U.S. patent number 10,534,098 [Application Number 15/890,372] was granted by the patent office on 2020-01-14 for radiographic imaging apparatus.
This patent grant is currently assigned to FUJIFILM Corporation. The grantee listed for this patent is FUJIFILM Corporation. Invention is credited to Keiichi Akamatsu, Takeya Meguro, Haruyasu Nakatsugawa, Shinichi Ushikura.
United States Patent |
10,534,098 |
Akamatsu , et al. |
January 14, 2020 |
Radiographic imaging apparatus
Abstract
A radiographic imaging apparatus includes a sensor board
including a flexible substrate, and a plurality of pixels that are
provided on a first surface of the substrate to accumulate
electrical charges generated in accordance with light converted
from radiation. Additionally, the radiographic imaging apparatus
includes flexible cables having one ends electrically connected to
the sensor board and the other ends provided with connectors, and
flexible cables on which signal processing circuit parts are
mounted and which are connected electrically to the cables by the
one ends thereof being electrically connected to the connectors.
Additionally, the radiographic imaging apparatus includes flexible
cables having one ends electrically connected to the sensor board
and the other ends provided with connectors, and flexible cables on
which drive circuit parts are mounted and which are connected
electrically to the cables by the one ends thereof being
electrically connected to the connectors.
Inventors: |
Akamatsu; Keiichi (Kanagawa,
JP), Ushikura; Shinichi (Kanagawa, JP),
Meguro; Takeya (Kanagawa, JP), Nakatsugawa;
Haruyasu (Kanagawa, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
FUJIFILM Corporation |
Minato-ku, Tokyo |
N/A |
JP |
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Assignee: |
FUJIFILM Corporation (Tokyo,
JP)
|
Family
ID: |
63582444 |
Appl.
No.: |
15/890,372 |
Filed: |
February 7, 2018 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20180275292 A1 |
Sep 27, 2018 |
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Foreign Application Priority Data
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Mar 22, 2017 [JP] |
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2017-056560 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06T
11/00 (20130101); H04N 5/32 (20130101); G01T
1/16 (20130101); G01T 1/362 (20130101) |
Current International
Class: |
G01T
1/36 (20060101); H04N 5/32 (20060101); G06T
11/00 (20060101); G01T 1/16 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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H09-152486 |
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Jun 1997 |
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JP |
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2012-122841 |
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Jun 2012 |
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JP |
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2014-025847 |
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Feb 2014 |
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JP |
|
Other References
English language translation of the following: Office action dated
Dec. 3, 2019 from the JPO in a Japanese patent application No.
2017-056560 corresponding to the instant patent application. This
office action translation is submitted now in order to supplement
the understanding of the cited references which are being disclosed
in the instant Information Disclosure Statement. cited by
applicant.
|
Primary Examiner: Gaworecki; Mark R
Attorney, Agent or Firm: SOLARIS Intellectual Property
Group, PLLC
Claims
What is claimed is:
1. A radiographic imaging apparatus comprising: a sensor board
including a flexible substrate, and a plurality of pixels that are
provided on a first surface of the substrate to accumulate
electrical charges generated in accordance with light converted
from radiation; a first flexible cable having one end electrically
connected to the sensor board by thermocompression and the other
end provided with a first connector; and at least one of: (i) a
board on which a circuit part to be driven, in a case in which an
electrical charge accumulated in each of the plurality of pixels is
read, is mounted and which is electrically connected to the first
cable by being electrically connected to the first connector, or
(ii) a second flexible cable on which a circuit part to be driven,
in a case in which an electrical charge accumulated in each of the
plurality of pixels is read, is mounted and which is electrically
connected to the first cable by one end of the second flexible
cable being electrically connected to the first connector.
2. The radiographic imaging apparatus according to claim 1, further
comprising: a control board on which a control unit that controls
the reading of the electrical charges accumulated in the plurality
of pixels of the sensor board is mounted, wherein the other end of
the second cable is provided with the second connector in a case in
which the second cable is provided, and the second cable and the
control board are electrically connected together by the second
connector.
3. The radiographic imaging apparatus according to claim 1, further
comprising: a control board on which a control unit that controls
the reading of the electrical charges accumulated in the plurality
of pixels of the sensor board is mounted, wherein the other end of
the second cable is electrically connected to the control board by
a thermocompression part in a case in which the second cable is
provided.
4. The radiographic imaging apparatus according to claim 1, wherein
the circuit part includes a circuit of a signal processing unit to
which electrical signals according to the electrical charges
accumulated in the plurality of pixels are input and which
generates and outputs image data according to the input electrical
signals.
5. The radiographic imaging apparatus according to claim 1, further
comprising: a flexible third cable on which a drive unit, which
causes the electrical charges to be read from the plurality of
pixels, is mounted and which has one end electrically connected to
the sensor board.
6. The radiographic imaging apparatus according to claim 1, wherein
the circuit part includes a circuit of a drive unit that causes the
electrical charges to be read from the plurality of pixels.
7. The radiographic imaging apparatus according to claim 1, wherein
the circuit part includes a circuit of a signal processing unit to
which electrical signals according to the electrical charges
accumulated in the plurality of pixels are input and which
generates and outputs image data according to the input electrical
signals, wherein a signal processing board is further provided,
which is included in the signal processing unit and on which a
circuit different from the circuit included in the circuit part is
mounted, wherein the other end of the second cable is provided with
the second connector in a case in which the second cable is
provided, and the second cable and the signal processing board are
electrically connected together by the second connector.
8. The radiographic imaging apparatus according to claim 1, wherein
the circuit part includes a circuit of a signal processing unit to
which electrical signals according to the electrical charges
accumulated in the plurality of pixels are input and which
generates and outputs image data according to the input electrical
signals, wherein a signal processing board is further provided,
which is included in the signal processing unit and on which a
circuit different from the circuit included in the circuit part is
mounted, and wherein the other end of the second cable is
electrically connected to the signal processing board by a
thermocompression part in a case in which the second cable is
provided.
