U.S. patent number 11,133,595 [Application Number 16/724,920] was granted by the patent office on 2021-09-28 for antenna module using metal bezel and electronic device including thereof.
This patent grant is currently assigned to Samsung Electronics Co., Ltd.. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Wonjoon Choi, Sungchul Park.
United States Patent |
11,133,595 |
Park , et al. |
September 28, 2021 |
Antenna module using metal bezel and electronic device including
thereof
Abstract
Disclosed is an electronic device including a metal bezel
including a bezel patch separated through a bezel slit, a printed
circuit board including a first conductive pattern and a second
conductive pattern, which are separated through a substrate slit
and a communication module transmitting or receiving an antenna
signal, using an antenna element including the bezel patch, the
first conductive pattern, and the second conductive pattern. The
first conductive pattern is connected to a part of the metal bezel.
The bezel patch and the second conductive pattern is arranged to be
aligned vertically. A bezel cavity is formed between the bezel
patch and the second conductive pattern.
Inventors: |
Park; Sungchul (Gyeonggi-do,
KR), Choi; Wonjoon (Gyeonggi-do, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Gyeonggi-do |
N/A |
KR |
|
|
Assignee: |
Samsung Electronics Co., Ltd.
(Suwon-si, KR)
|
Family
ID: |
71122303 |
Appl.
No.: |
16/724,920 |
Filed: |
December 23, 2019 |
Prior Publication Data
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|
|
Document
Identifier |
Publication Date |
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US 20200212584 A1 |
Jul 2, 2020 |
|
Foreign Application Priority Data
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|
|
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Dec 28, 2018 [KR] |
|
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10-2018-0171607 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01Q
1/44 (20130101); H01Q 21/08 (20130101); H01Q
21/064 (20130101); H01Q 1/243 (20130101); H01Q
13/16 (20130101); H01Q 1/38 (20130101); H01Q
5/35 (20150115); H01Q 13/18 (20130101); H01Q
3/36 (20130101); H01Q 3/28 (20130101) |
Current International
Class: |
H01Q
13/18 (20060101); H01Q 5/35 (20150101); H01Q
1/24 (20060101); H01Q 21/06 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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106058436 |
|
Oct 2016 |
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CN |
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10-2017-0084632 |
|
Jul 2017 |
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KR |
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10-2018-0060299 |
|
Jun 2018 |
|
KR |
|
Other References
International Search Report dated Apr. 28, 2020. cited by
applicant.
|
Primary Examiner: Smith; Graham P
Assistant Examiner: Kim; Jae K
Attorney, Agent or Firm: Cha & Reiter, LLC
Claims
What is claimed is:
1. An electronic device comprising: a metal bezel including a bezel
patch separated through a bezel slit; a printed circuit board
including a first conductive pattern and a second conductive
pattern separated by a substrate slit; and a communication module
configured to transmit or receive radio frequency signals using the
bezel patch, the first conductive pattern, and the second
conductive pattern, wherein the first conductive pattern is
connected to a part of the metal bezel; wherein the second
conductive pattern is disposed directly under the bezel patch, and
wherein a bezel cavity is formed between the bezel patch and the
second conductive pattern.
2. The electronic device of claim 1, wherein the bezel cavity is
filled with a dielectric substance.
3. The electronic device of claim 1, wherein the printed circuit
board includes a first feed part and a second feed part for feeding
the first conductive pattern and the second conductive pattern, and
wherein the first feed part and the second feed part feed the
substrate slit through a coupling scheme.
4. The electronic device of claim 3, wherein the first feed part is
disposed in a direction perpendicular to the second feed part.
5. The electronic device of claim 1, wherein the bezel slit is a
first bezel slit, wherein the bezel patch is separated into an
outer bezel patch and inner bezel patch through a second bezel
slit, and wherein the outer bezel patch is disposed to surround a
periphery of the inner bezel patch.
6. The electronic device of claim 5, wherein a width of the second
bezel slit is less than a width of the first bezel slit.
7. The electronic device of claim 5, wherein a length of a side of
the second conductive pattern is equal to a length of a side of the
outer bezel patch.
8. The electronic device of claim 1, wherein a width of the
substrate slit is equal to a width of the bezel slit.
9. The electronic device of claim 1, further comprising: a first
inductor connected between the metal bezel and the bezel patch; a
second inductor connected to the second conductive pattern; a first
capacitive sensor connected to the metal bezel and configured to
generate a sensor signal; and a second capacitive sensor connected
to the second inductor and configured to sense a change of a
magnitude of the sensor signal.
10. The electronic device of claim 9, wherein the second capacitive
sensor determines that there is a touch input when the magnitude of
the sensor signal is reduced to be less than a threshold value.
11. The electronic device of claim 1, wherein the bezel patch
includes an injection coupling part disposed at a center of the
bezel patch.
12. The electronic device of claim 11, wherein the cavity is filled
with a dielectric substance and wherein the injection coupling part
is formed in a screw shape and is coupled with the dielectric
substance.
13. An electronic device comprising: a metal bezel; an antenna
array formed in a part of the metal bezel; and a communication
module configured to transmit or receive an antenna signal, using
the antenna array, wherein the antenna array includes: a plurality
of bezel patches separated from the metal bezel through a plurality
of bezel slits; and a printed circuit board including a plurality
of first conductive patterns and a plurality of second conductive
patterns, wherein one of the first conductive patterns is separated
from one of the second conductive patterns through a substrate
slit, wherein the first conductive patterns is connected to the
part of the metal bezel, wherein one of the plurality of bezel
patches is disposed directly above one of the second conductive
patterns, and wherein a bezel cavity is formed between the one of
the plurality of bezel patches and the one of the second conductive
patterns.
14. The electronic device of claim 13, wherein the metal bezel
includes a switch bezel patch separated through a switch separation
slit, and wherein the plurality of bezel patches are formed in the
switch separation bezel patch.
15. The electronic device of claim 14, wherein the printed circuit
board is disposed directly under the switch bezel patch and wherein
the electronic device further comprises: a switch configured to
operate depending on a movement of the switch bezel patch.
16. The electronic device of claim 15, further comprising: a
control printed circuit board connected to the printed circuit
board through a flexible printed circuit board and including a
communication circuit.
17. The electronic device of claim 15, further comprising: a
reinforcement member interposed between the printed circuit board
and the switch.
18. The electronic device of claim 15, further comprising: a switch
support member fixing the switch on the printed circuit board.
19. The electronic device of claim 13, wherein one of the bezel
slits is directly above one of the substrate slits.
20. An antenna module formed in a part of a metal bezel of an
electronic device, the antenna module comprising: a bezel patch
separated from the metal bezel through a bezel slit; and a printed
circuit board including a first conductive pattern and a second
conductive pattern, which are separated through a substrate slit,
wherein the first conductive pattern is connected to the part of
the metal bezel, wherein the second conductive pattern is disposed
directly below the bezel patch, and wherein a bezel cavity is
formed between the bezel patch and the second conductive pattern.
Description
CROSS-REFERENCE TO RELATED APPLICATION(S)
This application is based on and claims priority under 35 U.S.C.
.sctn. 119 to Korean Patent Application No. 10-2018-0171607, filed
on Dec. 28, 2018, in the Korean Intellectual Property Office, the
disclosure of which is incorporated by reference herein its
entirety.
BACKGROUND
1. Field
The disclosure relates to the antenna technology using the metal
bezel of an electronic device.
2. Description of Related Art
As mobile communication technologies develop, an electronic device,
which is equipped with an antenna, such as a smartphone, a wearable
device, or the like is widely supplied. The electronic device may
receive or transmit a signal including data (e.g., a message, a
photo, a video, a music file, a game, and the like) through the
antenna. In the electronic device, a signal that is received by
using the antenna is provided to a radio frequency integrated
circuit (RFIC).
The above information is presented as background information only
to assist with an understanding of the disclosure. No determination
has been made, and no assertion is made, as to whether any of the
above might be applicable as prior art with regard to the
disclosure.
SUMMARY
In accordance with an aspect of the disclosure, an electronic
device comprises a metal bezel including a bezel patch separated
through a bezel slit; a printed circuit board including a first
conductive pattern and a second conductive pattern separated by a
substrate slit; and a communication module configured to transmit
or receive radio frequency signals using the separation bezel part,
the first conductive pattern, and the second conductive pattern,
wherein the first conductive pattern is connected to a part of the
metal bezel; wherein the second conductive pattern is disposed
directly under the bezel patch, and wherein a bezel cavity is
formed between the separation bezel part and the second conductive
pattern.
