attached to the top of the heat plate, to radiate the heat
therefrom.
FIG. 1 illustrates a broken perspective view of a heat sink
attached to a heat plate, available in the prior art, and FIG. 2
illustrates an assembled perspective view of a heat sink attached
to a heat plate, available in the prior art. Referring to FIGS. 1
and 2, a heat sink attached to a heat plate available in the prior
art consists of a heat plate 1, a cooling fin 21 produced by
employing an aluminum extrusion process, a heat transmission plate
31 with which an object to be cooled 5 is attached to the heat
plate 1, and of which the object is improvement of heat
transmission efficiency between an object to be cooled 5 and the
heat plate 1, and a flange 41, produced by employing an aluminum
die casting process, and which is employed to mount the heat sink
on a cubicle etc., which is employed for mounting electrical
equipment or the like. Since the surface of the heat plate 1 is not
even due to the closed path for a heat exchange medium between the
two aluminum plates, employment of an aluminum soldering process is
essential to stick a cooling fin 21 on the heat plate 1.
As was described above, the production of a heat sink attached to a
heat plate available in the prior art requires a large number of
parts and employment of an aluminum soldering process. Therefore,
the heat sink attached to a heat plate available in the prior art
has the drawback in that its fabrication is long and complicated,
resulting in high production cost.
The object of this invention is to provide a heat sink attached to
a heat plate which requires a small number of parts to be employed
for fabrication thereof, and which requires a short and simple
process for fabrication thereof, and which does not require
employment of an aluminum soldering process. Accordingly, only a
short and simple process for fabrication thereof is required at a
lower production cost.
DISCLOSURE OF THE INVENTION
According to this invention, there is provided a heat sink attached
to a heat plate comprising: a heat plate (1) which is produced by
sticking two aluminum plates (11 and 12) to each other, leaving a
closed path (13) therebetween for allowing a heat exchange medium
to be confined therein and to circulate therein, in the vertical
direction, and of which the bottom is attached to an object to be
cooled, a cooling fin (2) which is stuck to at least the upper
region of one surface of the heat plate (1), and a flange (4) which
is employed for mounting the assembly of the heat plate (1) and the
cooling fin (2), wherein: the surface of the heat plate (1) on
which the cooling fin (2) is to be attached, is even, and the
cooling fin (2) and the flange (4) are fabricated in one body by
employing a die casting process.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a broken perspective view of a heat sink attached by a
heat plate available in the prior art.
FIG. 2 is an assembled perspective view of a heat sink attached to
a heat plate available in the prior art.
FIG. 3 is a cross-sectional view of a heat plate employed for a
heat sink attached to a heat plate in accordance with one
embodiment of this invention.
FIG. 4 is a perspective view of the assembly of a cooling fin and a
flange employed for a heat sink attached to a heat plate in
accordance with one embodiment of this invention, which assembly is
fabricated by employing a die casting process.
FIG. 5 is a broken perspective view of a heat sink attached to a
heat plate in accordance with one embodiment of this invention.
FIG. 6 is an assembled perspective view of a heat sink attached to
a heat plate in accordance with one embodiment of this
invention.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENT
Referring to the drawings, a heat sink attached to a heat plate in
accordance with one embodiment of this invention will be described
below.
Referring to FIG. 3, a heat plate 1 consists of two aluminum plates
11 and 12, which are stuck to each other. The surface of the
aluminum plate 11 on which surface a cooling fin 2 is to be stuck
is made even and the surface of the other aluminum plate 12 is
allowed to be uneven. A path for a heat exchange medium 13 exists
between the two aluminum plates 11 and 12 at a location
corresponding to the projection caused by the path for the heat
exchange medium 13. The heat plate 1 having the foregoing
cross-section can be readily produced by employing the steps
described below. Two aluminum plates 11 and 12 are piled on a table
having a flat surface. A fluid is forced with high pressure between
the two aluminum plates 11 and 12 at the region at which a path for
a heat exchange medium 13 is to be produced, while the surface of
the aluminum plate 12 is being pressed with high pressure on the
region at which a path for a heat exchange medium 13 is not
produced. In this manner, a path for a heat exchange medium 13 is
inflated with a fluid.
Referring to FIG. 4, a die casting process is conducted to
fabricate the assembly of a cooling fin 2 and a flange 4. Since the
assembly of the cooling fin 2 and the flange 4 are fabricated in
one body, the number of the parts to be employed for production
thereof is reduced.
Referring to FIG. 5, the heat plate 1 is assembled into the
assembly of a cooling fin 2 and a flange 4, as illustrated by an
arrow A. Since one surface (the rear surface in the drawing) of the
heat plate 1 is an even plane, the heat plate 1 can be attached
fast with screws, an adhesive or the like, without employing an
aluminum soldering process.
Referring to FIG. 6, an object to be cooled 5 can be fitted on one
surface (the rear surface in the drawing) of the heat plate 1 with
screws, an adhesive or the like, in the direction of an arrow B.
Since the surface (the rear surface in the drawing) of the heat
plate 1 on which surface the object to be cooled 5 is attached, is
an even plane, the heat transmission plate 31 is unnecessary,
though the heat transmission plate 31 is essential in the prior
art. In this manner, the number of parts to be employed for
production thereof is reduced.
As was described above, the surface of the heat plate employed for
a heat sink attached by a heat plate in accordance with this
invention, on which surface a cooling fin 2 is stuck, is an even
plane. Therefore, employment of an aluminum soldering process is
unnecessary in the entire process for fabrication of the heat sink
attached by a heat plate in accordance with this invention. A
cooling fin 2 and a flange 4 are fabricated in one body by
employing a die casting process. Therefore, the number of the parts
to be employed for production thereof is reduced, and the assembly
process is made short and simple. As a result, the production cost
of the heat sink attached by a heat plate in accordance with this
invention is considerably less than that of the prior art.
POSSIBILITY TO EMPLOY THIS INVENTION FOR THE INDUSTRIAL
PURPOSES
As was described above, a heat sink attached to heat plate in
accordance with this invention requires less number of parts to be
employed for production thereof and a shorter and less complicated
fabrication process, and does not require an aluminum soldering
process in the entire process for production thereof. Therefore,
the heat plate in accordance with this invention is definitely
useful for cooling articles, such as semiconductor devices, or the
like, which are usually mounted in cubicles or the like.
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