U.S. patent number 10,554,120 [Application Number 16/411,800] was granted by the patent office on 2020-02-04 for power conversion device.
This patent grant is currently assigned to Mitsubishi Electric Corporation. The grantee listed for this patent is Mitsubishi Electric Corporation. Invention is credited to Kazuhiro Fujioka, Nobuhiro Kihara, Mai Nakada, Yujiro Nakada, Yoshihiro Takeshima.
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United States Patent |
10,554,120 |
Fujioka , et al. |
February 4, 2020 |
Power conversion device
Abstract
[Technical Problem] In a power conversion device for stepping up
or stepping down the input voltage, when voltage converter become
out of order, it is not possible to specify an IGBT element and a
current sensor, which is in an extraordinary fault condition.
[Solution to Problem] The power conversion device is configured to
detect a voltage value of a smoothing condenser, connected in
parallel to a load, where the load is to be connected to the power
conversion device; detects, by a first current sensor, a current
which flows through switching elements in a plurality of voltage
converter; decides an abnormality of a switching element, by
switching the switching element one by one; specifies the
abnormality of the switching element; and specifies that the first
current sensor is in an abnormal state, in a case where there is no
abnormal state switching elements.
Inventors: |
Fujioka; Kazuhiro (Tokyo,
JP), Kihara; Nobuhiro (Tokyo, JP), Nakada;
Mai (Tokyo, JP), Takeshima; Yoshihiro (Tokyo,
JP), Nakada; Yujiro (Tokyo, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Mitsubishi Electric Corporation |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Mitsubishi Electric Corporation
(Tokyo, JP)
|
Family
ID: |
66655779 |
Appl.
No.: |
16/411,800 |
Filed: |
May 14, 2019 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20200007027 A1 |
Jan 2, 2020 |
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Foreign Application Priority Data
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|
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Jul 2, 2018 [JP] |
|
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2018-125806 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H02M
3/33507 (20130101); H02M 1/32 (20130101); H02M
3/1584 (20130101); H02M 2003/1586 (20130101); H02M
2001/0009 (20130101); H02M 2001/0074 (20130101); G05F
1/565 (20130101); H02M 2001/325 (20130101) |
Current International
Class: |
H02M
1/32 (20070101); H02M 3/335 (20060101); G05F
1/565 (20060101); H02M 3/158 (20060101); H02M
1/00 (20060101) |
Field of
Search: |
;323/271,272,277,284,285
;363/65,67-70,78,79,89 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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|
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|
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2009-213246 |
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Sep 2009 |
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JP |
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2017-212770 |
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Nov 2017 |
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JP |
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2017-229123 |
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Dec 2017 |
|
JP |
|
Primary Examiner: Nash; Gary A
Attorney, Agent or Firm: Sughrue Mion, PLLLC Turner; Richard
C.
Claims
What is claimed is:
1. A power conversion device, which is to be placed between an
input power source and a load, the power conversion device
comprising; a first smoothing condenser, which is connected in
parallel to the input power source, a second smoothing condenser,
which is connected in parallel to the load and has a negative
electrode connected to a negative electrode of the first smoothing
condenser, a plurality of voltage converter, which are provided
between the first smoothing condenser and the second smoothing
condenser and convert voltage by operations of switching elements,
a first current sensor, which detects current flowing through the
switching element in the voltage converter, a first voltage sensor,
which detects voltage of the second smoothing condenser, a control
signal device, which performs drive-control of the switching
elements, and a failure decision device, which, in a case where a
value calculated based on a detected value of the first current
sensor deviates from a predetermined value, decides that the first
current sensor is in an abnormal state based on a value of the
first voltage sensor.
2. The power conversion device as set forth in claim 1, wherein,
the failure decision device, in the case where the value calculated
based on the detected value of the first current sensor deviates
from the predetermined value, drives one by one a switching element
in the voltage converter, and decides that a drive-targeted
switching element is in an abnormal state, in a case where there is
no voltage change in the second smoothing condenser, and decides
that the first current sensor is in an abnormal state, if none of
the switching elements in the voltage converter are decided to be
in an abnormal state.
3. The power conversion device as set forth in claim 2, wherein the
load is a bi-directional power source which is to be connected in
parallel to the second smoothing condenser.
4. The power conversion device as set forth in claim 3, further
comprising: a second current sensor, which detects current flowing
through the bi-directional power source, and a second voltage
sensor, which detects voltage of the first smoothing condenser,
wherein, in a case where the switching elements are decided to be
in a normal state, the failure decision device specifies that a
first current sensor is in a fault condition, which represented a
deviated detected value with respect to an estimated value of the
first current sensor, where the estimated value is calculated based
on a detected value by the second voltage sensor, a detected value
by the first voltage sensor, and a detected value by the second
current sensor.
5. The power conversion device as set forth in claim 4, wherein the
failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
6. The power conversion device as set forth in claim 3, wherein the
failure decision device specifies that a first current sensor is in
an abnormal state, according to a deviation level of the detected
value by the first current sensor, with respect to a current value
estimated based on a measured value of electric power to the
bi-directional power source and a measured value of electric power
supplied from the first smoothing condenser.
7. The power conversion device as set forth in claim 3, wherein the
failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
8. The power conversion device as set forth in claim 2, wherein the
failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
9. The power conversion device as set forth in claim 1, wherein the
load is a bi-directional power source which is to be connected in
parallel to the second smoothing condenser.
10. The power conversion device as set forth in claim 9, further
comprising: a second current sensor, which detects current flowing
through the bi-directional power source, and a second voltage
sensor, which detects voltage of the first smoothing condenser,
wherein, in a case where the switching elements are decided to be
in a normal state, the failure decision device specifies that a
first current sensor is in a fault condition, which represented a
deviated detected value with respect to an estimated value of the
first current sensor, where the estimated value is calculated based
on a detected value by the second voltage sensor, a detected value
by the first voltage sensor, and a detected value by the second
current sensor.
11. The power conversion device as set forth in claim 10, wherein
the failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
12. The power conversion device as set forth in claim 9, wherein
the failure decision device specifies that a first current sensor
is in an abnormal state, according to a deviation level of the
detected value by the first current sensor, with respect to a
current value estimated based on a measured value of electric power
to the bi-directional power source and a measured value of electric
power supplied from the first smoothing condenser.
13. The power conversion device as set forth in claim 9, wherein
the failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
14. The power conversion device as set forth in claim 1, wherein
the failure decision device, in a case where three or more first
current sensors are connected thereto and the switching elements
are decided to be in a normal state, specifies that a first current
sensor is in an abnormal state, whose value is deviated from values
of other first current sensors.
