U.S. patent number 3,663,997 [Application Number 05/076,779] was granted by the patent office on 1972-05-23 for method for making a kinescope comprising production and treatment of a temporary mask.
This patent grant is currently assigned to RCA Corporation. Invention is credited to Philip Kuznetzoff.
United States Patent |
3,663,997 |
Kuznetzoff |
May 23, 1972 |
METHOD FOR MAKING A KINESCOPE COMPRISING PRODUCTION AND TREATMENT
OF A TEMPORARY MASK
Abstract
Method for producing a color kinescope by steps comprising the
provision of a perforated etch-resistant layer on a substrate and
providing apertures in the substrate, which apertures are in
substantial register with and individually larger than the openings
of the perforated layer; providing a heat-resistant layer on the
exposed surface of the perforated etch-resistant layer;
substantially eliminating the bond between areas of the
etch-resistant layer that extend partially across the apertures and
the parts of the heat-resistant layer located on these areas;
heating the workpiece thus far produced and comprising at least the
apertured substrate and heat-resistant layer, and possibly the
etch-resistant layer or portions thereof to an elevated temperature
(e.g., the annealing temperature of the substrate) to stress
relieve the substrate and then shaping the substrate-heat-resistant
layer assembly to produce a temporary mask; producing an image
screen with the temporary mask; removing the heat-resistant layer
and any remains of the etch-resistant layer from the apertured
substrate to produce a color-selection mask; and incorporating the
color-selection mask and the image screen in a kinescope.
Inventors: |
Kuznetzoff; Philip (Somerville,
NJ) |
Assignee: |
RCA Corporation (N/A)
|
Family
ID: |
26758465 |
Appl.
No.: |
05/076,779 |
Filed: |
September 30, 1970 |
Current U.S.
Class: |
445/37;
445/47 |
Current CPC
Class: |
H01J
9/142 (20130101); H01J 9/144 (20130101) |
Current International
Class: |
H01J
9/14 (20060101); H01j 009/00 () |
Field of
Search: |
;29/25.1,25.11,25.13,25.14,25.17,25.18 ;313/85S,92B |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Campbell; John F.
Assistant Examiner: Lazarus; Richard Bernard
Claims
What is claimed is:
1. A method for producing a color kinescope comprising a
color-selection mask having apertures of given minimum dimension at
each location thereon and an image screen, said screen being
produced with a temporary mask having light-permeable corridors
registered with said apertures and having a dimension at each
location substantially smaller than said given minimum dimension,
comprising the steps of:
a. providing on at least one surface of a substrate from which said
color-selection mask is to be made a perforated layer of
etch-resistant material, having openings of said smaller
dimension;
b. producing said apertures of said given minimum dimension that
extend through said substrate in substantial register with said
openings in said perforated layer, whereby areas of said perforated
layer extend partially across said apertures;
c. providing an opaque layer of heat-resistant material on the
exposed surface of said perforated etchresistant layer, said layer
of heat-resistant material including corridors therethrough aligned
with and substantially equal in size to said openings, whereby
parts of said heat-resistant layer extend partially across said
apertures;
d. substantially eliminating the bond between said resist layer and
said heat-resistant layer at at least said areas of said perforated
resist layer extending partially across said apertures and
respective said parts of said heat-resistant layer located at said
areas;
e. heating the assembly in d above so as to reduce any stresses
therein and then shaping said assembly, thereby producing said
temporary mask;
f. providing said image screen by steps including photographic
exposure through said corridors of said temporary mask;
g. removing said layer of heat-resistant material and any remaining
portions of said etch-resistant perforated layer from said
substrate; and
h. then incorporating the apertured substrate adjacent to said
image screen to serve as said color-selection mask.
2. The method defined in claim 1, wherein said elimination of said
bond is achieved by completely removing said areas of said
etch-resistant layer extending partially across said apertures.
3. The method defined in claim 1, wherein said elimination of said
bond is achieved by physically separating said areas of said
etch-resistant layer extending partially across said apertures from
the corresponding said parts of said heat-resistant layer located
at said areas.
4. The method defined in claim 1, wherein said elimination of said
bond is achieved by crazing said areas of said etch-resistant layer
extending partially across said apertures.
5. The method defined in claim 1, wherein said elimination of said
bond is achieved by treating with a caustic material at least said
areas of said etch-resistant layer extending partially across said
apertures.
