U.S. patent number 10,971,836 [Application Number 16/672,122] was granted by the patent office on 2021-04-06 for printed circuit board with embedded lateral connector.
This patent grant is currently assigned to Amazon Technologies, Inc.. The grantee listed for this patent is Amazon Technologies, Inc.. Invention is credited to William Mische.
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United States Patent |
10,971,836 |
Mische |
April 6, 2021 |
Printed circuit board with embedded lateral connector
Abstract
Printed circuit boards (PCBs) may include embedded lateral
connectors. The embedded lateral connectors may be configured to
enable components to quickly couple to or plug into a PCB, thus
saving time to form connections. The embedded lateral connectors
may also reduce weight and/or size by avoiding need for bulky
tradition collections with conventional components (e.g., solders,
external pin connectors, etc.). The connectors may include male
connectors, female connectors, and/or mounting connectors. The
connectors may be configured to connect multiple PCBs together,
such as using a stacked configuration, which may enable reducing a
volume of space needed in a housing for the PCBs.
Inventors: |
Mische; William (Seattle,
WA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Amazon Technologies, Inc. |
Seattle |
WA |
US |
|
|
Assignee: |
Amazon Technologies, Inc.
(Seattle, WA)
|
Family
ID: |
1000005471577 |
Appl.
No.: |
16/672,122 |
Filed: |
November 1, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200067219 A1 |
Feb 27, 2020 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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15812756 |
Nov 14, 2017 |
10476188 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K
1/144 (20130101); H01R 12/73 (20130101); H01R
13/52 (20130101); H05K 3/403 (20130101); H05K
1/142 (20130101); H01R 12/716 (20130101); H01R
43/002 (20130101); H05K 1/115 (20130101); H05K
1/036 (20130101); H05K 1/148 (20130101); H05K
1/184 (20130101); H05K 2201/10409 (20130101); H05K
3/368 (20130101); H01R 12/721 (20130101); H05K
2201/09145 (20130101); H05K 2201/0919 (20130101); H05K
2201/09036 (20130101); H05K 2201/042 (20130101); H01R
12/722 (20130101); H05K 2201/09072 (20130101); H05K
2201/10189 (20130101) |
Current International
Class: |
H01R
12/72 (20110101); H05K 3/40 (20060101); H05K
1/18 (20060101); H05K 1/14 (20060101); H05K
1/11 (20060101); H01R 12/73 (20110101); H01R
12/71 (20110101); H01R 13/52 (20060101); H05K
1/03 (20060101); H01R 43/00 (20060101); H05K
3/36 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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19523364 |
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Jan 1996 |
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DE |
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102007039064 |
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Feb 2009 |
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DE |
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2222145 |
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Aug 2010 |
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EP |
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2003132668 |
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May 2003 |
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JP |
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WO2004103038 |
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Nov 2004 |
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WO |
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WO2007045520 |
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Apr 2007 |
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WO |
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WO2014091000 |
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Jun 2014 |
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WO |
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Other References
Final Office Action dated Dec. 23, 2019 for U.S. Appl. No.
15/711,707 "Printed Circuit Board With Heat Sink" Mische, 19 pages.
cited by applicant .
Non Final Office Action dated Jan. 4, 2019 for U.S. Appl. No.
15/711,707 "Printed Circuit Board With Heat Sink" Mische, 18 pages.
cited by applicant .
Office Action for U.S. Appl. No. 15/812,756, dated Apr. 15, 2019,
Mische, "Printed Circuit Board With Embedded Lateral Connector", 9
pages. cited by applicant .
Office action for U.S. Appl. No. 15/711,707, dated Apr. 16, 2018,
Mische, "Printed Circuit Board With Heat Sink", 17 pages. cited by
applicant .
Office Action for U.S. Appl. No. 15/711,707, dated Apr. 3, 2019,
Mische, "Printed Circuit Board With Heat Sink", 18 pages. cited by
applicant .
Office Action for U.S. Appl. No. 15/711,707, dated Jun. 28, 2019,
Mische, "Printed Circuit Board With Heat Sink", 19 pages. cited by
applicant .
Office Action for U.S. Appl. No. 15/812,756, dated Sep. 11, 2018,
William Mische, "Printed Circuit Board With Embedded Lateral
Connector", 12 pages. cited by applicant .
Office Action for U.S. Appl. No. 15/711,707, dated Sep. 18, 2018,
William Mische, "Printed Circuit Board With Heat Sink", 14 pages.
cited by applicant .
