U.S. patent number 10,290,962 [Application Number 15/492,042] was granted by the patent office on 2019-05-14 for dual connector system.
This patent grant is currently assigned to TE CONNECTIVITY CORPORATION. The grantee listed for this patent is TE CONNECTIVITY CORPORATION. Invention is credited to Dean Marlin Harmon, III.
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United States Patent |
10,290,962 |
Harmon, III |
May 14, 2019 |
Dual connector system
Abstract
A dual connector system includes a host circuit board with first
and second electrical connectors. The first electrical connector
has a housing with a card slot, first contacts and a latching
feature. The second electrical connector has a housing with second
contacts. The dual connector system includes a dual connector
module having a module circuit board having contact pads. The dual
connector module has a latch movable between a latched position and
an unlatched position. The latch engages the latching feature of
the first electrical connector in the latched position to hold the
dual connector module in a mated position. A release mechanism is
operably coupled between the dual connector module and at least one
of the first electrical connector and the second electrical
connector. The release mechanism forces the dual connector module
to an unmated position after the latch is moved from the latched
position to the unlatched position.
Inventors: |
Harmon, III; Dean Marlin
(Harrisburg, PA) |
Applicant: |
Name |
City |
State |
Country |
Type |
TE CONNECTIVITY CORPORATION |
Berwyn |
PA |
US |
|
|
Assignee: |
TE CONNECTIVITY CORPORATION
(Berwyn, PA)
|
Family
ID: |
63854767 |
Appl.
No.: |
15/492,042 |
Filed: |
April 20, 2017 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20180309213 A1 |
Oct 25, 2018 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R
12/716 (20130101); H01R 12/7005 (20130101); H01R
27/02 (20130101); H01R 13/6275 (20130101); H01R
13/6335 (20130101); H01R 12/73 (20130101); H01R
12/7076 (20130101); H01R 24/28 (20130101); H01R
13/7132 (20130101); H01R 24/50 (20130101); H01R
13/6315 (20130101); H01R 12/71 (20130101); H01R
13/6587 (20130101); H01R 24/005 (20130101); H01R
12/83 (20130101) |
Current International
Class: |
H01R
12/71 (20110101); H01R 27/02 (20060101); H01R
12/73 (20110101); H01R 13/627 (20060101); H01R
12/70 (20110101); H01R 13/633 (20060101); H01R
12/83 (20110101); H01R 13/713 (20060101); H01R
13/631 (20060101); H01R 24/50 (20110101); H01R
24/28 (20110101); H01R 13/6587 (20110101); H01R
24/00 (20110101) |
References Cited
[Referenced By]
U.S. Patent Documents
Other References
Tyco Electronic, Product Specification, DDR S.O.DIMM Socket 200
Positions, Jul. 11, 2007, 5 pages. cited by applicant .
TE Connectivity Emboss Assembly DDR1 & DDR2 SODIMM Socket 200P
Standard Profile Standard Type, Drawing No. C-1565917, Dec. 2001, 1
page. cited by applicant .
Co-pending U.S. Appl. No. 15/458,099, filed Mar. 14, 2017. cited by
applicant .
Co-pending U.S. Appl. No. 15/490,252, filed Apr. 18, 2017. cited by
applicant .
Co-pending U.S. Appl. No. 15/492,070, filed Apr. 20, 2017. cited by
applicant .
Co-pending U.S. Appl. No. 15/723,287, filed Oct. 3, 2017. cited by
applicant.
|
Primary Examiner: Harvey; James
Claims
What is claimed is:
1. A dual connector system comprising: a host circuit board having
a front mounting area and a rear mounting area; a first electrical
connector at the front mounting area of the host circuit board, the
first electrical connector having a housing having a card slot, the
housing holding first contacts at the card slot, the first contacts
being terminated to the host circuit board, the first electrical
connector having a latching feature; a second electrical connector
at the rear mounting area of the host circuit board, the second
electrical connector having a housing having an upper mating
surface, the housing holding second contacts at the upper mating
surface, the second contacts being terminated to the host circuit
board; a dual connector module movable between a mated position and
an unmated position with the first and second electrical
connectors, the dual connector module having a module circuit board
including an upper surface and a lower surface facing the host
circuit board, the module circuit board having at least one
communication component on the upper surface, the module circuit
board having first and second side edges extending between a front
edge and a rear edge, the module circuit board having front contact
pads proximate to the front edge for electrically connecting to the
first electrical connector, the module circuit board having rear
contact pads remote from the front edge for electrically connecting
to the second electrical connector, the dual connector module
having a latch movable between a latched position and an unlatched
position, the latch engaging the latching feature of the first
electrical connector in the latched position to hold the dual
connector module in the mated position with the first electrical
connector; and a release mechanism operably coupled between the
dual connector module and at least one of the first electrical
connector and the second electrical connector, the release
mechanism forcing the dual connector module to the unmated position
after the latch is moved from the latched position to the unlatched
position.
2. The dual connector system of claim 1, wherein the release
mechanism ejects the dual connector module from the first
electrical connector.
3. The dual connector system of claim 1, wherein the release
mechanism includes a spring imparting a spring force on the dual
connector module in an un-mating direction parallel to the host
circuit board.
4. The dual connector system of claim 1, wherein the release
mechanism is compressed as the dual connector module is moved from
the unmated position to the mated position and the release
mechanism is extended as the dual connector module is moved from
the mated position to the unmated position.