Description
FIELD OF THE INVENTION
The present application relates to a power conversion device.
BACKGROUND OF THE INVENTION
A conventional power conversion device is provided with a voltage
conversion unit, which steps up or steps down the input voltage,
and constitutes a power source system, which is inclusive of an
input power source and an electric storage device. The voltage
conversion unit is composed of switching elements, rectifying
devices, and reactors, and steps up or steps down the input voltage
of direct current, by repeatedly driving the switching elements to
turn on and off. Moreover, in the power conversion device, a
voltage conversion unit is configured to be in multi parallel
constitution, in order to convert the input voltage of direct
current into a predetermined output voltage. The voltage conversion
unit, which is connected in multi parallel constitution, uses a
current sensor and a voltage sensor to control its output, so that
overcurrent and overvoltage may not be caused. In addition, the
voltage conversion unit performs controlling in step up and step
down, so that its output may not exceed standard values of the step
up voltage and the step down voltage.
In a multi-phase converting unit, which includes a plurality of
voltage conversion units connected in parallel, the voltage
conversion units are controlled, so that the number of voltage
conversion units, which are made to stop, may increase gradually.
So doing, the multi-phase converting unit reveals characteristics
that, if a voltage conversion unit is in a normal state, an output
of the multi-phase converting unit will have a proper change before
and after the switching, and if a voltage conversion unit is in an
abnormal state, an output of the multi-phase converting unit will
exhibit an abnormal change before and after the switching. There
are shown a failure detection device and a power source device,
which use those characteristics and can specify one or more voltage
conversion unit(s) which is or are in an abnormal state. (Patent
Document 1)
CITATION LIST
Patent Literature
Patent Document 1: JP 2017-212770, A
SUMMARY OF THE INVENTION
Technical Problem
However, according to the failure detection device and the power
source device which are described in Patent Document 1, it is not
yet possible to specify an abnormal state switching element in the
voltage conversion unit, and one or more voltage conversion
unit(s), which is or are specified to be in an abnormal state, is
or are made to stop. Accordingly, normal operation cannot be
continued. Further, failure in a current sensor is not assumed. In
the case where the current sensor falls into an abnormal state, one
or more voltage conversion unit(s) is or are specified to be in an
abnormal state based on a current value. Accordingly, an abnormal
state part cannot be spotted accurately, and it is not possible to
decide a switching element which is in an abnormal state.
Furthermore, because one or more voltage conversion unit(s), which
is or are specified to be in an abnormal state, is or are made to
stop, it is not possible to continue the normal operation.
The present application is made in order to solve the above
mentioned problems. By specifying an abnormal state switching
element in the voltage conversion unit, a power conversion device
makes it possible to continue the operation, where the use of an
abnormal state switching element is eliminated, and only a normal
state switching element is used. Moreover, the present application
aims at obtaining a power conversion device, which can decide
accurately a part of abnormal state, by specifying the abnormal
state in a current sensor, and further can perform the continuous
operation, where a current sensor in an abnormal state is not
used.
Solution to Problem
A power conversion device which is disclosed in the present
application is a power conversion device, which is to be placed
between an input power source and a load, and the power conversion
device includes; a first smoothing condenser, which is connected in
parallel to the input power source; a second smoothing condenser,
which is connected in parallel to the load and has a negative
electrode connected to a negative electrode of the first smoothing
condenser; a plurality of voltage conversion units, which are
provided between the first smoothing condenser and the second
smoothing condenser and convert voltage by operations of switching
elements; a first current sensor, which detects current flowing
through the switching element in the voltage conversion unit; a
first voltage sensor, which detects voltage of the second smoothing
condenser; a control signal unit, which performs drive-control of
the switching elements; and a failure decision unit, which, in a
case where a value calculated based on a detected value of the
first current sensor deviates from a predetermined value, decides
that the first current sensor is in an abnormal state based on a
value of the first voltage sensor.
Advantageous Effects of Invention
According to the power conversion device of the present
application, it is possible to continue the normal operating state,
by specifying a switching element or a first current sensor which
is in an abnormal state, from among switching elements in a
plurality of voltage conversion units and a first current sensor
which detects a value of the current, flowing through a switching
element in each of the voltage conversion units.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a circuit diagram showing a power conversion device
according to Embodiment 1 of the present application;
FIG. 2A is a circuit diagram showing a first operating mode at the
time of power run operation, according to Embodiment 1 of the
present application;
FIG. 2B is a circuit diagram showing a second operating mode at the
time of power run operation, according to Embodiment 1 of the
present application;
FIG. 2C is a circuit diagram showing a third operating mode at the
time of power run operation, according to Embodiment 1 of the
present application;
FIG. 3 is a wave form chart showing ideal operating wave forms in
operating modes, at the time of power run operation, according to
Embodiment 1 of the present application;
FIG. 4A is a circuit diagram showing a fourth operating mode of the
power run operation, in a case where an OFF state keeping
abnormality is arisen in a first IGBT element, according to
Embodiment 1 of the present application;
FIG. 4B is a circuit diagram showing a fifth operating mode of the
power run operation, in a case where an OFF state keeping
abnormality is arisen in the first IGBT element, according to
Embodiment 1 of the present application;
FIG. 5 is a wave form chart showing ideal operating wave forms in
the operating modes of the power run operation, in a case where an
OFF state keeping abnormality is arisen in the first IGBT element,
according to Embodiment 1 of the present application;
FIG. 6 is a drawing showing a flow chart in failure decision,
according to Embodiment 1 of the present application;
FIG. 7A is a circuit diagram showing a sixth operating mode at the
time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7B is a circuit diagram showing a seventh operating mode at
the time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7C is a circuit diagram showing an eighth operating mode at
the time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7D is a circuit diagram showing a ninth operating mode at the
time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7E is a circuit diagram showing a tenth operating mode at the
time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7F is a circuit diagram showing an eleventh operating mode at
the time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7G is a circuit diagram showing a twelfth operating mode at
the time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 7H is a circuit diagram showing a thirteenth operating mode at
the time of the failure decision, according to Embodiment 1 of the
present application;
FIG. 8 is a wave form chart showing ideal operating wave forms, in
a case where a first IGBT element is made to drive, according to
Embodiment 1 of the present application;
FIG. 9 is a wave form chart showing ideal operating wave forms, in
a case where a second IGBT element is made to drive, according to
Embodiment 1 of the present application;
FIG. 10 is a wave form chart showing ideal operating wave forms, in
a case where a third IGBT element is made to drive, according to
Embodiment 1 of the present application;
FIG. 11 is a wave form chart showing ideal operating wave forms, in
a case where a fourth IGBT element is made to drive, according to
Embodiment 1 of the present application;
FIG. 12 is a circuit diagram showing a power conversion device,
according to Embodiment 2 of the present application;
FIG. 13 is a circuit diagram showing a power conversion device,
according to Embodiment 3 of the present application;
FIG. 14 is a circuit diagram showing a power conversion device,
according to Embodiment 4 of the present application;
FIG. 15 is a configuration diagram showing a configuration of the
hardware, in a failure decision unit of the present
application.