In accordance with another aspect of the disclosure an electronic
device comprises a metal bezel; an antenna array formed in a part
of the metal bezel; and a communication module configured to
transmit or receive an antenna signal, using the antenna array,
wherein the antenna array includes: a plurality of bezel patches
separated from the metal bezel through a plurality of bezel slits;
and a printed circuit board including a plurality of first
conductive patterns and a plurality of second conductive patterns,
wherein one of the first conductive patterns is separated from one
of the second conductive patterns through a substrate slit, wherein
the first conductive patterns is connected to the part of the metal
bezel, wherein one of the plurality of bezel patches is disposed
directly above one of the second conductive patterns, and wherein a
bezel cavity is formed between the one of the plurality of bezel
patches and the one of the second conductive patterns.
In accordance with another aspect of this disclosure, an antenna
module formed in a part of a metal bezel of an electronic device,
comprises: a bezel patch separated from the metal bezel through a
bezel slit; and a printed circuit board including a first
conductive pattern and a second conductive pattern, which are
separated through a substrate slit, wherein the first conductive
pattern is connected to a part of the metal bezel, wherein the
second conductive pattern is disposed directly below the bezel
patch, and wherein a bezel cavity is formed between the bezel patch
and the second conductive pattern.
Other aspects, advantages, and salient features of the disclosure
will become apparent to those skilled in the art from the following
detailed description, which, taken in conjunction with the annexed
drawings, discloses certain embodiments of the disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other aspects, features, and advantages of certain
embodiments of the disclosure will be more apparent from the
following description taken in conjunction with the accompanying
drawings, in which:
FIG. 1 is a block diagram illustrating an electronic device in a
network environment according to certain embodiments;
FIG. 2A is a front perspective view of a mobile electronic device
according to an embodiment;
FIG. 2B is a back perspective view of an electronic device of FIG.
2A;
FIG. 3 is an exploded perspective view of an electronic device of
FIGS. 2A and 2B;
FIG. 4A is a view illustrating a structure of an antenna module,
according to an embodiment of the disclosure;
FIG. 4B is a cross-sectional view taken along a line A-A' of FIG.
4A;
FIG. 4C is a cross-sectional view taken along a line B-B' of FIG.
4A;
FIG. 4D is a view illustrating the antenna module of FIG. 4A when
viewed from one side;
FIG. 4E is a view illustrating the antenna module of FIG. 4A when
viewed from another side;
FIG. 5A is a view illustrating a radiation operation of the antenna
module of FIG. 4A;
FIG. 5B is a view illustrating a resonance effect of the antenna
module of FIG. 4A;
FIG. 5C is a view illustrating a resonance effect between feed
parts of the antenna module of FIG. 4A;
FIG. 5D is a view illustrating transmission and reception
performance of the antenna module of FIG. 4A;
FIG. 6A is a view illustrating a structure of an antenna module,
according to another embodiment of the disclosure;
FIG. 6B is a sectional view taken along a line C-C' of FIG. 6A;
FIG. 6C is a sectional view taken along a line D-D' of FIG. 6A;
FIG. 7A is a view illustrating a resonance effect of the antenna
module of FIG. 6A;
FIG. 7B is a view illustrating the first transmission and reception
performance of the antenna module of FIG. 6A;
FIG. 7C is a view illustrating the second transmission and
reception performance of the antenna module of FIG. 6A;
FIG. 8 is a diagram illustrating a structure of an antenna module
used as a switch, according to an embodiment of the disclosure;
FIG. 9A is a view illustrating a resonance effect of the antenna
module of FIG. 8;
FIG. 9B is a view illustrating the transmission and reception
performance of the antenna module of FIG. 8;
FIGS. 10A and 10B are diagrams illustrating a structure of an
antenna module used as a switch, according to another embodiment of
the disclosure;
FIG. 11 is a diagram illustrating a structure of an antenna module
used as a switch, according to still another embodiment of the
disclosure;
FIG. 12A is a view illustrating a structure of an antenna module
including a support structure, according to an embodiment of the
disclosure;
FIG. 12B is a sectional view taken along a line E-E' of FIG.
12A;
FIG. 12C is a sectional view taken along a line F-F' of FIG.
12A;
FIG. 12D is a view illustrating an electric field in the case where
power is supplied to the antenna module of FIG. 12A; and
FIG. 13 is a communication system of an electronic device,
according to an embodiment.
DETAILED DESCRIPTION
An antenna of an electronic device can be implemented by using a
plurality of antenna elements for the purpose of receiving or
transmitting a signal more efficiently. For example, the electronic
device may include one or more antenna arrays in each of which a
plurality of antenna elements are arranged in a regular shape. The
antenna array has an effective isotropically radiated power (EIRP)
greater than one antenna element. As such, the electronic device
that includes an antenna array may receive or transmit a signal
efficiently.
Metal bezels are increasingly used in electronic devices using
antennas. The metal bezel is used to block or reflect the radiation
path of the antenna. When the metal bezel is used in the electronic
device, it may be difficult to secure beam coverage on the side
surface (e.g., the direction of the metal bezel) of the electronic
device. The metal bezel divided into several portions in the
electronic device is used to secure the beam coverage. However,
when the metal bezel is divided into several portions, the metal
bezel may significantly affect the appearance of the electronic
device.
Aspects of the disclosure are to address at least the
above-mentioned problems and/or disadvantages and to provide at
least the advantages described below. Accordingly, an aspect of the
disclosure is to provide an antenna module which does not affect
the appearance of an electronic device by forming a very thin slit
on a metal bezel and by forming an antenna module on the metal
bezel itself.
Furthermore, another aspect of the disclosure is to provide an
antenna module having a plurality of frequency bands by forming a
plurality of slits of different sizes on a metal bezel.
Moreover, another aspect of the disclosure is to form an antenna
module that is formed on a metal bezel itself and is used as a key
input device.
Hereinafter, certain embodiments of the disclosure may be described
with reference to accompanying drawings. Accordingly, those of
ordinary skill in the art will recognize that modification,
equivalent, and/or alternative on the certain embodiments described
herein can be variously made without departing from the scope and
spirit of the disclosure.
FIG. 1 is a block diagram illustrating an electronic device 101 in
a network environment 100 according to certain embodiments.
Referring to FIG. 1, the electronic device 101 in the network
environment 100 may communicate with an electronic device 102 via a
first network 198 (e.g., a short-range wireless communication
network), or an electronic device 104 or a server 108 via a second
network 199 (e.g., a long-range wireless communication network).
According to an embodiment, the electronic device 101 may
communicate with the electronic device 104 via the server 108.
According to an embodiment, the electronic device 101 may include a
processor 120, memory 130, an input device 150, a sound output
device 155, a display device 160, an audio module 170, a sensor
module 176, an interface 177, a haptic module 179, a camera module
180, a power management module 188, a battery 189, a communication
module 190, a subscriber identification module (SIM) 196, or an
antenna module 197. In some embodiments, at least one (e.g., the
display device 160 or the camera module 180) of the components may
be omitted from the electronic device 101, or one or more other
components may be added in the electronic device 101. In some
embodiments, some of the components may be implemented as single
integrated circuitry. For example, the sensor module 176 (e.g., a
fingerprint sensor, an iris sensor, or an illuminance sensor) may
be implemented as embedded in the display device 160 (e.g., a
display).
The processor 120 may execute, for example, software (e.g., a
program 140) to control at least one other component (e.g., a
hardware or software component) of the electronic device 101
coupled with the processor 120, and may perform various data
processing or computation. According to one embodiment, as at least
part of the data processing or computation, the processor 120 may
load a command or data received from another component (e.g., the
sensor module 176 or the communication module 190) in volatile
memory 132, process the command or the data stored in the volatile
memory 132, and store resulting data in non-volatile memory 134.
According to an embodiment, the processor 120 may include a main
processor 121 (e.g., a central processing unit (CPU) or an
application processor (AP)), and an auxiliary processor 123 (e.g.,
a graphics processing unit (GPU), an image signal processor (ISP),
a sensor hub processor, or a communication processor (CP)) that is
operable independently from, or in conjunction with, the main
processor 121. Additionally or alternatively, the auxiliary
processor 123 may be adapted to consume less power than the main
processor 121, or to be specific to a specified function. The
auxiliary processor 123 may be implemented as separate from, or as
part of the main processor 121.
