U.S. patent number 10,393,974 [Application Number 16/207,220] was granted by the patent office on 2019-08-27 for 4-channel parallel-optical device for monitoring emission power and monitoring method thereof.
This patent grant is currently assigned to O-NET COMMUNICATIONS (SHENZHEN) LIMITED. The grantee listed for this patent is O-NET COMMUNICATIONS (SHENZHEN) LIMITED. Invention is credited to Jiangqing Lei, Yanyong Wang, Tengfei Zhu.
United States Patent |
10,393,974 |
Lei , et al. |
August 27, 2019 |
4-channel parallel-optical device for monitoring emission power and
monitoring method thereof
Abstract
A 4-channel parallel-optical (SR4) device for monitoring an
emission power includes an emission assembly, a receiving assembly,
and a monitoring assembly. The emission assembly includes an
emission chip, a first planar groove, and a second planner groove.
The receiving assembly includes a third planar groove and a
receiving chip. The emission chip emits the laser to the first
planar groove, the first planar groove transmits a part of the
laser to the second planar groove, and the second planar groove
total reflects the transmitted laser to an optical fiber. The first
planar groove reflects a part of the laser to the monitoring
assembly. The monitoring assembly receives the reflected laser and
monitors power parameters of the reflected laser, the laser is
emitted to the third planar groove through the optical fiber, the
third planar groove total reflects the laser to the receiving chip,
and the receiving chip receives the laser.
Inventors: |
Lei; Jiangqing (Shenzhen,
CN), Zhu; Tengfei (Shenzhen, CN), Wang;
Yanyong (Shenzhen, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
O-NET COMMUNICATIONS (SHENZHEN) LIMITED |
Shenzhen |
N/A |
CN |
|
|
Assignee: |
O-NET COMMUNICATIONS (SHENZHEN)
LIMITED (Shenzhen, CN)
|
Family
ID: |
63317079 |
Appl.
No.: |
16/207,220 |
Filed: |
December 3, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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PCT/CN2018/101795 |
Aug 22, 2018 |
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Foreign Application Priority Data
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Mar 30, 2018 [CN] |
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2018 1 0276704 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01S
5/0228 (20130101); H01S 5/02252 (20130101); G02B
6/4295 (20130101); H04B 10/40 (20130101); G02B
6/4286 (20130101); G02B 6/4214 (20130101); H01S
5/02284 (20130101); H01S 5/0683 (20130101); H01S
5/0071 (20130101) |
Current International
Class: |
G02B
6/42 (20060101) |
Field of
Search: |
;385/33 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Pak; Sung H
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation-application of International Application No.
PCT/CN2018/101795, with an international filing date of Aug. 22,
2018, which claims foreign priority to Chinese Patent Application
No. 201810276704.X, filed on Mar. 30, 2018 in the State
Intellectual Property Office of China, the contents of all of which
are hereby incorporated by reference.
Claims
What is claimed is:
1. A 4-channel parallel-optical (SR4) device for monitoring an
emission power, comprising: an emission assembly for emitting
laser, a receiving assembly for receiving the laser, and a
monitoring assembly for monitoring the emission power of the
emission assembly, wherein the emission assembly comprises an
emission chip, a first planar groove for reflecting and
transmitting the laser, and a second planner groove for total
reflecting the laser; the receiving assembly comprises a third
planar groove for total reflecting the laser and a receiving chip;
an inner angle of the first planar groove is a predetermined angle;
wherein the emission chip emits the laser to the first planar
groove, the first planar groove transmits a part of the laser to
the second planar groove, and the second planar groove total
reflects the transmitted laser to an optical fiber; the first
planar groove reflects a part of the laser to the monitoring
assembly; the monitoring assembly receives the reflected laser and
monitors power parameters of the reflected laser; the laser is
emitted to the third planar groove through the optical fiber, the
third planar groove total reflects the laser to the receiving chip,
and the receiving chip receives the laser.
