U.S. patent number 11,054,954 [Application Number 16/828,296] was granted by the patent office on 2021-07-06 for fingerprint detection device and display device.
This patent grant is currently assigned to Japan Display Inc.. The grantee listed for this patent is Japan Display Inc.. Invention is credited to Hayato Kurasawa, Yoshitaka Ozeki, Yuji Suzuki, Toshinori Uehara.
United States Patent |
11,054,954 |
Kurasawa , et al. |
July 6, 2021 |
Fingerprint detection device and display device
Abstract
According to an aspect, a fingerprint detection device includes:
a substrate; a plurality of drive electrodes provided on one
surface side of the substrate and arranged in a first direction; a
plurality of detection electrodes provided on the one surface side
and arranged in a second direction intersecting the first
direction; and an insulating layer provided in a normal direction
of the substrate between each of the drive electrodes and the
corresponding detection electrodes. The detection electrodes
intersect the drive electrodes in the normal direction of the
substrate. The detection electrodes include: a first metallic
layer; and a second metallic layer positioned closer to the one
surface than the first metallic layer to the one surface. The first
metallic layer has a reflectance of visible light lower than that
of the second metallic layer.
Inventors: |
Kurasawa; Hayato (Tokyo,
JP), Ozeki; Yoshitaka (Tokyo, JP), Uehara;
Toshinori (Tokyo, JP), Suzuki; Yuji (Tokyo,
JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Japan Display Inc. |
Tokyo |
N/A |
JP |
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Assignee: |
Japan Display Inc. (Tokyo,
JP)
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Family
ID: |
1000005661821 |
Appl.
No.: |
16/828,296 |
Filed: |
March 24, 2020 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200226343 A1 |
Jul 16, 2020 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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PCT/JP2018/036258 |
Sep 28, 2018 |
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Foreign Application Priority Data
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Sep 29, 2017 [JP] |
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JP2017-191845 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F
3/0446 (20190501); G06F 3/0448 (20190501); G06K
9/0004 (20130101); G06F 3/0445 (20190501); G06F
3/0421 (20130101); G06F 2203/04112 (20130101); G06F
2203/04107 (20130101) |
Current International
Class: |
G06F
3/044 (20060101); G06F 3/042 (20060101); G06K
9/00 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2001-052148 |
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Jun 2002 |
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JP |
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2011-180854 |
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Sep 2011 |
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JP |
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2012-511360 |
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May 2012 |
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JP |
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2014-529128 |
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Oct 2014 |
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JP |
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2014-219987 |
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Nov 2014 |
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JP |
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2015-230607 |
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Dec 2015 |
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JP |
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2017-059147 |
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Mar 2017 |
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JP |
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WO2017/150197 |
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Sep 2017 |
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WO |
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Other References
International Search Report issued in International Patent
Application No. PCT/JP2018/036258, dated Oct. 30, 2018, and English
translation of same. 6 pages. cited by applicant.
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Primary Examiner: Xavier; Antonio
Attorney, Agent or Firm: K&L Gates
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of International Application No.
PCT/JP2018/036258, filed on Sep. 28, 2018, which claims priority to
Japanese Application No. 2017-191845, filed on Sep. 29, 2017. The
contents of these applications are incorporated herein by reference
in their entirety.
Claims
What is claimed is:
1. A fingerprint detection device, comprising: a substrate; a
plurality of drive electrodes provided on one surface side of the
substrate and arranged in a first direction; a plurality of
detection electrodes provided on the one surface side and arranged
in a second direction intersecting the first direction; and an
insulating layer provided in a normal direction of the substrate
between each of the drive electrodes and the corresponding
detection electrodes, wherein the detection electrodes intersect
the drive electrodes in the normal direction of the substrate, each
of the detection electrodes includes: a first metallic layer; and a
second metallic layer positioned closer to the one surface than the
first metallic layer to the one surface, and the first metallic
layer has a reflectance of visible light lower than that of the
second metallic layer.
2. The fingerprint detection device according to claim 1, further
comprising an insulating film provided on the one surface to cover
the detection electrodes, wherein the insulating film includes at
least one of a silicon nitride film or a light-shielding resin
film.
3. The fingerprint detection device according to claim 1, wherein
each of the drive electrodes includes: a plurality of electrode
portions arranged spaced apart from each other in a plan view; and
a plurality of connecting portions each connecting adjacent
electrode portions of the electrode portions to each other, the
electrode portions are translucent electrodes, and the detection
electrodes are metallic thin lines.
4. The fingerprint detection device according to claim 3, wherein
the insulating layer further includes: a first insulating film
arranged between the connecting portions and the corresponding
detection electrodes in the normal direction of the substrate; and
a second insulating film arranged between the connecting portions
and the corresponding detection electrodes, and the second
insulating film is thinner than the first insulating film.
5. The fingerprint detection device according to claim 4, wherein
each of the electrode portions includes: an electrode main body;
and a protruding portion in a plan view protruding from the
electrode main body toward an electrode portion adjacent to the
corresponding electrode portion, and the second insulating film is
arranged between the corresponding electrode portion and the
protruding portion.
6. The fingerprint detection device according to claim 1, further
comprising an inter-layer insulating film provided on the one
surface side of the substrate, wherein the inter-layer insulating
film is arranged between the substrate and the drive electrodes,
and a sum of a thickness of the inter-layer insulating film and a
thickness of the drive electrodes is 150 nm or less.
7. The fingerprint detection device according to claim 1, further
comprising an inter-layer insulating film provided on the one
surface of the substrate, wherein the substrate includes: a
fingerprint detection region in which the drive electrodes and the
detection electrodes are arranged; and a frame region adjacent to
the fingerprint detection region, and the inter-layer insulating
film is arranged in the frame region and is not arranged in the
fingerprint detection region.
8. The fingerprint detection device according to claim 1, further
comprising an inter-layer insulating film provided on the one
surface of the substrate, wherein the substrate includes: a
fingerprint detection region in which the drive electrodes and the
detection electrodes are arranged; and a frame region adjacent to
the fingerprint detection region, the inter-layer insulating film
is arranged in the frame region on the substrate, and the drive
electrodes are arranged in the fingerprint detection region on the
substrate.
9. A display device comprising: a display panel; and a fingerprint
detection device arranged facing the display panel, the finger
print detection device comprising: a substrate; a plurality of
drive electrodes provided on one surface side of the substrate and
arranged in a first direction; a plurality of detection electrodes
provided on the one surface side and arranged in a second direction
intersecting the first direction; and an insulating layer provided
in a normal direction of the substrate between each of the drive
electrodes and the corresponding detection electrodes, wherein the
detection electrodes intersect the drive electrodes in the normal
direction of the substrate, each of the detection electrodes
includes: a first metallic layer; and a second metallic layer
positioned closer to the one surface than the first metallic layer
to the one surface, and the first metallic layer has a reflectance
of visible light lower than that of the second metallic layer.
10. The display device according to claim 9, further comprising an
insulating film provided on the one surface to cover the detection
electrodes, wherein the insulating film includes at least one of a
silicon nitride film or a light-shielding resin film.
11. The display device according to claim 9, wherein each of the
drive electrodes includes: a plurality of electrode portions
arranged spaced apart from each other in a plan view; and a
plurality of connecting portions each connecting adjacent electrode
portions of the electrode portions to each other, the electrode
portions are translucent electrodes, and the detection electrodes
are metallic thin lines.
12. The display device according to claim 11, wherein the
insulating layer further includes: a first insulating film arranged
between the connecting portions and the corresponding detection
electrodes in the normal direction of the substrate; and a second
insulating film arranged between the connecting portions and the
corresponding detection electrodes, and the second insulating film
is thinner than the first insulating film.
13. The display device according to claim 12, wherein each of the
electrode portions includes: an electrode main body; and a
protruding portion in a plan view protruding from the electrode
main body toward an electrode portion adjacent to the corresponding
electrode portion, and the second insulating film is arranged
between the corresponding electrode portion and the protruding
portion.
14. The display device according to claim 9, further comprising an
inter-layer insulating film provided on the one surface side of the
substrate, wherein the inter-layer insulating film is arranged
between the substrate and the drive electrodes, and a sum of a
thickness of the inter-layer insulating film and a thickness of the
drive electrodes is 150 nm or less.
15. The display device according to claim 9, further comprising an
inter-layer insulating film provided on the one surface of the
substrate, wherein the substrate includes: a fingerprint detection
region in which the drive electrodes and the detection electrodes
are arranged; and a frame region adjacent to the fingerprint
detection region, and the inter-layer insulating film is arranged
in the frame region and is not arranged in the fingerprint
detection region.
16. The display device according to claim 9, further comprising an
inter-layer insulating film provided on the one surface of the
substrate, wherein the substrate includes: a fingerprint detection
region in which the drive electrodes and the detection electrodes
are arranged; and a frame region adjacent to the fingerprint
detection region, the inter-layer insulating film is arranged in
the frame region on the substrate, and the drive electrodes are
arranged in the fingerprint detection region on the substrate.
Description
BACKGROUND
1. Technical Field
The present disclosure relates to a fingerprint detection device
and a display device.
2. Description of the Related Art
A display device including a liquid crystal panel or the like may
be provided with a fingerprint sensor in some cases. A fingerprint
sensor of Japanese Patent Application Laid-open Publication No.
2001-52148 detects a capacitance change corresponding to a recess
or protrusion of a fingerprint to detect the shape of a fingerprint
of a finger being in contact with the display device. A detection
result of the fingerprint sensor is used for personal
authentication, for example. The surface of the fingerprint sensor
is provided with a cover glass. When a finger is in contact with or
proximity to the surface of the cover glass, the fingerprint sensor
can detect its fingerprint.