The auxiliary processor 123 may control at least some of functions
or states related to at least one component (e.g., the display
device 160, the sensor module 176, or the communication module 190)
among the components of the electronic device 101, instead of the
main processor 121 while the main processor 121 is in an inactive
(e.g., sleep) state, or together with the main processor 121 while
the main processor 121 is in an active state (e.g., executing an
application). According to an embodiment, the auxiliary processor
123 (e.g., an image signal processor or a communication processor)
may be implemented as part of another component (e.g., the camera
module 180 or the communication module 190) functionally related to
the auxiliary processor 123.
The memory 130 may store various data used by at least one
component (e.g., the processor 120 or the sensor module 176) of the
electronic device 101. The various data may include, for example,
software (e.g., the program 140) and input data or output data for
a command related thererto. The memory 130 may include the volatile
memory 132 or the non-volatile memory 134.
The program 140 may be stored in the memory 130 as software, and
may include, for example, an operating system (OS) 142, middleware
144, or an application 146.
The input device 150 may receive a command or data to be used by
other component (e.g., the processor 120) of the electronic device
101, from the outside (e.g., a user) of the electronic device 101.
The input device 150 may include, for example, a microphone, a
mouse, a keyboard, or a digital pen (e.g., a stylus pen).
The sound output device 155 may output sound signals to the outside
of the electronic device 101. The sound output device 155 may
include, for example, a speaker or a receiver. The speaker may be
used for general purposes, such as playing multimedia or playing
record, and the receiver may be used for an incoming calls.
According to an embodiment, the receiver may be implemented as
separate from, or as part of the speaker.
The display device 160 may visually provide information to the
outside (e.g., a user) of the electronic device 101. The display
device 160 may include, for example, a display, a hologram device,
or a projector and control circuitry to control a corresponding one
of the display, hologram device, and projector. According to an
embodiment, the display device 160 may include touch circuitry
adapted to detect a touch, or sensor circuitry (e.g., a pressure
sensor) adapted to measure the intensity of force incurred by the
touch.
The audio module 170 may convert a sound into an electrical signal
and vice versa. According to an embodiment, the audio module 170
may obtain the sound via the input device 150, or output the sound
via the sound output device 155 or a headphone of an external
electronic device (e.g., an electronic device 102) directly (e.g.,
wiredly) or wirelessly coupled with the electronic device 101.
The sensor module 176 may detect an operational state (e.g., power
or temperature) of the electronic device 101 or an environmental
state (e.g., a state of a user) external to the electronic device
101, and then generate an electrical signal or data value
corresponding to the detected state. According to an embodiment,
the sensor module 176 may include, for example, a gesture sensor, a
gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an
acceleration sensor, a grip sensor, a proximity sensor, a color
sensor, an infrared (IR) sensor, a biometric sensor, a temperature
sensor, a humidity sensor, or an illuminance sensor.
The interface 177 may support one or more specified protocols to be
used for the electronic device 101 to be coupled with the external
electronic device (e.g., the electronic device 102) directly (e.g.,
wiredly) or wirelessly. According to an embodiment, the interface
177 may include, for example, a high definition multimedia
interface (HDMI), a universal serial bus (USB) interface, a secure
digital (SD) card interface, or an audio interface.
A connecting terminal 178 may include a connector via which the
electronic device 101 may be physically connected with the external
electronic device (e.g., the electronic device 102). According to
an embodiment, the connecting terminal 178 may include, for
example, a HDMI connector, a USB connector, a SD card connector, or
an audio connector (e.g., a headphone connector).
The haptic module 179 may convert an electrical signal into a
mechanical stimulus (e.g., a vibration or a movement) or electrical
stimulus which may be recognized by a user via his tactile
sensation or kinesthetic sensation. According to an embodiment, the
haptic module 179 may include, for example, a motor, a
piezoelectric element, or an electric stimulator.
The camera module 180 may capture a still image or moving images.
According to an embodiment, the camera module 180 may include one
or more lenses, image sensors, image signal processors, or
flashes.
The power management module 188 may manage power supplied to the
electronic device 101. According to one embodiment, the power
management module 188 may be implemented as at least part of, for
example, a power management integrated circuit (PMIC).
The battery 189 may supply power to at least one component of the
electronic device 101. According to an embodiment, the battery 189
may include, for example, a primary cell which is not rechargeable,
a secondary cell which is rechargeable, or a fuel cell.
The communication module 190 may support establishing a direct
(e.g., wired) communication channel or a wireless communication
channel between the electronic device 101 and the external
electronic device (e.g., the electronic device 102, the electronic
device 104, or the server 108) and performing communication via the
established communication channel. The communication module 190 may
include one or more communication processors that are operable
independently from the processor 120 (e.g., the application
processor (AP)) and supports a direct (e.g., wired) communication
or a wireless communication. According to an embodiment, the
communication module 190 may include a wireless communication
module 192 (e.g., a cellular communication module, a short-range
wireless communication module, or a global navigation satellite
system (GNSS) communication module) or a wired communication module
194 (e.g., a local area network (LAN) communication module or a
power line communication (PLC) module). A corresponding one of
these communication modules may communicate with the external
electronic device via the first network 198 (e.g., a short-range
communication network, such as Bluetooth.TM., wireless-fidelity
(Wi-Fi) direct, or infrared data association (IrDA)) or the second
network 199 (e.g., a long-range communication network, such as a
cellular network, the Internet, or a computer network (e.g., LAN or
wide area network (WAN)). These various types of communication
modules may be implemented as a single component (e.g., a single
chip), or may be implemented as multi components (e.g., multi
chips) separate from each other. The wireless communication module
192 may identify and authenticate the electronic device 101 in a
communication network, such as the first network 198 or the second
network 199, using subscriber information (e.g., international
mobile subscriber identity (IMSI)) stored in the subscriber
identification module 196.
The antenna module 197 may transmit or receive a signal or power to
or from the outside (e.g., the external electronic device) of the
electronic device 101. According to an embodiment, the antenna
module 197 may include an antenna including a radiating element
composed of a conductive material or a conductive pattern formed in
or on a substrate (e.g., PCB). According to an embodiment, the
antenna module 197 may include a plurality of antennas. In such a
case, at least one antenna appropriate for a communication scheme
used in the communication network, such as the first network 198 or
the second network 199, may be selected, for example, by the
communication module 190 (e.g., the wireless communication module
192) from the plurality of antennas. The signal or the power may
then be transmitted or received between the communication module
190 and the external electronic device via the selected at least
one antenna. According to an embodiment, another component (e.g., a
radio frequency integrated circuit (RFIC)) other than the radiating
element may be additionally formed as part of the antenna module
197.
At least some of the above-described components may be coupled
mutually and communicate signals (e.g., commands or data)
therebetween via an inter-peripheral communication scheme (e.g., a
bus, general purpose input and output (GPIO), serial peripheral
interface (SPI), or mobile industry processor interface
(MIPI)).
According to an embodiment, commands or data may be transmitted or
received between the electronic device 101 and the external
electronic device 104 via the server 108 coupled with the second
network 199. Each of the electronic devices 102 and 104 may be a
device of a same type as, or a different type, from the electronic
device 101. According to an embodiment, all or some of operations
to be executed at the electronic device 101 may be executed at one
or more of the external electronic devices 102, 104, or 108. For
example, if the electronic device 101 should perform a function or
a service automatically, or in response to a request from a user or
another device, the electronic device 101, instead of, or in
addition to, executing the function or the service, may request the
one or more external electronic devices to perform at least part of
the function or the service. The one or more external electronic
devices receiving the request may perform the at least part of the
function or the service requested, or an additional function or an
additional service related to the request, and transfer an outcome
of the performing to the electronic device 101. The electronic
device 101 may provide the outcome, with or without further
processing of the outcome, as at least part of a reply to the
request. To that end, a cloud computing, distributed computing, or
client-server computing technology may be used, for example.
FIG. 2A is a front perspective view of a mobile electronic device
according to an embodiment. FIG. 2B is a back perspective view of
an electronic device of FIG. 2A.