The PCT Search Report and Written Opinion dated Jan. 3, 2019 for
PCT Application No. PCT/US2018/051429, 16 pages. cited by applicant
.
The PCT Search Report and Written Opinion dated Mar. 6, 2019 for
PCT Application No. PCT/US2018/060794, 37 pages. cited by
applicant.
|
Primary Examiner: Ta; Tho D
Attorney, Agent or Firm: Lee & Hayes, P.C.
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATION
This patent application is a continuation of and claims priority to
co-pending and co-owned U.S. patent application Ser. No.
15/812,756, filed Nov. 14, 2017, entitled "PRINTED CIRCUIT BOARD
WITH EMBEDDED LATERAL CONNECTOR," which is hereby incorporated in
its entirety by reference.
Claims
What is claimed is:
1. A method comprising: forming an inner layer of a printed circuit
board (PCB) that includes a first planar side and a second planar
side opposite the first planar side; coupling a connector to the
inner layer, the connector having an elongated body with a
longitudinal axis that is oriented parallel with the first planar
side, the elongated body extending outward and beyond a lateral
side of the PCB; coupling a first set of one or more layers to the
first planar side of the inner layer; coupling a second set of one
or more layers to the second planar side of the inner layer; and
adhering the inner layer to the first set of one or more layers and
to the second set of one or more layers to form the PCB having the
connector embedded laterally in the PCB, wherein an outermost layer
of PCB includes a spacing feature configured to engage an adjacent
PCB, the spacing feature to create a predefined gap between the PCB
and the adjacent PCB.
2. The method as recited in claim 1, wherein the connector includes
one or more contacts that create an electrical connection between
the inner layer and the connector, and wherein the one or more
contacts are further configured to engage a corresponding connector
of a different PCB.
3. The method as recited in claim 1, wherein the elongated body has
a first height relative to the first planar side at a first point
along the longitudinal axis and a second height relative to the
first planar side that is different than the first height at a
second point along the longitudinal axis.
4. The method as recited in claim 1, further comprising connecting
the PCB to the adjacent PCB via the connector and a second
connector of the adjacent PCB, the second connector being recessed
within the PCB.
5. The method as recited in claim 1, wherein the elongated body of
the connector includes a tip and at least one ring.
6. The method as recited in claim 1, wherein the inner layer
includes a layer aperture configured to receive the connector, and
wherein coupling the connector to the inner layer includes coupling
the connector to the inner layer within the layer aperture.
7. The method as recited in claim 6, further comprising forming the
layer aperture using at least one of a die cutting process or an
additive manufacturing process that omits adding material in a
location to form the layer aperture.
8. A printed circuit board (PCB) comprising: a plurality of layers,
at least one layer of the plurality of layers having a planar side
that connects to an adjacent layer of the plurality of layers; and
a connector embedded between at least some layers of the plurality
of layers, the connector having an elongated body that extends
outward and beyond a lateral side of the PCB, wherein a height of
the elongated body relative to the planar side varies along the
elongated body.
9. The PCB as recited in claim 8, wherein the connector includes
one or more contacts that create an electrical connection between a
layer of the plurality of layers and the connector, and wherein the
one or more contacts are further configured to engage a
corresponding connector of a different PCB.
10. The PCB as recited in claim 8, further comprising a mounting
feature coupled to the lateral side of the PCB and at least partly
located between at least some layers of the plurality of layers,
the mounting feature including an aperture and one or more threads
to facilitate mounting the PCB on a housing.
11. The PCB as recited in claim 8, wherein an outermost layer of
the plurality of layers includes a spacing feature configured to
engage an adjacent PCB, the spacing feature to create a predefined
gap between the PCB and the adjacent PCB.
12. The PCB as recited in claim 8, wherein the connector is a first
connector, and further comprising a second connector embedded
between at least some layers of the plurality of layers, the second
connector oriented such that a longitudinal axis of the second
connector is parallel with the planar side.
13. The PCB as recited in claim 12, wherein the first connector is
a first shape that is different than a second shape of the second
connector.
