U.S. patent number 10,790,382 [Application Number 15/845,300] was granted by the patent office on 2020-09-29 for method for forming horizontal nanowires and devices manufactured thereof.
This patent grant is currently assigned to IMEC VZW. The grantee listed for this patent is IMEC VZW. Invention is credited to Silvia Armini, Elisabeth Camerotto, Boon Teik Chan, Zheng Tao.
![](/patent/grant/10790382/US10790382-20200929-D00000.png)
![](/patent/grant/10790382/US10790382-20200929-D00001.png)
![](/patent/grant/10790382/US10790382-20200929-D00002.png)
![](/patent/grant/10790382/US10790382-20200929-D00003.png)
![](/patent/grant/10790382/US10790382-20200929-D00004.png)
![](/patent/grant/10790382/US10790382-20200929-D00005.png)
![](/patent/grant/10790382/US10790382-20200929-D00006.png)
![](/patent/grant/10790382/US10790382-20200929-D00007.png)
![](/patent/grant/10790382/US10790382-20200929-D00008.png)
![](/patent/grant/10790382/US10790382-20200929-D00009.png)
![](/patent/grant/10790382/US10790382-20200929-D00010.png)
United States Patent |
10,790,382 |
Chan , et al. |
September 29, 2020 |
Method for forming horizontal nanowires and devices manufactured
thereof
Abstract
A method for forming horizontal nanowires, the method comprising
providing a substrate comprising a dielectric layer and a fin
structure comprising a portion protruding from the dielectric
layer, the protruding portion being partially un-masked and
comprising a multi-layer stack consisting of a layer of a first
material stacked alternately and repeatedly with a layer of a
second material and forming horizontal nanowires done by performing
a cycle comprising removing selectively the first material up to
the moment that a horizontal nanowire of the second material
becomes suspended over a remaining portion of the partially
un-masked protruding portion, forming a sacrificial layer on the
remaining portion, while leaving the suspended horizontal nanowire
uncovered, providing, selectively, a cladding layer on the
suspended horizontal nanowire, and thereafter removing the
sacrificial layer. The horizontal nanowires become suspended
starting from the top and the cladding layer is removed, after the
bottom horizontal nanowire becomes suspended.
Inventors: |
Chan; Boon Teik (Leuven,
BE), Armini; Silvia (Heverlee, BE),
Camerotto; Elisabeth (Schaerbeek, BE), Tao; Zheng
(Heverlee, BE) |
Applicant: |
Name |
City |
State |
Country |
Type |
IMEC VZW |
Leuven |
N/A |
BE |
|
|
Assignee: |
IMEC VZW (Leuven,
BE)
|
Family
ID: |
1000005084207 |
Appl.
No.: |
15/845,300 |
Filed: |
December 18, 2017 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20180182868 A1 |
Jun 28, 2018 |
|
Foreign Application Priority Data
|
|
|
|
|
Dec 23, 2016 [EP] |
|
|
16206805 |
Jan 23, 2017 [EP] |
|
|
17152581 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
29/66818 (20130101); H01L 29/78696 (20130101); H01L
29/1079 (20130101); H01L 29/785 (20130101); H01L
29/775 (20130101); H01L 29/42392 (20130101); H01L
29/66469 (20130101); H01L 29/66439 (20130101); B82Y
10/00 (20130101); H01L 29/0673 (20130101) |
Current International
Class: |
H01L
29/66 (20060101); H01L 29/775 (20060101); B82Y
10/00 (20110101); H01L 29/78 (20060101); H01L
29/10 (20060101); H01L 29/786 (20060101); H01L
29/423 (20060101); H01L 29/06 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
104253048 |
|
Dec 2014 |
|
CN |
|
2015/094301 |
|
Jun 2015 |
|
WO |
|
Other References
European Search Report, European Patent Application No. 16206805.0,
dated Jul. 14, 2017, 12 pages. cited by applicant.
|
Primary Examiner: Liu; Benjamin Tzu-Hung
Attorney, Agent or Firm: McDonnell Boehnen Hulbert &
Berghoff LLP
Claims
What is claimed is:
1. A method for forming horizontal nanowires, the method
comprising: providing a substrate comprising a dielectric layer and
a fin structure, wherein the fin structure comprises a portion
protruding from the dielectric layer, and wherein the protruding
portion is partially un-masked and comprises a multi-layer stack
that comprises a layer of a first material stacked alternately and
repeatedly with a layer of a second material, wherein layers of a
portion of the multilayer stack of the partially un-masked
protruding portion have a non-uniform size; and forming horizontal
nanowires, wherein the forming comprises performing a cycle
comprising: selectively removing the first material such that a
horizontal nanowire of the second material is suspended over a
remaining portion of the partially un-masked protruding portion;
forming a sacrificial layer on the remaining portion, while leaving
the suspended horizontal nanowire uncovered; providing,
selectively, a metal cladding layer on the suspended horizontal
nanowire; and removing the sacrificial layer.
2. The method of claim 1, wherein the horizontal nanowires formed
in the cycle become suspended starting from a top horizontal
nanowire to a bottom horizontal nanowire.
3. The method of claim 2, further comprising: removing the cladding
layer after the bottom horizontal nanowire becomes suspended.
4. The method of claim 1, wherein the substrate is rotated during
the forming of the sacrificial layer.
5. The method of claim 1, wherein the sacrificial layer is a
spin-on material and is self-planarizing.
6. The method of claim 1, wherein the sacrificial layer is formed
as a spin-on-carbon layer.
7. The method of claim 1, wherein the selective removal of the
first material is cyclic and comprises: oxidizing the first
material and the second material; and performing an etching
process, wherein parameters of the etching process are chosen to
remove an oxide of the first material is faster than an oxide of
the second material.
8. The method of claim 7, wherein the etching process is a dry
plasma etching process.
9. The method of claim 1, wherein providing, selectively, the
cladding layer comprises performing an electro-less deposition or
an atomic layer deposition.
10. The method of claim 1, wherein the first material comprises Si
and Ge, and the second material comprises Si.
11. The method of claim 1, wherein the first material comprises Si
and the second material comprises Si and Ge.
12. The method of claim 1, further comprising: providing a gate
stack, surrounding the suspended horizontal nanowires, wherein the
gate stack comprises a gate insulator and a gate metal provided on
the gate insulator.