6. The method defined in claim 1, wherein said elimination of said
bond is achieved by heating at least said etch-resistant layer in a
chemically oxidizing atmosphere.
7. The method defined in claim 6, wherein said heating is carried
out at a temperature of at least 350.degree. C.
8. The method defined in claim 6, wherein the later said heating of
said assembly to reduce stresses therein is carried out in a
chemically reducing atmosphere so as to eliminate substantially any
oxides of said heat-resistant material that might be formed during
the preceding said heating of said resist layer.
9. The method defined in claim 8, wherein the later said heating of
said assembly is carried out at an annealing temperature of said
substrate.
10. The method defined in claim 1, wherein said areas of said
perforated etch-resistant layer over-hang respective ones of said
apertures.
Description
BACKGROUND OF THE INVENTION
The present invention relates to color kinescopes and particularly
to a novel method for making a masked-target color kinescope
wherein the image screen is produced with the use of a temporary
mask having temporary apertures of given size which temporary mask
is subsequently converted to a permanent color-selection mask
having larger apertures of a second size.
The prior art discloses color kinescopes having an image screen,
which includes a mosaic comprising a multiplicity of groups of
closely spaced elemental phosphor deposits, the elemental deposits
of each of such groups emitting light of a particular color when
struck by an electron beam, and a color-selection mask disposed
between the image screen and the electron source of the kinescope.
Such masks (including focusing and non-focusing masks) and their
mode of operation are well-known and may be of a planar, or
spherical, or some other non-planar contour, the contour of a
particular mask generally being similar to that of the image screen
with which it is used. Usually, the size of the apertures in the
color-selection mask is graded from a maximum at the center to a
minimum at the edge of the mask.
In the conventional non-focusing shadow mask color kinescope, the
mask apertures and also the beam spots on the screen are somewhat
smaller than the phosphor areas. Generally, commercial screen
printing procedures involve using a color-selection mask having
apertures of a desired final size as a master for photographically
printing the phosphor areas thereof. The mask, with the size of its
apertures unchanged, it then used in a color kinescope for
color-selection.
To increase the electron transmission of the color-selection mask
and, in the case of a non-focusing type tube, the proportion of
each phosphor area impinged by an electron beam, so that the
brightness of the image of a color kinescope can be increased, the
prior art discloses masks having apertures that are individually
larger than those in a conventional shadow mask kinescope, and that
may be larger than the respective elemental phosphor areas of the
image screens associated therewith. If no focusing action is
involved, such larger apertures provide electron beam spots of
greater size as measured at the screen, so that a larger proportion
(or, in many cases, all) of each phosphor area is impinged than in
conventional color kinescopes. On the other hand, in the case of a
focusing-type color kinescope, the beam spot size at the screen
generally is reduced to approximately the phosphor area size by
focusing the beamlets in the space between the mask and the screen.
For the reasons discussed in the U. S. Pat. application of H. B.
Law (Ser. No. 834,759, filed 6/19/69), masks with such larger
apertures are not satisfactory for direct screen printing (for both
focusing and non-focusing-type tubes) because they generally lead
to oversize (and, therefore, overlapping) phosphor areas and
associated problems with color purity and white uniformity.
In order to allow the use of a mask, first, as a photographic
master for screen printing and, then, as a color-selection mask
(either focusing or non-focusing type) exhibiting increased
electron transmissivity, the prior art has sought ways to provide,
and use for screen printing, a "temporary mask" having temporary
apertures of a first size and, after screen printing, to convert
the temporary mask to a permanent, or final, color-selection mask
having the desired larger, final-size apertures, this with
substantial maintenance of the desired kinescope operating
tolerances.
Such use of a "temporary mask" as a photographic master for
"printing" the phosphor areas of image screens and subsequent
conversion of the temporary mask to a color-selection mask for use
as such in a color kinescope, is referred to herein as
"post-printing apertures enlargement." As used with respect to this
invention, a "color-selection mask" is not a preliminary mask since
the apertures of the former are larger in size and the former is
used only for the color-selection function (including focusing),
not for screen printing.