9. The radiographic imaging apparatus according to claim 1, wherein
the circuit part includes a circuit of a drive unit that causes the
electrical charges to be read from the plurality of pixels, wherein
a driving substrate is further provided, which is included in the
drive unit and on which a circuit different from the circuit
included in the circuit part is mounted, and wherein the other end
of the second cable is provided with the second connector in a case
in which the second cable is provided, and the second cable and the
driving substrate are electrically connected together by the second
connector.
10. The radiographic imaging apparatus according to claim 1,
wherein the circuit part includes a circuit of a drive unit that
causes the electrical charges to be read from the plurality of
pixels, wherein a driving substrate is further provided, which is
included in the drive unit and on which a circuit different from
the circuit included in the circuit part is mounted, and wherein
the other end of the second cable is electrically connected to the
driving substrate by a thermocompression part in a case in which
the second cable is provided.
11. The radiographic imaging apparatus according to claim 1,
wherein the first cable includes a ground electrode that supplies a
predetermined ground potential.
12. The radiographic imaging apparatus according to claim 1,
wherein the flexible substrate is a resinous sheet.
Description
CROSS-REFERENCE TO RELATED APPLICATION
This application claims priority under 35 USC 119 from Japanese
Patent Application No. 2017-056560 filed Mar. 22, 2017, the
disclosure of which is incorporated by reference herein.
BACKGROUND
Technical Field
The present invention relates to a radiographic imaging
apparatus.
Related Art
In the related art, radiographic imaging apparatuses that perform
radiographic imaging for medical diagnosis have been known. Such
radiographic imaging apparatuses include a sensor board in which a
plurality of pixels that accumulate electrical charges generated in
accordance with light converted from radiation are provided on a
substrate, and a radiation detector that detects the radiation
transmitted through a subject by this sensor board to generate a
radiographic image is used.
In such a radiation detector, by electrically connecting circuit
parts provided outside the sensor board and the sensor board
together, the electrical charges accumulated in the respective
pixels are read by driving of the circuit parts. The connection
between the sensor board and the circuit parts is made by
electrically connecting cables, such as flexible cables, to the
substrate of the sensor board.
A radiographic imaging apparatus in which the circuit parts used
for the reading of the electrical charges are mounted on the cables
that electrically connects the circuit parts and the sensor board
together and are formed as chips on a film (COF) is known (refer to
JP1997-152486A (JP-H09-152486A)).
SUMMARY
Generally, in a case where cables that electrically connects the
circuit parts and a pixel group together are connected to the
substrate of the sensor board, there is a case where so-called
reworking of detaching the cables connected to the substrate of the
sensor board to newly reconnect the cables is performed due to the
deviation of the connecting positions of the cables, a problem of
the circuit parts mounted in the case of the cables on which the
circuit parts are mounted, or the like.
Meanwhile, it is desired to use a flexible substrate for the sensor
board. By using the flexible substrate, for example, there is a
case where the weight of the radiographic imaging apparatus
(radiation detector) can be reduced and imaging of a subject
becomes easy.
In a case where the substrate used for the sensor board is
flexible, for example, there is a case where the reworking in the
connection of the cables to the sensor board is not easily
performed due to deflection of the substrate, or the like.
An object of the present disclosure is to provide a radiographic
imaging apparatus that can easily perform reworking on a sensor
board.
In order to achieve the above object, a radiographic imaging
apparatus of the present disclosure comprises a sensor board
including a flexible substrate, and a plurality of pixels that are
provided on a first surface of the substrate to accumulate
electrical charges generated in accordance with light converted
from radiation; a first flexible cable having one end electrically
connected to the sensor board and the other end provided with a
first connector; and at least one of a board on which a circuit
part to be driven in a case where an electrical charge accumulated
in each of the plurality of pixels is read is mounted and which is
electrically connected to the first cable by being electrically
connected to the first connector, and a second flexible cable on
which the circuit part is mounted and which is electrically
connected to the first cable by one end thereof being electrically
connected to the first connector.
Additionally, the radiographic imaging apparatus of the present
disclosure may further comprise a control board on which a control
unit that controls the reading of the electrical charges
accumulated in the plurality of pixels of the sensor board is
mounted, and the other end of the second cable may be provided with
the second connector in a case where the second cable is provided,
and the second cable and the control board are electrically
connected together by the second connector.
Additionally, the radiographic imaging apparatus of the present
disclosure may further comprise a control board on which a control
unit that controls the reading of the electrical charges
accumulated in the plurality of pixels of the sensor board is
mounted, and the other end of the second cable may be electrically
connected to the control board by a thermocompression part in a
case where the second cable is provided.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a signal
processing unit to which electrical signals according to the
electrical charges accumulated in the plurality of pixels are input
and which generates and outputs image data according to the input
electrical signals.