13. A semiconductor structure comprising: a substrate comprising a
dielectric layer; and a fin structure comprising a portion
protruding from the dielectric layer, wherein the protruding
portion is partially un-masked, and wherein the partially un-masked
protruding portion comprises: a multilayer stack that includes a
layer of a first material stacked alternately and repeatedly with a
layer of a second material, and a horizontal nanowire of the second
material that is covered with a metal cladding layer, wherein the
horizontal nanowire is suspended over the multilayer stack and a
sacrificial layer covering the multilayer stack, and wherein layers
of a portion of the multilayer stack of the partially un-masked
protruding portion have a non-uniform size.
14. The structure of claim 13, wherein the sacrificial layer is
formed as a spin-on-carbon layer.
15. The structure of claim 13, wherein: a diameter of the
horizontal nanowires is substantially the same.
16. The structure of claim 13, wherein the first material comprises
Si and Ge, and the second material comprises Si.
17. The structure of claim 13, wherein the first material comprises
Si and the second material comprises Si and Ge.
18. The structure of claim 13, further comprising: a gate stack,
surrounding the suspended horizontal nanowires, wherein the gate
stack comprises a gate insulator and a gate metal provided on the
gate insulator.
19. A semiconductor structure comprising: a substrate comprising a
dielectric layer; and a fin structure comprising a portion
protruding from the dielectric layer, wherein the protruding
portion comprises a multilayer stack that includes a layer of a
first material stacked alternately and repeatedly with a layer of a
second material, wherein the protruding portion is partially
un-masked, and wherein the partially un-masked protruding portion
comprises: at least one horizontal nanowire of the second material
suspended over a remaining portion of the multilayer stack that
includes layers of the first material and second material, wherein
the at least one horizontal nanowire is covered with a metal
cladding layer, wherein a sacrificial layer covers the remaining
portion of the multilayer stack and leaves the at least one
horizontal nanowire uncovered, and wherein layers of a portion of
the multilayer stack of the partially un-masked protruding portion
have a non-uniform size.
20. The structure of claim 19, wherein the fin structure includes
non-protruding portion embedded in the dielectric layer.
21. The structure of claim 19, wherein the protruding portion
includes a partially masked portion, and wherein a top and
sidewalls of the partially masked portion of the protruding portion
are masked.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The present application is a non-provisional patent application
claiming priority to European Patent Application No. 16206805.0,
filed Dec. 23, 2016, and European Patent Application No.
17152581.9, filed Jan. 23, 2017, the contents of both which are
hereby incorporated by reference.
FIELD OF THE DISCLOSURE
The present disclosure is related to the field of semiconductor
devices. More specifically, it is related to a method for forming
horizontal nanowires and devices manufactured thereof.
BACKGROUND
In the past decade, the semiconductor industry has changed the
design of transistors by moving from planar CMOS to fin-type field
effect transistors (Fin-FETs). However, as the fin width has
continued to decrease in an effort to enable ultimate CMOS scaling,
undesirable variability and mobility in the channel have become a
challenge due to the result of decreasing channel width. One way to
overcome this problem has been the introduction of a new transistor
architecture called the gate-all-around field effect transistor
(GAA-FET). In a GAA-FET design, the gate is disposed so as to
completely wrap the channel. The GAA-FET design also incorporates
at least one horizontal nanowire, whereby the nanowires forming the
channels are suspended as they connect from the source to the
drain. This provides better gate control and electrostatics than
finFETs, thereby enabling further gate length scaling.
Despite these advantages, there are requirements as well as
challenges associated with the making of horizontal nanowires. The
ultimate goal for GAA-FET is to have at least three nanowires in
parallel in order to increase driving current, to keep the critical
dimension (CD) scaling within 5 to 7 nm, and to provide same width
across all the nanowires for better performance. The challenges
thus lie in the making of the nanowires to satisfy these
requirements.
Horizontal nanowires are typically made by removing a sacrificial
semiconductor material selectively from a multilayer stack
containing alternating layers of this sacrificial material and a
semiconductor nanowire material. Selective removal can be done by
using selective wet etching. US 2013/0161756 A1 discloses
selectively etching the sacrificial SiGe layers with a wet etch
that selectively removes the SiGe but does not remove the silicon
nanowire structures. Selective removal can also be done by using
selective dry plasma etching, whereby selective oxidation may be
done a priori.
Although these techniques can help in the forming of horizontal
nanowires, they do not guarantee satisfying the requirement of CD
being scaled to 5 to 7 nm and/or providing the same CD across all
the nanowires formed. Thus, although selective removal would lead
to the formation of nanowires, it may not satisfy the above
requirements. Furthermore, the selectivity between the alternating
layers of the semiconductor material to be sacrificed and the
semiconductor material to be made into nanowires will suffer from
non-uniformities between incoming wafers having such multi-layer
stacks. The selective etch process, while producing nanowires, may
not be able to meet the above requirements.
There is, therefore, a need for methods that enable the formation
of horizontal nanowires that are suitable for manufacturing
GAA-FETs without jeopardizing device performance while keeping up
with the scaling efforts of CMOS manufacturing.
SUMMARY
It is an object of the present disclosure to provide efficient and
simple methods to form horizontal nanowires. It is a further object
of the disclosure to form a gate-all-around field effect transistor
(GAA-FET).
The above objective can be accomplished by a method according to
the present disclosure.
In a first aspect, the present disclosure relates to a method for
forming horizontal nanowires. The method involves providing a
substrate and forming horizontal nanowires. The substrate includes
a dielectric layer and a fin structure. The fin structure includes
a portion protruding from the dielectric layer. The protruding
portion is partially un-masked and includes a multi-layer stack
that includes a layer of a first material stacked alternately and
repeatedly with a layer of a second material. The forming is done
by performing a cycle. The cycle involves removing selectively the
first material up to the moment that a horizontal nanowire of the
second material becomes suspended over a remaining portion of the
partially un-masked protruding portion. A sacrificial layer is
formed on the remaining portion, while leaving the suspended
horizontal nanowire uncovered. A cladding layer is provided on the
suspended horizontal nanowire and thereafter the sacrificial layer
is removed. The horizontal nanowires formed in the cycle become
suspended starting from the top and the cladding layer is removed
after the bottom horizontal nanowire becomes suspended.
In some embodiments, the method can allow for formation of
horizontal nanowires, particularly more than two horizontal
nanowires in a sequential way, thereby making the formation of such
nanowires independent of the limitations of selective etching of
the first material with respect to the second material.
The inventors have found out that forming a sacrificial layer on
the remaining portion that follows the selective removal of the
first material up to the moment that a horizontal nanowire becomes
suspended and the provision of a cladding layer, selectively, on
the suspended horizontal nanowire can allow for sequential
formation of horizontal nanowires.
The method can also allow for forming more than two horizontal
nanowires.
