U.S. patent number 10,680,382 [Application Number 16/256,117] was granted by the patent office on 2020-06-09 for modular bridge array for bridging electronic components.
This patent grant is currently assigned to QUANTA COMPUTER INC.. The grantee listed for this patent is QUANTA COMPUTER INC.. Invention is credited to Chun Chang, Ting-Kuang Pao, Yaw-Tzorng Tsorng.
United States Patent |
10,680,382 |
Tsorng , et al. |
June 9, 2020 |
Modular bridge array for bridging electronic components
Abstract
A bridge array for connecting electronic components within a
housing includes an array bracket and a plurality of connection
modules coupled to the array bracket. Each connection module
includes a first electrical connector configured to receive a first
electronic component, and a second electrical connector configured
to receive a second electronic component; thereby physically and
electrically connecting the first electronic component and the
second electronic component of each connection module. The array
bracket includes a first electrical port electrically connected to
the first electrical connector of each connection module. The first
electrical port provides a common connection to the first
electronic component of each connection module. The array bracket
includes a second electrical port electrically connected to the
second electrical connector of each connection module. The second
electrical port provides a common connection to the second
electronic component of each connection module.
Inventors: |
Tsorng; Yaw-Tzorng (Taoyuan,
TW), Chang; Chun (Taoyuan, TW), Pao;
Ting-Kuang (Taoyuan, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
QUANTA COMPUTER INC. |
Taoyuan |
N/A |
TW |
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Assignee: |
QUANTA COMPUTER INC. (Taoyuan,
TW)
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Family
ID: |
67253687 |
Appl.
No.: |
16/256,117 |
Filed: |
January 24, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200067229 A1 |
Feb 27, 2020 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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62723253 |
Aug 27, 2018 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R
13/518 (20130101); H05K 1/144 (20130101); H05K
7/1492 (20130101); H05K 7/1452 (20130101); H05K
7/1441 (20130101); H05K 7/1489 (20130101); H05K
2201/2018 (20130101); H05K 2201/042 (20130101); H05K
2201/10424 (20130101); H05K 2201/10409 (20130101); H05K
2201/10189 (20130101) |
Current International
Class: |
H01R
13/518 (20060101); H05K 7/14 (20060101); H05K
1/14 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Extended European Search Report for EP Application No. 19185505.5,
dated Jan. 30, 2020. cited by applicant.
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Primary Examiner: Chowdhury; Rockshana D
Attorney, Agent or Firm: Nixon Peabody LLP Lu; Zhou
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application claims priority under 35 U.S.C. .sctn. 119 to U.S.
Provisional Application No. 62/723,253, entitled "CONVERTIBLE
MODULE BRIDGE BOARDS ARRAY DESIGN", and filed on Aug. 27, 2018. The
contents of that application are hereby incorporated by reference
in their entirety.
Claims
What is claimed is:
1. A device for connecting electronic components, comprising: a
frame member having a back panel and a pair of sides extending from
the back panel; a connecting member attached to one of the sides of
the frame member, thereby forming a connection module, the
connection module being configured to physically and electrically
connect a first electronic component with a second electronic
component; an array bracket having a back side configured to at
least partially receive the connection module by the back panel of
the frame member being in contact with the back side of the array
bracket, the array bracket further configured to at least partially
receive a plurality of additional connection modules; and a first
electrical port and a second electrical port coupled to the array
bracket, wherein the first electrical port is operable to supply
electrical power through the device to the first electronic
component.
2. The device of claim 1, wherein each of the plurality of
additional connection modules is the same as the connection
module.
3. The device of claim 1, wherein the first electronic component is
the same as the second electronic component.
4. The device of claim 1, wherein the first electronic component is
a storage device and the second electronic component is processing
device.
5. The device of claim 1, wherein the connecting member includes
one or more printed circuit boards.
6. The device of claim 1, wherein the connecting member includes
two printed circuit boards coupled together via the frame
member.
7. The device of claim 1, wherein a first one of the plurality of
additional connection modules is configured to bridge two of a
first type of electronic component, and wherein a second one of the
plurality of additional connection modules is configured to bridge
two of a second type of electronic component, the first type of
electronic component being different from the second type of
electronic component.
8. The device of claim 1, wherein the connecting member includes a
first electrical connector configured to receive the first
electronic component, and a second electrical connector configured
to receive the second electronic component.