Additionally, the radiographic imaging apparatus of the present
disclosure may further comprise a flexible third cable on which a
drive unit, which causes the electrical charges to be read from the
plurality of pixels, is mounted and which has one end electrically
connected to the sensor board.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a drive unit
that causes the electrical charges to be read from the plurality of
pixels.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a signal
processing unit to which electrical signals according to the
electrical charges accumulated in the plurality of pixels are input
and which generates and outputs image data according to the input
electrical signals, a signal processing board may be further
provided, which is included in the signal processing unit and on
which a circuit different from the circuit included in the circuit
part is mounted, the other end of the second cable may be provided
with the second connector in a case where the second cable is
provided, and the second cable and the signal processing board are
electrically connected together by the second connector.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a signal
processing unit to which electrical signals according to the
electrical charges accumulated in the plurality of pixels are input
and which generates and outputs image data according to the input
electrical signals, a signal processing board may be further
provided, which is included in the signal processing unit and on
which a circuit different from the circuit included in the circuit
part is mounted, and the other end of the second cable may be
electrically connected to the signal processing board by a
thermocompression part in a case where the second cable is
provided.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a drive unit
that causes the electrical charges to be read from the plurality of
pixels, a driving substrate may be further provided, which is
included in the drive unit and on which a circuit different from
the circuit included in the circuit part is mounted, and the other
end of the second cable may be provided with the second connector
in a case where the second cable is provided, and the second cable
and the driving substrate are electrically connected together by
the second connector.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the circuit part may include a circuit of a drive unit
that causes the electrical charges to be read from the plurality of
pixels, a driving substrate may be further provided, which is
included in the drive unit and on which a circuit different from
the circuit included in the circuit part is mounted, and the other
end of the second cable may be electrically connected to the
driving substrate by a thermocompression part in a case where
second cable is provided.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the first cable may include a ground electrode that
supplies a predetermined ground potential.
Additionally, in the radiographic imaging apparatus of the present
disclosure, the flexible substrate may be a resinous sheet.
According to the present disclosure, the reworking on the sensor
board can be easily performed.
BRIEF DESCRIPTION OF THE DRAWINGS
Exemplary Embodiments of the present invention will be described in
detail with reference to the following figures, wherein:
FIG. 1 is a block diagram illustrating an example of the
configuration of main parts of an electrical system in a
radiographic imaging apparatus of a first embodiment, and is also a
configuration view illustrating an example of the configuration of
a sensor board in a radiation detector.
FIG. 2 is a cross-sectional view illustrating the outline of an
example of the configuration of a radiation detector of a first
embodiment.
FIG. 3 is a plan view of an example a state where cables are
connected to terminal regions of the radiation detector of the
first embodiment, as seen from a first surface side of a
substrate.
FIG. 4 is a plan view of an example of a state where a drive unit
and a signal processing unit are connected to the radiation
detector of the first embodiment, as seen from the first surface
side of the substrate.
FIG. 5 is a plan view of another example of the state where the
drive unit and the signal processing unit are connected to the
radiation detector of the first embodiment, as seen from the first
surface side of the substrate.
FIG. 6 is a plan view of an example of a state where cables are
connected to the terminal regions of the radiation detector of a
second embodiment, as seen from the first surface side of the
substrate.
FIG. 7 is a plan view of an example of a state where drive units
and signal processing units are connected to the terminal regions
of the radiation detector of the second embodiment, as seen from
the first surface side of the substrate.
FIG. 8 is a plan view of another example of the state where the
drive units and the signal processing units are connected to the
terminal regions of the radiation detector of the second
embodiment, as seen from the first surface side of the
substrate.
FIG. 9 is a plan view of an example of a state where cables are
connected to the terminal regions of the radiation detector of a
third embodiment, as seen from the first surface side of the
substrate.
FIG. 10A is a plan view of an example of cables connected to a
sensor board.
FIG. 10B is a cross-sectional view taken along line A-A of the
cables illustrated in FIG. 10A.
DETAILED DESCRIPTION
Hereinafter, embodiments of the invention will be described in
detail with reference to the drawings. In addition, the present
embodiments do not limit the invention.
First Embodiment
A radiographic imaging apparatus of the present embodiment has a
function of capturing a radiographic image of an object to be
imaged, by detecting radiation transmitted through a subject, which
is an object to be imaged, and outputting image information
representing a radiographic image of the subject.
First, the outline of an example of the configuration of an
electrical system in the radiographic imaging apparatus of the
present embodiment will be described with reference to FIG. 1. FIG.
1 is a block diagram illustrating an example of the configuration
of main parts of the electrical system in the radiographic imaging
apparatus of the present embodiment.
As illustrated in FIG. 1, the radiographic imaging apparatus 1 of
the present embodiment includes a radiation detector 10, a control
unit 100, a drive unit 102, a signal processing unit 104, an image
memory 106, and a power source unit 108.
The radiation detector 10 includes a sensor board 12 (refer to FIG.
2) and a conversion layer (refer to FIG. 2) that converts radiation
into light. The sensor board 12 includes a flexible substrate 14
and a plurality of pixels 16 provided on a first surface 14A of the
substrate 14. In addition, in the following, the plurality of
pixels 16 are simply referred to as "pixels 16".
As illustrated in FIG. 1, each pixel 16 of the present embodiment
includes a sensor part 22 that generates and accumulates an
electrical charge in accordance with the light converted by the
conversion layer, and a switching element 20 that reads the
electrical charge accumulated in the sensor part 22. In the present
embodiment, as an example, a thin film transistor (TFT) is used as
the switching element 20. For that reason, in the following, the
switching element 20 is referred to as a "TFT 20". In the present
embodiment, a layer in which the pixels 16 are formed on the first
surface 14A of the substrate 14 is provided as a flattened layer in
which the sensor parts 22 and the TFTs 20 are formed.
The pixels 16 are two-dimensionally disposed in one direction (a
scanning wiring direction corresponding to a transverse direction
of FIG. 1, hereinafter referred to as a "row direction"), and a
direction intersecting the row direction (a signal wiring direction
corresponding to the longitudinal direction of FIG. 1, hereinafter
referred as a "column direction") in an active area 15 of the
sensor board 12. Although an array of the pixels 16 are illustrated
in a simplified manner in FIG. 1, for example, 1024.times.1024
pixels 16 are disposed in the row direction and the column
direction.