The provision of the cladding layer helps to avoid any further
change in the size of the already formed horizontal nanowire during
the formation of the subsequent horizontal nanowires.
Thus, the method can further allow for optimizing and further
preserving the (desired) diameter (also referred to as the
"critical dimension" (CD)) of the horizontal nanowires during their
formation.
Thus, the method can allow for forming horizontal nanowires,
particularly more than two horizontal nanowires, having the
substantially the same (desired) diameter.
The method can also allow for formation of horizontal nanowires
starting from a fin structure, where the height and the profile of
the fin becomes less of a challenge for obtaining horizontal
nanowires, particularly more than two horizontal nanowires having
substantially the same (desired) diameter.
Additionally, the method can be compatible with CMOS
manufacturing.
In embodiments, the substrate can be rotated during the formation
of the sacrificial layer. This rotation can be performed along a
vertical axis perpendicular to the substrate.
By rotating the substrate, the sacrificial layer can be
homogeneously distributed over the surface. Furthermore, rotation
can allow for controlling the thickness of the sacrificial layer by
adjusting the rotation speed. Homogeneously distributed sacrificial
layer with a controlled thickness allows for uniform coverage of
the remaining portion. Uniform coverage of the remaining portion
allows for the provision of the cladding layer over the complete
surface of the suspended horizontal nanowire.
In embodiments, the sacrificial layer can be a spin-on material and
can be self-planarizing.
A spin-on material that is self-planarizing can allow for uniform
coverage of the remaining portion without creation of topography.
Absence of topography has the advantage that material removal
processes, such as etch back, in order to provide the required
thickness may be avoided. Avoiding the use of material removal
processes allows for preventing the modification of the (desired)
diameter of the already formed horizontal nanowire by being
subjected chemicals during the etch-process.
In embodiments, the sacrificial layer may be formed as a spin-on
carbon layer (SoC).
Forming the sacrificial layer as a SoC layer can allow easy removal
without damaging the masked part of the protruding portion. The
mask of the masked part of the protruding portion may include an
interlayer dielectric in contact with a dielectric spacer material.
The damaging of the interlayer dielectric and the dielectric spacer
material may result in degradation of the device performance since
it can result in exposure of the gate electrode, which can lead to
electrical shorting of the gate electrode with the source or the
drain region after establishing the electrical contact.
In embodiments, the selective removal of the first material may be
cyclic and may involve oxidizing the first material and the second
material and performing an etching process. Parameters of the
etching process may be chosen to remove the oxide of the first
material faster than the oxide of the second material.
Such a cyclic selective removal can allow for removal of the first
material with respect to the second material with improved
selectivity.
In embodiments, the etching process may be a dry plasma etching
process.
In embodiments, the cladding layer may be a metal.
Having a metal cladding can allow for protection of the horizontal
nanowire over which it is provided during the removal of the
sacrificial layer. This can ensure the preservation of the size of
the horizontal nanowire.
In embodiments, this metal may be nickel, cobalt or ruthenium.
In embodiments, this metal may be nickel.
In alternative embodiments, this cladding layer may be a metal
oxide.
This metal oxide may be a high-k dielectric material. This high-k
dielectric material may be aluminum oxide, hafnium oxide, zinc
oxide, zirconium oxide or titanium oxide.
A metal oxide cladding layer has the advantage that it may not be
affected by the cyclic selective removal.
In embodiments, the selective provision of the cladding layer may
involve performing an electro-less deposition or an atomic layer
deposition.
By performing the electro-less or atomic layer deposition, the
thickness of the cladding layer may be better controlled. Better
control of the thickness of the cladding layer may result in
preservation of the size of the horizontal nanowire during the
removal of the sacrificial layer.
Furthermore, electro-less deposition is advantageous due to the
fact that it is a low-temperature process such that it can be
carried out at a temperature in the range of room temperature to
90.degree. C. and preferably, in the range of room temperature to
70.degree. C. Furthermore, it can provide selective deposition.
In embodiments, the first material may include Si and Ge and the
second material may include Si.
In embodiments, the first material may be SiGe and the second
material may be Si.
In embodiments, the first material may be SiGe and the second
material may be Ge.
In embodiments, the first material may include Si and the second
material may include Si and Ge.
In embodiments, the first material may be Si and the second
material may be SiGe.
In embodiments, the selective removal may involve performing a wet
etching process.
In embodiments, the wet etching process may be performed by using a
wet etchant including hydrogen chloride.
In embodiments, the wet etchant may include water and hydrogen
chloride.
In embodiments, where the selective removal may involve performing
this wet etching process, a layer of a first material including a
binary Group III-V material may be stacked alternately and
repeatedly with a layer of a second material including a ternary
Group III-V material, thus making the multi-layer stack.
In embodiments, the binary Group III-V material may be InP.
In embodiments, the ternary Group III-V material may be InGaAs or
GaAsSb.
In embodiments, the first material and/or the second material may
be doped with a dopant element.
In embodiments, the dopant element may be an n-type or a p-type
dopant element.
In embodiments, the present disclosure relates to a method for
fabricating a horizontal gate-all-around nanowire field effect
transistor that involves forming suspended horizontal nanowires
according to embodiments of the first aspect of the present
disclosure. A gate stack may be provided surrounding the suspended
horizontal nanowires. This gate stack may include a gate insulator
and a gate metal provided on the gate insulator.
The method can allow for forming plurality of horizontal nanowires,
particularly more than 2 nanowires having substantially the same
diameter, scalable, down to 5 to 7 nm. Thus, it can allow for
meeting the requirements for achieving the desired device
performance.
In a second aspect, the present disclosure relates to a
semiconductor structure. The semiconductor structure includes a
substrate that includes a dielectric layer and a fin structure.
This fin structure includes a portion protruding from the
dielectric layer. This protruding portion is partially un-masked
thereby including a multi-layer stack that includes a layer of a
first material stacked alternately and repeatedly with a layer of a
second material. The partially un-masked protruding portion further
includes horizontal nanowires of the second material suspended over
a sacrificial layer and at least one of the horizontal nanowires is
covered with a cladding layer. This sacrificial layer covers the
multi-layer stack, where the layers have a non-uniform size.
Thus, there is provided a semiconductor structure enabling
sequential formation of horizontal nanowires. This semiconductor
structure is suitable for the manufacture of horizontal
gate-all-around nanowire field effect transistors (GAA-FET)
comprising plurality of horizontal nanowires (e.g., more than 2
nanowires).
In embodiments, the sacrificial layer may be formed as a
spin-on-carbon layer.
