U.S. patent number 10,656,684 [Application Number 16/532,431] was granted by the patent office on 2020-05-19 for method to recover permanent set in a foldable display.
This patent grant is currently assigned to Motorola Mobility LLC. The grantee listed for this patent is MOTOROLA MOBILITY LLC. Invention is credited to Alberto Cavallaro, Charles Wood.
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United States Patent |
10,656,684 |
Wood , et al. |
May 19, 2020 |
Method to recover permanent set in a foldable display
Abstract
A method, electronic device, and computer program product for
countering a semi-permanent deformation at an area of a foldable
display. The method includes detecting when a display-having at
least one hinge area that bends or folds, is placed in an angled
position, and in response to the display being placed in the angled
position, monitoring a time duration during which the display is in
the angled position. The method further includes, in response to
the display being placed in a fully-opened position after being in
the angled position, calculating a degree of semi-permanent
deformation associated with the at least one area of the display,
in part based on the time duration, and triggering an increase in
temperature at the at least one area of the display to counter the
degree of semi-permanent deformation.
Inventors: |
Wood; Charles (Highland Park,
IL), Cavallaro; Alberto (Northbrook, IL) |
Applicant: |
Name |
City |
State |
Country |
Type |
MOTOROLA MOBILITY LLC |
Chicago |
IL |
US |
|
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Assignee: |
Motorola Mobility LLC (Chicago,
IL)
|
Family
ID: |
62490123 |
Appl.
No.: |
16/532,431 |
Filed: |
August 5, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20190361504 A1 |
Nov 28, 2019 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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15375986 |
Dec 12, 2016 |
10409335 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F
1/206 (20130101); G06F 1/1616 (20130101); G06F
1/1677 (20130101); G05D 23/1917 (20130101); G05D
23/19 (20130101); G06F 1/1652 (20130101); G06F
1/1681 (20130101); G06F 1/1641 (20130101) |
Current International
Class: |
G05D
23/00 (20060101); G06F 1/16 (20060101); G05D
23/19 (20060101); G06F 1/20 (20060101) |
Field of
Search: |
;700/300 |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Osswald, Tim, "Understanding Polymer Processing", Chapter 2:
Mechanical Behavior of Polymers, Hanser Publishers (2010),
Cincinnati. cited by applicant.
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Primary Examiner: Vu; Vu A
Attorney, Agent or Firm: Yudell Isidore PLLC
Parent Case Text
RELATED APPLICATION
This application is a continuation of U.S. patent application Ser.
No. 15/375,986, filed Dec. 12, 2016, the content of which is fully
incorporated herein by reference.
Claims
What is claimed is:
1. An electronic device, comprising: a display capable of being
bent into one or more angled positions and returned to a straight
orientation position; a thermal element used for applying an
increase in temperature within at least one area of the display;
and a control module in communication with the thermal element and
which: identifies when the display is placed in an angled position;
in response to the display being placed in the angled position,
monitors a time duration during which the display is in the angled
position; and in response to the display being placed in a
fully-opened position after being in the angled position,
calculates a semi-permanent deformation associated with the at
least one area of the display, in part based on the time duration;
and controls the thermal element to provide an increase in
temperature at the at least one area of the display to counter the
semi-permanent deformation at the at least one area of the
display.
2. The electronic device of claim 1, further comprising: a
temperature measuring component that measures and reports a
temperature associated with at least one area of the display while
the display is in an angled position; wherein the controller
calculates the semi-permanent deformation and provides the increase
in temperature, in part based on the temperature associated with at
least one area of the display while the display is in the angled
position.
3. The electronic device of claim 1, wherein the increase in
temperature at the at least one area of the display is triggered
when a preset time duration, associated with the time duration the
display is in the angled position, elapses.
4. The electronic device of claim 1, wherein the heat generating
subsystem includes a thermal element proximate to the at least one
area of the display.
5. The electronic device of claim 4, wherein the thermal element
dynamically applies a selected temperature to the at least one area
of the display for a calculated length of time.
6. The electronic device of claim 5, wherein the display includes
at least one polymer layer and the calculated length of time is a
relaxation time associated with a stress relaxation modulus value
retrieved from stored stress relaxation data of the at least one
polymer layer when heated at the selected temperature.
7. The electronic device of claim 1, wherein the temperature is
applied to the semi-permanent deformation when the display is in a
fully open state and the display is not in use.
8. The electronic device of claim 1, wherein the heat generating
subsystem comprises a heat generating source that is isolated from
at least one of the display and the hinge while at least one of (i)
the display is in use and (ii) the display is not in a fully open
state.
9. A method comprising: detecting, via a detection module, when a
display, having at least one hinge area that bends or folds, is
placed in an angled position; and in response to the display being
placed in the angled position with respect to a device casing:
monitoring a time duration during which the display is in the
angled position; in response to the display being placed in a
fully-opened position after being in the angled position,
calculating a degree of semi-permanent deformation associated with
the at least one area of the display, in part based on the time
duration; and triggering an increase in temperature at the at least
one area of the display to counter the degree of semi-permanent
deformation.
10. The method of claim 9, further comprising: triggering the
increase in temperature in response to an elapsed amount of time
the display is in the angled position being greater than a
calculated period of time.
11. The method of claim 9, further comprising: monitoring
characteristics including at least one of the temperature, an
applied strain, and stress at the at least one area of the display;
and calculating the temperature and a corresponding temperature
application time required to counter the degree of semi-permanent
deformation at the at least one area of the display based on the
monitored characteristics.
12. The method of claim 9, wherein the display is associated with
at least one polymer layer.
13. The method of claim 9, wherein a thermal element, associated
with at least one of the display and the at least one hinge, is
engaged to apply the temperature to the at least one area of the
display.
14. The method of claim 9, further comprising: identifying when the
display is in a fully open state and is inactive; and increasing
the temperature only in response to the display being in the fully
open state and is inactive.
15. The method of claim 9, wherein a fold is created in the display
when at least one of the hinge and the display is in an angled
position.
16. The method of claim 9, wherein the display is in an angled
position when the display is in at least one of a closed and a
partially open position.
