U.S. patent number 11,165,047 [Application Number 16/812,350] was granted by the patent office on 2021-11-02 for display device and method of manufacturing the same.
This patent grant is currently assigned to Samsung Display Co., Ltd.. The grantee listed for this patent is Samsung Display Co., LTD.. Invention is credited to Hyun Kim, Sun Ho Kim, Sun Hee Lee.
United States Patent |
11,165,047 |
Kim , et al. |
November 2, 2021 |
Display device and method of manufacturing the same
Abstract
A display device including a display area and a non-display
area, a substrate including a through hole in the display area, an
element layer including an anode disposed on the substrate, a light
emitting layer disposed on the anode, and a cathode disposed on the
light emitting layer, and a thin-film encapsulation layer including
a first inorganic layer disposed on the element layer, an organic
layer disposed on the first inorganic layer, and a second inorganic
layer disposed on the organic layer, in which the first inorganic
layer includes a plurality of first refractors having a first
inclination angle.
Inventors: |
Kim; Hyun (Seoul,
KR), Kim; Sun Ho (Seongnam-si, KR), Lee;
Sun Hee (Hwaseong-si, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., LTD. |
Yongin-si |
N/A |
KR |
|
|
Assignee: |
Samsung Display Co., Ltd.
(Yongin-si, KR)
|
Family
ID: |
1000005908149 |
Appl.
No.: |
16/812,350 |
Filed: |
March 8, 2020 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200303684 A1 |
Sep 24, 2020 |
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Foreign Application Priority Data
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Mar 22, 2019 [KR] |
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10-2019-0033217 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
51/0096 (20130101); H01L 27/323 (20130101); H01L
27/3244 (20130101); H01L 51/5275 (20130101); H01L
51/56 (20130101); H01L 51/5253 (20130101); G06F
3/0445 (20190501); H01L 2227/323 (20130101); G06F
3/0446 (20190501) |
Current International
Class: |
H01L
51/52 (20060101); H01L 27/32 (20060101); H01L
51/00 (20060101); H01L 51/56 (20060101); G06F
3/044 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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10-2017-0111827 |
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Oct 2017 |
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KR |
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Primary Examiner: Warren; Matthew E
Attorney, Agent or Firm: H.C. Park & Associates, PLC
Claims
What is claimed is:
1. A display device comprising: a display area and a non-display
area; a substrate including a through hole in the display area; an
element layer including an anode disposed on the substrate, a light
emitting layer disposed on the anode, and a cathode disposed on the
light emitting layer; and a thin-film encapsulation layer including
a first inorganic layer disposed on the element layer, an organic
layer disposed on the first inorganic layer, and a second inorganic
layer disposed on the organic layer, wherein the first inorganic
layer includes a plurality of first refractors having a first
inclination angle.
2. The display device of claim 1, wherein the first refractors are
disposed on the cathode.
3. The display device of claim 2, wherein the first inclination
angle defines a degree of inclination with respect to an imaginary
line substantially perpendicular to an upper surface of the
cathode.
4. The display device of claim 2, wherein a path of light emitted
from the light emitting layer is configured to be refracted to the
greater extent as the first inclination angle increases.
5. The display device of claim 1, wherein the first inorganic layer
further includes a plurality of first voids formed between the
first refractors.
6. The display device of claim 5, wherein at least a portion of the
first voids are filled with the organic layer.
7. The display device of claim 1, wherein the non-display area
includes a hole peripheral area along a rim of the through
hole.
8. The display device of claim 7, wherein: the non-display area
further includes a peripheral area; and the light emitting layer
has a first light emitting area and a second light emitting area
disposed in the display area, and a third light emitting area
disposed in the peripheral area.
9. The display device of claim 8, wherein light emitted from the
first light emitting area is configured to pass through the first
refractors and travel to a first virtual light emitting area
overlapping the through hole.
10. The display device of claim 8, wherein light emitted from the
second light emitting area is configured to pass through the first
refractors and travel to a second virtual light emitting area
overlapping the hole peripheral area.
11. The display device of claim 8, wherein light emitted from the
third light emitting area is configured to pass through the first
refractors and travel to a third virtual light emitting area
overlapping the display area.
12. The display device of claim 1, wherein the second inorganic
layer includes second refractors having a second inclination
angle.
13. The display device of claim 12, wherein the second inclination
angle is the same as the first inclination angle.
14. The display device of claim 12, wherein the second inclination
angle is greater than the first inclination angle.
15. The display device of claim 12, further comprising a third
inorganic layer disposed on the second inorganic layer.
16. The display device of claim 15, wherein the second inorganic
layer includes a plurality of second voids formed between the
second refractors.
17. The display device of claim 16, wherein at least a portion of
the second voids are filled with the third inorganic layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority from and the benefit of Korean
Patent Application No. 10-2019-0033217, filed on Mar. 22, 2019,
which is hereby incorporated by reference for all purposes as if
fully set forth herein.
BACKGROUND
Field
Exemplary embodiments of the invention relate generally to a
display device and a method of manufacturing the same.
Discussion of the Background
Display devices are becoming increasingly important with the
development of multimedia. Accordingly, various types of display
devices, such as liquid crystal displays (LCDs) and organic light
emitting displays (OLEDs), are being used. Among these display
devices, OLEDs, which are self-light emitting devices, are drawing
attention as next-generation display devices due to their excellent
viewing angle.
With the usage of display devices in various electronic devices,
there is a growing demand for a technology that, in designing the
shape of a display device, increases the proportion of a display
area where an image is provided and reduces the proportion of a
peripheral area where relatively no image is provided. A display
device may include, in a display area, a hole in which an
electronic element, such as a camera, a photo-sensing element, a
heat sensing element, etc. is disposed.
The above information disclosed in this Background section is only
for understanding of the background of the inventive concepts, and,
therefore, it may contain information that does not constitute
prior art.
SUMMARY
Display devices constructed according to exemplary embodiments of
the invention have an increased proportion of display area and
improved display quality.
Additional features of the inventive concepts will be set forth in
the description which follows, and in part will be apparent from
the description, or may be learned by practice of the inventive
concepts.
A display device according to an exemplary embodiment includes a
display area and a non-display area, a substrate including a
through hole in the display area, an element layer including an
anode disposed on the substrate, a light emitting layer disposed on
the anode, and a cathode disposed on the light emitting layer, and
a thin-film encapsulation layer including a first inorganic layer
disposed on the element layer, an organic layer disposed on the
first inorganic layer, and a second inorganic layer disposed on the
organic layer, in which the first inorganic layer includes a
plurality of first refractors having a first inclination angle.
The first refractors may be disposed on the cathode.
The first inclination angle may define a degree of inclination with
respect to an imaginary line substantially perpendicular to an
upper surface of the cathode.
A path of light emitted from the light emitting layer may be
configured to be refracted to the greater extent as the first
inclination angle increases.
The first inorganic layer may further include a plurality of first
voids formed between the first refractors.
At least a portion of the first voids may be filled with the
organic layer.
The non-display area may include a hole peripheral area along a rim
of the through hole.
The non-display area may further include a peripheral area, and the
light emitting layer may have a first light emitting area and a
second light emitting area disposed in the display area, and a
third light emitting area disposed in the peripheral area.
Light emitted from the first light emitting area may be configured
to pass through the first refractors and travel to a first virtual
light emitting area overlapping the through hole.
Light emitted from the second light emitting area may be configured
to pass through the first refractors and travel to a second virtual
light emitting area overlapping the hole peripheral area.
Light emitted from the third light emitting area may be configured
to pass through the first refractors and travel to a third virtual
light emitting area overlapping the display area.
The second inorganic layer may include second refractors having a
second inclination angle.
The second inclination angle may be the same as the first
inclination angle.
The second inclination angle may be greater than the first
inclination angle.
The display device may further include a third inorganic layer
disposed on the second inorganic layer.
The second inorganic layer may include a plurality of second voids
formed between the second refractors.
At least a portion of the second voids may be filled with the third
inorganic layer.
A method of manufacturing a display device according to another
exemplary embodiment includes forming an element layer on a
substrate having a through hole in a display area, the element
layer including an anode, a light emitting layer, and a cathode
sequentially disposed on the substrate, forming a thin-film
encapsulation layer on the element layer including forming a first
inorganic layer including a plurality of first refractors having a
first inclination angle, forming an organic layer disposed on the
first inorganic layer, and forming a second inorganic layer
disposed on the organic layer.
Forming the first inorganic layer may include forming a film while
the substrate is placed to form a first angle with respect to an
imaginary line substantially perpendicular to a surface from which
a source is emitted, and an upper surface of the substrate is kept
constant.
After the first refractors having a first directionality are formed
using an anti-deposition plate, the substrate may be rotated such
that the first refractors having a second directionality different
from the first directionality are formed on the first inorganic
layer.