One method disclosed in the prior art for achieving this
"post-printing aperture enlargement" involves applying to each
major surface of an unperforated sheet of conductive material, a
coating of a photosensitive resist material, such as bichromated
glue or shellac. The two photosensitive coatings are then provided,
by photographic methods known in the art, with matching respective
patterns of perforations of a predetermined size to leave the
conductive sheet partially coated with resist. This partially
coated sheet is then immersed in an etching solution to produce, in
uncoated portions thereof, apertures of a final size desired for
the color-selection mask. The minimum diameter of each aperture of
final size is larger than the associated perforation in the resist
coating, so that portions of the resist coating overhang the
final-size apertures in the conductive sheet and form printing
apertures of smaller size than the apertures. Then the partially
coated sheet is used as a master in the well-known image
screen-printing operation, the light rays utilized for printing
passing through and being defined by the small perforations in the
resist coating. The resist coatings are subsequently removed so
that the apertured conductive sheet can be used as a
color-selection mask.
However, because of several reasons, this method is not completely
satisfactory from a commercial stand-point, especially in those
cases where the color-selection mask is desired to have a
non-planar final configuration. One reason is that the bichromated
glue or shellac, as well as comparable other organic resist
materials disclosed in the prior art, deteriorate at the annealing
temperatures (e.g., about 900.degree. C) generally employed in
producing non-planar masks by continuous mask-making processes
practiced in the art. More specifically, in these continuous
mask-making processes, a flat band of a suitable conductive
material (e.g., cold-rolled steel), which is in a comparatively
hard condition, is passed through the mask-making equipment where
the band is, inter alia, provided with suitable apertures. The
conductive material is used in a relatively hard condition to
impart strength thereto and thereby minimize tearing and/or
deformation of the band while it is being passed through the
mask-making equipment.
When a non-planar (e.g., spherical) mask is required, it is
generally desirable to shape the mask to the desired configuration
after the mask-making operation is completed but before the
screen-printing operation. For such a shaping operation, it is
desirable, first, to anneal (at about 900.degree. C for 10 minutes,
for example) the mask, which is still in a comparatively hard
condition, in order to reduce the hardness, and thereby facilitate
the shaping, thereof. After the mask is annealed and shaped, it is
generally mounted on a frame and used as a master for printing the
phosphor areas of the image screen in a manner known in the art
(see U. S. Pat. No. 3,406,068). As indicated with respect to the
above method, the perforated resist coating is required to remain
on the preliminary mask during the screen-printing operation, which
necessitates the resist coating's remaining on the preliminary mask
throughout the preceding annealing operation. However, the
aforementioned resist materials (i.e., shellac or glue), as well as
other organic resists known in the art, are not capable of
withstanding these annealing temperatures. As a result,
color-selection masks made by either of the above methods must be
made from a sheet of comparatively soft material in order to avoid
annealing of the preliminary masks and yet allow the shaping
thereof with relative ease.
The use of such comparatively soft materials results, however, in
the following: (a) an increased incidence of tear and/or
deformation of the conductive band where continuous manufacturing
processes are used, which leads to a relatively low production
yield, and (b) the relatively desirability of using a batch-type,
as compared to a continuous process for making such masks, in order
to minimize tearing and/or deformation. Where a batch-type, instead
of a continuous process is used, however, sheets of conductive
material from which preliminary masks are to be produced are
required to be handled individually in the operation. This results
in an increase in the time and cost of making such preliminary
masks.
Furthermore, the above method is not completely commercially
satisfactory for the reason that the resist materials, such as
shellac or glue, as well as other resists known in the art, used
therein are not completely opaque. Hence, opaquing materials are
required to be added to the resist material to minimize the amount
of light passing therethrough during the screen printing operation.
This addition of opaquing materials involves additional steps in
the manufacture of the kinescope. Also, because in the above
method, portions of the resist coating overhang the final size
apertures in the preliminary mask and because the prior art resist
materials used therein are comparatively fragile, considerable care
must be exercised in handling the preliminary mask to avoid damage
to these overhanging portions during the mask forming
operation.
Another method for achieving post-printing aperture enlargement is
disclosed in the abovementioned application of Law et al., where an
apertured metal layer is provided directly on a substrate of a
second metal that is to be processed ultimately into a
color-selection mask. The apertured metal layer is produced in one
embodiment therein by producing a suitable photosensitive resist
pattern on the substrate area and thereafter depositing the second
metal directly on accessible areas of the same surface, but
substantially not on the resist pattern, and then removing the
resist pattern. The apertures in the metal layer serve as the
temporary apertures for screen printing, the aperture size and
shape being adjusted for this purpose by regulating the resist
pattern's dimensions and configuration. The substrate-metal layer
workpiece is then etched with a suitable material so that portions
of the substrate that are accessible through the apertures of the
metal layer are removed, thereby producing the color-selection mask
with final size apertures. Because the apertured metal layer is on
the substrate during the etching of the substrate, it is necessary
that the second metal comprising this layer be resistant to the
etchants that are used. Where the second metal is not completely so
resistant, it, too, is attacked by the etchant so that the size of
the temporary apertures in the metal layer might vary significantly
from the proper dimensions, thus leading to improperly sized
phosphor areas. Therefore, the range of materials from which the
second metal can be selected is limited by the material comprising
the substrate.