5. The dual connector system of claim 1, wherein the dual connector
module includes a tab extending below the lower surface of the
module circuit board, the tab engaging the second electrical
connector, the release mechanism being positioned between the tab
and the second electrical connector.
6. The dual connector system of claim 5, wherein the tab engages a
ledge of the second electrical connector to prevent lift off of the
module circuit board from the upper mounting surface of the second
electrical connector.
7. The dual connector system of claim 1, wherein the release
mechanism is coupled to the second electrical connector remote from
the latch and is compressed by the dual connector module when the
dual connector module is moved from the unmated position to the
mated position.
8. The dual connector system of claim 1, wherein the release
mechanism is coupled to the first electrical connector and is
compressed by the dual connector module when the dual connector
module is moved from the unmated position to the mated
position.
9. The dual connector system of claim 1, wherein the release
mechanism is coupled to the dual connector module and is compressed
by the dual connector module against at least one of the first
electrical connector and the second electrical connector when the
dual connector module is moved from the unmated position to the
mated position.
10. The dual connector system of claim 1, wherein the latch is
released in a releasing direction perpendicular to the acting
direction of the release mechanism.
11. The dual connector system of claim 1, wherein the latch
includes a latching beam engaging the latching feature and an
actuator coupled to the latching beam and operated to actuate the
latching beam from the latched position to the unlatched
position.
12. The dual connector system of claim 11, wherein the latching
beam and the actuator are contained forward of the second
electrical connector.
13. A dual connector system comprising: a host circuit board having
a front mounting area and a rear mounting area; a first electrical
connector at the front mounting area of the host circuit board, the
first electrical connector having a housing having a card slot, the
housing holding first contacts at the card slot, the first contacts
being terminated to the host circuit board, the first electrical
connector having a latching feature; a second electrical connector
at the rear mounting area of the host circuit board, the second
electrical connector having a housing having an upper mating
surface, the housing holding second contacts at the upper mating
surface, the second contacts being terminated to the host circuit
board; a dual connector module matable with the first and second
electrical connectors, the dual connector module having a module
circuit board including an upper surface and a lower surface facing
the host circuit board, the module circuit board having at least
one communication component on the upper surface, the module
circuit board having first and second side edges extending between
a front edge and a rear edge, the module circuit board having front
contact pads proximate to the front edge for electrically
connecting to the first electrical connector, the module circuit
board having rear contact pads remote from the front edge for
electrically connecting to the second electrical connector, the
dual connector module having a latch movable between a latched
position and an unlatched position, the latch engaging the latching
feature of the first electrical connector in the latched position,
wherein the dual connector module is coupled to the host circuit
board by lowering the dual connector module in a loading direction
generally perpendicular to the host circuit board to a pre-staged,
unmated position where the first connector interface is adjacent to
the first electrical connector and the second connector interface
is adjacent to the second electrical connector, and wherein the
dual connector module is slid forward from the pre-staged, unmated
position to a mated position in a mating direction generally
parallel to the upper surface of the host circuit board to mate the
first connector interface to the first electrical connector by
loading the front edge of the module circuit board into the card
slot of the first electrical connector to mate the first contacts
to the first contact pads and to mate the second connector
interface to the second electrical connector to mate the second
contacts to the second contact pads; and a release mechanism
operably coupled between the dual connector module and at least one
of the first electrical connector and the second electrical
connector, the release mechanism forcing the dual connector module
to the pre-staged unmated position after the latch is moved from
the latched position to the unlatched position.
14. The dual connector system of claim 13, wherein the release
mechanism ejects the dual connector module from the first
electrical connector.
15. The dual connector system of claim 13, wherein the release
mechanism includes a spring imparting a spring force on the dual
connector module in an un-mating direction parallel to the host
circuit board.
16. The dual connector system of claim 13, wherein the release
mechanism is compressed as the dual connector module is moved from
the unmated position to the mated position and the release
mechanism is extended as the dual connector module is moved from
the mated position to the unmated position.
17. The dual connector system of claim 13, wherein the dual
connector module includes a tab extending below the lower surface
of the module circuit board, the tab engaging the second electrical
connector, the release mechanism being positioned between the tab
and the second electrical connector.
18. The dual connector system of claim 13, wherein the release
mechanism is coupled to the second electrical connector remote from
the latch and is compressed by the dual connector module when the
dual connector module is moved from the unmated position to the
mated position.
19. The dual connector system of claim 13, wherein the latch is
released in a releasing direction perpendicular to the acting
direction of the release mechanism.
20. A dual connector system comprising: a host circuit board having
a front mounting area and a rear mounting area; a first electrical
connector at the front mounting area of the host circuit board, the
first electrical connector having a first connector housing having
a card slot configured to receive a front edge of a module circuit
board of a dual connector module in a mating direction parallel to
the host circuit board, the first connector housing holding first
contacts at the card slot configured to be electrically connected
to contact pads at the front edge of the module circuit board, the
first contacts being terminated to the host circuit board, the
first electrical connector having a latching feature configured to
engage a latch of the dual connector module to secure the dual
connector module in a mated position when the latch engages the
latching feature; and a second electrical connector at the rear
mounting area of the host circuit board, the second electrical
connector having a second connector housing having an upper mating
surface configured to receive the module circuit board when mounted
thereto, the second connector housing having a release mechanism
coupled thereto configured to engage the dual connector module, the
release mechanism configured to impart a releasing force on the
dual connector module in an unmating direction opposite the mating
direction parallel to the host circuit board to cause the dual
connector module to move to an unmated position in the unmating
direction after the latch is unlatched from the latching feature of
the first electrical connector.