It is to be understood that both the foregoing general description
and the following detailed description are exemplary and
explanatory and are intended to provide further explanation of the
invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are included to provide a further
understanding of the invention and are incorporated in and
constitute a part of this specification, illustrate exemplary
embodiments of the invention, and together with the description
serve to explain the inventive concepts.
FIG. 1 is a schematic plan view of a display device according to an
exemplary embodiment.
FIG. 2 is a schematic cross-sectional view taken along Y1-Y1' of
the display device of FIG. 1 according to an exemplary
embodiment
FIG. 3 is a schematic cross-sectional view taken along Y3-Y3' of
the display device FIG. 1 according to an exemplary embodiment.
FIG. 4 is an enlarged cross-sectional view of a touch sensor
illustrated in FIGS. 2 and 3.
FIG. 5 is an enlarged cross-sectional view of an upper insulating
layer illustrated in FIGS. 2 and 3.
FIG. 6 is a schematic plan view of a display panel included in the
display device according to an exemplary embodiment.
FIG. 7 is an equivalent circuit diagram of a pixel illustrated in
FIG. 6.
FIG. 8 is a schematic cross-sectional view of the pixel illustrated
in FIG. 7.
FIG. 9 is a schematic plan view of a touch sensor included in a
display device according to an exemplary embodiment.
FIG. 10 is an enlarged plan view of a portion R1 of FIG. 9.
FIG. 11 is an enlarged cross-sectional view of an element layer and
a thin-film encapsulation layer illustrated in FIG. 3 according to
an exemplary embodiment.
FIG. 12 is an enlarged view of an area A of FIG. 11 according to an
exemplary embodiment.
FIG. 13 is an enlarged cross-sectional view of the element layer
and the thin-film encapsulation layer illustrated in FIG. 3
according to an exemplary embodiment.
FIG. 14 is an enlarged view of an area A of FIG. 13 according to an
exemplary embodiment.
FIG. 15 is a schematic plan view of a display device according to
an exemplary embodiment.
FIG. 16 is an enlarged cross-sectional view of the element layer
and the thin-film encapsulation layer illustrated in FIG. 3
according to an exemplary embodiment.
FIG. 17 is an enlarged view of an area A of FIG. 16 according to an
exemplary embodiment.
FIG. 18 is a schematic plan view of a display device according to
an exemplary embodiment.
FIG. 19 is a schematic cross-sectional view taken along Y9-Y9' of
the display device of FIG. 18 according to an exemplary
embodiment.
FIGS. 20 and 21 are diagrams illustrating a method of forming
refractors using oblique angle deposition or glancing angle
deposition.
DETAILED DESCRIPTION
In the following description, for the purposes of explanation,
numerous specific details are set forth in order to provide a
thorough understanding of various exemplary embodiments or
implementations of the invention. As used herein "embodiments" and
"implementations" are interchangeable words that are non-limiting
examples of devices or methods employing one or more of the
inventive concepts disclosed herein. It is apparent, however, that
various exemplary embodiments may be practiced without these
specific details or with one or more equivalent arrangements. In
other instances, well-known structures and devices are shown in
block diagram form in order to avoid unnecessarily obscuring
various exemplary embodiments. Further, various exemplary
embodiments may be different, but do not have to be exclusive. For
example, specific shapes, configurations, and characteristics of an
exemplary embodiment may be used or implemented in another
exemplary embodiment without departing from the inventive
concepts.
Unless otherwise specified, the illustrated exemplary embodiments
are to be understood as providing exemplary features of varying
detail of some ways in which the inventive concepts may be
implemented in practice. Therefore, unless otherwise specified, the
features, components, modules, layers, films, panels, regions,
and/or aspects, etc. (hereinafter individually or collectively
referred to as "elements"), of the various embodiments may be
otherwise combined, separated, interchanged, and/or rearranged
without departing from the inventive concepts.
The use of cross-hatching and/or shading in the accompanying
drawings is generally provided to clarify boundaries between
adjacent elements. As such, neither the presence nor the absence of
cross-hatching or shading conveys or indicates any preference or
requirement for particular materials, material properties,
dimensions, proportions, commonalities between illustrated
elements, and/or any other characteristic, attribute, property,
etc., of the elements, unless specified. Further, in the
accompanying drawings, the size and relative sizes of elements may
be exaggerated for clarity and/or descriptive purposes. When an
exemplary embodiment may be implemented differently, a specific
process order may be performed differently from the described
order. For example, two consecutively described processes may be
performed substantially at the same time or performed in an order
opposite to the described order. Also, like reference numerals
denote like elements.
When an element, such as a layer, is referred to as being "on,"
"connected to," or "coupled to" another element or layer, it may be
directly on, connected to, or coupled to the other element or layer
or intervening elements or layers may be present. When, however, an
element or layer is referred to as being "directly on," "directly
connected to," or "directly coupled to" another element or layer,
there are no intervening elements or layers present. To this end,
the term "connected" may refer to physical, electrical, and/or
fluid connection, with or without intervening elements. Further,
the D1-axis, the D2-axis, and the D3-axis are not limited to three
axes of a rectangular coordinate system, such as the x, y, and
z-axes, and may be interpreted in a broader sense. For example, the
D1-axis, the D2-axis, and the D3-axis may be perpendicular to one
another, or may represent different directions that are not
perpendicular to one another. For the purposes of this disclosure,
"at least one of X, Y, and Z" and "at least one selected from the
group consisting of X, Y, and Z" may be construed as X only, Y
only, Z only, or any combination of two or more of X, Y, and Z,
such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the
term "and/or" includes any and all combinations of one or more of
the associated listed items.
Although the terms "first," "second," etc. may be used herein to
describe various types of elements, these elements should not be
limited by these terms. These terms are used to distinguish one
element from another element. Thus, a first element discussed below
could be termed a second element without departing from the
teachings of the disclosure.
Spatially relative terms, such as "beneath," "below," "under,"
"lower," "above," "upper," "over," "higher," "side" (e.g., as in
"sidewall"), and the like, may be used herein for descriptive
purposes, and, thereby, to describe one elements relationship to
another element(s) as illustrated in the drawings. Spatially
relative terms are intended to encompass different orientations of
an apparatus in use, operation, and/or manufacture in addition to
the orientation depicted in the drawings. For example, if the
apparatus in the drawings is turned over, elements described as
"below" or "beneath" other elements or features would then be
oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. Furthermore, the apparatus may be otherwise oriented
(e.g., rotated 90 degrees or at other orientations), and, as such,
the spatially relative descriptors used herein interpreted
accordingly.
The terminology used herein is for the purpose of describing
particular embodiments and is not intended to be limiting. As used
herein, the singular forms, "a," "an," and "the" are intended to
include the plural forms as well, unless the context clearly
indicates otherwise. Moreover, the terms "comprises," "comprising,"
"includes," and/or "including," when used in this specification,
specify the presence of stated features, integers, steps,
operations, elements, components, and/or groups thereof, but do not
preclude the presence or addition of one or more other features,
integers, steps, operations, elements, components, and/or groups
thereof. It is also noted that, as used herein, the terms
"substantially," "about," and other similar terms, are used as
terms of approximation and not as terms of degree, and, as such,
are utilized to account for inherent deviations in measured,
calculated, and/or provided values that would be recognized by one
of ordinary skill in the art.
Various exemplary embodiments are described herein with reference
to sectional and/or exploded illustrations that are schematic
illustrations of idealized exemplary embodiments and/or
intermediate structures. As such, variations from the shapes of the
illustrations as a result, for example, of manufacturing techniques
and/or tolerances, are to be expected. Thus, exemplary embodiments
disclosed herein should not necessarily be construed as limited to
the particular illustrated shapes of regions, but are to include
deviations in shapes that result from, for instance, manufacturing.
In this manner, regions illustrated in the drawings may be
schematic in nature and the shapes of these regions may not reflect
actual shapes of regions of a device and, as such, are not
necessarily intended to be limiting.
As customary in the field, some exemplary embodiments are described
and illustrated in the accompanying drawings in terms of functional
blocks, units, and/or modules. Those skilled in the art will
appreciate that these blocks, units, and/or modules are physically
implemented by electronic (or optical) circuits, such as logic
circuits, discrete components, microprocessors, hard-wired
circuits, memory elements, wiring connections, and the like, which
may be formed using semiconductor-based fabrication techniques or
other manufacturing technologies. In the case of the blocks, units,
and/or modules being implemented by microprocessors or other
similar hardware, they may be programmed and controlled using
software (e.g., microcode) to perform various functions discussed
herein and may optionally be driven by firmware and/or software. It
is also contemplated that each block, unit, and/or module may be
implemented by dedicated hardware, or as a combination of dedicated
hardware to perform some functions and a processor (e.g., one or
more programmed microprocessors and associated circuitry) to
perform other functions. Also, each block, unit, and/or module of
some exemplary embodiments may be physically separated into two or
more interacting and discrete blocks, units, and/or modules without
departing from the scope of the inventive concepts. Further, the
blocks, units, and/or modules of some exemplary embodiments may be
physically combined into more complex blocks, units, and/or modules
without departing from the scope of the inventive concepts.
Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
disclosure is a part. Terms, such as those defined in commonly used
dictionaries, should be interpreted as having a meaning that is
consistent with their meaning in the context of the relevant art
and should not be interpreted in an idealized or overly formal
sense, unless expressly so defined herein.
FIG. 1 is a schematic plan view of a display device according to an
exemplary embodiment. FIG. 2 is a schematic cross-sectional view
taken along Y1-Y1' of the display device of FIG. 1 according to an
exemplary embodiment. FIG. 3 is a schematic cross-sectional view
taken along Y3-Y3' of the display device of FIG. 1 according to an
exemplary embodiment. FIG. 4 is an enlarged cross-sectional view of
a touch sensor TSL illustrated in FIGS. 2 and 3. FIG. 5 is an
enlarged cross-sectional view of an upper insulating layer TSL
illustrated in FIGS. 2 and 3.
Referring to FIGS. 1 through 5, the display device 1 according to
the illustrated exemplary embodiment may include short sides
extending in a first direction (e.g., x-direction) and long sides
extending in a second direction (e.g., y-direction) intersecting
the first direction. Each corner where a long side and a short side
of the display device 1 meet may have a curved shape. The planar
shape of the display device 1 is not limited to that shown in FIG.
1, and may have a circular shape or other shapes.
In FIG. 1, a portable terminal is illustrated as an example to
which the display device 1 may be applied. The portable terminal
may include, for example, a tablet personal computer (PC), a
smartphone, a personal digital assistant (PDA), a portable
multimedia player (PMP), a game machine, and a wristwatch-type
electronic device. However, the inventive concepts are not limited
to a specific type of the display device 1. In some exemplary
embodiments, the display device 1 may be used in large-sized
electronic devices, such as televisions and external billboards,
and small and medium-sized electronic devices, such as PCs,
notebook computers, car navigation devices, smart watches, and
cameras.
As for the planar structure of the display device 1, the display
device 1 includes a display area D-DA and a peripheral area D-NDA
adjacent to the display area D-DA. The display area D-DA may be an
area, in which an image is displayed, and the peripheral area D-NDA
may be an area, in most of which an image may not be displayed. In
some exemplary embodiments, however, an image may be displayed in a
portion of the peripheral area D-NDA adjacent to the display area
D-DA.
In some exemplary embodiments, the display area D-DA may have
substantially a quadrilateral shape. In some exemplary embodiments,
each corner of the display area D-DA may be curved or rounded in
plan view, as illustrated in FIG. 1.
The peripheral area D-NDA may surround the display area D-DA.
However, the inventive concepts are not limited thereto, and the
shape of the display area D-DA and the shape of the peripheral area
D-NDA can be variously designed.
The display device 1 may include a through hole TH in the display
area D-DA. For example, the through hole TH may be located near a
corner where a long side and a short side of the display device 1
meet. In some exemplary embodiments, the through hole TH may pass
through the display device 1 along a third direction (e.g.,
z-direction), and an electronic element EMD may be disposed in the
through hole TH. The electronic element EMD may be a camera
element, a speaker element, a photo-sensing element, a heat sensing
element, a microphone element, or the like.
The planar shape of the through hole TH may be a circular shape as
illustrated in the drawings. However, the inventive concepts are
not limited to one planar shape of the through hole TH, and in some
exemplary embodiments, the planar shape of the through hole TH may
have various other shapes, such as a polygonal shape, a combination
of a straight line and a curve, and an elliptical shape. The
peripheral area D-NDA may include a peripheral area D-NDA1 adjacent
to the outside of the display area D-DA and a hole peripheral area
D-NDA2 surrounding the through hole TH.
The display area D-DA may be an area, in which an image is
displayed, and the peripheral area D-NDA1 and the hole peripheral
area D-NDA2 may be areas, in most of which an image may not be
displayed. In some exemplary embodiments, however, an image may be
displayed in a part of each of the peripheral area D-NDA1 and the
hole peripheral area D-NDA2 adjacent to the display area D-DA.
The peripheral area D-NDA1 may surround the display area D-DA, and
the display area D-DA may surround the hole peripheral area
D-NDA2.
As for the stacked structure of the display device 1, the display
device 1 may include a display panel DP, the touch sensor TSL
disposed on the display panel DP, and a cover window CW disposed on
the touch sensor TSL.
In some exemplary embodiments, the display panel DP may be a
display panel including a self-light emitting element. In an
exemplary embodiment, the self-light emitting element may include
at least one of an organic light emitting diode, a quantum dot
light emitting diode, an inorganic material-based micro light
emitting diode (e.g., a micro light emitting diode), and an
inorganic material-based nano light emitting diode (e.g., a nano
light emitting diode). Hereinafter the self-light emitting element
will be described with reference to an organic light emitting
diode.
In its stacked structure, the display panel DP includes a first
substrate 110, an element layer DSL disposed on the first substrate
110, and the upper insulating layer TFL disposed on the element
layer DSL.
The first substrate 110 is a substrate, which supports the element
layer DSL. In some exemplary embodiments, the first substrate 110
may be an insulating substrate made of glass, quartz, ceramic, or
plastic.
The element layer DSL is disposed on the first substrate 110. In
some exemplary embodiments, the element layer DSL may include a
plurality of pixels and a plurality of display signal lines
disposed on the first substrate 110. Each of the pixels may include
a thin-film transistor (TFT), a capacitor, and a light emitting
element, which will be described in more detail later. The signal
lines may include scan lines, which transmit scan signals to the
pixels, and data lines, which transmit data signals to the pixels,
respectively.
In some exemplary embodiments, the pixels included in the element
layer DSL may be disposed in the display area D-DA, and some of the
pixels may be further disposed in the peripheral area D-NDA.
The element layer DSL may further include elements and wirings
disposed on the first substrate 110 and in the peripheral area
D-NDA. The elements and the wirings may generate various signals to
be transmitted to the pixels or may transmit the signals to the
pixels.
The upper insulating layer TFL may be disposed on the element layer
DSL. The upper insulating layer TFL may protect the element layer
DSL.
The upper insulating layer TFL may include a thin-film
encapsulation layer TFE, and may further include a capping layer
CPL.
The upper insulating layer TFL may include a plurality of thin
films. In the illustrated exemplary embodiment, the upper
insulating layer TFL may include the capping layer CPL and the
thin-film encapsulation layer TFE. The thin-film encapsulation
layer TFE may include a first inorganic layer IOL1, an organic
layer OL, and a second inorganic layer IOL2.
The capping layer CPL may be disposed on the element layer DSL and,
in some exemplary embodiments, may be disposed on a cathode of the
element layer DSL. In some exemplary embodiments, the capping layer
CPL may contact the cathode. The capping layer CPL may include an
organic material.
The thin-film encapsulation layer TFE may include the first
inorganic layer IOL1, the organic layer OL, and the second
inorganic layer IOL2.
The first inorganic layer IOL1 is disposed on the capping layer CPL
and contacts the capping layer CPL. The organic layer OL is
disposed on the first inorganic layer IOL1 and contacts the first
inorganic layer IOL1. The second inorganic layer IOL2 is disposed
on the organic layer OL and contacts the organic layer OL.
The capping layer CPL protects the cathode from a subsequent
manufacturing process, such as a sputtering process, and improves
the light output efficiency of light emitting elements.
The first inorganic layer IOL1 and the second inorganic layer IOL2
protect the element layer DSL from moisture/oxygen, and the organic
layer OL protects the element layer DSL from foreign matter, such
as dust particles. The first inorganic layer IOL1 and/or the second
inorganic layer IOL2 may include refractors having a predetermined
inclination angle. The refractors having the predetermined
inclination angle may change the path of light passing through the
first inorganic layer IOL1 and/or the second inorganic layer IOL2,
which will be described in more detail later.
The touch sensor TSL may be disposed on the display panel DP. In
some exemplary embodiments, the touch sensor TSL may obtain
coordinates of a touch input point using a capacitance method. In
the capacitance method, coordinate information of a touched point
may be obtained using a self-capacitance method or a mutual
capacitance method. Hereinafter, the touch sensor TSL will be
described as having a mutual capacitance structure, however, the
inventive concepts are not limited to one particular structure of
the touch sensor TSL.