Referring to FIGS. 2A and 2B, an electronic device 200 (e.g., the
electronic device 100) according to an embodiment may include a
housing 210 including a first surface (or a front surface) 210A, a
second surface (or a back surface) 210B, and a side surface 210C
surrounding a space between the first surface 210A and the second
surface 210B. In another embodiment (not illustrated), a housing
may refer to a structure which forms a part of the first surface
210A, the second surface 210B, and side surfaces 210C of FIGS. 2A
and 2B. According to an embodiment, the first surface 210A may be
implemented with a front plate 202 (e.g., a glass plate including
various coating layers, or a polymer plate), at least a portion of
which is substantially transparent. The second surface 210B may be
implemented with a back plate 211 that is substantially opaque. For
example, the back plate 211 may be implemented with a coated or
colored glass, a ceramic, a polymer, a metal (e.g., aluminum,
stainless steel (STS), or magnesium), or a combination of at least
two of the materials. The side surface 210C may be coupled with the
front plate 202 or the back plate 211 and may be implemented with a
side bezel structure (or a "side member") 218 including a metal
and/or a polymer. In an embodiment, the back plate 211 and the side
bezel structure 218 may be integrally formed and may include the
same material (e.g., a metal material such as aluminum).
According to an embodiment, the electronic device 200 may include
at least one or more of a display 201 (e.g., the display device
160), an audio module (203, 207, 214) (e.g., the audio module 170),
a sensor module (204, 219) (e.g., the sensor module 176), a camera
module (205, 212, 213) (e.g., the camera module 180), an antenna
module 220 (e.g., an antenna module 197), a key input device (215,
216, 217) (e.g., an input device 150), an indicator 206, and a
connector hole (208, 209). In any embodiment, the electronic device
200 may not include at least one (e.g., the key input device (215,
216, 217) or the indicator 206) of the components or may further
include any other component (e.g., a pen input device).
The display 201 may be exposed through a considerable portion of
the front plate 202, for example. In an embodiment, at least part
of the display 201 may be exposed through the front plate 202
forming the first surface 210A. In an embodiment, a corner of the
display 201 may be formed to be mostly identical to a shape of an
outer portion of the front plate 202 adjacent thereto. In another
embodiment (not illustrated), to increase the area where the
display 201 is exposed, a difference between an outer portion of
the display 201 and an outer portion of the front plate 202 may be
formed mostly identically.
In another embodiment (not illustrated), a recess or an opening may
be defined in a portion of a screen display region of the display
201, and at least one or more of the audio module 214, the sensor
module 204, the camera module 205, and the indicator 206 may be
provided to be aligned with the recess or the opening. In another
embodiment (not illustrated), at least one or more of the audio
module 214, the sensor module 204, the camera module 205, and the
indicator 206 may be provided on a back surface of the display 201,
which corresponds to the screen display region. In another
embodiment (not illustrated), the display 201 may be combined with
a touch sensing circuit, a pressure sensor capable of measuring the
intensity (or pressure) of a touch, and/or a digitizer capable of
detecting a magnetic stylus pen or may be disposed adjacent
thereto.
The audio module (203, 207, 214) may include the microphone hole
203 and the speaker hole (207, 214). A microphone for obtaining
external sound may be disposed within the microphone hole 203; in
an embodiment, a plurality of microphones may be disposed to make
it possible to detect a direction of sound. The speaker hole (207,
214) may include the external speaker hole 207 and the receiver
hole 214 for call. In an embodiment, the speaker hole (207, 214)
and the microphone hole 203 may be implemented with one hole, or a
speaker (e.g., a piezoelectric speaker) may be included without the
speaker hole (207, 214).
The sensor module (204, 219) may generate an electrical signal or a
data value corresponding to an internal operation state of the
electronic device 200 or corresponding to an external environment
state. The sensor module (204, 219) may include, for example, the
first sensor module 204 (e.g., a proximity sensor) and/or a second
sensor module (not illustrated) (e.g., a fingerprint sensor)
positioned on the first surface 210A of the housing 210, and/or the
third sensor module 219 (e.g., a heart rate monitor (HRM) sensor)
positioned on the second surface 210B of the housing 210. The
fingerprint sensor may be positioned on the second surface 210B as
well as the first surface 210A (e.g., the display 201) of the
housing 210. The electronic device 200 may further include a sensor
module not illustrated, for example, at least one of a gesture
sensor, a gyro sensor, a barometric pressure sensor, a magnetic
sensor, an acceleration sensor, a grip sensor, a color sensor, an
infrared (IR) sensor, a biometric sensor, a temperature sensor, a
humidity sensor, or the illumination sensor 204.
The camera module (205, 212, 213) may include the first camera
device 205 positioned on the first surface 210A of the electronic
device 200, and the second camera module 212 and/or the flash 213
positioned on the second surface 210B. The camera devices 205 and
212 may include one or more lenses, an image sensor, and/or an
image signal processor. The flash 213 may include, for example, a
light emitting diode or a xenon lamp. In an embodiment, two or more
lenses (e.g., an infrared camera and wide-angle and telephoto
lenses) and image sensors may be disposed on one surface of the
electronic device 200.
The key input device (215, 216, 217) may include the home key
button 215 positioned on the first surface 210A of the housing 210,
the touch pad 216 positioned in the vicinity of the home key button
215, and/or the side key button 217 positioned on the side surface
210C of the housing 210. In another embodiment, the electronic
device 100 may not include all or a part of the aforementioned key
input devices 215, 216, and 217, and the key input device 215, 216,
and 217 not included may be implemented in the form of a soft key
on the display 201.
The indicator 206 may be positioned, for example, on the first
surface 210A of the housing 210. The indicator 206 may provide
state information of the electronic device 200, for example, in the
form of light, and may include an LED.
The connector hole (208, 209) may include the first connector hole
208 that is able to accommodate a connector (e.g., a USB connector)
for transmitting/receiving a power and/or data to/from an external
electronic device, and/or the second connector hole 209 that is
able to accommodate a connector (e.g., an earphone jack) for
transmitting/receiving an audio signal to/from the external
electronic device.
FIG. 3 is an exploded perspective view of an electronic device of
FIGS. 2A and 2B.
Referring to FIG. 3, an electronic device 300 (e.g., the electronic
device 101) may include a side bezel structure 310, a first support
member 311 (e.g., a bracket), a first antenna 320 (e.g., the
antenna module 197), a front plate 330a, a display 330b (e.g., the
display device 160), a printed circuit board 340, a battery 350
(e.g., the battery 189), a second support member 360 (e.g., a rear
case), a second antenna 370 (e.g., the antenna module 197), and a
rear plate 380. In any embodiment, the electronic device 300 may
not include at least one (e.g., the first support member 311 or the
second support member 360) of the components or may further include
any other component. At least one of the components of the
electronic device 300 may be similar to or the same as at least one
of the components of the electronic device 200 of FIG. 2A or 2B.
Thus, additional description will be omitted to avoid
redundancy.
The first support member 311 may be disposed in the electronic
device 300 so as to be connected with the side bezel structure 310,
or may be integrally formed with the side bezel structure 310. The
first support member 311 may be formed of, for example, a metal
material and/or a nonmetal material (e.g., polymer). The display
330b may be coupled with one surface of the first support member
311, and the printed circuit board 340 may be coupled with an
opposite surface of the first support member 311. A processor
(e.g., the processor 120), a memory (e.g., the memory 130), and/or
an interface (e.g., the interface 177) may be mounted on the
printed circuit board 340. For example, the processor may include
one or more of a central processing unit, an application processor,
a graphic processing device, an image signal processor, a sensor
hub processor, or a communication processor.
The memory may include, for example, a volatile memory or a
nonvolatile memory.
The interface may include, for example, a high definition
multimedia interface (HDMI), a universal serial bus (USB)
interface, a secure digital (SD) card interface, and/or an audio
interface. The interface may electrically or physically connect,
for example, the electronic device 300 with an external electronic
device and may include a USB connector, an SD card/MMC connector,
or an audio connector.
The battery 350 that is a device for supplying a power to at least
one component of the electronic device 300 may include, for
example, a primary cell incapable of being recharged, a secondary
cell rechargeable, or a fuel cell. At least a portion of the
battery 350 may be disposed on substantially the same plane as the
printed circuit board (PCB) 340, for example. The battery 350 may
be integrally disposed within the electronic device 300, or may be
disposed to be removable from the electronic device 300.
The first antenna 320 may be disposed in a part of the side bezel
structure 310. For example, the first antenna 320 may include at
least one antenna array. The antenna array may include a plurality
of antenna elements. According to an embodiment, the plurality of
antenna elements may be arranged in a specified layout. For
example, the antenna array may include 4 antenna elements; and the
antenna elements may be arranged in `1.times.4`. The electronic
device 300 may transmit or receive data by transmitting or
receiving an RF signal through the first antenna 320. The first
antenna 320 may operate as a key input device (e.g., the side key
button 217).