Description
BACKGROUND OF THE INVENTION
The subject matter herein relates generally to a dual connector
system.
Dual connector systems include first and second electrical
connectors mounted to a host circuit board that are electrically
connected to a dual connector module. The dual connector module
includes a module circuit board having connector interfaces for
interfacing with the first and second electrical connectors.
Typically communication components are mounted to the module
circuit board. For example, electrical and/or optical components
may be mounted to the module circuit board. In various applications
an on-board optics module may be mounted to the module circuit
board. Heat dissipation of the communication components may be
provided, such as in the form of a heat sink thermally coupled to
the communication components and supported by the module circuit
board.
Mating of the dual connector module to the first and second
electrical connectors typically involves loading the dual connector
module into a first position in a vertical direction and then
sliding the dual connector module to a second position in a
horizontal direction to mate with the first and second electrical
connectors. However, unmating of the dual connector module may be
difficult. For example, the dual connector module needs to be moved
horizontally rearward out of the card slot at the front end before
being lifted upward off of the first and second electrical
connectors. Some conventional dual connector modules use a tether
that extends to the rear end of the dual connector module to
release the latch and pull the dual connector module rearward.
However, some conventional dual connector modules include cables
extending from the rear end of the dual connector module that
interfere with the tether. Additionally, actuation or pulling on
the tether may damage the cables, such as by bending the cables
beyond a bend limit of the cables.
A need remains for a dual connector system that provides a
mechanism for unmating the dual connector module from the first and
second electrical connectors.
BRIEF DESCRIPTION OF THE INVENTION
In one embodiment, a dual connector system is provided including a
host circuit board having a front mounting area and a rear mounting
area with a first electrical connector at the front mounting area
of the host circuit board and a second electrical connector at the
rear mounting area of the host circuit board. The first electrical
connector has a housing having a card slot holding first contacts
at the card slot that are terminated to the host circuit board. The
first electrical connector has a latching feature. The second
electrical connector has a housing having an upper mating surface
holding second contacts at the upper mating surface that are
terminated to the host circuit board. The dual connector system
includes a dual connector module movable between a mated position
and an unmated position with the first and second electrical
connectors. The dual connector module has a module circuit board
including an upper surface and a lower surface facing the host
circuit board with at least one communication component on the
upper surface. The module circuit board has first and second side
edges extending between a front edge and a rear edge. The module
circuit board has front contact pads proximate to the front edge
for electrically connecting to the first electrical connector and
rear contact pads remote from the front edge for electrically
connecting to the second electrical connector. The dual connector
module has a latch movable between a latched position and an
unlatched position. The latch engages the latching feature of the
first electrical connector in the latched position to hold the dual
connector module in the mated position with the first electrical
connector. A release mechanism is operably coupled between the dual
connector module and at least one of the first electrical connector
and the second electrical connector. The release mechanism forces
the dual connector module to the unmated position after the latch
is moved from the latched position to the unlatched position.
In another embodiment, a dual connector system is provided
including a host circuit board having a front mounting area and a
rear mounting area with a first electrical connector at the front
mounting area of the host circuit board and a second electrical
connector at the rear mounting area of the host circuit board. The
first electrical connector has a housing having a card slot holding
first contacts at the card slot that are terminated to the host
circuit board. The first electrical connector has a latching
feature. The second electrical connector has a housing having an
upper mating surface holding second contacts at the upper mating
surface that are terminated to the host circuit board. The dual
connector system includes a dual connector module movable between a
mated position and an unmated position with the first and second
electrical connectors. The dual connector module has a module
circuit board including an upper surface and a lower surface facing
the host circuit board with at least one communication component on
the upper surface. The module circuit board has first and second
side edges extending between a front edge and a rear edge. The
module circuit board has front contact pads proximate to the front
edge for electrically connecting to the first electrical connector
and rear contact pads remote from the front edge for electrically
connecting to the second electrical connector. The dual connector
module has a latch movable between a latched position and an
unlatched position. The latch engages the latching feature of the
first electrical connector in the latched position to hold the dual
connector module in the mated position with the first electrical
connector. The dual connector module is coupled to the host circuit
board by lowering the dual connector module in a loading direction
generally perpendicular to the host circuit board to a pre-staged,
unmated position where the first connector interface is adjacent to
the first electrical connector and the second connector interface
is adjacent to the second electrical connector. The dual connector
module is slid forward from the pre-staged, unmated position to a
mated position in a mating direction generally parallel to the
upper surface of the host circuit board to mate the first connector
interface to the first electrical connector by loading the front
edge of the module circuit board into the card slot of the first
electrical connector to mate the first contacts to the first
contact pads and to mate the second connector interface to the
second electrical connector to mate the second contacts to the
second contact pads. The dual connector system includes a release
mechanism operably coupled between the dual connector module and at
least one of the first electrical connector and the second
electrical connector. The release mechanism forces the dual
connector module to the pre-staged unmated position after the latch
is moved from the latched position to the unlatched position.
In a further embodiment, a dual connector system is provided
including a host circuit board having a front mounting area and a
rear mounting area. A first electrical connector is at the front
mounting area of the host circuit board. The first electrical
connector has a housing having a card slot configured to receive a
front edge of a module circuit board of a dual connector module in
a mating direction parallel to the host circuit board. The housing
holds first contacts at the card slot configured to be electrically
connected to contact pads at the front edge of the module circuit
board. The first contacts are terminated to the host circuit board.