9. The device of claim 1, wherein the connecting member is
electrically coupled with the first electrical port and the second
electrical port responsive to the array bracket receiving the
connection module.
10. The device of claim 9, wherein the connecting member includes a
first electrical connector and a second electrical connector, and
wherein the first electrical connector of the connecting member is
electrically connected to the first electrical port and the second
electrical connector of the connecting member is electrically
connected to the second electrical port responsive to the array
bracket receiving the connection module.
11. The device of claim 1, wherein the connection module is
configured to bridge the first electronic component and the second
electronic component such that the first electronic component can
transmit data to or receive data from the second electronic
component.
12. A device for connecting electronic components, comprising: a
plurality of frame members, each of the frame members having a back
panel and a pair of sides extending from the back panel; a
plurality of connecting members, each of the plurality of
connecting members attached to one of the sides of a respective one
of the plurality of frame members, thereby forming a plurality of
connection modules configured to receive a plurality of electronic
components, each of the plurality of connection modules being
configured to physically and electrically connect a respective
first one of the plurality of electronic components and a
respective second one of the plurality of electronic components; an
array bracket having a back side configured to receive the
plurality of connection modules by the back panel of each of the
frame members being in contact with the back side of the array
bracket; and a first electrical port and a second electrical port
coupled to the array bracket, wherein the first electrical port is
operable to supply electrical power through the device to the first
electronic component.
13. The device of claim 12, wherein each of the plurality of
connecting members is electrically connected to the first
electrical port and the second electrical port.
14. The device of claim 13, wherein the plurality of connecting
members is configured to electrically connect each of the
respective first ones of the plurality of electronic components to
the first electrical port, and wherein the plurality of connecting
members is configured to connect each of the respective second ones
of the plurality of electronic components to the second electrical
port.
15. A system for connecting electronic components, comprising: a
housing; a plurality of electronic components mounted within the
housing; and a bridge array mounted within the housing, the bridge
array including: a plurality of frame members, each of the frame
members having a back panel and a pair of sides extending from the
back panel; a plurality of connecting members, each of the
plurality of connecting members attached to one of sides of a
respective one of the plurality of frame members, thereby forming a
plurality of connection modules, each of the plurality of
connection modules being configured to physically and electrically
connect a respective first one of the plurality of electronic
components and a respective second one of the plurality of
electronic components; an array bracket having a back side
configured to receive the plurality of connection modules by the
back panel of each of the frame members being in contact with the
back side of the array bracket; and a first electrical port and a
second electrical port coupled to the array, bracket, wherein the
first electrical port is operable to supply electrical power to at
least one of the plurality of electronic components.
16. The system of claim 15, wherein the housing is configured to
slidably receive the plurality of electronic components within the
housing.
17. The system of claim 15, wherein the bridge array is fixedly
secured to the housing.
18. The system of claim 15, wherein the housing is configured to
slidably receive the bridge array within the housing.
Description
TECHNICAL FIELD
The present disclosure relates generally to computing devices, and
specifically to bridging two or more electronic components within a
computing device.
BACKGROUND
Servers and other computing devices generally include a variety of
different electronic components within a housing. For example, a
server can include processing devices such as a central processing
unit (CPU) or a graphics processing unit (GPU), hard drives,
networking or communication components, memory devices, etc. These
devices can be mounted in their own individual housings, or can be
part of a printed circuit board assembly (PCBA). Depending on the
specific needs of the system, pairs of electronic components can be
electrically connected to allow for the exchange data with each
other. However, for certain computing devices, individual
connectors between electronic components can often provide an
insufficient data transfer rate due to a lack of signal pins, and
can present signal integrity issues. For example, high-end systems
(such as a graphics processing system), require very large data
transfer rates which individual connectors cannot handle.
Individual connectors can also pose difficulties when attempting to
precisely align a number of components or PCBAs within the housing.
It can be difficult to position the connectors in the proper
alignment, and movement of any of the components can potentially
cause mechanical failures in the individual connectors. Thus, the
electronic components and PCBAs within a computing device must be
interconnected (as needed) in a manner that provides an acceptable
level of signal integrity and an acceptable data transfer rate. The
interconnection must also ensure the physical integrity of the
components and the connections. The present disclosure is directed
to solving these and other problems.
SUMMARY
The various examples of the present disclosure are directed towards
devices and systems for connecting electronic components. In a
first embodiment of the present disclosure, a device for connecting
electronic components comprises a frame member, a connecting
member, and an array bracket. The connecting member is coupled to
the frame member to form a connection module. The connection module
is configured to physically and electrically connect a first
electronic component with a second electronic component. The array
bracket is configured to at least partially receive the connection
module, and further configured to at least partially receive a
plurality of additional connection modules.