17. The method of claim 9, wherein a thermal element is coupled to
at least one of the hinge and the display, and the method comprises
autonomously isolating the thermal element from the display in
response to at least one of (i) the display being in use and (ii)
the display being in a non-fully open state.
18. A computer program product comprising: a computer readable
storage device; and program code on the computer readable storage
device that when executed within a processor associated with a
device, the program code enables the device to provide a
functionality of: detecting when a display that is capable of being
placed in an angled position via at least one hinge area, is in the
angled position; and in response to the display being placed in the
angled position with respect to a device casing: monitoring a time
duration during which the display is in the angled position; in
response to the display being placed in a fully-opened position
after being in the angled position, calculating a degree of
semi-permanent deformation associated with the at least one area of
the display, in part based on the time duration; and triggering an
increase in temperature at the at least one area of the display to
counter the degree of semi-permanent deformation.
19. The computer program product of claim 18, further comprising:
monitoring at least one of the temperature, an applied strain, and
stress at the at least one area of the display to derive the
temperature and a corresponding temperature application time to
counter the degree of semi-permanent deformation at the at least
one area of the display; and triggering the increase in temperature
in response to an elapsed amount of time the display is in the
angled position being greater than a pre-established period of
time.
20. The computer program product of claim 18, further comprising:
engaging a thermal element, associated with at least one of the
display and the at least one hinge, to apply the temperature to the
at least one area of the display; increasing the temperature at a
time when the display is in a fully open state, and the display is
inactive; and autonomously isolating the thermal element from the
display in response to at least one of (i) the display being in use
and (ii) the display being in a non-fully open state.
Description
BACKGROUND
1. Technical Field
The present disclosure generally relates to electronic displays and
in particular to foldable electronic displays.
2. Description of the Related Art
Polymeric materials, commonly called plastics, demonstrate the
ability to sustain a higher strain than most metallic materials.
The ability to sustain higher strain is primarily due to the
amorphous or non-crystalline construction which allows the polymer
molecules to exhibit some flexibility and mobility when exposed to
positional strain. Plastics have become useful in applications
where metals and glass would fail. Applications such as electronic
displays, and more specifically, plastic organic light emitting
diode displays (OLED), have become a popular choice for integrating
into the design of mobile phones, digital cameras, virtual reality
headsets, tablets, laptops, and televisions. However, the ability
of polymeric materials to exhibit flexibility and mobility when
exposed to positional strain is negated by the damage incurred by
displays during multiple bending cycles and during exposure to long
periods of loading.
BRIEF DESCRIPTION OF THE DRAWINGS
The description of the illustrative embodiments is to be read in
conjunction with the accompanying drawings, wherein:
FIG. 1 provides a block diagram representation of an example data
processing system within which certain aspects of the disclosure
can be practiced, in accordance with one or more embodiments;
FIG. 2A illustrates a mobile device within which certain aspects of
the disclosure can be practiced, in accordance with one or more
embodiments;
FIG. 2B illustrates a display coupled to a controller associated
with the mobile device within which certain aspects of the
disclosure can be practiced, in accordance with one or more
embodiments;
FIG. 3 illustrates an example foldable display, according to one or
more embodiments;
FIG. 4 illustrates another example foldable display, in accordance
with one or more embodiments;
FIG. 5 illustrates an example foldable display coupled to a heat
generating subsystem that is configured to apply heat to an area of
the foldable display, according to one or more embodiments;
FIG. 6 is a flow chart illustrating a method for determining
whether to engage a heat generating subsystem to heat a
predetermined area of the foldable display, in accordance with one
or more embodiments; and
FIG. 7 is a flow chart illustrating a method for engaging the heat
generating subsystem to heat a predetermined area of the foldable
display, in accordance with one or more embodiments.
DETAILED DESCRIPTION
Disclosed are a method, electronic device, and computer program
product for countering a semi-permanent deformation at an area of a
foldable display. The method includes monitoring a time duration
that the display is in an angled/folded position. The method
further includes measuring a temperature associated with at least
one area of the display while the display is in the angled
position. In response to the display remaining in the angled
position for greater than a calculated period of time, the method
includes measuring a degree of semi-permanent deformation
associated with the at least one area of the display. The method
further includes triggering an increase in temperature at the at
least one area of the display to counter the degree of
semi-permanent deformation.
In the following description, specific example embodiments in which
the disclosure may be practiced are described in sufficient detail
to enable those skilled in the art to practice the disclosed
embodiments. For example, specific details such as specific method
orders, structures, elements, and connections have been presented
herein. However, it is to be understood that the specific details
presented need not be utilized to practice embodiments of the
present disclosure. It is also to be understood that other
embodiments may be utilized and that logical, architectural,
programmatic, mechanical, electrical and other changes may be made
without departing from general scope of the disclosure. The
following detailed description is, therefore, not to be taken in a
limiting sense, and the scope of the present disclosure is defined
by the appended claims and equivalents thereof.
References within the specification to "one embodiment," "an
embodiment," "embodiments", or "alternate embodiments" are intended
to indicate that a particular feature, structure, or characteristic
described in connection with the embodiment is included in at least
one embodiment of the present disclosure. The appearance of such
phrases in various places within the specification are not
necessarily all referring to the same embodiment, nor are separate
or alternative embodiments mutually exclusive of other embodiments.
Further, various features are described which may be exhibited by
some embodiments and not by others. Similarly, various aspects are
described which may be aspects for some embodiments but not other
embodiments.
The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the disclosure. As used herein, the singular forms "a", "an", and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
Moreover, the use of the terms first, second, etc. do not denote
any order or importance, but rather the terms first, second, etc.
are used to distinguish one element from another.
It is understood that the use of specific component, device and/or
parameter names and/or corresponding acronyms thereof, such as
those of the executing utility, logic, and/or firmware described
herein, are for example only and not meant to imply any limitations
on the described embodiments. The embodiments may thus be described
with different nomenclature and/or terminology utilized to describe
the components, devices, parameters, methods and/or functions
herein, without limitation. References to any specific protocol or
proprietary name in describing one or more elements, features or
concepts of the embodiments are provided solely as examples of one
implementation, and such references do not limit the extension of
the claimed embodiments to embodiments in which different element,
feature, protocol, or concept names are utilized. Thus, each term
utilized herein is to be provided its broadest interpretation given
the context in which that term is utilized.