The first electrical connector has a latching feature configured to
engage a latch of the dual connector module to secure the dual
connector module in a mated position when the latch engages the
latching feature. A second electrical connector is at the rear
mounting area of the host circuit board. The second electrical
connector has a housing having an upper mating surface configured
to receive the module circuit board when mounted thereto. The
housing has a release mechanism coupled thereto configured to
engage the dual connector module. The release mechanism is
configured to impart a releasing force on the dual connector module
in an unmating direction opposite the mating direction parallel to
the host circuit board to cause the dual connector module to move
to an unmated position in the unmating direction after the latch is
unlatched from the latching feature of the first electrical
connector.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a dual connector system formed in
accordance with an exemplary embodiment showing a dual connector
module mounted to a host circuit board.
FIG. 2 is a side view of the dual connector system showing the dual
connector module mounted to the host circuit board.
FIG. 3 is a bottom perspective view of the dual connector module in
accordance with an exemplary embodiment.
FIG. 4 is a top perspective view of the host circuit board in
accordance with an exemplary embodiment.
FIG. 5 is an end view of a second electrical connector of the host
circuit board in accordance with an exemplary embodiment.
FIG. 6 is a top view of a portion of the dual connector system
showing a module circuit board partially mated to the host circuit
board.
FIG. 7 is a top view of a portion of the dual connector system
showing the module circuit board fully mated to the host circuit
board.
FIG. 8 shows the dual connector module 102 poised for coupling to
the host circuit board at an elevated positioned above the host
circuit board.
FIG. 9 shows the dual connector module in a pre-staged position on
the host circuit board.
FIG. 10 shows the dual connector module in a mated position on the
host circuit board.
FIG. 11 is a side view of a portion of the dual connector system
100 in accordance with an exemplary embodiment.
FIG. 12 is a side view of a portion of the dual connector system
100 in accordance with an exemplary embodiment.
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view of a dual connector system 100 formed
in accordance with an exemplary embodiment showing a dual connector
module 102 mounted to a host circuit board 110. FIG. 2 is a side
view of the dual connector system 100 showing the dual connector
module 102 mounted to the host circuit board 110. The host circuit
board 110 has a first electrical connector 112 at a front mounting
area 114 of the host circuit board 110 and a second electrical
connector 116 at a rear mounting area 118 of the host circuit board
110.
When the dual connector module 102 is mounted to the host circuit
board 110, the dual connector module 102 interfaces with both
electrical connectors 112, 116. Optionally, the dual connector
module 102 may be simultaneously mated with the first and second
electrical connectors 112, 116 during a mating process. In an
exemplary embodiment, the first electrical connector 112 is a
different type of electrical connector than the second electrical
connector 116. For example, the first electrical connector 112 may
be a front loaded electrical connector, such as a card edge
connector. The second electrical connector 116 may be a top loaded
electrical connector, such as a mezzanine connector. The electrical
connectors 112, 116 may be used for different types of signaling.
For example, the first electrical connector 112 may be used for
high-speed signaling while the second electrical connector 116 may
be used for low speed signaling, powering, or for another type of
connection.
In an exemplary embodiment, mating of the dual connector module 102
to the host circuit board 110 occurs by loading the dual connector
module 102 in a loading direction 124 (for example, downward) to a
pre-staged position and then mating the dual connector module 102
in a mating direction 126 (for example, forward) to a mated
position. The dual connector module 102 may be unmated in an
opposite unmating direction 128 (for example, rearward) to an
unmated position and then removed from the host circuit board 110
by lifting the dual connector module 102 upward. The loading
direction 124 may be perpendicular to the host circuit board 110,
such as in a vertical direction, and the mating and unmating
directions 126, 128 may be parallel to the host circuit board 110,
such as in horizontal directions.
The dual connector module 102 includes a module circuit board 130
having an upper surface 132 and a lower surface 134. The module
circuit board 130 extends between a front edge 136 (shown in
phantom) and a rear edge 138. The lower surface 134 faces the host
circuit board 110 and may be parallel to and spaced apart from the
host circuit board 110 when mated to the electrical connectors 112,
116.
In an exemplary embodiment, the dual connector module 102 includes
one or more communication components 140 on the upper surface 132
and/or the lower surface 134. The communication components 140 may
be electrical components, optical components, or other types of
components. In an exemplary embodiment, one or more of the
communication components 140 may be on-board optical modules. The
communication components 140 may include optical/digital converters
for converting between optical and electrical signals. Other types
of communication components 140 may be provided on the module
circuit board 130, such as processors, memory modules, antennas, or
other types of components.
In an exemplary embodiment, the dual connector module 102 includes
a housing or shell 142 on the upper surface 132. The shell 142
encloses the communication components 140. In an exemplary
embodiment, the shell 142 extends generally around the perimeter of
the module circuit board 130; however, portions of the module
circuit board 130 may be exposed exterior of the shell 142. In an
exemplary embodiment, the dual connector module 102 includes a heat
sink 144 thermally coupled to one or more of the communication
components 140. The heat sink 144 dissipates heat from the
communication components 140. The heat sink 144 may be mounted to
the shell 142 and/or the module circuit board 130. In an exemplary
embodiment, the heat sink 144 extends substantially the entire
length of the dual connector module 102. The heat sink 144 may have
a plurality of fins having a large surface area for dissipating
heat.