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
Referring to FIG. 1, explanation about Embodiment 1 of the present
application will be made. FIG. 1 is a circuit diagram of a power
conversion device 100 for explaining Embodiment 1 of the present
application.
It is to be noted that, in each of the drawings, the same reference
signs are used to refer to the same or corresponding
components.
As shown in FIG. 1, a power conversion device 100, which is placed
between a direct current power source 1a and a load 10, includes a
first smoothing condenser 2, a second smoothing condenser 6, a
first reactor 4a, a second reactor 4b, a first current sensor 3a
which detects current flowing through the first reactor 4a, and a
second current sensor 3b which detects current flowing through the
second reactor 4b. The power conversion device 100 is provided
with, as a first voltage conversion unit, a first IGBT element 5a1
and a first diode 5a2 which is in inverse parallel connection with
the first IGBT element 5a1; as a second voltage conversion unit, a
second IGBT element 5b1 and a second diode 5b2 which is in inverse
parallel connection with the second IGBT element 5b1; as a third
voltage conversion units, a third IGBT element 5c1 and a third
diode 5c2 which is in inverse parallel connection with the third
IGBT element 5c1; and as a fourth voltage conversion unit, a fourth
IGBT element 5d1 and a fourth diode 5d2 which is in inverse
parallel connection with the fourth IGBT element 5d1; and is
composed of a first voltage sensor 7a which detects a both end
voltage of the second smoothing condenser 6, a control signal unit
200, and a failure decision unit 300.
The control signal unit 200 generates gate signals of the first to
fourth IGBT elements 5a1 to 5d1, and turns on and off the first to
fourth IGBT elements 5a1 to 5d1, at a switching frequency fsw
(switching period Tsw). The failure decision unit 300 performs
failure decision, based on detected values of the first current
sensor 3a, the second current sensor 3b, and the first voltage
sensor 7a.
The first smoothing condenser 2 is connected in parallel to the
direct current power source 1a. A terminal 3a1 on one side of the
first current sensor 3a is connected to a positive electrode of the
first smoothing condenser 2 and a terminal 3b1 on one side of the
second current sensor 3b. A terminal 3a2 on the other side of the
first current sensor 3a is connected to the collector terminal of
the first IGBT element 5a1 and the emitter terminal of the second
IGBT element 5b1, via the first reactor 4a. A terminal 3b2 on the
other side of the second current sensor 3b is connected to the
collector terminal of the third IGBT element 5c1 and the emitter
terminal of the fourth IGBT element 5d1, via the second reactor
4b.
The emitter terminal of the first IGBT element 5a1 and the emitter
terminal of the third IGBT element 5c1 are connected to the
negative electrode of the first smoothing condenser 2 and the
negative electrode of the second smoothing condenser 6. The
collector terminal of the second IGBT element 5b1 and the collector
terminal of the fourth IGBT element 5d1 are connected to the
positive electrode of the second smoothing condenser 6. A terminal
7a1 on one side of the first voltage sensor 7a is connected to the
positive electrode of the second smoothing condenser 6, and a
terminal 7a2 on the other side is connected the negative electrode.
The load 10 is connected in parallel to the second smoothing
condenser 6.
The first output terminal 201a of the control signal unit 200 is
connected to the gate terminal of the first IGBT element 5a1, and
the second output terminal 201b is connected to the gate terminal
of the second IGBT element 5b1. The third output terminal 201c is
connected to the gate terminal of the third IGBT element 5c1, and
the fourth output terminal 201d is connected to the gate terminal
of the fourth IGBT element 5d1. The first input terminal 301a of
the failure decision unit 300 is connected to the output terminal
3a3 of the first current sensor 3a; the second input terminal 301b
is connected to the output terminal 3b3 of the second current
sensor 3b; and the third input terminal 302a is connected to the
output terminal 7a3 of the first voltage sensor 7a. The input
terminal 202 of the control signal unit 200 is connected to the
output terminal 303 of the failure decision unit 300.
As operating states of the power conversion device 100 which is in
a steady state, there exist two states; one (henceforth referred to
as power run operation) is a state, where electric power is
supplied from the first smoothing condenser 2 to the second
smoothing condenser 6, and the other (henceforth referred to as
regenerative operation) is a state, where electric power is
supplied from the second smoothing condenser 6 to the first
smoothing condenser 2, by exchanging the configurations of the
direct current power source 1a and the load 10, which are shown in
FIG. 1.
FIG. 2A, FIG. 2B, and FIG. 2C are circuit diagrams for explaining
operating modes at the time of power run operation, according to
Embodiment 1 of the present application. FIG. 3 shows ideal
operating wave forms at the time of power run operation, according
to Embodiment 1 of the present application. Dotted lines in FIG.
2A, FIG. 2B, and FIG. 2C represent current pathways. In FIG. 3,
relationships in the operating modes are represented among gate
signals G5a, G5b, G5c, G5d of the first to fourth IGBT elements 5a1
to 5d1; a both end voltage V4a of the first reactor 4a; a both end
voltage V4b of the second reactor 4b; a current I4a which flows
through the first reactor 4a; a current I4b which flows through the
second reactor 4b; and a voltage V2 of the second smoothing
condenser 6. As shown in FIG. 3, an operating mode at the beginning
is a first operating mode, which is shown in FIG. 2A. In the first
operating mode, the first IGBT element 5a1 becomes turned on, and
the second IGBT element 5b1 and the third IGBT element 5c1 and the
fourth IGBT element 5d1 become turned off. The current pathway
includes a pathway where current passes through the first smoothing
condenser 2, the first reactor 4a, the first IGBT element 5a1, and
the first smoothing condenser 2, and a pathway where current passes
through the first smoothing condenser 2, the second reactor 4b, the
fourth diode 5d2 and the second smoothing condenser 6, and the
first smoothing condenser 2. At the both ends of the first reactor
4a, a voltage V1 is applied, and at the both ends of the second
reactor 4b, a voltage (V1-V2) is applied. As for the direction of
current, a direction at the time of power run operation is defined
as positive.
