U.S. patent number 3,793,604 [Application Number 05/348,946] was granted by the patent office on 1974-02-19 for high strength electrical lead for disk type thermistors.
This patent grant is currently assigned to GTE Sylvania Incorporated. Invention is credited to Judith A. Dow, George L. Duggan.
United States Patent |
3,793,604 |
Duggan , et al. |
February 19, 1974 |
HIGH STRENGTH ELECTRICAL LEAD FOR DISK TYPE THERMISTORS
Abstract
A disk type thermistor has a conductive metallic coating bonded
to each face thereof. A lead-in wire is soldered to each metallic
coating, each lead-in wire extending beyond the edge of the
thermistor in a plane generally parallel to the face thereof. Each
lead-in wire is shaped so that the solder bond between the lead-in
wire and the metallic coating does not extend to the periphery of
the thermistor.
Inventors: |
Duggan; George L. (Bedford,
MA), Dow; Judith A. (Danvers, MA) |
Assignee: |
GTE Sylvania Incorporated
(Danvers, MA)
|
Family
ID: |
23370258 |
Appl.
No.: |
05/348,946 |
Filed: |
April 9, 1973 |
Current U.S.
Class: |
338/22R; 338/329;
338/324 |
Current CPC
Class: |
H01C
1/144 (20130101) |
Current International
Class: |
H01C
1/14 (20060101); H01C 1/144 (20060101); H01c
007/04 () |
Field of
Search: |
;338/22R,22SD,23,25,28,324,329 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Albritton; C. L.
Attorney, Agent or Firm: Theodosopoulos; James
Claims
We claim:
1. A barium titanate disk type thermistor having a solderable
coating securely bonded to each face thereof and a separate bent
lead-in wire fastened with solder to each of said coatings, the
solder bond between said coating and said lead-in wire extending
across the face of the thermistor but not as far as the periphery
thereof, each of said lead-in wires having a bend so as to be
elevated above the face of the thermistor at the periphery thereof
by a distance at least about double the thickness of the lead-in
wire, a peel-strength-improving solder fillet between said
thermistor face and said lead-in wire at said bend of the lead-in
wire and each of said lead-in wires having additional bends so that
their outer ends are substantially parallel and spaced apart about
the thickness of the thermistor.
Description
SUMMARY OF THE INVENTION
Thermistors are relatively simple, two-terminal semiconductor
devices the electrical resistance of which varies in a known
retraceable manner with temperature. They are commonly manufactured
in various shapes, such as rods, disks, washers, beads and
molded.
This invention relates to disk type thermistors and particularly to
such thermistors having generally radial lead-in wires. In such
thermistors a lead-in wire is laid across the face of the
thermistor and soldered thereto. The solder bond therebetween
extends from the inner end of the lead-in wire to the periphery of
the thermistor, the lead-in wire extending therebeyond.
We have found that such a construction does not produce an
adequately strong lead-in wire bond in those situations where the
peel strength requirement of the lead-in wire is quite high. The
peel strength is determined by measuring the amount of force
required to rupture the bond between the wire and the disk face.
The force is applied to the wire outside the periphery of the disk
and in a direction substantially parallel to the axis of the disc,
the effect being to peel the wire up from the face of the disk.
We have found that the peel strength of such lead-in wires can be
substantially increased by the use of a lead-in wire bent in such a
manner that the solder bond between the wire and disk face does not
extend to the periphery of the disk. That is to say, at about the
point where the lead-in wire extends beyond the periphery of the
disk, the wire should be sufficiently above the surface of the disk
so that a solder fillet therebetween does not extend to the
periphery of the disk.
The single FIGURE in the drawing is a perspective view of a
thermistor in accordance with this invention.
In one embodiment of this invention, thermistor 1 was a disk type
barium titanate thermistor, made by the usual process of blending
thermistor material in powder form, pressing the powder into a disk
shape and then firing the disk at an elevated temperature, above
about 1,000.degree. C. In this example, the fire disk had a
diameter of 1/2 inch and a thickness of 125 mils.
A conductive metallic coating 2 was then applied in known manner to
each face of the disk to provide an ohmic contact. Such a coating
is made of a powdered metal, such as silver, aluminum or copper,
dispersed in a liquid vehicle. The coating also contains a small
amount of inorganic binder, such as glass frit. After coating 2 has
dried, the thermistor is fired at a temperature above the melting
point of the glass frit to provide a good bond between the
condcutive coating and the thermistor surface. It is necessary that
coating 2 provide good ohmic contact and be readily wettable by
solder.
In some cases it may be desirable that coating 2 consist of two
coatings, the first coating selected to provide ohmic contact and a
good bond to the thermistor surface and the second coating selected
to bond well to the first coating and also provide better
solderability than the first coating. In such a case, the first
coating could contain silver or aluminum in an amount that provides
good ohmic contact to the barium titanate. The second coating could
contain a higher percentage of metal, e.g. silver, to provide
better solderability.
Lead-in wire 3 was made of 25 mil tinned copper wire and had an
overall length of about 11/2 inches. The end, segment 4, of lead-in
wire 3 that was soldered to coating 2 was straight and had a length
of 1/4 inch. Segment 4 was positioned on the face of the thermistor
so that acute angle bend 5 in lead-in wire 3 raised lead-in wire 3
sufficiently above the surface of the thermistor that solder fillet
6 did not extend to the periphery of the thermistor. We have found
that in order to prevent solder fillet 6 from extending to the
periphery of the thermistor, lead-in wire 3 should be elevated
above the face of the thermistor, at its periphery, at least about
double the wire diameter of lead-in wire 3. Both lead-in wires 3,
one on each face of the thermistor, were bent so that the space
between them, at their outer ends, was about equal to the thickness
of the thermistor.
Lead-in wires 3 were soldered to thermistor 1 by the process shown
in U.S. Pat. No. 3,721,003, where both lead-in wires 3 constituted
a prebent single wire which was cut after soldering. Prior to
soldering, the thermistor, held between the lead-in wires, was
dipped into a liquid flux and was then dipped in molten solder. In
this example the solder was 96.5 % tin - 3.5% silver having a
melting point of about 221.degree. C. The solder formed a fillet
all around segment 4 and securely bonded lead-in wire 3 to coating
2.
Disk thermistors in accordance with this invention had a lead-in
wire peel strength at least 50 % greater than that of similar prior
art thermistors, where the solder bond between the lead-in wire and
the thermistor extend to the periphery of the disk.
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