In some exemplary embodiments, a portion of the touch sensor TSL
disposed in the display area D-DA may include a touch electrode,
and a portion of the touch sensor TSL disposed in the peripheral
area D-NDA may include a touch signal line, which transmits and/or
receives a signal to/from the touch electrode and a touch pad
portion connected to the touch signal line. The touch sensor TSL
may be disposed on the upper insulating layer TFL. In some
exemplary embodiments, the touch sensor TSL may be disposed on the
thin-film encapsulation layer TFE, and a bonding layer (e.g., an
adhesive layer) may not be disposed between the thin-film
encapsulation layer TFE and the touch sensor TSL. For example, at
least any one of the touch electrode, the touch signal line, and
the touch pad portion of the touch sensor TSL may be disposed
directly on the thin-film encapsulation layer TFE. Alternatively,
when an insulating film is disposed between the touch sensor TSL
and the thin-film encapsulation layer TFE, at least any one of the
touch electrode, the touch signal line, and the touch pad portion
of the touch sensor TSL may be disposed directly on the insulating
film.
As for the stacked structure of the touch sensor TSL, the touch
sensor TSL may include a first conductive layer ML1, an insulating
layer IL, and a second conductive layer ML2, as illustrated in FIG.
4.
In some exemplary embodiments, the first conductive layer ML1 and
the second conductive layer ML2 may include a conductive material
having light transmitting properties, such as silver nanowires
(AgNWs), indium tin oxide (ITO), indium zinc oxide (IZO), antimony
zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO),
tin oxide (SnO.sub.2), carbon nanotubes, graphene, and conductive
polymers (e.g., PEDOT). Alternatively, the second conductive layer
ML2 may include a conductive material, such as a metal or an alloy
of metals, as long as light can be transmitted through the second
conductive layer ML2. For example, the metal may include gold (Au),
silver, (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr),
titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and
platinum (Pt). In some exemplary embodiments, when the second
conductive layer ML2 is made of a metal or an alloy of metals, the
second conductive layer ML2 may have a mesh structure so as not to
be visible to a user.
The insulating layer IL may be disposed between the first
conductive layer ML1 and the second conductive layer ML2. In some
exemplary embodiments, the insulating layer IL may include an
insulating material, such as an inorganic insulating material or an
organic insulating material. The inorganic insulating material may
include at least one of aluminum oxide, titanium oxide, silicon
oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The
organic insulating material may include at least any one of acrylic
resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin,
urethane resin, cellulose resin, siloxane resin, polyimide resin,
polyamide resin, and perylene resin.
The cover window CW is disposed on the display panel DP and
protects the display panel DP from external impact or the like. The
cover window CW may be formed as a film including a transparent
material, such as tempered glass or plastic.
FIG. 6 is a schematic plan view of the display panel DP included in
the display device 1 according to an exemplary embodiment. FIG. 7
is an equivalent circuit diagram of a pixel PX illustrated in FIG.
6. FIG. 8 is a schematic cross-sectional view of the pixel PX
illustrated in FIG. 7.
Referring to FIGS. 6 through 8, a display area DA, a peripheral
area NDA1, and a hole peripheral area NDA2, which correspond to the
display area D-DA, the peripheral area D-NDA1, and the hole
peripheral area D-NDA2 of the display device 1, respectively, may
be defined in the display panel DP or the first substrate 110. In
the illustrated exemplary embodiment, when two regions are
described as being corresponding to each other, the two regions may
overlap each other and have the same area.
An edge "es1" of the first substrate 110 may include rounded
portions "esr1" at corners. In addition, the first substrate 110
may further include a hole edge "et1" located around the through
hole TH to define the through hole TH.
A boundary "eb1" between the display area DA and the peripheral
area NDA1 of the display panel DP may include rounded portions
"eb1a" at corners. In addition, a boundary "eb1c" between the
display area DA and the hole peripheral area NDA2 of the display
panel DP may include a rounded portion, and its overall shape may
be substantially the same (e.g., a circular shape) as the planar
shape of the through hole TH.
A plurality of signal lines SGL and a plurality of pixels PX may be
disposed on the first substrate 110 in the display area DA. Signal
pads DPD may be disposed on the first substrate 110 in the
peripheral area NDA. Most of the pixels PX may be disposed in the
display area DA. Some of the pixels PX may be disposed in the
peripheral area NDA1, and the other pixels PX may be disposed in
the hole peripheral area NDA2.
The signal lines SGL, the pixels PX, and the signal pads DPD may be
included in the element layer DSL.
The signal lines SGL may include scan lines GL, data lines D,L and
a power supply line PL.
The scan lines GL are connected to corresponding ones of the pixels
PX, and transmit scan signals to the corresponding pixels PX,
respectively.
The data lines DL are connected to corresponding ones of the pixels
PX, and transmit data signals to the corresponding pixels PX,
respectively.
The power supply line PL is connected to the pixels PX, and
transmits a driving voltage to the pixels PX.
The signal pads DPD are disposed in the peripheral area NDA1, and
may be connected to, for example, the signal lines SGL and the data
lines DL, respectively. The signal pads DPD may receive data
signals from an external source.
In some exemplary embodiments, the scan lines GL may extend along
the first direction (e.g., x-direction), and the data lines DL may
extend along the second direction (e.g., y-direction). In some
exemplary embodiments, the power supply line PL may extend along
the second direction as the data lines DL.
In FIG. 7, any one scan line GL, any one data line DL, the power
supply line PL, and a pixel PX connected to these lines are
illustrated. However, the inventive concepts are not limited to a
particular configuration of the pixel PX, such that as shown in
FIG. 7.
A light emitting element ELD may be a top emission diode or a
bottom emission diode. As a pixel driving circuit for driving the
light emitting element ELD, the pixel PX includes a first
transistor T1 (or a switching transistor), a second transistor T2
(or a driving transistor), and a capacitor Cst. A first power
supply voltage ELVDD is provided to the second transistor T2, and a
second power supply voltage ELVSS is provided to the light emitting
element ELD. The second power supply voltage ELVSS may be lower
than the first power supply voltage ELVDD.
The first transistor T1 outputs a data signal transmitted to the
data line DL, in response to a scan signal transmitted to the scan
line GL. The capacitor Cst is charged with a voltage corresponding
to the data signal received from the first transistor T1. The
second transistor T2 is connected to the light emitting element
ELD. The second transistor T2 controls a driving current flowing
through the light emitting element ELD according to the amount of
charges stored in the capacitor Cst.
The equivalent circuit of a pixel PX shown in FIG. 7 is merely an
exemplary, and the inventive concepts are not limited thereto. For
example, in some exemplary embodiments, the pixel PX may further
include a plurality of transistors and more capacitors. The light
emitting element ELD can also be connected between the power supply
line PL and the second transistor T2.
In some exemplary embodiments, the light emitting element ELD may
be an organic light emitting diode as described above.
Alternatively, the light emitting element ELD may be any one of a
quantum dot light emitting diode, an inorganic material-based micro
light emitting diode, and an inorganic material-based nano light
emitting diode, without being limited thereto.
FIG. 8 is a cross-sectional view of a portion of the display panel
DP, which corresponds to the equivalent circuit of FIG. 7, together
with the thin-film encapsulation layer TFE and the touch sensor
TSL.
A buffer layer BFL may be disposed on the first substrate 110.
A semiconductor pattern OSP1 (hereinafter, referred to as a first
semiconductor pattern) of the first transistor T1 and a
semiconductor pattern OSP2 (hereinafter, referred to as a second
semiconductor pattern) of the second transistor T2 may be disposed
on the buffer layer BFL. Each of the first semiconductor pattern
OSP1 and the second semiconductor pattern OSP2 may include at least
one of amorphous silicon, polysilicon, and a metal oxide
semiconductor. In some exemplary embodiments, any one of the first
semiconductor pattern OSP1 and the second semiconductor pattern
OSP2 may be made of polysilicon, and the other one of the first
semiconductor pattern OSP1 and the second semiconductor pattern
OSP2 may be made of a metal oxide semiconductor.
A first intermediate inorganic layer 111 is disposed on the first
semiconductor pattern OSP1 and the second semiconductor pattern
OSP2. A control electrode GE1 (hereinafter, referred to as a first
control electrode) of the first transistor T1 and a control
electrode GE2 (hereinafter, a second control electrode) of the
second transistor T2 are disposed on the first intermediate
inorganic layer 111. When the first control electrode GE1 and the
second control electrode GE2 are disposed on the same layer, the
first control electrode GE1 and the second control electrode GE2
may be manufactured by the same photolithography process as the
scan lines GL (see FIG. 6). However, the inventive concepts are not
limited thereto, and the first control electrode GE1 and the second
control electrode GE2 may be disposed on different layers. In this
case, any one of the first control electrode GE1 and the second
control electrode GE2 may be manufactured by the same
photolithography process as the scan lines GL (see FIG. 6).