In some examples of the first embodiment, each of the plurality of
additional connection modules is the same as the connection
modules.
In some examples of the first embodiment, the first electronic
component is the same as the second electronic component.
In some examples of the first embodiment, the first electronic
component is a storage device and the second electronic component
is processing device.
In some examples of the first embodiment, the connecting member
includes one or more printed circuit boards.
In some examples of the first embodiment, the connecting member
includes two printed circuit boards coupled together via the frame
member.
In some examples of the first embodiment, a first one of the
plurality of additional connection modules is configured to bridge
two of a first type of electronic component, and a second one of
the plurality of additional connection modules is configured to
bridge two of a second type of electronic component, the first type
of electronic component being different from the second type of
electronic component.
In some examples of the first embodiment, the connecting member
includes a first electrical connector configured to receive the
first electronic component, and a second electrical connector
configured to receive the second electronic component.
In some examples of the first embodiment, the device further
comprises a first electrical port and a second electrical port
coupled to the array bracket.
In some examples of the first embodiment, the connecting member is
electrically coupled with the first electrical port and the second
electrical port responsive to the array bracket receiving the
connection module.
In some examples of the first embodiment, the connecting member
includes a first electrical connector and a second electrical
connector.
In some examples of the first embodiment, the first electrical
connector of the connecting member is electrically connected to the
first electrical port and the second electrical connector of the
connecting member is electrically connected to the second
electrical port responsive to the array bracket receiving the
connection module.
In some examples of the first embodiment, the connection module is
configured to bridge the first electronic component and the second
electronic component such that the first electronic component can
transmit data to or receive data from the second electronic
component.
In a second embodiment of the present disclosure, a device for
connecting electronic components includes a plurality of frame
members, a plurality of connecting members, and an array bracket.
Each of the plurality of connecting members is coupled to a
respective one of the plurality of frame members to form a
plurality of connection modules. The plurality of connection
modules is configured to receive a plurality of electronic
components. Each of the plurality of connection modules is
configured to physically and electrically connect a respective
first one of the plurality of electronic components and a
respective second one of the plurality of electronic components.
The array bracket is configured to receive the plurality of
connection modules.
In some examples of the second embodiment, the device further
comprises a first electrical port and a second electrical port.
In some examples of the second embodiment, each of the plurality of
connecting members is electrically connected to the first
electrical port and the second electrical port.
In some examples of the second embodiment, the plurality of
connecting members is configured to electrically connect each of
the respective first ones of the plurality of electronic components
to the first electrical port.
In some examples of the second embodiment, the plurality of
connecting members is configured to electrically connect each of
the respective second ones of the plurality of electronic
components to the second electrical port.
In a third embodiment of the present disclosure, a system for
connecting electronic components includes a housing, a plurality of
electronic components mounted within the housing, and a bridge
array mounted within the housing. The bridge array includes a
plurality of frame members, a plurality of connecting members, and
an array bracket. Each of the plurality of connecting members is
coupled to a respective one of the plurality of frame members to
form a plurality of connection modules. The plurality of connection
modules is configured to receive a plurality of electronic
components. Each of the plurality of connection modules is
configured to physically and electrically connect a respective
first one of the plurality of electronic components and a
respective second one of the plurality of electronic components.
The array bracket is configured to receive the plurality of
connection modules.
In some examples of the third embodiment, the housing is configured
to slidably receive the plurality of electronic components within
the housing.
In some examples of the third embodiment, the bridge array is
fixedly secured to the housing.
In some examples of the third embodiment, the housing is configured
to slidably receive the bridge array within the housing.
The above summary is not intended to represent each embodiment or
every aspect of the present disclosure. Rather, the foregoing
summary merely provides an ex ample of some of the novel aspects
and features set forth herein. The above features and advantages,
and other features and advantages of the present disclosure, will
be readily apparent from the following detailed description of
representative embodiments and modes for carrying out the present
invention, when taken in connection with the accompanying drawings
and the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The disclosure will be better understood from the following
description of exemplary embodiments together with reference to the
accompanying drawings.
