U.S. patent number 10,748,839 [Application Number 16/689,234] was granted by the patent office on 2020-08-18 for package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure.
This patent grant is currently assigned to LITE-ON SINGAPORE PTE. LTD.. The grantee listed for this patent is LITE-ON SINGAPORE PTE. LTD.. Invention is credited to You-Fa Wang.
United States Patent |
10,748,839 |
Wang |
August 18, 2020 |
Package structure of a folding magnetic coupling isolator,
leadframe component, and leadframe structure
Abstract
The present invention provides a leadframe component and a
package structure. The leadframe component includes a first
leadframe and a second leadframe. The first leadframe includes a
first chip-mounting portion for carrying a first chip, a first coil
portion, a plurality of first pins and a plurality of first floated
pins. The second leadframe includes a second chip-mounting portion
for carrying a second chip, a second coil portion, a plurality of
second pins and a plurality of second floated pins. The first
leadframe is disposed above or under the second leadframe for
aligning the first coil portion with the second coil portion.
Inventors: |
Wang; You-Fa (Singapore,
SG) |
Applicant: |
Name |
City |
State |
Country |
Type |
LITE-ON SINGAPORE PTE. LTD. |
Singapore |
N/A |
SG |
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Assignee: |
LITE-ON SINGAPORE PTE. LTD.
(Singapore, SG)
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Family
ID: |
66170134 |
Appl.
No.: |
16/689,234 |
Filed: |
November 20, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200091049 A1 |
Mar 19, 2020 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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16107497 |
Aug 21, 2018 |
10529657 |
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Foreign Application Priority Data
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Oct 25, 2017 [CN] |
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2017 1 1031101 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L
23/66 (20130101); H01L 23/49541 (20130101); H01L
21/4842 (20130101); H01L 24/49 (20130101); H01L
23/49551 (20130101); H01L 23/49575 (20130101); H01L
24/48 (20130101); H01L 2924/14 (20130101); H01L
2224/48247 (20130101); H01L 2224/48091 (20130101); H01L
2224/49171 (20130101); H01L 2224/48257 (20130101); H01L
2924/00014 (20130101); H01L 2224/48151 (20130101); H01L
2223/6661 (20130101); H01L 2924/00014 (20130101); H01L
2224/45099 (20130101) |
Current International
Class: |
H01L
23/495 (20060101); H01L 23/00 (20060101); H01L
21/48 (20060101); H01L 23/66 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Hoang; Quoc D
Attorney, Agent or Firm: Li & Cai Intellectual Property
(USA) Office
Parent Case Text
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a divisional application of Ser. No. 16/107,497
filed on Aug. 21, 2018, and entitled "PACKAGE STRUCTURE OF FOLDING
MAGNETIC COUPLING ISOLATOR AND LEADFRAME COMPONENT AND
MANUFACTURING METHOD THEREOF", now pending, the entire disclosures
of which are incorporated herein by reference.
Claims
What is claimed is:
1. A leadframe component, comprising: a first leadframe including a
first chip-mounting portion for carrying a first chip, a first coil
portion, a plurality of first pins and a plurality of first floated
pins; and a second leadframe including a second chip-mounting
portion for carrying a second chip, a second coil portion, a
plurality of second pins and a plurality of second floated pins;
wherein the first leadframe is disposed above or under the second
leadframe for aligning the first coil portion with the second coil
portion.
2. The leadframe component according to claim 1, wherein the first
coil portion and the second coil portion have a height difference
of from 100 micrometers to 500 micrometers therebetween.
3. The leadframe component according to claim 1, wherein one of the
first leadframe and the second leadframe comprises at least one
bending portion.
4. The leadframe component according to claim 3, wherein the at
least one bending portion is formed between the first pin and the
first coil portion, and between the first pin and the first
chip-mounting portion.
5. The leadframe component according to claim 4, wherein the other
one of the first leadframe and the second leadframe comprises at
least another one bending portion formed between the second pin
portion and the second coil portion, and between the second pin
portion and the second chip-mounting portion.
6. A package structure of a folding magnetic coupling isolator,
comprising: a first leadframe including a first chip-mounting
portion, a first coil portion, a plurality of first pin and a
plurality of first floated pins; a second leadframe including a
second chip-mounting portion, a second coil portion, a plurality of
second pins and a plurality of second floated pins; a first chip
disposed on the first chip-mounting portion; a second chip disposed
on the second chip-mounting portion; and an insulating package
enclosing the first chip and the second chip, and connecting the
first leadframe to the second leadframe, wherein a portion of each
of the first pins is exposed from the insulating package and a
portion of each of the second pin is exposed from the insulating
package; wherein the first leadframe is disposed above or under the
second leadframe for aligning the first coil portion with the
second coil portion and enabling the first coil portion and the
second coil portion to magnetically couple to each other; wherein
the first leadframe and the second leadframe are electrically
isolated from each other.