Electrodes in a fingerprint detection region reflects light
entering from the cover glass side. When the fingerprint detection
region is arranged at a position overlapping with a display region
of the display device, the reflection of light by the electrodes in
the fingerprint detection region may lead to unintended patterns
(e.g., moire and a light reflecting pattern) that can be visually
recognized.
For the foregoing reasons, there is a need for a fingerprint
detection device and a display device that can reduce the
reflection of light.
SUMMARY
According to an aspect, a fingerprint detection device includes: a
substrate; a plurality of drive electrodes provided on one surface
side of the substrate and arranged in a first direction; a
plurality of detection electrodes provided on the one surface side
and arranged in a second direction intersecting the first
direction; and an insulating layer provided in a normal direction
of the substrate between each of the drive electrodes and the
corresponding detection electrodes. The detection electrodes
intersect the drive electrodes in the normal direction of the
substrate. The detection electrodes include: a first metallic
layer; and a second metallic layer positioned closer to the one
surface than the first metallic layer to the one surface. The first
metallic layer has a reflectance of visible light lower than that
of the second metallic layer.
According to another aspect, a display device includes: a display
panel; and a fingerprint detection device arranged facing the
display panel, the finger print detection device including: a
substrate; a plurality of drive electrodes provided on one surface
side of the substrate and arranged in a first direction; a
plurality of detection electrodes provided on the one surface side
and arranged in a second direction intersecting the first
direction; and an insulating layer provided in a normal direction
of the substrate between each of the drive electrodes and the
corresponding detection electrodes. The detection electrodes
intersect the drive electrodes in the normal direction of the
substrate. Each of the detection electrodes includes: a first
metallic layer; and a second metallic layer positioned closer to
the one surface than the first metallic layer to the one surface.
The first metallic layer has a reflectance of visible light lower
than that of the second metallic layer.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a plan view illustrating a display device according to a
first embodiment;
FIG. 2 is a sectional view obtained by cutting the display device
illustrated in FIG. 1 along the A11-A12 line;
FIG. 3 is a plan view illustrating a configuration example of a
fingerprint detection device according to the first embodiment;
FIG. 4 is a block diagram illustrating a configuration example of
the fingerprint detection device;
FIG. 5 is a diagram for explaining the basic principle of mutual
capacitance detection;
FIG. 6 is a diagram illustrating an exemplary equivalent circuit
for explaining the basic principle of the mutual capacitance
detection;
FIG. 7 is a diagram illustrating exemplary waveforms of a drive
signal and a detection signal of the mutual capacitance
detection;
FIG. 8 is a sectional view illustrating a configuration example of
a display panel;
FIG. 9 is a plan view illustrating a configuration example of a
fingerprint sensor according to the first embodiment;
FIG. 10 is a plan view illustrating a configuration example of
drive electrodes according to the first embodiment;
FIG. 11 is a plan view illustrating a drive electrode and a
detection electrode according to the first embodiment;
FIG. 12 is a diagram omitting the illustration of electrode
portions and the detection electrode in FIG. 11;
FIG. 13 is a plan view illustrating a configuration example of the
electrode portions;
FIG. 14 is a sectional view illustrating a configuration example of
the fingerprint sensor;
FIG. 15 is a sectional view illustrating a method for manufacturing
the fingerprint sensor according to the first embodiment;
FIG. 16 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 17 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 18 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 19 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 20 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 21 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 22 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the first
embodiment;
FIG. 23 is a diagram illustrating a relation between the thickness
of an insulating film covering the detection electrodes and the
reflectance of light;
FIG. 24 is a plan view illustrating a configuration example of a
fingerprint sensor according to a second embodiment;
FIG. 25 is a plan view illustrating the drive electrode and the
detection electrode according to the second embodiment;
FIG. 26 is a diagram omitting the illustration of the detection
electrode and an insulating film in FIG. 25;
FIG. 27 is a sectional view illustrating a configuration example of
the fingerprint sensor according to the second embodiment;
FIG. 28 is a sectional view illustrating a method for manufacturing
the fingerprint sensor according to the second embodiment;
FIG. 29 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the second
embodiment;
FIG. 30 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the second
embodiment;
FIG. 31 is a sectional view illustrating the method for
manufacturing the fingerprint sensor according to the second
embodiment;
FIG. 32 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a third embodiment;
FIG. 33 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a fourth embodiment;
FIG. 34 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a fifth embodiment;
FIG. 35 is a diagram illustrating a relation between the wavelength
of light incident on an electrode portion of a drive electrode and
the reflectance of light;
FIG. 36 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a sixth embodiment;
FIG. 37 is a block diagram illustrating a configuration example of
the fingerprint detection device according to a seventh
embodiment;
FIG. 38 is a plan view illustrating a configuration example of the
detection electrodes according to the seventh embodiment; and
FIG. 39 is a plan view illustrating a configuration example of the
detection electrodes according to the seventh embodiment.
DETAILED DESCRIPTION
Exemplary aspects (embodiments) according to the present disclosure
are described below in greater detail with reference to the
accompanying drawings. The contents described in the embodiments
are not intended to limit the present disclosure. Components
described below include components easily conceivable by those
skilled in the art and components substantially identical
therewith. Furthermore, the components described below can be
appropriately combined. The disclosure is given by way of example
only, and various changes made without departing from the spirit of
the disclosure and easily conceivable by those skilled in the art
are naturally included in the scope of the disclosure. The drawings
may possibly illustrate the width, the thickness, the shape, and
the like of each unit more schematically than the actual aspect to
simplify the explanation. These elements, however, are given by way
of example only and are not intended to limit interpretation of the
present disclosure. In the specification and the drawings,
components similar to those previously described with reference to
a preceding drawing are denoted by like reference numerals, and
detailed explanation thereof will be appropriately omitted. In this
disclosure, when an element A is described as being "on" another
element B, the element A can be directly on the other element B, or
there can be one or more elements between the element A and the
other element B.
First Embodiment
FIG. 1 is a plan view illustrating a display device according to a
first embodiment. FIG. 2 is a sectional view obtained by cutting
the display device illustrated in FIG. 1 along the A11-A12 line.
The display device 1 illustrated in FIG. 1 is a display device
equipped with a fingerprint detection function and includes: a
display region AA for displaying an image; a fingerprint detection
region FA; and a frame region GA provided outside the display
region AA and the fingerprint detection region FA. The fingerprint
detection region FA is a region for detecting a recess or
protrusion on the surface of a finger or the like being in contact
with or in proximity to a cover member 80. In the display device 1
of the present embodiment, the display region AA and the
fingerprint detection region FA match with each other or
substantially match with each other, thereby enabling detection of
a fingerprint across the entire display region AA. The shape of the
display region AA and that of the fingerprint detection region FA
are rectangular, for example.
As illustrated in FIG. 2, the display device 1 of the present
embodiment includes a display panel 30 and a fingerprint detection
device 100. The fingerprint detection device 100 has a fingerprint
sensor 10 and the cover member 80. The cover member 80 is a
plate-shaped member having a first surface 80a and a second surface
80b on the side opposite of the first surface 80a. The first
surface 80a of the cover member 80 is a detection surface for
detecting the recess or protrusion on the surface of the finger or
the like being in contact therewith or in proximity thereto, and is
also a display surface for allowing an observer to visually
recognize an image on the display panel 30. The fingerprint sensor
10 and the display panel 30 are provided on the second surface 80b
side of the cover member 80. The cover member 80 is a member for
protecting the fingerprint sensor 10 and the display panel 30 and
covers the fingerprint sensor 10 and the display panel 30. The
cover member 80 is a glass substrate or a resin substrate, for
example.
The shapes of the cover member 80, the fingerprint sensor 10, and
the display panel 30 are not limited to be rectangular in a plan
view, and may be circular, oval, or an odd shape with part of these
outer shape lacked. The shape of the cover member 80 is not limited
to be plate-shaped. When the display region AA and the fingerprint
detection region FA each have a curved surface or the frame region
GA has a curved surface curving toward the display panel 30, for
example, the cover member 80 may have a curved surface. In this
case, the display device is a curved surface display having a
fingerprint detection function and can detect a fingerprint also on
the curved surface of the curved surface display. A "plan view"
indicates a case when viewed from a direction perpendicular to one
surface 101a of a substrate 101 illustrated in FIG. 3 described
below. The direction perpendicular to the one surface 101a is a
"normal direction Dz of the substrate 101".
As illustrated in FIG. 1 and FIG. 2, in the frame region GA, a
decorative layer 81 is provided on the second surface 80b of the
cover member 80. The decorative layer 81 is a coloring layer, light
transmittance of which is lower than that of the cover member 80.
The decorative layer 81 can prevent wiring, circuits, and the like
provided superimposed on the frame region GA from being visually
recognized by the observer. In the example illustrated in FIG. 2,
the decorative layer 81 is provided on the second surface 80b, but
it may be provided on the first surface 80a. The decorative layer
81 is not limited to be a single layer and may have a multilayered
configuration.
The fingerprint sensor 10 is a detector for detecting a recess or
protrusion on the surface of a finger Fin or the like being in
contact with or in proximity to the first surface 80a of the cover
member 80. As illustrated in FIG. 2, the fingerprint sensor 10 is
provided between the cover member 80 and the display panel 30. When
viewed from a direction perpendicular to the first surface 80a (a
normal direction), the fingerprint sensor 10 overlaps with the
fingerprint detection region FA and part of the frame region GA. A
flexible substrate 76 is connected to the fingerprint sensor 10 in
the frame region GA. An integrated circuit (IC) for detection (not
illustrated) for controlling detection operations of the
fingerprint sensor 10 is mounted on the flexible substrate 76.