FIG. 1A is a perspective view of a first side of a bridge array,
according to some aspects of the present disclosure;
FIG. 1B is a perspective view of a second side of the bridge array
of FIG. 1A, according to some aspects of the present
disclosure;
FIG. 2A is a perspective view of a first implementation of a
connection module for use with the bridge array of FIG. 1A,
according to some aspects of the present disclosure;
FIG. 2B is an exploded perspective view of the implementation of
the connection module of FIG. 2A, according to some aspects of the
present disclosure;
FIG. 2C is a perspective view of an implementation of securing the
connection module of FIG. 2A to an array bracket, according to some
aspects of the present disclosure;
FIG. 3A is a perspective view of the bridge array of FIG. 1A being
fixedly secured within the housing of a computing device, according
to some aspects of the present disclosure;
FIG. 3B is a perspective view of one or more electronic components
being inserted into the housing of FIG. 3A, according to some
aspects of the present disclosure;
FIG. 4 is a perspective view of the bridge array of FIG. 1A being
slidably coupled within the housing of a computing device,
according to some aspects of the present disclosure;
FIG. 5A is a perspective view of the bridge array of FIG. 1A with a
second implementation of a connection module, according to some
aspects of the present disclosure; and
FIG. 5B is a perspective view of the bridge array of FIG. 1A with a
third implementation of a connection module, according to some
aspects of the present disclosure. The present disclosure is
susceptible to various modifications and alternative forms. Some
representative embodiments have been shown by way of example in the
drawings and will be described in detail herein. It should be
understood, however, that the invention is not intended to be
limited to the particular forms disclosed. Rather, the disclosure
is to cover all modifications, equivalents, and alternatives
falling within the spirit and scope of the invention as defined by
the appended claims.
DETAILED DESCRIPTION
The present inventions can be embodied in many different forms.
Representative embodiments are shown in the drawings, and will
herein be described in detail. The present disclosure is an example
or illustration of the principles of the present disclosure, and is
not intended to limit the broad aspects of the disclosure to the
embodiments illustrated. To that extent, elements, and limitations
that are disclosed, for example, in the Abstract, Summary, and
Detailed Description sections, but not explicitly set forth in the
claims, should not be incorporated into the claims, singly or
collectively, by implication, inference, or otherwise. For purposes
of the present detailed description, unless specifically
disclaimed, the singular includes the plural and vice versa; and
the word "including" means "including without limitation."
Moreover, words of approximation, such as "about," "almost,"
"substantially," "approximately," and the like, can be used herein
to mean "at," "near," or "nearly at," or "within 3-5% of," or
"within acceptable manufacturing tolerances," or any logical
combination thereof, for example.
FIG. 1A shows a bridge array 10 for bridging two or more electronic
components within a system, such as a server or other computing
device. FIG. 1B shows the bridge array 10 from the opposite side of
the bridge array 10. Generally, the bridge array 10 and the
electronic components (FIGS. 3B and 4) will be located within a
housing (FIGS. 3A-4). The bridge array 10 includes an array bracket
11 and a plurality of connection modules 12A-12F. Each of the
connection modules 12A-12F is configured to be coupled to the array
bracket 11. As shown in FIG. 1A, the connection modules 12A-12F are
configured to be received at least partially within an interior
space 19 defined by the array bracket 11.
As further shown in FIG. 1A, the connection modules 12A-12F include
a plurality of electrical connectors 14A-14L, that are used to
connect electronic components. Generally, each of the connection
modules 12A-12F include two of the electrical connectors 14A-14L.
In this arrangement, two electronic components can be connected to
or plugged into each of the connection modules 12A-12F. In some
implementations, the electrical connectors 14A-14L provide a USB
connection, a PCIE connection, an RF connection, a Digital Visual
Interface (DVI) connection, a DisplayPort connection, a SATA
connection, an mSata connection, an eSATA connection, a PS/2
connection, a serial connection, a DE-9 connection, an SCSI
connection, an SAS connection, a power connection, a U.2
connection, an M.2 connection, or any other suitable electrical
connection.
Each connection module 12A-12F is generally made of one or more
customizable printed circuit boards. The connection modules 12A-12F
are configured to bridge the two electric components that are
connected to each of the connection modules 12A-12F. Thus, two
electronic components can be plugged into or otherwise connected to
each of the connection modules 12A-12F to physically and
electrically couple the two electronic components together.
Generally, any two electronic components that are connected to one
of the connection modules 12A-12F can communicate with each other
by sending or receiving data via the one connection module and its
associated electrical connectors.
