U.S. patent number 11,289,684 [Application Number 17/024,443] was granted by the patent office on 2022-03-29 for display device and electronic apparatus.
This patent grant is currently assigned to Samsung Display Co., Ltd.. The grantee listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Junghyun Cho, Beohmrock Choi, Jinkoo Chung, Seunghoon Lee.
United States Patent |
11,289,684 |
Cho , et al. |
March 29, 2022 |
Display device and electronic apparatus
Abstract
A display device includes: a substrate; two pixel circuits on
the substrate spaced apart from each other with a transmission area
therebetween, each of the two pixel circuits including a transistor
and a storage capacitor; two display elements respectively
electrically coupled to the two pixel circuits; a bottom metal
layer between the substrate and the two pixel circuits and
including a through hole at the transmission area; an encapsulation
member on the two display elements; and an optical functional layer
on the encapsulation member, wherein the optical functional layer
includes: a first layer including a first opening, second openings,
and a first slope portion, the first opening at the transmission
area, the second openings corresponding to each of the two display
elements, and the first slope portion being around the transmission
area; and a second layer on the first layer.
Inventors: |
Cho; Junghyun (Yongin-si,
KR), Lee; Seunghoon (Yongin-si, KR), Chung;
Jinkoo (Yongin-si, KR), Choi; Beohmrock
(Yongin-si, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-si |
N/A |
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
(Yongin-si, KR)
|
Family
ID: |
74586794 |
Appl.
No.: |
17/024,443 |
Filed: |
September 17, 2020 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20210249635 A1 |
Aug 12, 2021 |
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Foreign Application Priority Data
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Feb 12, 2020 [KR] |
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10-2020-0017139 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
27/322 (20130101); H01L 51/5253 (20130101); H01L
51/5281 (20130101); H01L 51/5275 (20130101); G06F
3/0412 (20130101); H01L 27/323 (20130101); H01L
27/3234 (20130101); H01L 27/326 (20130101); H01L
51/5284 (20130101); H01L 27/3272 (20130101); G06F
3/044 (20130101); H04M 1/026 (20130101); H04M
1/0266 (20130101) |
Current International
Class: |
G06F
3/041 (20060101); H01L 51/52 (20060101); H01L
27/32 (20060101); G06F 3/044 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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208507679 |
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Feb 2019 |
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CN |
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109950296 |
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Jun 2019 |
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CN |
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3139411 |
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Mar 2017 |
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EP |
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3139422 |
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Mar 2017 |
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EP |
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2009-110873 |
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May 2009 |
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JP |
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2010-96882 |
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Apr 2010 |
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JP |
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2012-109214 |
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Jun 2012 |
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JP |
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10-2013-0008660 |
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Jan 2013 |
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KR |
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10-2014-0135568 |
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Nov 2014 |
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KR |
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10-2014-0143916 |
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Dec 2014 |
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KR |
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10-2020-0050059 |
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May 2020 |
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KR |
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Primary Examiner: Nguyen; Kevin M
Attorney, Agent or Firm: Lewis Roca Rothgerber Christie
LLP
Claims
What is claimed is:
1. A display device comprising: a substrate; two pixel circuits on
the substrate spaced apart from each other with a transmission area
therebetween, each of the two pixel circuits including a transistor
and a storage capacitor; two display elements respectively
electrically coupled to the two pixel circuits; a bottom metal
layer between the substrate and the two pixel circuits and
including a through hole corresponding to the transmission area; an
encapsulation member on the two display elements; and an optical
functional layer on the encapsulation member, wherein the optical
functional layer includes: a first layer including a first opening,
second openings, and a first slope portion, the first opening
corresponding to the transmission area, the second openings
corresponding to each of the two display elements, and the first
slope portion being around the transmission area; and a second
layer on the first layer and having a refractive index greater than
a refractive index of the first layer.
2. The display device of claim 1, wherein the first slope portion
entirely surrounds the transmission area in a plan view.
3. The display device of claim 1, wherein the first slope portion
includes a plurality of sub-portions apart from one another.
4. The display device of claim 1, wherein a lateral surface of the
first slope portion includes a forward-tapered slope surface.
5. The display device of claim 1, wherein the first layer further
includes a second slope portion inside the first opening.
6. The display device of claim 5, wherein the first slope portion
is apart from the second slope portion.
7. The display device of claim 6, wherein an edge of the bottom
metal layer that defines the through hole is between the first
slope portion and the second slope portion in a plan view.
8. The display device of claim 5, wherein a first width of the
second slope portion is less than a second width of the through
hole of the bottom metal layer.
9. The display device of claim 1, further comprising an input
sensing layer between the encapsulation member and the optical
functional layer, the input sensing layer including at least one
conductive layer and an insulating layer, the at least one
conductive layer including a sensing electrode or a trace line.
10. The display device of claim 9, wherein the first slope portion
of the first layer overlaps the at least one conductive layer of
the input sensing layer.
11. The display device of claim 9, further comprising a reflection
prevention layer on the input sensing layer and including a black
matrix and a color filter.
12. The display device of claim 11, wherein the first slope portion
of the first layer of the optical functional layer overlaps the
black matrix.
13. The display device of claim 12, wherein the black matrix
includes a through hole corresponding to the transmission area, and
a portion of the first layer is in the through hole of the black
matrix.
14. An electronic apparatus comprising: a display device including
an array of a plurality of pixels, the plurality of pixels
including two pixels spaced apart from each other with a
transmission area therebetween; and a component overlapping at
least the transmission area, wherein the display device includes: a
display layer including the plurality of pixels; a bottom metal
layer including a through hole corresponding to the transmission
area; an encapsulation member on the display layer; and an optical
functional layer on the encapsulation member, wherein the optical
functional layer includes: a first layer including a first opening,
second openings, and a first slope portion, the first opening
corresponding to the transmission area, the second openings
corresponding to each of the plurality of pixels, and the first
slope portion being around the transmission area; and a second
layer on the first layer and having a refractive index greater than
a refractive index of the first layer.
15. The electronic apparatus of claim 14, wherein a lateral surface
of the first slope portion includes a slope surface forward-tapered
with respect to a top surface of a lower layer under the first
layer.
16. The electronic apparatus of claim 15, wherein the lower layer
comprises an input sensing layer including at least one conductive
layer and an insulating layer, the at least one conductive layer
including a sensing electrode or a trace line.
17. The electronic apparatus of claim 16, wherein the first slope
portion overlaps the at least one conductive layer of the input
sensing layer.
18. The electronic apparatus of claim 16, wherein the lower layer
further comprises a reflection prevention layer on the input
sensing layer and including a black matrix and a color filter.
19. The electronic apparatus of claim 18, wherein the first slope
portion of the first layer of the optical functional layer overlaps
the black matrix.
20. The electronic apparatus of claim 18, wherein the black matrix
includes a through hole corresponding to the transmission area, and
a portion of the first layer is in the through hole of the black
matrix.
21. The electronic apparatus of claim 14, wherein the first layer
further includes a second slope portion inside the first
opening.
22. The electronic apparatus of claim 21, wherein the first slope
portion is apart from the second slope portion.
23. The electronic apparatus of claim 22, wherein an edge of the
bottom metal layer that defines the through hole is between the
first slope portion and the second slope portion in a plan
view.
24. The electronic apparatus of claim 21, wherein a first width of
the second slope portion is less than a second width of the through
hole of the bottom metal layer.
25. The electronic apparatus of claim 14, wherein the component
includes a sensor or a camera.
Description
CROSS-REFERENCE TO RELATED APPLICATION
The present application claims priority to and the benefit of
Korean Patent Application No. 10-2020-0017139, filed on Feb. 12,
2020, in the Korean Intellectual Property Office, the disclosure of
which is incorporated herein in its entirety by reference.
BACKGROUND
1. Field
Aspects of one or more example embodiments relate to a display
device and an electronic apparatus including the same.
2. Description of Related Art
Recently, the uses and applications of display devices has
diversified. In addition, as display devices have become thinner
and lighter, their range of uses has gradually expanded.
As the area occupied by a display area in display devices expands,
various functions that are combined or associated with display
devices have been added. In order to add various functions while
expanding the display area, display devices may have a region for
adding various functions inside a display area, not a function of
displaying an image.
The above information disclosed in this Background section is only
for enhancement of understanding of the background and therefore
the information discussed in this Background section does not
necessarily constitute prior art.
SUMMARY
In order to incorporate various functions into display devices,
components such as cameras or sensors may be arranged in a display
device. To arrange a component while securing a display area having
a wider area in a display device, the component may be arranged to
overlap the display area. In one method of arranging a component, a
display device may include utilizing a transmission area through
which light or sound of a certain wavelength may pass.