One surface of the fingerprint sensor 10 is stuck to the second
surface 80b of the cover member 80 with an adhesive layer 71,
whereas the other surface thereof is stuck to a polarizing plate 35
of the display panel 30 with an adhesive layer 72. Each of the
adhesive layer 71 and the adhesive layer 72 is an adhesive or a
resin having translucency, and allows visible light to pass
therethrough.
The display panel 30 includes: a pixel substrate 30A; a counter
substrate 30B; a polarizing plate 34 provided below the pixel
substrate 30A; and the polarizing plate 35 provided above the
counter substrate 30B. An IC for display (not illustrated) for
controlling a display operation of the display panel 30 is
connected to the pixel substrate 30A via a flexible substrate 75.
In the present embodiment, the display panel 30 is a liquid crystal
panel in which a liquid crystal element is used as a display
function layer. However, the present disclosure is not limited to
this example, and the display panel 30 may be an organic EL display
panel, for example. The IC for detection and the IC for display
described above may be provided on a control substrate outside a
module. Alternatively, the IC for detection may be provided on the
substrate 101 of the fingerprint sensor 10 (refer to FIG. 3 and
FIG. 14). The IC for display may be provided on a first substrate
31 of the pixel substrate 30A (refer to FIG. 8).
FIG. 3 is a plan view illustrating a configuration example of the
fingerprint detection device according to the first embodiment. As
illustrated in FIG. 3, the fingerprint detection device 100
includes the substrate 101 and the fingerprint sensor 10 provided
on the one surface 101a side of the substrate 101. The fingerprint
sensor 10 includes drive electrodes Tx and detection electrodes Rx
provided on the one surface 101a side of the substrate 101. The
substrate 101 is a glass substrate having translucency allowing
visible light to pass therethrough. The substrate 101 may be a
translucent resin substrate or a resin film formed of a resin such
as polyimide. The fingerprint sensor 10 is a sensor having
translucency. The drive electrodes Tx are formed of a translucent
conductive material such as indium tin oxide (ITO).
The drive electrodes Tx are arranged in a first direction Dx. The
drive electrodes Tx extend in a second direction Dy intersecting
(e.g., orthogonal to) the first direction Dx. The detection
electrodes Rx are arranged in the second direction Dy. The
detection electrodes Rx extend in the first direction Dx. In this
manner, the detection electrodes Rx extend in a direction
intersecting the extension direction of the drive electrodes Tx.
The detection electrodes Rx are each connected to the flexible
substrate 75 provided on a short side of the frame region GA of the
substrate 101 via frame wiring (not illustrated). In the present
embodiment, the drive electrodes Tx employ a conductive material
having translucency such as ITO. As illustrated in FIG. 3, the
drive electrodes Tx and the detection electrodes Rx are provided in
the fingerprint detection region FA.
Capacitance is formed at each of intersections between the
detection electrodes Rx and the drive electrodes Tx. When a mutual
capacitance touch detection operation is performed in the
fingerprint sensor 10, a drive electrode driver 15 sequentially
selects the drive electrodes Tx in a time division manner, and
supplies a drive signal Vs to the selected drive electrode Tx. A
detection signal Vdet corresponding to a capacitance change by the
recess or protrusion on the surface of the finger or the like being
in contact with or in proximity to the cover member 80 is output
from the detection electrodes Rx, whereby fingerprint detection is
performed. The drive electrode driver 15 may sequentially select
each drive electrode block including a plurality of drive
electrodes Tx and drive the drive electrodes Tx.
While FIG. 3 illustrates a case in which the various kinds of
circuits such as a detection electrode selection circuit 14 and the
drive electrode driver 15 are provided in the frame region GA of
the substrate 101, this is a mere example. At least part of the
various kinds of circuits may be included in the IC for detection
mounted on the flexible substrate 76.
The following describes a detailed configuration of the fingerprint
detection device. FIG. 4 is a block diagram illustrating a
configuration example of the fingerprint detection device including
the fingerprint sensor. As illustrated in FIG. 4, the fingerprint
detection device 100 includes the fingerprint sensor 10, a
detection controller 11, the drive electrode driver 15, the
detection electrode selection circuit 14, and a detector 40.
The detection controller 11 is a circuit for controlling detection
operations of the fingerprint sensor 10. The drive electrode driver
15 is a circuit for supplying a drive signal Vs for detection to
the drive electrodes Tx of the fingerprint sensor 10 based on a
control signal supplied from the detection controller 11. The
detection electrode selection circuit 14 selects the detection
electrodes Rx of the fingerprint sensor 10 based on a control
signal supplied from the detection controller 11 to connect the
selected detection electrodes Rx to the detector 40.
The detector 40 is a circuit for detecting the recess or protrusion
on the surface of the finger or the like being in contact with or
in proximity to the first surface 80a of the cover member 80 based
on a control signal supplied from the detection controller 11 and
the detection signal Vdet output from an insulating film 150 to
detect the shape of a fingerprint. The detector 40 includes a
detection signal amplifier 42, an analog-to-digital (A/D) converter
43, a signal processor 44, a coordinates extractor 45, a
synthesizer 46, and a detection timing controller 47. The detection
timing controller 47 performs control to cause the detection signal
amplifier 42, the A/D converter 43, the signal processor 44, the
coordinates extractor 45, and the synthesizer 46 to operate in
synchronization with each other based on a control signal supplied
from the detection controller 11.
The detection signal Vdet is supplied to the detection signal
amplifier 42 of the detector 40 from the fingerprint sensor 10. The
detection signal amplifier 42 amplifies the detection signal Vdet.
The A/D converter 43 converts an analog signal output from the
detection signal amplifier 42 into a digital signal.
The signal processor 44 is a logic circuit for detecting whether
the finger is in contact with or in proximity to the fingerprint
sensor 10 based on an output signal of the A/D converter 43. The
signal processor 44 performs processing to extract a differential
signal of detection signals (an absolute value |.DELTA.V|)
generated by the finger. The signal processor 44 compares the
absolute value |.DELTA.V| with a certain threshold voltage. If this
absolute value |.DELTA.V| is less than the threshold voltage, the
signal processor determines that the finger is in a non-contact
state. On the other hand, if the absolute value |.DELTA.V| is the
threshold voltage or greater, the signal processor 44 determines
that the finger is in a contact-or-proximity state. In this manner,
the detector 40 can detect the contact or proximity of the
finger.
The coordinates extractor 45 is a logic circuit that, when the
contact or proximity of the finger is detected by the signal
processor 44, determines its detected coordinates. The coordinates
extractor 45 outputs the detected coordinates to the synthesizer
46. The synthesizer 46 combines the detection signal Vdet output
from the fingerprint sensor 10 to generate two-dimensional
information indicating the shape of the finger being in contact
with or in proximity to the fingerprint sensor 10. The synthesizer
46 outputs the two-dimensional information as output Vout of the
detector 40. Alternatively, the synthesizer 46 may generate an
image based on the two-dimensional information and make image
information serve as the output Vout.
The IC for detection described above functions as the detector 40
illustrated in FIG. 4. Part of the functions of the detector 40 may
be included in the IC for display described above or be provided as
functions of an external micro-processing unit (MPU).
The fingerprint sensor 10 operates based on the basic principle of
capacitance type detection. The following describes the basic
principle of mutual capacitance detection by the fingerprint sensor
10 with reference to FIG. 5 to FIG. 7. FIG. 5 is a diagram for
explaining the basic principle of mutual capacitance detection.
FIG. 6 is a diagram illustrating an exemplary equivalent circuit
for explaining the basic principle of the mutual capacitance
detection. FIG. 7 is a diagram illustrating exemplary waveforms of
a drive signal and a detection signal of the mutual capacitance
detection. While the following describes a case in which a finger
is in contact with or in proximity to a detection electrode, the
present disclosure is not limited to the finger, and a target may
be an object including a conductor such as a stylus, for
example.
As illustrated in FIG. 5, for example, a capacitance element C1
includes a pair of electrodes facing each other across a dielectric
D, i.e., a drive electrode E1, and a detection electrode E2. The
capacitance element C1 produces lines of electric force for a
fringe extending from ends of the drive electrode E1 toward an
upper surface of the detection electrode E2 in addition to lines of
electric force (not illustrated) generated between opposing
surfaces of the drive electrode E1 and the detection electrode E2.
As illustrated in FIG. 6, one end of the capacitance element C1 is
connected to an AC signal source (a drive signal source) S, whereas
the other end thereof is connected to a voltage detector DET. The
voltage detector DET is an integral circuit included in the
detector 40 illustrated in FIG. 4, for example.
When the AC signal source S applies an AC rectangular wave Sg at a
predetermined frequency (e.g., a frequency of several kilohertz to
several hundred kilohertz) to the drive electrode E1 (one end of
the capacitance element C1), an output waveform (the detection
signal Vdet) as illustrated in FIG. 7 appears via the voltage
detector DET connected to the detection electrode E2 (the other end
of the capacitance element C1). The AC rectangular wave Sg
corresponds to the drive signal Vs input from the drive electrode
driver 15 illustrated in FIG. 4.
In a state in which the finger is not in contact with or in
proximity to the detection electrode E2 (non-contact state), a
current corresponding to the capacitance value of the capacitance
element C1 flows with charge and discharge of the capacitance
element C1. The voltage detector DET illustrated in FIG. 6 converts
fluctuations in a current I.sub.1 corresponding to the AC
rectangular wave Sg into fluctuations in voltage (a solid line
waveform V.sub.1 (refer to FIG. 7)).