7. The package structure according to claim 6, wherein the first
chip and the first coil portion forming a first closed circuit
through a first connecting wire, the second chip and the second
coil portion forming a second closed circuit through a second
connecting wire.
8. The package structure according to claim 6, wherein the first
chip includes a coil driving circuit unit and the second chip
includes a receiving circuit unit, and a high frequency signal is
transmitted to the first coil portion by an electrical connection
between the coil driving circuit unit and the first coil portion,
and the second coil portion receives a high frequency voltage by an
electrical connection between the receiving circuit unit and the
second coil portion.
9. The package structure according to claim 6, wherein the first
chip and the second chip are disposed facing each other or opposite
directions from each other.
10. The package structure according to claim 6, wherein one of the
first leadframe and the second leadframe comprises at least one
bending portion.
11. The package structure according to claim 10, wherein the at
least one bending portion is formed between the first pin and the
first coil portion, and between the first pin and the first
chip-mounting portion.
12. The package structure according to claim 11, wherein the other
one of the first leadframe and the second leadframe comprises at
least another one bending portion formed between the second pin
portion and the second coil portion, and between the second pin
portion and the second chip-mounting portion.
13. The package structure according to claim 10, wherein a
polyimide film is disposed between the first leadframe and the
second leadframe.
14. The package structure according to claim 13, wherein the first
coil portion and the second coil portion have a height difference
of from 100 micrometers to 200 micrometers therebetween.
15. The package structure according to claim 10, wherein the first
coil portion and the second coil portion have a height difference
of from 100 micrometers to 500 micrometers therebetween.
16. A leadframe structure of a folding magnetic coupling isolator,
comprising: a frame body; a first leadframe including a first
chip-mounting portion for carrying a first chip, a first coil
portion, a plurality of first pins and a plurality of first floated
pins; a second leadframe including a second chip-mounting portion
for carrying a second chip, a second coil portion, a plurality of
second pins and a plurality of second floated pins; wherein the
first leadframe and the second leadframe are both connected to the
frame body; and wherein the first coil portion and the second coil
portion are respectively connected to the plurality of the first
floated pins and the plurality of the second floated pins; wherein
the first chip-mounting portion in the first leadframe is
surrounded by the first coil portion, and the second chip-mounting
portion in the second leadframe is surrounded by the second coil
portion.
17. The leadframe structure according to claim 16, wherein the
first chip-mounting portion and the first coil portion in the first
leadframe are separated from and adjacent to each other, and the
second chip-mounting portion and the second coil portion in the
second leadframe are separated from and adjacent to each other.
18. The leadframe structure according to claim 16, wherein the
relative position between the first chip-mounting portion and the
first coil portion are matched the relative position between the
second chip-mounting portion and the second coil portion.
Description
BACKGROUND
1. Technical Field
The present disclosure relates to a leadframe structure, a
leadframe component and a package structure of a folding magnetic
coupling isolator including the same, and in particular, to a
leadframe component formed by a single leadframe structure, and a
package structure of a folding magnetic coupling isolator including
the same.
2. Description of Related Art
Magnetic coupling isolators are commonly used in opto-isolator
products. However, magnetic coupling isolation technique can also
be used in common electronic components for integrating an isolator
and a functional semiconductor component into a single
semiconductor unit, such as a power management IC or a magnetic
coupling CAN bus transceiver with magnetic coupling function.
SUMMARY
The main object of the present disclosure is to provide a foldable
leadframe component and a package structure of a magnetic coupling
isolator including the same. Therefore, a leadframe component (a
"double leadframe component") can be formed by utilizing the
specific design of the single leadframe structure and the folding
(rotating) step. In addition, the coupling performance of the
package structure of the magnetic coupling isolator including the
double leadframe component can be adjusted by adjusting the
dimensions of specific portions in the leadframe structure.
An advantage of the present disclosure resides in that, based on
the technical features of "the first leadframe is disposed above or
under the second leadframe for aligning the first coil and the
second coil and enabling the first coil and the second coil to
magnetically couple to each other" or "rotating the first leadframe
relative to the frame body for moving the first leadframe to be
above or under the second leadframe", the foldable leadframe
component, and the package structure of a magnetic coupling
isolator including the same provided by the present disclosure can
improve the alignment accuracy of the first coil portion and the
second coil portion, and control the magnetic coupling effect
generated by the matching of the first coil portion and the second
coil portion.