The second antenna 370 may be interposed between the rear plate 380
and the battery 350. The second antenna 370 may include, for
example, a near field communication (NFC) antenna, an antenna for
wireless charging, and/or a magnetic secure transmission (MST)
antenna. For example, the second antenna 370 may perform short
range communication with an external device or may wirelessly
transmit/receive a power necessary to charge. In another
embodiment, an antenna structure may be formed by a part of the
side bezel structure 310 and/or the first support member 311, or by
a combination thereof.
FIG. 4A is a view illustrating a structure of an antenna module,
according to an embodiment of the disclosure. FIG. 4B is a
cross-sectional view taken along a line A-A' of FIG. 4A. FIG. 4C is
a cross-sectional view taken along a line B-B' of FIG. 4A. FIG. 4D
is a view illustrating the antenna module of FIG. 4A when viewed
from one side. FIG. 4E is a view illustrating the antenna module of
FIG. 4A when viewed from another side.
According to an embodiment, an antenna module 420 (e.g., the first
antenna 320) may be disposed on a portion of a metal bezel 410
(e.g., the side bezel structure 310). The antenna module 420 may
include a bezel portion BZ and a module PCB portion MPCB. The
module PCB portion MPCB may be disposed under the bezel portion
BZ.
According to an embodiment, the bezel portion BZ may include a
bezel patch 421 and a bezel cavity 422. For purposes of this
document, "include" shall refer to, in addition to it plain and
ordinary meaning, a circumstance where first element has an opening
and a second element is in the opening, where there is a narrow
space separating the second element from the first element on all
sides such that the second element does not make contact with the
first element.
For example, the bezel patch 421 may be formed of the same or
similar material as the metal bezel 410. The bezel patch 421 may be
spaced from the metal bezel 410 through a bezel slit BS. Although
in the displayed embodiment, the bezel slit BS completely surrounds
the bezel patch, in other embodiments, the bezel patch 421 may be
connected to the metal bezel 410 by at least portion in the path of
the bezel split BS. The bezel patch 421 may be spaced from the
metal bezel 410 by a first slit size S1. For example, the size of
the bezel slit BS may be formed as about 0.25 mm; the appearance of
the metal bezel 410 due to the bezel slit BS may be minimally
affected through the bezel patch 421. In some embodiments the slit
can have a size that is small enough to be only visible on close
inspection.
The bezel cavity 422 may be filled with a dielectric substance
vertically supporting the bezel patch 421. The bezel cavity 422 may
operate as an electrical cavity in an RF signal. During the
transmission and reception of an antenna, the transmitted and
received signal may resonate in the bezel cavity 422, and the
antenna module 420 may secure antenna performance. The bezel cavity
422 may be formed to have a constant height.
According to an embodiment, the module PCB portion MPCB may include
a plurality of layers. For example, the first layer of the module
PCB portion MPCB may include a first conductive pattern 423a and a
second conductive pattern 423b. The second conductive pattern 423b
may be positioned surrounded by the first conductive pattern 423a;
the first conductive pattern 423a and the second conductive pattern
423b may be spaced from each other through a substrate slit PS. The
bezel slit BS and the substrate slit PS may be arranged by being
aligned vertically. The substrate slit PS may have a first slit
size S1 the same as the bezel slit BS. The second layer of the
module PCB portion MPCB may include a ground pattern 425. The
ground pattern 425 and the first conductive pattern 423a may be
arranged by being aligned vertically.
According to an embodiment, a first feed part 426a (e.g., vertical
feed part) and a second feed part 426b (e.g., horizontal feed part)
may be interposed between the first layer and the second layer of
the module PCB portion MPCB. For example, the first feed part 426a
and the second feed part 426b may not be connected to the first
conductive pattern 423a and the second conductive pattern 423b. The
first feed part 426a and second feed part 426b may feed the
substrate slit PS in the coupling scheme.
According to an embodiment, the first feed part 426a may be
disposed in a direction perpendicular to the second feed part 426b.
For example, the first feed part 426a may be disposed perpendicular
to the first side surface of the bezel patch 421; the second feed
part 426b may be disposed perpendicular to the second side surface
of the bezel patch 421 perpendicular to the first side surface.
During the operation of an antenna, the first feed part 426a may
form the radiation component of vertical polarization; the second
feed part 426b may form the radiation component of horizontal
polarization.
According to an embodiment, the first feed part 426a may be
connected to the RF IC through a first feed via 427a. The second
feed part 426b may be connected to an RF IC through a second feed
via 427b. Alternatively, the first feed via 427a and the second
feed via 427b may be connected to the RF IC through additional
wiring. The module PCB portion MPCB may include a circuit (e.g.,
the antenna module 197) for communication including the RF IC.
According to an embodiment, the antenna module 420 may include at
least one antenna array. The antenna array may include a plurality
of antenna elements AE1, AE2, AE3, and AE4. For example, a
plurality of antenna elements AE1, AE2, AE3, and AE4 may be
disposed on the metal bezel 410 in a line. Each of the antenna
elements AE1, AE2, AE3, and AE4 may include the same configuration
and may be formed in the same size. However, the configuration and
size of the antenna elements AE1, AE2, AE3, and AE4 are not limited
thereto.
According to an embodiment, the metal bezel 410 of the antenna
elements AE1, AE2, AE3, and AE4 may be formed to be connected
integrally. The bezel patch 421 or bezel cavity 422 of each of the
antenna elements AE1, AE2, AE3, and AE4 may be formed to be
separated from each other. The first feed part 426a or the ground
pattern 425 of each of the antenna elements AE1, AE2, AE3, and AE4
may be formed to be separated from each other through a pattern gap
PG. The first feed part 426a or the ground pattern 425 of each of
the antenna elements AE1, AE2, AE3, and AE4 may be disposed spaced
from each other by a first pattern gap size G1.
According to an embodiment, the bezel cavity 422 of each of the
antenna elements AE1, AE2, AE3, and AE4 may be formed inside the
metal bezel 410. Accordingly, only the bezel slit BS is observed
outside the metal bezel 410; the bezel cavity 422 does not affect
the appearance of the metal bezel 410.
According to an embodiment, the resonant frequency of the antenna
signal may vary depending on the widths of the bezel slit BS or the
substrate slit PS. The resonant frequency of the antenna signal may
be changed depending on the sizes of the bezel patch 421 or the
second conductive pattern 423b. The resonant frequency of the
antenna signal may be changed depending on the size of the bezel
cavity 422.
As described above, in an electronic device (e.g., the electronic
device 200) according to certain embodiments, the antenna module
420 may be disposed on the metal bezel 410. The antenna module 420
may include the bezel patch 421 separated from the metal bezel 410
through the bezel slit BS. The bezel cavity 422 may be formed
inside the metal bezel 410 to secure antenna performance.
Accordingly, the antenna performance may be secured through the
bezel cavity 422; because the bezel slit BS is capable of being
implemented with very small width, the electronic device may
arrange the antenna module 420 while minimizing the effect on the
appearance of the metal bezel 410.
FIG. 5A is a view illustrating a radiation operation of the antenna
module of FIG. 4A. FIG. 5B is a view illustrating a resonance
effect of the antenna module of FIG. 4A. FIG. 5C is a view
illustrating a resonance effect between feed parts of the antenna
module of FIG. 4A. FIG. 5D is a view illustrating transmission and
reception performance of the antenna module of FIG. 4A.
Referring to FIGS. 4A to 4E and 5A, when the antenna signal is fed
to the first feed part 426a and the second feed part 426b, the
antenna signal may resonate within the bezel cavity 422 and may be
radiated through the bezel slit BS. The resonant frequency of the
antenna signal may be changed depending on the size of the bezel
cavity 422, the size of the bezel patch 421, or the width of the
bezel slit BS.
Referring to FIG. 5B, the graph illustrating the result of the
radiation simulation for the antenna illustrated in FIG. 4A is
illustrated. Referring to the graph, it may be understood that a
resonance is formed at around 26.5 GHz. It may be understood that
the antenna module 420 may transmit and receive an antenna signal
in the band of a high frequency (e.g., about 26.5 GHz) by forming
the bezel cavity 422 and the bezel slit BS on the metal bezel 410.
For example, referring to Table 1, the antenna module 420 may have
a band width of about 2 GHz.