Those of ordinary skill in the art will appreciate that the
hardware components and basic configuration depicted in the
following figures may vary. For example, the illustrative
components within the presented devices (100 and 200) are not
intended to be exhaustive, but rather are representative to
highlight components that can be utilized to implement the present
disclosure. For example, other devices/components may be used in
addition to, or in place of, the hardware depicted. The depicted
example is not meant to imply architectural or other limitations
with respect to the presently described embodiments and/or the
general disclosure.
Within the descriptions of the different views of the figures, the
use of the same reference numerals and/or symbols in different
drawings indicates similar or identical items, and similar elements
can be provided similar names and reference numerals throughout the
figure(s). The specific identifiers/names and reference numerals
assigned to the elements are provided solely to aid in the
description and are not meant to imply any limitations (structural
or functional or otherwise) on the described embodiments.
FIG. 1 illustrates a block diagram representation of an example
data processing system (DPS) 100, within which one or more of the
described features of the various embodiments of the disclosure can
be implemented. For example, a data processing system may be a
handheld device, personal computer, a server, a network storage
device, or any other suitable device and may vary in size, shape,
performance, functionality, and price.
Referring specifically to FIG. 1, example DPS 100 includes one or
more processor(s) 105 coupled to system memory 110 via system
interconnect 115. System interconnect 115 can be interchangeably
referred to as a system bus, in one or more embodiments. Also
coupled to system interconnect 115 is storage 120 within which can
be stored one or more software and/or firmware modules and/or data
(not specifically shown). In one embodiment, storage 120 can be a
hard drive or a solid-state drive. The one or more software and/or
firmware modules within storage 120 can be loaded into system
memory 110 during operation of DPS 100. As shown, system memory 110
can include therein a plurality of software and/or firmware modules
including application(s) 112, operating system (O/S) 114, basic
input/output system/unified extensible firmware interface
(BIOS/UEFI) 116 and other firmware (F/W) 118. For example, DPS 100
includes display recovery module (DRM) 142. DRM 142 may be provided
as an application that is optionally located within system memory
110 and executed by processor 105. Within this embodiment,
processor 105 executes DRM 142 to provide the various methods and
functions described herein. For simplicity, DRM 142 is illustrated
and described as a stand-alone or separate software/firmware/logic
component, which provides the specific functions and methods
described herein. However, in at least one embodiment, DRM 142 may
be a component of, may be combined with, or may be incorporated
within OS 114, and/or with one or more applications 112. Additional
aspects of DRM 142, and functionality thereof, are presented within
the description of FIGS. 3-6.
The various software and/or firmware modules have varying
functionality when their corresponding program code is executed by
processor(s) 105 or other processing devices within DPS 100. DPS
100 further includes one or more input/output (I/O) controllers
130, which support connection by, and processing of signals from,
one or more connected input device(s) 132, such as a keyboard,
mouse, touch screen, or microphone. I/O controllers 130 also
support connection to and forwarding of output signals to one or
more connected output devices 134, such as display 126 and audio
speaker(s). Display 126 may be, for example, an organic light
emitting screen and an organic light emitting diode (LED) display.
Display 126 comprises one or more polymer layers. The polymer
layers may be processed as a stack of polymer layers. Additionally,
display 126 is foldable. That is, display 126 includes one or more
hinge areas that bend and/or fold. Position sensor 150 and
temperature sensor 144 are located within display 126 and/or the
casing thereof. More specifically, position sensor 150 and
temperature sensor 144 are in close proximity to the hinge area
associated with display 126.
Additionally, in one or more embodiments, one or more device
interfaces 136, such as an optical reader, a universal serial bus
(USB), a card reader, Personal Computer Memory Card International
Association (PCMIA) slot, and/or a high-definition multimedia
interface (HDMI), can be coupled to I/O controllers 130 or
otherwise associated with DPS 100. Device interface(s) 136 can be
utilized to enable data to be read from or stored to additional
devices (not shown) for example a compact disk (CD), digital video
disk (DVD), flash drive, or flash memory card. In one or more
embodiments, device interfaces 136 can further include General
Purpose I/O interfaces, such as an Inter-Integrated Circuit
(I.sup.2C) Bus, System Management Bus (SMBus), and peripheral
component interconnect (PCI) buses.
DPS 100 further comprises a network interface device (NID) 160. NID
160 enables DPS 100 to communicate and/or interface with other
devices, services, and components that are located external
(remote) to DPS 100. These devices, services, and components can
interface with DPS 100 via an external network, such as example
network 170, using one or more communication protocols. Network 170
can be a local area network, wide area network, personal area
network, and the like, and the connection to and/or between network
and DPS 100 can be wired or wireless or a combination thereof. For
purposes of discussion, network 170 is indicated as a single
collective component for simplicity. However, it is appreciated
that network 170 can comprise one or more direct connections to
other devices as well as a more complex set of interconnections as
can exist within a wide area network, such as the Internet.
DPS 100 also includes display controller 140, which includes
processor 106 and DRM 142, which executes on processor 106. Display
controller 140 is communicatively coupled to temperature sensor
144, and position sensor 150 within display 126. Processor 106 is
optionally included within display controller 140 to execute DRM
142, thereby enabling the functionalities of display controller
140. In another embodiment, processor 105 executes DRM 142 and
enables the functionalities of display controller 140. Display
controller 140 also includes timer 152 communicatively coupled to
position sensor 150, which can be a separate device or a software
module executed on processor 106. Additional aspects of device
controller 140, and functionality thereof, are presented within the
description of FIGS. 3-7.
With reference now to FIG. 2A, there is illustrated an example
mobile device 200. Mobile device 200 includes at least one
processor integrated circuit, processor 205. Included within
processor 205 are data processor 204 and digital signal processor
(DSP) 208. Processor 205 is coupled to system memory 210 and
non-volatile storage 220 via a system communication mechanism, such
as system interconnect 215. System interconnect 215 can be
interchangeably referred to as a system bus, in one or more
embodiments. One or more software and/or firmware modules can be
loaded into system memory 210 during operation of mobile device
200. Specifically, in one embodiment, system memory 210 can include
therein a plurality of such modules, including firmware (F/W) 218.