In an exemplary embodiment, the dual connector module 102 includes
a latch 146 at a front end of the dual connector module 102 for
latchably securing the dual connector module 102 to the first
electrical connector 112. An actuator 148 is coupled to the latch
146 for releasing the latch 146. In the illustrated embodiment, the
actuator 148 extends upward from the latch 146 at the front end of
the dual connector module 102. The actuator 148 is configured to be
pulled upward to release the latch 146 from a latched position to
an unlatched position. Once the latch 146 is released, the dual
connector module 102 is able to be moved rearward in the unmating
direction 128.
In an exemplary embodiment, the dual connector module 102 is spring
actuated by a release mechanism 150 (FIG. 2) that pushes the dual
connector module 102 in the unmating direction 128 to remove the
front end of the dual connector module 102 from the first
electrical connector 112. In the illustrated embodiment, the
release mechanism 150 is positioned between the dual connector
module 102 and the second electrical connector 116; however the
release mechanism 150 may be positioned at other locations, such as
between the dual connector module 102 and the first electrical
connector 112. In other alternative embodiments, the release
mechanism 150 may be a stand-alone device mounted to the host
circuit board 110 rather than being mounted to the first or second
electrical connectors 112, 116. The release mechanism 150 presses
against the dual connector module 102 and/or one of the electrical
connectors 112, 116 to push the dual connector module 102 in the
unmating direction 128. For example, the release mechanism 150 may
be or include a spring that exerts a spring force against the dual
connector module 102 to move the dual connector module 102 in the
unmating direction.
In an exemplary embodiment, the actuator 148 is at the front end
and is accessible from above the dual connector module 102. For
example, because one or more cables 152 extend from the rear end of
the dual connector module 102, the cable 152 may block access to
the space rearward of the dual connector module 102. Routing of the
actuator 148 to the rear end of the dual connector module 102 may
be impractical because of the location of the cable 152 are limited
access to the space behind the dual connector module 102.
Additionally, if the actuator 148 were routed to the rear end of
the dual connector module 102, actuation of the actuator 148 may
damage the cable 152, such as from bending of the cable 152 out of
the way to access the actuator 148. In an exemplary embodiment, the
actuator 148 extends above the dual connector module 102 and is
accessed from above the dual connector module 102. However, in
alternative embodiments, the actuator 148 may extend to other
locations and may extend to the rear end of the dual connector
module 102 to help pull the dual connector module 102 rearward to
the unmated position.
FIG. 3 is a bottom perspective view of the dual connector module
102 in accordance with an exemplary embodiment. In an exemplary
embodiment, the module circuit board 130 includes front contact
pads 160 proximate to the front edge 136 along the lower surface
134 and/or the upper surface 132. The front contact pads 160 define
a first connector interface 162 configured for electrically
connecting to the first electrical connector 112 (shown in FIG. 2).
For example, the first connector interface 162 may be a card edge
interface at the front edge 136 configured to be plugged into a
card slot of the first electrical connector 112. The front contact
pads 160 are circuits of the module circuit board 130. The front
contact pads 160 may be electrically connected to corresponding
communication components 140 (shown in FIG. 2) via traces on
various layers of the module circuit board 130. In an exemplary
embodiment, the front contact pads 160 convey high speed data
signals. Optionally, various front contact pads 160 may be arranged
in pairs configured to carry differential signals.
The module circuit board 130 includes rear contact pads 164 on the
lower surface 134 that define a second connector interface 166
configured for electrically connecting to the second electrical
connector 116 (shown in FIG. 2). The rear contact pads 164 may be
electrically connected to corresponding communication components
140 via traces on various layers of the module circuit board 130.
Optionally, at least some of the rear contact pads 164 may be power
pads configured to transmit power between the second electrical
connector 116 and the module circuit board 130 for powering the
communication components 140. Optionally, the rear contact pads 164
may be provided in multiple rows along the lower surface 134. The
rear contact pads 164 are provided at an intermediate portion 168
of the module circuit board 130 remote from the front edge 136 and
remote from the rear edge 138. Optionally, the rear contact pads
164 are positioned closer to the rear edge 138 than the front edge
136 and may be positioned at the rear edge 138 in some
embodiments.
The module circuit board 130 includes cutouts 172 at the side edges
near the intermediate portion 168. The shell 142 includes pockets
174 above the cutouts 172. The cutouts 172 and the pockets 174 are
configured to receive portions of the second electrical connector
116 during mating of the dual connector module 102 to the second
electrical connector 116 (FIG. 2). In an exemplary embodiment, the
module circuit board 130 includes landing pads 176 extending into
the cutouts 172. The landing pads 176 are configured to be engaged
by the second electrical connector 116 to mechanically secure the
dual connector module 102 to the second electrical connector
116.
The module circuit board 130 includes pressing surfaces 180, such
as at the rear ends of the cutouts 172. The shell 142 includes
pressing surfaces 182, such as at the rear ends of the pockets 174.
The release mechanisms 150 (shown in FIG. 1) are configured to
engage the pressing surfaces 180, 182. For example, when the
release mechanisms 150 are coupled to the second electrical
connector 116 (shown in FIG. 1), the release mechanism 150 may
press against the pressing surfaces 180 and/or the pressing
surfaces 182 to force the dual connector module 102 rearward. In
other various embodiments, the release mechanisms 150 may be
mounted to the dual connector module 102 at the pressing surfaces
182 and engage the second electrical connector 116, thus pressing
against the pressing surfaces 180 and/or the pressing surfaces 182
to force the dual connector module 102 rearward.