Additional aspects of some example embodiments will be set forth in
part in the description which follows and, in part, will be more
apparent from the description, or may be learned by practice of the
presented example embodiments of the disclosure.
According to one or more example embodiments, a display device
includes a substrate, two pixel circuits on the substrate to be
apart from each other with a transmission area therebetween, each
of the two pixel circuits including a transistor and a storage
capacitor, two display elements respectively electrically coupled
to the two pixel circuits, a bottom metal layer between the
substrate and the two pixel circuits and including a through hole
corresponding to the transmission area, an encapsulation member on
the two display elements, and an optical functional layer on the
encapsulation member, wherein the optical functional layer includes
a first layer including a first opening, second openings, and a
first slope portion, the first opening corresponding to the
transmission area, the second openings corresponding to each of the
two display elements, and the first slope portion being around the
transmission area, and a second layer on the first layer and having
a refractive index greater than a refractive index of the first
layer.
According to some example embodiments, the first slope portion may
entirely surround the transmission area when viewed in a direction
perpendicular to the substrate.
According to some example embodiments, the first slope portion may
include a plurality of sub-portions apart from one another.
According to some example embodiments, a lateral surface of the
first slope portion may include a forward-tapered slope
surface.
According to some example embodiments, the first layer may further
include a second slope portion located inside the first
opening.
According to some example embodiments, the first slope portion may
be apart from the second slope portion.
According to some example embodiments, an edge of the bottom metal
layer that defines the through hole may be located between the
first slope portion and the second slope portion when viewed in a
direction perpendicular to the substrate.
According to some example embodiments, a first width of the second
slope portion may be less than a second width of the through hole
of the bottom metal layer.
According to some example embodiments, the display device may
further include an input sensing layer between the encapsulation
layer and the optical functional layer and including at least one
conductive layer and an insulating layer, the at least one
conductive layer including a sensing electrode or a trace line.
According to some example embodiments, the first slope portion of
the first layer may overlap the at least one conductive layer of
the input sensing layer.
According to some example embodiments, the display device may
further include a reflection prevention layer on the input sensing
layer and including a black matrix and a color filter.
According to some example embodiments, the first slope portion of
the first layer of the optical functional layer may overlap the
black matrix.
According to some example embodiments, the black matrix may include
a through hole corresponding to the transmission area, and a
portion of the first layer may be in the through hole of the black
matrix.
According to one or more example embodiments, an electronic
apparatus includes a display device including an array of a
plurality of pixels, the plurality of pixels including two pixels
that are apart from each other with a transmission area
therebetween, and a component overlapping at least the transmission
area, wherein the display device includes a display layer including
the plurality of pixels, a bottom metal layer including a through
hole corresponding to the transmission area, an encapsulation
member on the display layer, and an optical functional layer over
the encapsulation member, wherein the optical functional layer
includes a first layer including a first opening, second openings,
and a first slope portion, the first opening corresponding to the
transmission area, the second openings corresponding to each of the
plurality of pixels, and the first slope portion being around the
transmission area, and a second layer on the first layer and having
a refractive index greater than a refractive index of the first
layer.
According to some example embodiments, a lateral surface of the
first slope portion may include a slope surface forward-tapered
with respect to a top surface of a lower layer under the first
layer.
According to some example embodiments, the lower layer may include
an input sensing layer including at least one conductive layer and
an insulating layer, the at least one conductive layer including a
sensing electrode or a trace line.
According to some example embodiments, the first slope portion may
overlap the at least one conductive layer of the input sensing
layer.
According to some example embodiments, the lower layer may include
a reflection prevention layer on the input sensing layer and
including a black matrix and a color filter.
According to some example embodiments, the first slope portion of
the first layer of the optical functional layer may overlap the
black matrix.
According to some example embodiments, the black matrix may include
a through hole corresponding to the transmission area, and a
portion of the first layer may be in the through hole of the black
matrix.
According to some example embodiments, the first layer may further
include a second slope portion located inside the first
opening.
According to some example embodiments, the first slope portion may
be apart from the second slope portion.
According to some example embodiments, an edge of the bottom metal
layer that defines the through hole may be located between the
first slope portion and the second slope portion when viewed in a
direction perpendicular to the substrate.
According to some example embodiments, a first width of the second
slope portion may be less than a second width of the through hole
of the bottom metal layer.
According to some example embodiments, the component may include a
sensor or a camera.
These and/or other aspects and characteristics according to some
example embodiments will become more apparent and more readily
appreciated from the following description of the example
embodiments, the accompanying drawings, and the claims and their
equivalents.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other aspects, features, and characteristics of
certain embodiments of the disclosure will be more apparent from
the following description taken in conjunction with the
accompanying drawings, in which:
FIGS. 1A and 1B are perspective views of an electronic apparatus
including a display device according to some example
embodiments;
FIGS. 2A to 2C are cross-sectional views of a portion of an
electronic apparatus including a display device according to some
example embodiments;
FIGS. 3A and 3B are plan views of a display device according to
some example embodiments;
FIG. 4 is an equivalent circuit diagram of a pixel circuit
connected to an organic light-emitting diode of a display device
according to some example embodiments;
FIG. 5 is a plan view of a portion of a first display area of a
display device according to some example embodiments;
FIGS. 6A to 6C are plan views of a portion of a second display area
of a display device according to some example embodiments;
FIG. 7 is a cross-sectional view of a portion of a display panel of
a display device according to some example embodiments;
FIGS. 8A and 8B are cross-sectional views of a display device
according to some example embodiments;
FIGS. 9A to 9E are plan views of a slope portion of a first layer
of an optical functional layer around a transmission area and a
bottom metal layer in a display device according to some example
embodiments;
FIG. 10 is a cross-sectional view of a portion of a display device
according to some example embodiments;
FIG. 11 is a cross-sectional view of a portion of a display device
according to some example embodiments; and
FIG. 12 is a cross-sectional view of a portion of a display device
according to some example embodiments.
DETAILED DESCRIPTION
Reference will now be made in detail to aspects of some example
embodiments, which are illustrated in the accompanying drawings,
wherein like reference numerals refer to like elements throughout.
In this regard, the present example embodiments may have different
forms and should not be construed as being limited to the
descriptions set forth herein. Accordingly, aspects of some example
embodiments are merely described below, by referring to the
figures, to explain aspects of the present description. As used
herein, the term "and/or" includes any and all combinations of one
or more of the associated listed items. Throughout the disclosure,
the expression "at least one of a, b or c" indicates only a, only
b, only c, both a and b, both a and c, both b and c, all of a, b,
and c, or variations thereof.
Hereinafter, aspects of some example embodiments of the present
disclosure are described in more detail with reference to the
accompanying drawings. When description is made with reference to
the drawings, like reference numerals are used for like or
corresponding elements and repeated descriptions thereof are
omitted.
It will be understood that although the terms "first," "second,"
etc. may be used herein to describe various components, these
components should not be limited by these terms. These components
are only used to distinguish one component from another.
As used herein, the singular forms "a," "an," and "the" are
intended to include the plural forms as well, unless the context
clearly indicates otherwise.
It will be further understood that the terms "comprises" and/or
"comprising" used herein specify the presence of stated features or
components, but do not preclude the presence or addition of one or
more other features or components.
It will be understood that when a layer, region, or component is
referred to as being "formed on," another layer, region, or
component, it can be directly or indirectly formed on the other
layer, region, or component. That is, for example, intervening
layers, regions, or components may be present.
Sizes of elements in the drawings may be exaggerated or reduced for
convenience of explanation. In other words, because sizes and
thicknesses of components in the drawings are arbitrarily
illustrated for convenience of explanation, the following
embodiments are not limited thereto.
When a certain embodiment may be implemented differently, a
specific process order may be performed differently from the
described order. For example, two consecutively described processes
may be performed substantially at the same time or performed in an
order opposite to the described order.
It will be understood that when a layer, region, or component is
referred to as being "connected" to another layer, region, or
component, it may be "directly connected" to the other layer,
region, or component and/or may be "indirectly connected" to the
other layer, region, or component with other layer, region, or
component interposed therebetween. For example, it will be
understood that when a layer, region, or component is referred to
as being "electrically connected" to another layer, region, or
component, it may be "directly electrically connected" to the other
layer, region, or component and/or may be "indirectly electrically
connected" to other layer, region, or component with other layer,
region, or component interposed therebetween.
FIGS. 1A and 1B are perspective views of an electronic apparatus 1
including a display device according to some example
embodiments.
Referring to FIGS. 1A and 1B, the electronic apparatus 1 may
include a display area DA and a non-display area NDA outside the
display area DA. For example, according to some example
embodiments, the non-display area NDA may be located around a
periphery, or outside a footprint of, the display area DA. The
electronic apparatus 1 may display images through an array of a
plurality of pixels two-dimensionally arranged in the display area
DA (e.g., arranged in a matrix across a display surface of the
display area DA). The plurality of pixels may include first pixels
P1 and second pixels P2, the first pixels P1 being arranged in the
first display area DA1, and the second pixels P2 being arranged in
the second display area DA2.