In order to further understand the techniques, means and effects of
the present disclosure, the following detailed descriptions and
appended drawings are hereby referred to, such that, and through
which, the purposes, features and aspects of the present disclosure
can be thoroughly and concretely appreciated; however, the appended
drawings are merely provided for reference and illustration,
without any intention to be used for limiting the present
disclosure.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings are included to provide a further
understanding of the present disclosure, and are incorporated in
and constitute a part of this specification. The drawings
illustrate exemplary embodiments of the present disclosure and,
together with the description, serve to explain the principles of
the present disclosure.
FIG. 1 is a top view of a leadframe structure used in an embodiment
of the present disclosure.
FIG. 2 is a top view of a leadframe structure used in another
embodiment of the present disclosure.
FIG. 3 is a flow chart of a method for manufacturing a package
structure of a magnetic coupling isolator of an embodiment of the
present disclosure.
FIG. 4 is a flow chart of a method for manufacturing a package
structure of a magnetic coupling isolator of another embodiment of
the present disclosure.
FIG. 5 is a partial sectional view obtained along line V-V in FIG.
1.
FIG. 6 is a schematic view of a step in a method for manufacturing
a package structure of a folding magnetic coupling isolator of an
embodiment of the present disclosure.
FIG. 7 is a schematic view of another step in the method for
manufacturing a package structure of a folding magnetic coupling
isolator of an embodiment of the present disclosure.
FIG. 8 is a schematic view of yet another step in the method for
manufacturing a package structure of a folding magnetic coupling
isolator of an embodiment of the present disclosure.
FIG. 9 is a schematic view of a package structure of a folding
magnetic coupling isolator provided by an embodiment of the present
disclosure.
FIG. 10 is a schematic view of a package structure of a folding
magnetic coupling isolator provided by another embodiment of the
present disclosure.
FIG. 11 is a schematic view of a package structure of a folding
magnetic coupling isolator provided by yet another embodiment of
the present disclosure.
DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
Reference will now be made in detail to the exemplary embodiments
of the present disclosure, examples of which are illustrated in the
accompanying drawings. Wherever possible, the same reference
numbers are used in the drawings and the description to refer to
the same or like parts.
Reference is made to FIG. 1 and FIG. 2. The method for
manufacturing a package structure of a folding magnetic coupling
isolator provided by the present disclosure can be performed using
a single lead frame structure 1. Specifically, a leadframe
structure and a package structure of a folding magnetic coupling
isolator can be formed under simple manufacturing steps by using
the lead frame structure 1 shown in FIG. 1 and FIG. 2. Meanwhile,
the accuracy of alignment and the electrical insulation between a
pair of coils in the leadframe and the package structure can be
ensured.
As shown in FIG. 1 and FIG. 2, the lead frame structure 1 used in
the present disclosure includes a frame body 10, a first leadframe
11 and a second leadframe 12 both connected to the frame body 10.
The first leadframe 11 includes a first chip-mounting portion 111,
a first coil portion 112, a plurality of first pins 113 and a
plurality of first floated pins 114. The second leadframe 12
includes a second chip-mounting portion 121, a second coil portion
122, a plurality of second pins 123 and a plurality of second
floated pins 124. The frame body 10, the first leadframe 11 and the
second leadframe 12 can be formed by conductive materials such as
metals. The frame body 10, the first leadframe 11 and the second
leadframe 12 can be made from same or different materials.
The first coil portion 112 and the second coil portion 122 can be
formed by metal frames or metal rings connected to the lead frame
structure 1. The first coil portion 112 and the second coil portion
122 can each include a single coil or a plurality of coils. The
first coil portion 112 and the second coil portion 122 are
respectively connected to the first floated pin 114 and the second
floated pin 124. The first floated pins 114 are used to support the
first coil portion 112, and the second floated pins 124 are used to
support the second coil portion 122. In addition, in the present
disclosure, the numbers of the first coil portion 112 and the
second coil portion 122 are not limited. For example, the first
leadframe 11 can include two first coil portions 112 symmetrically
located therein, and the second leadframe 12 can include two second
coil portions 122 symmetrically located therein. Specifically, the
two first coil portions 112 can be located at two opposite sides of
the first chip-mounting portion 111, and the two second coil
portions 122 can be located at two opposite sides of the second
chip-mounting portion 121, thereby forming two electrical signal
channels.