SUMMARY OF THE INVENTION
The invention comprises a method for producing a color kinescope
containing a color-selection (final) mask having apertures of given
dimension at each location on the mask (which apertures, in a
conventional graded mask, will vary from the center to the edge
thereof) and an image screen, which screen is produced with a
temporary mask having light-permeable corridors aligned with the
apertures and having respective maximum dimensions smaller than the
respective minimum dimensions of the associated apertures. The
method includes the steps of providing a perforated layer of
etch-resistant material on at least one surface of a suitable
substrate and producing apertures that extend through the
substrate, the apertures being larger than and in substantial
register with the openings of the perforated etch-resistant
layer.
Then, an opaque layer of heat-resistant material (e.g., a metal,
preferably one having a melting point that significantly exceeds
the thermal treatment temperatures intended for the temporary mask
previous to the printing of the screen) is provided on the exposed
surface of the etch-resistant layer. The heat-resistant layer
includes corridors that extend therethrough and that equal
substantially the size of the openings of the etch-resistant layer.
Thereafter, the workpiece comprising the apertured substrate,
etch-resistant layer, and heat-resistant layer is treated (e.g.,
given a caustic rinse or heated in an oxidizing atmosphere) to
"eliminate substantially the bond" between the areas of the
etch-resistant layer extending partially across the apertures and
the parts of the heat-resistant layer located on these areas. Then,
the assembly including the substrate and the heat-resistant layer
is heated to reduce any stresses in the substrate, and, later
shaped to the desired contour, thereby producing the temporary mask
that is later used to print the image screen by photographic
methods. After the printing of the image screen, the heat-resistant
layer is removed, along with any remaining portions of the
etch-resistant layer, from the substrate and the apertures
substrate, which constitutes the color-selection mask, is then
incorporated in the kinescope along with the screen.
The present method provides a number of improvements over the prior
art, such as, for example, a temporary mask that can withstand the
thermal treatments (e.g., annealing) generally conducted in
kinescope manufacture, and a comparatively broad range of materials
that can be used for the heat-resistant layer of the temporary
mask.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a side view, partly in axial section, of a mask-type
color kinescope including an image screen prepared with the use of
a temporary mask made by the present invention, which temporary
mask is later converted to the color selection mask of the
kinescope.
FIG. 2 is a fragmentary, transverse sectional view of a
resist-coated substrate prior to the conversion thereof to a
temporary mask according to the present invention.
FIG. 3 is a fragmentary transverse sectional view of the structure
shown in FIG. 2 at a subsequent processing step of the present
invention, wherein perforations are provided in the resist
layers.
FIG. 4 is a fragmentary transverse sectional view of the structure
shown in FIG. 3, there being produced in the substrate apertures
extending therethrough, and there being areas of the resist layers
extending partially across these apertures in the substrate.
FIG. 5 is a sectional perspective view of the structure in FIG. 4,
there being, additionally, an opaque layer of heat-resistant
material disposed on and substantially co-extensive with the resist
layer.
FIG. 6 is a fragmentary transverse sectional view of the structure
in FIG. 5, with those parts of the resist layer overhanging the
corridors of the substrate substantially eliminated.
FIG. 7 is a fragmentary transverse sectional view of the temporary
mask produced by the steps including those shown in FIGS. 2 through
6.
FIG. 8 is a fragmentary perspective view of the temporary mask
shown in FIG. 7, in position for use as a photographic master in
preparing an image screen for a color kinoscope.
FIG. 9 is a fragmentary sectional perspective view of a structure
comprising a grille-type color-selection mask during processing
into a temporary mask according to this invention, the structure
further comprising a perforated etch-resistant layer and an opaque
heat-resistant layer.