A second intermediate inorganic layer 112 covering the first
control electrode GE1 and the second control electrode GE2 is
disposed on the first intermediate inorganic layer 111. An input
electrode DE1 (hereinafter, referred to as a first input electrode)
and an output electrode SE1 (hereinafter, referred to as a first
output electrode) of the first transistor T1 and an input electrode
DE2 (hereinafter, referred to as a second input electrode) and an
output electrode SE2 (hereinafter, referred to as a second output
electrode) of the second transistor T2 are disposed on the second
intermediate inorganic layer 112.
The first input electrode DE1 and the first output electrode SE1
are connected to the first semiconductor pattern OSP1,
respectively, through a first through hole CH1 and a second through
hole CH2 passing through the first intermediate inorganic layer 111
and the second intermediate inorganic layer 112. The second input
electrode DE2 and the second output electrode SE2 are connected to
the second semiconductor pattern OSP2, respectively, through a
third through hole CH3 and a fourth through hole CH4 passing
through the first intermediate inorganic layer 111 and the second
intermediate inorganic layer 112. In some exemplary embodiments,
one of the first transistor T1 and the second transistor T2 may
have a bottom gate structure.
An intermediate organic layer 113 covering the first input
electrode DE1, the second input electrode DE2, the first output
electrode SE1, and the second output electrode SE2 is disposed on
the second intermediate inorganic layer 112. The intermediate
organic layer 113 may provide a flat surface.
A pixel defining layer PDL and the light emitting element ELD may
be disposed on the intermediate organic layer 113. The pixel
defining layer PDL may include an organic material. An anode AE is
disposed on the intermediate organic layer 113. The anode AE is
connected to the second output electrode SE2 through a fifth
through hole CH5 passing through the intermediate organic layer
113. An opening OPN is defined in the pixel defining layer PDL. The
opening OPN of the pixel defining layer PDL exposes at least a
portion of the anode AE. In some exemplary embodiments, the pixel
defining layer PDL may be omitted.
The pixel PX may be disposed in the display area DA. The display
area DA may include a light emitting area PXA and a non-light
emitting area NPXA adjacent to the light emitting area PXA. The
non-light emitting area NPXA may surround the light emitting area
PXA. In the illustrated exemplary embodiment, the light emitting
area PXA is defined to correspond to a portion of the anode AE
exposed by the opening OPN.
In an exemplary embodiment, the light emitting area PXA may overlap
at least one of the first and second transistors T1 and T2. In this
manner, the opening OPN may become wider, and the anode AE and a
light emitting layer EML to be described later may also become
wider.
A hole control layer HCL may be common to each of the light
emitting area PXA and the non-light emitting area NPXA. In some
exemplary embodiments, a common layer, such as the hole control
layer HCL, may be formed in common to each of the pixels PX (see
FIG. 3 (6)).
The light emitting layer EML is disposed on the hole control layer
HCL. The light emitting layer EML may generate light of a
predetermined color. The light emitting layer EML may be disposed
in an area corresponding to the opening OPN. More particularly, the
light emitting layer EML may be formed separately in each pixel
PX.
When the light emitting element ELD is an organic light emitting
diode, the light emitting layer EML may include an organic
material, and thus, the light emitting layer EML may be an organic
light emitting layer.
When the light emitting element ELD is a quantum dot light emitting
diode, the light emitting layer EML may include a quantum dot
material, and thus, the light emitting layer EML may be a quantum
dot light emitting layer.
A core of a quantum dot may be selected from a group II-VI
compound, a group III-V compound, a group IV-VI compound, a group
IV element, a group IV compound, and combinations thereof. The
quantum dot may have a full width of half maximum (FWHM) of an
emission wavelength spectrum of about 45 nm or less, about 40 nm or
less, or about 30 nm or less. In this range, color purity or color
reproducibility may be improved. In addition, since light emitted
through the quantum dot is emitted in all directions, a wide
viewing angle may be provided.
The quantum dot may be in a form generally known in the art. For
example, the quantum dot may be in the form of a spherical,
pyramidal, multi-arm, or cubic nanoparticle, nanotube, nanowire,
nanofiber, or plate-like nanoparticle.
The quantum dot may control the color of emitted light according to
the particle size. Therefore, the quantum dot can have various
emission colors, such as blue, red, and green.
In the illustrated exemplary embodiment, the patterned light
emitting layer EML is exemplarily illustrated. However, the
inventive concepts are not limited thereto, and in some exemplary
embodiments, the light emitting layer FAIL may be formed in common
to each of the pixels PX. The light emitting layer EML may generate
white light. In addition, the light emitting layer EML may have a
multilayer structure called a tandem.
An electron control layer ECL is disposed on the light emitting
layer EML. In some exemplary embodiments, the electron control
layer ECL may be formed in common to each of the pixels PX.
A cathode CE is disposed on the electron control layer ECL. The
cathode CE may be formed in common to each of the pixels PX.
The thin-film encapsulation layer TFE may be disposed on the
cathode CE. The thin-film encapsulation layer TFE may include the
first inorganic layer IOL1, the organic layer OL, and the second
inorganic layer IOL2. The touch sensor TSL described above may be
disposed on the thin-film encapsulation layer TFE.
The anode AE, the hole control layer HCL, the light emitting layer
EML, the electron control layer ECL, and the cathode CE disposed in
the light emitting area PXA may form the light emitting element
ELD.
More particularly, the light emitting element ELD may be defined as
a portion where each of the anode AE, the hole control layer HCL,
the light emitting layer EML, the electron control layer ECL, and
the cathode CE are located in the light emitting area PXA.
FIG. 9 is a schematic plan view of a touch sensor TSL included in a
display device according to an exemplary embodiment. FIG. 10 is an
enlarged plan view of a portion R1 of FIG. 9.
Referring to FIGS. 9 and 10, the touch sensor TSL is disposed on
the thin-film encapsulation layer TFE. In particular, the thin-film
encapsulation layer TFE may function as a base layer of the touch
sensor TSL.
As in the first substrate 110, an edge "es2" of the thin-film
encapsulation layer TFE may include rounded portions "esr2" at
corners. In addition, the thin-film encapsulation layer TFE may
further include a hole edge "et2" located around the through hole
TH to define the through hole TH.
The edge "es2" of the thin-film encapsulation layer TFE and the
edge "es1" of the first substrate 110 may be substantially aligned
along the third direction (e.g., z-direction), and the hole edge
"et2" of the thin-film encapsulation layer TFE and the hole edge
"et1" of the first substrate 110 may be substantially aligned along
the third direction (e.g., z-direction).
A sensing area SA, a non-sensing area NSA1, and a hole non-sensing
area NSA2 are defined in the touch sensor TSL. The sensing area SA
may be an area that senses a touch input in the touch sensor TSL,
and the non-sensing area NSA1 and the hole non-sensing area NSA2
may be areas that may not sense a touch input.
The sensing area SA may correspond to the display area D-DA of the
display device 1 illustrated in FIG. 1, or the display area DA of
the display panel DP illustrated in FIG. 6. The non-sensing area
NSA1 may correspond to the peripheral area D-NDA1 of the display
device 1 illustrated in FIG. 1, or the peripheral area NDA1 of the
display panel DP illustrated in FIG. 6. In addition, the hole
non-sensing area NSA2 may correspond to the hole peripheral area
D-NDA2 of the display device 1 illustrated in FIG. 1, or the hole
peripheral area NDA2 of the display panel DP illustrated in FIG.
6.
A boundary "eb2" between the sensing area SA and the non-sensing
area NSA1 may include rounded portions "eb2a" at corners. In
addition, a boundary "eb2c" between the sensing area SA and the
hole non-sensing area NSA2 may include a rounded portion, which may
generally have substantially the same as the planar shape of the
through hole TH, such as a circular shape.
In some exemplary embodiments, the boundary "eb2" between the
sensing area SA and the non-sensing area NSA1, and the boundary
"eb1" between the display area DA and the peripheral area NDA1 of
the display panel DP may be substantially aligned along the third
direction (e.g., z-direction). In addition, the boundary "eb2c"
between the sensing area SA and the hole non-sensing area NSA2 may
be substantially aligned with the boundary "eb1c" between the
display area DA and the hole peripheral area NDA2 of the display
panel DP along the third direction (e.g., z-direction).
The touch sensor TSL may include first electrode portions 310 and
second electrode portions 330. In addition, the touch sensor TSL
may further include touch signal lines 901 and 903 and touch pad
portions TPD1 and TPD2.
The first electrode portions 310 and the second electrode portions
330 may be disposed in the sensing area SA, and the touch pad
portions TPD1 and TPD2 and the touch signal lines 901 and 903 may
be disposed in the non-sensing area NSA1. A first connection
portion 313 and a second connection portion 333 around the through
hole TH may be disposed in the hole non-sensing area NSA2.