Additionally, a plurality of scanning wiring lines 26, which are
provided for respective rows of the pixels 16 to control switching
states (ON and OFF) of the TFTs 20, and a plurality of signal
wiring lines 24, which are provided for respective columns of the
pixels 16 and from which electrical charges accumulated in the
sensor parts 22 are read, are provided in a mutually intersecting
manner in the radiation detector 10. The plurality of scanning
wiring lines 26 are respectively connected to the drive unit 102
via terminals (not illustrated), respectively, and thereby, driving
signals, which are output from the drive unit 102 to drive the TFTs
20 to control the switching states thereof, flow to the plurality
of scanning wiring lines 26, respectively. Additionally, the
plurality of signal wiring lines 24 are respectively connected to
the signal processing unit 104 via terminals (not illustrated),
respectively, and thereby, electrical charges read from the
respective pixels 16 are output to the signal processing unit 104
as electrical signals. The signal processing unit 104 generates and
outputs image data according to the input electrical signals.
The control unit 100 to be described below is connected to the
signal processing unit 104, and the image data output from the
signal processing unit 104 is sequentially output to the control
unit 100. The image memory 106 is connected to the control unit
100, and the image data sequentially output from the signal
processing unit 104 is sequentially stored in the image memory 106
under the control of the control unit 100. The image memory 106 has
a storage capacity capable of storing image data equivalent to a
predetermined number of sheets, and whenever radiographic images
are captured, image data obtained by the capturing is sequentially
stored in the image memory 106.
The control unit 100 includes a central processing unit (CPU) 100A,
a memory 100B including a read only memory (ROM), a random access
memory (RAM), and the like, and a nonvolatile storage unit 100C,
such as a flash memory. An example of the control unit 100 is a
microcomputer or the like. The control unit 100 controls the
overall operation of the radiographic imaging apparatus 1.
In addition, in the radiographic imaging apparatus 1 of the present
embodiment, the image memory 106, the control unit 100, and the
like are formed in the control board 110.
Additionally, common wiring lines 28 are provided in a wiring
direction of the signal wiring lines 24 at the sensor parts 22 of
the respective pixels 16 in order to apply bias voltages to the
respective pixels 16. Bias voltages are applied to the respective
pixels 16 from a bias power source by connecting the common wiring
lines 28 to the bias power source (not illustrated) outside the
sensor board 12 via a pad (not illustrated).
The power source unit 108 supplies electrical power to various
elements or various circuits, such as the control unit 100, the
drive unit 102, the signal processing unit 104, the image memory
106, and power source unit 108. In addition, in FIG. 1,
illustration of wiring lines, which connect the power source unit
108 and various elements or various circuits together, is omitted
in order to avoid complication.
Moreover, the radiation detector 10 of the present embodiment will
be described in detail. FIG. 2 is a cross-sectional view
illustrating the outline of an example of the radiation detector 10
of the present embodiment.
As illustrated in FIG. 2, the radiation detector 10 of the present
embodiment includes the sensor board 12 including the substrate 14
and the pixels 16, and a conversion layer 30, and the substrate 14,
the pixels 16, and the conversion layer 30 are provided in this
order. In addition, in the following, a direction (upward-downward
direction in FIG. 2) in which the substrate 14, the pixels 16, and
the conversion layer 30 are arranged is referred to as a lamination
direction.
The substrate 14 is a resinous sheet having flexibility and
including, for example, plastics, such as polyimide. A specific
example of the substrate 14 is XENOMAX (registered trademark). In
addition, the substrate 14 may have any desired flexibility and is
not limited to the resin sheet. For example, the substrate 14 may
be a relatively thin glass substrate. The thickness of the
substrate 14 may be a thickness such that desired flexibility is
obtained in accordance with the hardness of a material, the size of
the sensor board 12 (the area of the first surface 14A or the
second surface 14B), or the like. For example, in a case where the
substrate 14 is the resin sheet, the thickness thereof may be 5
.mu.m to 125 .mu.m. Additionally, in a case where the substrate 14
is the glass substrate, the substrate 14 has flexibility in a case
where the thickness thereof becomes 0.3 mm or less in a size in
which one side is 43 cm or less. Therefore, the thickness may be
0.3 mm or less.
As illustrated in FIG. 2, the plurality of pixels 16 are provided
in an inner partial region on the first surface 14A of the
substrate 14. That is, in the sensor board 12 of the present
embodiment, no pixel 16 is provided at an outer peripheral part of
the first surface 14A of the substrate 14. In the present
embodiment, the region on the first surface 14A of the substrate 14
where the pixels 16 are provided is used as the active area 15. In
addition, in the present embodiment, as an example, the pixels 16
are provided on the first surface 14A of the substrate 14 via an
undercoat layer (not illustrated) using SiN or the like.
Additionally, as illustrated in FIG. 2, terminal regions 34
including terminals electrically connected to the signal wiring
lines 24 or the scanning wiring lines 26 are provided at an outer
periphery of the first surface 14A of the substrate 14. As
illustrated in FIG. 3, flexible cables 220 and flexible (having
flexibility) cables 320 are electrically connected to the terminals
(not illustrated) provided in the terminal regions 34. In addition,
in the present embodiment, connection regarding components referred
to as "cables" including the cables 220 and the cables 320 means
electrical connection unless otherwise mentioned. In addition, the
cables 220 and the cables 320 include signal lines 150 (refer to
FIG. 10A and FIG. 10B) consisting of conductors, and are
electrically connected by the connection of the signal lines. The
cables 220 and cables 320 of the present embodiment are examples of
a first cable of the present disclosure. Additionally, in the
following, the "cables" means flexible (having flexibility)
cables.
A plan view of an example of a state where the cables 220 and the
cables 320 are connected to the terminal regions 34 of the
radiation detector 10 of the present embodiment, as seen from the
first surface 14A side of the substrate 14, is illustrated in FIG.
3. As illustrated in FIG. 3, in the present embodiment, the
terminal regions 34 are respectively provided at an outer edge 14L2
and an outer edge 14L3 of two adjacent sides of the rectangular
radiation detector 10.