FIG. 10 is a fragmentary sectional transverse view of a structure
comprising a substrate wherein the apertures extending therethrough
have been produced by etching through the openings of only one of
the perforated etch-resistant layers thereon.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 1 illustrates a mask-type color kinescope 10 produced by the
novel method and temporary mask structure disclosed herein, which
kinescope 10 includes a glass envelope 12 comprising a funnel
portion 14 and a panel or cap 16, which cap 16 includes a
transparent faceplate 18. A plurality of elemental phosphor areas
20, which collectively comprise two or more groups of deposits of
two or more different phosphors, the deposits of each group being
individually capable of emitting luminescence of a particular color
(e.g., red, blue, or green) when struck by an electron beam 22, are
deposited on the internal surface 24 of the transparent faceplate
18. The faceplate 18 (or other transparent substrate), the phosphor
areas 20 and, optionally, a light absorbing matrix 26 (discussed
below), are collectively referred to herein as an image screen 28.
Generally, there is included on the image screen a
light-reflective, electron-permeable, conductive layer (not shown)
of aluminum, for example, which covers the phosphor areas and also
serves as an electrode. The phosphor areas 20, are, for
illustration purposes, exaggerated in size and proportion (as are
other parts of FIG. 1 and the other figures) and shown as having a
dot configuration, which dots may be arranged in the well-known
hexagonal dot pattern (FIG. 8). Alternatively, each phosphor area
may have a well-known stripe configuration (not shown), these
stripes being arranged in an array of parallel lines of different
color phosphors to provide a line color screen. The kinescope 10
further includes a number of electron guns equal to the number of
different colors in the screen and either electrostatic or magnetic
deflection and convergence means, none of which are shown for
simplicity. In generally parallel, spaced relation with the screen
28 is a color-selection mask (or mask electrode) 30 which may be,
for example, of the focusing or non-focusing variety, both of which
are known in the art. A suitable frame 32 or other means can be
used to support the color-selection (final) mask 30 in the cap 16.
Unless stated otherwise, for purposes of example, the
color-selection mask 30 is understood to be of the non-focusing
mask variety, which is operated at substantially the same potential
as the screen 28 to form a field-free region therebetween. The mask
30 is made form a sheet or wide band of electrically conducting
material (e.g., cold-rolled steel) and has a plurality of apertures
34 of desired final size at each point therein. The size of the
apertures 34 may be graded from a maximum at the center to a
minimum at the edge of the mask, as is well known in the art. While
the apertures 34 are, for simplicity, shown in FIG. 1 to be
substantially circular in shape, apertures having other shapes may
be used; for example, the mask may be of the "grille" type (FIG.
9), having elongated slot-shaped apertures and used with a line
screen. The apertures 34 are related in size and position to
respective phosphor areas 20 of the image screen 28. In the present
invention, the size relationship is such that, where the
color-selection mask 30 is of the non-focusing variety, each
aperture 34 is of such size as to be capable of passing an electron
beam 22 whose spot dimensions, as measured at the screen 28 (i.e.,
the spot size of the beam) are at least substantially equal to, or
preferably larger than, the size of the individual phosphor area 20
upon which the electron beam spot impinges. The electron beam spot
size is preferably sufficiently large to provide a negative leaving
tolerance (beam spot larger than corresponding phosphor area) but
not so great that the electron beam spot impinges any ones other
than the intended phosphor areas. However, where, in the prior art,
color-selection masks have apertures of a given size that are used
for both screen printing and the color-selection function, the
effective size of the light spots produced during screen printing
generally exceeds by a significant amount the size of the electron
beam spots produced in the operation of the kinescope. This results
in the size of the individual phosphor areas being considerably
greater than the spot size of their associated electron beam so
that the beam spot impinges only a portion of each phosphor area.
Such differences in size between the printing light spots and the
electron beam spots are familiar to the art, the difference
therebetween being attributable to the more extensive
penumbra-umbra effect taking place in the screen printing
screen.
Generally, it is preferred that the apertures 34 exceed in size
their associated phosphor areas 20. The apertures of a
focusing-type mask are much greater in size than their respective
individual phosphor areas where the color tube is of the positive
leaving tolerance type (beam spot smaller than a corresponding
phosphor area) or the negative leaving tolerance type. In mask-type
color kinescopes in the prior art, there is a single aperture in
the color selection barrier for each trio of phosphor areas 20
(i.e., one area each of red, green and blue phosphors); however,
for purposes of simplicity, each aperture 34 is shown in FIG. 1 to
correspond in position with only one phosphor area 20.
