U.S. patent number 10,747,274 [Application Number 15/253,758] was granted by the patent office on 2020-08-18 for architecture features of an electronic device.
This patent grant is currently assigned to Apple Inc.. The grantee listed for this patent is Apple Inc.. Invention is credited to Jiang Ai, Santhana Krishnan Balaji, John R. Kamorowski, Jason S. Keats, Melody L. Kuna, G. Kyle Lobisser, Stephen R. McClure, John Raff, Oliver C. Ross, Robert Scritzky, Erik A. Uttermann, Guangtao Zhang.
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United States Patent |
10,747,274 |
Uttermann , et al. |
August 18, 2020 |
Architecture features of an electronic device
Abstract
A portable electronic device, having a single piece housing to
carry operational components having a front opening, an integral
bottom and sidewalls that cooperate to form a cavity in cooperation
with the front opening. The operational components can include a
display to present visual content disposed within the front opening
and having an outermost protective layer, a main logic board that
extends along a central portion of the cavity having a size and
shape that bisects the cavity into a first portion and a second
portion each having substantially the same size and shape, a power
storage system supported at the bottom wall and comprising a first
power storage unit located in the first portion and second power
storage unit located in the second portion, each being coupled to
the main logic board, and self-contained audio components
positioned at each corner of the single piece housing.
Inventors: |
Uttermann; Erik A. (Cupertino,
CA), Raff; John (Menlo Park, CA), Kuna; Melody L.
(Cupertino, CA), Keats; Jason S. (Castro Valley, CA),
Lobisser; G. Kyle (Los Altos Hills, CA), Kamorowski; John
R. (Campbell, CA), Ross; Oliver C. (San Francisco,
CA), Zhang; Guangtao (San Francisco, CA), Balaji;
Santhana Krishnan (Cupertino, CA), Ai; Jiang (Cupertino,
CA), Scritzky; Robert (Sunnyvale, CA), McClure; Stephen
R. (Belmont, CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
Apple Inc. |
Cupertino |
CA |
US |
|
|
Assignee: |
Apple Inc. (Cupertino,
CA)
|
Family
ID: |
57137798 |
Appl.
No.: |
15/253,758 |
Filed: |
August 31, 2016 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20170068288 A1 |
Mar 9, 2017 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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62214081 |
Sep 3, 2015 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F
1/183 (20130101); G06F 1/1626 (20130101); G06F
1/1635 (20130101); H04M 1/0277 (20130101); G06F
1/1656 (20130101); H04M 1/0262 (20130101); H04M
1/035 (20130101); G06F 1/203 (20130101); H04B
1/3888 (20130101); G06F 1/184 (20130101); G06F
1/1688 (20130101) |
Current International
Class: |
G06F
1/16 (20060101); H04M 1/03 (20060101); H04M
1/02 (20060101); G06F 1/20 (20060101); H04B
1/3888 (20150101); H05K 5/00 (20060101); H05K
7/00 (20060101); G06F 1/18 (20060101) |
References Cited
[Referenced By]
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Other References
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Oct. 23, 2017. cited by applicant .
Chinese Patent Application No. 201610791091.4--First Office Action
dated Dec. 18, 2018. cited by applicant .
Australian patent application No. 2016222502--Examination report
No. 1, dated Mar. 24, 2017. cited by applicant .
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Report dated Mar. 17, 2017. cited by applicant .
European Patent Application No. 16186539.9--European Search Report
dated Dec. 9, 2016. cited by applicant .
Australian Patent Application No. 2016222502--Examination report
No. 2, dated Jun. 14, 2017. cited by applicant .
Blickenstorfer, C. H., "SDG Systems RAMPAGE 6--Large, versatile,
ultra-rugged Android-based handheld computer with 5.7-inch display"
[retrieved from the internet on Jun. 14, 2017]. <URL:
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3_handhelds_sdg_systems_rampage.html > published on Dec. 27,
2014 as per Wayback Machine, [7 pages]. Whole document. cited by
applicant .
Orf, D., "Acer Has a Crazy New Gaming Tablet" [retrieved from the
internet on Jun. 14, 2017]. <URL:
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; published on Apr. 24, 2015, [16 pages]. Whole article. cited by
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[retrieved from the internet on Jun. 14, 2017]. <URL:
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s-on-02400505/> published on Sep. 2, 2015, [7 pages] Whole
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[retrieved from the internet on Jun. 14, 2017]. <URL:
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; published on Sep. 2, 2015, [6 pages]. Whole article. cited by
applicant .
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Preliminary Rejection dated Jun. 18, 2017. cited by applicant .
Chinese Patent for Utility Model No. ZL201621024002.5--Evaluation
Report (UMPER) dated Jul. 19, 2017. cited by applicant.
|
Primary Examiner: Haughton; Anthony M
Attorney, Agent or Firm: Dickinson Wright RLLP
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims the benefit of priority under 35 U.S.C.
.sctn. 119(e) to U.S. Provisional Application No. 62/214,081, filed
on Sep. 3, 2015, and titled "ARCHITECTURE FEATURES OF AN ELECTRONIC
DEVICE," the disclosure of each is incorporated herein by reference
in its entirety.
Claims
What is claimed is:
1. A portable electronic device, comprising: a single piece housing
arranged to carry operational components and comprising: a front
opening, a bottom wall and sidewalls integrated with the bottom
wall that cooperate to form a cavity in cooperation with the front
opening, the operational components comprising: a display capable
of presenting visual content and disposed within the front opening
and having an outermost protective layer; a main logic board that
extends along a central portion of the cavity having a size and
shape that bisects the cavity into a first portion and a second
portion each having substantially the same size and shape; a power
storage system supported at the bottom wall and comprising a first
power storage unit located in the first portion and second power
storage unit located in the second portion, each being coupled to
the main logic board; a self-contained audio module positioned at
each corner of the single piece housing; a can member disposed over
the main logic board and comprising an opening that at least
partially receives the main logic board; a cover disposed over the
can member and the opening, the cover comprising: a thermally
conductive layer that draws and directs heat away from the main
logic board; and an electrically conductive layer disposed over a
surface of the thermally conductive layer, the electrically
conductive layer providing an electrical grounding path for the
main logic board.
2. The electronic device of claim 1, wherein the self-contained
region comprises a rib integrally formed within the second portion
and disposed in the second portion, the rib capable of spreading an
acoustical energy of the audio module.
3. The electronic device of claim 2, wherein the second portion
comprises a rib integrally formed within the second portion and
disposed in the second portion, the rib capable of spreading an
acoustical energy of the audio module.
4. The electronic device of claim 3, further comprising a cover
sealed with the rib at the second portion that combines with the
second portion to define a back volume for the audio module, the
cover comprising several layers of materials, and wherein at least
one layer of material comprises carbon fiber having several
fibers.
5. The electronic device of claim 4, wherein the cover includes a
first outer layer, a second outer layer, and an inner layer
positioned between the first outer layer and the second outer
layer.
6. The electronic device of claim 4, wherein the several fibers are
oriented in a first direction aligned with one of the corners, and
the rib in the second portion is oriented in a second direction
perpendicular to the first direction.
7. The electronic device of claim 2, further comprising an
underpass that opens to the first portion and the second portion
allowing an audible sound from the audio module to pass into the
second portion.
8. The electronic device of claim 1, wherein the cover comprises a
second electrically conductive layer over a second surface opposite
the surface and wherein the electrically conductive layer and the
second electrically conductive layer are adhesively secured with
the thermally conductive layer via an electrically conductive
adhesive.
9. The electronic device of claim 8, wherein the thermally
conductive layer comprises a graphite material and wherein the
electrically conductive layer comprises a metal alloy that includes
at least nickel or copper.
10. The electronic device of claim 9, wherein the thermally
conductive layer is completely enclosed by the first and second
electrically conductive layers.
11. The electronic device of claim 1, further comprising a second
circuit board comprising a second integrated circuit, the can
member having a second opening that at least partially receives the
second integrated circuit, the cover being disposed over the can
member and the second opening.
12. An electronic device, comprising: a single piece enclosure
arranged to carry operational components and comprising: a front
opening, a bottom wall and sidewalls integrated with the bottom
wall that cooperate to form a cavity in cooperation with the front
opening; audio modules symmetrically disposed on opposite
sidewalls, wherein each audio module includes: a rib feature
integrally formed with the enclosure, the rib feature defining a
first region that receives an audio module and a second region
connected to the first region; a cover sealed with the rib feature
at the second region that combines with the second region to define
a back volume for the audio module; and a main logic board that
extends along a central portion of the cavity having a size and
shape that bisects the cavity into a first portion having a first
power source and a second portion having a second power source; a
can member disposed over the main logic board and comprising an
opening that at least partially receives the main logic board; a
cover disposed over the can member and the opening, the cover
comprising: a thermally conductive layer that draws and directs
heat away from the main logic board; and an electrically conductive
layer disposed over a surface of the thermally conductive layer,
the electrically conductive layer providing an electrical grounding
path for the main logic board.