It should be noted that in addition to the lead frame structure 1,
a first chip 21 disposed on the first chip-mounting portion 111, a
second chip 22 disposed on the second chip-mounting portion 121, a
plurality of first connecting wires 211 and a plurality of second
connecting wires 221 respectively providing electrical connection
to the first chip 21 and the second chip 22 are shown in FIG. 1. In
addition, the main difference between FIG. 1 and FIG. 2 is that the
positions of the first chip-mounting portion 111 and the first coil
portion 112 in the first leadframe 11, and the second chip-mounting
portion 121 and the second coil portion 122 in the second leadframe
12 are different.
Referring to FIG. 1, in an embodiment of the present disclosure,
the first chip-mounting portion 111 in the first leadframe 11 is
surrounded by the first coil portion 112, and the first
chip-mounting portion 111 and the first coil portion 112 are
connected to the frame body 10 through the first floated pins 114.
Similarly, the second chip-mounting portion 121 in the second
leadframe 12 is surrounded by the second coil portion 122, and the
second chip-mounting portion 121 and the second coil portion 122
are connected to the frame body 10 through the second floated pins
124.
As shown in FIG. 2, in another embodiment of the present
disclosure, the first chip-mounting portion 111 and the first coil
portion 112 in the first leadframe 11 are separated from and
adjacent to each other, and the second chip-mounting portion 121
and the second coil portion 122 in the second leadframe 12 are
separated from and adjacent to each other. In the present
disclosure, the relative position between the first chip-mounting
portion 111 and the first coil portion 112, and the relative
position between the second chip-mounting portion 121 and the
second coil portion 122 can be adjusted based on the needs of the
products and are not limited in the present disclosure.
In other words, as long as the first coil portion 112 and the
second coil portion 122 are matched and are able to transmit
signals through electrical magnetic coupling, the relative position
between the first chip-mounting portion 111 and the first coil
portion 112, and the relative position between the second
chip-mounting portion 121 and the second coil portion 122 are not
limited in the present disclosure. However, the arrangement of the
first chip-mounting portion 111, the first coil portion 112, the
second chip-mounting portion 121 and the second coil portion 122
shown in FIG. 1 can effectively reduce the overall size of the
leadframe component or the package structure formed thereby while
achieving a maximum coil area. Therefore, preferably, the first
coil portion 112 surrounds the first chip-mounting portion 111 and
the second coil portion 122 surrounds the second chip-mounting
portion 121.
In addition, in other embodiments of the present disclosure, the
first coil portion 112 and the second coil portion 122 can further
be supported by at least a portion of the chip-mounting portions,
thereby further reducing the overall size of the product.
Reference is made to FIG. 1 and FIG. 2. A plurality of first
connecting wires 211 and a plurality of second connecting wires 221
are respectively disposed on the first leadframe 11 and the second
leadframe 12. Based on the plurality of first connecting wires 211
and the plurality of second connecting wires 221, the first
chip-mounting portion 111 and the first coil portion 112 are
electrically connected to each other to form a closed circuit
(using two first connecting wires 211 and two second connecting
wires 221 shown in FIG. 1), and the first chip-mounting portion 111
and the second chip-mounting portion 121 can respectively be
electrically connected to the first pin portion 113 and the second
pin portion 123 for forming closed circuits by the other first
connecting wires 211 and second connecting wires 221 (such as the
other four first connecting wires 211 and the other four second
connecting sires 221 shown in FIG. 1).
In the present disclosure, the numbers and the shapes of the first
pins 113 and the second pins 123 can be designed and adjusted based
on the needs of the products and are not limited in the present
disclosure. In addition, the connection manners and structures of
the first connecting wires 211 and the second connecting wires 221
are not limited in the present disclosure and can be varied by
those skilled in the art based on their professional knowledge.
Reference is made to FIG. 3 and FIG. 4. FIG. 3 and FIG. 4 show flow
charts of the methods provided by different embodiments of the
present disclosure. As shown in FIG. 3, the method for
manufacturing the package structure of magnetic coupling structure
includes a step of providing a leadframe structure including a
frame body, a first leadframe connected to the frame body and a
second leadframe connected to the frame body (step S100). The first
leadframe includes a first chip-mounting portion, a first coil
portion, a plurality of first pins and a plurality of first floated
pins. The second leadframe includes a second chip-mounting portion,
a second coil portion, a plurality of second pins and a plurality
of second floated pins. The method further includes the following
steps: respectively disposing at least a first chip and at least a
second chip on the first chip-mounting portion and the second
chip-mounting portion and enabling the first chip and the second
chip to be electrically connected to the first pin portion and the
second pin portion (step S102); and rotating the first leadframe
relative to the frame body for moving the first leadframe to a
position above or under the second leadframe, thereby generating a
height difference between the first leadframe and the second
leadframe and electrically isolating the first leadframe from the
second leadframe, the first coil portion and the second coil
portion being aligned with each other and being magnetically
coupled to each other (step S104).