14. An electronic device comprising: a housing; a printed circuit
board (PCB) including: a plurality of layers, at least one layer of
the plurality of layers having a planar side that connects to an
adjacent layer of the plurality of layers; and a connector embedded
between at least some layers of the plurality of layers, the
connector having an elongated body that extends outward and beyond
a lateral side of the PCB; a component coupled to the PCB by the
connector; and a mounting feature coupled to the lateral side of
the PCB and at least partly located between at least two layers of
the plurality of layers, the mounting feature including an aperture
and one or more coupling features to facilitate mounting of the PCB
on the housing.
15. The electronic device as recited in claim 14, wherein the
component is a different PCB.
16. The electronic device as recited in claim 14, wherein the
elongated body has a first height relative to the planar side at a
first point along a longitudinal axis of the connector and a
second, different height relative to the planar side at a second
point along the longitudinal axis of the connector.
17. The electronic device as recited in claim 14, wherein the
connector includes one or more contacts that create an electrical
connection between a layer of the plurality of layers and the
connector, the one or more contacts further configured to engage
the component.
18. The electronic device as recited in claim 17, further
comprising a power source, and wherein the electrical connection
includes a connection to the power source.
19. The electronic device as recited in claim 14, wherein the
connector is a first connector, and further comprising a second
connector embedded between at least some layers of the plurality of
layers, the second connector oriented such that a longitudinal axis
of the second connector is parallel with the planar side.
20. The electronic device as recited in claim 19, wherein the first
connector is a first shape that is different than a second shape of
the second connector.
Description
BACKGROUND
Printed circuit boards (PCBs) are formed during a manufacturing
process, and then often later modified to add components, such as
surface-mounted processors and other components. Some components
are added to PCBs by adding solder to create electrical
connections. Other components may be added by bolting through
apertures formed through a thin side of a PCB, which is typically
less than a few millimeters thick. Both of these processes add
weight to the overall system and add bulk by increasing an overall
volume of the PCB, and in particular, a thickness of the finished
PCB.
BRIEF DESCRIPTION OF THE DRAWINGS
The detailed description is described with reference to the
accompanying figures. In the figures, the left-most digit(s) of a
reference number identifies the figure in which the reference
number first appears. The same reference numbers in different
figures indicate similar or identical items.
FIGS. 1A and 1B show a pictorial flow diagram describing an
illustrative process to create an electronic device with a printed
circuit board (PCB) that includes an embedded lateral
connector.
FIG. 2 is a perspective view of an illustrative PCB that includes
an illustrative embedded lateral connector.
FIG. 3A shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of embedded lateral connectors.
FIG. 3B shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of embedded lateral connectors
having retention features.
FIG. 3C shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of some embedded lateral connectors
having different retention features.
FIG. 3D a schematic diagram of a connector that includes a wedge
inserted into a tip of the connector to expand a diameter of the
tip to secure the connector in a receptacle.
FIG. 3E shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of some embedded lateral connectors
utilizing a wedge retention feature for use with the connector
shown in FIG. 3D.
FIG. 4A is a perspective view of a sealed connector that secures a
wire to a PCB.
FIG. 4B is a cross-sectional side elevation view of the sealed
connector shown in FIG. 4A.
FIGS. 5A and 5B show perspective views of coupling of different
components using embedded lateral connectors.
FIGS. 6A-6C show perspective views of PCBs electrically connected
using embedded lateral connectors.
DETAILED DESCRIPTION
This disclosure is directed to printed circuit boards (PCBs) that
include one or more embedded lateral connectors, which may be used
to couple components to the PCB. The connectors (also referred to
as an "interface" or a "coupler") may be formed as apertures
configured to receive a plug or other corresponding solid connector
(i.e., female connectors), as plugs configured to engage connector
receptacles (i.e., male connectors), or a combination of both.
Unlike conventional connectors that engage a PCB through a top or
bottom surface, the connectors described herein are positioned in
the lateral sides of the PCB and thus can project into the PCB on
the order of millimeters or centimeters since PCBs have larger
width and length than a thickness. Typically, a thickness of a PCB
is just a few millimeters in most situations. The connector(s) may
be used for data transfer, for supply of power, and/or for other
electronic functions
In accordance with one or more embodiments, layers used to form a
PCB may be formed with one or more apertures or cutouts on some
layers to accommodate placement of the embedded lateral
connector(s) between at least some of the layers. The apertures may
be formed by die cuts or removing material in other ways (e.g.,
milling, etc.), formed by printing each layer to exclude material
in locations to form the aperture(s), or by other known techniques
to form a layer with at least one aperture. A PCB may be formed
using the layers. For example, an inner layer may be formed that
includes a first planar side and a second planar side opposite the
first planar side. A connector may be coupled to the inner layer
such that an aperture with a longitudinal axis is oriented parallel
with the first planar surface. An opening of the connector may be
aligned with a side of the inner layer. The connector may create an
electrical connection between the inner layer and contacts included
in the connector that are configured to engage a plug. In other
embodiments, the connector may be a plug, but may be formed in a
similar manner. Next, a set of layers may be coupled to the first
planar side of the inner layer and another set of layers may be
coupled to the second planar side of the inner layer. The layers
may then be adhered (e.g., glued, laminated, cured, etc.) to form a
PCB having the connector embedded laterally in the PCB.