System memory 210 may also include basic input/output system and an
operating system (not shown). The software and/or firmware modules
provide varying functionality when their corresponding program code
is executed by processor 205 or by secondary processing devices
within mobile device 200.
Processor 205 supports connection by and processing of signals from
one or more connected input devices such as camera 245, speaker
262, touch sensor 264, microphone 285, keypad 266, and display 226.
Additionally, in one or more embodiments, one or more device
interfaces 282, such as an optical reader, a universal serial bus
(USB), a card reader, Personal Computer Memory Card International
Association (PCMIA) slot, and/or a high-definition multimedia
interface (HDMI), can be associated with mobile device 200. Mobile
device 200 also contains a power source such as a battery 268 that
supplies power to mobile device 200.
Mobile device 200 further includes Bluetooth transceiver 224 and
global positioning system module (GPS MOD) 258, all of which are
communicatively coupled to processor 205. Modem 256, Bluetooth
transceiver 224, and GPS MOD 258 enable mobile device 200 and/or
components within mobile device 200 to communicate and/or interface
with other devices, services, and components that are located
external to mobile device 200.
Mobile device 200 is presented as a wireless communication device.
As a wireless device, mobile device 200 can transmit data over
wireless network 170. Mobile device 200 includes transceiver 230,
which is communicatively coupled to processor 205 and to antenna
232. Transceiver 230 allows for wide-area or local wireless
communication, via wireless signal 294, between mobile device 200
and evolved node B (eNodeB) 284, which includes antenna 273. Mobile
device 200 is capable of wide-area or local wireless communication
with other mobile wireless devices or with eNodeB 284 as a part of
a wireless communication network. Mobile device 200 communicates
with other mobile wireless devices by utilizing a communication
path involving transceiver 230, antenna 232, wireless signal 294,
antenna 273, and eNodeB 284. Mobile device 200 additionally
includes near field communication transceiver (NFC TRANS) 225
wireless power transfer receiver (WPT RCVR) 227.
As provided by FIG. 2A, mobile device 200 additionally includes
display controller 240. Display controller 240 includes an optional
processor 206 and DRM 242 which executes on processor 206. In at
least one embodiment, DRM 242 may be a component of, may be
combined with, or may be incorporated within one or more
applications 212. Display controller 240 is communicatively coupled
to position sensor 250 and temperature sensor 244 within display
226 (illustrated in FIG. 2.B). Display controller 240 also includes
timer 252, which can be a separate device or a software module
executed on processor 206. Timer 252 can include a back-up battery.
The back-up battery can enable timer 252 to monitor the time
duration display 226 is in an angled position when mobile device
200 is shut-down. Display controller 240 and components thereof are
further discussed in FIG. 2B.
Turning now to FIG. 2B, there is illustrated a display assembly
that includes display controller 240 described in FIG. 2A. Display
controller 240 is communicatively coupled to display 226, and the
components thereof. Display 226 includes hinge 270, hinge 272,
thermal element 274 and 275, and heat generating area 276.
Physically positioned within or associated with display 226 are
temperature sensor 244 and position sensor 250. More specifically,
position sensor 250 and temperature sensor 244 are in close
proximity to hinge area 270. Although not shown, hinge area 272
also includes a position sensor and temperature sensor similar to
that of position sensor 250 and temperature sensor 244.
Display 226 is a foldable display. Similar to display 126, display
226 may be, for example, an organic light emitting screen and an
organic light emitting diode (LED) display. Display 226 comprises
one or more polymer layers. The polymer layers may be processed as
a stack of polymer layers. Display 226 includes at least one hinge
area, for example, hinge 270 and hinge 272. Display 226 bends
and/or folds on or near hinge 270 and 272.
Thermal element 274 and 275 is a part of a heat generating
subsystem that is juxtaposed to at least one area of display 226 to
produce heat and thus increase the temperature within a
predetermined area of display 226. Predetermined area of display
226 is an area in close proximity to hinge 270 that has endured, or
is at risk of enduring semi-permanent deformation. Similarly,
thermal element 275 is located in close proximity to hinge 272.
Thermal element 274 and 275 may be a heating coil, heating grid,
imbedded heating wire, or any heating device that enables an
increase in temperature in proximity to hinge 270 and 272,
respectively. In the example of FIG. 2B, thermal element 275
generates heat to an area in proximity to hinge 272, resulting in
heat dissipation within an area in close proximity to thermal
element 275, for example heat generating area 276.
Display controller 240 optionally includes processor 206. In one
embodiment, processor 206 executes instruction to perform the
functionality provided by display controller 240. In another
embodiment, the local processor, processor 205, of mobile device
200 executes the instruction to perform the functionality provided
by display controller 240.
Position sensor 250, communicatively coupled to display controller
240, detects when display 226 is folding, bending, or in a position
that causes at least a part of display 226 to be at an angle that
promotes deformation of one or more polymer layers. Timer 252 is a
module that is associated with position sensor 250. Timer 252
monitors a time duration that display device 226 is in the angled
position. Temperature sensor 244 detects and monitors temperatures
associated with at least one predetermined area of display device
226.
According to one aspect, display controller 240 is communicatively
coupled to display 226. In the presented embodiment, mobile device
200 includes display controller 240 that performs several of the
processes described herein relative to the bendable display 226. In
one embodiment, display controller 240 includes or is
communicatively coupled to a persistent storage or memory within
which DRM 242 is stored. In one embodiment, display controller 240
includes and/or provides timer 252. In an alternate embodiment,
timer 252 can be provided as one of several executable, functional
modules within DRM 242.