In the outer edge 14L2, one ends of the plurality (four in FIG. 3)
of cables 220 are connected to the terminals (not illustrated)
formed in a terminal region 34 by thermocompression. The cables 220
have a function of connecting the drive unit 102 and the scanning
wiring lines 26 together (to refer to FIG. 1). The plurality of
signal lines 150 (refer to FIG. 10A and FIG. 10B) included in a
cable 220 are connected to the scanning wiring lines 26 (refer to
FIG. 1) via the terminals formed in the connected terminal region
34. The other ends of the cables 220 are respectively provided with
connectors 230A. The connectors 230A of the present embodiment are
examples of a first connector of the present disclosure.
In addition, connectors 230, connectors 236 to be described below,
connectors 330, and connectors 336 are, for example, connectors of
a zero insertion force (ZIF) structure or connectors of a Non-ZIF
structure.
Meanwhile, in the outer edge 14L3, one ends of the plurality (four
in FIG. 3) of cables 320 are connected to the terminals (not
illustrated) formed in a terminal region 34 by thermocompression.
The plurality of signal lines 150 (refer to FIG. 10A and FIG. 10B)
included in a cable 320 are connected to the signal wiring lines 24
(refer to FIG. 1) via the terminals formed in the connected
terminal region 34. The cables 320 have a function of connecting
the signal processing unit 104 and the signal wiring lines 24
together (to refer to FIG. 1). The other ends of the cables 320 are
respectively provided with connectors 330A. The connectors 330A of
the present embodiment are examples of the first connector of the
present disclosure.
Additionally, as illustrated in FIG. 2, the conversion layer 30
covers the active area 15. In the present embodiment, a
scintillator including CsI (cesium iodide) is used as an example of
the conversion layer 30. It is preferable that such a scintillator
includes, for example, CsI:T1 (cesium iodide to which thallium is
added) or CsI:Na (cesium iodide to which sodium is added) having an
emission spectrum of 400 nm to 700 nm at the time of X-ray
irradiation. In addition, the emission peak wavelength in a visible
light region of CsI:T1 is 565 nm.
In the present embodiment, the conversion layer 30 of CsI is
directly formed as a columnar crystal on the sensor board 12 by a
vapor-phase deposition method, such as a vacuum vapor deposition
method, a sputtering method, and a chemical vapor deposition (CVD)
method. In this case, the side of the conversion layer 30, which in
contact with the pixels 16, becomes a base point side in a growth
direction of the columnar crystal.
In addition, in this way, in a case where the conversion layer of
CsI is directly formed on the sensor board 12 by the vapor-phase
deposition method, for example, a reflective layer (not
illustrated) having a function of reflecting the light converted in
the conversion layer 30 may be provided on the surface of the
conversion layer opposite to the side in contact with the sensor
board 12. The reflective layer may be directly provided in the
conversion layer 30, and or may be provided via an adhesion layer
or the like. As a material of the reflective layer in this case, it
is preferable to use an organic material, and it is preferable to
use, for example, at least one of white polyethylene terephthalate
(PET), TiO.sub.2, Al.sub.2O.sub.3, foamed white PET, a
polyester-based high-reflection sheet, specular reflection
aluminum, or the like. Particularly, it is preferable to use the
white PET as the material from a viewpoint of reflectivity.
In addition, the white PET is obtained by adding a white pigment,
such as TiO.sub.2 or barium sulfate, to PET. Additionally, the
polyester-based high-reflection sheet is a sheet (film) having a
multilayer structure in which a plurality of thin polyester sheets
are laminated. Additionally, the foamed white PET is white PET of
which the front surface is porous.
Additionally, in a case where the scintillator of CsI is used as
the conversion layer 30, the conversion layer 30 can also be formed
in the sensor board 12 by a method different from that of the
present embodiment. For example, the conversion layer 30 may be
formed in the sensor board 12 by preparing CsI vapor-deposited on
an aluminum sheet or the like by the vapor-phase deposition method,
and gluing the side of CsI, which is not in contact with the
aluminum sheet, and the pixels 16 of the sensor board 12 together
with an adhesive sheet or the like.
Moreover, unlike the radiation detector 10 of the present
embodiment, GOS (Gd.sub.2O.sub.2S:Tb) or the like may be used as
the conversion layer 30 instead of CsI. In this case, for example,
the conversion layer 30 can be formed in the sensor board 12 by
preparing a sheet glued on a support formed of the white PET or the
like with an adhesion layer or the like, the sheet being obtained
by dispersing GOS in a binder, such as resin, and by gluing the
side of GOS on which the support is not glued, and the pixels 16 of
the sensor board 12 together with an adhesive sheet or the
like.
In addition, a protective film or an antistatic film that covers a
part or the entirety of the radiation detector 10 or the conversion
layer 30 or the like may be provided. The protective film is, for
example, a PARYLENE (registered trademark) film, an insulating
sheet, such as polyethylene terephthalate, or the like is used.
Additionally, the antistatic film, for example, an LAPPET
(registered trademark) sheet obtained by laminating aluminum, such
as by bonding aluminum foil, on the insulating sheet (film), such
as polyethylene terephthalate, or a film using an antistatic
coating material "COLCOAT" (trade name: made by COLCOAT CO., LTD),
or the like.
Next, the connection between the radiation detector 10 of the
present embodiment, and the drive unit 102 and the signal
processing unit 104 will be described in detail. A plan view of an
example of a state where the drive unit 102 and the signal
processing unit 104 are connected to the radiation detector 10 of
the present embodiment, as seen from the first surface 14A side of
the substrate 14, is illustrated in FIG. 4.