The apparatuses and techniques described herein may be implemented
in a number of ways. Example implementations are provided below
with reference to the following figures.
FIGS. 1A and 1B show a pictorial flow diagram describing an
illustrative process to create an electronic device with a printed
circuit board (PCB) that includes an embedded lateral connector.
The process is illustrated as a collection of blocks in a logical
flow graph, which represent a sequence of operations. The order in
which the operations are described is not intended to be construed
as a limitation, and any number of the described blocks can be
combined in any order and/or in parallel to implement the
process.
FIG. 1A shows an illustrative process 100. At 102, an inner layer
104 may be formed. The inner layer 104 may include a planar layer
106 having a top planar side and a bottom planar side. The layer
may include etched or otherwise formed metallic connections on the
top planar side, the bottom planar side, or both. The layers,
including the planar layer 104, may be formed of insulator
material, such as fiberglass (reinforces epoxy resin), plastic, or
other material commonly used to form PCBs, and may include
conductive materials, such as copper foil or other metallic foil or
material. The planar layer 106 may include an aperture or special
feature that accommodates coupling of a connector 108 to the planar
layer 106 such that at least part of the connector occupies space
within the plane of the planar layer 106, which is referred to
herein as an aperture or special feature. In some embodiments, the
layers may be formed by an additive manufacturing process that
utilizes three-dimensional (3D) printing. The additive
manufacturing process may omit or refrain from adding material in
certain areas to form apertures or special features. In some
embodiments, the layers may be machined, die cut, or otherwise
processed to remove material to form the apertures or special
features. The connector may be coupled to the inner layer such that
a longitudinal axis of the connector is oriented parallel with the
top planar surface. If the connector includes an aperture, an
opening of the connector may be aligned with a side of the inner
layer. The connector may create an electrical connection between
the inner layer and contacts included in the connector that are
configured to engage another connector, such as a plug or
complementary recess (if the connector is a plug).
At 110, additional layers may be formed to create a PCB. Top layers
112 and bottom layers 114 may be created, such as using same or
similar techniques used to form the planar layer 106 described
above. The layers may include etched or otherwise formed metallic
connections on a top side, a bottom side, or both of each layer. In
some embodiments, the top layers 112 and bottom layers 114 may be
mirrored versions of one another. At least some of the top layers
112 may include first apertures 116 while at least some of the
bottom layers 114 may include second apertures 118, which may be a
mirrored version of the first apertures 116. The first apertures
116 and the second apertures 118 may accommodate the volume of the
connector, which may reside in a cavity formed by the apertures
after assembly of the layers with the inner layer 104.
At 120, the top layers 112, the inner layer 104 and the bottom
layers 114 may be assembled such as by stacking the layers on top
of one another. When assembled the first apertures 116 and the
second apertures 118 may be in alignment and may accommodate the
connector 108, which may be situated between at least some of the
layers and at least partly with the apertures.
At 122, the layers may be adhered (e.g., glued, laminated, cured,
etc.) together to form a PCB 124 that includes an embedded lateral
connector 126.
FIG. 1B shows additional processes 128 that may be performed on the
PCB 124 or with the PCB 124.
At 130, conventional components 132 may be coupled to a top surface
of the PCB 124, a bottom surface of the PCB 124, or both. The
conventional components 132 may be coupled by solder, by threaded
connectors that extend through apertures that extend through all
layers of the PCB 124 in the planar surface of the PCB 124, and/or
by other convention techniques. The components may include
capacitors, controllers, resistors, pin connectors, and/or other
types of conventional components.