During operation of mobile device 200, DRM 242 is executed by
display controller 240 to provide certain of the functional
features described herein. DRM 242 determines the extent of
semi-permanent deformation that occurs at a predetermined area of
display 226, which is the area surrounding hinge 270 and 272, in
the current illustration. In response to the detection of
deformation at a predetermined area of display 226, DRM 242 enables
thermal element 275 to generate heat to the predetermined area by
applying electrical energy to thermal element 275. In the
illustrated example, the temperature is increased at heat
generating area 276 to reverse the semi-permanent deformation
associated with display 226.
In one embodiment, the time duration and heat dissipated by thermal
element 275 is proportional to the extent of the deformation
associated with display 226. The extent of semi-permanent
deformation may be based on polymeric behavior of polymers
associated with display 226, as well as time and temperature
aspects associated with display 226. The extent of semi-permanent
deformation may also be determined by the length of time display
226 is detected to be in an angled and/or folded position, as
determined by position sensor 250 and timer 252. Semi-permanent
deformation may additionally be associated with an ambient
temperature detected at a predetermined area of display 226. DRM
242 (or an associated memory component) may store a history of
temperatures, stresses endured, detected force, or similar data to
determine an extent of semi-permanent deformation that has occurred
or is occurring at predetermined areas of display 226.
Additionally, DRM 242 stores relaxation modulus curves and similar
data related to the polymeric behavior of the one or more polymeric
components. DRM 242 utilizes the stored data to calculate a
temperature application and time duration needed to counter a
semi-permanent deformation associated with display 226.
FIG. 3 illustrates an example foldable electronic display
associated with electronic device 300. In FIG. 3, electronic device
300 is presented in four positional arrangements, first position
310, second position 320, third position 330, and fourth position
340. Electronic device 300 is similar to and/or can be
representative of DPS 100 or mobile device 200. Electronic device
300 is a hinged device having display 305 encased within device
casing 304. Casing includes hinge area 360. The four positional
arrangements illustrated in FIG. 3 represent the ability of
electronic device 300 or display 305 to be positioned and/or
maneuvered into a range of angles about hinge area 360. In one
embodiment, hinge area 360 enables the coupling of two segments of
display together at a hinge. In another embodiment, hinged area 360
enables one segment to fold at and/or around hinge area 360. As
shown, electronic device 300 includes thermal element 308. Thermal
element 308, similar to thermal element 274 or 275 (FIG. 2B), is
connected to or in close proximity to hinge area 360.
Display controller 240 (or 140 of FIG. 1) is communicatively
coupled to electronic device 300 and operates as the control module
for display 305. Display controller 240 enables the functionalities
of DRM 242. For example, DRM 242 (not shown in FIG. 3) enables an
increase of the temperature at thermal element 308 in one or more
embodiments. Thermal element 308 is a heat generating subsystem
capable of applying an increase in the temperature associated with
at least one predetermined area of display 305. Additionally,
display controller 240 includes a detection module, or position
sensor 350, that identifies when display 305 is placed in an angled
position. In response to display 305 being placed in the angled
position, timer 252 (FIG. 2B) monitors a time duration during which
display 305 is in the angled position. In response to display 305
being in the angled position, a temperature measuring component,
temperature sensor 344, measures and reports a temperature
associated with at least one predetermined area of display 305
while display 305 is in the angled position.
In one embodiment, DRM 242, or an associated storage device, stores
at least one viscoelastic behavior of at least one polymeric
component associated with display 305. In one example, the
viscoelastic behavior is received as relaxation modulus curves for
the at least one polymeric component. The viscoelastic behavior
defines how the polymer will react at a specific temperature. DRM
242 utilizes known viscoelastic behavior of the at least one
polymeric component to determine the degree of deformation to at
least one polymer associated with display 305, particularly at the
hinged/bendable segments of display 305. DRM 242 may store the
relaxation modulus curves to determine a target relaxation time and
temperature needed to overcome a semi-permanent deformation.
FIG. 3 illustrates four example positions: first position 310,
second position 320, third position 330, and fourth position 340.
In FIG. 3, first position 310 displays electronic device 300 in a
closed position. First position 310 is representative of a
substantially zero-degree angle, at which a maximum convex bend of
the display occurs. In first position 310, at least one area of
display 305 is positioned adjacent to a second area of display 305.
First position 310 illustrates electronic device 300 folding at or
near hinge area 360. Second position 320 illustrates electronic
device 300 in an acute angle between 0-90 degrees. The positional
arrangement of second position 320 represents when display device
305 is in an angle that promotes a bend, and more specifically an
inward/forward bend, forming a semi-permanent deformation in
display 305. Third position 330 illustrates electronic device 300
in an open position. When electronic device 300 is in third
position 330, display 305 is in the most horizontal position
possible, with little or no bend, thus minimizing any potential
deformation. Fourth position 340 illustrates electronic device 300
in an extended position. In fourth position 340, display 305 is in
a positional arrangement that promotes a bend, and more
specifically an outward/reverse bend, also forming a semi-permanent
deformation in display 305.
The display positions illustrated in FIG. 3 are for example only.
It is understood that display 305 is operable to bend/fold at any
angle. Additionally, the position of hinge area 360 is only for
example. It is understood that hinge area 360 may be located at any
area associated with display 305. The fold and/or bend associated
with display 305 may not necessarily be associated with an
electronic device that opens and closes. Instead, semi-permanent
deformation of display 305 may be associated with a slight
bend/flex of display 305.
In operation, semi-permanent deformation occurs after display 305
has been in an angled position for a predetermined time duration.
DRM 242 determines the degree of semi-permanent deformation of
display 305 according to the time duration in which display 305 is
in an angled position. The degree of deformation increases with the
length of time and the amount of bend associated with the
predetermined area. When a predetermined time duration, associated
with the time duration in which display 305 is in the angled
position elapses, and display 305 returns to third position 330,
DRM 242 triggers the increase in temperature at the heat generating
area to counter the semi-permanent deformation.