The next operating mode is a third operating mode, which is shown
in FIG. 2C. In the third operating mode, the first to fourth IGBT
elements 5a1 to 5d1 become turned off, as shown in FIG. 2C. The
current pathway includes a pathway where current passes through the
first smoothing condenser 2, the first reactor 4a, the second diode
5b2, the second smoothing condenser 6, and the first smoothing
condenser 2, and a pathway where current passes through the first
smoothing condenser 2, the second reactor 4b, the fourth diode 5d2,
the second smoothing condenser 6, and the first smoothing condenser
2. At the both ends of the first reactor 4a and at the both ends of
the second reactor 4b, voltages (V1-V2) are applied.
The next operating mode is a second operating mode, which is shown
in FIG. 2B. In the second operating mode, as shown in FIG. 2B, the
third IGBT element 5c1 becomes turned on, and the first IGBT
element 5a1, the second IGBT element 5b1 and the fourth IGBT
element 5d1 become turned off. The current pathway includes a
pathway where current passes through the first smoothing condenser
2, the first reactor 4a, the second diode 5b2, the second smoothing
condenser 6, and the first smoothing condenser 2, and a pathway
where current passes through the first smoothing condenser 2, the
second reactor 4b, the third IGBT element 5c1 and the first
smoothing condenser 2. At the both ends of the first reactor 4a, a
voltage (V1-V2) is applied, and at the both ends of the second
reactor 4b, a voltage V1 is applied.
The next operating mode is a third operating mode, which is shown
in FIG. 2C. As the third operating mode is identical to or the same
with the before mentioned second operating mode, the explanation is
omitted.
By repetition of a series of modes which include "from a first
operating mode, a third operating mode, a second operating mode,
and a third operating mode," it becomes possible to step up the
voltage V1 of the first smoothing condenser 2 to an arbitrary
voltage, and output it as the voltage V2 of the second smoothing
condenser 6.
In the case of the regenerative operation, a different point from
the power run operation is only in that, the directions of currents
which flow through the first to fourth IGBT elements 5a1 to 5d1;
the gate signal G5a of the first IGBT element 5a1 is exchanged with
the gate signal G5b of the second IGBT element 5b1; the gate signal
G5c of the third IGBT element 5c1 is exchanged with the gate signal
G5d of the fourth IGBT element 5d1; and the voltage V2 is stepped
down. The current pathways are the same in the both operations.
Accordingly, no explanation in the regenerative operation will be
made also in subsequent explanation.
In the power conversion device 100, the first to fourth IGBT
elements 5a1 to 5d1 are controlled to turn on and off, so that a V2
detected value may become in agreement with a V2 target value. In
the case where malfunction is caused in any one of the first to
fourth IGBT elements 5a1 to 5d1, a current value I4a of the first
reactor 4a or a current value I4b of the second reactor 4b
represents an abnormal value; current values in the two pathways
become unbalanced; and increase in the current value I4a or the
current value I4b enlarges also a loss. As any of the first to
fourth IGBT elements 5a1 to 5d1 may exceed in heat proof
temperature and overcurrent may be caused to flow, normal operation
becomes impossible.
As an example of the before mentioned malfunction, an abnormal case
(henceforth, referred to as OFF state keeping abnormality) will be
presented, where any of the first to fourth IGBT elements 5a1 to
5d1 is in open failure and does not allow current to flow
through.
FIG. 4A and FIG. 4B are circuit diagrams for explaining operating
modes in the power run operation, in the case where an OFF state
keeping abnormality is caused in the first IGBT element 5a1, which
is in accordance with Embodiment 1 of the present application. A
current pathway of the fourth operating mode in the power run
operation, which is shown in FIG. 4A, and a current pathway of the
fifth operating mode in the power run operation, which is shown in
FIG. 4B, are identical to or the same with those of FIG. 2A, FIG.
2B, and FIG. 2C of Embodiment 1. Therefore, the explanation is
omitted.
FIG. 5 shows ideal operating wave forms, in the case where an OFF
state keeping abnormality is caused in the first IGBT element 5a1.
As shown in FIG. 5, in the case where the OFF state keeping
abnormality is caused in the first IGBT element 5a1, the first IGBT
element 5a1 cannot turn on and the current value I4a becomes 0 A.
Accordingly, unbalance is arisen between the current value I4a and
the current value I4b, and normal operation becomes impossible. At
the time of OFF state keeping abnormality in the second IGBT
element 5b1, the same state will be generated at the time of
regenerative operation. At the times of respective OFF state
keeping abnormalities in the third IGBT element 5c1 and the fourth
IGBT element 5d1, the difference is only in that the current value
I4a and the current value I4b have changes, and the voltage value
V4a and the voltage value V4b have changes, with respect to those
at times of respective OFF state keeping abnormalities in the first
IGBT element 5a1 and the second IGBT element 5b1. As operations are
the same with those at the times of respective OFF state keeping
abnormalities in the first IGBT element 5a1 and the second IGBT
element 5b1, the explanation is omitted.
Further, in the case where an abnormal state is caused in the first
current sensor 3a, or in the second current sensor 3b, it is
possible to attain a failure decision on the current sensor, based
on the fact that current values between binary parallels become
unbalanced. Also in the case where an OFF state keeping abnormality
is caused in the first to fourth IGBT elements 5a1 to 5d1, current
values between the binary parallels become unbalanced, as mentioned
above. Accordingly, a behavior, which is similar to that in the
case where an abnormal state is caused in a current sensor, is
generated, and the failure decision unit will make an erroneous
decision that a current sensor is in failure. Consequently,
distinguishing between the abnormality in a current sensor and the
abnormality in an IGBT element is necessary to perform a failure
decision.
FIG. 6 is a flow chart drawing in the failure decision, which is
used in Embodiment 1 of the present application. FIG. 7A, FIG. 7B,
FIG. 7C, FIG. 7D, FIG. 7E, FIG. 7F, FIG. 7G, and FIG. 711 are
circuit diagrams for explaining operating modes at the time of the
failure decision, which are used in Embodiment 1 of the present
application. Dotted lines, which are drawn in FIG. 7A, FIG. 7B,
FIG. 7C, FIG. 7D, FIG. 7E, FIG. 7F, FIG. 7G, and FIG. 711,
represent current pathways.