2. The SR4 device according to claim 1, wherein the emission
assembly further comprises a first collimating lens for collimating
the laser; the first collimating lens is arranged adjacent to the
emission chip.
3. The SR4 device according to claim 2, wherein the emission
assembly further comprises a first focusing lens for focusing the
laser; the first focusing laser is arranged adjacent to the optical
fiber.
4. The SR4 device according to claim 1, wherein the emission
assembly further comprises a fourth planar groove; the first
focusing laser is arranged adjacent to the optical fiber; an inner
angle of the fourth planar groove is consistent with the inner
angle of the first planar groove, and the fourth planar groove and
the first planar groove are horizontally arranged.
5. The SR4 device according to claim 1, wherein the receiving
assembly further comprises a fifth planar groove for reflecting and
transmitting the laser, the fifth planar groove is arranged between
the third planar groove and the receiving chip, and an inner angle
of the fifth planar groove is 12.degree..
6. The SR4 device according to claim 5, wherein the receiving
assembly further comprises a second collimating lens for
collimating the laser; the second collimating lens is arranged
adjacent to the optical fiber.
7. The SR4 device according to claim 6, wherein the receiving
assembly further comprises a second focusing lens for focusing the
laser; the second focusing lens is arranged adjacent to the
receiving chip.
8. The SR4 device according to claim 5, wherein the emission
assembly further comprises a sixth planar groove; the fifth planar
groove and the sixth planar groove are horizontally arranged, and
an inner angle of the sixth planar groove is 12.degree..
9. The SR4 device according to claim 1, wherein an inner angle of
the second planner groove and the third planner groove is
45.degree..
10. A monitoring method applied on a 4-channel parallel-optical
(SR4) device, the SR4 device comprises an emission assembly for
emitting laser, a receiving assembly for receiving the laser, and a
monitoring assembly for monitoring the emission power of the
emission assembly; the emission assembly comprises an emission
chip, a first planar groove for reflecting and transmitting the
laser, and a second planner groove for total reflecting the laser;
the receiving assembly comprises a third planar groove for total
reflecting the laser and a receiving chip; an inner angle of the
first planar groove is a predetermined angle; the monitoring
method, comprising: emitting laser, by the emission chip, to the
first planar groove; transmitting a part of the laser, by the first
planar groove, to the second planar groove, and reflecting a part
of the laser to the monitoring assembly; total reflecting the
transmitted laser, by the second planar groove, to the optical
fiber; receiving the reflected laser and monitoring power
parameters of the reflected laser by the monitoring assembly;
emitting the laser to the third planar groove through the optical
fiber; total reflecting the laser, by the third planar groove, to a
receiving chip; and receiving the laser by the receiving chip.
11. The monitoring method device according to claim 10, wherein the
emission assembly further comprises a first collimating lens for
collimating the laser: the first collimating lens is arranged
adjacent to the emission chip.
12. The monitoring method device according to claim 11, wherein the
emission assembly further comprises a first focusing lens for
focusing the laser: the first focusing laser is arranged adjacent
to the optical fiber.
13. The monitoring method device according to claim 10, wherein the
emission assembly further comprises a fourth planar groove; an
inner angle of the fourth planar groove is consistent with the
inner angle of the first planar groove, and the fourth planar
groove and the first planar groove are horizontally arranged.
14. The monitoring method device according to claim 10, wherein the
receiving assembly further comprises a fifth planar groove for
reflecting and transmitting the laser; the fifth planar groove is
arranged between the third planar groove and the receiving chip,
and an inner angle of the fifth planar groove is 12.degree..
15. The monitoring method device according to claim 14, wherein the
receiving assembly further comprises a second collimating lens for
collimating the laser; the second collimating lens is arranged
adjacent to the optical fiber.
16. The monitoring method device according to claim 15, wherein the
receiving assembly further comprises a second focusing lens for
focusing the laser; the second focusing lens is arranged adjacent
to the receiving chip.