13. The electronic device of claim 12, wherein the second region
comprises a rib integrally formed within the second region and
disposed in the second region, the rib capable of spreading an
acoustical energy of the audio module.
14. The electronic device of claim 13, wherein the cover comprises
several layers of materials, and wherein at least one layer of
material comprises carbon fiber having several fibers.
15. The electronic device of claim 14, wherein the cover includes a
first outer layer, a second outer layer, and an inner layer
positioned between the first outer layer and the second outer
layer.
16. The electronic device of claim 15, wherein: the enclosure
comprises a corner, the several fibers are oriented in a first
direction aligned with the corner, and the rib in the second region
is oriented in a second direction perpendicular to the first
direction.
17. A method for forming a portable electronic device, the method
comprising: arranging a main logic board within a single piece
housing of the portable electronic device for carrying operational
components, the housing having a front opening, a bottom wall and
sidewalls integrated with the bottom wall that cooperate to form a
cavity in cooperation with the front opening such that the main
logic board extends along a central portion of the cavity having a
size and shape that bisects the cavity into a first portion and a
second portion each having substantially the same size and shape;
disposing a power storage system at the bottom wall, the power
storage system comprising a first power storage unit located in the
first portion and second power storage unit located in the second
portion, each being coupled to the main logic board; positioning a
self-contained audio components positioned at each corner of the
single piece housing; and arranging a display to present visual
content within the front opening, the display having an outermost
protective layer; disposing a can member over the main logic board,
the can member comprising: an opening that at least partially
receives the main logic board, and a cover disposed on the can
member and the opening, the cover comprising: a thermally
conductive layer that draws and directs heat away from the main
logic board; and an electrically conductive layer disposed on a
surface over the thermally conductive layer, the electrically
conductive layer providing an electrical grounding path for the
main logic board.
18. The method of claim 17, wherein the self-contained audio module
comprises a rib feature defining a first region that receives an
audio module and a second region connected to the first region.
Description
FIELD
The following description relates to an electronic device. In
particular, the following description relates to several internal
features of an electronic device. The internal features may be used
by the electronic device to enhance structural support as well as
acoustical performance.
BACKGROUND
Electronic devices, which may include tablet devices, are known to
include a display assembly coupled with an enclosure. An electronic
device may include one or more circuits including a processor
circuit and a memory circuit. The processor circuit may be used to
cause the display assembly to show visual content based on, for
example, a media file stored on the memory circuit. Further, the
electronic device may further emit audible sound consistent with
the visual content.
SUMMARY
Some embodiments can include a portable electronic device having a
single piece housing arranged to carry operational components that
can include a front opening, an integral bottom and sidewalls that
cooperate to form a cavity in cooperation with the front opening.
The operational components can include a display configured to
present visual content and disposed within the front opening and
having an outermost protective layer and a main logic board that
extends along a central portion of the cavity having a size and
shape that bisects the cavity into a first portion and a second
portion each having substantially the same size and shape. The
operational components can include a power storage system supported
at the bottom wall and may include a first power storage unit
located in the first portion and a second power storage unit
located in the second portion, each being coupled to the main logic
board. The operational components can include self-contained audio
components positioned at each corner of the single piece
housing.
Some embodiments can include an electronic device including an
enclosure, a rib feature integrally formed with the enclosure, the
rib feature defining a first region that receives an audio module
and a second region connected to the first region, a cover sealed
with the rib feature at the second region that combines with the
second region to define a back volume for the audio module, and a
circuit board disposed between a first power source and a second
power source.
Some embodiments can include a method that can include arranging a
main logic board within a single piece housing of a portable
electronic device for carrying operational components, the housing
having a front opening, an integral bottom and sidewalls that
cooperate to form a cavity in cooperation with the front opening
such that the main logic board extends along a central portion of
the cavity having a size and shape that bisects the cavity into a
first portion and a second portion each having substantially the
same size and shape. The method can include disposing a power
storage system at the bottom wall, the power storage system
including a first power storage unit located in the first portion
and second power storage unit located in the second portion, each
being coupled to the main logic board and positioning
self-contained audio components positioned at each corner of the
single piece housing. The method can include arranging a display to
present visual content within the front opening, the display having
an outermost protective layer.
Other systems, methods, features and advantages of the embodiments
will be, or will become, apparent to one of ordinary skill in the
art upon examination of the following figures and detailed
description. It is intended that all such additional systems,
methods, features and advantages be included within this
description and this summary, be within the scope of the
embodiments, and be protected by the following claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The disclosure will be readily understood by the following detailed
description in conjunction with the accompanying drawings, wherein
like reference numerals designate like structural elements, and in
which:
FIG. 1 illustrates an isometric view of an embodiment of an
electronic device, in accordance with the described
embodiments;
FIG. 2 illustrates a plan view of the electronic device shown in
FIG. 1, showing several internal features of the electronic
device;
FIG. 3 illustrates an exploded view showing several internal
features of the electronic device shown in FIG. 1;
FIG. 4 illustrates an exploded view of the first cover shown in
FIG. 3, in accordance with the described embodiments;
FIG. 5 illustrates a plan view of the electronic device shown in
FIG. 3, showing the covers disposed over their respective second
regions in accordance with several embodiments;
FIG. 6A illustrates an exploded view of a can member aligned with
electronic components that may be covered by the can member, in
accordance with several embodiments;
FIG. 6B illustrates a bottom view of the can member shown in FIG.
6A, in accordance with several embodiments;
FIG. 7A illustrates an exploded view of an embodiment of an
electro-thermal member that may be disposed over a can member, in
accordance with the described embodiments;
FIG. 7B illustrates a cross sectional view of the electro-thermal
member of FIG. 7A in accordance with several embodiments;
FIG. 7C illustrates the boundary of a graphite layer in relation to
the other layers of the electro-thermal member of FIG. 7A in
accordance with several embodiments;
FIG. 8A illustrates a top view showing a SIM card tray and an
enclosure, in accordance with several embodiments;
FIG. 8B illustrates a top view of the SIM card tray and enclosure
shown in FIG. 8A, further showing the SIM card tray installed in
the housing, in accordance with several embodiments;
FIG. 8C illustrates a top view of the SIM card tray and enclosure
shown in FIG. 8A, further showing the SIM card tray being ejected
from the housing by actuating the lever arm in accordance with
several embodiments;
FIG. 9A illustrates a plan view of an embodiment of flexible cable
assembly 902, in accordance with several described embodiments;
FIG. 9B illustrates a backside of the display assembly 104 (shown
in FIG. 1), showing the flexible cable assembly 902 electrically
coupled with several internal components;
FIG. 10 is a block diagram of a computing device that can represent
some of the components of the electronic device, in accordance with
the described embodiments; and
FIG. 11 is a flow chart illustrating a method for assembling a
portable electronic device in accordance with several
embodiments.
Those skilled in the art will appreciate and understand that,
according to common practice, various features of the drawings
discussed below are not necessarily drawn to scale, and that
dimensions of various features and elements of the drawings may be
expanded or reduced to more clearly illustrate the embodiments of
the present invention described herein
DETAILED DESCRIPTION
Reference will now be made in detail to representative embodiments
illustrated in the accompanying drawings. It should be understood
that the following descriptions are not intended to limit the
embodiments to one preferred embodiment. To the contrary, it is
intended to cover alternatives, modifications, and equivalents as
can be included within the spirit and scope of the described
embodiments as defined by the appended claims.
In the following detailed description, references are made to the
accompanying drawings, which form a part of the description and in
which are shown, by way of illustration, specific embodiments in
accordance with the described embodiments. Although these
embodiments are described in sufficient detail to enable one
skilled in the art to practice the described embodiments, it is
understood that these examples are not limiting such that other
embodiments may be used, and changes may be made without departing
from the spirit and scope of the described embodiments.
The following disclosure relates to an electronic device having
various architectural enhancements. The enhancements described
herein may include an improved internal layout of several internal
components. For example, the electronic device may include a single
piece housing having a bottom wall and several sidewalls defining
an internal cavity arranged to carry several operational
components. The electronic device may include multiple internal
power supplies (batteries), including a first power supply and a
second power supply, secured length wise with the bottom wall and
extending across a substantial portion of the bottom wall. Also,
each of the internal power supplies may also be positioned near a
sidewall of the enclosure. Further, rather than a single, centrally
located power supply, the power supplies described in the
disclosure may be positioned along opposing sidewalls, thereby
creating a space for several additional internal components, such
as a circuit board, between the first power supply and the second
power supply. Also, by securing the power supplies with the bottom
wall, the power supplies not store electrical energy for the
internal components, but also provide structural support to the
bottom wall. Also, securing means between the power supplies and
the bottom wall may include adhesives and/or double-sided tape.