As shown in FIG. 6, in Step ST0, normal control is continued; in
Step ST1, the failure decision unit confirms that unbalance is not
caused in current values between the binary parallels, and if the
unbalance is not caused, the failure decision unit repeats the
control, and continues the detection of the current value and the
voltage value. In the case where unbalance is caused in the current
values between the binary parallels, in Step ST2, the first IGBT
element 5a1 is made to drive. In Step ST3, in the case where the
voltage V2 of the second smoothing condenser 6 makes a change in
intensity, the first IGBT element 5a1 is in a normal state, and in
the case where the voltage V2 does not make a change, in Step ST4
the failure decision unit decides that the first IGBT element 5a1
is in an OFF state keeping abnormality. This determination method
uses the fact that, in the case where an OFF state keeping
abnormality is caused in the IGBT element, current does not flow
through and then, the voltage V2 does not make a change, as
mentioned above.
In the case where the voltage V2 of the second smoothing condenser
6 makes a change, in Step ST5, the second IGBT element 5b1 is made
to drive. Then, in Step ST6, the failure decision unit decides
whether the voltage V2 of the second smoothing condenser 6 makes a
change or not, and in the case where the voltage V2 makes a change,
the failure decision unit decides that the second IGBT element 5b1
is in a normal state. In the case where the voltage V2 does not
make a change, in Step ST7, the failure decision unit decides that
an OFF state keeping abnormality is caused in the second IGBT
element 5b1. In the case where the second IGBT element 5b1 is in a
normal state, in Step ST8, the third IGBT element 5c1 is made to
drive. In Step ST9, the failure decision unit checks whether the
voltage V2 of the second smoothing condenser 6 makes a change or
not. In the case where the voltage V2 is found to make a change,
the failure decision unit decides that the third IGBT element 5c1
is in a normal state, and in the case where the voltage V2 is found
not to make a change, in Step ST10, the failure decision unit
decides that the third IGBT element 5c1 is in an OFF state keeping
abnormality. If the abnormality is not found until the checks up to
the third IGBT element 5c1, in Step ST11, the fourth IGBT element
5d1 is made to drive, and in Step ST12, the failure decision unit
checks whether the second smoothing condenser 6 makes a change or
not in voltage. In the case where the voltage V2 is found to make a
change, the failure decision unit decides that the fourth IGBT
element 5d1 is in a normal state. In the case where the voltage V2
does not make a change, in Step ST13, the failure decision unit
decides that an OFF state keeping abnormality is caused in the
fourth IGBT element 5d1. If the first to fourth IGBT elements 5a1
to 5d1 are decided to be in a normal state, in Step ST14, the
failure decision unit makes a failure decision that a current
sensor is in an abnormal state.
Consequently, it becomes possible to distinguish abnormalities in
the current sensors from abnormalities in the first to fourth IGBT
elements 5a1 to 5d1.
FIG. 8 shows ideal operating wave forms, at the time when only the
first IGBT element 5a1 is made to drive, and represents
relationships among gate signals of the first to fourth IGBT
elements 5a1 to 5d1, reactor currents, reactor voltages, and a
condenser voltage.
As shown in FIG. 8, the operating mode at the beginning is a sixth
operating mode, which is shown in FIG. 7A. In this case, the first
IGBT element 5a1 is in on state, and the second IGBT element 5b1,
the third IGBT element 5c1, and the fourth IGBT element 5d1 are in
off state. As shown in FIG. 7A, the current pathway is a pathway
where current passes through the first smoothing condenser 2, the
first reactor 4a, the first IGBT element 5a1, and the first
smoothing condenser 2, and a voltage V1 is applied to the both ends
of the first reactor 4a.
The next operating mode is a seventh operating mode, which is shown
in FIG. 7B. In this case, the first to fourth IGBT elements 5a1 to
5d1 are in off state. As shown in FIG. 7B, the current pathway is a
pathway where current passes through the first smoothing condenser
2, the first reactor 4a, the second diode 5b2, the second smoothing
condenser 6, and the first smoothing condenser 2, and a voltage
(V1-V2) is applied to the both ends of the first reactor 4a. If the
first IGBT element 5a1 is in a normal state, the voltage V4a, the
current I4a, and the voltage V2 make changes, like solid line
graphs (A) of FIG. 8. If the first IGBT element 5a1 is in an OFF
state keeping abnormality, the first IGBT element does not turn on,
and then, the voltage V4a, the current I4a, and the voltage V2 make
no changes, like dotted line graphs (B) of FIG. 8. Therefore, it
becomes possible to attain a failure decision of the first IGBT
element 5a1, by the existence or non-existence of the change in the
voltage V2.
FIG. 9 shows ideal operating wave forms, at the time when only the
second IGBT element 5b1 is made to drive, and represents the
relationships among gate signals, reactor currents, reactor
voltages, and a condenser voltage.
As shown in FIG. 9, the voltage V2 in an initial state is supposed
to have a value, which is larger than the voltage V1. Further, the
operating mode at the beginning is a tenth operating mode, which is
shown in FIG. 7E. In this case, the second IGBT element 5b1 becomes
turned on, and the first IGBT element 5a1 and the third IGBT
element 5c1 and the fourth IGBT element 5d1 become turned off. The
current pathway is a pathway where current passes through the
second smoothing condenser 6, the second IGBT element 5b1, the
first reactor 4a, the first smoothing condenser 2, and the second
smoothing condenser 6, and a voltage (V1-V2) is applied to the both
ends of the first reactor 4a.
The next operating mode is an eleventh operating mode, which is
shown in FIG. 7F. In this case, the first to fourth IGBT elements
5a1 to 5d1 become turned off. The current pathway is a pathway
where current passes through the first reactor 4a, the first
smoothing condenser 2, the first diode 5a2, and the first reactor
4a, and a voltage V1 is applied to the both ends of the first
reactor 4a. If the second IGBT element 5b1 is in a normal state,
the voltage V4a, the current I4a, and the voltage V2 make changes
like solid line graphs (A) of FIG. 9. If the second IGBT element
5b1 is in an OFF state keeping abnormality, the second IGBT element
does not turn on, and then, the voltage V4a, the current I4a, and
the voltage V2 make no changes, like dotted line graphs (B) of FIG.
9. Therefore, it becomes possible to attain a failure decision of
the second IGBT element 5b1, by the existence or non-existence of
the change in the voltage V2.
FIG. 10 shows ideal operating wave forms at the time when only the
third IGBT element 5c1 is made to drive, and represents
relationships among gate signals, reactor currents, reactor
voltages, and a condenser voltage. As shown in FIG. 10, the
operating mode at the beginning is an eighth operating mode, which
is shown in FIG. 7C. In this case, the third IGBT element 5c1
becomes turned on, and the first IGBT element 5a1 and the second
IGBT element 5b1 and the fourth IGBT element 5d1 become turned off.
