U.S. patent number 3,639,119 [Application Number 05/034,605] was granted by the patent office on 1972-02-01 for copper base alloy.
This patent grant is currently assigned to Olin Corporation. Invention is credited to Charles D. McLain.
United States Patent |
3,639,119 |
McLain |
February 1, 1972 |
COPPER BASE ALLOY
Abstract
The present disclosure teaches an improved copper base alloy
containing iron and tin and a material selected from the group
consisting of phosphorous and zinc and mixtures thereof. The alloys
of the present invention are characterized by improved physical
properties, in particular high strength and high conductivity.
Inventors: |
McLain; Charles D. (Alton,
IL) |
Assignee: |
Olin Corporation (N/A)
|
Family
ID: |
21877464 |
Appl.
No.: |
05/034,605 |
Filed: |
May 4, 1970 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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648946 |
Jun 26, 1971 |
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Current U.S.
Class: |
420/473 |
Current CPC
Class: |
C22C
9/02 (20130101); C22C 9/00 (20130101); H01B
1/026 (20130101); C22C 9/04 (20130101) |
Current International
Class: |
C22C
9/02 (20060101); C22C 9/00 (20060101); H01B
1/02 (20060101); C22C 9/04 (20060101); C22c
009/00 (); C22c 009/02 () |
Field of
Search: |
;75/153,154,157
;148/11.5,13.2,32,32.5 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Lovell; Charles N.
Parent Case Text
This application is a continuation-in-part of copending application
Ser. No. 648,946 for "Copper Base Alloy" by Charles D. McLain,
filed June 26, 1967, now abandoned.
Claims
What is claimed is:
1. A high conductivity, high strength copper base alloy consisting
essentially of from 1.5 to 3.5 percent iron, from 0.02 to 0.10
percent tin, a material selected from the group consisting of
phosphorus from 0.01 to 0.08 percent, zinc from 0.05 to 0.20
percent and mixtures thereof and the balance copper.
2. A copper base alloy according to claim 1 containing both
phosphorus and zinc.
3. A copper base alloy according to claim 1 in the flat rolled
condition.
4. A copper base alloy according to claim 1 having an electrical
conductivity of at least 70 percent IACS and an annealed tensile
strength of at least 55,000 p.s.i.
5. A copper base alloy according to claim 1 having an electrical
conductivity of at least 60 percent IACS.
6. A copper base alloy according to claim 1 wherein the zinc
content is from 0.05 to 0.15 percent.
7. A copper base alloy according to claim 1 wherein the iron
content is from 1.8 to 2.9 percent.
8. A copper base alloy according to claim 1 wherein the tin content
is from 0.03 to 0.10 percent.
9. A copper base alloy according to claim 1 in the cold-rolled
condition.
10. A copper base alloy according to claim 1 in the cold-rolled and
annealed condition.
Description
As is well known in the art, copper is an excellent conductor of
electricity. Numerous alloying additions have been proposed in
order to increase the strength of copper. In so doing, the
electrical conductivity of the copper is markedly reduced.
It is, therefore, highly desirable to provide a copper base alloy
characterized by high conductivity and increased strength.
Accordingly, it is a principal object of the present invention to
provide a copper base alloy characterized by high electrical
conductivity and high strength properties.
It is a further object of the present invention to provide a copper
base alloy with annealed physical properties which do not have a
wide variation.
It is a further object of the present invention to provide a copper
base alloy having the ability to attain various strength levels as
a result of different annealing treatments, even when small amounts
of impurities are present.
It is a further object of the present invention to provide an
improved copper base alloy having a combination of high strength,
high conductivity, and other excellent physical properties.
It is an additional object of the present invention to provide a
copper base alloy which is inexpensive and wherein the excellent
physical properties are easily obtainable.
Further objects and advantages of the present invention will appear
from the ensuing specification.
In accordance with the present invention it has been found that an
improved copper base alloy is provided which effectively achieves
the foregoing objects and advantages. The alloy of the present
invention comprises a copper base alloy consisting essentially of
from 1.5 to 3.5 percent iron, from 0.02 to 0.10 percent tin, a
material selected from the group consisting of phosphorus from 0.01
to 0.08 percent, zinc from 0.05 to 0.20 percent and mixtures
thereof and the balance essentially copper. Throughout the ensuing
specification all percentages are percentages by weight.
In accordance with the present invention, it has been surprisingly
found that the foregoing alloys are characterized by numerous
unexpected and surprising advantages. For example, the alloys of
the present invention have an unexpected improvement in electrical
conductivity. Namely, there is readily obtained an IACS electrical
conductivity in excess of 60 percent IACS and generally over 70
percent IACS. Furthermore, the alloys of the present invention have
excellent annealing characteristics, with the ability to attain
various strength levels as a result of different annealing
treatments. In addition, the alloys of the present invention attain
high rolled temper strength levels. Still further the high
electrical conductivity of the alloys of the present invention is
coupled with excellent annealed tensile strength properties of
approximately 55,000 p.s.i. and higher. The strength and physical
properties of the alloys of the present invention are not
significantly variable if small amounts of impurities are present.