At 134, a component 136 may be coupled to the embedded lateral
connector 126. The component 136 may include a complementary
connector 138 that is complementary to the embedded lateral
connector 126 that, when joined or coupled to the embedded lateral
connector 126, creates an electrical connection between the PCB 124
and the component 136. The component 136 may be a power adapter,
another PCB, a display, and/or any other type of electronic
component that operates by electrical interaction with the PCB. In
some embodiments, the embedded lateral connector 126 may include
multiple contacts, such as rings or other types of contacts, which
may be designated for electrical transmission of different signals.
In various embodiments, multiple embedded lateral connectors may be
used to couple to the component 136. The multiple embedded lateral
connectors may be a same type or may be of different types, which
may desirably limit coupling position/orientation with the
component 136.
At 140, the PCB 124 may be coupled to a housing 142 of an
electronic device 144. The housing 142 may secure the PCB 124, such
as by couplers that engage embedded lateral mounting features in
the PCB, which are discussed below.
FIG. 2 is a perspective view of an illustrative PCB 200 that
includes a plurality of illustrative embedded lateral connectors
202 on a first lateral side 204. In some embodiments, the PCB 200
may include additional embedded lateral connectors on one or more
different lateral sides, such as a second lateral side 206, a third
lateral side 208, or a fourth lateral side 210. The PCB 200 may
include a top planar surface 212 and a bottom planar surface 214
opposite the top planar surface 212. Conventional components 216
may be soldered to the top planar surface 212 or otherwise coupled
thereto.
FIG. 3A shows a cross-sectional top view of the PCB 200 shown in
FIG. 2, showing illustrative details of some embodiments of the
embedded lateral connectors. In some embodiments, the
cross-sectional top view of the PCB 200 may be a cross-sectional
view of an inner layer of the PCB, such as the inner layer 104
discussed with reference to FIG. 1A.
The PCB 200 may include first connectors 302(1)-302(N), which may
be plugs or other extrusions of a male-type connector. The first
connectors may include tip(s) 304 and ring(s) 306, as well as a
sleeve, which may be used for grounding purposes. In some
embodiments, the first connectors 302 may include multiple rings,
which may be separated by insulators to enable transmission of
different signals. The tip(s) 304 and the ring(s) 306 include
electrical connectivity to an electrical grid formed in layers in
the PCB 200, as discussed above. The first connectors 302(1)-302(N)
may include electrical connection with different layers of the PCB
via a first contact 307(1) and a second contact 307(2) shown in
Detail A, although more contacts may be used depending on factors
such as a number or rings of the first connectors 302(1)-302(N). In
some embodiments, a first contact 307(1) may include electrical
connection with the inner layer while the second contact 307(2) may
include electrical connection with a different layer, possibly an
adjacent later.
The PCB 200 may include second connectors 308(1)-308(M), which may
be apertures or other cavities of a female-type connector. The
second connectors 308 may include first contact(s) 310 and second
contact(s) 312, and possibly other contacts, which may engage
rings, tips, and/or a sleeve of a corresponding connector (e.g., a
plug), which are also shown in Detail B. The first contact(s) 310
and second contact(s) 312 may be formed as biasing devices (e.g.,
leaf spring, etc.) to enable repetitive interaction with a
corresponding connector, which may cause deflection (compression)
of a contact when mated with one of the second connectors
308(1)-308(M). In some embodiments, the first contact(s) 310 may
include electrical connection with the inner layer while the second
contact(s) 312 may include electrical connection with a different
layer, possibly an adjacent later. The second connectors 308 may
include retention features 314, which may engage the corresponding
connector to secure the corresponding connector to one of the
second connectors 308. The contacts 310 and 312 include electrical
connectivity to the electrical grid formed in layers in the PCB
200, as discussed above.
In accordance with some embodiments, the PCB 200 may include
mounting features 316, which may be embedded in the lateral side of
the PCB. The mounting features 316 may enable coupling the PCB 200
to a housing, frame, mounting bracket, other PCB, or other
component. The mounting features 316 may include treads or other
features to enable corresponding parts to be securely fastened or
coupled to the mounting features, such as screws. Besides threaded
features, the mounting features may use a snap fit, magnets,
friction fit, or other types of coupling features to secure the
mounting features to another part.
FIG. 3B shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of embedded lateral connectors
having retention features.