In embodiments, the diameter of the horizontal nanowires may be
substantially the same.
Thus, there is provided a structure enabling the manufacture of
horizontal gate-all-around nanowire field effect transistors
(GAA-FET) with improved device performance due to the to the
plurality of horizontal nanowires having substantially the same
diameter.
In embodiments, the diameter of the horizontal nanowires may have a
standard deviation of 2 nm.
In embodiments, the cladding layer may be a metal.
The metal cladding layer can increase the resistance to the
chemical attack during the selective removal of the first layer,
thus maintaining the diameter of the nanowire.
In embodiments, this metal may be nickel, cobalt or ruthenium.
In other embodiments, this metal is nickel.
In alternative embodiments, the cladding layer may be a metal
oxide. In embodiments, this metal oxide may be a high-k dielectric
material. In embodiments, this high-k dielectric material may be
aluminum oxide, hafnium oxide, zinc oxide, zirconium oxide or
titanium oxide.
In embodiments, the first material may include Si and Ge and the
second material may comprise Si.
In embodiments, the first material may include SiGe and the second
material may comprise Si.
In embodiments, the first material may include SiGe and the second
material may include Ge.
In embodiments, the first material may include Si and the second
material may include Si and Ge.
In embodiments, the first material may include Si and the second
material may include SiGe.
In embodiments, a layer of a first material including a binary
Group III-V material may be stacked alternately and repeatedly with
a layer of a second material including a ternary Group III-V
material.
In embodiments, the binary Group III-V material may be InP.
In embodiments, the ternary Group III-V material may be InGaAs or
GaAsSb.
In embodiments, the first material and/or the second material may
be doped with a dopant element.
In embodiments, the dopant element may be an n-type or a p-type
dopant element.
BRIEF DESCRIPTION OF THE FIGURES
The figures are only schematic and are non-limiting. In the
drawings, the size of some of the elements may be exaggerated and
not drawn on scale for illustrative purposes. Any reference signs
in the claims shall not be construed as limiting the scope. In the
different drawings, the same reference signs refer to the same or
analogous elements.
FIG. 1 is a flowchart representing a method, according to example
embodiments of the present disclosure.
FIG. 2A is a flowchart representing formation of the horizontal
nanowires according to an example embodiment of the present
disclosure.
FIG. 2B is a flowchart representing selective removal of the first
material, according to an example embodiment of the present
disclosure.
FIG. 3 shows schematically a substrate used for the forming of
horizontal nanowires, according to example embodiments of the
present disclosure.
FIGS. 4A, 4B, 4C, 4D, 4E, 4F, 4Q 4H, 4I, 4J, 4K, and 4L
schematically illustrate a process flow for forming horizontal
nanowires, according to example embodiments of the present
disclosure.
FIG. 5 schematically illustrates a semiconductor structure
including horizontal nanowires formed, according to example
embodiments of the present disclosure.
FIG. 6 schematically illustrates a semiconductor structure obtained
during the formation of horizontal nanowires, according to example
embodiments of the present disclosure.
DETAILED DESCRIPTION
The present disclosure will be described with respect to particular
embodiments and with reference to certain drawings but the
disclosure is not limited thereto but only by the claims. The
drawings described are only schematic and are non-limiting. In the
drawings, the size of some of the elements may be exaggerated and
not drawn on scale for illustrative purposes. The dimensions and
the relative dimensions do not correspond to actual reductions to
practice of the disclosure.
It is to be noticed that the term "comprising", used in the claims,
should not be interpreted as being restricted to the means listed
thereafter; it does not exclude other elements or steps. It is thus
to be interpreted as specifying the presence of the stated
features, integers, steps or components as referred to, but does
not preclude the presence or addition of one or more other
features, integers, steps or components, or groups thereof.
Reference throughout the specification to "one embodiment" or "an
embodiment" means that a particular feature, structure or
characteristic described in connection with the embodiment is
included in at least one embodiment of the present disclosure.
Thus, appearances of the phrases "in one embodiment" or "in an
embodiment" in various places throughout the specification are not
necessarily all referring to the same embodiment, but may do so.
Furthermore, the particular features, structures or characteristics
may be combined in any suitable manner, as would be apparent to one
of ordinary skill in the art from the disclosure, in one or more
embodiments.
Similarly, it should be appreciated that in the description of
exemplary embodiments of the disclosure, various features of the
disclosure are sometimes grouped together in a single embodiment,
figure, or description thereof for the purpose of streamlining the
disclosure and aiding in the understanding of one or more of the
various aspects. The method of disclosure, however, is not to be
interpreted as reflecting an intention that the claimed disclosure
requires more features than are expressly recited in each claim.
Rather, as the following claims reflect, some aspects lie in less
than all features of a single foregoing disclosed embodiment. Thus,
the claims following the detailed description are hereby expressly
incorporated into the detailed description, with each claim
standing on its own as a separate embodiment of the disclosure.
Furthermore, while some embodiments described herein include some
but not other features included in other embodiments, combinations
of features of different embodiments are meant to be within the
scope of the disclosure, and form different embodiments, as would
be understood by those in the art. For example, in the following
claims, any of the claimed embodiments can be used in any
combination.
In the description provided herein, numerous specific details are
set forth. However, it is understood that embodiments of the
disclosure may be practiced without these specific details. In
other instances, well-known methods, structures and techniques have
not been shown in detail in order not to obscure an understanding
of the description.
The following terms are provided solely to aid in the understanding
of the disclosure.
As used herein and unless provided otherwise, the term "sacrificial
layer" refers to a layer that is meant to be sacrificed or removed
at a certain stage in the process flow.
As used herein and unless provided otherwise, the term "suspended"
refers to released and can be used interchangeably throughout the
text.
As used herein and unless provided otherwise, the term "spin-on"
refers to a class of dielectric materials that are deposited by
spin-on coating technique.
As used herein and unless provided otherwise, the term "cladding
layer" refers to a layer covering the complete exposed surface of
the horizontal nanowire.
As used herein and unless provided otherwise, the term "exposed"
refers to a layer, a surface or a region that is not protected from
its surrounding environment.
As used herein and unless provided otherwise, the term "CD" refers
to critical dimension and indicates the width of the feature in
question.
As used herein and unless provided otherwise, the term
"Self-Assembled Monolayer (SAM)" refers to molecular assemblies
that form on the surfaces spontaneously by adsorption and are
organized into more or less large ordered domains. SAM materials
may possess a head group with a strong affinity to the substrate, a
tail group and a functional end group. SAM materials are created by
the chemisorption of the head groups onto the substrate from vapor
or liquid phase followed by slow organization of the tail
groups.