Compared to the method for manufacturing the magnetic coupling
package structure shown in FIG. 3, the method shown in FIG. 4
further includes step S103, step S105 and step S106. Specifically,
the method shown in FIG. 4 includes: providing a leadframe
structure including a frame body, a first leadframe connected to
the frame body and a second leadframe connected to the frame body,
in which the first leadframe includes a chip-mounting portion, a
first coil portion, a plurality of first pins and a plurality of
first floated pins, and the second leadframe includes a second
chip-mounting portion, a second coil portion, a plurality of second
pins and a plurality of second floated pins (step S100); disposing
at least a first chip and at least a second chip on the first
chip-mounting portion and the second chip-mounting portion and
enabling the first chip and the second chip to be electrically
connected to the first pin portion and the second pin portion (step
S102); forming at least a bending portion in the first leadframe
(step S103); rotating the first leadframe relative to the frame
body, and moving the first leadframe to a position above or under
the second leadframe for matching the first coil portion to the
second coil portion (step S104); forming an insulating package for
packaging a first chip and the second chip and connecting the first
leadframe to the second leadframe (step S105); and removing the
frame body (step S106).
It should be noted that in the method for manufacturing the
magnetic coupling package structure, step S102 and step S103 are
not necessarily performed in the above order. In other words,
before rotating the first leadframe (step S104), the first chip 21
and the second chip 22 can be mounted before the formation of the
bending portion, or the bending portion can be formed before
disposing the first chip 21 and the second chip 22 on the first
chip-mounting portion 111 and the second chip-mounting portion 121,
respectively. For the purpose of illustration, step S102 is
performed before step S103 in the following description.
Reference is made to FIG. 1 and FIG. 5 to FIG. 8. FIG. 5 is a
partial sectional schematic view taken along line V-V in FIG. 1,
FIG. 6 is a schematic view of step S1013, FIG. 7 is a schematic
view of step S104, and FIG. 8 is a schematic view of step 105. In
step S100, a leadframe structure 1 is provided. The leadframe
structure 1 can have a structure shown in FIG. 1 or FIG. 2 and
include a frame body 10, a first leadframe 11 and a second
leadframe 12. As shown in FIG. 5, the first leadframe 11 and the
second leadframe 12 of the lead frame structure 1 are adjacent to
each other and have similar structures. The first leadframe 11
includes a first chip-mounting portion 111, a first coil portion
112 and a first pin portion 113, and the second leadframe 12
includes a second chip-mounting portion 121, a second coil portion
122 and a second pin portion 123. In addition, the first leadframe
11 and the second leadframe 12 each includes a plurality of first
floated pins 114 and a plurality of second floated pins 124.
Next, in step S102, the first chip 21 and the second chip 22 are
respectively disposed on the first chip-mounting portion 111 and
the second chip-mounting portion 121. Electrical connections are
established between the first chip 21 and the first pin portion
113, and between the second chip 22 and the second pin portion 123.
The number of the first chip 21 and the number of the second chip
22 are not limited in the present disclosure. In the embodiments
shown in FIG. 1 and FIG. 2, the first leadframe 11 includes a first
chip 21, and the second leadframe 12 includes a second chip 22. For
example, the first chip 21 and the second chip 22 are both an
integrated circuit (IC) chip.
For example, the first chip 21 includes a coil driving circuit
unit, and the second chip 22 includes a receiving circuit unit. A
high-frequency signal is transmitted to the first coil portion 112
through the electrical connection between the coil driving circuit
unit and the first coil portion 112, and the second coil portion
122 receives a high-frequency voltage through the electrical
connection between the receiving circuit unit and the second coil
portion 122. Alternatively, in another embodiment, the first chip
21 can include the receiving circuit unit and the second chip 22
can include the coil driving circuit unit.