The electronic device may further include several structural
enhancements. For example, the enclosure may include several ribs
integrally formed with the housing. The phrase "integrally formed"
as used throughout this detailed description and in the claims
refers two or more features formed from a single piece of material.
For example, the enclosure may be formed from a single block of
metal that undergoes a material removal operation with at least
some of the remaining material of the single block of metal (after
the material removal operation) defining the rib. In this regard,
the material removal operation may include a cutting tool such as a
computer number control ("CNC") cutting tool.
In addition, the ribs may be positioned at the corners of the
enclosure to receive audio speakers designed to provide acoustical
energy in the form of audible sound. For example, the ribs at one
of the corners may define a rib member that includes a first region
having a size and shape to receive an audio speaker. Further, the
first region may be positioned to allow the audio speaker to emit
acoustical energy through an opening (or openings) of a sidewall.
The rib member may also define a second region designed to couple
with a cover to form a back volume to enhance acoustical
performance of the audio speaker. In this regard, at least one of
the ribs may include an underpass opening to both the first and
second regions. Also, the rib members at the corners of the
enclosure may include second regions having different arrangements,
thereby defining different sizes and shapes of the second regions
of the rib members. This may create back volumes of different
volumes in order to harmonize the acoustically energy emitted from
the several audio speakers.
The aforementioned cover may adhesively secure with the second
region to define a closed volume. Also, when the cover combines
with the rib member at the second region, the combination of the
cover and the rib member may provide additional structural support
to the electronic device by resisting bending or twisting of the
enclosure. In this regard, the cover may include several layers of
material. In particular, at least some of the layers may several
fibers embedded in the layers. In some cases, the layers include
carbon fibers. Further, the layer may include a fiber configuration
aligned diagonally, as an example, with respect to the sidewalls.
For example, the fiber configuration may be directed toward the
corner at which the cover and the rib member are located.
The electronic device may further include a can member designed to
cover one or more internal components. In particular, the can
member may cover a circuit board as well as several integrated
circuits disposed on the circuit board. The can member may shield
other sensitive components from electromagnetic interference
("EMI") generated from the integrated circuit when the can member
covers the integrated circuits. Also, in some embodiments, the can
member includes an opening, or cutout region, designed to at least
partially receive an integrated circuit. In these embodiments, the
can member may include an electrically conductive the covers the
opening as well as the integrated circuit (extending through the
opening), and provides an electrical grounding path for the
integrated circuit.
In some instances, the can member includes an electro-thermal
feature overlaying a surface of the can member. The electro-thermal
feature may include several layers. For example, the
electro-thermal feature may include a layer formed from a metal or
metal alloy designed to provide an additional electrical grounding
path for the integrated circuit. Further, the electro-thermal
feature may include a second layer used to draw heat generated from
the integrated circuit. Accordingly, the second lay may provide a
thermal dissipation path for the integrated circuit. Further, in
some embodiments, the electronic device includes a display assembly
having a touch sensitive layer designed to receive a touch input
from a user. The can member and the electro-thermal feature may
combine to provide a support surface below the display assembly.
Also, the support surface may include a planar or flat surface that
prevent or limit issues, such as visual display artifacts and
screen "tearing," related to a touch input to the display assembly
in a location above the can member. Accordingly, the can member may
not only provide electrical and thermal enhancements, but also
provide a better user experience by improving video quality. The
can member may be installed after installation of the integrated
circuit and other components at a final test and assembly point.
The ability to assemble at this later point makes testing and
quality control easier to perform and manage. Also, the can member
may be a singular body that covers multiple integrated circuits.
This singular body feature, combined with the ability to assemble
after all most components are installed, can simplify rework of the
electronic device.
In order to provide electrical communication between internal
components, the electronic device may include several flexible
circuits. The flexible circuit may include flexible circuit
assemblies or flexible cable assemblies, either of which may be
designed to bend or twist without damaging while also carrying
electrical signals between components. In some embodiments, at
least one of the flexible circuits may include a design feature
that increases the overall surface area of the flexible circuit.
For example, the design feature may include an opening formed by a
split in the flexible circuit with the flexible circuit
subsequently merging together. This design feature may be disposed
below the circuit board (such as a main logic board) and between
the circuit board and the enclosure. In this regard, the flexible
circuit may provide a protective buffer by absorbing a load force
received by the enclosure, and in particular, in a location
corresponding to the circuit board. For example, when the
electronic device is dropped, a force or load to the enclosure may
be transferred to the circuit board, causing some components to
break away from the circuit board. The force may also damage the
circuit board. However, the design feature (opening) of the
flexible circuit may be in a location to provide some absorption of
the force to the enclosure thereby limiting or preventing component
issues related to dropping the electronic device.
The electronic device may also include a housing system designed to
receive a subscriber identity module ("SIM") card that stores
information related to the user, such as authentication
information. The housing system may include an enclosed, modular
feature that includes an ejection module within the modular feature
reducing the footprint associated with the SIM card. This may
increase internal space within the electronic device.
Also, the electronic device may further include a layout in which
electrical signals associated with the display assembly are
separated from electrical signal for other components. For example,
the electronic device may include a control circuit, such as a
video timing controller suitable for use with the display assembly.
The video timing controller may extend lengthwise along the
enclosure adjacent to one of the aforementioned power supplies. The
video timing controller may generate several analog signals later
converted to digital signals. In order to prevent interference from
other electrical signals to those of the video timing controller,
the electronic device may include a second flexible circuit
dedicated solely to the video timing controller. Further, the
electronic device may include a second circuit board electrically
coupled with the second flexible circuit, and accordingly, with the
video timing controller. The second circuit board may also include
several integrated circuits used to process electrical signals from
an input mechanism, such as a button of the electronic device, as
well as light emitting diodes ("LEDs") used to provide light to the
display assembly. The second flexible circuit, coupled with the
video timing controller and the second circuit board, may further
extend away from the second circuit board to electrically couple
with the display assembly via several connectors of the second
flexible circuit. However, the second flexible circuit may be
designed to carry signals This may allow the electronic device to
include improved signal quality. Also, an assembly time of the
electronic device may be reduced as the display assembly may be
assembled with the enclosure after the circuit board and the can
member are assembled. In other words, the display assembly need not
be directly coupled with and assembled contemporaneously with, the
circuit board having the can member.
These and other embodiments are discussed below with reference to
FIGS. 1-11. However, those skilled in the art will readily
appreciate that the detailed description given herein with respect
to these Figures is for explanatory purposes only and should not be
construed as limiting.
FIG. 1 illustrates an isometric view of an embodiment of an
electronic device 100, in accordance with the described
embodiments. In some embodiments, the electronic device 100 is a
mobile communications device, such as a smartphone. In the
embodiment shown in FIG. 1, the electronic device 100 is a tablet
device. The electronic device 100 may vary in shape and size. Also,
the electronic device 100 may include an enclosure 102 designed to
enclose and protect several internal components, such as a
processor circuit, a memory circuit, etc. In some embodiments, the
enclosure 102 is formed from a metal, such as aluminum.
Also, the electronic device 100 may include a display assembly 104
designed to present visual content. In some embodiments, the
display assembly 104 includes a touch sensitive layer designed to
receive a touch input and generate a command, in accordance with
the touch input, to a processor circuit (not shown) of the
electronic device 100. Further, in some embodiments, the display
assembly 104 includes a capacitive touch sensitive layer designed
to generate an input based upon a capacitive coupling with the
display assembly 104. Further, an outer protective layer 106 made
from a transparent material, such as glass, may also overlay the
display assembly 104. Also, in some embodiments, the electronic
device 100 includes a force detection sensor (not shown) designed
to detect an amount of force applied to the display assembly 104
and/or the outer protective layer 106. The amount of force detected
may be received by a processor circuit of the electronic device
100, in order to generate a command or input based on the amount of
force.
In some embodiments, the electronic device 100 includes a button
108 designed to receive an input corresponding to a command to the
electronic device 100 (for example, to change the visual content
shown on the display assembly 104). Further, in some embodiments,
the electronic device 100 includes a charge port 110 designed to
receive power from a power source (not shown) in order to provide
power to internal components of the electronic device 100 and/or
power one or more power sources (such as battery packs) disposed in
the electronic device 100.
Also, in some embodiments, the electronic device 100 includes a
camera 112 designed to capture an image (or several images during a
video recording) and store the image or images on a memory circuit
(not shown) in the electronic device 100. Further, the camera 112
may be designed to capture an image of a user of the electronic
device 100. In some embodiments, the electronic device 100 is
relatively large. Accordingly, when the electronic device 100 is
positioned on a flat surface, an image capture area of the camera
112 may be generally be normal with respect to the electronic
device 100. However, as shown in FIG. 1, the camera 112 may be
tilted at an angle 114 corresponding to an angle between an
imaginary line (perpendicular with the electronic device 100) and a
positioning of the camera 112 with respect to the imaginary line.
The angle 114 may be approximately in the range of 5 to 15 degrees.