The dual connector module 102 includes one or more of the latches
146, such as two latches 146 provided at or near the sides of the
dual connector module 102 at the front end of the dual connector
module 102. In an exemplary embodiment, each latch 146 is coupled
to and extends forward from the shell 142. The latch 146 is
pivotably coupled to the shell 142 at a fulcrum 190. The latch 146
includes a latching beam 192 extending forward from the fulcrum
190. The latch 146 includes a hook 194 at the distal end of the
latching beam 192 for latching to a corresponding latching feature
of the first electrical connector 112.
The actuator 148 is coupled to the latch 146, such as to the
latching beam 192, forward of the fulcrum 190. Optionally, the
actuator 148 may be a tether coupled to the latch 146. In an
exemplary embodiment, the actuator 148 is used to lift the latch
146 upward, such as in a direction perpendicular to the mating
direction of the module circuit board 130, to release the latch
146. The actuator 148 may extend along the sides of the heat sink
144 or may extend along the front of the heat sink 144, to a handle
196 used to operate the actuator 148.
FIG. 4 is a top perspective view of the host circuit board 110 in
accordance with an exemplary embodiment. The host circuit board 110
includes mounting areas for mounting the dual connector module 102
(shown in FIG. 3) to the host circuit board 110. The mounting area
is subdivided into the front mounting area 114 receiving the first
electrical connector 112 and the rear mounting area 118 receiving
the second electrical connector 116.
With additional reference to FIG. 3 for reference to components of
the dual pluggable module 102, the first electrical connector 112
includes a housing 300 mounted to the host circuit board 110. The
housing 300 holds a plurality of first contacts 302 configured to
be terminated to the host circuit board 110. The housing 300 has a
mating end 304 configured to be mated with the first connector
interface 162 (FIG. 3) of the dual connector module 102. In an
exemplary embodiment, the first electrical connector 112 includes a
card slot 306 at the mating end 304. The first contacts 302 are
arranged in the card slot 306 for mating with the first connector
interface 162. For example, the first contacts 302 may be arranged
in an upper row and a lower row for interfacing with the front
contact pads 160 (FIG. 3) on the upper surface 132 and the lower
surface 134 at the front edge 136 of the module circuit board
130.
The housing 300 includes locating surfaces 308 at the mating end
304 for locating the module circuit board 130 relative to the card
slot 306 during mating. For example, the locating surfaces 308 may
be upward facing surfaces configured to support the front edge 136
of the module circuit board 130 in the pre-staged position. The
module circuit board 130 may slide along the locating surfaces 308
during mating as the front edge 136 of the module circuit board 130
is loaded into the card slot 306. The locating surfaces 308 may
support the module circuit board 130 in the mated position to
prevent damage to the first contacts 302 from the weight of the
dual connector module 102.
The housing 300 includes one or more latching features 310. The
latching features 310 interact with the latch 146 of the dual
connector module 102 to secure the dual connector module 102 to the
first electrical connector 112. For example, in the illustrated
embodiment, the latching features 310 are openings in the top
surface of the housing 300 that receive the hooks 194 of the
corresponding latches 146. The latches 146 are releasable from the
latching features 310. In a latched position, the latches 146 are
received in the latching features 310 and retain the relative
position of the dual connector module 102 with respect to the first
electrical connector 112. For example, the latches 146 retain the
front edge 136 of the module circuit board 130 in the card slot
306. When the latches 146 are released to an unlatched position,
such as by pulling upward on the actuator 148, the dual connector
module 102 may be unmated from the first electrical connector 112.
For example, the dual connector module 102 may be moved rearward,
such as by the releasing mechanisms 150.
With additional reference to FIG. 5, which is an end view of the
second electrical connector 116 in accordance with an exemplary
embodiment, the second electrical connector 116 includes a housing
350 mounted to the host circuit board 110. The housing 350 holds a
plurality of second contacts 352 configured to be terminated to the
host circuit board 110. The housing 350 has a mating end 354 (for
example, defining the top) configured to be mated with the second
connector interface 166 (FIG. 3) of the dual connector module 102.
In an exemplary embodiment, the second electrical connector 116
includes an upper mating surface 356 at the mating end 354. The
second contacts 352 are arranged along the upper mating surface
356, such as in one or more rows, for mating with the second
connector interface 166. The second contacts 352 may include
deflectable spring beams configured to be resiliently biased
against the second connector interface 166 when the dual connector
module 102 is mated to the second electrical connector 116.
The housing 350 includes locating surfaces 358 at the mating end
354 for locating the module circuit board 130 during mating. For
example, the locating surfaces 358 may be upward facing surfaces
configured to support the intermediate portion 168 of the module
circuit board 130. The housing 350 includes towers 360 extending
above the locating surfaces 358, such as at opposite sides 362, 364
of the housing 350. The towers 360 may be integral with the base of
the housing 350; however, the towers 360 may be separate components
mounted to the base of the housing 350 in alternative embodiments.
For example, the towers 360 may be die cast metal components
attached to a molded plastic base of the housing 350 and/or the
host circuit board 110 to provide additional rigidity for support
and holding strength for the module circuit board 130 and/or to
provide higher precision manufacturing and locating for the module
circuit board 130.
The towers 360 include ledges 366, such as at distal or top ends of
the towers 360, extending over the second electrical connector 116.