Two second touch electrodes 331 spaced apart from each other along
the first direction (e.g., x-direction) with the through hole TH
interposed therebetween in the hole non-sensing area NSA2 may be
connected to each other by the second connection portion 333
bypassing the through hole TH. In addition, two first touch
electrodes 311 spaced apart from each other along the second
direction (e.g., y-direction) with the through hole TH interposed
therebetween in the hole non-sensing area NSA2 may be connected to
each other by the first connection portion 313 bypassing the
through hole TH.
Since the first connection portion 313 and the first touch
electrodes 311 are disposed on different layers, the first touch
electrodes 311 may be connected to the first connection portion 313
through contact holes CNTH formed in the insulating layer IL.
Hereinafter, refractors TC formed in the first inorganic layer IOL1
and/or the second inorganic layer IOL2 will be described.
FIG. 11 is an enlarged cross-sectional view of the element layer
DSL and the thin-film encapsulation layer TFE illustrated in FIG. 3
according to an exemplary embodiment. FIG. 12 is an enlarged view
of an area A of FIG. 11 according to an exemplary embodiment.
Referring to FIGS. 11 and 12, the element layer DSL disposed on the
first substrate 110 may include the anodes AE, the light emitting
layer EML, and the cathode CE. The thin-film encapsulation layer
TFE may be disposed on the cathode CE. The touch sensor TSL may be
disposed on the thin-film encapsulation layer TFE. The electronic
element EMD may be disposed in the through hole TH passing through
the first substrate 110, the element layer DSL, the thin-film
encapsulation layer TFE, and the touch sensor TSL in the third
direction (e.g., z-direction). The cover window CW may be disposed
on the touch sensor TSL. Since the cover window CW is also disposed
over the through hole TH, the cover window CW can prevent the
electronic element EMD from being exposed to the outside.
The display area D-DA excluding the through hole TH may be an area,
in which an image is displayed, and the peripheral area D-NDA1 and
the hole peripheral area D-NDA2 may be areas, in most of which an
image may not be displayed. Since the through hole TH and the hole
peripheral area D-NDA2 are non-light emitting areas, where no image
is displayed, the through hole TH and the hole peripheral area
D-NDA2 may be recognized as dark spots or defects, when seen from
the front. If the path of light emitted from light emitting areas
PXA adjacent to the through hole TH and the hole peripheral area
D-NDA2 is changed, virtual light emitting areas PXA' may be formed
in the through hole TH and the hole peripheral area D-NDA2.
The thin-film encapsulation layer TFE may include the first
inorganic layer IOL1, the organic layer OL, and the second
inorganic layer IOL2. The first inorganic layer IOL1 may prevent
permeation of foreign matter, such as moisture (H.sub.2O) or oxygen
(O.sub.2), and may include a first inorganic material. For example,
the first inorganic material may include one or more of AlO.sub.x,
TiO.sub.2, ZrO, SiO.sub.2, AION, SiON, ZnO, and Ta.sub.2O.sub.5,
without being limited thereto.
The first inorganic layer IOL1 may include first refractors TC1
inclined at a predetermined angle. For example, the first
refractors TC1 may have substantially an elongated shape, such as
cylindrical bars, which may be inclined at a first inclination
angle .theta.1 with respect to an imaginary line NL substantially
perpendicular to the cathode CE. The imaginary line NL
substantially perpendicular to the cathode CE may coincide with the
third direction (e.g., z-direction). The first refractors TC1 may
include an inorganic material. The first inorganic layer IOL1
including the first refractors TC1 having three-dimensional (3D)
bar shape may include voids VD therebetween.
Light L emitted from a first light emitting area PXA1 travels
mostly in the third direction (e.g., z-direction). However, when
the first refractors TC1 are formed on the first light emitting
area PXA1 according to the illustrated exemplary embodiment, light
L' passing through the first refractors TC1 may travel mostly in a
direction inclined at the first inclination angle .theta.1 with
respect to the imaginary line NL substantially perpendicular to the
cathode CE.
For example, as illustrated in FIG. 11, light emitted from the
first light emitting area PXA1 may travel to an area overlapping
the through hole TH and form a first virtual light emitting area
PXA1', and light emitted from a second light emitting area PXA2 may
travel to an area overlapping the hole peripheral area D-NDA2 and
form a second virtual light emitting area PXA2'.
In addition, light emitted from a third light emitting area PXA3
and a fourth light emitting area PXA4 may move a predetermined
distance in the first direction (e.g., x-direction) when passing
through the first refractors TC1 to form a third virtual light
emitting area PXA3' and a fourth virtual light emitting area PXA4',
respectively. In particular, the third virtual light emitting area
PXA3' and the fourth virtual light emitting area PXA4' may be
formed in the display area D-DA.
Light emitted from a fifth light emitting area PXA5 disposed in the
peripheral area D-NDA1 may move a predetermined distance in the
first direction (e.g., x-direction) when passing through the first
refractors TC1 to form a fifth virtual light emitting area PXA5'.
In some exemplary embodiments, although the fifth light emitting
area PXA5 disposed in the peripheral area D-NDA1 is a light
emitting area, the fifth light emitting area PXA5 can be recognized
as a non-light emitting area as not being visible due to a pattern
printed on the cover window CW.
The first inclination angle .theta.1 of the first refractors TC1
may be adjusted by controlling source injection direction and rate,
deposition direction, or the like, during a manufacturing process
according to oblique angle deposition or glancing angle deposition,
which will be described in more detail later. As the first
inclination angle .theta.1 increases, the path of light passing
through the first refractors TC1 may be changed to the greater
extent. For example, when the through hole TH, in which the
electronic element EMD is disposed, and the hole peripheral area
D-NDA2 are increased in size, the first inclination angle .theta.1
may be designed to be greater so as to form wider virtual light
emitting areas PXA'.
The organic layer OL may be disposed directly on the first
inorganic layer IOL1 including the first refractors TC1. The
organic layer OL may include a polymer-based organic material. The
polymer-based material may include acrylic resin, epoxy resin,
polyimide, and polyethylene, without being limited thereto. The
organic layer OL may be formed to be thicker than the first
inorganic layer IOL1 to entirely cover the first refractors TC1. A
portion of the organic layer OL, for example, a lower portion of
the organic layer OL may fill the voids VD between the first
refractors TC1. In this manner, the adhesion between the first
inorganic layer IOL1 and the organic layer OL may be increased.
The second inorganic layer IOL2 may be formed on the organic layer
OL. The second inorganic layer IOL2 may prevent permeation of
foreign matter, such as moisture (H2O) or oxygen (O2), and may
include a second inorganic material. For example, the second
inorganic material may include one or more of AlO.sub.x, TiO.sub.2,
ZrO, SiO.sub.2, AION, SiON, ZnO, and Ta.sub.2O.sub.5, without being
limited thereto.
Hereafter, other exemplary embodiments will be described.
Hereinafter, a description of elements substantially identical to
those of the above-described exemplary embodiments will be omitted
or given briefly to avoid redundancy. As such, the following
exemplary embodiments will be described, focusing mainly on
differences from the above-described exemplary embodiments.
FIG. 13 is an enlarged cross-sectional view of the element layer
DSL and the thin-film encapsulation layer TFE illustrated in FIG. 3
according to an exemplary embodiment. FIG. 14 is an enlarged view
of an area A of FIG. 13 according to an exemplary embodiment.
Referring to FIGS. 13 and 14, the element layer DSL and the
thin-film encapsulation layer TFE according to the illustrated
exemplary are different from those of FIGS. 11 and 12, in that
second refractors TC2 are further included in a second inorganic
layer IOL2 and that a third inorganic layer IOL3 is further
provided to cover the second refractors TC2.
More specifically, the second inorganic layer IOL2 may be formed on
an organic layer OL. The second inorganic layer IOL2 may include
the second refractors TC2 inclined at a predetermined angle. For
example, the second refractors TC2 may have substantially an
elongated shape, such as cylindrical bars, which may be inclined at
a second inclination angle .theta.2 with respect to an imaginary
line NL' substantially perpendicular to the organic layer OL. The
imaginary line NL' substantially perpendicular to the organic layer
OL may coincide with the third direction (e.g., z-direction).
According to an exemplary embodiment, the second inclination angle
.theta.2 may be the same as a first inclination angle .theta.1. The
second refractors TC2 may include a second inorganic material. For
example, the second inorganic material may include one or more of
AlO.sub.x, TiO.sub.2, ZrO, SiO.sub.2, AION, SiON, ZnO, and
Ta.sub.2O.sub.5, without being limited thereto. The second
inorganic layer IOL2 including the second refractors TC2 having 3D
bar shape may include voids VD therebetween.
The third inorganic layer IOL3 may be disposed directly on the
second inorganic layer IOL2 including the second refractors TC2.