On the other hand, in a state in which the finger is in contact
with or in proximity to the detection electrode E2 (contact state),
as illustrated in FIG. 5, capacitance C2 generated by the finger is
in contact with or near the detection electrode E2. With this
configuration, the lines of electric force for a fringe between the
drive electrode E1 and the detection electrode E2 are blocked by
the conductor (the finger). Consequently, the capacitance element
C1 acts as a capacitance element with a capacitance value smaller
than a capacitance value in the non-contact state. As illustrated
in FIG. 6 and FIG. 7, the voltage detector DET converts the
fluctuations in the current I.sub.1 corresponding to the AC
rectangular wave Sg into fluctuations in voltage (a dotted line
waveform V.sub.2).
In this case, the waveform V.sub.2 is smaller in amplitude than the
waveform V.sub.1 described above. With this relation, the absolute
value |.DELTA.V| of a voltage difference between the waveform
V.sub.1 and the waveform V.sub.2 changes in accordance with the
influence of an external object being in contact with or in
proximity to the detection electrode E2 from the outside such as a
finger. In order for the voltage detector DET to accurately detect
the absolute value |.DELTA.V| of the voltage difference between the
waveform V.sub.1 and the waveform V.sub.2, the voltage detector DET
preferably operates with a period Reset to reset charge and
discharge of a capacitor in accordance with the frequency of the AC
rectangular wave Sg by switching in the circuit.
The detector 40 compares the absolute value |.DELTA.V| with a
certain threshold voltage. If the absolute value |.DELTA.V| is less
than the threshold voltage, the detector 40 determines that the
finger is in the non-contact state. On the other hand, if the
absolute value |.DELTA.V| is the threshold voltage or greater, the
detector 40 determines that the finger is in the
contact-or-proximity state. When it is determined that the finger
is in the contact-or-proximity state, the detector 40 detects a
capacitance change by the recess or protrusion on the surface of
the finger based on a difference in the absolute value |.DELTA.V|.
The drive electrode E1 illustrated in FIG. 5 corresponds to the
drive electrode Tx illustrated in FIG. 3, whereas the detection
electrode E2 illustrated in FIG. 5 corresponds to the detection
electrode Rx illustrated in FIG. 3.
FIG. 8 is a sectional view illustrating a configuration example of
a display panel. The pixel substrate 30A includes a first substrate
31, pixel electrodes 32, and a common electrode 33. The common
electrode 33 is provided on the first substrate 31. The pixel
electrodes 32 are provided above the common electrode 33 via an
insulating layer 38, and are arranged in a matrix (row-column
configuration) in a plan view. The pixel electrodes 32 are provided
corresponding to respective subpixels forming each pixel Pix of the
display panel 30, and are supplied with pixel signals for
performing a display operation. The common electrode 33, to which
DC drive signals for display are supplied, functions as a common
electrode for the pixel electrodes 32.
In the present embodiment, the common electrode 33, the insulating
layer 38, and the pixel electrodes 32 are stacked in this order on
the first substrate 31. The polarizing plate 34 is provided below
the first substrate 31 via an adhesive layer. Thin film transistors
(TFT, not illustrated) serving as switching elements for display
are provided to the first substrate 31. For example, a conductive
material having translucency such as ITO is used for the pixel
electrodes 32 and the common electrode 33.
The arrangement of the pixel electrodes 32 is not limited to the
matrix arrangement in which the pixel electrodes 32 are arranged in
a first direction and a second direction orthogonal to the first
direction, and may employ an arrangement in which adjacent pixel
electrodes 32 are shifted from each other in the first direction or
the second direction. Alternatively, the present disclosure can
employ a configuration in which, with respect to one pixel
electrode 32 constituting a pixel column in the first direction,
two or three pixel electrodes 32 are arranged on one side of the
one pixel electrode 32, according to a difference in shape between
adjacent pixel electrodes 32.
The counter substrate 30B includes a second substrate 36 and a
color filter 37 formed on one surface of the second substrate 36.
The color filter 37 faces a liquid crystal layer 6 in a direction
perpendicular to the first substrate 31. Further, the polarizing
plate 35 is provided above the second substrate 36 via an adhesive
layer. The color filter 37 may be arranged on the first substrate
31. In the present embodiment, each of the first substrate 31 and
the second substrate 36 is a glass substrate or a resin substrate,
for example.
The liquid crystal layer 6 is provided between the first substrate
31 and the second substrate 36. The liquid crystal layer 6
modulates light passing therethrough in accordance with the state
of an electric field, and employs liquid crystals in a transverse
electric field mode such as an in-plane switching (IPS) mode
including a fringe field switching (FFS) mode. An orientation film
may be provided between the liquid crystal layer 6 and the pixel
substrate 30A and between the liquid crystal layer 6 and the
counter substrate 30B illustrated in FIG. 8.
An illuminator (a backlight, not illustrated) is provided below the
first substrate 31. The illuminator has a light source such as a
light-emitting diode (LED), for example, and emits light from the
light source toward the first substrate 31. The light from the
illuminator passes through the pixel substrate 30A, and switching
is performed between part of the light to be blocked and not to be
emitted and part of the light to be emitted depending on the state
of liquid crystals, so that an image is displayed on the display
surface (the first surface 80a).
As illustrated in FIG. 2, the display panel 30 is stuck to the
fingerprint sensor 10 via the adhesive layer 72 provided on the
polarizing plate 35 in the display region AA. The fingerprint
sensor 10 is arranged at a position closer to the cover member 80
than the display panel 30 is to the cover member 80 in a direction
orthogonal to the second surface 80b of the cover member 80. The
provision of the fingerprint sensor 10 closer to the cover member
80 can reduce a distance between the detection electrodes Rx and
the first surface 80a serving as the detection surface, in
comparison with a case in which detection electrodes for
fingerprint detection are provided integrally with the display
panel 30, for example. Consequently, the display device 1 of the
present embodiment can improve detection performance.
FIG. 9 is a plan view illustrating a configuration example of
detection electrodes of the fingerprint sensor according to the
first embodiment. As illustrated in FIG. 9, the detection
electrodes Rx intersect the drive electrodes Tx. When viewed from
the normal direction Dz of the substrate 101, the shape of the
detection electrode Rx is a zigzag line. The detection electrodes
Rx zigzag in the first direction Dx. The detection electrodes Rx
each have a plurality of first line portions RxL1, a plurality of
second line portions RxL2, and a plurality of bent portions RxB,
for example. The second line portions RxL2 extend in a direction
intersecting the first line portions RxL1. The bent portions RxB
connect the first line portions RxL1 and the second line portions
RxL2 to each other.
For example, the first line portions RxL1 extend in a direction
intersecting the first direction Dx and the second direction Dy.
The second line portions RxL2 also extend in a direction
intersecting the first direction Dx and the second direction Dy.
The first line portions RxL1 and the second line portions RxL2 are
arranged so as to be bilaterally symmetric about a virtual line
(not illustrated) parallel to the first direction Dx.
In each of the detection electrodes Rx, an arrangement pitch of
bent portions RxB in th first direction Dx is defined as Prx. In
adjacent detection electrodes Rx, an arrangement pitch of the bent
portions RxB in the second direction Dy is defined as Pry. In the
present embodiment, a magnitude relation of Pry<Prx holds, for
example.
An arrangement pitch of the drive electrodes Tx in the first
direction Dx is defined as Pt. An arrangement pitch in the first
direction Dx of the pixel electrodes 32 of the display panel 30
stuck to the fingerprint detection device 100 is defined as Ppix.
In the present embodiment, a magnitude relation of the arrangement
pitch Pt of the drive electrodes Tx and the arrangement pitch Ppix
of the pixel electrodes 32 preferably satisfies the following
Expression (1), where n is an integer of 1 or more. With this
relation, the fingerprint sensor 10 can reduce the occurrence of
unintended patterns (e.g., moire and a light reflecting pattern) in
the fingerprint detection region FA.
0.6.times.(n-1).times.Ppix.ltoreq.Pt.ltoreq.0.4.times.n.times.Ppix
(1)
The following describes the shape of the drive electrodes Tx more
specifically. FIG. 10 is a plan view illustrating a configuration
example of the drive electrodes according to the first embodiment.
As illustrated in FIG. 10, the drive electrodes Tx (e.g., TX-1,
TX-2, TX-3, TX-4, . . . ) arranged in the first direction Dx each
have a plurality of electrode portions 130 and a plurality of
connecting portions 127. In each of the drive electrodes Tx, the
electrode portions 130 are arranged in the second direction Dy and
are arranged spaced apart from each other. In each of the drive
electrodes Tx, the connecting portion 127 connects adjacent
electrode portions among the electrode portions 130 to each other.
As illustrated in FIG. 10, when viewed from the normal direction Dz
of the substrate 101 (refer to FIG. 3), one detection electrode Rx
passes through a gap between adjacent electrode portions 130 and
intersect the connecting portions 127.
An arrangement pitch of the connecting portions 127 in the first
direction Dx is defined as Pb. The arrangement pitch Pb of the
connecting portions 127 is preferably 0.5 times the arrangement
pitch Pt of the drive electrode Tx. In each of the drive electrodes
Tx, the connecting portions 127 are preferably arranged alternately
on one side and the other side relative to a central line Lcent
parallel to the second direction Dy and passing through the center
of the electrode portions 130. With this structure, the connecting
portions 127, light transmittance of which is lower than that of
the electrode portions 130, are not arranged on a straight line, so
that the fingerprint sensor 10 can reduce the occurrence of
unintended patterns such as moire.
The longitudinal directions of the connecting portions 127 are
preferably aligned in one direction. All of the longitudinal
directions of the connecting portions 127 of the drive electrodes
Tx are the second direction, for example. This structure uniforms
the shape of the connecting portions 127 intersecting the detection
electrodes Rx, which makes it easy to uniform capacitance between
the drive electrodes Tx and the connecting portions 127.