In one embodiment, display controller 240, in communication with
display 305, receives a time duration and measured temperature, as
detected by timer 252 and temperature sensor 344. The time duration
and measured temperature are detected in response to display 305
being in the angled position, for example first position 310,
second position 320, or fourth position 340. In response to display
305 being in a horizontal position, such as third position 330,
display controller 240 determines a current value/amount of
semi-permanent deformation associated with a predetermined area of
display 305. DRM 242 triggers an increase in temperature at the
heat generating area, via thermal element 308, to counter the
semi-permanent deformation at the predetermined area of display
305. Thermal element 308 dynamically applies a calculated
temperature to the predetermined area of display 305 for a
calculated length of time. The length of time is calculated based
on (i) the time duration in which display 305 is in the angled
position and (ii) the measured temperature range of display 305
when in the angled position. In the current example, display 305
includes at least one polymer layer and the determined length of
time is a relaxation time associated with a stress relaxation
modulus value retrieved from stress relaxation data associated with
the at least one polymer layer when heated at a selected
temperature. The selected temperature is one of a calculated
temperature and a dynamically selected temperature. The temperature
may be calculated or dynamically selected for display 305 according
to a preference of recovery time dynamically selected or defined by
a user or manufacturer of display 305.
In one embodiment, electronic device 300 can be placed in anyone of
various positions, which include first position 310, second
position 320, and fourth position 340 for a respective time period.
Position sensor 350 identifies when display 305 is in any one or
more of first position 310, second position 320, and fourth
position 340. In response to display 305 being placed in any one or
more of first position 310, second position 320, and fourth
position 340, timer 252 monitors the time durations during which
display 305 is in the different angled positions, and timer 252
reports the time durations to DRM 242. In this embodiment,
temperature sensor 344 detects and monitors the ambient temperature
associated with at least one corresponding area of display 305.
Temperature sensor 344 reports the temperature/temperature range to
DRM 242. DRM 242 stores the time duration and monitored ambient
temperature range. Temperature, time, and stress incurred at each
position impacts the semi-permanent deformation sustained by an
area of display 305. In response to detecting the change in angles
for display 305, DRM 242 utilizes the average of the angles
detected with respect to time positioned at each angle, and the
average temperature to help determine an amount of heat and/or time
to apply the heat. Accordingly, heat is generated to the
predetermined area of display 305 for a predetermined length of
time to counter the semi-permanent deformation incurred by display
305.
In another example, position sensor 350 identifies when display 305
is placed in third position 330 and reports the positional
arrangement to DRM 242. In response to display 226 moving into
third position 330, DRM 242 receives the measured temperature range
and time duration recorded while display 305 was in one or more of
the first, second, and/or fourth positions. DRM 242 utilizes
current and past conditions, polymer properties, as well as endured
physical load while display 305 was in one or more of the first
position 310, second position 320, and fourth position 340 to
calculate the level of semi-permanent deformation associated with a
predetermined area of display 305. More specifically, DRM 242
utilizes the time duration, ambient temperature, known viscoelastic
behavior, endured strain and stress (determined by imbedded strain
gauges and force sensing) associated with display 305 while display
305 is in one or more of the angled positions. DRM 242 calculates
the target temperature and length of time, or polymer relaxation
time, needed to overcome the semi-permanent deformation at the
predetermined area of display 305. DRM 242 triggers thermal element
308 to dynamically apply the determined target temperature to the
predetermined area of display 305, for the determined length of
time, in order to overcome the semi-permanent deformation.
In an alternate embodiment, DRM 242 receives a user-defined length
of time in which to complete the process of reversing the
semi-permanent deformation. In response to receipt of the
user-defined length of time, DRM 242 dynamically selects a target
temperature and heat generation rate, respective of the
viscoelastic behavior, which will counter the semi-permanent
deformation associated with display 305. According to one aspect,
the time it takes to relax the imposed stresses on display 305 is
governed by at least the relaxation time of the polymer associated
with display 305. High temperatures correlate to shorter molecular
relaxation times and low temperatures correlate to longer
relaxation times. Thermal element 308 dynamically generates the
selected temperature that corresponds to the polymer and the
user-defined length of time. In response to heating display 305 at
the predetermined area, DRM 242 monitors the decreasing stress, or
stress relaxation of display 305 via one or more stress sensors or
strain gauges (described further in the discussion in FIG. 5). When
the stress relaxation value of display 305 reaches an
empirically-determined, configurable threshold, thermal element 308
discontinues applying heat to the at least one predetermined area
of display 305.
In one embodiment, temperature sensor 344 dynamically monitors the
ambient temperature at a predetermined area of display 305. DRM 242
determines the semi-permanent deformation associated with display
305. Thermal element 308 generates a temperature that is a
calculated temperature increase above the ambient temperature. In
response to display 305 being in third position 330, DRM 242
enables thermal element 308 to generate an increase in temperature
to heat a predetermined area of display 305 to the calculated
temperature above the detected ambient temperature. Thermal element
308 applies heat to at least one predetermined area of display 305.
The target temperature to apply to the at least one predetermined
area of display 305 is calculated with respect to the target heat
application period available to reverse the semi-permanent
deformation experienced by display 305. The target heat application
period may be one of a time duration that is: (i) programmed during
manufacturing of electronic device 300; (ii) defined by a user; and
(iii) dynamically determined by DRM 242 with respect to historical
data providing frequency of use of electronic device 300 during a
time of the day.
In another embodiment, the temperature, generated by thermal
element 308, is applied to the semi-permanent deformation when
display 305 is in third position 330 and display 305 is not in use.
DRM 242 isolates thermal element 308 from display 305 when
electronic device 300 is in use and when display 305 is in any one
of first position 310, second position 320, and fourth position
340.
In still another embodiment, safety attributes are engaged to
mitigate heat damage to electronic device 300 and more specifically
display 305. Thermal element 308 is isolated from at least one of
display 305 and hinge area 360 while at least one of (i) display
305 is in use and (ii) display 305 is not in a fully open state.
Isolating thermal element 308 when display 305 is in use will
eliminate inadvertent activation of the heat generating subsystem
during the use of display 305. Additionally, isolating thermal
element 308 when display 305 is not in a fully open/horizontal
state eliminates heating a folded display 305 which would further
promote semi-permanent deformation of display 305. In at least one
embodiment, thermal element 308 is disengaged when the temperature
measured of at least one area of display 305 reaches a configurable
threshold.