In the operation of the kinescope 10, electrons are emitted by the
respective electron guns (not shown) and thereafter, directed, by
means known in the art, as respective electron beams (only one beam
22 is shown for simplicity) through the apertures 34 to impinge
upon the trios of phosphor areas 20. Because a larger electron beam
spot is produced, which spot impinges upon substantially an entire
individual phosphor area, the kinescope 10 exhibits improved
characteristics, such as increased image brightness and contrast,
over positive tolerance kinescopes.
In the method illustrated in FIGS. 2 through 7, a color kinescope
(e.g., 10 of FIG. 1) is manufactured by steps including the
production of a temporary mask 50 FIG. 7) for screen printing. The
first step in making the temporary mask 50 is the provision of a
continuous first layer 52 (FIG. 2) of a photosensitive resist
material (e.g., bichromated fish glue) on one major surface 54 of a
substrate 56 of a suitable, relatively hard material (e.g.,
cold-rolled steel, having a thickness of about 7 mils) and a
continuous second layer 58 of a photo-sensitive resist material on
the other major surface 60 of the substrate 56 (the second layer 58
is not shown in the drawings in FIGS. 5 to 7 for simplicity). The
layers 52 and 58 of resist material are converted into perforated
layers 62 and 64, respectively, by methods known in the art, for
example, by light exposure through a suitable stencil and
subsequent selective removal of the unexposed, unhardened areas by
washing, to produce patterns of openings 66 and 68 therein. The
openings 66 and 68 are disposed at and substantially concentric
with the sites where the color-selection apertures (78 in FIG. 4)
are intended, the openings 66 or 68 of each respective perforated
layer 62 or 64 being in register with those of the other layer. The
openings (e.g., 66) of one of the layers (62) are of a
predetermined size at each point on the mask suitable for screen
printing, this size being significantly smaller than the minimum
size of the subsequently-produced apertures (78 in FIG. 4). The
other openings (i.e., 68) preferably are significantly larger at
each location than the corresponding openings (66) of predetermined
size such that the apertures (78 in FIG. 4) that are later produced
are generally tapered from one surface 54 toward the other surface
60, according to general practice in the art. Such tapered
apertures generally are preferred to minimize interference of the
color-selection mask with the electron beams during operation of
the kinescope; for example, to minimize impingement of electrons on
the side walls of the apertures.
Those portions of the substrate 56 (FIG. 3) located generally
between the openings 66 and 68 of the perforated resist layers 62
and 64, respectively, are removed, as by etching with ferric
chloride, from both surfaces 52 and 60 of the substrate 56, so as
to produce apertures 78 (FIG. 4) thereat. Such removal of material
from the substrate 52 is carried out so that there are also removed
portions thereof located beneath that layer (i.e., 62) surrounding
the openings (i.e., 66) of the predetermined size necessary for
screen printing, and consequently, areas 69 (FIG. 4) of this layer
62 extend partially across the apertures 78 so produced. It is
preferred that these areas 69 of the layer 62 overhang the
apertures 78 so that substantially all of these respective areas 69
are located above the apertures 78. In the preferred embodiment
illustrated in FIG. 4, certain substrate portions located beneath
the second resist layer 64 also have been removed so that areas of
this layer 64 also extend partially across the apertures 78, to
produce a relatively large taper angle, although it is not
necessary for purposes of this invention that this be so. Where it
is desired, etching of the substrate to produce apertures 78' (FIG.
10, where the elements corresponding to those in FIG. 4 are
designated with primed corresponding numerals) can be done through
only the openings 68' of one perforated etch-resistant layer 64' on
the substrate 56', these openings 68' being significantly larger
than the other openings (66') that are of predetermined size
suitable for screen printing and that are located in the second
etch-resistant layer 62'. Also, after the provision of the
apertures in the substrate, the heat-resistant layer 72' is
provided, and the second perforated etchresistant layer 64' (or 64
of FIG. 4) can be removed from the substrate 56 where it is desired
to eliminate any interference by that layer 64 with the subsequent
screen printing operation.