The electronic apparatus 1 may display a first image by using light
emitted from the first pixels P1 arranged in the first display area
DA1 and display a second image by using light emitted from the
second pixels P2 arranged in the second display area DA2. According
to some example embodiments, the first image and the second image
may include one portions of one of images displayed on the display
area DA of the electronic apparatus 1. According to some example
embodiments, the electronic apparatus 1 may display the first image
and the second image that are independent of each other.
The second display area DA2 may include a transmission area TA
located between the second pixels P2. The transmission area TA
includes a region through which light may pass. Pixels are not
arranged in the transmission area TA.
The non-display area NDA includes a region at which images are not
displayed. The non-display area NDA may at least partially surround
the display area DA. For example, the non-display area NDA may
entirely surround the display area DA. A driver, etc. may be
arranged in the non-display area NDA, the driver providing an
electric signal or power to the first pixels P1 and the second
pixels P2. A pad may be arranged in the non-display area NDA, the
pad being a region to which an electronic element or a printed
circuit board, etc. may be electrically connected.
The second display area DA2 may have a circular shape or an
elliptical shape in a plan view as shown in FIG. 1A. Alternatively,
the second display area DA2 may have a polygonal shape such as a
quadrangular shape or a bar type as shown in FIG. 1B.
The second display area DA2 may be arranged inside the first
display area DA1 (see FIG. 1A) or arranged on one side of the first
display area DA1 (see FIG. 1B). As shown in FIG. 1A, the second
display area DA2 may be entirely surrounded by the first display
area DA1. According to some example embodiments, the second display
area DA2 may be partially surrounded by the first display area DA1.
For example, the second display area DA2 may be partially
surrounded by the first display area DA1 while being located at a
corner portion on one side of the first display area DA1.
A ratio of the second display area DA2 to the display area DA may
be less than a ratio of the first display area DA1 to the display
area DA. The electronic apparatus 1 may include one second display
area DA2 as shown in FIG. 1A, or include two or more second display
areas DA2.
The electronic apparatus 1 may include mobile phones, tablet
personal computers (PC), notebook computers, smartwatches or
smartbands worn on a wrist.
FIGS. 2A to 2C are cross-sectional views of a portion of the
electronic apparatus 1 including a display device 1 according to
some example embodiments.
Referring to FIGS. 2A to 2C, the electronic apparatus 1 may include
the display device 10 and a component 20, the component 20
overlapping the display device 10.
The display device 10 may include a substrate 100, a display layer
200, a thin-film encapsulation layer 300A, an input sensing layer
400, an optical functional layer 500, a reflection prevention layer
600, and a window 700, the thin-film encapsulation layer 300A being
on the display layer 200.
The component 20 may be located in the second display area DA2. The
component 20 may include an electronic element that uses light or
sound. For example, an electronic element may include a sensor
measuring a distance such as a proximity sensor, a sensor
recognizing an object or a portion (e.g., a fingerprint, an iris, a
face, etc.) of a user's body, a small lamp outputting light, or an
image sensor (e.g. a camera) capturing an image. The electronic
element that uses light in various wavelengths including visible
light, infrared light, ultraviolet light, etc. An electronic
element that uses sound may use ultrasonic waves or sounds in a
different frequency band. According to some example embodiments,
the component 20 may include sub-components such as a light emitter
and a light receiver. The light emitter and the light receiver may
have an integrated structure, or a pair of light emitter and light
receiver that have physically separated structures may constitute
one component 20.
The substrate 100 may include glass or a polymer resin. In this
case, the polymer resin may include polyethersulfone, polyacrylate,
polyetherimide, polyethylene naphthalate, polyethylene
terephthalate, polyphenylene sulfide, polyarylate, polyimide,
polycarbonate, or cellulose acetate propionate. The substrate 100
including the polymer resin may be flexible, rollable, or bendable.
The substrate 100 may have a multi-layered structure including a
layer including the polymer resin and an inorganic layer (not
shown).
The display layer 200 may be arranged on a front surface of the
substrate 100, and a bottom protective film 175 may be arranged on
a rear surface of the substrate 100. The bottom protective film 175
may be attached to the rear surface of the substrate 100. An
adhesive layer may be arranged between the bottom protective film
175 and the substrate 100. Alternatively, the bottom protective
film 175 may be directly formed on the rear surface of the
substrate 100. In this case, the adhesive layer is not arranged
between the bottom protective film 175 and the substrate 100.
The bottom protective film 175 may support and protect the
substrate 100. The bottom protective film 175 may include an
opening 1750P corresponding to the second display area DA2. The
opening 1750P of the bottom protective film 175 includes a concave
portion formed when a portion of the bottom protective film 175 is
removed in a thickness direction. According to some example
embodiments, the opening 1750P of the bottom protective film 175
may be formed when a portion of the bottom protective film 175 is
entirely removed in a thickness direction. In this case, as shown
in FIGS. 2A and 2C, the opening 1750P may have a through-hole
shape. According to some example embodiments, the opening 1750P may
have a blind-hole shape as shown in FIG. 2B when a portion of the
bottom protective film 175 is partially removed in a thickness
direction.
Because the bottom protective film 175 includes the opening 1750P,
a transmittance of the second display area DA2, for example, a
light transmittance of the transmission area TA may be improved.
The bottom protective film 175 may include an organic insulating
material such as polyethylene terephthalate (PET) or polyimide
(PI).
The display layer 200 may include a plurality of pixels. Each pixel
may include a display element and emit red, green, or blue light.
The display element may include an organic light-emitting diode
OLED. According to some example embodiments, a region of the
organic light-emitting diode OLED in which light is emitted may
correspond to a pixel.
The display layer 200 may include a display element layer, a
circuit layer, and an insulating layer IL, the display element
layer including an organic light-emitting diode OLED, and the
circuit layer including a thin film transistor TFT electrically
connected to the organic light-emitting diode OLED. A thin film
transistor TFT and an organic light-emitting diode OLED may be
arranged in each of the first display area DA1 and the second
display area DA2, the organic light-emitting diode OLED being
electrically connected to the thin film transistor TFT.
The second display area DA2 may include the transmission area TA in
which a thin film transistor TFT and an organic light-emitting
diode OLED are not arranged. The transmission area TA may include a
region through which light emitted from and/or directed to the
component 20 may pass. In the display device 10, a transmittance of
the transmission area TA may be 30% or more, 40% or more, 50% or
more, 60% or more, 70% or more, 75% or more, 80% or more, 85% or
more, or 90% or more.
A bottom metal layer BML may be arranged between the substrate 100
and the display layer 200, for example, between the substrate 100
and the thin film transistor TFT. The bottom metal layer BML may
include a through hole BML-TH through which light emitted from
and/or directed to the component 20 may pass. The through hole
BML-TH of the bottom metal layer BML is located in the transmission
area TA. A portion of the bottom metal layer BML in which the
through hole BML-TH is not formed may prevent light from being
diffracted through a narrow gap of the pixel circuit PC or between
wirings connected to the pixel circuit PC arranged in the second
display area DA2. The bottom metal layer BML may improve the
performance of the thin film transistor TFT. A portion of the
bottom metal layer BML does not exist in the transmission area TA.
For example, the bottom metal layer BML may include a hole(s)
located in the transmission area TA.
The display layer 200 may be sealed by an encapsulation member.
According to some example embodiments, the encapsulation member may
include the thin-film encapsulation layer 300A as shown in FIGS. 2A
and 2B. The thin-film encapsulation layer 300A may include at least
one inorganic encapsulation layer and at least one organic
encapsulation layer. According to some example embodiments, the
thin-film encapsulation layer 300A may include first and second
inorganic encapsulation layers 310 and 330 and an organic
encapsulation layer 320 therebetween.
According to some example embodiments, the encapsulation member may
include an encapsulation substrate 300B as shown in FIG. 2C. The
encapsulation substrate 300B may face the substrate 100 with the
display layer 200 therebetween. There may be a gap between the
encapsulation substrate 300B and the display layer 200. The
encapsulation substrate 300B may include glass. Sealant may be
arranged between the substrate 100 and the encapsulation substrate
300B. The sealant may be arranged in the non-display area NDA
described with reference to FIG. 1A or 1B. The sealant arranged in
the non-display area NDA may prevent penetration of moisture
through a lateral surface of the display area DA while surrounding
the display area DA.
The input sensing layer 400 may obtain coordinate information
corresponding to an external input, for example, a touch event of
an object such as a finger or a stylus pen. The input sensing layer
400 may include a touch electrode and trace lines connected to the
touch electrode. The input sensing layer 400 may sense an external
input by using a mutual capacitive method or a self-capacitive
method.