Now turning to FIG. 4, which illustrates two depictions of an
electronic device (400 and 420) that encompasses characteristics
and positional abilities similar to electronic device 300 discussed
in FIG. 3. However, each electronic device 400 and 420 illustrate
the display with an additional hinge area. More specifically,
electronic device 400 includes display 405, device casing 404,
first hinge area 406, first thermal element 408, second hinge area
416, and second thermal element 418. Electronic device 420 includes
display 415, first hinge area 426, first thermal element 428,
second hinge area 436, and second thermal element 438.
In one embodiment, first hinge area 406 and second hinge area 416
are positioned in at least two areas of display 405. First hinge
area 406 and second hinge area 416 are respectively associated with
thermal element 408 and thermal element 418. Display 405 bends,
flexes, and/or folds near hinge area 406 and second hinge area 416.
Display 405 is capable of flexing (i) inward, in a movement that
rotates the outer edges of electronic device 400 towards display
405, and (ii) outward, in a movement that rotates the outer edges
of electronic device towards device casing 404. The inward flex may
create a concave semi-permanent deformation in one or more areas in
proximity to first hinge area 406 and second hinge area 416. The
outward flex may create a convex semi-permanent deformation in one
or more areas in proximity to first hinge area 406 and second hinge
area 416. First thermal element 408 and second thermal element 418
respectively generate a predetermined increase in temperature to an
area in proximity to first hinge area 406 and second hinge area 416
to relax the semi-permanent deformation associated with display
405.
In an alternate embodiment, electronic device 420 does not include
a device casing. First thermal element 428 and second thermal
element 438 are coupled to display 415. Display 415 is capable of
flexing (i) inward, in a movement that rotates the outer edges of
electronic device 420 towards the top layer of display 415, and
(ii) outward, in a movement that rotates the outer edges of
electronic device 420 towards the bottom layer of display 415. The
inward flex may create a concave (top layer of display 415) and
convex (bottom layer of display 415) semi-permanent deformation in
one or more areas in proximity to first hinge area 426 and second
hinge area 436. The outward flex may also create a concave (bottom
layer of display 415) and convex (top layer of the display 415)
semi-permanent deformation in one or more areas in proximity to
first hinge area 426 and second hinge area 436. In this
configuration, first thermal element 428 and second thermal element
438 respectively apply a predetermined increase in temperature to
the predetermined areas of display 415 in proximity to hinge area
426 and second hinge area 436 to relax the semi-permanent
deformation in the top and bottom surface of display 415.
FIG. 5 illustrates an example foldable display 504 (similar to
foldable display 226 of FIG. 2) associated with a thermal element
(506) that is configured to apply heat to an area of foldable
display 504. FIG. 5 includes top down view 500, first view 502, and
second view 512. Top down view 500 includes a top down illustration
of foldable display 504 and hinge area 508. Thermal element 506 and
strain gauge 518 are coupled in close proximity to hinge area 508.
First view 502 and second view 512 include an example
cross-sectional view of foldable display 504, device casing 510,
and thermal element 506.
In the example of first view 502, foldable display 504 is
illustrated with a concave semi-permanent deformation in close
proximity to hinge area 508. In response to foldable display 504
being in an open and flat position, for example third position 330,
DRM 242 enables thermal element 506 to generate heat 505 to the
concave semi-permanent deformation at the predetermined area of
foldable display 504. In one embodiment, heat 505 is generated to a
calculated temperature to increase the mobility of the polymer
chains associated with at least one polymer comprised within
foldable display 504. Increasing the mobility of the polymer chains
enables the applied heat 505 to counter the semi-permanent
deformation at the predetermined area of foldable display 504,
relaxing the predetermined area to a less deformed state. In one
embodiment, the temperature increase is applied for a calculated
length of time. In an alternate embodiment, strain gauge 518 is
connected to foldable display 504 to monitor the stress relaxation
associated with foldable display 504. With this alternate
embodiment, the temperature increase is applied while strain gauge
518 measures the force, pressure, tension, or weight associated
with foldable display 504. When the residual stress and strain
associated with an area of foldable display 504 is below a
pre-established threshold, then steps to recover deformation are
not necessary, or can be postponed.
The example of second view 512 illustrates that foldable display
504 has recovered from the semi-permanent deformation illustrated
in first view 502. The increase in temperature generated by thermal
element 506 to foldable display 504 counters the semi-permanent
deformation experienced by foldable display 504. In response to
strain gauge 518 detecting that foldable display 504 has achieved a
residual stress level below a predetermined threshold, heat 505,
generated by thermal element 506, is discontinued.
Referring now to FIG. 6 and FIG. 7. FIG. 6 provides a method for
determining whether to engage thermal element 274 (FIG. 2) to heat
a predetermined area of display 226 (FIG. 2), in accordance with
one or more embodiments of the present disclosure. FIG. 7 provides
a method for engaging thermal element 274 (FIG. 2) to heat a
predetermined area of the foldable display, and monitoring the
recovery of display 226. Aspects of the methods are described with
reference to the components of FIGS. 1-5. Several of the processes
of the method provided in FIG. 6 and FIG. 7 can be implemented by a
processor (e.g., processor 205) executing software code of DRM 242
associated with display controller 240 within a generic data
processing system 100 (FIG. 1) or mobile device 200 (FIG. 2). In
the following method processes described in FIG. 6 and FIG. 7,
processor 205 executes DRM 242 to perform the steps described
herein.
Method 600 commences at the start block, then proceeds to block
602. At block 602 the method engages position sensor 250 to detect
the position of display 226. A decision is made at block 604
whether display 226 is placed in an angled position, for example
first position 310, second position 320, or fourth position 340. In
response to the display 226 not being placed in the angled
position, the process returns to block 602. In response to display
226 being placed in the angled position, the process continues to
block 606. At block 606, DRM 242 monitors and stores the time
duration display 226 is in the angled position. At block 608,
temperature sensor 244 measures the ambient temperature at a
specific area of display 226, and DRM 242 stores the detected
ambient temperature values. At block 610 a decision is made whether
a calculated period of time has elapsed. The period of time is
calculated based on the temperature and stress endured by display
226 while in the angled position. In response to the calculated
period of time not elapsing, the process returns to block 610. In
response to the calculated period of time elapsing, the process
continues to block 612. At block 612 a determination is made
whether the initiation of a position change associated with display
226 has been detected. In response to the initiation of a position
change not being detected, the process returns to block 606. In
response to the initiation of a position change being detected, the
method continues to block 614. At block 614 a determination is made
whether display 226 is in a fully open position. The process
returns to block 606 in response to display 226 not being in a
fully open position. In response to display 226 being in a fully
open position, the process continues to block 702.