By using printed circuit boards, the connection modules 12A-12F can
generally provide more data channels between the two electronic
components connected to any one of the connection modules 12A-12F.
This allows for more data to be transferred between two electronic
components, and/or for data to be transferred between the two
electronic components at a higher rate. Moreover, the printed
circuit boards of the connection modules 12A-12F can provide
precise alignments for high-density connectors. This can prevent
pins from being misaligned during the mating process. And because
all of the necessary connections are integrated into the connection
modules, the process of physically connecting different components
is simplified.
Further, the use of the connection modules 12A-12F allows for
greater cross-interface compatibility. Different components may
have different interfaces. Standard methods of connecting these
components may require the use of adaptors that can occupy large
amounts of space and may transfer data at slower rates. By using
the connection modules 12A-12F with customer circuit boards, two
components with different interfaces can much more easily be
connected to each other.
In other implementations, any number of electronic components can
be bridged to provide communication between the electronic
components. For example, in some implementations, one or more of
the connection modules 12A-12F are configured to connect with three
or more electronic components. In this implementation, any of the
three or more electronic components can be configured to send data
to, or receive date from, any other of the three or more electronic
components. Generally, the connection modules 12A-12F are
customizable depending on the specific needs of the computing
device that is being utilized.
Each of the connection modules 12A-12F can be coupled or attached
to the array bracket 11. This connection provides mechanical
stability to the connection modules 12A-12F and any electronic
components connected to the connection modules 12A-12F. The
connection modules 12A-12F can be attached to the array bracket 11
using a variety of methods. In some implementations, the connection
modules 12A-12F are attached to the array bracket 11 using one or
more fasteners. FIG. 1A shows fasteners 22A and 22B that are used
to attach connection modules 12A to the array bracket 11. Any of
the fasteners, including fasteners 22A and 22B, can include screws,
bolts, pins, clips, etc. In other implementations, the connection
modules 12A-12F may be attached to the array bracket 11 via a
snap-fit or press-fit connection. Other methods of physically
attaching the connection modules 12A-12F to the array bracket 11
can also be used.
As illustrated in both FIG. 1A and FIG. 1B, the bridge array 10
further includes two electrical ports 20A (FIG. 1B) and 20B. The
electrical ports 20A, 20B provide a common electrical connection to
two or more of the electronic components. The electrical ports 20A,
20B can be electrically connected directly to the electronic
components, or through the connection modules 12A-12F. The
electrical ports 20A, 20B are generally positioned on a side of the
array bracket 11 opposite the connection modules 12A-12F. The
electrical ports 20A, 20B are configured to be electrically
connected to the electrical connectors 14A-14L of the connection
modules 12A-12F when the connection modules 12A-12F are received by
the array bracket 11. By then connecting the electronic components
to the electrical connectors 14A-14L of the connection modules
12A-12F, an electrical connection between the electrical ports 20A,
20B and the electronic components is created.
In one implementation, each of the electrical ports 20A, 20B is
electrically connected to only one of the electrical connectors of
each of the connection modules 12A-12F. In this implementation, the
electrical port 20A is electrically connected to only the
electrical connectors 14A, 14C, 14E, 14G, 14I, 14K. The electrical
port 20B is electrically connected to only the electrical
connectors 14B, 14D, 14F, 14H, 14J, 14L. In this manner, the
electrical port 20A can thus be electrically connected to only the
"top" electronic components that are connected to the connection
modules 12A-12F. The electrical port 20B can correspondingly be
electrically connected to only the "bottom" electronic components
that are connected to the connection modules 12A-12F.
Other implementations can provide different electrical connections
between the electrical ports 20A, 20B and the electrical connectors
14A-14L. For example, one of the electrical ports 20A, 20B can be
configured to be electrically connected with electrical connectors
14A-14F, e.g., the electrical connectors of the "left" connection
modules 12A-12C. The other one of the electrical ports 20A, 20B can
be configured to be electrically connected with electrical
connectors 14G-14L, e.g., the electrical connectors of the "right"
connection modules 12D-12F. In still other implementations, both
electrical ports 20A, 20B are connected to each of the electrical
connectors 14A-14L. Other configurations of electrical connections
between the electrical ports 20A, 20B and the connection modules
12A-12F are also possible.