In addition to the foregoing, the alloys of the present invention
are inexpensive and their excellent physical properties are easily
obtainable.
The composition of the alloys of the present invention is as stated
heretofore. The preferred iron content is from 1.8 to 2.9 percent
and the preferred tin content is from 0.03 to 0.10 percent. The
preferred zinc content is 0.05 to 0.15 percent.
In view of the high and in fact surprising physical properties of
the alloys of the present invention, the percentage ranges of the
alloying ingredients are important.
In addition to the foregoing, small amounts of additional alloying
ingredients may be, of course, included in order to achieve
particularly desirable results, for example, phosphorus from 0.01
to 0.10 percent and zinc from 0.05 to 0.20 percent. Also, small
amounts of impurities may be tolerated.
The alloys of the present invention attain improvement over
conventional alloys in a wide range of processing. Naturally,
however, particular processing will result in variation in
properties.
The manner of casting the material is not particularly critical,
with conventional casting methods for these types of alloys being
readily utilizable, it being noted that higher temperatures should
be used in order to solutionize the iron. It is preferred to cast
the alloy into billets of conventional size, subjecting them to hot
working, as by rolling in the conventional size.
After casting the alloy should be hot rolled at an elevated
temperature, i.e., from 800.degree. to 1,050.degree. C., with a
temperature of about 950.degree. C. being preferred. The alloy
should then be cold rolled to gage, with intermediate anneals, with
cold reduction in excess of 50 percent between anneals being
preferred. Annealing temperatures of from 400.degree. to
600.degree. C. are preferred, with annealing time at temperature
preferably being a minimum of 2 hours. Longer times may be
utilized, if desired, to improve electrical conductivity.
Continuous strand annealing of strip or mill products will achieve
the same high level of physical properties as with bell annealing,
but will not achieve as high a level of electrical conductivity.
Therefore, for development of both high annealed strength and
electrical conductivity, final annealing and preferably in process
annealing must be in batches with conventional furnace cooling,
such as bell annealing.
Detailed processing and preferred processing parameters consonant
with the foregoing are found in copending application Ser. No.
648,742 for "Process For Treating Copper Base Alloy," filed June
26, 1967 by C. D. McLain, now U.S. Pat. No. 3,522,112.
The present invention will be more readily understandable from a
consideration of the following illustrative examples.
EXAMPLE I
Alloys were prepared in the following manner. High purity copper
and high purity iron were melted together in a low frequency,
slot-type induction furnace under a charcoal cover at approximately
1,200.degree. C. About 10 percent of the copper charge was held
back and the melt was slightly overheated to about 1,300.degree. C.
in order to put the iron into solution. High purity alloying
additions were added when the molten mass was at about
1,300.degree. C. The balance of the copper was added and the melt
brought to the pouring temperature of about 1,200.degree. C. The
melt was then poured into a water-cooled ingot mold of
283/4.times.5.times.96 inches at a pouring rate of 21.3 inches per
minute.
The alloys thus prepared had the following composition.
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TABLE I
Alloy Iron Phosphorus Tin Copper
__________________________________________________________________________
1 2.3% 0.03% 0.08% essentially balance 2 2.3% 0.03% -- essentially
balance
__________________________________________________________________________
EXAMPLE II
Alloys 1 and 2 prepared in example I were processed as follows. The
alloys were hot rolled at from 900.degree. to 940.degree. C.,
followed by a water spray quench to room temperature. The materials
were then cold rolled to 0.100 inch, bell annealed at
480.degree.-600.degree. C. (1 to 4 hours at temperature,) cold
rolled to 0.050 inch, bell annealed at 460.degree.-480.degree. C.
(1 to 3 hours at temperature,) and cold rolled to 0.025 inch gage
and bell annealed at 440.degree.-480.degree. C. (1 to 3 hours at
temperature.)
The alloys were then tested for physical properties, with the
results being shown in the following table. ##SPC1##
The foregoing demonstrates that alloy 1, the alloy of the present
invention, develops greater annealed strength levels than
conventional alloy 2 at comparable electrical conductivity.
This invention may be embodied in other forms or carried out in
other ways without departing from the spirit or essential
characteristics thereof. The present embodiment is therefore to be
considered as in all respects illustrative and not restrictive, the
scope of the invention being indicated by the appended claims, and
all changes which come within the meaning and range of equivalency
are intended to be embraced therein.
* * * * *