In this manner, the camera 112 is tiled at an angle 114 such that
the camera 112 may capture an image (or images) of the user even
when 1) the electronic device 100 is on a flat surface and 2) the
user is not positioned directly over the electronic device 100.
Further, in some embodiments, the electronic device 100 includes an
electrical contact 116 designed to electrically couple the
electronic device 100 with an electrical contact of another device,
such as an accessory device (not shown) or another electronic
device (not shown). Accordingly, the electrical contact 116 may
include an electrically conductive material, such as a metal. Based
on the electrical coupling with one of the aforementioned devices,
the electronic device 100 may communicate or send information (such
as model or design of the electronic device 100) to the other
device. Further, the electrical coupling may allow the electronic
device to receive information (such as model or design of the other
device). Further, the electrical coupling may allow the electronic
device 100 to receive an input or command from the other device.
For example, in some cases, an accessory device may include a
feature (or features) such as a keyboard or a touch pad designed to
receive an input from a user. When the user generates an input to
the feature, the input may pass to the electronic device 100 as a
command to a processor circuit (not shown) of the electronic device
100. For example, the command received by the processor circuit may
include changing the visual content presented on the display
assembly 104. Also, in some embodiments, the electronic device 100
includes multiple electrical contacts (not shown) designed to
electrically couple with a corresponding number of electrical
contacts of another device.
FIG. 2 illustrates a plan view of the electronic device 100 shown
in FIG. 1, showing several internal features of the electronic
device 100. The display assembly 104 and other feature may be
removed for purposes of illustration. As shown, the first power
source 202 and the second power source 204 may be disposed
lengthwise across the enclosure 102. In this manner, the first
power source 202 and the second power source 204 may provide
structural support to the enclosure 102, in additional to providing
an internal power supply. This additional structural support may be
useful, particularly when a thickness of the enclosure 102 is 1
millimeter or less.
The electronic device 100 may include several additional
dual-purpose features. For example, the electronic device 100 may
include a first rib feature 120 that may be integrally formed with
the enclosure 102. The first rib feature 120 may be used to provide
additional structural support to the enclosure 102, and
accordingly, to the electronic device 100. As, the first rib
feature 120 may form a box, or box-like feature. The first rib
feature 120 may include a first audio module 132 and a first cover
134. The first cover 134 may enclose a region of the first rib
feature 120 to define a back volume that receive some audio
transmission from the first audio module 132. The back volume may
be tuned to receive audio transmission in order to improve an
overall sound quality of the electronic device 100. This will be
discussed below. Also, the first cover 134 may also combine with
the first rib feature 120 to not only improve acoustical
performance, but also to improve the strength of the enclosure 102.
The first rib feature 120 and associated components may be
representative of several additional rib features and associated
components, which will be shown and described below. Also, the rib
features and their respective covers may combine to provide an
improved structural rigidity as well as an improved acoustical
performance.
Also, the electronic device 100 may include a can member 208
disposed between the first power source 202 and the second power
source 204. The can member 208 cover a circuit board (not shown)
having several integrated circuits. The can member 208 may be used
to shield the internal components from electromagnetic radiation in
the form of radio waves, for example, emitted from an internal
component such as antenna (not shown). Further, the can member 208
may shield the antenna from electromagnetic interference ("EMI")
generated from an integrated circuit covered by the can member
208.
FIG. 3 illustrates an exploded view showing several internal
features of the electronic device 100 shown in FIGS. 1 and 2. The
display assembly 104 and outer protective layer 106 are removed for
purposes of illustration. The enclosure 102 may include several rib
features designed to provide structural support to the electronic
device 100 and combine with other features to enhance acoustical
performance. For example, the electronic device 100 may include a
first rib feature 120 that include several ribs integrally formed
with the enclosure 102. Further, the ribs of the first rib feature
120 may be positioned along the enclosure 102 to define a first
region 122 and a second region 124. The first region 122 may
include a size and a shape designed to receive an audio module,
such as a first audio module 132, designed to generate audible
sound. Further, as shown in the enlarged view, a first ridge
feature 126 may be formed along one or more ribs defining the first
region 122. The first audio module 132 may be adhesively secured
with the first region 122 along the first ridge feature 126. Also,
although not shown, a foam ring may be used to further seal the
first audio module 132 in the first region 122. Further, the audio
modules may be positioned in the rib features in a manner allowing
audible sound to emit through the enclosure 102 through several
openings. For example, the first audio module 132, when disposed in
the first region 122, may emit audio sound through a first opening
142 in the enclosure 102. In other embodiments, the enclosure 102
includes several openings similar to the first opening 142 in order
to allow audible sound to pass from the first audio module 132
through the enclosure 102.
Each rib feature having a first region and a second region may vary
in size and shape. However, the first region of each rib feature
may include a substantially similar, or even identical, size and
shape in order to receive an audio module of a consistent size and
shape (corresponding to the size and shape of the first region
122). This allows for easier assembly, as each audio module is
generally the same size and shape, and sorting of audio modules by
size and shape is not required. For example, as shown in FIG. 3,
the first region 122 of the first rib feature 120 may be
substantially similar in size and shape as that of a first region
152 of a second rib feature 150. Accordingly, the first audio
module 132 may be substantially similar in size and shape as that
of a second audio module 162.
The second region 124 may include a size and a shape designed to
receive a cover, such as a first cover 134. The covers may include
several layers of material pressed or woven together. In some
embodiments, the covers include one or more carbon fiber layers.
Further, the covers may be formed according to a desired size and
shape by means such as laser cutting or die cutting. The cover may
provide additional structural support to the enclosure 102 as well
as enhance the acoustical performance of the audio modules. This
will be discussed further below. As shown in the enlarged view, a
second ridge feature 128 may be formed along one or more ribs
defining the second region 124. The first cover 134 may be
adhesively secured with the second region 124 along the second
ridge feature 128.
The second regions may vary shape according to a desired acoustic
performance of each audio module. Further, the shape of the rib
features may vary in order to accommodate one or more internal
components proximate to the rib features. For example, as shown in
FIG. 3, the second region 124 of the first rib feature 120 may
include a different shape than that of a second region 154 of the
second rib feature 150. However, despite the differences in shape,
the size (including the volume) of each second region may be
substantially similar. For example, the second region 124 of the
first rib feature 120 may include a substantially similar size as
that of the second region 154 of the second rib feature 150.
Accordingly, the first cover 134 and a second cover 164 (designed
for use with the second region 154) may include different shape but
a substantially similar size, both of which may correspond to the
size and shape of their respective second regions.
When the audio modules and covers are adhesively secured in the
first regions and the second regions, respectively, the first
regions and second regions may be sealed. Also, at least one rib
shared by each first and (adjacent) second region may include an
underpass linking the first regions to their respective second
regions. Also, the second regions, enclosed by their respective
covers, may define back volumes used with their respective audio
modules. The back volume may be an enclosed space that receives
some audible sound generated by the audio modules. Accordingly, the
audio modules may also be positioned such that at least some
audible sound passes through the respective underpasses and into
the back volumes in order to enhance the acoustical performance of
the audio modules. For example, as shown in the enlarged view, a
rib 144 shared by the first region 122 and the second region 124
may include an underpass 146. In this manner, the second region
124, enclosed by the first cover 134, may define a first back
volume for the first audio module 132. Further, due in part to the
substantially similar sizes of the second regions, the back volumes
may also be substantially similar in volume.
Also, the second region of each rib feature may include one or more
ribs disposed within the second regions, and accordingly, within
the back volumes. For example, as shown in enlarged view, the
second region 124 may include a first rib 156 and a second rib 158.
These ribs may be used to provide additional structural support.
Also, the ribs may further be used and positioned to enhance
acoustical performance. For example, during operation of the audio
modules, the audible sound emitted from the audio modules may
include an acoustical energy causing the covers to vibrate
according one or more frequencies. Further, the covers may vibrate
at a resonant frequency (determined by the material makeup of the
covers), causing additional vibration of the covers based on a
relatively high amplitude according to resonant frequency. This may
lead to a reduced acoustical performance as well as increased
likelihood of the covers delaminating (or becoming unglued) from
the rib features. However, the ribs may act as partitions of the
audible sound entering the back volumes, causing the covers to
vibrate accordingly to additional frequencies. This may "spread
out" the acoustical energy along several frequencies, including the
resonant frequency, causing a reduced amplitude in each of the
respective frequencies. As an example, the first rib 156 and the
second rib 158 may reduce the vibrational energy of the first cover
134 during operation of the first audio module 132. This may
improve the acoustic performance of the first audio module 132 as
well as reduce the likelihood of the first cover 134 delaminating,
as the first cover 134 may vibrate according to several frequencies
having a relatively low amplitude.
While various features are described in detail for the first rib
feature 120, the remaining rib features and respective components
(such as an audio module and a cover) may include any feature or
feature previously described for the first rib feature 120 and its
components.