The electrical ports 20A, 20B are thus configured to provide a
common connection to two or more of the electronic components
connected to the connection modules 12A-12F. In some
implementations, one or both of the electrical ports 20A, 20B can
be used to provide power to the electronic components connected to
the connection modules 12A-12F. In other implementations, one or
both of the electrical ports 20A, 20B can be used to provide data
to the electronic components connected to the connection modules
12A-12F. In still other implementations, one of the electrical
ports 20A, 20B provides power to some or all of the electronic
components, while the other one of the electrical ports 20A, 20B
provides data to some or all of the electronic components.
The electrical ports 20A, 20B can generally utilize any type of
electrical connection or interface. For example, the electrical
ports 20A, 20B can be USB ports, PCIe ports, standard power
connectors, power bus bars. etc.
In some implementations, the connection modules 12A-12F are
automatically electrically connected directly to the electrical
ports 20A, 20B once the connection modules 12A-12F are coupled to
the array bracket 11. For example, each of the connection modules
12A-12F may include electrically conductive portions that
electrically connect the connection modules 12A-12F to the
electrical ports when the connection modules 12A-12F are coupled to
the array bracket 11. In other implementations, the connection
modules 12A-12F are configured to be electrically connected to the
electrical ports 20A, 20B via an electrically conductive component
that is coupled to or formed with the array bracket 11. For
example, the array bracket 11 may include a number of small printed
circuit boards containing electrical traces that are mounted to the
array bracket 11. When the connection modules 12A-12F are received
by the array bracket 11, the connection modules 12A-12F form
electrical connections to the electrical ports 20A, 20B via
individual ones of the small printed circuit boards. The electrical
traces can also be integrally formed with the array bracket 11. In
other implementations, the connection modules 12A-12F may be
electrically connected to the electrical ports 20A, 20B via wires
mounted to the array bracket 11.
In still other implementations, the array bracket 11 may utilize
different types of switches to electrically connect the individual
components to the electrical ports 20A, 20B via the connection
modules 12A-12F. For example, manually operated switches can be
disposed anywhere in or around the array bracket 11. Each
individual switch can be configured to connect one or more of the
connection modules 12A-12F to one or both of the electrical ports
20A, 20B via any type of electrically conductive path described
above, or by itself. The switches can have a manually-operable
actuator, such as a push-button, a lever, a rotary shaft, a toggle,
a rocker, etc. The actuator of the switches is generally accessible
to a user while the electrical components connected to the array
bracket 11 are in use. Once the connection modules 12A-12F are
inserted into the array bracket 11, the user can actuate any of the
switches to connect a desired one of the connection modules 12A-12F
to the electrical ports 20A, 20B.
Detection switches can also be used to automatically connect the
connection modules 12A-12F to the electrical ports 20A, 20B. These
switches can be configured to detect either insertion of the
connection modules 12A-12F into the array bracket 11, or the
connection of the electronic components to the connection modules
12A-12F. In some implementations, the detection switches have a
physical actuator that is pressed, turned, toggled, or otherwise
activated in response to the connection modules 12A-12F being
inserted into the array bracket 11. Alternatively, the detection
switches may be activated in response to the electronic components
to the connection modules 12A-12F.
For example, the detection switches may be located within the array
bracket 11 and have a push-button actuator. When the connection
modules 12A-12F are inserted into their slots in the array bracket
11, the connection modules 12A-12F physically press the push-button
of the detection switches. The activated switches thus complete the
electrical connection between the connection modules 12A-12F and
the electrical ports 20A, 20B. In still other implementations, the
detection switches may be optical or magnetic switches that detect
the presence of the connection modules 12A-12F or the individual
electronic components and connect the connection modules 12A-12F to
the electrical ports 20A, 20B.
FIG. 2A shows a magnified view of one of the connection modules
12A, while FIG. 2B shows an exploded view of the connection module
12A. The connection module 12A generally comprises a first
connecting member portion 17A and a second connecting member
portion 17B that are coupled to a frame member 13. The connecting
member portions 17A, 17B are printed circuit boards that are
configured to attach to either side of the frame member 13 via
fasteners 24A-24D. Fasteners 24A-24D can include screws, bolts,
pins, clips, or any other suitable type of fastener. The connecting
member portions 17A, 17B can also be configured to couple with the
frame member 13 via a snap-fit or press-fit connection.
In some implementations, only the frame member 13 is secured to the
array bracket 11 (FIGS. 1A and 1B) in order to couple the
connection module 12A to the array bracket 11. In other
implementations, only the connecting member portions 17A, 17B are
secured to the array bracket. In still other implementations, both
the frame member 13 and the connecting member portions 17A, 17B are
secured to the array bracket.