In the present embodiment, the drive unit 102 is realized by
circuits and elements that are mounted on a driving substrate 202,
and drive circuit parts 212. The drive circuit parts 212 are
integrated circuits (ICs) including circuits different from the
circuits mounted on the driving substrate 202 among various
circuits and elements that realize the drive unit 102.
Each drive circuit part 212 is mounted on each cable 222, and is
connected to a plurality of signal lines included in the cable 222.
The cables 222 of the present embodiment are examples of a second
cable of the present disclosure. Connectors 230B are provided at
one ends of the cables 222, and connectors 236A are provided at the
other ends of the cables 222. The connectors 236A of the present
embodiment are examples of a second connector of the present
disclosure. The connectors 230B of the cables 222 and the
connectors 230A provided in the cables 220 connected to the sensor
board 12 are connected together. In the following, the connectors
230A and the connectors 230B are simply referred to as "connectors
230" in a case where these connectors are generically referred to
without being distinguished from each other.
Additionally, a plurality of connectors 236B connected to the
various circuits and elements that are mounted on the driving
substrate 202 are provided in a region of an end part of the
driving substrate 202. The connectors 236B provided in the driving
substrate 202 and the connectors 236A of the cables 222 are
connected together. In the following, the connectors 236A and the
connectors 236B are simply referred to as "connectors 236" in a
case where these connectors are generically referred to without
being distinguished from each other.
As illustrated in FIG. 4, the drive unit 102 and the respective
scanning wiring lines 26 are connected together by the cables 222
and the cables 220 connected to the sensor board 12 being connected
together by the connectors 230 and the cables 222 and the driving
substrate 202 being connected together by the connectors 236.
Meanwhile, in the present embodiment, the signal processing unit
104 is realized by circuits and elements that are mounted on the
signal processing unit 104, and signal processing circuit parts
314. The signal processing circuit parts 314 are ICs including
circuits different from the circuits mounted on a signal processing
board 304 among various circuits and elements that realize the
signal processing unit 104.
Each signal processing circuit part 314 is mounted on each cable
322, and is connected to a plurality of signal lines included in
the cable 322. The cables 322 of the present embodiment are
examples of the second cable of the present disclosure. Connectors
330B are provided at one ends of the cables 322, and connectors
336A are provided at the other ends of the cables 322. The
connectors 336A of the present embodiment are examples of the
second connector of the present disclosure. The connectors 330B of
the cables 322 and the connectors 330A provided in the cables 320
connected to the sensor board 12 are connected together. In the
following, the connectors 330A and the connectors 330B are simply
referred to as "connectors 330" in a case where these connectors
are generically referred to without being distinguished from each
other.
Additionally, a plurality of connectors 336B connected to the
various circuits and elements that are mounted on the signal
processing board 304 are provided in a region of an end part of the
signal processing board 304. The connectors 336B provided in the
signal processing board 304 and the connectors 336A of the cables
322 are connected together. In the following, the connectors 336A
and the connectors 336B are simply referred to as "connectors 336"
in a case where these connectors are generically referred to
without being distinguished from each other.
As illustrated in FIG. 4, the signal processing unit 104 and the
respective signal wiring lines 24 are connected together by the
cables 322 and the cables 320 connected to the sensor board 12
being connected together by the connectors 330 and the cables 322
and the signal processing board 304 being connected together by the
connectors 336.
As described above, the radiographic imaging apparatus 1 of the
present embodiment includes the sensor board 12 including the
flexible substrate 14, and the plurality of pixels 16 that are
provided on the first surface 14A of the substrate 14 to accumulate
the electrical charges generated in accordance with the light
converted from radiation. Additionally, the radiographic imaging
apparatus 1 includes the flexible cables 320 having the one ends
electrically connected to the sensor board 12 and the other ends
provided with the connectors 230A, and the flexible cables 322 on
which the signal processing circuit parts 314 to be driven in a
case where the electrical charges accumulated in the plurality of
pixels 16 are read are mounted and which are connected electrically
to the cables 320 by the one ends thereof being electrically
connected to the connectors 330. Additionally, the radiographic
imaging apparatus 1 includes the flexible cables 220 having the one
ends electrically connected to the sensor board 12 and the other
ends provided with the connectors 330A and the flexible cables 220
on which the drive circuit parts 212 to be driven in a case where
the electrical charges accumulated in the plurality of pixels 16
are read are mounted and which are connected electrically to the
cables 222 by the one ends thereof being electrically connected to
the connectors 230.
In this way, in the radiographic imaging apparatus 1 of the present
embodiment, the connectors 230A are provided in the cables 220
connected to the sensor board 12 of the radiation detector 10.
Additionally, the cables 222 are provided with the connectors 236A
for connection with the driving substrate 202.
Accordingly, in the radiographic imaging apparatus 1 of the present
embodiment, in a case where the drive unit 102 is connected to the
sensor board 12, the cables 222 on which the drive circuit parts
212 are mounted may be connected to the cables 220 connected to the
sensor board 12 by the connectors 230, and the driving substrate
202 and the cables 222 may be connected together by the connectors
236.
In this way, the drive unit 102 and the sensor board 12 can be
connected together by the connectors 230 and the connectors 236.
Therefore, in the sensor board 12, deviation of the connecting
positions of the cables (the cables 222 in the present embodiment)
on which the drive circuit parts 212 are mounted can be suppressed.
Additionally, attachment and detachment of the drive unit 102
become easy.
In addition, in the following, detaching the drive unit 102 or the
signal processing unit 104 from the sensor board 12 to newly
reconnect the drive unit 102 or the signal processing unit 104 due
to a problem, positional deviation, or the like of the drive unit
102 or the signal processing unit 104 is referred to as
"reworking".
Additionally, in the radiographic imaging apparatus 1 of the
present embodiment, the connectors 330A are provided in the cables
320 connected to the sensor board 12 of the radiation detector 10.