The PCB 200 may include third connectors 318(1)-318(N), which may
be plugs or other extrusions of a male-type connector. The third
connectors may include tip(s) 320 and ring(s) 322, as well as a
sleeve, which may be used for grounding purposes. At least some of
the rings 322 may be formed as biased rings or springs, which may
deflect upon entry into a corresponding connector, and then engage
a corresponding recess to retain the third connector in the
corresponding connector. For example, the third connectors may be
similar to "banana plugs". In some embodiments, the third
connectors 318 may include multiple rings, which may be separated
by insulators to enable transmission of different signals. The
tip(s) 320 and the ring(s) 322 include electrical connectivity to
an electrical grid formed in layers in the PCB 200, as discussed
above.
The PCB 200 may include fourth connectors 324(1)-324(M), which may
be apertures or other cavities of a female-type connector. The
fourth connectors 324 may include first contact(s) 326 and second
contact(s) 328, and possibly other contacts, which may engage
rings, tips, and/or a sleeve of a corresponding connector (e.g., a
plug). The second contacts 328 may be formed as a recess to act as
retention features, which may engage the corresponding biased rings
or springs to secure the corresponding connector to one of the
fourth connectors 324. The contacts 326 and 328 include electrical
connectivity to the electrical grid formed in layers in the PCB
200, as discussed above.
In accordance with some embodiments, the PCB 200 having the third
connectors 318, the forth connectors 324, and/or any other
connectors described herein, may include the mounting features 316,
which may be embedded in the lateral side of the PCB. The mounting
features 316 may enable coupling the PCB 200 to a housing, frame,
mounting bracket, other PCB, or other component. The connectors
described herein may include any of the contacts 307(1), 307(2),
312, and/or 314 described above with reference to FIG. 3A
FIG. 3C shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of some embedded lateral connectors
having different retention features.
The PCB 200 may include fifth connectors 330(1)-330(N), which may
be plugs or other extrusions of a male-type connector. The fifth
connectors may include tip(s) 332 and ring(s) 334, as well as a
sleeve, which may be used for grounding purposes. At least some of
the rings 334 may include directional barbs or securing features,
which may enable entry into a corresponding connector, and then
engage a sidewall or corresponding features or recesses to retain
the fifth connector in the corresponding connector. In some
embodiments, the fifth connectors 330 may include multiple rings,
which may be separated by insulators to enable transmission of
different signals. The tip(s) 332 and the ring(s) 334 include
electrical connectivity to an electrical grid formed in layers in
the PCB 200, as discussed above.
The PCB 200 may include sixth connectors 336(1)-336(M), which may
be apertures or other cavities of a female-type connector. The
sixth connectors 336 may include first contact(s) 338 and second
contact(s) 340, and possibly other contacts, which may engage
rings, tips, and/or a sleeve of a corresponding connector (e.g., a
plug). The second contacts 340 may include retention features,
which may engage corresponding rings features, such as the
directional barbs or securing features discussed with relation to
the rings 334 to secure the corresponding connector to one of the
sixth connectors 336. The contacts 338 and 340 include electrical
connectivity to the electrical grid formed in layers in the PCB
200, as discussed above.
In accordance with some embodiments, the PCB 200 having the fifth
connectors 330, the sixth connectors 336, and/or any other
connectors described herein, may include the mounting features 316,
which may be embedded in the lateral side of the PCB. The mounting
features 316 may enable coupling the PCB 200 to a housing, frame,
mounting bracket, other PCB, or other component. The connectors
described herein may include any of the contacts 307(1), 307(2),
312, and/or 314 described above with reference to FIG. 3A
FIG. 3D a schematic diagram of a first configuration 342 of a
connector 344 that includes a wedge 346 inserted into a tip of the
connector 342. A second configuration 348 of the connector 344
shows the wedge 346 pushed into the connector 344 along a seam to
expand a diameter 350 of the tip, which flares or expands to secure
the connector in a corresponding connector or receptacle, such as
the corresponding connector discussed with reference to FIG. 3E,
below.
FIG. 3E shows a cross-sectional top view of the PCB shown in FIG.
2, showing illustrative details of some embedded lateral connectors
utilizing a wedge retention feature for use with the connector
shown in FIG. 3D.
The PCB 200 may include seventh connectors 352(1)-352(M), which may
be apertures or other cavities of a female-type connector. The
seventh connectors 352 may include first contact(s) 354 and second
contact(s) 356, and possibly other contacts, which may engage
rings, tips, and/or a sleeve of a corresponding connector, such as
the second configuration 348 of the connector 344 that includes the
wedge 346 inserted into the seam (as shown in FIG. 3D). The second
contacts 356 may be formed as a recess to act as retention features
that engage the diameter 350 of the tip, to secure the
corresponding connector to one of the seventh connectors 352. The
contacts 354 and 356 include electrical connectivity to the
electrical grid formed in layers in the PCB 200, as discussed
above.