As used herein and unless provided otherwise, the term "room
temperature" refers to temperature of 20.degree. C.
As used herein and unless provided otherwise, the term "SiGe"
refers to Si.sub.1-xGe.sub.x, with x being a real number referring
to the atomic percent.
The disclosure will now be described by a detailed description of
several embodiments of the disclosure. It is clear that other
embodiments of the disclosure can be configured according to the
knowledge of persons skilled in the art without departing from the
technical teaching of the disclosure, the disclosure being limited
only by the terms of the appended claims.
We now refer to FIG. 1, FIG. 3 and FIG. 4A.
FIG. 1 shows a flowchart representing a method according to
embodiments of the present disclosure.
FIG. 3 schematically illustrates a substrate 9, tilted and in three
dimensions (3D), used for the forming of horizontal nanowires
according to embodiments of the present disclosure, and FIG. 4A
schematically shows a cross section of this substrate 9. The
multi-layer stack included in the substrate shown in these figures
includes three layers 4 of a first material stacked alternately and
repeatedly with three layers 3 of a second material. The figures
should not be construed in any limiting sense such that the
multi-layer stack included in the substrate may include more than
two layers of first material stacked alternately and repeatedly
with more than two layers of second material. In this way, a
plurality of horizontal nanowires, greater than two, can be
obtained.
The method 800 involves a step 100 of providing a substrate (e.g.,
substrate 9) and a step 200 of forming horizontal nanowires.
As illustrated in FIG. 3 and FIG. 4A, the substrate 9 includes a
dielectric layer 2 and a fin structure 5. In embodiments, the
substrate may be a silicon substrate. The substrate 9 may also be a
silicon on insulator (SOI) substrate or any substrate suitable for
growing fin structures. The dielectric layer 2 may be a silicon
oxide layer. The dielectric layer 2 may be referred to as shallow
trench isolation (STI) dielectric and may be in direct contact with
the substrate 9. The fin structure 5 includes a portion 5a that
protrudes from the dielectric layer 2 and a non-protruding portion
5b that is embedded in the dielectric layer 2. The bottom of the
non-protruding portion 5b may lie at the interface between the
dielectric layer 2 and the substrate 9. It may also lie above or
below this interface. The bottom of the non-protruding portion 5b
may be flat or may have V-shape. The protruding portion 5a is
partially un-masked and includes a multi-layer stack. This
multi-layer stack includes a layer 4 of a first material stacked
alternately and repeatedly with the layer 3 of a second
material.
In embodiments, the first material and/or the second material may
be doped with a dopant element. This dopant element may be an
n-type or a p-type dopant element. Typically, boron is used as a
p-type dopant, while phosphorus or arsenic is used an n-type
dopant.
In embodiments, the first material may include Si and Ge and the
second material may include Si. In these embodiments, the first
material may, for example, include SiGe and the second material may
for example, include Si.
In other embodiments, the first material may include Si and Ge and
the second material may include Ge. In these embodiments, the first
material may, for example, be SiGe and the second material may for
example, be Ge.
Alternatively, in other embodiments, the first material may include
Si and the second material may include Si and Ge. In these
alternative embodiments, the first material may, for example,
include Si and the second material may, for example, include
SiGe.
The fin structure 5 may be obtained after performing several
processing steps. It can, for example, be obtained by providing a
substrate 9 and depositing alternating and repeated layers of the
first material and the second material. Further, a fin patterning
process may be done in order to form the fin structure 5. Depending
on the fin patterning process, a plurality of fin structures may be
formed. Providing the dielectric layer 2 may embed the fin
structure 5 in this dielectric layer 2. Performing an etch back
process of the dielectric layer 2 may lead to the formation of the
fin structure 5 including a portion protruding from the etch-backed
dielectric layer 2, where the protruding portion includes the
multi-layer stack. In some examples, the protruding portion 5a of
the fin structure 5 may be covered conformally by a dielectric
layer (not shown in the figures). When such a dielectric layer is
present, this is typically referred to as a dummy dielectric layer
and it can be removed from the unmasked protruding portion before
performing the step 200 of forming the nanowires.
Partial masking of the protruding portion 5a is provided by a
dielectric layer. This partial masking refers to masking a part of
the protruding portion 5a including the top and the sidewalls of
the protruding portion. This partial masking, thus, creates a
partially un-masked portion. In embodiments, this dielectric layer
may include a first dielectric layer 10 and a second dielectric
layer 1 stacked horizontally and in contact with each other.
In embodiments, the first dielectric layer 10 may be a silicon
oxide layer while the second dielectric layer 1 may be a silicon
nitride layer. The second dielectric layer 1 may be used as gate
spacer.
The protruding portion 5a of the fin structure 5 may be covered
conformally by a dielectric layer (not shown in the figures). In
the fabrication of horizontal gate-all-around nanowire field effect
transistors (GAA-FET), this is typically referred to as a dummy
gate dielectric layer. A dummy gate dielectric layer and a dummy
gate may be used when fabricating the GAA-FET through Replacement
Metal Gate (RMG) approach and it can be removed from the unmasked
protruding portion before performing the step 200 of forming the
nanowires.
We now refer to FIG. 2A, showing a flowchart representing a method
for the step 200 of forming the horizontal nanowires, while
referring also to FIG. 4B to FIG. 4L showing corresponding
cross-sections of the substrate at different stages of the method
200. Purely to facilitate understanding, different layers, even of
the same material, are shown with different numbers, however, this
should not be construed in any limiting sense.
As illustrated in FIG. 2A, formation of the horizontal nanowires
can be done by performing a cycle. This cycle includes a step 300
of removing selectively the first material. The first material is
removed selectively up to the moment that a horizontal nanowire of
the second material becomes suspended over a remaining portion of
the partially un-masked protruding portion 5a. The horizontal
nanowires become suspended starting from the top. Thus, as shown in
FIG. 4B, the top nanowire 11 of the second material becomes
suspended during the first cycle.
In embodiments, as shown in FIG. 2B, selective removal of the first
material may include a step 310 of oxidizing the first material and
the second material. An etching process may be performed, whereby
parameters of the etching process may be chosen to remove the oxide
of the first material faster than the oxide of the second material,
as indicated by step 320. This selective removal process including
oxidation and etching may be cyclic repeated up to the moment that
that a horizontal nanowire of the second material becomes suspended
over a remaining portion of the partially un-masked protruding
portion.
In embodiments, this etching process may be a dry plasma etching
process.