The input sensing layer 400 may be arranged on the encapsulation
member. Alternatively, the input sensing layer 400 may be formed
separately and then coupled to the encapsulation member through an
adhesive layer such as an optical clear adhesive OCA. According to
some example embodiments, as shown in FIGS. 2A to 2C, the input
sensing layer 400 may be directly formed on the thin-film
encapsulation layer 300A or the encapsulation substrate 300B. In
this case, the adhesive layer may not be arranged between the input
sensing layer 400 and the thin-film encapsulation layer 300A or the
encapsulation substrate 300B.
The optical functional layer 500 may improve a light efficiency.
For example, the optical functional layer 500 may improve a front
light efficiency and/or lateral visibility of light emitted from
the organic light-emitting diode OLED and minimize or prevent
diffraction of light directed to the component 20 through the
transmission area TA.
The reflection prevention layer 600 may reduce reflectivity of
light (external light) incident toward the display device 10 from
the outside.
According to some example embodiments, the reflection prevention
layer 600 may include an optical plate including a retarder and/or
a polarizer. The retarder may include a film-type retarder or a
liquid crystal-type retarder. The retarder may include a .lamda./2
retarder and/or a .lamda./4 retarder. The polarizer may include a
film-type polarizer or a liquid crystal-type polarizer. The
film-type polarizer may include a stretchable synthetic resin film,
and the liquid crystal-type polarizer may include liquid crystals
arranged in a structure or arrangement (e.g., a set or
predetermined arrangement).
According to some example embodiments, as shown in FIG. 2C, the
reflection prevention layer 600 may include a filter plate
including a black matrix and color filters. The filter plate may
include color filters, a black matrix, and an overcoat layer each
arranged for each pixel.
According to some example embodiments, the reflection prevention
layer 600 may include a destructive interference structure. The
destructive interference structure may include a first reflective
layer and a second reflective layer arranged on different layers.
First-reflected light and second-reflected light respectively
reflected by the first reflective layer and the second reflective
layer may be destructively interfered and thus reflectivity of
external light may be reduced.
The window 700 may be arranged on the reflection prevention layer
600 and coupled to the reflection prevention layer 600 by using the
adhesive layer such as an optical clear adhesive OCA. Though it is
shown in FIGS. 2A to 2C that the window 700 is arranged on the
reflection prevention layer 600, the locations of the reflection
prevention layer 600 and the optical functional layer 500 may be
switched to each other according to some example embodiments. In
this case, the window 700 may be coupled to the optical functional
layer 500 by using the adhesive layer such as an optical clear
adhesive OCA. According to some example embodiments, the optical
clear adhesive OCA may be omitted between the window 700 and a
layer (e.g. the reflection prevention layer or the optical
functional layer) under the window 700.
One component 20 may be arranged or a plurality of components 20
may be arranged in the second display area DA2. In the case where
the electronic apparatus 1 includes a plurality of components 20,
the electronic apparatus 1 may include the number of second display
areas DA2 corresponding to the number of components 20. For
example, the electronic apparatus 1 may include the plurality of
second display areas DA2 apart from each other. According to some
example embodiments, the plurality of components 20 may be arranged
in one second display area DA2. For example, the electronic
apparatus 1 may include the bar type-second display area DA2
described with reference to FIG. 1B. The plurality of components 20
may be apart from each other in a lengthwise direction (e.g. an
x-direction of FIG. 1) of the second display area DA2.
Though it is shown in FIGS. 2A to 2C that the display device 10
includes an organic light-emitting diode OLED as a display element,
the display device 10 according to embodiments of the present
disclosure are not limited thereto. According to some example
embodiments, the display device 10 may include inorganic
light-emitting displays including an inorganic material, or quantum
dot light-emitting displays, the inorganic material including micro
light-emitting diodes. For example, an emission layer of a display
element of the display device 10 may include an organic material,
an inorganic material, quantum dots, an organic material and
quantum dots, or an inorganic material and quantum dots.
FIGS. 3A and 3B are plan views of the display device 10 According
to some example embodiments.
Referring to FIGS. 3A and 3B, the display device 10 may include an
array of a plurality of pixels arranged on the substrate 100. The
plurality of pixels may include the first pixels P1 arranged in the
first display area DA1 and the second pixels P2 arranged in the
second display area DA2.
The display area DA includes the first display area DA1 and the
second display area DA2. The area of the first display area DA1 may
be different from the area of the second display area DA2. The area
of the first display area DA1 may be greater than the area of the
second display area DA2.
The first pixels P1 may be two-dimensionally arranged in the first
display area DA1, and the second pixels P2 may be two-dimensionally
arranged in the second display area DA2. The transmission area TA
is arranged in the second display area DA2. The transmission area
TA may be arranged between the second pixels P2 neighboring each
other.
The non-display area NDA may entirely surround the display area DA.
A scan driver, a data driver, etc. may be arranged in the
non-display area NDA. A pad 230 may be arranged in the non-display
area NDA. The pad 230 may neighbor one of the edges of the
substrate 100. The pad 230 may be exposed by not being covered by
an insulating layer and be electrically connected to a flexible
printed circuit board FPCB. The flexible printed circuit board FPCB
may electrically connect a controller to the pad 230 and supply a
signal or power transferred from the controller. According to some
example embodiments, a data driver may be arranged on the flexible
printed circuit board FPCB. To transfer a signal or voltage of the
flexible printed circuit board FPCB to the first pixels P1 or the
second pixels P2, the pad 230 may be connected to a plurality of
wirings.
According to some example embodiments, instead of the flexible
printed circuit board FPCB, an integrated circuit may be arranged
on the pad 230. The integrated circuit may include, for example, a
data driver and may be electrically connected to the pad 230
through an anisotropic conductive film including a conductive
ball.
Each of the first pixel P1 and the second pixel P2 may emit light
having a color (e.g., a set or predetermined color) by using the
organic light-emitting diode OLED (see FIGS. 2A to 2C). Each
organic light-emitting diode OLED may emit, for example, red,
green, or blue light. Each organic light-emitting diode OLED may be
connected to a pixel circuit including a transistor and a
capacitor.
FIG. 4 is an equivalent circuit diagram of a circuit connected to
an organic light-emitting diode OLED of the display device 10
according to some example embodiments.
Referring to FIG. 4, the organic light-emitting diode OLED is
electrically connected to a pixel circuit PC. The pixel circuit PC
may include a first thin film transistor T1, a second thin film
transistor T2, and a storage capacitor Cst.
The second thin film transistor T2 is a switching thin film
transistor, may be connected to a scan line SL and a data line DL,
and may transfer a data voltage (or a data signal Dm) input from a
data line DL to the first thin film transistor T1 based on a
switching voltage (or a switching signal Sn) input from the scan
line SL. A storage capacitor Cst may be connected to a second thin
film transistor T2 and a driving voltage line PL and may store a
voltage corresponding to a difference between a voltage transferred
from the second thin film transistor T2 and a first power voltage
ELVDD supplied to the driving voltage line PL.
The first thin film transistor T1 is a driving thin film
transistor, may be connected to the driving voltage line PL and the
storage capacitor Cst, and may control a driving current flowing
through an organic light-emitting diode OLED from the driving
voltage line PL in response to the voltage stored in the storage
capacitor Cst. The organic light-emitting diode OLED may emit light
having a brightness (e.g., a set or predetermined brightness) by
using the driving current. An opposite electrode (e.g. a cathode)
of the organic light-emitting diode OLED may receive a second power
voltage ELVSS.
Though it is shown in FIG. 4 that a pixel circuit PC includes two
thin film transistors and one storage capacitor, the embodiments
according to the present disclosure are not limited thereto. The
number of thin film transistors and the number of storage
capacitors may be variously changed depending on a design of the
pixel circuit PC. For example, the pixel circuit PC may include
three, four, five or more thin film transistors.
FIG. 5 is a plan view of a portion of the first display area DA1 of
the display device 10 according to some example embodiments.
Referring to FIG. 5, the first pixels P1 are arranged in the first
display area DA1. The first pixels P1 may include a red first pixel
P1r, a green first pixel P1g, and a blue first pixel P1b. According
to some example embodiments, as shown in FIG. 5A, a red first pixel
P1r, a green first pixel P1g, and a blue first pixel P1b may be
arranged in a pentile type-configuration. According to some example
embodiments, a red first pixel P1r, a green first pixel P1g, and a
blue first pixel P1b may be arranged in a stripe
type-configuration.