Thereafter, the exposed surface 70 of the resist layer 62, which
includes the openings 66 of the predetermined size for screen
printing, is covered with a heat-resistant layer 72 of a material
capable of withstanding the annealing temperatures (i.e., the
melting point of such material exceeds the annealing temperature of
the substrate) to which the temporary mask is subjected (as
discussed below), an exemplary annealing temperature being about
900.degree. C. The heat-resistant layer 72 includes light-permeable
corridors 73 that are in substantial register with and
substantially co-extensive with the openings 66. The term
"heat-resistant" is defined herein to include material capable of
withstanding thermal treatments (e.g., annealing) to which the
temporary mask might be subjected. Such a heat-resistant material
can be a metal, such as copper or nickel, for example; and the
layer 72 should be sufficiently thick so that the parts 75 thereof
over the apertures 78 can be self supporting (e.g., about one-half
mil in thickness). The material of the layer 72 preferably is
substantially opaque and, where the mask is to be formed to a
non-planar contour, is of relatively ductile material. This layer
of heat-resistant material can be produced by, for example,
painting directly on the resist layer; evaporation; electroless
chemical deposition; electrolytic deposition; or electrophoresis,
according to known practices.
Then, the workpiece 71 (shown in FIG. 5 and comprising the
apertured substrate 56, perforated resist layer 62, and
heat-resistant layer 72) is annealed (e.g., at about 900.degree.
C), thereby relieving any stresses that may be present in the
substrate 56 and facilitating the mask forming operation (discussed
below).
However, to reduce significantly the possibility of deformation,
tearing, or other damage to the parts 75 of the heat-resistant
layer 72 overhanging the apertures 78, due, for example, to
thermally-caused physical movement of the overhanging areas 69 of
the resist layer 62 during the annealing (or some other heating)
operation, the work-piece 71 (shown in FIG. 5 and comprising the
apertured substrate 56, perforated resist layer 62 and
heat-resistant layer 72) is treated, before such an annealing
operation, so as to reduce or to eliminate substantially the bond
between at least the parts 75 of the heat-resistant layer 72 that
overhang the apertures 78 and the areas 69 of the resist layer 62
that co-extend therewith and overhang the apertures 78. Such
"elimination" or "reduction of the bond," both being referred to
herein as "elimination of the bond," can be achieved, for example,
by completely removing these overhanging areas 69 of the resist
layer from the workpiece 71, as in the structure 79 (FIG. 6); by
physically separating these areas 69 of the resist layer 62 from
the corresponding parts 75 of the heat-resistant layer 72; or by
crazing these areas 69 of the resist layer 62 so as to produce a
number of fragmented portions (not shown).
One way for achieving such elimination of the bond is to wash the
above workpiece 71 (FIG. 5) in a caustic solution, such as sodium
hydroxide. Another way is to heat the workpiece in an oxidizing
atmosphere (e.g., air), a minimum temperature of about 350.degree.
C being generally preferred for most organic resist materials. A
temperature of about 400.degree. C to 500.degree. C is preferred
where the resist layer material is fish glue. Whereas the heating
the workpiece 71 in an oxidizing atmosphere might lead to the
conversion of a metallic heat-resistant layer into an oxide
thereof, which oxide might be undesirable because of its
brittleness, the execution of annealing of the workpiece, which is
carried out after the elimination of the bond, at about 900.degree.
C, for example, in a chemically reducing atmosphere, such as
"forming gas" (i.e., 90% N.sub.2 - 10% H.sub.2), for example,
serves to reduce the less desirable metal oxide to the metal.
The workpiece that has been treated to eliminate the bond (e.g., 79
in FIG. 6) is then annealed in the manner described above (e.g., at
900.degree. C). While some portions (e.g., 62a in FIG. 6) of resist
material may, after the above preferred treatment to eliminate the
bond with the heat-resistant layer 72, remain between the
heat-resistant layer 72 and the substrate 56, these portions 62a do
not, during the annealing operation, adversely affect significantly
the parts 75 of the heat-resistant layer 72 over-hanging the
apertures 78. These portions 62a are, in fact, substantially
removed by this annealing operation.
After annealing the resulting assembly including the substrate 56
and the heat-resistant layer 72 (FIG. 7) is formed (shaped)
according to known practices in the art to produce a temporary mask
50 of non-planar contour where a non-planar color-selection mask is
desired. At this point, substantially all of the resist layers (62
and 64) have been removed (due, in part, to the annealing), as
shown in FIG. 7, and the heat-resistant layer 72 is located on the
apertured substrate 56.