Additionally, the cables 322 are provided with the connectors 336A
for connection with the signal processing board 304.
Accordingly, in the radiographic imaging apparatus 1 of the present
embodiment, in a case where the signal processing unit 104 is
connected to the sensor board 12, the cables 322 on which the
signal processing circuit parts 314 are mounted may be connected to
the cables 320 connected to the sensor board 12 by the connectors
330, and the signal processing board 304 and the cables 322 may be
connected together by the connectors 336.
Additionally, in a case where the cables 222 on which the drive
circuit parts 212 are mounted or the cables 322 on which the signal
processing circuit parts 314 are mounted are directly connected to
the sensor board 12 unlike the present embodiment, for example,
there is a case where the substrate 14 of the sensor board 12 is
deflected due to the weight of the drive circuit parts 212 or the
signal processing circuit parts 314. In this way, in a case where
the substrate 14 is deflected, positional deviation easily occurs
in the connecting positions of the cables 222 and the cables
322.
In contrast, in the radiographic imaging apparatus 1 of the present
embodiment, the signal processing unit 104 and the sensor board 12
can be connected together by the connectors 330 and the connectors
336. Therefore, in the sensor board 12, deviation of the connecting
positions of the cables (the cables 322 in the present embodiment)
on which the signal processing circuit parts 314 are mounted can be
suppressed. Additionally, attachment and detachment of the signal
processing unit 104 become easy.
Therefore, according to the radiographic imaging apparatus 1 of the
present embodiment, the reworking on the sensor board 12 can be
easily performed.
In addition, a form in which the driving substrate 202 and the
cables 222 are connected together by the connectors 236 and the
signal processing board 304 and the cables 322 are connected
together by the connectors 336 is illustrated in FIG. 4. However,
the invention is not limited to the form illustrated in FIG. 4. For
example, the driving substrate 202 and the cables 222 may be
connected together by thermocompression, and the signal processing
board 304 and the cables 322 may be connected together by
thermocompression. For example, at least one of the driving
substrate 202 and cables 222 or the signal processing board 304 and
the cables 322 may be connected together by other methods, such as
thermocompression.
As an example, unlike the form illustrated in FIG. 4, a form in
which no connectors 236A are provided in the cables 222, no
connectors 236B are not provided in the driving substrate 202, and
the cables 222 and the driving substrate 202 are connected together
by thermocompression is illustrated in FIG. 5. Additionally, unlike
the form illustrated in FIG. 4, a state where no connectors 336A
are provided in the cables 322, no connectors 336B are provided in
the signal processing board 304, and the cables 322 and the signal
processing board 304 are connected together by thermocompression is
illustrated in the form illustrated in FIG. 5. The terminal regions
34 in this case is an example of a thermocompression part of the
present embodiment.
Second Embodiment
A plan view of an example of a state where drive units 102 and
signal processing units 104 are connected to the radiation detector
10 of the present embodiment, as seen from the first surface 14A
side of the substrate 14, is illustrated in FIG. 6.
As illustrated in FIG. 6, in the radiographic imaging apparatus 1
of the present embodiment, ICs that realize the drive units 102 are
mounted on cables 221, and the drive units 102 are connected to the
signal lines included in the cables 221. The cables 221 of the
present embodiment are examples of a third cable of the present
disclosure.
Similar to the radiation detector 10 of the first embodiment, the
cables 221 and the sensor board 12 are connected together by
thermocompression, and the drive units 102 and the scanning wiring
lines 26 of the sensor board 12 are connected together by the
cables 221.
Additionally, instead of the signal processing circuit parts 314 of
the first embodiment, ICs that realize the signal processing units
104 are mounted on the cables 322. The signal processing units 104
are connected to the signal lines included in the cables 322.
The signal processing units 104 and the signal wiring lines 24 of
the sensor board 12 are connected together by connecting the
connectors 330B of the cables 322 and the connectors 330A provided
in the cables 320 connected to the sensor board 12 together.
Additionally, in the present embodiment, instead of the signal
processing board 304 of the first embodiment, the connectors 336B
are provided in a region of an end part of the control board 110,
and the connectors 336B provided in the control board 110 and the
connectors 336A of the cables 322 are connected together. In this
way, in the radiographic imaging apparatus 1 of the present
embodiment, the control board 110 and the signal processing units
104 are connected together by the connectors 336.
In this way, in the radiographic imaging apparatus 1 of the present
embodiment, the connectors 330A are provided in the cables 320
connected to the sensor board 12 of the radiation detector 10.
Accordingly, in the radiographic imaging apparatus 1 of the present
embodiment, in a case where the signal processing units 104 are
connected to the sensor board 12, the cables 322 on which the
signal processing units 104 are mounted may be connected to the
cables 320 connected to the sensor board 12 by the connectors
330.
In this way, the signal processing units 104 and the sensor board
12 can be connected together by the connectors 330. Therefore,
deviation of the connecting positions of the cables (the cables 322
in the present embodiment) on which the signal processing units 104
are mounted can be suppressed in the sensor board 12. Additionally,
attachment and detachment of the signal processing units 104 become
easy.
Additionally, in the radiographic imaging apparatus 1 of the
present embodiment, the control board 110 and the signal processing
units 104 can be connected together by the connectors 336.
Therefore, for example, in a case where a problem has occurred in
any one of the signal processing units 104 or the control board
110, one in which the problem has not occurred can be used as it
is.
Therefore, according to the radiographic imaging apparatus 1 of the
present embodiment, the reworking on the sensor board 12 can be
easily performed.