The third inorganic layer IOL3 may prevent permeation of foreign
matter, such as moisture (H.sub.2O) or oxygen (O.sub.2), and may
include a third inorganic material. For example, the third
inorganic material may include one or more of AlO.sub.x, TiO.sub.2,
ZrO, SiO.sub.2, AION, SiON, ZnO, and Ta.sub.2O.sub.5, without being
limited thereto. The third inorganic layer IOL3 may be formed to be
thicker than the second inorganic layer IOL2 to entirely cover the
second refractors TC2. A portion of the third inorganic layer IOL3,
for example, a lower portion of the third inorganic layer IOL3 may
fill the voids VD provided between the second refractors TC2. In
this manner, irregularities formed in the second inorganic layer
IOL2 may be substantially flattened (or planarized). The touch
sensor TSL described above may be formed on the third inorganic
layer IOL3.
When a plurality of first refractors TC1 are formed on a first
light emitting area PXA1, light L' passing through the first
refractors TC1 may travel mostly in a direction inclined at the
first inclination angle .theta.1 with respect to an imaginary line
NL substantially perpendicular to a cathode CE. However, some of
the light L' passing through the first refractors TC1 may be
scattered while passing through the organic layer OL, or its path
may be changed due to a difference in refractive index at the very
moment when light passes through a boundary between the organic
layer OL and the third inorganic layer IOL3.
As such, the second refractors TC2 are formed in the second
inorganic layer IOL2 according to the illustrated exemplary
embodiment, such that light L' incident on the second inorganic
layer IOL2 may travel in a direction inclined at the second
inclination angle .theta.2 with respect to the imaginary line NL'
substantially perpendicular to the organic layer OL. More
particularly, light L' incident on the second inorganic layer IOL2
may travel in the same path as the direction inclined at the first
inclination angle 10 with respect to the imaginary line NL
substantially perpendicular to the cathode CE. In this manner,
virtual light emitting areas PXA' can be formed more clearly in an
area overlapping a through hole TH and an area overlapping a hole
peripheral area D-NDA2.
For example, as illustrated in FIG. 13, light emitted from the
first light emitting area PXA1 may travel to the area overlapping
the through hole TH when passing through the first refractors TC1
and the second refractors TC2 and form a first virtual light
emitting area PXA1', and light emitted from a second light emitting
area PXA2 may travel to the area overlapping the hole peripheral
area D-NDA2 and form a second virtual light emitting area
PXA2'.
In addition, light emitted from a third light emitting area PXA3
and a fourth light emitting area PXA4 may move a predetermined
distance in the first direction (e.g., x-direction) when passing
through the first refractors TC1 and the second refractors TC2, and
form a third virtual light emitting area PXA3' and a fourth virtual
light emitting area PXA4', respectively. More particularly, the
third virtual light emitting area PXA3' and the fourth virtual
light emitting area PXA4' may be formed in a display area D-DA.
Light emitted from a fifth light emitting area PXA5 disposed in a
peripheral area D-NDA1 may move a predetermined distance in the
first direction (e.g., x-direction) when passing through the first
refractors TC1 and the second refractors TC2, and form a fifth
virtual light emitting area PXA5' in the display area D-DA. In some
exemplary embodiments, although the fifth light emitting area PXA5
disposed in the peripheral area D-NDA1 is a light emitting area,
the fifth light emitting area PXA5 can be recognized as a non-light
emitting area as not being visible due to a pattern printed on the
cover window CW.
The first inclination angle .theta.1 of the first refractors TC1
and the second inclination angle .theta.2 of the second refractors
TC2 may be adjusted by controlling source injection direction and
rate, deposition direction, or the like during a manufacturing
process according to oblique angle deposition or glancing angle
deposition, which will be described in more detail later. As the
first inclination angle .theta.1 of the first refractors TC1 and
the second inclination angle .theta.2 of the second refractors TC2
increase, the path of light passing through the first refractors
TC1 and the second refractors TC2 may be changed to the greater
extent. For example, when the through hole TH, in which an
electronic element EMD is disposed, and the hole peripheral area
D-NDA2 are increased in size, the first inclination angle .theta.1
and the second inclination angle .theta.2 may be designed to be
greater so as to form wider virtual light emitting areas PXA'.
FIG. 15 is a schematic plan view of a display device according to
an exemplary embodiment. FIG. 16 is an enlarged cross-sectional
view of the element layer DSL and the thin-film encapsulation layer
TFE illustrated in FIG. 15 according to an exemplary embodiment.
FIG. 17 is an enlarged view of an area A of FIG. 16 according to an
exemplary embodiment.
Referring to FIGS. 15 through 17, the display device 2 according to
the illustrated exemplary embodiment is different from that of
FIGS. 13 and 14, in that a through hole TH_1 having a first
electronic element EMD1 and a second electronic element EMD2 is
included in a display area D-DA1, and that third refractors TC3
included in a second inorganic layer IOL2_1 have a third
inclination angle .theta.3 greater than a first inclination angle
.theta.1 and a second inclination angle .theta.2.
More specifically, the second inorganic layer IOL2_1 may be formed
on an organic layer OL. The second inorganic layer IOL2_1 may
include the third refractors TC3 inclined at a predetermined angle.
For example, the third refractors TC3 may have substantially an
elongated shape, such as cylindrical bars, which may be inclined at
the third inclination angle .theta.3 with respect to an imaginary
line NL' substantially perpendicular to the organic layer OL. The
imaginary line NL' substantially perpendicular to the organic layer
OL may coincide with the third direction (e.g., z-direction).
According to an exemplary embodiment, the third inclination angle
.theta.3 may be different from the first inclination angle
.theta.1. The third refractors TC3 may include a third inorganic
material. For example, the third inorganic material may include one
or more of AlO.sub.x, TiO.sub.2, ZrO, SiO.sub.2, AION, SiON, ZnO,
and Ta.sub.2O.sub.5, without being limited thereto. The second
inorganic layer IOL2_1 including the third refractors TC3 having 3D
bar shape may include voids VD therebetween.
When the third refractors TC3 are formed in the second inorganic
layer IOL2_1, light L' incident on the second inorganic layer
IOL2_1 may travel in a direction inclined at the third inclination
angle .theta.3 with respect to the imaginary line NL' substantially
perpendicular to the organic layer OL. More particularly, light L'
incident on the second inorganic layer IOL2_1 may travel in a
different path from a direction inclined at the first inclination
angle .theta.1 with respect to an imaginary line NL substantially
perpendicular to a cathode CE. According to an exemplary
embodiment, the third inclination angle .theta.3 may be greater
than the first inclination angle .theta.1. In this case, light L'
incident on the second inorganic layer IOL2_1 may be refracted to
the greater extent than light L incident on a first inorganic layer
IOL1. As such, wider virtual light emitting areas PXA' can be
formed in an area overlapping the through hole TH_1 and an area
overlapping a hole peripheral area D-NDA21.
For example, as illustrated in FIG. 16, light emitted from a first
light emitting area PXA1 and a second light emitting area PXA2 may
travel to the area overlapping the through hole TH_1 when passing
through first refractors TC1 and the third refractors TC3 and form
a first virtual light emitting area PXA1' and a second virtual
light emitting area PXA2'. Light emitted from a third light
emitting area PXA3 may travel to the area overlapping the hole
peripheral area D-NDA21 and form a third virtual light emitting
area PXA3'.
In addition, light emitted from a fourth light emitting area PXA4
may move a predetermined distance in the first direction (e.g.,
x-direction) when passing through the first refractors TC1 and the
third refractors TC3 and form a fourth virtual light emitting area
PXA4'. In particular, the fourth virtual light emitting area PXA4'
may be formed in the display area D-DA1.
Light emitted from a fifth light emitting area PXA5 disposed in a
peripheral area D-DNA11 may move a predetermined distance in the
first direction (e.g., x-direction) when passing through the first
refractors TC1 and the third refractors TC3 and form a fifth
virtual light emitting area PXA5' in the display area D-DA1. In
some exemplary embodiments, although the fifth light emitting area
PXA5 disposed in the peripheral area D-DNA11 is a light emitting
area, the fifth light emitting area PXA5 can be recognized as a
non-light emitting area as not being visible due to a pattern
printed on a cover window CW.
The first inclination angle .theta.1 of the first refractors TC1
and the third inclination angle .theta.3 of the third refractors
TC3 may be adjusted by controlling source injection direction and
rate, deposition direction, or the like during a manufacturing
process according to oblique angle deposition or glancing angle
deposition, which will be described later. As the first inclination
angle .theta.1 of the first refractors TC1 and the third
inclination angle .theta.3 of the third refractors TC3 increase,
the path of light passing through the first refractors TC1 and the
third refractors TC3 may be changed to the greater extent. For
example, when the through hole TH_1, in which the first electronic
element EMD1 and the second electronic element EMD2 are disposed,
and the hole peripheral area D-NDA21 are increased in size, the
first inclination angle .theta.1 and the third inclination angle
.theta.3 may be designed to be greater so as to form wider virtual
light emitting areas PXA'.