Therefore, the input signal input from the coil driving circuit
unit can be transmitted to the output end (the receiving circuit
unit) through the effective magnetic coupling generated by the
alignment between the first coil portion 112 and the second coil
portion 122 in horizontal direction. Specifically, the first coil
portion 112 of the first leadframe 11 and the first chip 21
together form a first closed circuit through a part of the first
connecting wires 211. Inputting a current into the first closed
circuit can generate a high frequency alternative current magnetic
field. The high frequency magnetic field forms a high frequency
alternative current in a second closed circuit formed by the second
coil portion 122 of the second leadframe 12, the second chip 22 and
some of the second connecting wires 221 through the magnetic
coupling between the first coil portion 112 and the second coil
portion 122. Therefore, electrical signals can be transmitted from
the first chip 21 (e.g., an emitter) to the second chip 22 (e.g., a
receiver) electrically isolated from the first chip 21.
The manner for disposing (mounting) the first chip 21 and the
second chip 22 in step S102 is not limited in the present
disclosure. In addition, in step S102, a plurality of first
connecting wires 211 and a plurality of second connecting wires 221
can be disposed along with the first chip 21 and the second chip
22. For example, the first connecting wires 211 and the second
connecting wires 221 can be disposed between the first chip 21, the
second chip 22, the first chip-mounting portion 111, the second
chip-mounting portion 121, the first coil portion 112, the second
coil portion 122, the first pins 113 and the second pins 123 by
wire-bonding processes.
Next, reference is made to FIG. 6. In step S103, at least one
bending portion S can be formed in the first leadframe 11. In fact,
in the present disclosure, the bending portion S can be formed in
the first leadframe 11 or in the second leadframe 12. In other
words, the method provided by the present disclosure can include
forming at least a bending portion S on at least one of the first
leadframe 11 and the second leadframe 12. In the embodiment shown
in FIG. 6, the bending portion S is formed between the first pin
portion 113 and the first coil portion 112, and between the first
pin portion 113 and the first chip-mounting portion 111. For
example, the bending portion S can be formed by bending the first
floated pins 114. The formation of the bending portion S can
prevent the first coil portion 112 and the second coil portion 122
from contacting with each other in the subsequent steps, and
prevent the first chip 21 disposed on the first chip-mounting
portion 111 and the second chip 22 disposed on the second
chip-mounting portion 121 from contacting with each other.
As long as the object of preventing the contact between the first
leadframe 11 and the second leadframe 12 in the final product,
i.e., ensuring the electrical isolation between the first leadframe
11 and the second leadframe 12, is achieved, the dimensions of the
bending portion S and the direction for bending the first floated
pins 114 can be adjusted. Specifically, the specific parameters of
the bending portion S can be designed based on the method and
properties such as magnetic coupling and voltage insulation of a
target product. For example, the bending direction of the bending
portion S can be determined based on the rotation direction of the
first leadframe 11 in step S104.
As shown in FIG. 6, in this embodiment, the bending portion S is
formed in the first leadframe 11. Referring to FIG. 1, before
forming the bending portion S, the plurality of first pins 113 and
the plurality of first floated pins 114 located at the junction of
the first leadframe 11 and the second leadframe 12 can be bent
downwardly by cutting the first leadframe 11 along the cutting
lines A. In other words, in FIG. 1, the plurality of first pins 113
and the plurality of first floated pins 114 located at the right
side of the two cutting lines A can be bent (towards a direction
away from the viewer) for allowing the second chip-mounting portion
121 and the second coil portion 122 located at the left side of the
two cutting lines A to move to another plane (away from the
viewer).
As mentioned above, the first chip-mounting portion 111 for
carrying the first chip 21 and the first coil portion 112 are
lowered to a plane away from the second leadframe 12. In other
words, based on the design of the bending portion S, the first
chip-mounting portion 111 and the first coil portion 112 are moved
downwardly to produce a height difference d between a portion of
the first leadframe 11 and the second leadframe 12, thereby
allowing the first coil portion 112 and the second coil portion 122
to be spaced apart from each other by a distance equal to the
height difference d.
The height difference d can be designed based on the properties of
the target product, such as the magnetic coupling and voltage
insulation properties. In other words, by adjusting the height
difference d, the isolation voltage between the two leadframes and
the magnetic coupling strength between the two coil portions can be
adjusted. In the present disclosure, the height difference d
preferably ranges between 100 and 500 micrometers. In other words,
in the target product (a leadframe component of a magnetic coupling
package structure), the distance between the first coil portion 112
and the second coil portion 122 is preferably from 100 to 500
micrometers. Therefore, the isolation voltage and the magnetic
coupling efficiency between the first coil portion 112 and the
second coil portion 122 can be ensured, and the size of the target
product can be reduced.