In the fingerprint sensor 10 illustrated in FIG. 10, the shape of
the drive electrodes Tx, the shape of the detection electrodes Rx,
and the positional relation thereof are uniform among the
electrodes, and thus variations in capacitance of the drive
electrodes Tx and variations in capacitance of the detection
electrodes Rx are small. Further, there is an advantage that the
calculation of coordinates in the fingerprint sensor 10 is easily
corrected, for example.
FIG. 11 is a plan view illustrating a drive electrode and a
detection electrode according to the first embodiment. FIG. 12 is a
diagram omitting the illustration of the electrode portions and the
detection electrode in FIG. 11. As illustrated in FIG. 11, an
insulating layer 129 is arranged between the connecting portion 127
and the detection electrode Rx. The insulating layer 129 is a resin
insulating film, for example. The insulating layer 129 includes a
first insulating film 129A and a second insulating film 129B
thinner than the first insulating film 129A. The second insulating
film 129B is provided with a contact hole 129H. As illustrated in
FIG. 12, the connecting portion 127 is exposed at the bottom of the
contact hole 129H.
FIG. 13 is a plan view illustrating a configuration example of the
electrode portions. As illustrated in FIG. 13, the electrode
portion 130 has an electrode main body 131 and a protruding portion
132 in a plan view protruding toward an adjacent electrode portion
130 from the electrode main body 131. The second insulating film
129B is arranged between the protruding portion 132 and the
connecting portion 127. The protruding portion 132 is embedded in
the contact hole 129H (refer to FIG. 11) provided in the second
insulating film 129B. With this structure, the protruding portion
132 is connected to the connecting portion 127 (refer to FIG. 11)
via the contact hole 129H. The electrode portions 130 are connected
to each other in the second direction Dy via the connecting
portions 127.
In the second direction Dy, when a distance between adjacent
electrode main bodies 131 is defined as d1, and a distance between
adjacent protruding portions 132 is defined as d2, a magnitude
relation of d1>d2 holds. When viewed from the normal direction
Dz, the detection electrode Rx is arranged so as to overlap with
the protruding portions 132 and capacitance generated between the
electrode portions 130 and the detection electrode Rx can be
reduced, in comparison with a case in which the electrode main
bodies 131 and the detection electrode Rx overlap with each
other.
As illustrated in FIG. 10, when viewed from the normal direction
Dz, the electrode portions 130 have a plurality of shapes. For
example, the electrode portions 130 include a first electrode
portion 130A and a second electrode portion 130B, the shape of the
electrode main body 131 (refer to FIG. 13) of which is different
from that of the first electrode portion 130A. When viewed from the
normal direction Dz, each of the shape of the electrode main body
131 of the first electrode portion 130A and the shape of the
electrode main body 131 of the second electrode portion 130B is a
parallelogram. When viewed from the normal direction Dz, the shape
of the electrode main body 131 of the first electrode portion 130B
is obtained by vertically flipping the shape of the electrode main
body 131 of the second electrode portion 130A.
For example, the drive electrodes Tx-1 and Tx-2 intersecting the
first line portions RxL1 of the detection electrodes Rx (refer to
FIG. 9) include the first electrode portion 130A having two sides
parallel to the first line portions RxL1. The drive electrodes Tx-3
and Tx-4 intersecting the second line portions RxL2 of the
detection electrodes Rx (refer to FIG. 9) include the second
electrode portion 130B having two sides parallel to the second line
portions RxL2. With this structure, when viewed from the normal
direction Dz, the electrode main bodies 131 can be arranged along
the zigzag detection electrode Rx, and a separating distance d3
between the zigzag detection electrode Rx and the electrode main
bodies 131 can be a constant length.
The following describes a layer structure of the fingerprint
sensor. FIG. 14 is a sectional view illustrating a configuration
example of the fingerprint sensor. In FIG. 14, the section of the
fingerprint detection region FA is obtained by cutting the plan
view illustrated in FIG. 10 along the A13-A14 line. In FIG. 14, the
section of the frame region GA is obtained by cutting a part
including a thin film transistor Tr of the drive electrode driver
15 (refer to FIG. 3). FIG. 14 illustrates the section along the
A13-A14 line of the fingerprint detection region FA and the section
of the part including the thin film transistor Tr of the frame
region GA by schematically connecting these parts in order to show
a relation between the layer structure of the fingerprint detection
region FA and the layer structure of the frame region GA.
As illustrated in FIG. 14, the fingerprint sensor 10 has the
substrate 101, a gate electrode 103 provided on the substrate 101,
and a first inter-layer insulating film 111 provided on the
substrate 101 to cover the gate electrode 103. The gate electrode
103 is provided in the frame region GA. Aluminum (Al), copper (Cu),
silver (Ag), molybdenum (Mo), or an alloy of these materials is
used as the material of the gate electrode 103. A silicon oxide
film, a silicon nitride film, or a silicon oxide nitride film is
used as the material of the first inter-layer insulating film 111.
The first inter-layer insulating film 111 is not limited to a
single layer and may be a film with a multilayered structure. The
first inter-layer insulating film 111 may be a film with a
multilayered structure in which a silicon nitride film is formed on
a silicon oxide film, for example.
The fingerprint sensor 10 includes: a semiconductor layer 113
formed on the first inter-layer insulating film 111; and a second
inter-layer insulating film 121 formed on the first inter-layer
insulating film 111 to cover the semiconductor layer 113. The
second inter-layer insulating film 121 is provided with contact
holes 121H1 and 121H2. The semiconductor layer 113 is exposed at
the bottom of the contact holes 121H1 and 121H2. A polysilicon or
an oxide semiconductor is used as the material of the semiconductor
layer 113. A silicon oxide film, a silicon nitride film, or a
silicon oxide nitride film is used as the material of the second
inter-layer insulating film 121. The second inter-layer insulating
film 121 is not limited to a single layer and may be a film with a
multilayered structure. The second inter-layer insulating film 121
may be a film with a multilayered structure in which a silicon
nitride film is formed on a silicon oxide film, for example.
The fingerprint sensor 10 includes a source electrode 123, a drain
electrode 125, and the connecting portions 127 provided on the
second inter-layer insulating film 121. The source electrode 123 is
embedded in the contact hole 121H1. The drain electrode 125 is
embedded in the contact hole 121H2. With this structure, the source
electrode 123 is connected to the semiconductor layer 113 via the
contact hole 121H1. The drain electrode 125 is connected to the
semiconductor layer 113 via the contact hole 121H2. Titanium
aluminum (TiAl), which is an alloy of titanium and aluminum, is
used as the materials of the source electrode 123, the drain
electrode 125, and the connecting portions 127.
The gate electrode 103, the semiconductor layer 113, the source
electrode 123, and the drain electrode 125 described above are
provided in the frame region GA. The gate electrode 103, the
semiconductor layer 113, the source electrode 123, and the drain
electrode 125 constitute the thin film transistor Tr in the frame
region GA.
The insulating layer 129 is provided on the second inter-layer
insulating film 121. As described above, the insulating layer 129
includes the first insulating film 129A and the second insulating
film 129B thinner than the first insulating film 129A. The first
insulating film 129A provided in the frame region GA covers the
source electrode 123 and the drain electrode 125. The first
insulating film 129A provided in the frame region GA is provided
with the contact hole 129H. The first insulating film 129A provided
in the fingerprint detection region FA covers part of the
connecting portion 127 positioned under the detection electrode Rx.
The second insulating film 129B provided in the fingerprint
detection region FA covers part of the connecting portion 127
positioned under the electrode portion 130. As described above, the
second insulating film 129B is provided with the contact hole
129H.
A resin film is used as the insulating layer 129, for example.
Since the resin film has a high refractive index, the resin film
serving as the insulating layer 129 is preferably not arranged in
the display region AA as much as possible. Not arranging the resin
film in the display region AA as much as possible improves the
visibility of an image displayed on the display region AA. As
described above, in the display device 1 of the present embodiment,
the display region AA and the fingerprint detection region FA match
with each other or substantially match with each other. In the
configuration in FIG. 14, only the second insulating film 129B,
which is a thin film, is arranged as the insulating layer 129 in
the display region AA. Consequently, the visibility of the image
displayed on the display region AA improves.
Further, the electrode portions 130 are provided on the second
inter-layer insulating film 121. In the fingerprint detection
region FA, the peripheral parts of the electrode portions 130
(e.g., the protruding portions 132 illustrated in FIG. 13) are
embedded in the contact hole 129H. With this structure, the
electrode portions 130 are connected to the connecting portions 127
via the contact hole 129H. In this example, the electrode portions
130 are in contact with the second inter-layer insulating film
121.
In the fingerprint detection region FA, the detection electrodes Rx
are provided on the first insulating film 129A. The first
insulating film 129A insulates the detection electrodes Rx and the
drive electrodes Tx from each other. The detection electrode Rx
includes a first metallic layer 141, a second metallic layer 142,
and a third metallic layer 143, for example. The second metallic
layer 142 is provided on the third metallic layer 143, and the
first metallic layer 141 is provided on the second metallic layer
142. Molybdenum or a molybdenum alloy is used as the materials of
the first metallic layer 141 and the third metallic layer 143, for
example. Aluminum or an aluminum alloy is used as the material of
the second metallic layer 142. Molybdenum or a molybdenum alloy
forming the first metallic layer 141 has a reflectance of visible
light lower than that of aluminum or an aluminum alloy forming the
second metallic layer 142.
The insulating film 150 is provided above the insulating layer 129,
the electrode portions 130, and the detection electrodes Rx. The
insulating film 150 covers upper surfaces and side surfaces of the
detection electrodes Rx. A film with a high refractive index and a
low reflectance such as a silicon nitride film is used as the
insulating film 150. Alternatively, the insulating film 150 may be
a light-shielding resin film (e.g., a black resin film).