This dry plasma etching process is advantageous since the first
material and the second material can both be oxidized during the
oxidation process. The rate of oxidation or the thickness of the
oxide of the first material and the second material may depend on
the oxidation kinetics of the first and the second material. This
dry plasma etching process, thus, allows for formation of the
horizontal nanowire with a desired diameter or, in other words,
with a desired CD, by allowing for the removal of the oxide of the
first material faster than the oxide of the second material.
Furthermore, in the making of CMOS devices, one of the devices,
either p-MOS or n-MOS can be protected by a photoresist layer
during processing to make the n-MOS or the p-MOS. Thus, dry plasma
etching is further advantageous since the photoresist layer is
compatible with dry etching process.
The oxidation and the etching process done during the selective
removal may also result in material loss of the other layers of the
first material of the multi-layer stack shown in FIG. 4B, thus
allowing them to end up with a non-uniform size 4a compared to
their initial size 4 (shown in FIG. 4A). In the meantime, the other
layers of the second material also end up with a non-uniform size
3a compared to their initial size 3 (shown in FIG. 4B).
In alternative embodiments, the first material may include a binary
Group III-V material and the second material may comprise a ternary
Group III-V material.
In these alternative embodiments, the selective removal may involve
performing a wet etching process. The wet etching process may
remove the binary Group III-V material, which is the first
material.
In these alternative embodiments, the wet etching process may be
done by using a wet etchant comprising hydrogen chloride.
In these alternative embodiments, the wet etchant may include water
and hydrogen chloride. This wet etchant is advantageous since it
allows for etching the binary Group III-nitride material selective
towards the ternary Group III-nitride material.
In these alternative embodiments, the binary Group III-V material
may be InP.
In these alternative embodiments, the ternary Group III-V material
may be InGaAs or GaAsSb. Thus, this wet etchant will allow
advantageously to etch InP selective towards InGaAs or GaAsSb.
In these alternative embodiments, this first material and/or this
second material may be doped with a dopant element.
In these alternative embodiments, the dopant element may be an
n-type or a p-type dopant element.
In these alternative embodiments, when the fin structure 5 has a
tapered profile, the provision of the cladding layer 7 can protect
the already formed suspended horizontal nanowire, while the size of
the following suspended nanowire is being tuned according to the
size of this already formed suspended nanowire. This is due to the
fact that the use of the wet etchant can allow removal of the layer
of the first material, which may be InP, selective to the layer of
the second material, which may be InGaAs or GaAsSb, thereby forming
the following horizontal nanowire. However, for tuning its size,
this horizontal nanowire can be etched. This may be done by
performing a dry plasma etching process, whereby protection of the
horizontal nanowire already formed becomes necessary during the dry
plasma etching process.
The method of the step 200 can also involve the step 400 of forming
a sacrificial layer 6 on the partially un-masked protruding portion
(shown in FIG. 4C) except for the suspended horizontal nanowire 11.
This sacrificial layer 6 leaves the suspended horizontal nanowire
uncovered. Thus, when this sacrificial layer is formed after the
formation of the top horizontal nanowire 11 during the first cycle
of the formation of the horizontal nanowires, the first suspended
horizontal nanowire, which is the top one, is left uncovered.
In embodiments, the substrate 9 may be rotated along an axis
perpendicular to a main surface of the substrate 9 during the
formation of the sacrificial layer. Rotation allows for homogeneous
distribution of the sacrificial layer 6 over the surface and allows
for control of its thickness by adjusting the rotation speed.
Adjustment of the thickness of the sacrificial layer 6 allows the
suspended horizontal nanowire to remain un-covered, while allowing
the remaining portion uniformly covered. Furthermore, it allows for
providing freedom on the thickness for the provision of the
cladding layer 7 on the suspended horizontal nanowire.
In embodiments, the sacrificial layer may be a spin-on material and
may be self-planarizing.
Due to the fact that the sacrificial layer is formed after the
horizontal nanowire becomes suspended, a further modification of
the size of the suspended nanowire is undesired. A self-planarizing
spin-on material has the advantage that it avoids creation of
topography, while covering the remaining portion of the partially
un-masked protruding portion. Absence of topography has the
advantage that material removal processes become obsolete, thus
avoiding the suspended nanowire becoming subjected to etch-back
process to remove topography, which would otherwise jeopardize the
diameter of the suspended horizontal nanowire.
In embodiments, the sacrificial layer may be formed as a
spin-on-carbon layer. SOC is a self-planarizing layer and is able
to cover the remaining portion without topography issues. SOC layer
is easy to remove from the substrate, thus, does not pose a
challenge on the distortion of the profile of the partial masking
dielectric layer. This dielectric layer may include a first
dielectric layer 10 and a second dielectric layer 1 stacked
horizontally and in contact with each other. This partial masking
dielectric layer may be used in the fabrication of horizontal
gate-all-around nanowire field effect (GAA-FET) transistors and
damaging may result in exposure of the gate electrode leading to
electrical shorting of the gate electrode with the source or the
drain region after establishing the electrical contact.
The method of the step 200 further includes a step 500 of providing
a cladding layer 7 on the suspended horizontal nanowire 11 (shown
in FIG. 4D). The cladding layer 7 covers the complete surface of
the suspended horizontal nanowire 11.
The purpose of the cladding layer 7 is to protect the already
formed suspended horizontal nanowire 11 during the selective
removal of the first material that will be take place in a
subsequent cycle to be performed for the formation of the
subsequent horizontal nanowire. Therefore, the provision of a
cladding layer 7 can help maintain the size of the suspended
horizontal nanowire during the formation of the subsequent
horizontal nanowires.
Furthermore, the provision of the cladding layer can provide an
opportunity for increasing the number of cycles in the cyclic
selective removal 300 (FIG. 2B) of the first material for the
formation of subsequent horizontal nanowires, by protecting the
already formed suspended horizontal nanowire. Considering the fact
that the profile of the fin structure 5 may be tapered such that
the width gets larger moving from its top to its bottom
necessitates an extended number of cycles in the cyclic selective
removal in order to achieve the size of horizontal nanowire that is
protected by the cladding layer.
In embodiments, the cladding layer may be a metal.
In embodiments, the cladding layer may be Ni, Co or Ru.
In preferred embodiments, the cladding layer may be Ni. Use of Ni
is advantageous since it protects the already formed horizontal
nanowire towards the selective removal of the first material during
the formation of the subsequent nanowires through selective
removal.
In alternative embodiments, the cladding layer 7 may be a metal
oxide. This metal oxide may be a high-k dielectric material. This
high-k dielectric material may be aluminum oxide, hafnium oxide,
zinc oxide, zirconium oxide or titanium oxide. Using a metal oxide
cladding layer is advantageous due to the fact that it is not
affected by cyclic selective removal process that is carried out
for the formation of the horizontal nanowire.