The current pathway is a pathway where current passes through the
first smoothing condenser 2, the second reactor 4b, the third IGBT
element 5c1 and the first smoothing condenser 2, and a voltage V1
is applied to the both ends of the second reactor 4b.
The next operating mode is a ninth operating mode, which is shown
in FIG. 7D. In this case, the first to fourth IGBT elements 5a1 to
5d1 become turned off. The current pathway is a pathway where
current passes through the first smoothing condenser 2, the second
reactor 4b, the fourth diode 5d2, the second smoothing condenser 6,
and the first smoothing condenser 2, and a voltage (V1-V2) is
applied to the both ends of the second reactor 4b. If the third
IGBT element 5c1 is in a normal state, the voltage V4b, the current
I4b, and the voltage V2 make changes like solid line graphs (A) of
FIG. 10. If the third IGBT element 5c1 is in an OFF state keeping
abnormality, the third IGBT element does not become turned on, and
then, the voltage V4b, the current I4b, and the voltage V2 make no
changes, like dotted line graphs (B) of FIG. 10. Therefore, it
becomes possible to attain a failure decision of the third IGBT
element 5c1, by the existence or non-existence of the change in the
voltage V2.
FIG. 11 shows ideal operating wave forms at the time when only the
fourth IGBT element 5d1 is made to drive, and represents the
relationships among gate signals, reactor currents, reactor
voltages, and a condenser voltage.
As shown in FIG. 11, the voltage V2 in an initial state is supposed
to have a value, which is larger than the voltage V1. Further, the
operating mode at the beginning is a twelfth operating mode, which
is shown in FIG. 7G. In this case, the fourth IGBT element 5d1
becomes turned on, and the first to third IGBT elements 5a1 to 5c1
become turned off. The current pathway is a pathway where current
passes through the second smoothing condenser 6, the fourth IGBT
element 5d1, the second reactor 4b, the first smoothing condenser
2, and the second smoothing condenser 6, and a voltage (V1-V2) is
applied to the both ends of the second reactor 4b.
The next operating mode is a thirteenth operating mode, which is
shown in FIG. 711. In this case, the first to fourth IGBT elements
5a1 to 5d1 become turned off. The current pathway is a pathway
where current passes through the second reactor 4b, the first
smoothing condenser 2, the third diode 5c2, and the second reactor
4b, and a voltage V1 is applied to the both ends of the second
reactor 4b. If the fourth IGBT element 5d1 is in a normal state,
the voltage V4b, the current I4b, and the voltage V2 make changes
like solid line graphs (A) of FIG. 11. If the fourth IGBT element
5d1 is in an OFF state keeping abnormality, the fourth IGBT element
5d1 does not become turned on, and then, the voltage V4b, the
current I4b, and the voltage V2 make no changes, like dotted line
graphs (B) of FIG. 11. Therefore, it becomes possible to attain a
failure decision of the fourth IGBT element 5d1, by the existence
or non-existence of the change in the voltage V2.
In the case where an OFF state keeping abnormality is caused in the
first IGBT element 5a1 or in the third IGBT element 5c1, current
cannot flow through the first reactor 4a or the second reactor 4b
in the power run operation, and normal operation is not possible.
In the regenerative operation, however, normal operation becomes
possible, because the first IGBT element 5a1 and the third IGBT
element 5c1 are not used. In the power run operation, normal
operation is possible, even in the case where an OFF state keeping
abnormality is caused in the second IGBT element 5b1 or in the
fourth IGBT element 5d1, because the second IGBT element 5b1 and
the fourth IGBT element 5d1 are not used.
Consequently, performing the before mentioned operations makes it
possible to specify a part where an OFF state keeping abnormality
of the first to fourth IGBT elements 5a1 to 5d1 is caused, and it
becomes possible to continue the transmission of electric power
using normal state IGBT elements.
It is to be noted that, in the power conversion device 100
according to Embodiment 1, a case where IGBTs (Insulated Gate
Bipolar Transistors) are used as the first to fourth IGBT elements
5a1 to 5d1 is explained. However, even in a case where switching
elements employ MOSFETs (Metal Oxide Semiconductor Field Effect
Transistors), similar effects as in Embodiment 1 will be
obtained.
Further, although in Embodiment 1, explanation is given about a
case where an uncombined type reactor is employed as a reactor of
the power conversion device 100, similar effects as in Embodiment 1
will obtained, even in a case where the reactor employs a combined
type reactor.
Further, in Embodiment 1, in the failure decision of current
sensors and IGBT elements, first driving is made to the first IGBT
element 5a1, in a case where unbalance is caused in current values
between the binary parallels. However, it is allowed to drive any
IGBT element at first, and the IGBT elements may be made to drive
in any order.
Further, in Embodiment 1, there is shown a case where a current
sensor is connected between a reactor and the positive electrode of
the first smoothing condenser 2. However, similar effects as in
Embodiment 1 will be obtained, even if the current sensors are
connected to the places where a first current and a second current
which flow through the first reactor 4a and the second reactor 4b
respectively, can be detected.
Embodiment 2
In FIG. 1 to FIG. 11, arrangements between the first smoothing
condenser 2 and the second smoothing condenser 6 are in binary
parallel constitution. In Embodiment 2, however, a case of trinary
parallel constitution will be explained.
FIG. 12 is a circuit diagram of a power conversion device 101 in
the trinary parallel constitution, for explaining Embodiment 2. In
the case of trinary parallel constitution, added component parts,
as those which are different from in binary parallel constitution,
are a third current sensor 3c, a third reactor 4c; as a fifth
voltage conversion unit, a fifth IGBT element 5e1 and a fifth diode
5e2, which is in inverse parallel connection with the fifth IGBT
element 5e1; and as a sixth voltage conversion unit, a sixth IGBT
element 5f1 and a sixth diode 5f2, which is in inverse parallel
connection with the sixth IGBT element 5f1. That is to say, a state
is created where three current sensors are connected.
The third current sensor 3c, the third reactor 4c, the fifth IGBT
element 5e1, and the sixth IGBT element 5f1, which are added,
achieve functions similar to those of the parts in the binary
parallel constitution.