The following describes a method for manufacturing the fingerprint
sensor illustrated in FIG. 14 in order of process. FIG. 15 to FIG.
22 are sectional views each illustrating a method for manufacturing
the fingerprint sensor according to the first embodiment. As
illustrated in FIG. 15, first, a manufacturing apparatus (not
illustrated) forms a conductive film (not illustrated) such as
aluminum on the substrate 101. The conductive film is formed by
sputtering, for example.
Subsequently, the manufacturing apparatus forms the gate electrode
103 by patterning the conductive film by photolithography technique
and dry etching technique. The manufacturing apparatus forms a
resist (not illustrated) on the conductive film, for example. The
resist, which is patterned by the photolithography, is formed into
a shape covering an area in which the gate electrode 103 is formed,
and exposing the other area. Subsequently, the manufacturing
apparatus removes the conductive film in the area exposed from the
resist by the dry etching technique. With this operation, the gate
electrode 103 is formed out of the conductive film. After forming
the gate electrode 103, the manufacturing apparatus removes the
resist.
Subsequently, the manufacturing apparatus forms the first
inter-layer insulating film 111 on the substrate 101. The first
inter-layer insulating film 111 is formed by chemical vapor
deposition (CVD), for example. With this operation, the gate
electrode 103 is covered with the first inter-layer insulating film
111. Subsequently, the manufacturing apparatus forms a
semiconductor film (not illustrated) on the first inter-layer
insulating film 111. The semiconductor film is formed by the CVD,
for example. Subsequently, the manufacturing apparatus patterns the
semiconductor film by the photolithography technique and the dry
etching technique. With this operation, the manufacturing apparatus
forms the semiconductor layer 113 out of the semiconductor
film.
Subsequently, the manufacturing apparatus forms the second
inter-layer insulating film 121 on the first inter-layer insulating
film 111. The second inter-layer insulating film 121 is formed by
the CVD, for example. With this operation, the semiconductor layer
113 is covered with the second inter-layer insulating film 121.
Subsequently, the manufacturing apparatus forms the contact holes
121H1 and 121H2 in the second inter-layer insulating film 121. The
manufacturing apparatus forms a resist (not illustrated) on the
second inter-layer insulating film 121, for example. The resist,
which is patterned by the photolithography, is formed into a shape
exposing areas in which the contact holes 121H1 and 121H2 are
formed, and covering the other area. Subsequently, the
manufacturing apparatus removes the second inter-layer insulating
film 121 in the area exposed from the resist by the dry etching
technique. With this operation, the contact holes 121H1 and 121H2
are formed in the second inter-layer insulating film 121. After
forming the contact holes 121H1 and 121H2, the manufacturing
apparatus removes the resist.
Subsequently, the manufacturing apparatus forms a metallic film
(not illustrated) such as titanium aluminum on the second
inter-layer insulating film 121. The metallic film is formed by the
sputtering, for example. Subsequently, the manufacturing apparatus
patterns the metallic film by the photolithography technique and
the dry etching technique. With this operation, as illustrated in
FIG. 17, the manufacturing apparatus forms the source electrode
123, the drain electrode 125, and the connecting portions 127 out
of the metallic film.
Subsequently, as illustrated in FIG. 18, the manufacturing
apparatus forms the insulating layer 129 on the second inter-layer
insulating film 121. The insulating layer 129 is a resin film, for
example, and is a positive resist, for example. The insulating
layer 129 is formed by spin coating technique, for example. The
insulating layer 129 covers the source electrode 123, the drain
electrode 125, and the connecting portions 127.
Subsequently, the manufacturing apparatus performs first exposure
processing on the insulating layer 129. The first exposure
processing is half exposure. As illustrated in FIG. 19, in the half
exposure, part of the insulating layer 129 ranging from an upper
surface of the insulating layer 129 to a halfway position exp in
the thickness direction of the insulating layer 129 is exposed.
Subsequently, the manufacturing apparatus performs second exposure
processing on the insulating layer 129. With this operation, the
part of the insulating layer 129 in which the contact hole 129H
(refer to FIG. 14) is formed is exposed.
Subsequently, the manufacturing apparatus performs developing
processing on the insulating layer 129. Through the developing
processing, the part exposed through the first exposure processing
and the part exposed through the second exposure processing are
removed from the insulating layer 129. Consequently, as illustrated
in FIG. 20, the first insulating film 129A and the second
insulating film 129B thinner than the first insulating film 129A
are formed out of the insulating layer 129. The contact hole 129H
is formed in the second insulating film 129B.
Subsequently, the manufacturing apparatus forms a conductive film
such as ITO (not illustrated) above the substrate 101. The
conductive film is formed by the sputtering, for example.
Subsequently, the manufacturing apparatus patterns the conductive
film by the photolithography technique and the dry etching
technique. With this operation, as illustrated in FIG. 21, the
manufacturing apparatus forms the electrode portions 130 out of the
conductive film.
Subsequently, the manufacturing apparatus forms a metallic film
with a multilayered structure (not illustrated) above the substrate
101. The metallic film with the multilayered structure is a film
with molybdenum or a molybdenum alloy, aluminum or an aluminum
alloy, and molybdenum or a molybdenum alloy stacked in this order
from the substrate 101, for example. The metallic film is formed by
the sputtering, for example. Subsequently, the manufacturing
apparatus patterns the metallic film by the photolithography
technique and the dry etching technique. With this operation, as
illustrated in FIG. 22, the manufacturing apparatus forms the
detection electrode Rx including the first metallic layer 141, the
second metallic layer 142, and the third metallic layer 143.
Subsequently, the manufacturing apparatus forms the insulating film
150 (refer to FIG. 14) above the substrate 101. The insulating film
150 is formed by the CVD or the like. Through the foregoing
processes, the fingerprint sensor illustrated in FIG. 14 is
completed.
As described above, the fingerprint sensor 10 according to the
first embodiment includes the drive electrodes Tx and the detection
electrodes Rx both provided on the one surface 101a side of the
substrate 101. The drive electrodes Tx are arranged in the first
direction Dx. The detection electrodes Rx are arranged in the
second direction Dy intersecting the first direction Dx. The
fingerprint sensor 10 includes the insulating layer 129 provided in
the normal direction Dz of the substrate 101 between the drive
electrodes Tx and the respective detection electrodes Rx. In the
normal direction of the substrate 101, the detection electrodes Rx
intersect the drive electrodes Tx. The detection electrode Rx has
the first metallic layer 141 and the second metallic layer 142
positioned closer to the one surface 101a than the first metallic
layer 141 is to the one surface 101a. The first metallic layer 141
has a reflectance of visible light lower than that of the second
metallic layer 142. This structure can reduce the reflection of
light coming from the cover member 80 side (hereinafter, incident
light) on the detection electrodes Rx, thereby making the detection
electrodes Rx less noticeable. Consequently, the fingerprint sensor
10 can reduce the occurrence of unintended patterns such as
moire.
The fingerprint sensor 10 includes the insulating film 150 provided
on the one surface 101a side of the substrate 101. The insulating
film 150 covers the detection electrodes Rx. The insulating film
150 is a film with a high refractive index and a low reflectance
and is a silicon nitride film, for example. Alternatively, the
insulating film 150 is a light-shielding resin film (e.g., a black
resin film). With this structure, the fingerprint sensor 10 can
further reduce the reflection of light.
FIG. 23 is a diagram illustrating a relation between the thickness
of an insulating film covering the detection electrodes and the
reflectance of light. The horizontal axis of FIG. 23 indicates a
wavelength (nm) of light incident on the fingerprint detection
region FA, where 380 nm to 780 nm correspond to a wavelength range
of visible light. The vertical axis of FIG. 23 indicates the
reflectance of light coming from the detection electrodes Rx. In
FIG. 23, Dre1 is measured data when no silicon nitride film is
provided on the detection electrodes Rx so that the detection
electrodes Rx are exposed to the air. Dre2 is measured data when a
silicon nitride film with a thickness of 100 nm is provided on the
detection electrodes Rx. Dre3 is measured data when a silicon
nitride film with a thickness of 50 nm is provided on the detection
electrodes Rx. As illustrated in FIG. 23, in the wavelength range
of visible light, the data Dre2 and Dre3 have a reflectance lower
than that of the data Dre1. Consequently, the fingerprint sensor 10
can further reduce the reflection of light by having the insulating
film 150. As illustrated in FIG. 23, there is a correlation between
the thickness of the silicon nitride film and the reflectance of
visible light. Consequently, a designer of the fingerprint
detection device may set the thickness of the insulating film 150
so as to make the reflectance of visible light a desired value.
The electrode portions 130 are translucent electrodes, whereas the
detection electrodes Rx are metallic thin lines. This structure can
reduce resistance and capacitance of the detection electrodes Rx.
The detection electrodes Rx are metallic thin lines and are thus
small in electrode width. This structure can reduce the area
covered with the detection electrodes Rx. Consequently, the
fingerprint sensor 10 can increase the aperture of the fingerprint
detection region FA and increase the translucency of the
fingerprint detection region FA.
The insulating layer 129 includes: the first insulating film 129A
arranged between the connecting portion 127 and the detection
electrode Rx in the normal direction Dz of the substrate 101; and
the second insulating film 129B arranged between the connecting
portion 127 and the electrode portion 130. The second insulating
film 129B is thinner than the first insulating film 129A. This
structure allows the fingerprint sensor 10 to reduce a level
difference of the electrode portion 130 in comparison with a case
in which the electrode portion 130 is arranged on the first
insulating film 129A. This structure can lower the probability of
disconnection in the electrode portion 130. The first insulating
film 129A arranged between the connecting portion 127 and the
detection electrode Rx is larger in thickness than the second
insulating film 129B, and thus can reduce capacitance generated
between the detection electrodes Rx and the drive electrodes
Tx.