The temporary mask 50 (FIG. 7) thus produced is then positioned
(FIG. 8) in spaced relation with a suitable transparent substrate
80 (e.g., a faceplate) and used as a photographic master to "print"
the various elemental phosphor areas 82, 84, and 86 of the
respective phosphor groups (e.g., red, blue, and green) on the
substrate 80. The printing process is known in the art (see, for
example, U. S. Pat. No. 3,406,068 to H. B. Law). Where the
color-selection masks of non-planar configuration are desired, the
shaping of the temporary mask to this configuration is done, as
mentioned above, as the final step in temporary mask-making, and
before screen printing. Briefly, in the screen-printing process,
one surface 88 of the transparent substrate 80 may be coated with a
mixture (not shown) comprising a first one of the desired phosphors
and a suitable photosensitive material and then exposed to a
suitable light which is passed through the corridors 73 of the
temporary mask 50. Those portions of the photo-sensitive-phosphor
coating (not shown) struck by the light rays are hardened and then
the unhardened portions of the coating are removed, by washing, for
example, to leave a pattern (not shown) of areas (dots) of a
phosphor of a first color mixed with the hardened resist material.
This sequence of steps is repeated for the other phosphors. The
hardened resist material is subsequently removed from the phosphor
dots by baking or by chemical dissolution methods known in the art.
In first-order color printing, a light source (not shown) intended
for a particular phosphor group is located at a point (90, 92, or
94) so as to be in substantially the same spatial relation with the
image screen (e.g., 28 of FIG. 1) as the center of deflection or
apparent source of the electron beam (not shown) used for exciting
that particular phosphor group. The paths followed by the light
rays during printing and by the electrons during operation of the
kinescope are indicated, for purposes of illustration, by the lines
96, 98 and 100.
The screen printing operation may include providing, by using the
temporary mask 50 disclosed herein, a light-absorbing matrix (e.g.,
26 of FIG. 1) of an opaque, non-light-reflective material on the
image screen (e.g., 28 of FIG. 1). For purposes of this invention,
where such a matrix is provided on an image screen, it is
considered to be included in the term "image screen." This matrix
can be produced, for example, in the manner described in the
abovementioned application of Law et al. The phosphor areas may, if
desired, be somewhat larger than the openings of the matrix so that
portions of the respective phosphor areas overlap the matrix. The
"effective size" of such phosphor areas is, however, equal to the
size of their respective matrix openings. As used with respect to
the phosphor areas of a matrix-bearing image screen, the term
"size" is defined to be the effective size thereof.
Upon completion of the screen printing operation, the temporary
mask 50 (FIG. 7) is converted to a color-selection mask (not shown)
that corresponds to mask 30 in FIG. 1, by removing the layer 72 of
heat-resistant material. Such removal is carried out, for example,
where the heat-resistant material is metal, by a second etching
operation utilizing a suitable etching material. It is preferred
that the second etching material be selected so as substantially
not to attack the substrate 56. However, because the quantity and
thickness of the heat-resistant layer is comparatively small with
respect to the apertured substrate, a relatively insignificant
dimensional change might result in the apertured substrate due to
etching, in the relatively short time needed to remove the
heat-resistant layer. Where it is desired, the material comprising
the heat-resistant layer can be chosen so as to be more readily
attached by etching agents than the substrate so as to facilitate
removal thereof from the substrate. Such materials include those
having oxidation-reduction potentials significantly higher than the
material comprising the substrate 56.
In another embodiment, an assembly 11 (FIG. 9) comprising a
substrate 112 that has been processed (generally in the manner
outlined above) into a grille-type color-selection mask of desired
dimensions; an etch-resistant perforated layer 114 on the substrate
112, which layer 114 serves the same purposes as and is comparable
to layer 62 in FIGS. 3 to 5; and an opaque layer 116 of
heat-resistant material co-extensive with the perforated layer 114,
which opaque layer 116 is comparable to and serves the same purpose
as the layer 72 in FIGS. 3 to 5. The processing of the assembly 110
and the screen printing therewith are comparable to those recited
above.
The elimination of the bond disclosed herein comprises an inventive
improvement on the method of making a color kinescope described and
claimed in an application filed concurrently herewith for Glenn R.
Fadner, Jr., and assigned to the same assignee, which method
involves some of the steps herewithin. The title of the Fadner
application is "Method For Making A Kinescope Comprising A Color
Selection Mask With Temporary Corridors."
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