TABLE-US-00001 TABLE 1 Frequency (GHz) 25.5 26.5 27.5 Element gain
(dB) 7.403 8.73 6.12
Referring to FIG. 5C, the graph illustrating the result of the
radiation simulation between the first feed part 426a and the
second feed part 426b is illustrated. Referring to the graph, it
may be understood that the isolation performance of the antenna
module 420 having an S-parameter value of about -15 dB or less over
the entire band is specified.
Referring to FIG. 5D, the graph illustrating the radiation pattern
of the antenna module 420 is illustrated. Referring to the graph,
for example, when the antenna module 420 includes 1.times.4 antenna
elements AE1, AE2, AE3, and AE4, it may be understood that beam
forming is formed normally.
TABLE-US-00002 TABLE 2 Element Array Gain (dB) 8.74 14.6
Table 2 illustrates gains in the case of operating as an antenna
element and an antenna array. It may be understood that the antenna
element gain is greater than the antenna array gain by about 6 dB
(4 times) due to the characteristics of the 1.times.4 antenna
array.
FIG. 6A is a view illustrating a structure of an antenna module,
according to another embodiment of the disclosure. FIG. 6B is a
sectional view taken along a line C-C' of FIG. 6A. FIG. 6C is a
sectional view taken along a line D-D' of FIG. 6A.
Referring to FIGS. 6A to 6C, a single antenna element AE included
in an antenna module (e.g., the antenna module 420) is illustrated.
The description about the configuration the same as or similar to
that of the first antenna element AE1 of FIGS. 4A to 4E will be
omitted.
According to an embodiment, the antenna element AE may include the
bezel portion BZ and the module PCB portion MPCB. The module PCB
portion MPCB may be disposed under the bezel portion BZ.
According to an embodiment, the bezel portion BZ may include at
least one bezel slit. For example, the bezel portion BZ may include
first and second bezel slits BS1 and BS2. The bezel portion BZ may
include a outer bezel patch 621a and an inner bezel patch 621b,
which are separated through the first and second bezel slits BS1
and BS2. The outer bezel patch 621a and the inner bezel patch 621b
may be formed of the same or similar material as a metal bezel 610.
The antenna module may operate (e.g., two different resonance
frequencies) at the resonant frequency corresponding to the number
of bezel slits (e.g., two) included in the antenna element.
According to an embodiment, the outer bezel patch 621a and the
inner bezel patch 621b may have different sizes from each other.
For example, the length of one side of the outer bezel patch 621a
may be different from the length of one side of the inner bezel
patch 621b. The length of one side of the outer bezel patch 621a
may be greater than the length of one side of the inner bezel patch
621b. The resonant frequency of the antenna module may be changed
depending on the lengths of sides of the outer bezel patch 621a and
the inner bezel patch 621b.
According to an embodiment, the first and second bezel slits BS1
and BS2 may have different sizes from each other. For example, the
outer bezel patch 621a may be spaced from the metal bezel 610 by a
first slit size S1. The inner bezel patch 621b may be spaced from
the outer bezel patch 621a by a second slit size S2. The inner
bezel patch 621b may be disposed inside the outer bezel patch 621a.
The outer bezel patch 621a and the inner bezel patch 621b may share
a center. In an embodiment, the second slit size S2 may be smaller
than the first slit size S1. The resonant frequency of the antenna
module may be changed depending on the first and second slit sizes
S1 and S2.
According to an embodiment, the bezel portion BZ may include a
bezel cavity 622. For example, the bezel cavity 622 may be filled
with a dielectric substance providing vertical support for the
outer bezel patch 621a and inner bezel patch 621b. The bezel cavity
622 may operate as an electrical cavity in an RF signal. During the
transmission and reception of an antenna, the transmitted and
received signal may resonate in the bezel cavity 622, and the
antenna module may secure antenna performance. The bezel cavity 622
may be formed to have a constant height.
According to an embodiment, the module PCB portion MPCB may include
a plurality of layers. For example, the first layer of the module
PCB portion MPCB may include a first conductive pattern 623a and a
second conductive pattern 623b. The second conductive pattern 623b
may be positioned surrounded by the first conductive pattern 623a;
the first conductive pattern 623a and the second conductive pattern
623b may be spaced from each other through a substrate slit PS. The
substrate slit PS may be disposed at a location corresponding to
the first bezel slit BS1. The substrate slit PS may have a first
slit size S1 the same as the bezel slit BS. The second layer of the
module PCB portion MPCB may include a ground pattern 625.
FIG. 7A is a view illustrating a resonance effect of the antenna
module of FIG. 6A. FIG. 7B is a view illustrating the first
transmission and reception performance of the antenna module of
FIG. 6A. FIG. 7C is a view illustrating the second transmission and
reception performance of the antenna module of FIG. 6A. When the
antenna signal is fed to a first feed part 626a and a second feed
part 626b, the antenna signal may resonate within the bezel cavity
622 and may be radiated through the bezel slit BS. The resonant
frequency of the antenna signal may be changed depending on the
size of the bezel cavity 622, the sizes of the outer bezel patch
621a and the inner bezel patch 621b, or the widths of the first and
second bezel slits BS1 and BS2. In addition, because a single
antenna element AE includes two bezel slits BS1 and BS2, two
resonant frequencies may be identified in the graph.
Referring to FIG. 7A, the graph illustrating the result of the
radiation simulation for the antenna module illustrated in FIG. 6A
is illustrated. Referring to the graph, it may be understood that a
resonance is formed at around 28.5 GHz and 38.5 GHz. It may be
understood that an antenna module 620 may transmit and receive an
antenna signal in two frequency bands (e.g., about 28.5 GHz and
about 38.5 GHz) by forming the bezel cavity 622 and the two bezel
slits BS1 and BS2 on the metal bezel 610.
Referring to FIGS. 7B and 7C, the graph illustrating the result of
the radiation pattern for the antenna module illustrated in FIG. 6A
is illustrated. Referring to the graph, for example, FIG. 7B
illustrates the radiation pattern in a low band (e.g., about 28.5
GHz); FIG. 7C illustrates the radiation pattern in a high band
(e.g., about 38.5 GHz); it may be seen that beam forming is
normally formed.
TABLE-US-00003 TABLE 3 Frequency (GHz) 28.5 38.5 Gain (dB) 7.48
5.15
Table 3 illustrates the antenna element gain of the antenna module
620 in the dual band (e.g., about 28.5 GHz and 38.5 GHz)
illustrated in FIG. 6A. According to the antenna element gain, it
may be seen that the antenna module illustrated in FIG. 6A operates
normally as a dual band.
FIG. 8 is a diagram illustrating a structure of an antenna module
used as a switch, according to an embodiment of the disclosure.
Referring to FIG. 8, the antenna element AE may include a first
inductor 828a and a second inductor 828b. In the antenna element
AE, the description about the configuration having the structure
the same as or similar to that of the first antenna element AE1 of
FIGS. 4A to 4E will be omitted.
According to an embodiment, the first inductor 828a may be
connected between a metal bezel 810 and a bezel patch 821. The
second inductor 828b may be connected to a second conductive
pattern 823b. A first capacitive sensor 891a (e.g. a capacitive
transmission sensor) may be connected to the metal bezel 810. A
second capacitive sensor 891b (e.g. a capacitive reception sensor)
may be connected to the second inductor 828b. The first capacitive
sensor 891a may transmit a sensor signal, and the second capacitive
sensor 891b may detect the strength of the sensor signal. The
low-frequency signal may be used as the sensor signal rather than
the antenna signal so as to pass through the first inductor 828a
and the second inductor 828b. Because the antenna signal is a
relatively high-frequency signal, the antenna signal may not pass
through the first inductor 828a and the second inductor 828b.
According to an embodiment, the inductance values of the first
inductor 828a and the second inductor 828b may be designed based on
the frequencies of the antenna signal and the sensor signal.
According to an embodiment, when the first capacitive sensor 891a
applies the sensor signal, a first electric field FD1 may occur
between the bezel patch 821 and the second conductive pattern 823b.
When a dielectric substance 890 (e.g., the finger of a human)
contacts the bezel patch 821, a second electric field FD2 may occur
and the first electric field FD1 may decrease. The second
capacitive sensor 891b may generate a switch signal by detecting
the increase or decrease of the first electric field FD1. For
example, when the strength of the first electric field FD1 is
reduced to the threshold value or less, an electronic device may
determine that the dielectric substance 890 is touched.
Accordingly, the electronic device may utilize an antenna module as
a switch.
According to an embodiment, when the dielectric substance 890 is
touched to the antenna element AE, the electronic device may stop
utilizing the antenna array including the antenna element AE and
may use the antenna array mounted at another location.