A red first pixel P1r, a green first pixel P1g, and a blue first
pixel P1b may respectively have different sizes (or widths). For
example, a blue first pixel P1b may be greater than a red first
pixel P1r and a green first pixel P1g. A red first pixel P1r may be
greater than a green first pixel P1g. According to some example
embodiments, a green first pixel P1g may have a rectangular shape
and neighboring green first pixels P1g may extend in different
directions.
FIGS. 6A to 6C are plan views of a portion of the second display
area DA2 of the display device according to some example
embodiments.
Referring to FIGS. 6A to 6C, the second pixels P2 are arranged in
the second display area DA2. The second pixels P2 may include a red
first pixel P1r, a green first pixel P1g, and a blue first pixel
P1b. According to some example embodiments, a red second pixel P2r,
a green second pixel P2g, and a blue second pixel P2b may be
arranged in a pentile type-configuration. According to some example
embodiments, a red second pixel P2r, a green second pixel P2g, and
a blue second pixel P2b may be arranged in a stripe
type-configuration.
The transmission area TA may be arranged to neighbor the second
pixels P2. For example, the transmission area TA may be arranged
between the second pixels P2. The transmission areas TA may be
arranged in a direction oblique to an x-direction and a y-direction
as shown in FIGS. 6A and 6B, or arranged to neighbor each other as
shown in FIG. 6C.
The bottom metal layer BML may be arranged in the second display
area DA2 and may include the through hole BML-TH corresponding to
the transmission area TA. According to some example embodiments,
the through hole BML-TH may have an approximately quadrangular
shape in a plan view as shown in FIG. 6A, have an approximately
circular shape as shown in FIG. 6B, or have an elliptical shape.
According to some example embodiments, the through hole BML-TH may
have a cross shape as shown in FIG. 6C. The through hole BML-TH may
have various shapes.
FIG. 7 is a cross-sectional view of a portion of a display panel of
the display device according to some example embodiments. FIG. 7 is
a cross-sectional view of the display panel of the display device.
The display panel may include the substrate 100, the display layer
200, and the encapsulation member. According to some example
embodiments, FIG. 7 shows the thin-film encapsulation layer 300A as
the encapsulation member.
Referring to FIG. 7, the substrate 100 may have a multi-layered
structure. The substrate 100 may include a first base layer 101, a
first inorganic layer 102, a second base layer 103, and a second
inorganic layer 104 that are sequentially stacked.
Each of the first base layer 101 and the second base layer 103 may
include a polymer resin. The polymer resin may include
polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI),
polyethylene naphthalate (PEN), polyethylene terephthalate (PET),
polyphenylene sulfide (PPS), polyimide (PI), polycarbonate,
cellulose tri acetate (TAC), and cellulose acetate propionate
(CAP). The polymer resin may be transparent.
Each of the first inorganic layer 102 and the second inorganic
layer 104 includes a barrier layer preventing the penetration of
external foreign substances and may include a single layer or a
multi-layer including an inorganic material such as silicon
nitride, silicon oxynitride, and/or silicon oxide.
A buffer layer 111 may reduce or block the penetration of foreign
substances, moisture, or external air from below the substrate 100
and provide a flat surface on the substrate 100. The buffer layer
111 may include an inorganic insulating material such as silicon
oxide, silicon oxynitride, and silicon nitride and have a
single-layered structure or a multi-layered structure including the
above materials.
The bottom metal layer BML may be arranged between the substrate
100 and the buffer layer 111. The bottom metal layer BML may
include the through hole BML-TH corresponding to the transmission
area TA. The bottom metal layer BML may include a metal having
conductivity such as aluminum (Al), platinum (Pt), palladium (Pd),
silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium
(Nd), iridium (Ir), chrome (Cr), lithium (Li), calcium (Ca),
molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper
(Cu).
The bottom metal layer BML may be electrically connected to a
conductive line CL. The conductive line CL may be electrically
connected to a gate electrode, a source electrode, or a drain
electrode of a thin film transistor TFT described below or
electrically connected to one of capacitor plates of a storage
capacitor Cst. Alternatively, the conductive line CL may be
electrically connected to the driving voltage line PL (see FIG. 4).
Through the conductive line CL, the bottom metal layer BML may be
electrically connected to a gate electrode, a source electrode, or
a drain electrode of a thin film transistor TFT, electrically
connected to one of capacitor plates of a storage capacitor Cst, or
electrically connected to the driving voltage line PL. The bottom
metal layer BML connected to the conductive line CL may protect the
thin film transistor TFT from electrostatic discharge or improve
the performance of the thin film transistor TFT.
The pixel circuit PC including the thin film transistor TFT and the
storage capacitor Cst may be arranged on the buffer layer 111. The
thin film transistor TFT may include a semiconductor layer A1, a
gate electrode G1, a source region S1, and a drain region D1, the
gate electrode G1 overlapping a channel region of the semiconductor
layer A1, and the source electrode S1 and the drain electrode D1
being respectively connected to a source region and a drain region
of the semiconductor layer A1. A gate insulating layer 112 may be
arranged between the semiconductor layer A1 and the gate electrode
G1. A first interlayer insulating layer 113 and a second interlayer
insulating layer 115 may be arranged between the gate electrode G1
and the source electrode S1 or between the gate electrode G1 and
the drain electrode D1.
The storage capacitor Cst may overlap the thin film transistor TFT.
The storage capacitor Cst may include a first capacitor plate CE1
and a second capacitor plate CE2 overlapping each other. According
to some example embodiments, the gate electrode G1 of the thin film
transistor TFT may include the first capacitor plate CE1 of the
storage capacitor Cst. The first interlayer insulating layer 113
may be arranged between the first capacitor plate CE1 and the
second capacitor plate CE2.
The semiconductor layer A1 may include polycrystalline silicon.
According to some example embodiments, the semiconductor layer A1
may include amorphous silicon. According to some example
embodiments, the semiconductor layer A1 may include an oxide of at
least one of indium (In), gallium (Ga), stannum (Sn), zirconium
(Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge),
chromium (Cr), titanium (Ti), or zinc (Zn). The semiconductor layer
A1 may include a channel region, a source region, and a drain
region, the source region and the drain region being doped with
impurities.
The gate insulating layer 112 may include an inorganic insulating
material such as silicon oxide, silicon oxynitride, and silicon
nitride and have a single-layered structure or a multi-layered
structure including the above materials.
The gate electrode G1 or the first capacitor plate CE1 may include
a low-resistance conductive material such as molybdenum (Mo),
aluminum (Al), copper (Cu), and/or titanium (Ti) and have a
single-layered structure or a multi-layered structure including the
above materials.
The first interlayer insulating layer 113 may include an inorganic
insulating material such as silicon oxide, silicon oxynitride, and
silicon nitride and have a single-layered structure or a
multi-layered structure including the above materials.
The second capacitor plate CE2 may include aluminum (Al), platinum
(Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au),
nickel (Ni), neodymium (Nd), iridium (Ir), chrome (Cr), lithium
(Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W),
and/or copper (Cu) and have a single-layered structure or a
multi-layered structure including the above materials.
The second interlayer insulating layer 115 may include an inorganic
insulating material such as silicon oxide, silicon oxynitride, and
silicon nitride and have a single-layered structure or a
multi-layered structure including the above materials.
The source electrode S1 or the drain electrode D1 includes aluminum
(Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg),
gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chrome (Cr),
calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or
copper (Cu) and have a single-layered structure or a multi-layered
structure including the above materials. For example, the source
electrode S1 or the drain electrode D1 may have a three-layered
structure of a titanium layer/aluminum layer/titanium layer.
A planarization insulating layer 117 may include a material
different from that of at least one inorganic insulating layer IOL
thereunder, for example, the gate insulating layer 112, the first
interlayer insulating layer 113, and the second interlayer
insulating layer 115. The planarization insulating layer 117 may
include an organic insulating material such as acryl,
benzocyclobutene (BCB), polyimide, or hexamethyldisiloxane
(HMDSO).
A pixel electrode 221 may be arranged on the planarization
insulating layer 117. The pixel electrode 221 may be electrically
connected to the thin film transistor TFT through a contact hole
formed in the planarization insulating layer 117.
The pixel electrode 221 may include a reflective layer including
silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt),
palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium
(Ir), chrome (Cr), or a compound thereof. The pixel electrode 221
may include a reflective layer including the above material and a
transparent conductive layer on and/or under the reflective layer.
The transparent conductive layer may include indium tin oxide
(ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide
(In.sub.2O.sub.3), indium gallium oxide (IGO), or aluminum zinc
oxide (AZO). According to some example embodiments, the pixel
electrode 221 may have a three-layered structure of an ITO layer/an
Ag layer/an ITO layer that are sequentially stacked.