Reference is made to FIG. 7. In step S104, the first leadframe 11
is rotated relative to the frame body 10 and moved to a position
above or under the second leadframe 12 for matching the first coil
portion 112 with the second coil portion 122 and generating
magnetic coupling. Specifically, as shown in FIG. 1, the first
leadframe 11 is rotated along the rotating axis B and toward the
rotation direction R for 180 degrees. Therefore, the first
leadframe 11 is moved to a position above the second leadframe 12.
The position of the lead frame structure 1 is unchanged during step
S104.
It should be noted that if the bending portion S is formed by
bending the first pin portion 113 of the first leadframe 11
downward as in step S103, the first leadframe 11 will be rotated
and moved to a position above the second leadframe 12 in step 104
for preventing the first chip 21 and the second chip 22 from
contacting with each other, or preventing the first coil portion
112 and the second coil portion 122 from contacting with each
other. Similarly, if the bending portion S is formed by bending the
first pin portion 113 of the first leadframe 11 upward as in step
S103, the first leadframe 11 will be rotated and moved to a
position under the second leadframe 12 in step S104. In other
words, the step for forming the bending portion S and the step for
rotating the first leadframe 11 are correlated with each other.
Based on step S104, the first coil portion 112 of the first
leadframe 11 and the second coil portion 122 of the second
leadframe 12 has a height difference d formed by the bending
portion S therebetween. As mentioned above, by controlling the
value of the height difference d, the coupling and voltage
insulation efficiency of the leadframe component or the magnetic
coupling package structure formed thereby can be adjusted. In
addition, the step for rotating the first leadframe 11 can be
achieved in a single step, i.e., rotating the first leadframe 11
for 180 degrees in a single movement, or can be achieved through
multiple steps, i.e., rotating the first leadframe 11 for different
or same angles in each step.
In the embodiment shown in FIG. 5 to FIG. 8, after completing step
S104, the first coil portion 112 is located at a position right
above the second coil portion 122 and is parallel to the second
coil portion 122 as shown in FIG. 8. In addition, the first coil
portion 112 and the second coil portion 122 are aligned with each
other, thereby ensuring the coupling effect between the first coil
portion 112 and the second coil portion 122. In addition, the first
coil portion 112 and the second coil portion 122 have a
nonconductive spacing (equal to the height difference d)
therebetween.
After matching the first coil portion 112 with the second coil
portion 122, step S105 can be performed to form an insulating
package structure 3 for molding the first chip 21 and the second
chip 22, and for connecting the first leadframe 11 to the second
leadframe 12. As shown in FIG. 9, the insulating package structure
3 encloses the first chip-mounting portion 111 and the first coil
portion 112 of the first leadframe 11, the second chip-mounting
portion 121 and the second coil portion 122 of the second leadframe
12, and the first chip 21 and the second chip 22 respectively
disposed on the first chip-mounting portion 111 and the second
chip-mounting portion 121. A portion of the insulating package
structure 3 is filled in (disposed) between the first leadframe 11
and the second leadframe 12 for insulating the first coil portion
112 from the second coil portion 122.
In addition, a portion of each of the first pins 113 are exposed
from the insulating package structure 3, and a portion of each of
the second pins 123 are exposed from the insulating package
structure 3. A portion of the first floated pins 114 is exposed
from the insulating package structure 3, and a portion of the
second floated pins 124 is exposed from the insulating package
structure 3. The portion of the first pins 113 and the portion of
the second pins 123 exposed from the insulating package structure 3
can be electrically connected to other electronic components. For
example, the portion of the first pins 113 and the portion of the
second pins 123 can provide the required isolating voltage to the
magnetic coupling package structure.
Referring to FIG. 4, after step S105, the method provided by the
embodiments of the present disclosure further includes a step of
removing the frame body 10. Specifically, the frame body 10 is used
to support the first leadframe 11 and the second leadframe 12
during the manufacturing process. After an insulating package
structure 3 is provided to connect the first leadframe 11 to the
second leadframe 12, the frame body 10 can be deflashed, trimmed
and formed, and then removed. The process for removing the frame
body 10 is not limited in the present disclosure. During the step
of removing the frame body 10, the first floated pins 114 and the
second floated pins 124 exposed from the insulating package
structure 3 can be removed. It should be noted that in the present
disclosure, the direction for removing (cutting) the first floated
pins 114 and the second floated pins 124 can be opposite to each
other (both are removed along a direction away from the center of
the semiconductor package) for increasing the isolation distance,
thereby ensuring the isolation voltage.