The electronic device 100 may include additional features. For
example, as shown in FIG. 3, the electronic device 100 may include
a first power source 202 and a second power source 204. In some
embodiments, the first power source 202 and the second power source
204 are battery packs designed to store power and provide
electrical current to several internal components of the electronic
device 100, such as the display assembly 104 (shown in FIG. 1), the
audio modules, and several integrated circuits. The power sources
may be electrically coupled with several internal components via
flexible circuits (not shown). Also, then first power source 202
and the second power source 204, when disposed in the enclosure
102, may be positioned along opposing sides of a first circuit
board 206. In additional to providing power to various internal
components, the first power source 202 and the second power source
204 may also provide additional structural support to the enclosure
102, as the first power source 202 and the second power source 204
are positioned along a lengthwise manner in the enclosure 102, and
cover a substantial portion of the enclosure 102.
Also, the first circuit board 206 may include several integrated
circuits, such as a first integrated circuit 212 and a second
integrated circuit 214. In some cases, the first integrated circuit
212 and/or the second integrated circuit 214 may emit
electromagnetic radiation that may cause interference with other
components. Alternatively, the performance of the first integrated
circuit 212 and/or the second integrated circuit 214 may be
compromised by electromagnetic interference ("EMI") generated from
one or more internal components external with respect to the first
circuit board 206. However, the electronic device 100 may include a
can member 208 disposed over the first circuit board 206. A partial
cross section of the can member 208 is shown in FIG. 3. The can
member 208 may be formed from a metal, including a metal alloy
having phosphor and bronze. The can member 208 may contain the
electromagnetic radiation generated by the integrated circuits
disposed on first circuit board 206. Also, the can member 208 may
prevent EMI from components external with respect to the can member
208 from interfering with the integrated circuits on the first
circuit board 206.
Also the can member 208 may include openings in order to
accommodate certain integrated circuits. For example, the can
member 208 may include a first opening 216 and a second opening 218
designed to receive the first integrated circuit 212 and the second
integrated circuit 214, respectively. The number of openings may
vary according to the number of integrated circuits having
dimensions that would otherwise engage the can member 208. Also,
the can member 208 may include a conductive tape (not shown)
overlaying the openings and providing an additional electrical
grounding path for the first integrated circuit 212 and/or the
second integrated circuit 214. Further, an electro-thermal member
220 may be disposed over the can member 208. The electro-thermal
member 220 may include a thermally conductive layer, such as
graphite, designed to draw heat from, and provide a thermal
dissipation path for, the integrated circuits on the first circuit
board 206. Also, the electro-thermal member 220 may include an
electrically conductive layer disposed over the thermally
conductive layer. The electrically conductive layer may be formed
from metals such as nickel and/or copper. The electrically
conductive layer may provide an additional electrical grounding
path for at least some of the integrated circuits on the first
circuit board 206. In this regard, the electro-thermal member 220
may be adhesively secured with the can member 208 via an
electrically conductive adhesive (not shown) that provides an
additional electrical grounding path. Also, the can member 208 may
combine with the electro-thermal member 220 to provide a support
surface below the display assembly (not shown). The support surface
may be relatively flat and may also prevent or limit issues, such
as visual display artifacts and screen "tearing," related to a
touch input to the display assembly in a location corresponding to
a location of the can member 208. Accordingly, the can member 208
may not only provide electrical and thermal enhancements, but also
provide a better user experience by improving video quality. In
some embodiments, the electro-thermal member 220 includes an
additional electrically conductive layer adhesively secured with
the thermally conductive layer via an electrically conductive
adhesive, with the two electrically conductive layer sandwiching
the thermally conductive layer. This will be further shown and
described below.
Also, in some embodiments, the enclosure 102 undergoes an
anodization operation in which the enclosure 102 is exposed to
anodic bath containing several acidic compounds. The anodization
operation may provide an oxidation layer to the enclosure 102 which
may enhance the strength and appearance of the enclosure 102.
However, the oxidation layer may render the enclosure 102
electrically inert. In this regard, the enclosure 102 may undergo a
laser ablation process to remove portions of the oxidation layer,
and exposing the original metal layer of the enclosure 102.
Further, the can member 208 may be electrically coupled with the
exposed metal layer (exposed by the laser ablation operation), and
the can member 208 may combine with the enclosure 102 to provide an
electrical grounding path.
Also, the electronic device 100 may further include a housing 230
for a SIM card tray 232 (shown as dotted lines). The SIM card tray
232 may carry a SIM card (not shown) that can hold identification
and/or authentication information related to a user account
associated with the electronic device 100. The housing 230 may be
stored on a receiving feature 234 of the enclosure 102. The housing
230 may further include a pivot arm 236 (also shown as dotted
lines) enclosed by the housing 230. The pivot arm 236 may be used
to eject the SIM card tray 232. For example, in response to a force
received by an external tool (not shown), the pivot arm 236 may be
actuated in a rotational manner to eject the SIM card tray 232.
This will be shown and described in further detail below.
FIG. 4 illustrates an exploded view of the first cover 134 shown in
FIGS. 2 and 3, in accordance with the described embodiments. The
first cover 134 may include several layers, such as a first outer
layer 242 and a second outer layer 244. Also, one or more layers
may be positioned between the first outer layer 242 and the second
outer layer 244, such as a first inner layer 246 and a second inner
layer 248. Adjacent layers may be woven, or otherwise interlocked
together.
Also, the first outer layer 242 and the second outer layer 244 may
include a fiber material, such as a carbon fiber material. Further,
the first outer layer 242 and the second outer layer 244 may
include a fibers aligned according to a desired direction. For
example, as shown in FIG. 3, the first outer layer 242 may include
a first fiber configuration 252 defined by several fibers (shown as
dotted lines) aligned according to a first direction. The first
direction may be a diagonal direction aligned with a corner (not
shown) of an electronic device. This will be shown below. Also, the
second outer layer 244 may include a second fiber configuration 254
substantially similar to that of the first fiber configuration 252.
The first cover 134 may be a representative cover of the remaining
covers of an electronic device, with some modifications to the
fiber configurations.
FIG. 5 illustrates a plan view of the electronic device 100 shown
in FIG. 2, showing the covers disposed over their respective second
regions. The first power source 202, the second power source 204,
and the can member 208 are removed for purposes of simplicity. As
shown, the first rib feature 120 includes the first cover 134
disposed in the second region 124 (of the first rib feature 120)
and the second rib feature 150 includes the second cover 164
disposed in the second region 154 (of the second rib feature 150).
FIG. 4 further shows a partial cutout of the first cover 134
showing the first rib 156 and the second rib 158 disposed in the
second region 124.
Also, FIG. 5 further shows the first cover 134 having fibers
aligned according to the first fiber configuration 252 (of the
first outer layer 242, shown in FIG. 4). Further, the first fiber
configuration 252 includes fibers of the first cover 134 aligned in
a direction facing a first corner 262 of the electronic device 100.
In other words, the first fiber configuration 252 includes fibers
aligned in a direction toward (or away from) the first corner 262.
However, the first rib 156 and the second rib 158 (disposed in the
second region 124 of the first rib feature 120) are aligned
perpendicular (or 90 degrees), or at least approximately
perpendicular, with respect to the first fiber configuration 252.
This perpendicular configuration between the ribs and the covers
may increase the overall stiffness and rigidity of the electronic
device 100, and in particular, the enclosure 102.
Similarly, the second cover 164 (disposed in the second region 154
of the second rib feature 150) may include a fiber configuration
256 aligned in a direction facing a second corner 264 of the
electronic device 100. Further, a partial cutout of the second
cover 164 shows ribs disposed in the second region 154 of the
second rib feature 150 are aligned perpendicular, or at least
approximately 90 degrees, with respect to the fiber configuration
256 of the second cover 164. As shown, the first rib 166 and the
second rib 168 (disposed in the second region 154 of the second rib
feature 150) are aligned perpendicular, or at least approximately
perpendicular, with respect to the fiber configuration 256. This
may further increase the overall stiffness of the electronic device
100, and in particular, the enclosure 102. It should be noted that
the remaining covers and remaining ribs in the second regions of
their respective second regions may include a similar configuration
as the configuration shown for the first cover 134, the second
cover, and their respective ribs.
Also, the electronic device 100 may include several flexible
circuit assemblies designed to route signals to and from several
integrated circuits, and/or to provide power in the form of
electrical current from the powers sources (not shown) to internal
components. Further, in some embodiments, the flexible circuits
provide a dual purpose. For example, FIG. 5 illustrates a flexible
circuit 270 having an opening 272 in the flexible circuit 270. The
opening 272 splits the flexible circuit 270 into multiple regions
to increase a surface area (and associated volume) of the flexible
circuit 270. Further, not only does the flexible circuit 270 route
signals and/or power, but the flexible circuit 270, in the
embodiment shown in FIG. 5, may also provide support for a circuit
board (not shown) disposed over the flexible circuit 270 such that
the flexible circuit 270 is disposed between the enclosure 102 and
the circuit board. For example, if the electronic device 100
receives a load or force in the event of a drop event, for example,
the circuit board may become damages or an integrated circuit may
become decoupled from the circuit board. However, the flexible
circuit 270 may absorb some of the load or force from the impact of
the drop event and causing the load or force to spread across the
flexible circuit 270. Accordingly, the circuit board may incur a
reduced load or force causing less stress to the circuit board.