In addition, in the radiographic imaging apparatus 1 illustrated in
FIG. 6, cables 221 on which drive units 102 are mounted are
directly connected to the sensor board 12. However, ICs that are
the drive units 102 have a weight of about 1/10 compared to ICs
that are the signal processing units 104, and is relatively light
in weight. For that reason, in connection to the cables 221, for
example, the deflection of the substrate 14 by the weight of the
connected drive units 102 is suppressed. Therefore, positional
deviation does not occur easily. For that reason, even in a case
where the cables 221 on which the drive units 102 are mounted are
directly connected to the sensor board 12 as in the radiographic
imaging apparatus 1 of the present embodiment, the reworking does
not become difficult in many cases.
In addition, as illustrated in FIG. 7, the cables 220 provided with
the connectors 230A may be connected to the sensor board 12 similar
to the first embodiment, and the cables 221 on which the drive
units 102 are mounted may also be provided with the connectors
230B. In this case, since the drive units 102 and the scanning
wiring lines 26 can be connected together by connecting the cables
220 and the cables 221 together by the connectors 230, the
reworking can be easily performed.
In addition, although a form in which the control board 110 and the
cables 322 are connected together by the connectors 336 is
illustrated in FIG. 6, the invention is not limited to the form
illustrated in FIG. 6. For example, as illustrated in FIG. 8, the
control board 110 and the cables 322 may be connected together by
thermocompression in thermocompression parts 111 provided at the
end part of the control board 110. According to the radiographic
imaging apparatus 1 of the present embodiment, for example, even
the cables 322 in a state where the control board 110 is connected
can be easily connected by the connectors 330, and can be easily
detached. Therefore, the reworking on the sensor board 12 can be
easily performed.
Third Embodiment
A plan view of an example of a state where the drive units 102 and
the signal processing units 104 are connected to the radiation
detector 10 of the present embodiment, as seen from the first
surface 14A side of the substrate 14, is illustrated in FIG. 9.
As illustrated in FIG. 9, in the radiographic imaging apparatus 1
of the present embodiment, packaged ICs that realize the signal
processing units 104 are mounted on the control board 110.
Additionally, the end part of the control board 110 is provided
with connectors 330B for connection to the cables 320 in
correspondence with the signal processing units 104, respectively.
The control board 110 of the present embodiment is an example of a
board of the present disclosure.
In the radiographic imaging apparatus 1 of the present embodiment,
the signal processing units 104 and the signal wiring lines 24 of
the sensor board 12 are connected together by connecting the
connectors 330A of the cables 320 and the connectors 330B provided
in the control board 110 together.
Accordingly, in the radiographic imaging apparatus 1 of the present
embodiment, in a case where the signal processing units 104 are
connected to the signal wiring lines 24 of the sensor board 12, the
control board 110 and the cables 320 may be connected together by
the connectors 330.
Therefore, similar to the radiographic imaging apparatus 1 of each
of the above embodiments, in the sensor board 12, deviation of the
connecting position of the control board 110 on which the signal
processing units 104 are mounted can be suppressed. Additionally,
attachment and detachment of the signal processing units 104 become
easy.
Therefore, according to the radiographic imaging apparatus 1 of the
present embodiment, the reworking on the sensor board 12 can be
easily performed.
In addition, in the radiographic imaging apparatus 1 of each of the
above embodiments, the sensor board 12 is provided with at least
one of the cables 220 provided with the connectors 230 and the
cables 320 provided with the connectors 330, and at least one of
the cables 220 and the cables 320 are connected to at least one of
the drive units 102 or the signal processing units 104 via the
connectors 230 and the connectors 330. For that reason, in the
radiographic imaging apparatus 1 of each of the above embodiments,
the total length of the cables used for these kinds of connection
tends to be long. As the length of the cables becomes long, noise
is likely to overlap electrical signals flowing through signal
lines included in the cables. For that reason, cables obtained by
performing a noise countermeasure on the cables used for these
kinds of connection, particularly, the cables 220 and the cables
320 can be used. An example of a cable 220 and a cable 320 that
have undergone a noise countermeasure is illustrated in FIG. 10.
FIG. 10A illustrates a state where the cable 220 and the cable 320
are in a plan view, and FIG. 10B is a cross-sectional view taken
along line A-A of FIG. 10A. In addition, although FIG. 10
illustrates, as an example, a case where each of the cable 220 and
the cable 320 includes five signal lines 150, the number of signal
lines 150 is not particularly limited.
Additionally, in the example illustrated in FIG. 10, a ground
electrode 152 that supplies a ground potential is provided in
parallel to the arrangement of the five signal lines 150 arranged
in one row and in a layer separate from the signal lines 150. In
this way, since the electrostatic capacity between the signal lines
150 and the ground electrode 152 is increased by providing the
ground electrode 152 within the cable 220 and the cable 320,
impedance can be lowered to suppress noise.
Additionally, in each of the above embodiments, as illustrated in
FIG. 1, an aspect in which the pixels 16 are two-dimensionally
arrayed in a matrix has been described. However, the pixels 16 may
be one-dimensionally arrayed or may be arrayed in a honeycomb
shape. Additionally, the shape of the pixels is also not limited,
and may be a rectangular shape, or may be a polygonal shape, such
as a hexagonal shape. Moreover, it goes without saying that that
the shape of the active area 15 is also not limited.
Additionally, the radiation detector 10 (radiographic imaging
apparatus 1) of each of the above embodiments may be applied to a
so-called irradiation side sampling (ISS) type in which the sensor
board 12 is disposed on a side where the radiation of the
conversion layer 30 enters, or may be applied to a so-called
penetration side sampling (PSS) in which the sensor board 12 is
disposed on a side opposite to the side where the radiation of the
conversion layer 30 enters.
In addition, it goes without saying that the configurations,
manufacturing methods, and the like of the radiographic imaging
apparatuses 1, the radiation detectors 10, and the like that are
described in the respective above embodiments are merely examples,
and can be modified in accordance with situations without departing
from the scope of the invention.
Explanation of References
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