The towers 360 and the ledges 366 form a gap 368 above the upper
mating surface 356 that receives the module circuit board 130. The
ledges 366 are configured to engage the upper surface 132 of the
module circuit board 130, such as at the landing pads 176 (FIG. 3),
to retain the module circuit board 130 in the gap 368 between the
ledges 366 and the upper mating surface 356. The ledges 366 prevent
lift-off of the module circuit board 130 when the dual connector
module 102 is in the mated position. The module circuit board 130
is configured to bypass the towers 360 as the dual connector module
102 is loaded to the pre-staged position; however, when the dual
connector module 102 is slid forward to the mated position, the
module circuit board 130 is slid under the ledges 366 to the mated
position.
The module circuit board 130 may slide along the locating surfaces
358 during mating as the front edge 136 of the module circuit board
130 is loaded into the card slot 306. The locating surfaces 358 may
support the module circuit board 130, such as at the intermediate
portion 168, in the mated position to prevent damage to the second
contacts 352 from the weight of the dual connector module 102.
In an exemplary embodiment, the release mechanisms 150 are coupled
to the second electrical connector 116. For example, the release
mechanisms 150 are coupled to the towers 360 for interfacing with
the dual connector module 102 when the dual connector module 102 is
mated to the second electrical connector 116. In the illustrated
embodiment, the release mechanisms 150 are coupled to rear ends 370
of the towers 360. The release mechanisms 150 may be stamped and
formed from sheet metal into a spring shape, such as a leaf spring
shape. Each release mechanism 150 includes a base 372 mounted to
the tower 360 and a spring beam 374 extending from the base 372.
The spring beam 374 is deflectable and is configured to be
compressed against the dual connector module 102. When the spring
beams 382 are compressed, the spring beams 382 are resiliently
deformed and are thus spring biased outward against the dual
connector module 102. For example, when compressed, the spring beam
374 develops an internal spring biasing force. The spring beam 374
presses against the dual connector module 102 and forces the dual
connector module 102 rearward.
FIG. 6 is a top view of a portion of the dual connector system 100
showing the module circuit board 130 partially mated to the host
circuit board 110. FIG. 7 is a top view of a portion of the dual
connector system 100 showing the module circuit board 130 fully
mated to the host circuit board 110. The release mechanisms 150
extend from the towers 360 to engage the module circuit board 130;
however the release mechanisms 150 may extend from the dual
connector module 102 to engage the second electrical connector 116
or the first electrical connector 112 in alternative
embodiments.
In an exemplary embodiment, mating of the dual connector module 102
to the host circuit board 110 (and the electrical connectors 112,
116) occurs by loading the dual connector module 102 in the loading
direction 124 (shown in FIG. 2) to the pre-staged, unmated position
(FIG. 6), such as by loading the dual connector module 102 downward
onto the first and second electrical connectors 112, 116. Once
positioned, the dual connector module 102 is mated to the first and
second electrical connectors 112, 116 by moving the dual connector
module 102 in the mating direction 126 to the mated position (FIG.
7).
During mating, the first connector interface 162 is generally
aligned above the first electrical connector 112 and the second
connector interface 166 is generally aligned above the second
electrical connector 116 and the module circuit board 130 is
lowered into position on the first and second electrical connectors
112, 116 to the pre-staged, unmated position. The front edge 136 of
the module circuit board 130 rests on, and is supported by, the
first electrical connector 112 in the pre-staged, unmated position
(FIG. 6). As the module circuit board 130 is lowered, the towers
360 of the second electrical connector 116 extend into the cutouts
172 in the module circuit board 130. The release mechanisms 150 are
received in the cutouts 172 at opposite sides of the module circuit
board 130.
As the dual connector module 102 is moved from the pre-staged,
unmated position (FIG. 6) to the mated position (FIG. 7), the
release mechanisms 150 are compressed. The bases 372 of the release
mechanisms 150 are mounted to the towers 360. The spring beams 374
of the release mechanisms 150 extend from the bases 372. The
portion of the module circuit board 130 rearward of the cutouts 172
is moved forward to a position between the towers 360. The release
mechanisms 150 engage the pressing surfaces 180 (and/or the
pressing surfaces 182 of the shell 142, both shown in FIG. 3). The
spring beams 374 are deflected and compressed by the pressing
surfaces 180 (and/or the pressing surfaces 182). The spring beams
374 press against the pressing surfaces 180 (and/or the pressing
surfaces 182). The dual connector module 102 is latchably secured
to the first electrical connector 112, as described above. However,
when the latches 146 (shown in FIG. 3) are released, the release
mechanisms 150 cause the dual connector module 102 to shift
rearward to the unmated position.
FIGS. 8 through 10 show a mating sequence of the dual connector
module 102 to the host circuit board 110. FIG. 8 shows the dual
connector module 102 poised for coupling to the host circuit board
110 at an elevated positioned above the host circuit board 110.
FIG. 9 shows the dual connector module 102 in a pre-staged, unmated
position. FIG. 10 shows the dual connector module 102 in a mated
position.
In an exemplary embodiment, mating of the dual connector module 102
to the host circuit board 110 occurs by loading the dual connector
module 102 in the loading direction 124 to the pre-staged, unmated
position (FIG. 9), such as by loading the dual connector module 102
downward onto the first and second electrical connectors 112, 116.
Once positioned, the dual connector module 102 is mated to the
first and second electrical connectors 112, 116 by moving the dual
connector module 102 in the mating direction 126 to the mated
position (FIG. 10).