Also, although the flexible circuit 270 is shown having a
particular design, the flexible circuit 270 may be modified to
improve load impact. For example, in some embodiments, the flexible
circuit 270 is disposed vertically (as opposed to the horizontal
position shown in FIG. 5) and further includes several openings to
increase the surface area (and associated volume) of the flexible
circuit 270. The flexible circuit, being configured as described,
where it crosses the circuit board, allows for arranging the
circuit board centrally within the enclosure. Having the circuit
board in the center of the enclosure can add the stiffness of the
device. Locating the circuit board centrally can also improve
signal integrity for the circuit board and connections.
FIG. 6A illustrates an exploded view of a can member 608 aligned
with several electronic components that may be covered by the can
member 608. The can member 608 may be designed a printed circuit
board ("PCB") and one or more integrated circuits disposed on a
PCB. For example, a first PCB 604 may include a first integrated
circuit 612. A second PCB 624 can include a second integrated
circuit 614. The integrated circuits and electronic components can
include Wi-Fi, cellular data antenna and other radio components,
connectors, processors, memory, timing controller board, LED
control boards and the like. While not shown additional integrated
circuits can be included and can alone or in combination make up a
main logic board or other circuit boards for controlling an
electronic device, such as the electronic device 100 (shown in FIG.
1). The second PCB 624 may include a connector 610. First PCB 604
and second PCB 624 may be installed in a retention channel 640 for
locating and installing the PCBs to an enclosure, such as the
enclosure 102 (shown in FIG. 1). The can member 608 can be
configured to couple with the retention channel 640 to mechanically
retain can member 608 to retention channel 640. Also, the can
member 608 can include spring finger snaps 616 (shown in FIG. 6B)
to provide pressure for retaining the can member 608 to the
retention channel 640. The can member 608 can also be coupled to
the retention channel 640 and the electronic components, such as
the first integrated circuit 612 and the second integrated circuit
614, by pressure sensitive adhesive, or PSA (not shown). The PSA
may include dual sided adhesion characteristics so that the PSA may
provide a stronger adhesion force to the electronic components
relative to an adhesion force of the can member 608 to allow the
can member 608 to be removed more easily for rework operations if
necessary. Can member 608 can also be restrained to the enclosure
by way of screws (not shown) installed in screw holes 618 through
can member 608 and screw holes 626 in the PCBs. The screws can
additionally provide part of an electrical grounding path for the
electronic components electrically coupled with the screws. The can
member 608 can provide the benefit of covering multiple electronic
components and connections and can be installed towards the end of
the manufacturing process in the final assembly test and pack
operation. The can member 608 can provide electrical shielding
between components that otherwise create interference from cross
talk. Heat dissipation and grounding can be provided by an
electro-thermal member 620, which can be installed to the topside
of the can member 608 and can act as a cowling for the electronic
components as well as the connectors (including board to board
connectors) covered by the can member 608. Electro-thermal member
620, shown in FIG. 7A, and its various features are shown and
described below.
FIG. 6B illustrates a bottom view of the can member 608. An opening
622 can penetrate the can member 608 to accommodate electronic
components that might otherwise interact with the can member 608,
such as first integrated circuit 612 or second integrated circuit
614. Insulation (not shown) can be provided in the opening to
coordinate with electronic components when the can member is
installed to the electronic device.
FIG. 7A illustrates an exploded view of an embodiment of an
electro-thermal member 620 that may be disposed over a can member,
in accordance with the described embodiments. The electro-thermal
member 720 can be made up of several layers including a first
adhesion layer 722, a graphite layer 724, and a second adhesion
layer 726. The first adhesion layer 722 and the second adhesion
layer 726 can be electrically conductive. FIG. 7B illustrates a
cross sectional view of the electro-thermal member 720 of FIG. 7A.
As illustrated, the graphite layer 724 can be fully enclosed by the
first adhesion layer 722 and the second adhesion layer 726 to
prevent flaking off of any graphite from graphite layer 724 and
retain the graphite layer 724 between the two layers. FIG. 7C
illustrates how the graphite layer 724 may include a smaller
boundary profile than both the first adhesion layer 722 and the
second adhesion layer 726. The graphite layer 724 can dissipate
and/or transfer the heat from a given electronic component over a
broad region. Likewise, the graphite layer 724 can take the form of
many shapes and sizes to suite the particular thermal dissipation
needs of the particular electronic component or components. For
instance, the graphite layer 724 can take various shapes or be
formed into paths that lead heat in particular directions to
dissipate the heat generated by the electronic components to a
predetermined area.
The electronic device 100 (shown in FIG. 1) may be designed receive
a subscriber identity module ("SIM") card, as well as various
features to retain and ejected the SIM card. For example, FIG. 8A
illustrates a plan view of a SIM card tray 802 and an SIM enclosure
804 (also referred to as a housing) designed to receive the SIM
card tray 802. As shown, the SIM enclosure 804 may include a pivot
arm 806 integrated with the SIM enclosure 804 and used to eject the
SIM card tray 802. The SIM card tray 802 can hold a SIM card 812
that provides an electronic device with identification and/or
authentication information. The SIM card tray 802 may include
retention cutouts 810 located on the sides that can coordinate with
retention clips 814 arranged in the SIM enclosure 804. The
retention clips 814 can be spring loaded and biased so that when
the SIM card tray 802 is installed in the SIM enclosure 804 the
retention clips 814 engage the retention cutouts 810 and hold the
SIM card tray 802 in the SIM enclosure 804. The SIM card tray 802
may include a release aperture 816 located in a front wall 818
through the front for inserting a tool (not shown) that can engage
with a lever arm 808 arranged in the SIM enclosure 804. The lever
arm 808 can be connected to a pivot 820 also arranged in the SIM
enclosure 804. The pivot arm 806 can be engaged at the bottom
and/or rear portion of the SIM card tray 802 when SIM card tray 802
is installed in the SIM enclosure 804.
FIG. 8B illustrates when the SIM card tray 802 is installed in the
SIM enclosure 804. Here, SIM card tray 802 biases the pivot arm 806
in an inactive state.
Alternatively, FIG. 8C illustrates when a tool (not shown) is used
to depress the lever arm 808. Here, in response to a force applied
to the pivot arm 806 by the lever arm 808, the pivot arm 806
rotates about a pivot 820 and presses the SIM card tray 802 with
sufficient force to overcome the retention force exerted by the
retention clips 814 on the retention cutouts 810 and the SIM card
tray 802 is pressed out of the SIM enclosure 804. Because the
retention clips 814, the lever arm 808, the pivot arm 806 and the
pivot 820 are all enclosed by the SIM enclosure 804, SIM enclosure
804 provides the benefit of being more modular making it easier to
install and rework if necessary.
FIG. 9B illustrates a plan view of an embodiment of flexible cable
assembly 902, in accordance with several described embodiments. The
flexible cable assembly 902 may provide an electrical communication
path between several electrical components of an electronic device
(not shown), and may include some portions dedicated to specific
components. This will be discussed below. The flexible cable
assembly 902 may include a first cable portion 904 having a first
connector 906 designed to electrically couple with an internal
component of the electronic device. The flexible cable assembly 902
may further include a central cable portion 908 designed to
electrically couple with an additional internal component. Also,
the flexible cable assembly 902 may further include a second cable
portion 910 designed to electrically couple with an additional
electrical component. As shown, the second cable portion 910 may
split into first tail 912 and a second tail 914. Both the first
tail 912 and the second tail 914 may include a first connector 916
and a second connector 981, respectively. The first connector 916
and the second connector 918 can be used to electrically couple
their respective tails with an internal component. The split in
second cable portion 910 can make installing and rework operations
easier as the connectors are easier to install and uninstall in a
relatively small space. Also, the first cable portion 904 and the
second cable portion 910 can be separated into distinct portions to
prevent "cross talk" amongst electrical signals that travel through
the various regions of the flexible cable assembly 902. This will
be explained below.