In embodiments, selective provision of the cladding layer 7 may be
done by electro-less deposition or by an Atomic Layer Deposition
(ALD) process. Electro-less deposition or ALD process is
advantageous since conformal, uniform cladding layer may be
deposited with controlled thickness. In embodiments, the provision
of the cladding layer 7 may further include first removal of the
native oxide from the surface of the layer 4 of the first material
and the layer 3 of the second material. This native oxide removal
may be achieved by a treatment using diluted hydrogen fluoride
(HF). Removal of the native oxide by diluted HF treatment makes the
surface of the nanowires become H-terminated.
In embodiments where the suspended horizontal nanowires are doped
with a dopant element, provision of the cladding layer 7 by
electro-less deposition may be advantageous. In these embodiments,
removal of the native oxide from the surface of the layer 4 of the
first material and the layer 3 of the second material is
advantageous for the efficiency of the electro-less deposition of
the cladding layer Removal of the native oxide may be done by
performing a diluted HF treatment. Using electro-less deposition
for the provision of the cladding layer 7 is advantageous when the
layer of the second material is Si-comprising. Thus, when the
suspended horizontal nanowires are made of doped Si, for example,
it will be advantageous to use electro-less deposition for the
provision of the cladding layer 7. In these embodiments, the
cladding layer 7 may be nickel, cobalt or ruthenium. In
embodiments, provision of the cladding layer 7 may include
application of a self-assembled monolayer (SAM) (not shown in the
figures). The self-assembled monolayer may be applied as an
inhibition layer on the exposed surfaces of the first dielectric
layer 10 and the second dielectric layer 1, but not on the exposed
sacrificial layer 6, thereby facilitating easy and direct provision
of the cladding layer on the suspended horizontal nanowire. When
SAM is used as the inhibition layer, the choice of SOC as the
sacrificial layer 6 provides a further advantage such that it is
immune to the SAM layer, and thus, the SAM layer will not be
deposited on the SOC sacrificial layer 6.
When the SAM layer is used as an inhibition layer, provision of the
cladding layer 7 may be done by electro-less deposition or ALD
process. In embodiments, where the layer of the second material is
Si-comprising, using electro-less deposition is advantageous. Thus,
when the suspended horizontal nanowires are made of doped Si, for
example, electro-less deposition can be used for the provision of
the cladding layer 7 including the application of a self-assembled
monolayer (SAM). In these embodiments, the cladding layer 7 may be
nickel, cobalt or ruthenium.
In embodiments, when ALD process is used for the provision of the
metal cladding layer 7 comprising the application of the SAM layer,
the cladding layer 7 may be nickel, cobalt or ruthenium and the
second material may comprise Si or may comprise ternary Group III-V
material.
Alternatively, in these embodiments, where ALD is process is used,
the cladding layer 7 may also be a metal oxide, which may be
aluminum oxide, hafnium oxide, zinc oxide, zirconium oxide or
titanium oxide. The metal oxide may be directly provided as metal
oxide by the ALD process. Alternatively, metal of the metal oxide
may be provided by the ALD process, which then may be followed by
oxidation of this metal to thereby obtain the metal oxide cladding
layer 7.
In embodiments, where the suspended horizontal nanowires are not
doped with a dopant element, provision of the cladding layer 7 may
still be done by electro-less deposition. This may be achieved by
the use of a second SAM layer that may be provided on the on the
H-terminated nanowires thanks to the removal of the native oxide by
the diluted HF treatment. Provision of the second SAM layer can
make it possible for the cladding layer to be deposited on the
nanowires.
In these embodiments, the layer of the second material may include
Si. Thus, the suspended horizontal nanowires may be made of doped
Si.
Before the selective removal of the first material starts in the
subsequent cycle for forming the subsequent horizontal nanowire,
the method of the step 200 can further involve a step 600 of
removing the sacrificial layer 6 from the remaining portion (as
shown in FIG. 4E). Removal of the sacrificial layer may be done by
performing a dry plasma etching process using an oxygen plasma.
This oxygen plasma does not damage the exposed surfaces of the
substrate 9. Furthermore, since the already suspended horizontal
nanowire 11 is covered by the cladding layer 7, it is also
protected and thus, its size is maintained. Removal of the
sacrificial layer 6 thus, completes the first cycle of the
formation of horizontal nanowires, whereby the top nanowire is
formed as shown in FIG. 4E.
FIG. 4F, FIG. 4Q FIG. 4H, and FIG. 4I schematically show how
another cycle is completed to form the subsequent horizontal
nanowire, where this subsequent nanowire is also covered
selectively with the cladding layer 7 at the end of this another
cycle. Applying a final cyclic selective removal of the first
material from the remaining portion of the partially un-masked
protruding portion can lead to the formation of the bottom
horizontal nanowire. This final cyclic selective removal can also
tune the size of the bottom horizontal nanowire in line with the
size of the previously formed nanowires. After the formation of
this bottom horizontal nanowire (shown in FIG. 4J), the cladding
layer 7 covering the previously formed horizontal nanowires is
removed (as shown in FIG. 4K). Horizontal nanowires are formed with
substantially the same diameter. Having substantially the same
diameter or size may refer to the fact that the diameter of the
horizontal nanowires may have a standard deviation of 2 nm.
The (desired) diameter of the horizontal nanowires can be
determined as a function of the technology node in CMOS
manufacturing. The control of the diameter of the horizontal
nanowires can be achieved by the cyclic selective removal process.
Its verification may be done by performing a cross section scanning
electron microscopy (X-SEM) or transmission electron microscopy
(TEM).
Removal of the cladding layer 7 may be done by performing a wet
etching process. This wet etching process may be done by using
HCl.
The masked portion of the protruding portion 5a of the fin
structure 5 is protected against the selective removal during the
formation of suspended horizontal nanowires 11, 12, and 13. Thus,
even after the formation of the suspended horizontal nanowires 11,
12, and 13, the layer of the first material and the layer of the
second material of the multi-layer stack is present as being
stacked alternately and repeatedly with each other.
In embodiments, the present disclosure relates to a method for
fabricating a horizontal gate-all-around nanowire field effect
transistor (GAA-FET). The method may involve forming suspended
horizontal nanowires 11, 12, 13 according to embodiments of the
first aspect of the present disclosure (as shown in FIG. 4K and
FIG. 5). A gate stack 8 may be provided that surrounds the
suspended horizontal nanowires 11, 12, and 13, as shown in FIG. 4L.