17. The monitoring method device according to claim 14, wherein the
emission assembly further comprises a sixth planar groove; the
fifth planar groove and the sixth planar groove are horizontally
arranged, and an inner angle of the sixth planar groove is
12.degree..
18. The monitoring method device according to claim 10, wherein an
inner angle of the second planner groove and the third planner
groove is 45.degree..
Description
TECHNICAL FIELD
The present disclosure relates to the technical field of optical
transceiver devices, and in particular to a 4-channel
parallel-optical (SR4) device for monitoring an emission power and
a monitoring method thereof.
BACKGROUND
At present, compared to spectrum efficiency and distance-bit rate
product in long-distance network for people, in an inner network of
large-throughput data center and optical fiber connected to a
server that is only a few meters to several kilometers, people are
more concerned with interconnection of stations with high-speed and
short-distance optical fiber module.
However, a conventional 4-channel parallel-optical module for short
reach optical links usually uses that four transceiver chips is
integrated on a printed circuit board, a single-channel rate is 25
Gbps, namely total rate is up to 100 Gbps.
A 4-channel parallel-optical (SR4) device monitors optical power of
transmitting terminal in use. An existing method is a splitting
method that beam splitting prism directs signal of emission light
source to a monitoring chip, which increases difficulty of device
processing and surface coating process.
SUMMARY
The technical problem solved by the present disclosure is to
provide a 4-channel parallel-optical (SR4) device for monitoring
emission power capable of monitoring emission power of emission
chip.
The technical problem solved by the present disclosure is to
provide a monitoring method capable of monitoring an emission power
of emission chip.
In order to solve the technical problem mentioned above, the
present disclosure provides a 4-channel parallel-optical (SR4)
device for monitoring emission power, comprising: an emission
assembly for emitting laser, a receiving assembly for receiving the
laser, and a monitoring assembly for monitoring the emission power
of the emission assembly. The emission assembly comprises an
emission chip, a first planar groove for reflecting and
transmitting the laser, and a second planner groove for total
reflecting the laser; the receiving assembly comprises a third
planar groove for total reflecting the laser and a receiving chip.
An inner angle of the first planar groove is 12.degree..
The emission chip emits the laser to the first planar groove, the
first planar groove transmits a part of the laser to the second
planar groove, and the second planar groove total reflects the
transmitted laser to an optical fiber. The first planar groove
reflects a part of the laser to the monitoring assembly. The
monitoring assembly receives the reflected laser and monitors power
parameters of the reflected laser, the laser is emitted to the
third planar groove through the optical fiber, the third planar
groove total reflects the laser to the receiving chip, and the
receiving chip receives the laser.
Furthermore, the emission assembly further comprises a first
collimating lens for collimating the laser, where the first
collimating lens is arranged adjacent to the emission chip.
Furthermore, the emission assembly further comprises a first
focusing lens for focusing the laser, where the first focusing
laser is arranged adjacent to the optical fiber.
Furthermore, the emission assembly further comprises a fourth
planar groove. The fourth planar groove and the first planar groove
are horizontally arranged. An inner angle of the fourth planar
groove is 12.degree..
Furthermore, the receiving assembly further comprises a fifth
planar groove for reflecting and transmitting the laser, where the
fifth planar groove is arranged between the third planar groove and
the receiving chip. An inner angle of the fifth planar groove is
12.degree..
Furthermore, the receiving assembly further comprises a second
collimating lens for collimating the laser, where the second
collimating lens is arranged adjacent to the optical fiber.
Furthermore, the receiving assembly further comprises a second
focusing lens for focusing the laser, the second focusing lens is
arranged adjacent to the receiving chip.
Furthermore, the emission assembly further comprises a sixth planar
groove; the fifth planar groove and the sixth planar groove are
horizontally arranged, and an inner angle of the sixth planar
groove is 12.degree..