FIG. 9A illustrates a backside of the display assembly 104 (shown
in FIG. 1), showing the flexible cable assembly 902 electrically
coupled with several internal components. As shown, the flexible
cable assembly 902 may use the first cable portion 904, including
the first connector 906, to couple with a timing controller board
920 ("TCON board") positioned at the edge of the backside of the
display assembly 104. The timing controller board 920 may provide a
controller mechanism for the display assembly 104. Also, the timing
controller board 920 may be positioned so as to not engage the
power sources (shown in FIG. 2). Also, the timing controller board
920 can be connected to an interposer board 907 by way of the first
cable portion 904 and the central cable portion 908. The connection
for the central cable 908 to the TCON board 920 can be a zero
insertion force ("ZIF") connection or any other suitable
cable-to-board connection. The interposer board 907 may include a
chip set (not shown) for converting analog signals received from
the TCON board 920 into digital signals that can be sent to the MLB
(not shown). The interposer board 907 may include a hotbar pad 911.
The hotbar pad 911 may include connection pads that are offset and
alternating or configured in rows. Although not shown, several
other configurations are possible. The central cable 908 can be
connected to the interposer board 907 by way of the hotbar pad
911.
Since the MLB flex 910 (second cable portion 910) is connected when
display assembly 104 and enclosure 102 (shown in FIG. 1) are
coupled together. The TCON flex 908 (central cable portion 908) and
the MLB flex 910 can be separated into distinct portions shown to
prevent "cross talk" amongst signals that travel through the
various cables as well as to allow for centralized arrangement of
the interposer board 907. Locating the interposer board 907
centrally within the enclosure also makes it closer to the MLB,
which can improve signal integrity. Other electrical components can
be connected to the interposer board 907 such as an LED (not shown)
by way of an LED cable 922, for example, amongst others including a
power button etc.
The display assembly 104 can be connected to the interposer board
907 by way of a MLB 910, shown in FIG. 9B. The MLB flex 910 and the
TCON flex 908 can be integrated into a single integrated cable. The
integrated cable 916 may include multiple tails. At one end, the
integrated cable 916 can be connected to the interposer board 907
(shown in FIG. 9A) by way of a hotbar pad 910 and the tails of the
integrated cable 916 each extend to their own respective
connections for their respective components. The MLB flex 910 can
be split into two tails, a first tail 912 and a second tail 914,
with connectors at the respective ends of each tail that can
connect with the MLB, not shown. The split in MLB flex 910 can make
installing and rework operations easier as the connectors are
easier to install and uninstall in a small space since the MLB flex
910 is connected when display assembly 104 and enclosure 102 (shown
in FIG. 1) are coupled together. The TCON flex 908 and the MLB flex
910 can be separated into distinct portions shown to prevent "cross
talk" amongst signals that travel through the various cables as
well as to allow for centralized arrangement of the interposer
board 907. Locating the interposer board 907 centrally within the
enclosure also makes it closer to the MLB, which can improve signal
integrity. Other electrical components can be connected to the
interposer board 907 such as an LED (not shown) by way of an LED
cable 922, for example, amongst others including a power button
etc.
FIG. 10 is a block diagram of a computing device 1000 that can
represent some of the components of the electronic device. It will
be appreciated that the components, devices or elements illustrated
in and described with respect to FIG. 10 may not be mandatory and
thus some may be omitted in certain embodiments. The computing
device 1000 can include a processor 1002 that represents a
microprocessor, a coprocessor, circuitry and/or a controller for
controlling the overall operation of the computing device 1000.
Although illustrated as a single processor, it can be appreciated
that the processor 1002 can include a plurality of processors. The
plurality of processors can be in operative communication with each
other and can be collectively configured to perform one or more
functionalities of the computing device 1000 as described herein.
In some embodiments, the processor 1002 can be configured to
execute instructions that can be stored at the computing device
1000 and/or that can be otherwise accessible to the processor 1002.
As such, whether configured by hardware or by a combination of
hardware and software, the processor 1002 can be capable of
performing operations and actions in accordance with embodiments
described herein.
The computing device 1000 can also include a user input device 1004
that allows a user of the computing device 1000 to interact with
the computing device 1000. For example, the user input device 1004
can take a variety of forms, such as a button, keypad, dial, touch
screen, audio input interface, visual/image capture input
interface, input in the form of sensor data, etc. Still further,
the computing device 1000 can include a display 1008 (screen
display) that can be controlled by the processor 1002 to display
information to a user. A controller 1010 can be used to interface
with and control different equipment through an equipment control
bus 1012. The computing device 1000 can also include a network/bus
interface 1014 that couples to a data link 1016. The data link 1016
can allow the computing device 1000 to couple to a host computer or
to accessory devices. The data link 1016 can be provided over a
wired connection or a wireless connection. In the case of a
wireless connection, network/bus interface 1014 can include a
wireless transceiver.
The computing device 1000 can also include a storage device 1018,
which may include a single disk or a plurality of disks (e.g., hard
drives) and a storage management module that manages one or more
partitions (also referred to herein as "logical volumes") within
the storage device 1018. In some embodiments, the storage device
1018 can include flash memory, semiconductor (solid state) memory
or the like. Still further, the computing device 1000 can include
Read-Only Memory (ROM) 1020 and Random Access Memory (RAM) 1022.
The ROM 1020 can store programs, code, instructions, utilities or
processes to be executed in a non-volatile manner. The RAM 1022 can
provide volatile data storage, and store instructions related to
components of the storage management module that are configured to
carry out the various techniques described herein. The computing
device 1000 can further include data bus 1024. The data bus 1024
can facilitate data and signal transfer between at least the
processor 1002, the controller 1010, the network/bus interface
1014, the storage device 1018, the ROM 1020, and the RAM 1022.
FIG. 11 illustrates a flowchart showing a method 1100 for
assembling electronic device, in accordance with the described
embodiments. The method 1100 may include steps for forming an
electronic device, such as the electronic device 100 (shown in FIG.
1). The steps of the method are provided in the order below by way
of example only, but of course the steps can be rearranged to
assemble the electronic device. That said, the method 1100 can
begin in a first step 1102 with arranging a main logic board within
a single piece housing of a portable electronic device for carrying
operational components were the housing has a front opening, an
integral bottom and sidewalls that cooperate to form a cavity in
cooperation with the front opening such that the main logic board
extends along a central portion of the cavity having a size and
shape that bisects the cavity into a first portion and a second
portion each having substantially the same size and shape. In a
second step 1104, the method can include disposing a power storage
system at the bottom wall where the power storage system has a
first power storage unit located in the first portion and second
power storage unit located in the second portion, each being
coupled to the main logic board. In a third step 1106, the method
can include positioning self-contained audio components at each
corner of the single piece housing. In a fourth step 1108, the
method can include arranging a display to present visual content
within the front opening, the display having an outermost
protective layer.
Various embodiments are described herein. These embodiments include
at least the following. Some embodiments include a portable
electronic device, having a single piece housing arranged to carry
operational components that can include a front opening, an
integral bottom and sidewalls that cooperate to form a cavity in
cooperation with the front opening. The operational components can
include a display configured to present visual content and disposed
within the front opening and having an outermost protective layer
and a main logic board that extends along a central portion of the
cavity having a size and shape that bisects the cavity into a first
portion and a second portion each having substantially the same
size and shape. The operational components can include a power
storage system supported at the bottom wall and comprising a first
power storage unit located in the first portion and a second power
storage unit located in the second portion, each being coupled to
the main logic board and self-contained audio components positioned
at each corner of the single piece housing.
In some embodiments the self-contained audio components have a rib
feature defining a first region that receives an audio module and a
second region connected to the first region. In some embodiments
the second region comprises a rib integrally formed within the
second region and disposed in the second region, the rib configured
to spread an acoustical energy of the audio module. Some
embodiments can include a cover sealed with the rib feature at the
second region that combines with the second region to define a back
volume for the audio module, the cover comprising several layers of
materials, and wherein at least one layer of material comprises
carbon fiber having several fibers.
In some embodiments the cover includes a first outer layer, a
second outer layer, and an inner layer positioned between the first
outer layer and the second outer layer. In some embodiments the
several fibers are oriented in a first direction aligned with one
of the corners, and the rib in the second region is oriented in a
second direction perpendicular to the first direction. Some
embodiments can include an underpass that opens to the first region
and the second region allowing an audible sound from the audio
module to pass into the second region. Some embodiments can include
a can member disposed over the main logic board having an opening
configured to at least partially receive the main logic board. The
can member may include a cover disposed over the can member and the
opening where the cover may include a thermally conductive layer
that draws and directs heat away from the main logic board and an
electrically conductive layer disposed a surface over the thermally
conductive layer, the electrically conductive layer providing an
electrical grounding path for the main logic board.
In some embodiments the cover comprises a second electrically
conductive layer over a second surface opposite the surface, and
the electrically conductive layer and the second electrically
conductive layer are adhesively secured with the thermally
conductive layer via an electrically conductive adhesive. In some
embodiments the thermally conductive layer comprises a graphite
material, and the electrically conductive layer comprises a metal
alloy that includes at least nickel and/or copper.
In some embodiments the thermally conductive layer is completely
enclosed by the first and second electrically conductive layers.
Some embodiments can include a second circuit board comprising a
second integrated circuit and, a can member having a second opening
configured to at least partially receive the second integrated
circuit, the cover being disposed over the can member and the
second opening.