This gate stack may include a gate insulator and a gate metal
provided on the gate insulator. This gate insulator may be a high-k
dielectric layer. This gate metal may be a gate metal stack
including layers dedicated for effective work function tuning.
In these embodiments, when the first material includes Si and Ge
and the second material includes Si, the fabricated horizontal GAA
nanowire FET will be a n-MOS device. This is due to the fact that
selective removal of the first material will result in the
formation of horizontal nanowires including Si. In embodiments, the
first material may be Si.sub.(1-x)Ge.sub.x and the second material
may be Si. In these embodiments, the atomic % (x) of Ge in
Si.sub.(1-x)Ge.sub.x may be 25%, 50% or 75%. Therefore, in
embodiments, the first material may be Si.sub.(1-x)Ge.sub.x having
25 atomic % Ge and the second material may be Si.
Si.sub.(1-x)Ge.sub.x having 25 atomic % Ge is better suited for
epitaxial growth on Si.
In alternative embodiments, the first material may be
Si.sub.(1-x)Ge.sub.x having 75 atomic % Ge. In these alternative
embodiments, the second material may be Ge. SiGe having 75 atomic %
Ge is better suited for epitaxial growth on Ge.
On the other hand, when the first material includes Si and the
second material includes Si and Ge, the fabricated horizontal GAA
nanowire FET will be an p-MOS device. This is due to the fact that
selective removal of the first material will result in the
formation of horizontal nanowires including Si and Ge.
Similarly, when the multi-layer stack of the layer of first
material including the binary Group III-V material stacked
alternately and repeatedly with the layer of the second material
comprising a ternary Group III-V material is used, the fabricated
horizontal GAA nanowire FET will be a p-MOS device or an n-MOS
device after removal of the binary Group III-V material, which may
be InP. When the layer of the second material includes InGaAs, the
resulting horizontal GAA nanowire FET will be an n-MOS device,
while it will be a p-MOS device if the second material includes
GaAsSb.
We now refer to FIG. 6 that shows schematically a semiconductor
structure 400, according to a second aspect of the present
disclosure.
The semiconductor structure 400 includes a substrate 9 including a
dielectric layer 2 and a fin structure 5. The fin structure 5
includes a portion 5a protruding from the dielectric layer 2. The
protruding portion is partially un-masked thereby comprising a
multi-layer stack. The multi-layer stack includes a layer 4 of a
first material stacked alternately and repeatedly with a layer 3 of
a second material. The partially un-masked protruding portion
further includes horizontal nanowires 11, 12 of the second material
suspended over a sacrificial layer 6 and at least one of the
horizontal nanowires 11 is covered with a cladding layer 7. The
sacrificial layer 6 covers the multi-layer stack, whereby layers 4b
of the first material stacked alternately and repeatedly with
layers of the second material 3b. The layers 3b and 4b have a
non-uniform size. By non-uniform size it is meant that the size of
the layers 3b and 4b are not in agreement with each other. The
partially masked portion of the protruding portion 5a has the
multi-layer stack, whereby the alternating layers 3 and 4 have
uniform size.
In embodiments, the sacrificial layer 6 may be a spin-on-carbon
layer.
This semiconductor structure is advantageous due to the fact that
it allows sequential formation of plurality of horizontal
nanowires. It is, therefore, further advantageous for the
manufacturing of horizontal gate-all-around nanowire field effect
transistors (GAA-FET).
In embodiments, the bottom of the non-protruding portion 5b may lie
at the interface between the dielectric layer 2 and the substrate
9. It may also lie above or below this interface. The bottom of the
non-protruding portion (5b may be flat or may have V-shape.
Partial masking of the protruding portion 5a is provided by a
dielectric layer. This partial masking refers to masking a part of
the protruding portion 5a including the top and the sidewalls. This
partial masking, thus, can create a partially un-masked portion. In
embodiments, this dielectric layer may include a first dielectric
layer 10 and a second dielectric layer 1 stacked horizontally and
in contact with each other.
In embodiments, the first dielectric layer 10 may be a silicon
oxide layer while the second dielectric layer 1 may be a silicon
nitride layer.
In embodiments, diameter of the horizontal nanowires 11 and 12 may
be substantially the same.
Thus, the semiconductor structure allows sequential formation of
plurality of horizontal nanowires having substantially the same
diameter. It is, therefore, advantageous for the manufacturing of
horizontal gate-all-around nanowire field effect transistors
(GAA-FET) with improved device performance thanks to the plurality
of horizontal nanowires having substantially the same diameter. In
horizontal gate-all-around nanowire field effect transistors
(GAA-FET), current is transferred through each of these nanowires.
Having substantially the same diameter, thus, allows for reducing
distortions in current flow, thereby improving device
performance.
In embodiments, the cladding layer 7 may be a metal.
The presence of the cladding layer 7 is an indication that the
horizontal nanowire has the desired diameter and thus, its presence
can maintain the size of the horizontal nanowire.
In embodiments, this metal may be Ni, Co or Ru.
In other embodiments, this metal is Ni.
In alternative embodiments, the cladding layer 7 may be a metal
oxide. This metal oxide may be a high-k dielectric material. This
high-k dielectric material may be aluminum oxide, hafnium oxide,
zinc oxide, zirconium oxide or titanium oxide.
In embodiments, the first material may include Si and Ge and the
second material may include Si. In these embodiments, the first
material may include SiGe, while the second material may include
Si.
In embodiments, the first material may be Si.sub.(1-x)Ge.sub.x and
the second material may be Si. In these embodiments, the atomic %
(x) of Ge in Si.sub.(1-x)Ge.sub.x may be 25%, 50% or 75%.
Therefore, in embodiments, the first material may be
Si.sub.(1-x)Ge.sub.x having 25 atomic % Ge and the second material
may be Si.
In embodiments, the first material may include Si and Ge and the
second material may include Ge. In these embodiments, the first
material may, for example, be SiGe and the second material may for
example, be Ge.
In embodiments, the first material may be Si.sub.(1-x)Ge.sub.x
having 75 atomic % Ge. In these embodiments, the second material
may be Ge.
In alternative embodiments, the first material may include a binary
Group III-V material and the second material may include a ternary
Group III-V material.
In these alternative embodiments, the binary Group III-V material
may be InP.
In these alternative embodiments, the ternary Group III-V material
may be InGaAs or GaAsSb.
In embodiments, this first material and/or this second material may
be doped with a dopant element.
In embodiments, the dopant element may be an n-type or a p-type
dopant element.
* * * * *