Furthermore, an inner angle of the second planner groove and the
third planner groove is 45.degree..
The present disclosure further provides a monitoring method for
above 4-channel parallel-optical (SR4) device, the SR4 device
comprises an emission assembly for emitting laser, a receiving
assembly for receiving the laser, and a monitoring assembly for
monitoring the emission power of the emission assembly; the
emission assembly comprises an emission chip, a first planar groove
for reflecting and transmitting the laser, and a second planner
groove for total reflecting the laser; the receiving assembly
comprises a third planar groove for total reflecting the laser and
a receiving chip; an inner angle of the first planar groove is a
predetermined angle; the monitoring method comprises:
emitting laser, by the emission chip, to the first planar
groove;
transmitting a part of the laser, by the first planar groove, to
the second planar groove, and reflecting a part of the laser to the
monitoring assembly;
total reflecting the transmitted laser, by the second planar
groove, to the optical fiber;
receiving the reflected laser and monitoring power parameters of
the reflected laser by the monitoring assembly;
emitting the laser to the third planar groove through the optical
fiber;
total reflecting the laser, by the third planar groove, to the
receiving chip; and
receiving the laser by the receiving chip.
Furthermore, the emission assembly further comprises a first
collimating lens for collimating the laser, where the first
collimating lens is arranged adjacent to the emission chip.
Furthermore, the emission assembly further comprises a first
focusing lens for focusing the laser, where the first focusing
laser is arranged adjacent to the optical fiber.
Furthermore, the emission assembly further comprises a fourth
planar groove, where an inner angle of the fourth planar groove is
consistent with the inner angle of the first planar groove, and the
fourth planar groove and the first planar groove are horizontally
arranged.
Furthermore, the receiving assembly further comprises a fifth
planar groove for reflecting and transmitting the laser; the fifth
planar groove is arranged between the third planar groove and the
receiving chip, and an inner angle of the fifth planar groove is
12.degree..
Furthermore, the receiving assembly further comprises a second
collimating lens for collimating the laser, the second collimating
lens is arranged adjacent to the optical fiber.
Furthermore, the receiving assembly further comprises a second
focusing lens for focusing the laser, the second focusing lens is
arranged adjacent to the receiving chip.
Furthermore, the emission assembly further comprises a sixth planar
groove; the fifth planar groove and the sixth planar groove are
horizontally arranged, and an inner angle of the sixth planar
groove is 12.degree..
Furthermore, an inner angle of the second planner groove and the
third planner groove is 45.degree..
The benefit effects of the present disclosure are: different from
the prior art, the present disclosure provides the SR4 device for
monitoring emission power and a monitoring method, the laser is
emitted, and the laser is reflected by the first planar groove. The
laser is focused and emitted to the monitoring chip, and the
monitoring chip directly monitors power parameters of the emitted
laser through receiving reflected signal, which is without device
processing and surface coating process, and the cost is reduced.
The present disclosure uses a plurality of collimating lens and
focusing lens to make the laser successfully transmit in the SR4
device.
BRIEF DESCRIPTION OF THE DRAWINGS
The present disclosure will be further described with reference to
the accompanying drawings and embodiments:
FIG. 1 is a schematic diagram of a 4-channel parallel-optical (SR4)
device of the present disclosure.
FIG. 2 is a schematic diagram of an emission assembly of the
present disclosure.
FIG. 3 is a schematic diagram of a receiving assembly of the
present disclosure.
FIG. 4 is a flowchart diagram of a monitoring method of the present
disclosure.
DETAILED DESCRIPTION
The following will clearly and completely describe the technical
solutions in the embodiments of the present disclosure with
reference to the accompanying drawings in the embodiments of the
present disclosure.
As shown in FIG. 1 to FIG. 3, the present disclosure provides an
embodiment of a 4-channel parallel-optical (SR4) device for
monitoring emission power.