In some embodiments the display is configured to receive a touch
input and the electronic device can include a circuit assembly
configured to providing a timing controller for the display, and a
flexible circuit electrically coupled with the circuit assembly,
where the main logic board comprises an integrated circuit
electrically coupled with the flexible circuit and the flexible
circuit carries only signals from the circuit assembly.
Some embodiments can include a second integrated circuit configured
to receive a control signal in response to the touch input and a
second flexible circuit that carries the control signal to the
second integrated circuit, where the second flexible circuit is
separate from the flexible circuit. Some embodiments can include a
button configured to provide an input to a third integrated circuit
electrically coupled with the circuit board. In some embodiments
the flexible circuit extends from the main logic board to
electrically couple with the display assembly. In some embodiments
wherein the flexible circuit is split and has two portions that
electrically couple with the main logic board.
Some embodiments can include a modular subscriber information
module (SIM) card enclosure and tray assembly, with the assembly
having a SIM card tray for supporting a SIM card, and a SIM
enclosure configured to accept the SIM card tray. The SIM enclosure
can include a lever arm arranged within the SIM enclosure and
accessible from outside the SIM enclosure with a tool for
depressing the lever arm and a pivot arm arranged about a pivot and
within the SIM enclosure such that when the lever arm is depressed,
the lever arm, rotates about the pivot to move the SIM card tray
from within the SIM enclosure, when the SIM card tray is installed
in the SIM enclosure. In some embodiments the SIM enclosure further
comprises a retention clip for retaining the SIM card tray in the
SIM enclosure. Some embodiments can include a SIM aperture in a
sidewall of the electronic device housing and wherein the SIM card
tray has a front portion configured to coordinate with the sidewall
such that when the SIM card tray is installed in the SIM aperture,
the front portion and the sidewall merge to make a smooth
surface.
Some embodiments can include an electronic device, having an
enclosure and a circuit board disposed in the enclosure, the
circuit board carrying an integrated circuit. The electronic device
can also include a can member disposed over the circuit board
having an opening configured to at least partially receives the
integrated circuit and a cover disposed over the can member and the
opening. The cover may include a thermally conductive layer that
draws and directs heat away from the integrated circuit, and an
electrically conductive layer disposed a surface over the thermally
conductive layer, the electrically conductive layer providing an
electrical grounding path for the integrated circuit.
In some embodiments the cover includes a second electrically
conductive layer over a second surface opposite the surface, and
the electrically conductive layer and the second electrically
conductive layer are adhesively secured with the thermally
conductive layer via an electrically conductive adhesive. In some
embodiments the thermally conductive layer includes a graphite
material, and wherein the electrically conductive layer comprises a
metal alloy that includes at least nickel and/or copper. In some
embodiments the circuit board comprises a second integrated circuit
that emits electromagnetic radiation, and the can member and the
cover combine to define a shield that contains the electromagnetic
radiation.
Some embodiments can include a first power source and a second
power source, where the circuit board is disposed between the first
power source and the second power source. In some embodiments the
enclosure comprises a rib feature integrally formed with the
enclosure, the rib feature defining a first region that receives an
audio module and a second region that defines a back volume. Some
embodiments can include a display assembly coupled with the
enclosure, wherein the can member and the cover define a flat
support feature for the display assembly.
Some embodiments can include electronic device having an enclosure
and a display assembly coupled with the enclosure to receive a
touch input. The electronic device can also include a circuit
assembly extending along the enclosure to providing a timing
controller for the display assembly and a flexible circuit
electrically coupled with the circuit assembly. The electronic
device can also include a circuit board comprising an integrated
circuit electrically coupled with the flexible circuit, where the
flexible circuit carries only signals from the circuit
assembly.
In some embodiments the circuit board can include a second
integrated circuit configured to receive a control signal in
response to the touch input and a second flexible circuit that
carries the control signal to the second integrated circuit, where
the second flexible circuit is separate from the flexible circuit.
Some embodiments can include a button configured to provide an
input to a third integrated circuit electrically coupled with the
circuit board. In some embodiments the flexible circuit can extend
from the circuit board to electrically couple with the display
assembly.
Some embodiments can also include a second circuit board comprising
a second integrated circuit and a can member having an opening
configured to at least partially receive the second integrated
circuit. Some embodiments can also include a cover disposed over
the can member and the opening, the cover having a thermally
conductive layer and an electrically conductive layer.
Some embodiments can include a system for connecting a timing
controller board and main logic board of an electronic device where
the system can include an interposer board having an interpose
connector, and a timing controller connector located on the timing
controller board. The system can also include a main logic board
connector located on the main logic board, and an integrated cable.
The integrated cable can include a first connection configured to
coordinated with the interposer connector, a second connection
configured to coordinate with the timing controller connector and a
third connection configured to coordinate with the main logic board
connection.
In some embodiments the integrated cable has a main logic board
portion and a timing controller portion and the main logic board
portion is split into more than one tails with each tail having a
connection. In some embodiments the connection of each tail of the
main logic board portion coordinates with a respective connection
on the main logic board. In some embodiments the first connection
is a hot bar connection. In some embodiments the second and third
connections are zero insertion force connections. In some
embodiments the electronic device comprises a housing having a
midline and the main logic board and interposer board are arranged
along the midline. In some embodiments the electronic device can
include a can that covers the main logic board, interposer board
and the first and third connections. In some embodiments the can
comprises a thermal dissipation layer. In some embodiments, the
interposer board includes a chipset for converting analog signals
to digital signals.
Some embodiments can include a system for shielding centralized
electronic components of an electronic device, where the system can
include multiple electronic components aligned along a midline of a
housing of the electronic device and a can member configured to
enclose all of the multiple electronic components.
Some embodiments can include a system the electronic device
comprises a retention channel that surrounds the multiple
components and is configured to coordinate with the can member to
enclose the multiple components. In some embodiments the can member
comprises spring biased ribs that retain the can member to the
retention channel when the can is installed over the multiple
components. In some embodiments the can member can include a
sandwiched graphite thermal dissipation layer having a first
conductive adhesive layer, a second conductive adhesive layer and a
graphite layer between and fully enclosed by the first and second
conductive adhesive layers.
In some embodiments the multiple electronic components are arranged
on one or more printed circuit boards and wherein the can member is
fastened to the one or more printed circuit boards by way of
fasteners and fastener apertures on the can member. In some
embodiments the fasteners and can member provide grounding for the
multiple electronic components. In some embodiments the can member
provides a contiguous flat surface over the multiple electronic
components. In some embodiments the electronic device comprises a
display that rests on the can member when the display and can
member are installed in the electronic device.
Some embodiments can include a method that can include arranging a
main logic board within a single piece housing of a portable
electronic device for carrying operational components, the housing
having a front opening, an integral bottom and sidewalls that
cooperate to form a cavity in cooperation with the front opening
such that the main logic board extends along a central portion of
the cavity having a size and shape that bisects the cavity into a
first portion and a second portion each having substantially the
same size and shape. The method can include disposing a power
storage system at the bottom wall, the power storage system
comprising a first power storage unit located in the first portion
and second power storage unit located in the second portion, each
being coupled to the main logic board and positioning
self-contained audio components positioned at each corner of the
single piece housing. The method can include arranging a display to
the housing to present visual content within the front opening, the
display having an outermost protective layer.
In some embodiments the display is configured to receive a touch
input and the method can include disposing a circuit assembly to
the display configured to providing a timing controller for the
display and electrically coupling a flexible circuit to the circuit
assembly, where the main logic board comprises an integrated
circuit electrically coupled with the flexible circuit and the
flexible circuit carries only signals from the circuit
assembly.
The various aspects, embodiments, implementations or features of
the described embodiments can be used separately or in any
combination. Various aspects of the described embodiments can be
implemented by software, hardware or a combination of hardware and
software. The described embodiments can also be embodied as
computer readable code on a computer readable medium for
controlling manufacturing operations or as computer readable code
on a computer readable medium for controlling a manufacturing line.
The computer readable medium is any data storage device that can
store data, which can thereafter be read by a computer system.
Examples of the computer readable medium include read-only memory,
random-access memory, CD-ROMs, HDDs, DVDs and optical data storage
devices. The computer readable medium can also be distributed over
network-coupled computer systems so that the computer readable code
is stored and executed in a distributed fashion.
The foregoing description, for purposes of explanation, used
specific nomenclature to provide a thorough understanding of the
described embodiments. However, it will be apparent to one skilled
in the art that the specific details are not required in order to
practice the described embodiments. Thus, the foregoing
descriptions of the specific embodiments described herein are
presented for purposes of illustration and description. They are
not targeted to be exhaustive or to limit the embodiments to the
precise forms disclosed. It will be apparent to one of ordinary
skill in the art that many modifications and variations are
possible in view of the above teachings.
* * * * *
References