During assembly, the first connector interface 162 is generally
aligned above the first electrical connector 112 and the second
connector interface 166 is generally aligned above the second
electrical connector 116 (FIG. 8) and the module circuit board 130
is lowered into position on the first and second electrical
connectors 112, 116 to the pre-staged position (FIG. 9). The front
edge 136 of the module circuit board 130 rests on, and is supported
by, the first electrical connector 112 in the pre-staged, unmated
position. As the module circuit board 130 is lowered, the tower 360
of the second electrical connector 116 extends into the cutout 172
in the module circuit board 130. The release mechanism 150 is
received in the cutout 172. The release mechanism 150 includes the
base 372 mounted to the tower 360 and the spring beam 374 extending
from the base 372; however, the base 372 may be mounted to the dual
connector module 102 in alternative embodiments such that the
spring beam 374 engages the second electrical connector 116.
As the dual connector module 102 is moved from the pre-staged,
unmated position (FIG. 9) to the mated position (FIG. 10), the
release mechanism 150 is compressed between the dual connector
module 102 and the second electrical connector 116. The module
circuit board 130 rearward of the cutout 172 is moved forward in
line with the tower 360. For example, the module circuit board 130
is slid forward relative to the second electrical connector 116. In
the mated position, the ledge 366 of the tower 360 is positioned
above the landing pad 176 of the module circuit board 130 to hold
the vertical position of the module circuit board 130 within the
second electrical connector 116. For example, the module circuit
board 130 is captured between the ledge 366 and the upper mating
surface 356. The ledge 366 prevents lift-off of the module circuit
board 130 from the upper mating surface 356.
When the dual connector module 102 is slid forward to the mated
position, the latch 146 engages the latching feature 310 to
latchably secure the dual connector module 102 in the mated
position. When the actuator 148 is operated (for example, pulled
upward), the latch 146 is released in a releasing direction 400
perpendicular to an acting direction 402 of the release mechanism
150. For example, the releasing direction 400 is vertically upward
and the spring force acting direction 402 is horizontally rearward
in the illustrated embodiment. The release mechanism 150 forces the
dual connector module 102 in the rearward unmating direction 128.
The release mechanism 150 is extended as the dual connector module
102 is moved from the mated position to the unmated position.
FIG. 11 is a side view of a portion of the dual connector system
100 in accordance with an exemplary embodiment. FIG. 11 illustrates
the first electrical connector 112 and the release mechanism 150
between the first electrical connector 112 and the dual connector
module 102. Optionally, the release mechanism 150 may be coupled to
the first electrical connector 112 and presses against the dual
connector module 102 to force the dual connector module 102 in the
rearward unmating direction 128 when the latch 146 is released.
Alternatively, the release mechanism 150 may be coupled to the dual
connector module 102 and presses against the first electrical
connector 112 to force the dual connector module 102 in the
rearward unmating direction 128 when the latch 146 is released.
FIG. 12 is a side view of a portion of the dual connector system
100 in accordance with an exemplary embodiment. FIG. 12 illustrates
a different connection arrangement between the second electrical
connector 116 and the dual connector module 102. Rather than using
the towers 360 (shown in FIG. 5), the dual connector module 102
includes a tab 460 extending downward below the lower surface 134
of the module circuit board 130 to engage the second electrical
connector 116. For example, the tab 460 includes a ledge 462 (shown
in phantom) and the second electrical connector 116 includes a
ledge 464 (shown in phantom). As the dual connector module 102 is
moved forward from the unmated position to the mated position, the
ledge 462 is captured below the ledge 464 to hold the dual
connector module 102 downward against the mating surface of the
second electrical connector 116 and prevent lift-off of the dual
connector module 102.
In an exemplary embodiment, the release mechanism 150 is positioned
between the second electrical connector 112 and the dual connector
module 102. For example, the release mechanism 150 is positioned
between the second electrical connector 116 and the tab 460.
Optionally, the release mechanism 150 may be coupled to the second
electrical connector 112 and presses against the tab 460 to force
the dual connector module 102 in the rearward unmating direction
128 when the latch 146 is released. Alternatively, the release
mechanism 150 may be coupled to the tab 460 and presses against the
second electrical connector 112 to force the dual connector module
102 in the rearward unmating direction 128 when the latch 146 is
released.
It is to be understood that the above description is intended to be
illustrative, and not restrictive. For example, the above-described
embodiments (and/or aspects thereof) may be used in combination
with each other. In addition, many modifications may be made to
adapt a particular situation or material to the teachings of the
invention without departing from its scope. Dimensions, types of
materials, orientations of the various components, and the number
and positions of the various components described herein are
intended to define parameters of certain embodiments, and are by no
means limiting and are merely exemplary embodiments. Many other
embodiments and modifications within the spirit and scope of the
claims will be apparent to those of skill in the art upon reviewing
the above description. The scope of the invention should,
therefore, be determined with reference to the appended claims,
along with the full scope of equivalents to which such claims are
entitled. In the appended claims, the terms "including" and "in
which" are used as the plain-English equivalents of the respective
terms "comprising" and "wherein." Moreover, in the following
claims, the terms "first," "second," and "third," etc. are used
merely as labels, and are not intended to impose numerical
requirements on their objects. Further, the limitations of the
following claims are not written in means-plus-function format and
are not intended to be interpreted based on 35 U.S.C. .sctn.
112(f), unless and until such claim limitations expressly use the
phrase "means for" followed by a statement of function void of
further structure.
* * * * *