A pixel-defining layer 119 may cover the edges of the pixel
electrode 221 and include a through hole 119TH exposing the center
of the pixel electrode 221. The pixel-defining layer 119 may
include an organic insulating material such as benzocyclobutene
(BCB), polyimide, or hexamethyldisiloxane (HMDSO). The through hole
119TH of the pixel-defining layer 119 may define an emission area
EA. Red, green, or blue light may be emitted through the emission
area EA. The area or width of the emission area EA may define the
area or width of a pixel.
A spacer 121 may be formed on the pixel-defining layer 119. The
spacer 121 may prevent layers under the spacer 121 from being
damaged by a mask during a process of forming an intermediate layer
222 described below. The spacer 121 may include the same material
as that of the pixel-defining layer 119.
The intermediate layer 222 may include an emission layer 222b
overlapping the pixel electrode 221. The emission layer 222b may
include an organic material. The emission layer 222b may include a
polymer organic material or a low molecular weight organic material
emitting light having a color (e.g., a set or predetermined color).
The emission layer 222b may be formed through a deposition process
that uses the mask as described above.
A first functional layer 222a and a second functional layer 222c
may be respectively arranged under and/or on the emission layer
222b.
The first functional layer 222a may include a single layer or a
multi-layer. For example, in the case where the first functional
layer 222a includes a polymer material, the first functional layer
222a may include a hole transport layer (HTL), which has a
single-layered structure, and include
poly(3,4-ethylenedioxythiophene) (PEDOT) or polyaniline (PANI). In
the case where the first functional layer 222a includes a low
molecular weight material, the first functional layer 222a may
include a hole injection layer (HIL) and a hole transport layer
(HTL).
The second functional layer 222c may be omitted. For example, in
the case where the first functional layer 222a and the emission
layer 222b include a polymer material, according to some example
embodiments, the second functional layer 222c may be formed. The
second functional layer 222c may include a single layer or a
multi-layer. The second functional layer 222c may include an
electronic transport layer (ETL) and/or an electron injection layer
(EIL).
Each of the first functional layer 222a and the second functional
layer 222c may be formed as one body to entirely cover the display
area. As shown in FIG. 7, the first functional layer 222a and the
second functional layer 222c may be formed as one body over the
display area.
An opposite electrode 223 may include a conductive material having
a relatively small work function. For example, the opposite
electrode 223 may include a (semi) transparent layer including
silver (Ag), magnesium (Mg), aluminum (Al), nickel (Ni), chromium
(Cr), lithium (Li), calcium (Ca), or an alloy thereof.
Alternatively, the opposite electrode 223 may further include a
layer including ITO, IZO, ZnO, or In.sub.2O.sub.3 on the (semi)
transparent layer including the above material. According to some
example embodiments, the opposite electrode 223 may include silver
(Ag) and magnesium (Mg). The opposite electrode 223 may include a
fourth hole 223H located in the transmission area TA and be formed
as one body over the display area.
A stacked structure of the pixel electrode 221, the intermediate
layer 222, and the opposite electrode 223 that are sequentially
stacked may constitute a light-emitting diode, for example, an
organic light-emitting diode OLED. The display layer 200 may be
covered by the thin-film encapsulation layer 300A, the display
layer 200 including insulating layers and the organic
light-emitting diode.
The thin-film encapsulation layer 300A may include the first and
second inorganic encapsulation layers 310 and 330 and the organic
encapsulation layer 320 therebetween.
The first and second inorganic encapsulation layers 310 and 330 may
include one or more inorganic insulating materials. The inorganic
insulating material may include aluminum oxide, titanium oxide,
tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon
nitride, and/or silicon oxynitride. The first and second inorganic
encapsulation layers 310 and 330 may be formed by chemical vapor
deposition.
The organic encapsulation layer 320 may include a polymer-based
material. The polymer-based material may include an acryl-based
resin, an epoxy-based resin, polyimide, and polyethylene. For
example, the organic encapsulation layer 320 may include an acrylic
resin, for example, polymethylmethacrylate, poly acrylic acid, etc.
The organic encapsulation layer 320 may be formed by hardening a
monomer or coating a polymer.
Because the second display area DA2 includes the transmission area
TA, it is shown in FIG. 7 that two pixel circuits PC and two
organic light-emitting diodes OLED neighbor each other with the
transmission area TA therebetween.
Insulating layers on the substrate 100, for example, at least one
of inorganic insulating layer ILO, the planarization insulating
layer 117, or the pixel-defining layer 119 may include a hole
corresponding to the transmission area TA. The at least one
inorganic insulating layer ILO may include at least one of the gate
insulating layer 112, the first interlayer insulating layer 113, or
the second interlayer insulating layer 115.
A first hole IOL-H of the at least one inorganic insulating layer
ILO, a second hole 117H of the planarization insulating layer 117,
or a third hole 119H of the pixel-defining layer 119 may overlap
each other in the transmission area TA. The opposite electrode 223
may include the fourth hole 223H located in the transmission area
TA. The fourth hole 223H may overlap the first hole IOL-H, the
second hole 117H, and the third hole 119H. The first hole IOL-H may
have the shape of a through hole passing through a stacked body of
the gate insulating layer 112, the first interlayer insulating
layer 113, and the second interlayer insulating layer 115 or have
the shape of a blind hole formed by removing a portion of the
stacked body in a thickness direction of the stacked body. The
second hole 117H, the third hole 119H, and the fourth hole 223H
each may have the shape of a through hole.
Some of the insulating layers, for example, the buffer layer 111
and the second inorganic layer 104 may not include a hole located
in the transmission area TA. For example, as shown in FIG. 7, the
buffer layer 111 and the second inorganic layer 104 may cover the
transmission area TA. According to some example embodiments, the
buffer layer 111 and/or the second inorganic layer 104 may include
a hole located in the transmission area TA.
The sizes or widths of the first hole IOL-H, the second hole 117H,
the third hole 119H, and the fourth hole 223H may be different from
each other. Though it is shown in FIG. 7 that the width of the
first hole IOL-H is substantially the same as the width of the
through hole BML-TH of the bottom metal layer BML, the embodiments
according to the present disclosure are not limited thereto.
According to some example embodiments, the width of the first hole
IOL-H may be greater or less than the width of the through hole
BML-TH of the bottom metal layer BML.
Though it is shown in FIG. 7 that the thin-film encapsulation layer
300A is arranged on the organic light-emitting diode OLED, the
encapsulation substrate 300B (see FIG. 2C) may be arranged on the
organic light-emitting diode OLED according to some example
embodiments. FIG. 7 describes a cross-sectional structure of the
second display area DA2, the organic light-emitting diode and the
pixel circuit may be arranged for every first pixel of the first
display area DA1, the pixel circuit being connected to the organic
light-emitting diode. The relevant structure may be the same as the
structure of the organic light-emitting diode OLED and the pixel
circuit PC described with reference to FIG. 7.
FIGS. 8A and 8B are cross-sectional views of the display device
according to some example embodiments. FIGS. 8A and 8B show a
cross-sectional structure of the display device in the second
display area DA2.
Referring to FIGS. 8A and 8B, the structure of the substrate 100,
the display layer 200, and the thin-film encapsulation layer 300A
is the same as that described above with reference to FIG. 7.
Hereinafter, a structure on the thin-film encapsulation layer 300A
is described.
The input sensing layer 400 may include a first conductive layer
MTL1 and a second conductive layer MTL2 each including a sensing
electrode and/or a trace line, etc. An organic insulating layer 410
may be arranged between the thin-film encapsulation layer 300A and
the first conductive layer MTL1. A second insulating layer 420 may
be arranged between the first conductive layer MTL1 and the second
conductive layer MTL2.
The first conductive layer MTL1 and the second conductive layer
MTL2 may include a conductive material. The conductive material may
include molybdenum (Mo), aluminum (Al), copper (Cu), and titanium
(Ti) and include a single layer or a multi-layer including the
above materials. According to some example embodiments, the first
conductive layer MTL1 and the second conductive layer MTL2 may have
a structure of Ti/Al/Ti in which a titanium layer, an aluminum
layer, and a titanium layer are sequentially stacked.
The organic insulating layer 410 and the second insulating layer
420 may include an inorganic insulating material and/or an organic
insulating material. The inorganic insulating material may include
silicon oxide, silicon nitride, and silicon oxynitride. The organic
insulating material may include an acrylic-based organic material
and an imide-based organic material.
The optical functional layer 500 may include a first layer 510 and
a second layer 520 on the first layer 510. The first layer 510 may
include an insulating material having a first refractive index, and
the second layer 520 may include an insulating material having a
second refractive index greater than the first refractive
index.
The first refractive index of the first layer 510 may be in the
range, for example, from about 1.3 to about 1.6. According to some
example embodiments, the first refractive index of the first layer
510 may be in the range, for example, from about 1.4 to about 1.55.