FIG. 18 is a schematic plan view of a display device according to
an exemplary embodiment. FIG. 19 is a schematic cross-sectional
view taken along Y9-Y9' of the display device of FIG. 18 according
to an exemplary embodiment.
Referring to FIGS. 18 and 19, the display device 3 is different
from the display device 1 of FIG. 1, in that a peripheral area
D-NDA12 is formed in only a part of each corner area, where one
short side and one long side of the display device 3 meet.
More specifically, the display device 3 may include both short
sides extending in the first direction (e.g., x-direction) and both
long sides extending in the second direction (e.g., y-direction)
intersecting the first direction. Each corner where a long side and
a short side of the display device 3 meet may be curved. In some
exemplary embodiments, the display device 3 may further include
fourth side display areas extending and bending from both short
sides and both long sides of a display area D-DA2 disposed at the
front side thereof. As such, the peripheral area D-NDA12, which is
a non-light emitting area, may be disposed in only a part of each
corner, where a long side and a short side meet.
An element layer DSL disposed on a first substrate 110 may include
anodes AE, light emitting layers EML, and a cathode CE. A thin-film
encapsulation layer TFE may be disposed on the cathode CE. A touch
sensor TSL may be disposed on the thin-film encapsulation layer
TFE. A cover window CW may be disposed on the touch sensor TSL. The
cover window CW may be supported by a bottom chassis BC. In this
manner, the cover window CW may also be disposed in the peripheral
area D-NDA12.
The display area D-DA2 may be an area, in which an image is
displayed, and the peripheral area D-NDA12 may be an area, in most
of which an image may be displayed. When the path of light emitted
from a light emitting area PXA adjacent to the peripheral area
D-NDA12 is changed, a virtual light emitting area PXA' may be
formed in the peripheral area D-NDA12.
The thin-film encapsulation layer TFE may include a first inorganic
layer IOL11, an organic layer OL, and a second inorganic layer
IOL22. The first inorganic layer IOL11 may prevent permeation of
foreign matter, such as moisture (H.sub.2O) or oxygen (O.sub.2) and
may include a first inorganic material. For example, the first
inorganic material may include one or more of AlO.sub.x, TiO2, ZrO,
SiO2, AION, SiON, ZnO, and Ta2O5, without being limited
thereto.
The first inorganic layer IOL11 may include fourth refractors TC4
inclined at a predetermined angle. For example, the fourth
refractors TC4 may have substantially an elongated shape, such as
cylindrical bars, which may be inclined at a fourth inclination
angle .theta.4 with respect to an imaginary line NL substantially
perpendicular to the cathode CE. The imaginary line NL
substantially perpendicular to the cathode CE may coincide with the
third direction (e.g., z-direction). The fourth refractors TC4 may
include an inorganic material. The first inorganic layer IOL11
including the fourth refractors TC4 having 3D bar shape may include
voids VD therebetween.
Light L emitted from a first light emitting area PXA1 travels
mostly in the third direction (e.g., z-direction). However, when
the fourth refractors TC4 are formed on the first light emitting
area PXA1, light L' passing through the fourth refractors TC4 may
travel mostly in a direction inclined at the fourth inclination
angle .theta.4 with respect to the imaginary line NL substantially
perpendicular to the cathode CE.
For example, as illustrated in FIG. 19, light emitted from the
first light emitting area PXA1 and a second light emitting area
PXA2 may move a predetermined distance along a direction between
the first direction (e.g., x-direction) and the second direction
(e.g., y-direction) when passing through the fourth refractors TC4
and form a first virtual light emitting area PXA1' and a second
virtual light emitting area PXA2'. In particular, the first virtual
light emitting area PXA1' and the second virtual light emitting
area PXA2' may be formed in the display area D-DA2.
Light emitted from a third light emitting area PXA3 and a fourth
light emitting area PXA4 may travel to an area overlapping the
peripheral area D-NDA12 when passing through the fourth refractors
TC4 and form a third virtual light emitting area PXA3' and a fourth
virtual light emitting area PXA4'. In this manner, a non-light
emitting area may be relatively reduced.
The fourth inclination angle .theta.4 of the fourth refractors TC4
may be adjusted by controlling source injection direction and rate,
deposition direction, or the like during a manufacturing process
according to oblique angle deposition or glancing angle deposition,
which will be described later. As the fourth inclination angle
.theta.4 increases, the path of light passing through the fourth
refractors TC4 may be changed to the greater extent.
The organic layer OL may be disposed directly on the first
inorganic layer IOL11 including the fourth refractors TC4. The
organic layer OL may include a polymer-based organic material. The
polymer-based material may include acrylic resin, epoxy resin,
polyimide, and polyethylene, without being limited thereto. The
organic layer OL may be formed to be thicker than the first
inorganic layer IOL11 to entirely cover the fourth refractors TC4.
A portion of the organic layer OL, for example, a lower portion of
the organic layer OL may fill the voids VD provided in the fourth
refractors TC4. In this manner, the adhesion between the first
inorganic layer IOL11 and the organic layer OL may be
increased.
The second inorganic layer IOL22 may be formed on the organic layer
OL. The second inorganic layer IOL22 may prevent permeation of
foreign, matter such as moisture (H2O) or oxygen (O2) and may
include a second inorganic material. For example, the second
inorganic material may include one or more of AlO.sub.x, TiO.sub.2,
ZrO, SiO.sub.2, AION, SiON, ZnO, and Ta.sub.2O.sub.5, without being
limited thereto. In some exemplary embodiments, the second
inorganic layer IOL22 may further include refractors, and the path
of light incident on the second inorganic layer IOL22 may be
controlled by adjusting an inclination angle of the refractors.
A method of forming refractors on a cathode CE will now be
described.
FIGS. 20 and 21 are diagrams illustrating a method of forming
refractors using oblique angle deposition or glancing angle
deposition.
Referring to FIGS. 13, 14, 20 and 21, a substrate SUB may be fixed
to a substrate holder SH. The substrate SUB may be in a state where
an element layer DSL is disposed on a first substrate 110. The
element layer DSL may be in a state where anodes AE, light emitting
layers EML, and a cathode CE are stacked sequentially. The
substrate SUB may be inclined at a predetermined angle with respect
to a surface from which a source S is to be emitted. For example,
when an angle formed by an imaginary line substantially
perpendicular to the surface from which the source S is to be
emitted, and an upper surface of the substrate SUB is inclined at X
degrees, a first inclination angle .theta.1 may be 90-X degrees.
The source S may include one or more inorganic materials selected
from AlO.sub.x, TiO.sub.2, ZrO, SiO.sub.2, AION, SiON, ZnO, and
Ta.sub.2O.sub.5, without being limited thereto
In oblique angle deposition or glancing angle deposition, a film is
generally formed by rotating the substrate SUB. In the case of the
rotating film formation, first refractors TC1 may have a 3D
nanostructure having at least one pitch around one axis. For
example, as an inorganic material grows clockwise or
counterclockwise around one axis, columnar or spherical helical
refractors may be formed.
In the illustrated exemplary embodiment, a film may be formed by
keeping the substrate SUB fixed at a predetermined angle without
rotating the substrate SUB. In the case of the fixed film
formation, the first refractors TC1 may have a 3D nanostructure
having a first directionality. For example, the first refractors
TC1 may have substantially an elongated shape, such as cylindrical
bars, which may be inclined at the first inclination angle .theta.1
with respect to an imaginary line NL substantially perpendicular to
the cathode CE.
To form a film by fixing the substrate SUB, an end of an
anti-deposition plate PL may be aligned with an area, in which a
through hole TH is disposed. The first refractors TC1 may not be
formed on the substrate SUB in an area overlapping the
anti-deposition plate PL. After the first refractors TC1 having the
first directionality are formed, the substrate hole SH may be
rotated 180 degrees.
If the fixed film formation process is repeated after the substrate
hole SH is rotated 180 degrees, first refractors TC1 having a
second directionality may be formed. Although the first refractors
TC1 are described as having two directionalities, however, the
inventive concepts are not limited thereto. For example, in some
exemplary embodiments, the first refractors TC1 having a plurality
of directionalities can also be formed depending on the degree to
which the substrate hole SH is rotated.
According to the exemplary embodiments, a display device has an
increased proportion of display area and improved display
quality.
Although certain exemplary embodiments and implementations have
been described herein, other embodiments and modifications will be
apparent from this description. Accordingly, the inventive concepts
are not limited to such embodiments, but rather to the broader
scope of the appended claims and various obvious modifications and
equivalent arrangements as would be apparent to a person of
ordinary skill in the art.
* * * * *