It should be noted that in the present disclosure, a step for
disposing a polyimide film between the first leadframe 11 and the
second leadframe 12 can be included for increasing the isolation
voltage. In other words, the polyimide film can increase the
electrical isolation efficiency between the first leadframe 11 and
the second leadframe 12. In addition, by disposing the polyimide
film, the height difference (i.e., the distance of the spacing)
between the first coil portion 112 and the second coil portion 122
can be effectively reduced to from 100 to 200 micrometers.
Therefore, the magnetic coupling efficiency can be increased while
ensuring the isolation voltage.
Reference is made to FIG. 10 and FIG. 11. Compared to the
embodiment shown in FIG. 9, the magnetic coupling package structure
P of the embodiment shown in FIG. 10 and FIG. 11 has a different
number of bending portions S, and the positions of the first chip
21 and the second chip 22 are also different. Specifically, as
shown in FIG. 10, in addition to the bending portion S formed on
the first pin portion 113 of the first leadframe 11, the second pin
portion 123 of the second leadframe 12 also has a bending portion S
formed thereon. In other words, the distance between the first coil
portion 112 and the second coil portion 122 can be adjusted by
forming bending portions S on the first pin portion 113, the first
floated pin 114, the second pin portion 123 and the second floated
pin 124.
Compared to FIG. 9 and FIG. 10, in the embodiment shown in FIG. 11,
the arrangement of the first chip 21 and the second chip 22 is
different. Specifically, in FIG. 11, the first chip 21 and the
second chip 22 are respectively disposed on two chip-mounting
portions facing towards opposite directions. In other words,
compared to FIG. 10, in which the two surfaces having the first
chip 21 and the second chip 22 mounted thereon in the magnetic
coupling package structure P are arranged face to face, the first
chip 21 and the second chip 22 in FIG. 11 are arranged back to
back. Therefore, the height difference d can be reduced, and the
magnetic coupling efficiency can be increased. In fact, the
arrangements of the first chip 21 and the second chip 22 is not
limited in the present disclosure.
The present disclosure further provides a leadframe component and a
magnetic coupling package structure. The leadframe component and
the magnetic coupling package structure P can be formed by the
method described above. Therefore, the details of the leadframe
component and the magnetic coupling packages structure are not
reiterated herein.
Effects of the Embodiments
One of the advantages of the present disclosure resides in that,
based on the technical features of "the first leadframe 11 is
disposed above or under the second leadframe 12 for aligning the
first coil 112 and the second coil 122 and enabling the first coil
112 and the second coil 122 to magnetically couple to each other"
or "rotating the first leadframe 11 relative to the frame body 10
for moving the first leadframe 11 to a position above or under the
second leadframe 12", the foldable leadframe component, a package
structure of a magnetic coupling isolator P including the same and
a method for manufacturing the package structure provided by the
present disclosure can improve the alignment accuracy of the first
coil portion and the second coil portion and control the magnetic
coupling effect generated by the matching of the first coil portion
and the second coil portion.
Specifically, the package structure of the magnetic coupling
isolator P provided by the present disclosure can be used in
semiconductor package elements such as micro-transformer. In
addition, the package structure can be manufactured by a simple
method and be based on the specific structural design of the
leadframe structure for achieving the effect of automatic alignment
of the coils located in different areas (the first leadframe 11 and
the second leadframe 12) in a single leadframe structure 1.
Furthermore, by using the insulating package 3, the first coil
portion 112 and the second coil portion 122 are highly insulated
from each other. The package structure of a foldable magnetic
coupling isolator P can have an insulation voltage larger than 5
kV.
In the present disclosure, the first coil portion 112 and the
second coil portion 122 are aligned vertically and form effective
magnetic coupling, thereby enabling the signals to be transmitted
from an input (such as a reflector) to an output (such as a
receiver) through the coupling of the coils. In addition, the
vertical distance between the first coil portion 112 and the second
coil portion 122 can be controlled by changing the design of the
leadframe structure 1. For example, by adjusting the distance
between the first leadframe 11 with the first coil portion 112
located thereon and the second leadframe 12 with the second coil
portion 122 located thereon, the performance of the electrical
insulation of the two coils can be adjusted.
The above-mentioned descriptions represent merely the exemplary
embodiment of the present disclosure, without any intention to
limit the scope of the present disclosure thereto. Various
equivalent changes, alterations or modifications based on the
claims of the present disclosure are all consequently viewed as
being embraced by the scope of the present disclosure.
* * * * *