To be specific, as shown in FIG. 1, the SR4 device for monitoring
an emission power comprises an emission assembly 10 for emitting
laser, a receiving assembly 20 for receiving the laser, and a
monitoring assembly 30 for monitoring the emission power of the
emission assembly 10, where the monitoring assembly 30 is a
monitoring chip. The emission assembly 10 is used to emit the laser
to the receiving assembly 20, the receiving assembly 20 receives
the laser, and the monitoring assembly 30 monitors a power of the
emitted laser of the emission assembly 10 in real-time.
As shown in FIG. 2, the emission assembly 10 comprises an emission
chip 11, a first planar groove 12 for reflecting and transmitting
the laser, a second planner groove 13 for total reflecting the
laser, a first collimating lens 14 for collimating the laser, a
first focusing lens 15 for focusing the laser, and a fourth planar
groove 16 for transmitting the laser. An inner angle of the first
planar groove 12 is set to a predetermined angle, which is related
to a position of the monitoring assembly 30. Furthermore, the inner
angle of the first planar groove 12 is set to be 12.degree., an
inner angle of the fourth planar groove 16 is consistent with the
inner angle of the first planar groove 12, and the fourth planar
groove 16 and the first planar groove 12 are horizontally arranged.
An inner angle of the fourth planar groove 16 is 12.degree.. An
inner angle of the second planner groove 13 is 45.degree.. The
first collimating lens 14 is arranged adjacent to the emission chip
11. Along with transmitting of an optical path, the first planar
groove 12 is arranged behind the first collimating lens 14, the
fourth planar groove 16 is arranged adjacent to the first planar
groove 12, the second planner groove 13 is arranged behind the
fourth planar groove 16, the first focusing laser 15 is arranged
adjacent to optical fiber 40 and behind the second planner groove
13. The emission assembly 10 further comprises a third focusing
lens 17 for focusing the laser, where the third focusing lens 17 is
arranged adjacent to the monitoring assembly 30.
As shown in FIG. 3, the receiving assembly 20 comprises a third
planar groove 22 for total reflecting the laser, a receiving chip
21, a fifth planar groove 26 for reflecting and transmitting the
laser, a second collimating lens 24 for collimating the laser, a
second focusing lens 25 for focusing the laser, and a sixth planar
groove 23 for transmitting the laser. An inner angle of the fifth
planar groove 26 is set to be 12.degree.. The fifth planar groove
26 and the sixth planar groove 23 are horizontally arranged. An
inner angle of the sixth planar groove 23 is 12.degree., and an
inner angle of the third planner groove 22 is 45.degree.. The
second collimating lens 24 is arranged adjacent to the optical
fiber 40. Along with transmitting of the optical path, the third
planar groove 22 is arranged behind the second collimating lens 24,
and the fifth planar groove 26 is arranged between the third planar
groove 22 and the receiving chip 21. To be specific, the fifth
planar groove 26 is arranged behind the third planar groove 22.
Along with transmitting of the optical path, the second focusing
laser 25 is arranged behind the sixth planner groove 23 and is
arranged adjacent to the receiving chip 21. It should be understood
that the fifth planar groove 26 and the sixth planar groove 23 also
can be horizontal planar groove to make the laser passing through
the fifth planar groove 26 and the sixth planar groove 23
vertically emits to the receiving chip 21, which is not
limited.
The transmission of the optical path of the emission assembly is as
follow: the transmission chip 11 emits the laser outward, the laser
is collimated by the first collimating lens 14 and is transmitted
to the first planar groove 12, the first planar groove 12 transmits
a part of the laser to the fourth planar groove 16, and the laser
is transmitted to the second planar groove 13. The second planar
groove 13 total reflects the laser to the first focusing lens 15.
The first focusing lens 15 focuses the laser on the optical fiber
40. The first planar groove 12 reflects a part of the laser to the
third focusing lens 17, and the laser is focused by the third
focusing lens 17 and is transmitted to the monitoring assembly 30.