Method 700 commences at the start block, then proceeds to block
702. At block 702 the method engages strain gauge 518 to measure
the degree of semi-permanent deformation associated with at least
one polymeric layer of display 226. The method engages thermal
element 274, at block 704, to generate the heat at the level and
for the duration, or heat application period, needed to overcome
the semi-permanent deformation associated with the polymeric layer
of display 226. At block 706 the method engages strain gauge 518 to
detect the recovery progress of the polymeric layer associated with
display 226. A determination is made at block 708 whether the
recovery (i.e., reversal of the semi-permanent deformation) of the
polymeric layer associated with display 226 is complete. In
response to the recovery being complete, the process continues to
block 710. In response to the recovery not being complete, the
process continues to block 712. At block 712, a determination is
made whether the recovery of display 226 experienced an
interruption, for example, the display position change or power was
discontinued to thermal element 274. In response to the recovery of
display 226 not being interrupted, the process returns to block
708. In response to the recovery of display 226 being interrupted,
the process returns to block 612. At block 710 the method
discontinues heat generation by thermal element 274. The process
concludes at the end block.
In the above-described flow charts, one or more of the method
processes may be embodied in a computer readable device containing
computer readable code such that a series of steps are performed
when the computer readable code is executed on a computing device.
In some implementations, certain steps of the methods are combined,
performed simultaneously or in a different order, or perhaps
omitted, without deviating from the scope of the disclosure. Thus,
while the method steps are described and illustrated in a
particular sequence, use of a specific sequence of steps is not
meant to imply any limitations on the disclosure. Changes may be
made with regards to the sequence of steps without departing from
the spirit or scope of the present disclosure. Use of a particular
sequence is therefore, not to be taken in a limiting sense, and the
scope of the present disclosure is defined only by the appended
claims.
Aspects of the present disclosure are described above with
reference to flowchart illustrations and/or block diagrams of
methods, apparatus (systems) and computer program products
according to embodiments of the disclosure. It will be understood
that each block of the flowchart illustrations and/or block
diagrams, and combinations of blocks in the flowchart illustrations
and/or block diagrams, can be implemented by computer program
instructions. Computer program code for carrying out operations for
aspects of the present disclosure may be written in any combination
of one or more programming languages, including an object oriented
programming language, without limitation. These computer program
instructions may be provided to a processor of a general purpose
computer, special purpose computer, or other programmable data
processing apparatus to produce a machine that performs the method
for implementing the functions/acts specified in the flowchart
and/or block diagram block or blocks. The methods are implemented
when the instructions are executed via the processor of the
computer or other programmable data processing apparatus.
As will be further appreciated, the processes in embodiments of the
present disclosure may be implemented using any combination of
software, firmware, or hardware. Accordingly, aspects of the
present disclosure may take the form of an entirely hardware
embodiment or an embodiment combining software (including firmware,
resident software, micro-code, etc.) and hardware aspects that may
all generally be referred to herein as a "circuit," "module," or
"system." Furthermore, aspects of the present disclosure may take
the form of a computer program product embodied in one or more
computer readable storage device(s) having computer readable
program code embodied thereon. Any combination of one or more
computer readable storage device(s) may be utilized. The computer
readable storage device may be, for example, but not limited to, an
electronic, magnetic, optical, electromagnetic, infrared, or
semiconductor system, apparatus, or device, or any suitable
combination of the foregoing. More specific examples (a
non-exhaustive list) of the computer readable storage device can
include the following: a portable computer diskette, a hard disk, a
random access memory (RAM), a read-only memory (ROM), an erasable
programmable read-only memory (EPROM or Flash memory), a portable
compact disc read-only memory (CD-ROM), an optical storage device,
a magnetic storage device, or any suitable combination of the
foregoing. In the context of this document, a computer readable
storage device may be any tangible medium that can contain, or
store a program for use by or in connection with an instruction
execution system, apparatus, or device.
Where utilized herein, the terms "tangible" and "non-transitory"
are intended to describe a computer-readable storage medium (or
"memory") excluding propagating electromagnetic signals; but are
not intended to otherwise limit the type of physical
computer-readable storage device that is encompassed by the phrase
"computer-readable medium" or memory. For instance, the terms
"non-transitory computer readable medium" or "tangible memory" are
intended to encompass types of storage devices that do not
necessarily store information permanently, including, for example,
RAM. Program instructions and data stored on a tangible
computer-accessible storage medium in non-transitory form may
afterwards be transmitted by transmission media or signals such as
electrical, electromagnetic, or digital signals, which may be
conveyed via a communication medium such as a network and/or a
wireless link.
While the disclosure has been described with reference to example
embodiments, it will be understood by those skilled in the art that
various changes may be made and equivalents may be substituted for
elements thereof without departing from the scope of the
disclosure. In addition, many modifications may be made to adapt a
particular system, device, or component thereof to the teachings of
the disclosure without departing from the scope thereof. Therefore,
it is intended that the disclosure not be limited to the particular
embodiments disclosed for carrying out this disclosure, but that
the disclosure will include all embodiments falling within the
scope of the appended claims.
The description of the present disclosure has been presented for
purposes of illustration and description, but is not intended to be
exhaustive or limited to the disclosure in the form disclosed. Many
modifications and variations will be apparent to those of ordinary
skill in the art without departing from the scope of the
disclosure. The described embodiments were chosen and described in
order to best explain the principles of the disclosure and the
practical application, and to enable others of ordinary skill in
the art to understand the disclosure for various embodiments with
various modifications as are suited to the particular use
contemplated.
* * * * *