Alternatively, when the dielectric substance 890 is touched to the
antenna element AE, the electronic device may stop utilizing the
touched antenna element AE and may perform communication using
another antenna element.
FIG. 9A is a view illustrating a resonance effect of the antenna
module of FIG. 8. FIG. 9B is a view illustrating the transmission
and reception performance of the antenna module of FIG. 8.
FIGS. 9A and 9B are graphs illustrating the effect of performance
when an inductor is connected to an antenna element. Referring to
FIGS. 9A and 9B, it may be seen that there is minimal, if not no
difference in antenna performance between the case where the
inductor is connected to the antenna element (e.g., the case where
the antenna element is used as a touch switch) and the case where
the inductor is not connected to the antenna element (e.g., the
case where the antenna element is not used as a touch switch).
FIGS. 10A and 10B are diagrams illustrating a structure of an
antenna module used as a switch, according to another embodiment of
the disclosure.
According to an embodiment, an antenna module 1020 may be used as a
physical switch. The antenna module 1020 may include a first bezel
patch 1021a (e.g., a switch bezel patch) and a second bezel patch
1021b (e.g., the bezel patch 421). The first bezel patch 1021a may
be configured to perform a switching operation while being
separated from a metal bezel 1010 through a switch separation slit.
The first bezel patch 1021a may be combined with a tact switch 1094
to operate as the physical switch. The second bezel patch 1021b may
be distinguished from the first bezel patch 1021a through a bezel
slit (e.g., the bezel slit BS).
According to an embodiment, a module PCB portion may include a
first module PCB portion MPCB1 (e.g., a module printed circuit
board) and a second module PCB portion MPCB2 (e.g., a control
printed circuit board). The first module PCB portion MPCB1 and the
first bezel patch 1021a may be arranged to be aligned vertically.
The first module PCB portion MPCB1 may include first and second
conductive patterns (e.g., first and second conductive patterns
423a and 423b), a ground pattern (e.g., the ground pattern 425),
and first and second feed parts (e.g., the first and second feed
parts 426a and 426b). The first module PCB portion MPCB1 may be
interposed between the first bezel patch 1021a and the tact switch
1094. The second module PCB portion MPCB2 may be connected to the
first module PCB portion MPCB1 through a flexible printed circuit
board (FPCB) 1092. The second module PCB portion MPCB2 may include
a circuit (e.g., the antenna module 197) for communication
including an RF IC.
According to an embodiment, the antenna module 1020 may include a
switch support member 1095 and a substrate reinforcement member
1096. The tact switch 1094 may be mounted in the switch support
member 1095. The tact switch 1094 may be fixed to the first module
PCB portion MPCB1 through the switch support member 1095. The
substrate reinforcement member 1096 may be interposed between the
first module PCB portion MPCB1 and the tact switch 1094. The
substrate reinforcement member 1096 may supplement the stiffness of
the first module PCB portion MPCB1.
FIG. 11 is a diagram illustrating a structure of an antenna module
used as a switch, according to still another embodiment of the
disclosure.
According to an embodiment, an antenna module 1120 may be used as a
physical switch. The antenna module 1120 may be implemented with a
slit antenna. The antenna module 1120 may include a switch bezel
patch 1121; an antenna slit SL may be formed in the switch bezel
patch 1121. The switch bezel patch 1121 may operate as a physical
switch in combination with a tact switch (e.g., the tact switch
1094).
According to an embodiment, a module PCB portion may include the
first module PCB portion MPCB1 and the second module PCB portion
MPCB2. The first module PCB portion MPCB1 may be interposed between
the switch bezel patch 1121 and a tact switch. The second module
PCB portion MPCB2 may be connected to the first module PCB portion
MPCB1 through a FPCB 1192. The second module PCB portion MPCB2 may
include a circuit (e.g., the antenna module 197) for communication
including an RF IC.
According to an embodiment, the antenna module 1120 may include a
switch support member (e.g., the switch support member 1095) and a
substrate reinforcement member (e.g., a substrate reinforcement
member 1096). The tact switch may be mounted in the switch support
member. The tact switch may be fixed to the first module PCB
portion MPCB1 through the switch support member. The substrate
reinforcement member may be interposed between the first module PCB
portion MPCB1 and the tact switch. The substrate reinforcement
member may supplement the stiffness of the first module PCB portion
MPCB1.
FIG. 12A is a view illustrating a structure of an antenna module
including a support structure, according to an embodiment of the
disclosure. FIG. 12B is a sectional view taken along a line E-E' of
FIG. 12A. FIG. 12C is a sectional view taken along a line F-F' of
FIG. 12A.
Referring to FIGS. 12A to 12C, a single antenna element AE included
in an antenna module (e.g., the antenna module 420) is illustrated.
The description about the configuration the same as or similar to
that of the first antenna element AE1 of FIGS. 4A to 4E will be
omitted.
According to an embodiment, the antenna element AE may include a
bezel patch 1221a and an injection coupling part 1221b. The bezel
patch 1221a and the injection coupling part 1221b may be formed
integrally. For example, the injection coupling part 1221b may be
formed in a cylindrical shape at the center of the bottom surface
of the bezel patch 1221a. The injection coupling part 1221b is
formed in the form of a screw so as to be coupled to a dielectric
substance filled in a bezel cavity 1222. The bezel patch 1221a may
strengthen the bond with the dielectric substance filled in the
bezel cavity 1222, through the injection coupling part 1221b.
FIG. 12D is a view illustrating an electric field in the case where
power is supplied to the antenna module of FIG. 12A. FIG. 12D
illustrates how the injection coupling part 1221b affects antenna
performance.
Referring to FIG. 12D, when a first feed part 1226a or a second
feed part 1226b is fed, the electric field E-Field formed in the
antenna element AE is illustrated. When the power is fed to the
first feed part 1226a or the second feed part 1226b, it may be seen
that the electric field is weakest in the central portion of the
bezel patch 1221a. Accordingly, when the injection coupling part
1221b is formed in the central portion of the bezel patch 1221a,
the change in antenna performance due to the injection coupling
part 1221b may be minimized.
FIG. 13 is a communication system of an electronic device,
according to an embodiment of the disclosure.
Referring to FIG. 13, a communication system (e.g., the
communication module 190) may include a switch group 1310, an RF IC
1320, an IF IC 1350, and a communication processor 1370. In certain
embodiments, the communication system may further include one or
more components not illustrated in FIG. 4 or may not include a part
of components illustrated in FIG. 4. For example, an additional RF
IC may be added to the components of the communication system.
According to an embodiment, an antenna element (e.g., 1341_1 or
1341_n) included in a first antenna array 1341 may be connected
with an RF IC 1320_1 through a switch 1311_1 included in the switch
group 1310. For example, in the case where an electronic device
(e.g., the electronic device 101) transmits an RF signal (e.g., in
the case of a signal transmit mode), the switch 1311_1 may connect
an antenna element (e.g., 1341_1) and a power amplifier (PA) (e.g.,
1321); in the case where the electronic device receives an RF
signal (e.g., in the case of a signal receive mode), the switch
1311_1 may connect the antenna element (e.g., 1341_1) and a low
noise amplifier (LNA) (e.g., 1331).
According to an embodiment, the RF IC 1320 may include a transmit
path 1320_1t and a receive path 1320_1r with regard to an RF
signal.
According to an embodiment, in the case where the electronic device
is in the signal transmit mode, the PA 1321, a first variable gain
amplifier (VGA) 1322, a phase shifter (PS) 1323, a second VGA 1324,
a splitter 1325, and a mixer 1326 may be positioned on the transmit
path 1320_1t of the RF signal.
The PA 1321 may amplify a power of the RF signal. According to an
embodiment, the PA 1321 may be mounted inside or outside the RF IC
1320. The first VGA 1322 and the second VGA 1324 may perform a
transmit auto gain control (AGC) operation under control of the
communication processor 1370. According to an embodiment, the
number of variable gain amplifiers may be 2 or more or may be less
than 2. The PS 1323 may change a phase of the RF signal based on a
beamforming angle under control of the communication processor
1370. The splitter 1325 may divide an RF signal from the mixer 1326
into `n` signals. The number of the divided signals may be the same
as the number of antenna elements (e.g., 1341_1 to 1341_n) included
in the first antenna array 1341. The mixer 1326 may upconvert an IF
signal from the IF IC 1350 to the RF signal. In an embodiment, the
mixer 1326 may receive a signal to be mixed from an internal or
external oscillator.