In accordance with some embodiments, the PCB 200 having the seventh
connectors 352 and/or any other connectors described herein, may
include the mounting features 316, which may be embedded in the
lateral side of the PCB. The mounting features 316 may enable
coupling the PCB 200 to a housing, frame, mounting bracket, other
PCB, or other component. The connectors described herein may
include any of the contacts 307(1), 307(2), 312, and/or 314
described above with reference to FIG. 3A
FIG. 4A is a perspective view of a sealed connector pair 400 that
secures a wire 402 to a PCB 404. The sealed connector pair 400 may
include a housing 406, which may be coupled to a collar 408. The
collar 408 may retain a sleeve 410. The sleeve 410 may retain a
gasket 412, among other internal parts shown in FIG. 4B, below. The
sealed connector pair 400 may enable connection of the wire 402 to
electrical components of the PCB 404, while preventing or reducing
exposure by the PCB 404 to environmental conditions, such as dirt,
moisture, and/or other contamination.
FIG. 4B is a cross-sectional side elevation view of the sealed
connector shown in FIG. 4A. As shown, the wire 402 may engage a
connector 414, which may create an electrical connection with a
connector 416 via contacts 418. The connector 414 may receive the
wire 402 and retain the wire, at least in part by friction, a press
fit, and/or by retaining features, such as barbs. The connector 414
may abut a first seal 420 positioned between the connector 414, the
sleeve 410, and the housing 406. A second seal 422 may be
positioned between the sleeve 410, the wire 402, and the gasket
412. The seals 420 and 422 may prevent or reduce exposure by the
connector 416 of the PCB 404 to environmental conditions, such as
dirt, moisture, and/or other contamination. Meanwhile, the sleeve
410 may be coupled to the collar 408 by clips, snap features,
and/or other features to retain the sleeve, and retain the wire 402
in the connector 416. During use, the wire 402 may be coupled to
the connector 414, the sleeve 410, seals 420 and 422, and the
gasket 412 to form an assembly. The assembly may then be inserted
through the housing 406 and into the connector 416 until the sleeve
couples to the collar 408, thereby securing or retaining the wire
402 in the connector 416.
FIGS. 5A and 5B show perspective views of different components
coupled to embedded lateral connectors. FIG. 5A shows a PCB 500
that includes embedded lateral connectors 502. For example, the
embedded lateral connectors 502 may include a first set of embedded
lateral connectors 504 and a second set of embedded lateral
connectors 506. In some embodiments, the first set of embedded
lateral connectors 504 may be a different type of connector than
the second set of embedded lateral connectors 506, such as
male-type connectors versus female-type connectors, or selected
from any other type of connector described above. FIG. 5A also
shows a first component 508 and a second component 510 configured
to be coupled to the first set of embedded lateral connectors 504
and the second set of embedded lateral connectors 506,
respectively.
FIG. 5B shows the PCB 500 coupled to the first component 508 and
the second component 510. The first component 508 is coupled to the
first set of embedded lateral connectors 504 while the second
component 510 is coupled to the second set of embedded lateral
connectors 506.
FIGS. 6A-6C show perspective views of PCBs electrically connected
using embedded lateral connectors.
FIG. 6A shows a perspective view of a first assembly 600 of PCBs,
including a first PCB 602 and a second PCB 604. The first PCB 602
and the second PCB 604 may include one or more embedded lateral
connectors 606, as described above. The first PCB 602 may be
electrically connected to the second PCB 604 by coupling first
embedded lateral connectors of the first PCB 602 directly to second
embedded lateral connectors of the second PCB 604. By connecting
PCBs in this manner, the PCBs may exchange information and/or
electrical signals and may possibly operate in a similar way as a
larger PCB that encompasses all components and circuitry of the
first PCB 602 and the second PCB 604. In some embodiments, the
embedded lateral connectors may operate as a multi-pin connector to
facilitate exchange of different signals between the first and
second PCB. Additional PCBs may be connected to additional embedded
lateral connectors on the first or second PCB.