For example, the first layer 510 may include an acryl-based organic
material having a refractive index of about 1.5. The first layer
510 may include (ethyl)exyl acrylate, pentafluoropropyl acrylate,
poly(ethylene glycol) dimethacrylate, or ethylene glycol
dimethacrylate.
The first layer 510 may include a first opening 510OP1 and a second
opening 510OP2. the first opening 510OP1 overlapping the
transmission area TA, and the second opening 510OP2 overlapping the
emission area EA. According to some example embodiments, as
described in FIGS. 6A to 6B, the display device may include a
plurality of transmission areas TA, and first openings 510OP1 each
overlaps corresponding transmission area TA. The first layer 510
may includes a plurality of second openings 510OP2 each overlapping
a corresponding emission area EA (or pixel). A slope portion 510P
may be arranged near each of the first opening 510OP1 and the
second opening 510OP2. The slope portion 510P may include a
material of the first layer 510 and have a shape relatively further
protruding upward than the first opening 510OP1 and the second
opening 510OP2. A lateral surface of the slope portion 510P may
include a forward-tapered slope surface. For example, a lateral
surface of the slope portion 510P may include a tapered slope
surface having an acute angle with respect to a layer thereunder,
for example, a top surface of the input sensing layer 400 or a top
surface of the thin-film encapsulation layer 300A.
The first layer 510 may include a protective layer that passivates
a conductive layer of the input sensing layer 400, for example, the
second conductive layer MTL2. For example, the slope portion 510P
may overlap the second conductive layer MTL2 and cover the second
conductive layer MTL2.
The first opening 510OP1 and the second opening 510OP2 of the first
layer 510 may have the shape of a through hole as shown in FIG. 8A,
or have the shape of a blind hole as shown in FIG. 8B. In the
present specification, the opening of the first layer 510 denotes a
concave portion of the first layer 510 formed while a portion of
the first layer 510 is removed in a thickness direction of the
first layer 510. The opening of the first layer 510 may have the
shape of a through hole formed while a portion of the first layer
510 is entirely removed in the thickness direction of the first
layer 510, or have the shape of a blind hole formed while a portion
of the first layer 510 is partially removed in the thickness
direction of the first layer 510. According to some example
embodiments, the first opening 510OP1 and the second opening 510OP2
may have the shape of a through hole having substantially the same
depth as the thickness of the first layer 510 while a portion of
the first layer 510 is entirely removed in the thickness direction
of the first layer 510 (see FIG. 8A). According to some example
embodiments, the first opening 510OP1 and the second opening 510OP2
may have the shape of a through hole having a depth less than the
thickness of the first layer 510 while a portion of the first layer
510 is partially removed in the thickness direction of the first
layer 510 (see FIG. 8B).
The second layer 520 may include a planarization layer having a
second refractive index. The second refractive index of the second
layer 520 may be in the range from about 1.65 to about 1.85. The
second layer 520 may include at least one of an acryl-based organic
material or a siloxane-based organic material. According to some
example embodiments, the second layer 520 may include
polydiarylsiloxane, methyltrimethoxysilane, or
tetramethoxysilane.
The second layer 520 may be formed right on the first layer 510.
Therefore, the second layer 520 may directly contact the first
layer 510. Some portions of the second layer 520 may respectively
exist in the first opening 510OP1 and the second opening 510OP2 and
contact a layer thereunder, for example, the input sensing layer
400.
Because the slope portion 510P of the first layer 510 is arranged
near the transmission area TA, light progressing toward the
substrate 100, for example, the component 20 (see FIG. 7) from the
outside may progress along a path "A". As a comparative example, in
the case where the first layer 510 does not include the first
opening 510OP1, light progressing toward the component 20 in a
direction (e.g. a (-) z-direction) perpendicular to the substrate
100 from the outside may be diffracted near an edge defining the
through hole BML-TH of the bottom metal layer BML. The diffracted
light may be incident to the component 20. Because the diffracted
light includes a kind of noise, the component 20 may have distorted
information. According to some example embodiments, in the case
where the component 20 includes a camera including an image sensor,
an image captured by the camera may be different from an actual
image.
However, according to some example embodiments, because the optical
functional layer 500 has the above-described structure, light
progressing toward the substrate 100 from the outside progresses
along the path "A" and accordingly the diffraction by the bottom
metal layer BML itself may be prevented or minimized.
The slope portion 510P of the first layer 510 may be arranged near
the emission area EA. Light emitted from the organic light-emitting
diode OLED may progress along a path "B". Therefore, a light
efficiency of the display device, for example, a front light
efficiency and/or a lateral light efficiency may be improved.
The reflection prevention layer 600 may be arranged on the optical
functional layer 500. According to some example embodiments, the
reflection prevention layer 600 may include an optical plate
including a retarder and/or a polarizer. Alternatively, a
reflection prevention structure having various embodiment forms as
described with reference to FIG. 2A may be provided. The window 700
may be arranged on the reflection prevention layer 600. An adhesive
layer such as an optical clear adhesive OCA may be arranged
therebetween as described above.
FIGS. 9A to 9E are plan views of a slope portion of the first layer
of the optical functional layer around the transmission area TA and
the bottom metal layer BML in the display device according to some
example embodiments.
Referring to FIGS. 9A and 9B, the transmission area TA may be
entirely surrounded by the slope portion 510P of the first layer of
the optical functional layer. An inner surface of the slope portion
510P includes a region in which the first opening 510OP1 is
located. The first opening 510OP1 may be entirely surrounded by the
slope portion 510P.
The first opening 510OP1 may overlap the through hole BML-TH of the
bottom metal layer BML. According to some example embodiments, the
size or width of the first opening 510OP1 may be greater than the
size or width of the through hole BML-TH of the bottom metal layer
BML as shown in FIG. 9A. According to some example embodiments, the
size or width of the first opening 510OP1 may be less than the size
or width of the through hole BML-TH of the bottom metal layer BML
as shown in FIG. 9B. In this case, the slope portion 510P of the
first layer may partially overlap the edge of the through hole
BML-TH of the bottom metal layer BML in a plan view.
Though it is shown in FIGS. 9A and 9B that the transmission area TA
is entirely surrounded by the slope portion 510P, the slope portion
510P may include a plurality of sub-portions 510Ps apart from each
other along a periphery of the transmission area TA in a plan view
as shown in FIGS. 9C to 9E.
The slope portion 510P may include the plurality of sub-portions
510Ps apart from each other along the edge of the transmission area
TA. Each sub-portion 510Ps may have a circular shape as shown in
FIG. 9C, a quadrangular shape as shown in FIG. 9D, or a shape
having a concave or convex portion as shown in FIG. 9E. According
to some example embodiments, neighboring sub-portions 510Ps may
extend or be tilted in different directions as shown in FIG. 9D. In
the case where the slope portions 510P are tilted in various
directions and/or have an irregular shape, light progressing toward
the component 20 (see FIG. 7) from the outside may be more
effectively prevented from being diffracted near the through hole
BML-TH of the bottom metal layer BML.
Though it is shown in FIGS. 9C to 9E that the sub-portion 510Ps
overlaps the edge of the through hole BML-TH and the bottom metal
layer BML that defines the through hole BML-TH, the sub-portion
510Ps may overlap only a metal portion of the bottom metal layer
BML and may not overlap the through hole BML-TH as shown in FIG. 9A
according to some example embodiments. For example, the sub-portion
510Ps may be arranged along the edge of the through hole BML-TH at
the outer side of the through hole BML-TH of the bottom metal layer
BML.
FIG. 10 is a cross-sectional view of a portion of the display
device according to some example embodiments. FIG. 10 shows a
cross-sectional structure of the second display area DA2 in the
display device.
Referring to FIG. 10, the structures of the substrate 100, the
display layer 200, and the thin-film encapsulation layer 300A are
the same as those described above with reference to FIG. 7. The
structure of the optical functional layer 500 may include all the
characteristics described above with reference to FIG. 8.
The first layer 510 of the optical functional layer 500 may include
the first opening 510OP1 and the second opening 510OP2, the first
opening 510OP1 being located in the transmission area TA, and the
second opening 510OP2 being located in the emission area EA. The
slope portion 510P may be arranged around the first opening 510OP1
and the second opening 510OP2. In addition, the first layer 510 may
further include an additional slope portion 510P2 inside the first
opening 510OP1. Hereinafter, for convenience of description, the
slope portion 510P is referred to as a first slope portion, and the
additional slope portion 510P2 is referred to as a second slope
portion.
The second slope portion 510P2 includes the same material as that
of the first slope portion 510P and may be formed during the same
process as a process of forming the first slope portion 510P. The
second slope portion 510P2 may be apart from the first slope
portion 510P. According to some example embodiments, a first width
W1 of the second slope portion 510P2 may be less than a second
width W2 of the through hole BML-TH of the bottom metal layer BML.