In the description below, explanation is made about the connection
of the added parts. The third current sensor 3c includes a terminal
3c1, which is connected to the positive electrode of the first
smoothing condenser 2 and the terminal 3a1 of the first current
sensor 3a; and a terminal 3c2, which is connected to, via the third
reactor 4c, the collector terminal of the fifth IGBT element 5e1
and the emitter terminal of the sixth IGBT element 5f1. The emitter
terminal of the fifth IGBT element 5e1 is connected to the negative
electrode of the first smoothing condenser 2, and the collector
terminal of the sixth IGBT element 5f1 is connected to the positive
electrode of the second smoothing condenser 6. A terminal 201e of
the control signal unit 200 is connected to the gate terminal of
the fifth IGBT element 5e1, and a terminal 201f of the control
signal unit 200 is connected to the gate terminal of the sixth IGBT
element 5f1. A terminal 301c of the failure decision unit 300 is
connected to the terminal 3c3 of the third current sensor 3c.
In the power conversion device 101 of Embodiment 2, two operations,
a power run operation and a regenerative operation, are present in
a steady state. Compared with the power conversion device 100 of
Embodiment 1, the power conversion device 101 of Embodiment 2 is
different only in that the number of parallel connections in a
circuit is increased. Accordingly, the operation in a steady state
and the behavior at the time of OFF state keeping abnormality are
the same as those of the power conversion device 100 of Embodiment
1, and then, the explanation is omitted.
In the power conversion device 101 of Embodiment 2, failure
decisions are carried out on the first to sixth IGBT elements 5a1
to 5f1 and the current sensors, in the case where unbalance is
caused in the current values among parallel elements. Moreover, it
becomes possible to specify a sensor which is in a fault condition,
from among the first to third current sensors 3a to 3c.
In the description below, explained is a way how to specify a
current sensor which is in a fault condition, out of the first to
third current sensors 3a to 3c. Differences are taken each other in
current values I3a to I3c of the first to third current sensors 3a
to 3c, and are represented as Equations (1) to (3). |I3a-I3b|=I3ab
(1) |I3a-I3c|=I3ac (2) |I3b-I3c|=I3bc (3)
Among the first to third current sensors 3a to 3c, a current sensor
which is in a fault condition differs from other normal state
current sensors in current value. For example, in the case where
the first current sensor 3a is in a fault condition, a difference
I3ab and a difference I3ac become larger values than a difference
I3bc, because the current value I3a is different from other current
values.
It is to be noted that, even in the case where the second current
sensor 3b or the third current sensor 3c is in a fault condition,
similar explanation can be made.
Further, in the case where the power conversion device 101 of
Embodiment 2 employs switching elements of MOSFETs to the first to
sixth IGBT elements 5a1 to 5f1, similar effects as those of
Embodiment 2 can be obtained.
Further, in Embodiment 2, there is shown a case where an uncombined
type reactor is employed to the reactor of the power conversion
device 101. However, similar effects can be obtained, even if a
reactor of combined type is employed.
Further, there is shown a case where the current sensors of
Embodiment 2 are connected between the reactors and the positive
electrodes of the first smoothing condenser 2. However, similar
effects can be obtained, even if respective current sensors are
connected to the places where a first current, a second current,
and a third current, which flow through the first reactor 4a, the
second reactor 4b, and the third reactor 4c respectively, can be
detected.
Further, in Embodiment 2, explanation is made about a power
conversion device 101 of trinary parallel constitution. However,
similar effects can be obtained also in a power conversion device
of N-nary parallel constitution, where N denotes a natural number
equal to or larger than 3. That is to say, in the case where three
or more current sensors are connected and the switching elements
are decided to be in a normal state, it becomes possible to specify
that a first current sensor having a value which is deviated from
other first current sensors is in an abnormal state.
Embodiment 3
Next, explanation is made about Embodiment 3. FIG. 13 is a circuit
diagram of a power conversion device 102 in accordance with
Embodiment 3.
As shown in FIG. 13, the power conversion device 102 according to
Embodiment 3, in addition to the components of the power conversion
device 100 according to Embodiment 1, employs additionally a second
voltage sensor 7b which detects the voltage V1 at the both ends of
the first smoothing condenser 2, a bi-directional power source 1b,
and a fourth current sensor 8a which detects a current I1b flowing
through the bi-directional power source 1b. Here, the
bi-directional power source 1b is a single unit power source, which
functions as a power source when performing the power run
operation, and functions as a load when performing the regenerative
operation.
Explanation will be made about the connection of added components.
A terminal 7b1 of the second voltage sensor 7b is connected to the
positive electrode of the first smoothing condenser 2; and a
terminal 7b2 of the sensor is connected to the negative electrode
of the condenser. One end of the bi-directional power source 1b is
connected to a terminal 8a2 of the fourth current sensor 8a, and
the other end of the power source is connected to the negative
electrode of the second smoothing condenser 6. A terminal 8a1 of
the fourth current sensor 8a is connected to the positive electrode
of the second smoothing condenser 6. An input terminal 301d of the
failure decision unit 300 is connected to the output terminal 8a3
of the fourth current sensor 8a, and the output terminal 7b3 of the
second voltage sensor 7b is connected to the input terminal 302b of
the failure decision unit.
According to Embodiment 3, it is possible to distinguish failures
in the current sensors from failures in the first to fourth IGBT
elements 5a1 to 5d1, and moreover, it is possible to distinguish a
failure in the first current sensor 3a from a failure in the second
current sensor 3b, based on the values of respective types of
sensors.
Explained next is a way how to distinguish between a failure of the
first current sensor 3a and a failure of the second current sensor
3b. Supposing that an electric power from the first smoothing
condenser 2 is W1, a detected value of the second voltage sensor 7b
is V1, a detected value of the first current sensor 3a is I3a, and
a detected value of the second current sensor 3b is I3b, the
electric power W1 from the first smoothing condenser 2 will be
expressed as Equation (4). W1=V1.times.(I3A+I3b) (4)
Further, supposing that an electric power to the second smoothing
condenser 6 is W2, a detected value of the first voltage sensor 7a
is V2, and a detected value of the fourth current sensor 8a is I8a,
the electric power W2 to the second smoothing condenser 6 will be
expressed as Equation (5). W2=V2.times.I8a (5)
Because the electric power W1 from the first smoothing condenser 2
and the electric power W2 to the bi-directional power source 1b
become equivalent in value, the relation between the two is
represented as Equation (6). (I3a+I3b)=V2.times.I8a/V1 (6)
In the case where the rate between the current I3a and the current
I3b can be assumed, the relation between the two is represented as
Equation (7), using a coefficient y. I3a=y.times.I3b (7)
From Equation (6) and Equation (7), I3a can be represented by
Equation (8) and I3b can be represented by Equation (9).