The fingerprint sensor 10 includes: the first inter-layer
insulating film 111 provided on the one surface 101a of the
substrate 101; and the second inter-layer insulating film 121
provided on the first inter-layer insulating film 111 in the
fingerprint detection region FA. The drive electrodes Tx are
provided on the second inter-layer insulating film. The sum of the
thickness of the first inter-layer insulating film 111, the
thickness of the second inter-layer insulating film 121, and the
thickness of the drive electrode Tx is preferably 150 nm or less.
This structure can reduce the reflection of light incident on the
drive electrodes Tx.
Second Embodiment
The above has described the first embodiment in which the
connecting portion 127 is connected to the electrode portion 130
via the contact hole 129H. However, in the present embodiment, the
connecting portion 127 may be connected to the electrode portion
130 without via a contact hole. The electrode portions 130 adjacent
to each other in the second direction Dy may be connected to each
other via a conductive film formed simultaneously with the
electrode portions 130 at the same process.
FIG. 24 is a plan view illustrating a configuration example of a
fingerprint sensor according to a second embodiment. FIG. 25 is a
plan view illustrating the drive electrode and the detection
electrode according to the second embodiment. FIG. 26 is a diagram
omitting the illustration of the detection electrode and the
insulating film in FIG. 25. FIG. 27 is a sectional view
illustrating a configuration example of the fingerprint sensor
according to the second embodiment.
As illustrated in FIG. 24, in this fingerprint sensor 10A according
to the second embodiment, one drive electrode Tx has a plurality of
electrode portions 130, a plurality of connecting portions
(hereinafter, first connecting portions) 127, and a plurality of
second connecting portions 133. In one drive electrode Tx, the
electrode portions 130 are arranged in the second direction Dy and
are spaced apart from each other. In one drive electrode Tx, the
first connecting portions 127 and the second connecting portions
133 each connect adjacent electrode portions among the electrode
portions 130 to each other. As illustrated in FIG. 27, for example,
the second connecting portion 133 is provided above the first
connecting portion 127.
As illustrated in FIG. 25 to FIG. 27, one end of the first
connecting portion 127 is in contact with a surface of one
electrode portion 130 and the other end of the first connecting
portion 127 is in contact with a surface of another electrode
portion 130 adjacent to the one electrode portion 130, the surfaces
facing the substrate 101. The second connecting portion 133 is a
film formed simultaneously with the electrode portions 130 at the
same process. The second connecting portion 133 is integral with
the electrode portions 130. An insulating film 135 is provided
between the second connecting portion 133 and the detection
electrode Rx. With this structure, the detection electrodes Rx and
the drive electrodes Tx are insulated from each other. The
insulating film 135 is a resin insulating film, for example.
The following describes a method for manufacturing the fingerprint
sensor illustrated in FIG. 27 in order of process. FIG. 28 to FIG.
31 are sectional views each illustrating a method for manufacturing
the fingerprint sensor according to the second embodiment. The
method for manufacturing the finger sensor according to the second
embodiment is identical to that of the finger sensor according to
the first embodiment (refer to FIG. 15 to FIG. 17) until the
process by which the manufacturing apparatus (not illustrated)
forms the source electrode 123, the drain electrode 125, and the
connecting portion 127 in FIG. 28.
After forming the source electrode 123, the drain electrode 125,
and the connecting portion 127, the manufacturing apparatus forms
the insulating layer 129 only in the frame region GA, as
illustrated in FIG. 29. The manufacturing apparatus forms the
contact hole 129H in the insulating layer 129. The manufacturing
apparatus forms an insulating film (not illustrated) above the
substrate 101, for example. The insulating film covers the source
electrode 123, the drain electrode 125, and the connecting portions
127. Subsequently, the manufacturing apparatus performs exposure
processing on the insulating film. With this operation, part of the
insulating film positioned in the fingerprint detection region FA
and part of the insulating film in which the contact hole 129H is
formed are exposed. Subsequently, the manufacturing apparatus
performs developing processing on the insulating film to remove the
exposed part. With this operation, the manufacturing apparatus
forms the insulating layer 129 in the frame region GA and forms the
contact hole 129H in the insulating layer 129.
Subsequently, as illustrated in FIG. 30, the manufacturing
apparatus forms a conductive film such as ITO (not illustrated)
above the substrate 101. The conductive film is formed by the
sputtering, for example. Subsequently, the manufacturing apparatus
patterns the conductive film by the photolithography technique and
the dry etching technique. With this operation, as illustrated in
FIG. 31, the manufacturing apparatus forms the electrode portion
130 and the second connecting portions 133 out of the conductive
film.
Subsequently, the manufacturing apparatus forms the insulating film
135 only in the fingerprint detection region FA, as illustrated in
FIG. 31. The manufacturing apparatus forms an insulating film (not
illustrate) above the substrate 101, for example. The insulating
film covers the electrode portion 130 and the like. Subsequently,
the manufacturing apparatus performs exposure processing on the
insulating film. With this operation, the insulating film other
than part thereof positioned on the second connecting portion 133
is exposed. Subsequently, the manufacturing apparatus performs
developing process on the insulating film to remove the exposed
part. With this operation, the manufacturing apparatus forms the
insulating layer 129 on the second connecting portion 133.
The subsequent processes are the same as those of the first
embodiment. As illustrated in FIG. 27, the manufacturing apparatus
forms the detection electrode Rx including the first metallic layer
141, the second metallic layer 142, and the third metallic layer
143 on the insulating layer 129. The manufacturing apparatus forms
the insulating film 150 (refer to FIG. 27) above the substrate 101.
The insulating film 150 is formed by the CVD or the like. Through
the foregoing processes, the fingerprint sensor 10A illustrated in
FIG. 27 is completed.
Also in the fingerprint sensor 10A according to the second
embodiment, the detection electrode Rx has the first metallic layer
141 and the second metallic layer 142. The first metallic layer 141
has a reflectance of visible light lower than that of the second
metallic layer 142. With this structure, the fingerprint sensor 10A
can reduce the reflection of light by the detection electrodes Rx
and can reduce the occurrence of unintended patterns (e.g., moire
and a light reflecting pattern) due to this reflection. Further,
the structure can reduce the size of the connecting portions 127,
and reduce the area covered with the connecting portions 127. With
this structure, the fingerprint sensor 10A can further increase
aperture of the fingerprint detection region FA and further
increase the translucency of the fingerprint detection region
FA.
Third Embodiment
FIG. 32 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a third embodiment. As
illustrated in FIG. 32, in the fingerprint sensor 10B according to
the third embodiment, the insulating layer 129 is arranged between
the substrate 101 and the electrode portion 130 in the fingerprint
detection region FA. The insulating layer 129 is arranged on the
second inter-layer insulating film 121, and the electrode portion
130 is arranged on the insulating layer 129, for example.
The process of arranging the insulating layer 129 on the substrate
101 in the fingerprint detection region FA may be performed by
masking a region excluding the insulating layer 129 so as not to
cause light incident on the region in the exposure processing for
the insulating layer 129 described with reference to FIG. 29. With
this operation, the insulating layer 129 is arranged on the
substrate 101.
Also in the fingerprint sensor 10B according to the third
embodiment, the detection electrode Rx has the first metallic layer
141 and the second metallic layer 142. The first metallic layer 141
has a reflectance of visible light lower than that of the second
metallic layer 142. With this structure, the fingerprint sensor 10B
can reduce the reflection of light by the detection electrodes Rx
and can reduce the occurrence of unintended patterns due to the
reflection.
The provision of the insulating layer 129 also in the display
region AA that matches or substantially matches the fingerprint
detection region FA flattens the display surface of the display
region AA. In addition, the process of removing the first
insulating film 129A described above (refer to FIG. 14) is
eliminated, and the number of processes of manufacturing the
fingerprint sensor 10B can be reduced in comparison with that of
the fingerprint sensor 10A (refer to FIG. 14).
Fourth Embodiment
FIG. 33 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a fourth embodiment. As
illustrated in FIG. 33, in this fingerprint sensor 10C according to
the fourth embodiment, the first inter-layer insulating film 111
and the second inter-layer insulating film 121 are not arranged
between the substrate 101 and the electrode portion 130. In the
fingerprint detection region FA, the insulating layer 129 is
arranged on the substrate 101, and the electrode portion 130 is
arranged on the insulating layer 129.
The process of removing the first inter-layer insulating film 111
and the second inter-layer insulating film 121 from the fingerprint
detection region FA may be performed before or after the process of
forming the contact holes 121H1 and 121H2 described with reference
to FIG. 16. Before or after the contact holes 121H1 and 121H2 are
formed, a manufacturing apparatus (not illustrated) may
sequentially remove the second inter-layer insulating film 121 and
the first inter-layer insulating film 111 of the fingerprint
detection region FA by the photolithography technique and wet
etching technique, for example.
Also in the fingerprint sensor 10C according to the fourth
embodiment, the detection electrode Rx has the first metallic layer
141 and the second metallic layer 142. The first metallic layer 141
has a reflectance of visible light lower than that of the second
metallic layer 142. With this structure, the fingerprint sensor 10C
can reduce the reflection of light by the detection electrodes Rx
and can reduce the occurrence of unintended patterns (e.g., moire
and a light reflecting pattern) due to the reflection. In the
fingerprint detection region FA, the first inter-layer insulating
film 111 and the second inter-layer insulating film 121 are not
arranged. With this structure, the fingerprint sensor 10C can
reduce the reflection of light also at the position of the
electrode portion 130 of the fingerprint detection region FA.