The edge of the bottom metal layer BML that defines the through
hole BML-TH may overlap the first opening 510OP1. For example, a
portion of the first opening 510OP1 may be located on a virtual
vertical line VL passing through the edge of the bottom metal layer
BML that defines the through hole BML-TH. In other words, the edge
of the bottom metal layer BML that defines the through hole BML-TH
may be located between the first slope portion 510P and the second
slope portion 510P2 in a plan view (when viewed in a direction
perpendicular to the substrate 100).
The second layer 520 of the optical functional layer 500 may
entirely cover the first slope portion 510P and the second slope
portion 510P2. There may be a portion of the second layer 520 in
the first opening 510OP1 and the second opening 510OP2.
A structure of the first slope portion 510P of the first layer 510
may have the same characteristics as those described above with
reference to FIGS. 9A to 9E. Though it is shown in FIG. 10 that the
first opening 510OP1 and the second opening 510OP2 have the shape
of a through hole, the first opening 510OP1 and the second opening
510OP2 may have the shape of a blind hole according to some example
embodiments. Though FIG. 10 shows the thin-film encapsulation layer
300A as an encapsulation member, the encapsulation member may
include an encapsulation substrate according to some example
embodiments.
FIG. 11 is a cross-sectional view of a portion of the display
device according to some example embodiments. FIG. 11 shows a
cross-sectional structure of the second display area DA2 in the
display device.
Referring to FIG. 11, the structures of the substrate 100, the
display layer 200, the thin-film encapsulation layer 300A, and the
input sensing layer 400 are the same as those described above with
reference to FIG. 7. According to some example embodiments, as
shown in FIG. 11, the optical functional layer 500 may be arranged
on a reflection prevention layer 600'.
The reflection prevention layer 600' may include a black matrix (or
light blocking layer) 610 and a color filter 620. The color filter
620 may be arranged in the emission area EA of the organic
light-emitting diode OLED. The color filter 620 may include red,
green, or blue pigment or dye depending on the color of light
emitted from the organic light-emitting diode OLED.
The black matrix 610 may be located in a non-emission area and may
surround the emission area EA. The black matrix 610 may include a
through hole 610TH located in the transmission area TA. According
to some example embodiments, the black matrix 610 may passivate a
touch electrode of the input sensing layer 400. For example, as
shown in FIG. 11, the second conductive layer MTL2 of the input
sensing layer 400 including the touch electrode may overlap the
black matrix 610 and be covered by the black matrix 610. The black
matrix 610 may include an insulating material (e.g. an organic
insulating material) including pigment or dye having a black
color.
The optical functional layer 500 may include the first layer 510
and the second layer 520, the first layer 510 having the first
refractive index, and the second layer 520 having the second
refractive index. The second refractive index may be greater than
the first refractive index.
The first refractive index of the first layer 510 may be in the
range, for example, from about 1.3 to about 1.6. According to some
example embodiments, the first refractive index of the first layer
510 may be in the range, for example, from about 1.4 to about 1.55.
For example, the first layer 510 may include an acryl-based organic
material having a refractive index of about 1.5. The first layer
510 may include (ethyl)exyl acrylate, pentafluoropropyl acrylate,
poly(ethylene glycol) dimethacrylate, or ethylene glycol
dimethacrylate.
The first layer 510 may include the first opening 510OP1 and the
second opening 510OP2, the first opening 510OP1 overlapping the
transmission area TA, and the second opening 510OP2 overlapping the
emission area EA. The slope portion 510P may be arranged near each
of the first opening 510OP1 and the second opening 510OP2, the
slope portion 510P including a material of the first layer 510.
According to some example embodiments, a lateral surface of the
slope portion 510P may include a forward-tapered slope surface. For
example, a lateral surface of the slope portion 510P may include a
slope surface having an acute angle with respect to a top surface
of a layer thereunder, for example, a top surface of the reflection
prevention layer 600', a top surface of the input sensing layer
400, or a top surface of the thin-film encapsulation layer
300A.
The slope portion 510P may overlap a conductive layer of the input
sensing layer 400, for example, the second conductive layer MTL2.
The slope portion 510P may overlap the black matrix 610 on the
second conductive layer MTL2.
The first opening 510OP1 and the second opening 510OP2 of the first
layer 510 may have the shape of a blind hole as shown in FIG. 11.
There may be a portion of the first layer 510 in the through hole
610TH of the black matrix 610.
The second layer 520 may include a planarization layer having the
second refractive index. The second refractive index of the second
layer 520 may be in the range from about 1.65 to about 1.85. The
second layer 520 may include at least one of an acryl-based organic
material or a siloxane-based organic material. According to some
example embodiments, the second layer 520 may include
polydiarylsiloxane, methyltrimethoxysilane, or
tetramethoxysilane.
The second layer 520 may be formed right on the first layer 510.
Therefore, the second layer 520 may directly contact the first
layer 510. Some portions of the second layer 520 may respectively
exist in the first opening 510OP1 and the second opening 510OP2 and
contact a layer thereunder, for example, the input sensing layer
400.
The window 700 may be arranged on the optical functional layer 500.
An adhesive layer such as an optical clear adhesive OCA may be
arranged therebetween.
Though it is described in FIG. 11 that the first opening 510OP1 and
the second opening 510OP2 of the first layer 510 have the shape of
a blind hole, the first opening 510OP1 and the second opening
510OP2 may have the shape of a through hole according to some
example embodiments. In this case, there may be a portion of the
second layer 520 in the through hole 610TH of the black matrix 610.
The slope portion 510P of the first layer 510 may have various
shapes in a plan view as described with reference to FIGS. 9A to
9E. Though FIG. 11 shows the thin-film encapsulation layer 300A as
the encapsulation member, the encapsulation member may include an
encapsulation substrate according to some example embodiments.
FIG. 12 is a cross-sectional view of a portion of the display
device according to some example embodiments.
Referring to FIG. 12, the structures of the substrate 100, the
display layer 200, and the thin-film encapsulation layer 300A are
the same as those described above with reference to FIG. 7 or 8A.
The structures of the optical functional layer 500 and the
reflection prevention layer 600' may include all the
characteristics described above with reference to FIG. 11.
The first layer 510 of the optical functional layer 500 may include
the first opening 510OP1 and the second opening 510OP2, the first
opening 510OP1 being located in the transmission area TA, and the
second opening 510OP2 being located in the emission area EA. The
slope portion 510P (the first slope portion) may be arranged around
the first opening 510OP1 and the second opening 510OP2. In
addition, the first layer 510 may further include the additional
slope portion 510P2 (the second slope portion) inside the first
opening 510OP1.
The second slope portion 510P2 includes the same material as that
of the first slope portion 510P and may be formed during the same
process as a process of forming the first slope portion 510P. The
second slope portion 510P2 may be apart from the first slope
portion 510P. According to some example embodiments, the first
width W1 of the second slope portion 510P2 may be less than the
second width W2 of the through hole BML-TH of the bottom metal
layer BML. The edge of the bottom metal layer BML that defines the
through hole BML-TH may overlap the first opening 510OP1. For
example, as described in FIG. 10, a portion of the first opening
510OP1 may be located on a virtual vertical line VL (FIG. 10)
passing through the edge of the bottom metal layer BML that defines
the through hole BML-TH. In other words, the edge of the bottom
metal layer BML that defines the through hole BML-TH may be located
between the first slope portion 510P and the second slope portion
510P2 in a plan view (when viewed in a direction perpendicular to
the substrate 100).
The second layer 520 may entirely cover the first slope portion
510P and the second slope portion 510P2. There may be a portion of
the second layer 520 in the first opening 510OP1 and the second
opening 510OP2.
The first slope portion 510P of the first layer 510 may have the
same characteristics as those described above with reference to
FIGS. 9A to 9E. Though it is shown in FIG. 12 that the first
opening 510OP1 and the second opening 510OP2 have the shape of a
blind hole, the first opening 510OP1 and the second opening 510OP2
may have the shape of a through hole according to some example
embodiments. Though FIG. 12 shows the thin-film encapsulation layer
300A as the encapsulation member, the encapsulation member may
include an encapsulation substrate according to some example
embodiments.
The embodiments may provide a display panel which may display
high-quality images and prevent the diffraction of light received
by a component. This effect is provided as an example and the scope
of embodiments according to the present disclosure are not limited
by this effect.
It should be understood that embodiments described herein should be
considered in a descriptive sense only and not for purposes of
limitation. Descriptions of features or aspects within each
embodiment should typically be considered as available for other
similar features or aspects in other embodiments. While one or more
embodiments have been described with reference to the figures, it
will be understood by those of ordinary skill in the art that
various changes in form and details may be made therein without
departing from the spirit and scope as defined by the following
claims and their equivalents.
* * * * *