I3a=V2.times.I8a/V1.times.y/(1+y) (8) I3b=V2.times.I8a/V1/(1+y)
(9)
If there is deviation in value between an I3a estimated value which
is calculated from Equation (8) and a detected value I3a of the
first current sensor 3a, it can be found that the first current
sensor 3a is out of order. If there is deviation in value between
an I3b estimated value which is calculated from Equation (9) and a
detected value I3b of the second current sensor 3b, it can be found
that the second current sensor 3b is out of order. That is to say,
in the case where the first to fourth IGBT elements 5a1, 5b1, 5c1,
and 5d1 are decided to be in a normal state, the electric power W1
supplied from the first smoothing condenser 2 and the electric
power W2 to the bi-directional power source 1b are measured.
Accordingly, it becomes possible to specify one or more current
sensors to be in an abnormal state, according to the deviation
level of the current value which is detected by the current sensor,
with respect to a current value assumed based on the measured
values. It is to be noted that, a current sensor which is in an
abnormal state can be specified based on a calculated electric
power value, instead of measuring the electric power, where the
electric power value is calculated based on a voltage value
detected by the voltage sensor and a current value detected by the
current sensor, as shown in Equation (5), which is mentioned
before.
It is to be noted that, although in Embodiment 3, explanation is
made about a power conversion device 102 of binary parallel
constitution, similar effects as those of Embodiment 3 can be
obtained also in a power conversion device of N-nary parallel
constitution, where N denotes a natural number equal to or larger
than two.
Further, explanation is made about a case where current sensors are
connected to all of the binary parallels in the power conversion
device 102 according to Embodiment 3. However, similar effects as
in Embodiment 3 can be obtained, even if at least one current
sensor is connected to.
Further, description is made about a case where the first to fourth
IGBT elements 5a1 to 5d1 are employed in the power conversion
device 102 according to Embodiment 3. However, similar effects can
be obtained, even if MOSFETs are employed as switching
elements.
Further, in Embodiment 3, there is shown a case where an uncombined
type reactor is used to the reactor of the power conversion device
102. However, similar effects can be obtained, even if a reactor of
combined type is used.
Further, explanation is made about a case where the current sensors
of Embodiment 3 are connected between the reactors and the positive
electrode of the first smoothing condenser 2. However, similar
effects can be obtained, even if the current sensors are connected
to the places where a first current and a second current, which
flow through the first reactor 4a and the second reactor 4b
respectively, can be detected.
Embodiment 4
Next, explanation will be made about Embodiment 4. FIG. 14 is a
circuit diagram of a power conversion device 103 in accordance with
Embodiment 4.
As shown in FIG. 14, the power conversion device 103 according to
Embodiment 4 makes it possible to calculate an estimated value in
current, by sending information of the electric power to the
bi-directional power source 1b, from the terminal 1b3 of the
bi-directional power source 1b to the terminal 301e of the failure
decision unit 300, where the fourth current sensor 8a is deleted,
compared with the power conversion device 102 according to
Embodiment 3.
The power conversion device 103 according to Embodiment 4 differs
in the following points, compared with the power conversion device
102 according to Embodiment 3. That is to say, one point is that a
terminal 1b1 of the bi-directional power source 1b is connected to
the terminal 7a1 of the first voltage sensor 7a, and the other
point is that a terminal 1b3 of the bi-directional power source 1b
is connected to the terminal 301e of the failure decision unit
300.
In the description below, explanation will be made about the
calculation of an estimated value. By inserting Equation (5) into
Equation (8) and Equation (9), Equation (10) on the current I3a and
Equation (11) on the current I3b, which both use the electric power
W2, will be represented. I3a=W2/V1.times.y/(1+y) (10)
I3b=W2/V1/(1+y) (11)
If there is deviation in the value between an I3a estimated value
which is calculated from Equation (10) and a detected value I3a of
the first current sensor 3a, it can be found that the first current
sensor 3a is out of order. If there is deviation in the value
between an I3b estimated value which is calculated from Equation
(11) and a detected value I3b of the second current sensor 3b, it
can be found that the second current sensor 3b is out of order.
It is to be noted that, although explanation in Embodiment 4 is
made about the power conversion device 103 of binary parallel
constitution, similar effects as those of Embodiment 4 are obtained
also with the power conversion device of N-nary parallel
constitution, where N denotes a natural number equal to or larger
than two.
Further, in Embodiment 4, explanation of the power conversion
device 103 is made about a case where current sensors are connected
to all of the binary parallels. However, similar effects can be
obtained, even if at least one current sensor is connected to.
Further, there is shown a case where the first to fourth IGBT
elements 5a1 to 5d1 are employed in the power conversion device 103
of Embodiment 4. However, similar effects can be obtained, even if
MOSFETs are employed as switching elements.
Further, in Embodiment 4, there is shown a case where an uncombined
type reactor is employed to the reactor of the power conversion
device 103. However, similar effects can be obtained, even if a
reactor of combined type is employed.
Further, in Embodiment 4, there is shown a case where current
sensors are connected between the reactors and the positive
electrode of the first smoothing condenser 2. However, similar
effects as in Embodiment 4 can be obtained, even if the current
sensors are connected to the places where a first current and a
second current, which flow through the first reactor 4a and the
second reactor 4b respectively, can be detected.
It is to be noted that, the failure decision unit 300 is composed
of a processor 310 and a storage device 320, as FIG. 15 shows an
example of the hardware. The storage device 320, which is not shown
in the detail, is provided with volatile memory devices, such as
random access memories, and nonvolatile auxiliary storage devices,
such as flash memories. Further, the storage device 320 is provided
with auxiliary storage devices of hard disks, instead of flash
memories. The processor 310 executes a program which is input from
the storage device 320. In this case, the program is input into the
processor 310, via volatile memory devices, from auxiliary storage
devices. Further, the processor 310 is allowed to output data of
calculated results and others to the volatile memory devices of the
storage device 320, and is also allowed to save the data, via the
volatile memories, in the auxiliary storage device.
Although the present application is described above in terms of
various exemplary embodiments and implementations, it should be
understood that the various features, aspects and functionality
described in one or more of the individual embodiments are not
limited in their applicability to the particular embodiment with
which they are described, but instead can be applied, alone or in
various combinations to one or more of the embodiments. It is
therefore understood that numerous modifications which have not
been exemplified can be devised without departing from the scope of
the present application. For example, at least one of the
constituent components may be modified, added, or eliminated. At
least one of the constituent components mentioned in at least one
of the preferred embodiments may be selected and combined with the
constituent components mentioned in another preferred
embodiment.
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