According to an embodiment, in the case where the electronic device
is in the signal receive mode, the LNA 1331, a PS 1332, a first VGA
1333, a combiner 1334, a second VGA 1335, and a mixer 1336 may be
positioned on the receive path 1320_1r of the RF signal.
The LNA 1331 may amplify an RF signal received from an antenna
element (e.g., 1341_1 or 1341_n). The first VGA 1333 and the second
VGA 1335 may perform a receive AGC operation under control of the
communication processor 1370. According to an embodiment, the
number of variable gain amplifiers may be 2 or more or may be less
than 2. The PS 1332 may change a phase of the RF signal based on a
beamforming angle under control of the communication processor
1370. The combiner 1334 may combine RF signals aligned in phase
through a phase shift operation. The combined signal may be
provided to the mixer 1336 through the second VGA 1335. The mixer
1336 may downconvert the received RF signal to an IF signal. In an
embodiment, the mixer 1336 may receive a signal to be mixed from an
internal or external oscillator.
According to an embodiment, the RF IC 1320 may further include a
switch 1337 that electrically connects the mixers 1326 and 1336 and
the IF IC 1350. The switch 1337 may selectively connect the
transmit path 1320_1t or the receive path 1320_1r of the RF signal
with the IF IC 1350.
According to an embodiment, a mixer 1353, a third VGA 1354, a low
pass filter (LPF) 1355, a fourth VGA 1356, and a buffer 1357 may be
positioned on the transmit path 1350_t of the IF IC 1350. The mixer
1353 may convert a balanced in-phase/quadrature-phase (I/Q) signal
of a base band to an IF signal. The LPF 1355 may function as a
channel filter which uses a bandwidth of a baseband signal as a
cutoff frequency. In an embodiment, the cutoff frequency may be
variable. The first VGA 1354 and the second VGA 1356 may perform
the transmit AGC operation under control of the communication
processor 1370. According to an embodiment, the number of variable
gain amplifiers may be 2 or more or may be less than 2. The buffer
1357 may function as buffering upon receiving the Balanced I/Q
signal from the communication processor 1370, and thus, the IF IC
1350 may stably process the Balanced I/Q signal.
According to an embodiment, a mixer 1361, a third VGA 1362, an LPF
1363, a fourth VGA 1364, and a buffer 1365 may be positioned on the
receive path 1350_r of the IF IC 1350. The functions of the third
VGA 1362, the LPF 1363, and the fourth VGA 1364 may be the same as
or similar to the functions of the third VGA 1354, the LPF 1355,
and the fourth VGA 1356 positioned on the transmit path 1350_t. The
mixer 1361 may convert the IF signal from the RF IC 1320 into a
balanced I/Q signal of the baseband. The buffer 1365 may function
as buffering upon providing the communication processor 1370 with
the Balanced I/Q signal passing through the fourth VGA 1364, and
thus, the IF IC 1350 may stably process the Balanced I/Q
signal.
According to an embodiment, the communication processor 1370 may
include a Tx I/Q digital analog converter (DAC) 1371 and an Rx I/Q
analog digital converter (ADC) 1372. In an embodiment, the Tx I/Q
DAC 1371 may convert a digital signal modulated by a modem to the
Balanced I/Q signal and may provide the Balanced I/Q signal to the
IF IC 1350. In an embodiment, the Rx I/Q ADC 1372 may convert the
Balanced I/Q signal which is converted by the IF IC 1350 and may
provide the digital signal to the modem. According to certain
embodiments, the communication processor 1370 may perform multi
input multi output (MIMO) or diversity. According to certain
embodiments, the communication processor 1370 may be implemented
with a separate chip or may be implemented in one chip together
with any other component (e.g., the IF IC 1350).
The electronic device according to certain embodiments may be one
of various types of electronic devices. The electronic devices may
include, for example, a portable communication device (e.g., a
smartphone), a computer device, a portable multimedia device, a
portable medical device, a camera, a wearable device, or a home
appliance. According to an embodiment of the disclosure, the
electronic devices are not limited to those described above.
It should be appreciated that certain embodiments of the disclosure
and the terms used therein are not intended to limit the
technological features set forth herein to particular embodiments
and include various changes, equivalents, or replacements for a
corresponding embodiment. With regard to the description of the
drawings, similar reference numerals may be used to refer to
similar or related elements. It is to be understood that a singular
form of a noun corresponding to an item may include one or more of
the things, unless the relevant context clearly indicates
otherwise. As used herein, each of such phrases as "A or B," "at
least one of A and B," "at least one of A or B," "A, B, or C," "at
least one of A, B, and C," and "at least one of A, B, or C," may
include any one of, or all possible combinations of the items
enumerated together in a corresponding one of the phrases. As used
herein, such terms as "1st" and "2nd," or "first" and "second" may
be used to simply distinguish a corresponding component from
another, and does not limit the components in other aspect (e.g.,
importance or order). It is to be understood that if an element
(e.g., a first element) is referred to, with or without the term
"operatively" or "communicatively", as "coupled with," "coupled
to," "connected with," or "connected to" another element (e.g., a
second element), it means that the element may be coupled with the
other element directly (e.g., wiredly), wirelessly, or via a third
element.
As used herein, the term "module" may include a unit implemented in
hardware, software, or firmware, and may interchangeably be used
with other terms, for example, "logic," "logic block," "part," or
"circuitry". A module may be a single integral component, or a
minimum unit or part thereof, adapted to perform one or more
functions. For example, according to an embodiment, the module may
be implemented in a form of an application-specific integrated
circuit (ASIC).
Certain embodiments as set forth herein may be implemented as
software (e.g., the program 140) including one or more instructions
that are stored in a storage medium (e.g., internal memory 136 or
external memory 138) that is readable by a machine (e.g., the
electronic device 101). For example, a processor (e.g., the
processor 120) of the machine (e.g., the electronic device 101) may
invoke at least one of the one or more instructions stored in the
storage medium, and execute it, with or without using one or more
other components under the control of the processor. This allows
the machine to be operated to perform at least one function
according to the at least one instruction invoked. The one or more
instructions may include a code generated by a compiler or a code
executable by an interpreter. The machine-readable storage medium
may be provided in the form of a non-transitory storage medium.
Wherein, the term "non-transitory" simply means that the storage
medium is a tangible device, and does not include a signal (e.g.,
an electromagnetic wave), but this term does not differentiate
between where data is semi-permanently stored in the storage medium
and where the data is temporarily stored in the storage medium.
According to an embodiment, a method according to certain
embodiments of the disclosure may be included and provided in a
computer program product. The computer program product may be
traded as a product between a seller and a buyer. The computer
program product may be distributed in the form of a
machine-readable storage medium (e.g., compact disc read only
memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)
online via an application store (e.g., PlayStore.TM.), or between
two user devices (e.g., smart phones) directly. If distributed
online, at least part of the computer program product may be
temporarily generated or at least temporarily stored in the
machine-readable storage medium, such as memory of the
manufacturer's server, a server of the application store, or a
relay server.
According to certain embodiments, each component (e.g., a module or
a program) of the above-described components may include a single
entity or multiple entities. According to certain embodiments, one
or more of the above-described components may be omitted, or one or
more other components may be added. Alternatively or additionally,
a plurality of components (e.g., modules or programs) may be
integrated into a single component. In such a case, according to
certain embodiments, the integrated component may still perform one
or more functions of each of the plurality of components in the
same or similar manner as they are performed by a corresponding one
of the plurality of components before the integration. According to
certain embodiments, operations performed by the module, the
program, or another component may be carried out sequentially, in
parallel, repeatedly, or heuristically, or one or more of the
operations may be executed in a different order or omitted, or one
or more other operations may be added.
According to embodiments disclosed in the specification, an antenna
module may not affect the appearance of an electronic device by
forming a very thin slit on a metal bezel and by forming an antenna
module on the metal bezel itself.
According to embodiments disclosed in the specification, an antenna
module may be formed on a metal bezel itself and may be used as a
key input device.
According to embodiments disclosed in the specification, an antenna
module may have a plurality of frequency bands by forming a
plurality of slits of different sizes on a metal bezel.
A variety of effects directly or indirectly understood through this
disclosure may be provided.
While the disclosure has been shown and described with reference to
certain embodiments thereof, it will be understood by those skilled
in the art that various changes in form and details may be made
therein without departing from the spirit and scope of the
disclosure as defined by the appended claims and their
equivalents.
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