As shown in FIG. 2B, each of the connecting member portions 17A,
17B include two electrical connector portions. Connecting member
portion 17A includes electrical connector portions 15A and 15C.
Connecting member portion 17B includes electrical connector
portions 15B and 15D. When the connecting member portions 17A, 17B
are coupled to the frame member 13, as shown in FIG. 2A, electrical
connector portions 15A and 15B form electrical connector 14A, while
electrical connector portions 15C and 15D form electrical connector
14B. Once the connection module 12A is assembled, the connection
module 12A can be mounted in the array bracket 11 (FIGS. 1A and
1B).
In some implementations, the frame member 13 is made of an
electrically insulating material and acts as a passive structural
device. In these implementations, the connecting member portions
17A, 17B provide any necessary electrical connections between
electronic components (FIGS. 3B and 4) and/or to the electrical
ports of the array bracket (FIGS. 1A and 1B). In other
implementations, the frame member 13 can include electrically
conductive portions that assist in electrically connecting
electronic devices to each other and/or to the electrical ports of
the array bracket.
FIG. 2C shows an implementation for securing one of the connection
modules 12A to the array bracket 11. In this implementation, the
frame member 13 includes a pair fastener portions 16A and 16B. The
fastener portions 16A, 16B extend from the frame member 13 toward
the array bracket 11. The array bracket 11 defines a corresponding
pair of fastener apertures 18A, 18B. The fastener apertures 18A,
18B are configured to mate with the fastener portions 16A, 16B of
the frame member 13 to secure the connection modules 12A to the
array bracket 11.
The fastener portions 16A, 16B are generally configured to snap
into the fastener apertures 18A, 18B responsive to being pressed
against the fastener apertures 18A, 18B. In other implementations
however, the fastener portions 16A, 16B may be screwed into the
fastener apertures 18A, 18B. In still other implementations, a
separate component may attach to the fastener portions 16A, 16B on
the opposite side of the array bracket 11 as the fastener portions
16A, 16B extend through the fastener apertures 18A, 18B. While FIG.
2C shows two fastener portions 16A, 16B and two fastener apertures
18A, 18B, each of the connection modules may have any number of
fastener portions. The array bracket 11 may have any number of
corresponding fastener apertures.
Any number of other types of mechanisms may also be used to secure
the connection modules to the array bracket. For example, the
connection modules may utilize latches or levers to secure the
connection modules to the array bracket. The connection modules can
also be configured to couple to the array bracket via a friction
fit. The connection modules can also be secured to the array
bracket using screws, nails, pins, bolts, clamps, etc.
FIGS. 3A and 3B show an implementation of a computing device 25
that can house the electronic components and the bridge array. The
computing device 25 can be a server in some implementations. The
computing device 25 includes a housing 26 in which the array
bracket 11, the connection modules 12A-12F, and a number of
electronic components 30 (FIG. 3B) can be placed. As shown in FIG.
3A, the array bracket 11 and the connection modules 12A-12F can be
placed inside the housing 26 and secured to the housing 26. The
array bracket 11 can be secured to the housing 26 using any
suitable mechanism, such as screws, bolts, pins, clips, etc. FIGS.
3A and 3B thus show the bridge array 10 (including array bracket 11
and connection modules 12A-12F) acting as a stationary terminal for
the electronic components. The computing device can generally be
any type of computing device, such as standard computers or
servers. In addition, any device involving large amounts of data
and/or power transfer can generally benefit from this design, such
as a power switch board or a mobile data/power center.
As shown in FIG. 3B, once the array bracket 11 and connection
modules 12A-12F have been placed within the housing 26, component
trays 28A, 28B containing one or more electronic components 30 can
be slidably inserted into the housing 26. As the component trays
28A, 28B are inserted into the housing 26, the one or more
electronic components 30 connect to the electrical connectors (FIG.
1A) of the connection modules 12A-12F. In some implementations, the
bridge array 10 is accessible from the rear of the housing 26. One
or more power supplies 34 can be mounted to the housing 26 and can
be used to provide power to one or more of the electronic
components 30, via the electrical ports in the bridge array 10.
FIG. 4 shows another implementation of a computing device 25 that
houses the electronic components and the bridge array. In this
implementation, the bridge array 10 (including array bracket 11 and
connection modules 12A-12F) can be slidably coupled to the housing
26. In this implementation, the bridge array 10 is generally not
fixedly secured within the housing 26 as in FIGS. 3A and 3B.