The monitoring assembly 30 receives the reflected laser and
monitors power parameters of the reflected laser to directly
monitor power parameters of the emitted laser.
The transmission of the optical path of the receiving assembly 20
is as follow: the laser is emitted to the second collimating lens
24 through the optical fiber 40, and the laser is collimated by the
second collimating lens 24 and emits to the third planar groove 22;
the third planar groove 22 total reflects the laser to the fifth
planar groove 26, the fifth planar groove 26 transmits a part of
the laser or all laser to the sixth planar groove 23, along with
the transmission of the optical path, the laser is transmitted to
the second focusing lens 25, and the laser is focused by the second
focusing lens 25 and is transmitted to the receiving chip 21. The
receiving chip 21 receives the laser.
As shown in FIG. 4, the present disclosure further provides a
preferred embodiment of a monitoring method.
To be specific, as shown in FIG. 4, the monitoring method applied
on the above SR4 device, the SR4 device comprises the emission
assembly 10 for emitting laser, the receiving assembly 20 for
receiving the laser, and the monitoring assembly 30 for monitoring
the emission power of the emission assembly, the emission assembly
comprises the emission chip 11, the first planar groove 12 for
reflecting and transmitting the laser, and the second planner
groove 13 for total reflecting the laser; the receiving assembly 20
comprises the third planar groove 22 for total reflecting the laser
and the receiving chip 21; the inner angle of the first planar
groove is the predetermined angle; the monitoring method
comprising:
Step10: emitting the laser, by the emission chip, to the first
planar groove;
Step20: transmitting a part of the laser, by the first planar
groove, to the second planar groove, and reflecting a part of the
laser to the monitoring assembly;
Step31: total reflecting the transmitted laser, by the second
planar groove, to the optical fiber;
Step32: receiving the reflected laser and monitoring power
parameters of the reflected laser by the monitoring assembly;
Step311: emitting the laser to the third planar groove through the
optical fiber;
Step312: total reflecting the laser, by the third planar groove, to
the receiving chip;
Step313: receiving the laser by the receiving chip.
Furthermore, the emission assembly 10 further comprises the first
collimating lens 14 for collimating the laser; the first
collimating lens 14 is arranged adjacent to the emission chip 11.
The emission assembly 10 further comprises the first focusing lens
15 for focusing the laser, where the first focusing laser 15 is
arranged adjacent to the optical fiber 40. The emission assembly 10
further comprises the fourth planar groove 16, the inner angle of
the fourth planar groove 16 is consistent with the inner angle of
the first planar groove 12, and the fourth planar groove 16 and the
first planar groove 12 are horizontally arranged.
The receiving assembly 20 further comprises the fifth planar groove
26 for reflecting and transmitting the laser, where the fifth
planar groove 26 is arranged between the third planar groove 22 and
the receiving chip 21, and the inner angle of the fifth planar
groove is 12.degree.. The receiving assembly 20 further comprises
the second collimating lens 24 for collimating the laser, where the
second collimating lens 24 is arranged adjacent to the optical
fiber 40. The receiving assembly 20 further comprises the second
focusing lens 25 for focusing the laser, where the second focusing
lens 25 is arranged adjacent to the receiving chip 21.
The emission assembly 10 further comprises the sixth planar groove
23, where the fifth planar groove 26 and the sixth planar groove 23
are horizontally arranged, and the inner angle of the sixth planar
groove is 12.degree.. The inner angle of the second planner groove
13 and the third planner groove 22 is 45.degree..
The foregoing descriptions are merely implementation manners of the
present disclosure, and therefore do not limit the scope of patents
of the present disclosure. Any equivalent structure or equivalent
process transformation using the description of the present
disclosure and the accompanying drawings may be directly or
indirectly applied to other related technologies. The same applies
in the field of patent protection of this disclosure.
* * * * *