When a silicon nitride film is used for the first inter-layer
insulating film 111 and the second inter-layer insulating film 121,
the reflected light of light coming from the electrode portion 130
side is colored (e.g., the reflected light has a tinge of red). For
this reason, the first inter-layer insulating film 111 and the
second inter-layer insulating film 121 are not preferably arranged
in the display region AA that matches or substantially matches the
fingerprint detection region FA. This structure can prevent the
reflected light from unintentionally having a tinge of red, which
can improve coloring of the reflected light. Consequently, the
quality of an image displayed on the display region AA can be
improved.
Fifth Embodiment
FIG. 34 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a fifth embodiment. As
illustrated in FIG. 34, in this fingerprint sensor 10D according to
the fourth embodiment, the first inter-layer insulating film 111
and the second inter-layer insulating film 121 are not arranged
between the substrate 101 and the electrode portion 130. The
insulating layer 129 (refer to FIG. 33) is not arranged between the
substrate 101 and the electrode portion 130, either. In the
fingerprint detection region FA, the electrode portion 130 is
arranged on the substrate 101, and the electrode portion 130 is in
contact with the substrate 101. The connecting portion 127 is
arranged on the substrate 101, and the connecting portion 127 is in
contact with the substrate 101.
In the fingerprint sensor 10D according to the fifth embodiment as
well, the detection electrodes Rx have the first metallic layer 141
and the second metallic layer 142. The first metallic layer 141 has
a reflectance of visible light lower than that of the second
metallic layer 142. With this structure, the fingerprint sensor 10D
can reduce the reflection of light by the detection electrodes Rx
and can reduce the occurrence of unintended patterns due to the
reflection. In the fingerprint detection region FA, the first
inter-layer insulating film 111 and the second inter-layer
insulating film 121 are not arranged. With this structure, the
fingerprint sensor 10D can also reduce the reflection of light at
the position of the electrode portion 130 of the fingerprint
detection region FA. The insulating layer 129 (refer to FIG. 33) is
not arranged at the position of the electrode portion 130, either.
With this structure, the fingerprint sensor 10D can increase the
translucency of the position of the electrode portion 130.
FIG. 35 is a diagram illustrating a relation between the wavelength
of light incident on the electrode portion of the drive electrode
and the reflectance of light. The horizontal axis of FIG. 35
indicates the wavelength (nm) of light incident on the electrode
portion 130, where 380 nm to 780 nm correspond to a wavelength
range of visible light. The vertical axis of FIG. 35 indicates the
reflectance of light coming from the electrode portion 130. In FIG.
35, L11 is measured data of the fingerprint sensor 10D. L12 is
measured data of a fingerprint sensor in which a silicon nitride
film is arranged between the substrate 101 and the electrode
portion 130. As illustrated in FIG. 35, in the wavelength range of
visible light, especially in the red wavelength range (e.g., 620 nm
to 780 nm), L11 is lower in reflectance than L12. As illustrated in
FIG. 35, the fingerprint sensor 10D can reduce the reflection of
reddish light in particular, and can thus improve coloring of
reflected light.
Sixth Embodiment
FIG. 36 is a sectional view illustrating a configuration example of
a fingerprint sensor according to a sixth embodiment. As
illustrated in FIG. 36, an insulating film 160 may be provided on
the insulating film 150 in FIG. 35. The insulating film 160 is a
resin film, for example, and is formed by the spin coating
technique or printing. With the configuration illustrated in FIG.
36, the detection surface of a fingerprint sensor 10E including the
drive electrodes Tx and the detection electrodes Rx is protected by
the insulating film 160. Consequently, the fingerprint detection
device 100 can improve reliability.
Seventh Embodiment
FIG. 37 is a block diagram illustrating a configuration example of
the fingerprint detection device according to a seventh embodiment.
FIG. 38 is a plan view illustrating a configuration example of the
detection electrodes according to the seventh embodiment. FIG. 39
is a plan view illustrating a configuration example of the
detection electrodes according to the seventh embodiment. FIG. 39
is a partially enlarged view illustrating FIG. 38. In the seventh
embodiment, the drive electrode driver 15 and the drive electrodes
Tx are arranged in the second direction Dy in which the drive
electrodes Tx extend. A plurality of detection electrode selection
circuits 14 are arranged in the first direction Dx so as to
sandwich the drive electrodes Tx therebetween.
The drive electrode driver 15 includes a shift register circuit 151
and a buffer circuit 152. The shift register circuit 151
sequentially selects the drive electrodes Tx in a time division
manner. The buffer circuit 152 amplifies the drive signal Vs and
supplies it to a selected drive electrode Tx. A plurality of power
supply lines PL supply power to the buffer circuit 152 from the
outside. The power supply lines PL supply power to both ends of the
buffer circuit 152 and the central part thereof in the second
direction Dy, for example. With this operation, without supplying
power from the upper side, power can be directly supplied to the
buffer circuit 152 from the outside of the drive electrode driver
15, and a load during power supply is reduced.
As illustrated in FIG. 38, dummy electrodes dmp are arranged such
that conductive materials such as metal discontinue and not
continuous in the first direction. As illustrated in FIG. 39, slits
SLT separate the conductive materials. This structure makes the
detection electrodes Rx less noticeable and invisible.
While exemplary embodiments have been described, the embodiments
are not intended to limit the present disclosure. The contents
disclosed in the embodiments are given by way of example only, and
various modifications may be made without departing from the spirit
of the present disclosure. Although a transmissive liquid crystal
display device capable of color display has been described as the
display device 1 in the first embodiment, for example, the present
disclosure is not limited to a transmissive liquid crystal display
device supporting color display and may be a transmissive liquid
crystal display device for monochrome display. Appropriate
modifications made without departing from the gist of the present
disclosure also naturally belong to the technical scope of the
present disclosure.
The fingerprint detection device and the display device of the
preset disclosure include the following aspects:
(1) A fingerprint detection device, comprising:
a substrate;
a plurality of drive electrodes provided on one surface side of the
substrate and arranged in a first direction;
a plurality of detection electrodes provided on the one surface
side and arranged in a second direction intersecting the first
direction; and
an insulating layer provided in a normal direction of the substrate
between each of the drive electrodes and the corresponding
detection electrodes, wherein
the detection electrodes intersect the drive electrodes in the
normal direction of the substrate,
each of the detection electrodes includes:
a first metallic layer; and
a second metallic layer positioned closer to the one surface than
the first metallic layer to the one surface, and
the first metallic layer has a reflectance of visible light lower
than that of the second metallic layer.
(2) The fingerprint detection device according to (1), further
comprising an insulating film provided on the one surface to cover
the detection electrodes, wherein
the insulating film includes at least one of a silicon nitride film
or a light-shielding resin film.
(3) The fingerprint detection device according to (1) or (2),
wherein each of the drive electrodes includes:
a plurality of electrode portions arranged spaced apart from each
other in a plan view; and
a plurality of connecting portions each connecting adjacent
electrode portions of the electrode portions to each other,
the electrode portions are translucent electrodes, and
the detection electrodes are metallic thin lines.
(4) The fingerprint detection device according to (3), wherein
the insulating layer further includes:
a first insulating film arranged between the connecting portions
and the corresponding detection electrodes in the normal direction
of the substrate; and
a second insulating film arranged between the connecting portions
and the corresponding detection electrodes, and
the second insulating film is thinner than the first insulating
film.
(5) The fingerprint detection device according to (4), wherein each
of the electrode portions includes:
an electrode main body; and
a protruding portion in a plan view protruding from the electrode
main body toward an electrode portion adjacent to the corresponding
electrode portion, and
the second insulating film is arranged between the corresponding
electrode portion and the protruding portion.
(6) The fingerprint detection device according to any one of (1) to
(5), further comprising an inter-layer insulating film provided on
the one surface side of the substrate, wherein
the inter-layer insulating film is arranged between the substrate
and the drive electrodes, and
a sum of a thickness of the inter-layer insulating film and a
thickness of the drive electrodes is 150 nm or less.
(7) The fingerprint detection device according to any one of (1) to
(6), further comprising an inter-layer insulating film provided on
the one surface of the substrate, wherein
the substrate includes:
a fingerprint detection region in which the drive electrodes and
the detection electrodes are arranged; and
a frame region adjacent to the fingerprint detection region,
and
the inter-layer insulating film is arranged in the frame region and
is not arranged in the fingerprint detection region.
(8) The fingerprint detection device according to any one of (1) to
(6), further comprising an inter-layer insulating film provided on
the one surface of the substrate, wherein
the substrate includes:
a fingerprint detection region in which the drive electrodes and
the detection electrodes are arranged; and
a frame region adjacent to the fingerprint detection region,
the inter-layer insulating film is arranged in the frame region on
the substrate, and
the drive electrodes are arranged in the fingerprint detection
region on the substrate.
(9) A display device comprising:
a display panel; and
a fingerprint detection device arranged facing the display panel,
the finger print detection device comprising:
a substrate;
a plurality of drive electrodes provided on one surface side of the
substrate and arranged in a first direction;
a plurality of detection electrodes provided on the one surface
side and arranged in a second direction intersecting the first
direction; and
an insulating layer provided in a normal direction of the substrate
between each of the drive electrodes and the corresponding
detection electrodes, wherein
the detection electrodes intersect the drive electrodes in the
normal direction of the substrate,
each of the detection electrodes includes:
a first metallic layer; and
a second metallic layer positioned closer to the one surface than
the first metallic layer to the one surface, and
the first metallic layer has a reflectance of visible light lower
than that of the second metallic layer.
* * * * *