Rather, the bridge array 10 in FIG. 4 is configured to be easily
inserted into and removed from the housing 26 as needed. In this
implementation, electronic components 32A-32E are generally placed
into the housing 26 from one end of the housing 26. The bridge
array 10 is then inserted into the housing 26 from the other end to
connect the electronic components 32A-32E to the electrical
connectors (FIG. 1A) of the connection modules 12A-12F. This
configuration allows the bridge array 10 to be easily removed from
the housing 26. FIG. 4 thus shows the bridge array 10 acting as a
retractable terminal for the electronic components.
In the implementation of FIG. 4, the housing 26 can include one or
more power supplies 34 mounted to the exterior of the housing 26.
One or more of the power supplies 34 can be electrically connected
to either of the electrical ports 20A, 20B of the bridge array 10
to provide power to any of the electronic components 32A-32E. In
some implementations, the power supplies 34 can be electrically
connected to a power supply board (power supply PCB) that is
mounted within the housing 26. The power supply board can then be
connected using power cables to the electrical ports 20A, 20B of
the bridge array 10.
FIGS. 5A and 5B show additional implementations of the bridge
array. In the bridge array 40A illustrated in FIG. 5A, the
connecting member of each connection module is an add-on card
connector 42. The add-on card connectors 42 are secured to frame
pieces to form the connection modules, which are then coupled to
the array bracket 11 to form the bridge array 40A. The add-on card
connectors 42 can be used to connect to a variety of different
electronic components of the computing device that are provided on
add-on cards.
In the bridge array 40B, illustrated in FIG. 5B, the connecting
member of each connection module is a cable connector 44. The cable
connectors 44 are secured to frame pieces to form the connection
modules, which are then coupled to the array bracket 11 to from the
bridge array 40B. The cable connectors 44 can be used to connect
any electronic components that have a cable connection.
The various implementations of the bridge array as shown herein
offer greater mechanical stability to the electronic components
located within the computing device. By bridging all of the
electronic components using connection modules that are coupled to
a single array bracket, all of the electronic components are
physically secured to a single structure that can be configured to
not move within the housing. This configuration provides more
mechanical stability than individual bridge connectors between two
components that are not secured to a larger structure.
The bridge array can also be customized depending on the specific
requirements of the computing device. For example, in some
implementations, the bridge array can include at least one
connection module, as illustrated in FIGS. 2A and 2B, and at least
one of a different type of connection module, such as the
connection modules illustrated in FIG. 5A and FIG. 5B. In other
implementations, the bridge array only includes a single type of
connection modules.
The bridge array can be used to bridge a variety of different
devices. In some implementations, a connection module can be used
to bridge two or more of the same type of electronic component. In
other implementations, a connection module can be used to bridge
two different types of electronic components, for example a storage
device (such as a hard drive) and a processing device. Further, an
individual connection module can be used to bridge any number of
electronic components. In some implementations, an individual
connection module may be connected to only one electronic
component. The connection module thus provides mechanical stability
to the electronic component and can electrically connect the
electronic component to one of the electrical ports of the bridge
array. In this implementation however, the connection module does
not connect the electronic component to any other electronic
components.
The terminology used herein is for the purpose of describing
particular embodiments only, and is not intended to be limiting of
the invention. As used herein, the singular forms "a," "an," and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. Furthermore, to the extent
that the terms "including," "includes," "having," "has," "with," or
variants thereof, are used in either the detailed description
and/or the claims, such terms are intended to be inclusive in a
manner similar to the term "comprising."
Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art. Furthermore, terms,
such as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art, and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
While various embodiments of the present invention have been
described above, it should be understood that they have been
presented by way of example only, and not limitation. Numerous
changes to the disclosed embodiments can be made in accordance with
the disclosure herein, without departing from the spirit or scope
of the invention. Thus, the breadth and scope of the present
invention should not be limited by any of the above described
embodiments. Rather, the scope of the invention should be defined
in accordance with the following claims and their equivalents.
Although the invention has been illustrated and described with
respect to one or more implementations, equivalent alterations, and
modifications will occur or be known to others skilled in the art
upon the reading and understanding of this specification and the
annexed drawings. In addition, while a particular feature of the
invention may have been disclosed with respect to only one of
several implementations, such feature may be combined with one or
more other features of the other implementations as may be desired
and advantageous for any given or particular application.
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