FIG. 6B shows a perspective view of a second assembly 608 of PCBs
in a stacked configuration, including the first PCB 602 and the
second PCB 604. The first PCB 602 and the second PCB 604 may
include one or more embedded lateral connectors 606, as described
above. The first PCB 602 may be electrically connected to the
second PCB 604 by coupling first embedded lateral connectors of the
first PCB 602 to second embedded lateral connectors of the second
PCB 604 using an adapter 610. The adapter 610 may include a first
adapter end 612 and a second adapter end 614 that each include
connectors configured to couple to respective embedded lateral
connectors 606 of the first PCB 602 and the second PCB 604,
respectively. By connecting PCBs in this manner, the PCBs may
exchange information and/or electrical signals and may possibly
operate in a similar way as a larger PCB that encompasses all
components and circuitry of the first PCB 602 and the second PCB
604. In some embodiments, the embedded lateral connectors may
operate as a multi-pin connector to facilitate exchange of
different signals between the first and second PCB. Additional PCBs
may be connected to additional embedded lateral connectors on the
first or second PCB.
FIG. 6C shows a perspective view of a third assembly 616 of PCBs in
a stacked and coupled configuration, including the first PCB 602
and the second PCB 604. In various embodiments, the first PCB 602,
the second PCB 604, or both may include spacers 618 on the planar
surfaces of the PCBs. The spacers 618 may create an offset between
adjacent PCBs and/or may couple the PCBs, such as by engaging in
corresponding features. The first PCB 602 and the second PCB 604
may include one or more embedded lateral connectors 606, as
described above. The first PCB 602 may be electrically connected to
the second PCB 604 by coupling first embedded lateral connectors of
the first PCB 602 to second embedded lateral connectors of the
second PCB 604 using the adapter 610. The adapter 610 may include a
first adapter end 612 and a second adapter end 614 that each
include connectors configured to couple to respective embedded
lateral connectors 606 of the first PCB 602 and the second PCB 604,
respectively. By connecting PCBs in this manner, the PCBs may
exchange information and/or electrical signals and may possibly
operate in a similar way as a larger PCB that encompasses all
components and circuitry of the first PCB 602 and the second PCB
604. In some embodiments, the embedded lateral connectors may
operate as a multi-pin connector to facilitate exchange of
different signals between the first and second PCB. Additional PCBs
may be connected to additional embedded lateral connectors on the
first or second PCB.
In accordance with various embodiments, an electronic device ma
include a housing, a PCB, a connector, and a component. The PCB may
include a plurality of layers, each layer having a planar side that
mates with an adjacent layer of the plurality of layers. The PCB
may include a connector embedded between at least some of the
layers. The connector may be oriented such that a longitudinal axis
of the connector is parallel with the planar side. The connector
may be configured to receive a corresponding connector to create an
electrical connection to at least some of the plurality of layers
via the connector. The component may be coupled to the PCB by the
connector.
In various embodiment, the component is a different PCB. The PCB
and the different PCB may be arranged in a stacked configuration,
possibly using the spaces to create an offset between the PCBs
and/or couple the PCBs to one another.
The electronic device may include a power source. The electrical
connection may include connection to the power source.
The electronic device may include mounting features coupled to a
lateral side of the PCB and at least partly located between at
least some of the plurality of layers. The mounting feature may
include an aperture and coupling features to facilitate coupling to
the housing. For example, screws may retain the PCB to the housing
via the mounting features
In some embodiments, the connector includes an aperture, and an
opening of the aperture aligns with a lateral side PCB. The
connector may be configured to engage a corresponding connector.
The aperture may include at least partially concave sidewalls that
form recesses to retain a plug. A seal may be positioned adjacent
to the opening of the aperture and adjacent to a lateral side of
the PCB. The seal may prevent environmental debris from entering an
aperture of the connector.
In accordance with one or more embodiments, the connector may
include an elongated body that extends outward and beyond a lateral
side of the PCB. The elongated portion may include a tip and at
least one ring. The PCB may include a second connector embedded
between at least some of the layers. The second connector may be
oriented such that a longitudinal axis of the second connector is
parallel with the planar side. The second connector may be
configured to receive a different corresponding connector to create
a different electrical connection to at least some of the plurality
of layers via the second connector. The first connector may include
a different shape than the second connector.
CONCLUSION
Although the subject matter has been described in language specific
to structural features and/or methodological acts, it is to be
understood that the subject matter defined in the appended claims
is not necessarily limited to the specific features or acts
described. Rather, the specific features and acts are disclosed as
illustrative forms of implementing the claims.
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