U.S. patent number 10,283,915 [Application Number 15/149,873] was granted by the patent office on 2019-05-07 for connector and electronic device including the same.
This patent grant is currently assigned to Samsung Electronics Co., Ltd. The grantee listed for this patent is Samsung Electronics Co., Ltd.. Invention is credited to Jae Ryong Han, Eun Seok Hong, Kyu Hyuck Kwak.
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United States Patent |
10,283,915 |
Han , et al. |
May 7, 2019 |
Connector and electronic device including the same
Abstract
Disclosed is a connector that interrupts electromagnetic waves
and includes a terminal part, an inner shell surrounding the
terminal part and having a plug form that is inserted into the
connector from outside of the connector, and an outer shell
surrounding at least a portion of the inner shell.
Inventors: |
Han; Jae Ryong (Gyeonggi-do,
KR), Kwak; Kyu Hyuck (Gyeonggi-do, KR),
Hong; Eun Seok (Gyeonggi-do, KR) |
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd. |
Gyeonggi-do |
N/A |
KR |
|
|
Assignee: |
Samsung Electronics Co., Ltd
(KR)
|
Family
ID: |
57223303 |
Appl.
No.: |
15/149,873 |
Filed: |
May 9, 2016 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20160329663 A1 |
Nov 10, 2016 |
|
Foreign Application Priority Data
|
|
|
|
|
May 7, 2015 [KR] |
|
|
10-2015-0064075 |
May 7, 2015 [KR] |
|
|
10-2015-0064076 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R
13/6595 (20130101); H01R 13/6593 (20130101) |
Current International
Class: |
H01R
13/648 (20060101); H01R 13/6593 (20110101); H01R
13/6595 (20110101) |
Field of
Search: |
;439/607.27,607.36,607.37,607.4,607.55 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Primary Examiner: Vu; Hien D
Attorney, Agent or Firm: The Farrell Law Firm, P.C.
Claims
What is claimed is:
1. A connector comprising: a terminal part including a first pin
for power supply and a second pin for data transmission; an inner
shell surrounding the terminal part and having a form corresponding
to a plug that is inserted into the connector from outside of the
connector; and an outer shell surrounding at least a portion of the
inner shell, wherein the first pin is at least partially coated
with a resin to prevent corrosion, wherein the outer shell is
provided with a plurality of first holes through which the first
pin is accessible and a plurality of second holes through which the
second pin is accessible, wherein the resin is applied to the first
pin through at least one of the first holes, and wherein each of
the first holes is larger than each of the second holes, and the
first holes are fewer in number than the second holes, wherein each
of the first holes is formed between the second holes, and wherein
the first holes and the second holes are formed to enable seeing
through the first holes and the second holes to identify that the
first pin and the second pin are connected to a board.
2. The connector of claim 1, wherein the outer shell comprises: a
top area; bending areas extending from the top area to left and
right side surfaces of the outer shell; side areas extending from
the bending areas and being perpendicular to a bottom surface of
the outer shell; and a rear area disposed on an opposite side to a
surface, through which the plug is inserted, and being
perpendicular to the bottom surface.
3. The connector of claim 2, wherein the top area, the bending
areas, the side areas, and the rear area are integrally formed of
one metallic material.
4. The connector of claim 2, wherein the bending areas are bent and
adhered to an outer surface of the inner shell.
5. The connector of claim 2, wherein the side areas comprise at
least one coupling part that is coupled to the inner shell.
6. The connector of claim 2, wherein the side areas comprise an
insertion part that is inserted into a hole formed in a printed
circuit board (PCB).
7. The connector of claim 2, wherein the side areas further
comprise a fixing part that couples the outer shell to a printed
circuit board (PCB).
8. The connector of claim 7, wherein the side areas further
comprise interruption parts that are disposed adjacent to the
fixing part and contact a surface of the PCB.
9. The connector of claim 2, wherein the rear area comprises at
least one opening for maintaining a specific distance or more from
a designated pin connected to the terminal part.
10. The connector of claim 9, wherein the opening is disposed
between a lower end of the rear area and a surface of the PCB.
11. The connector of claim 9, wherein the opening becomes wider
towards the lower end of the rear area.
12. The connector of claim 2, wherein the rear area is coupled to
ends of the bending areas and the side areas through a designated
number or more of coupling points.
13. An electronic device comprising: a housing; an opening formed
on a surface of the housing; a board disposed in the housing to be
substantially perpendicular to the surface of the housing; and a
connector connected through the opening and mounted on the board,
wherein the connector comprises: a designated number or more of
pins connected to or mounted on the board; an inner shell
surrounding the pins from at least three sides; and an outer shell
surrounding at least a portion of an outer surface of the inner
shell, wherein at least one hole is provided on the outer shell
such that at least one pin disposed on the connector is accessible
through the at least one hole, wherein the at least one hole is
positioned on a surface of the outer shell that is perpendicular to
a plane on which the at least one pin projects, wherein some of the
designated number or more of pins are at least partially covered by
a resin, wherein the at least one hole includes a plurality of
first holes formed so that a nozzle for applying the resin can be
inserted into the first holes, and a plurality of second holes for
enabling visual inspection of the designated number or more of pins
and the board, wherein the first holes are larger in size but fewer
in number than the second holes, wherein each of the first holes is
formed between the second holes, and wherein the first holes and
the second holes are formed to enable seeing through the first
holes and the second holes to identify that the first pin and the
second pin are connected to a board.
14. The electronic device of claim 13, wherein the inner shell
surrounds at least three sides of the pins around the opening, when
viewed from above one surface of the housing.
15. The electronic device of claim 13, further comprising: a
wireless communication module disposed inside the housing to
transmit and receive a wireless signal of a designated frequency
band; and at least one processor connected to the wireless
communication module and the connector.
16. The electronic device of claim 15, wherein when the at least
one processor transmits and receives data through at least one of
the pins at a designated transmission rate, the inner shell or the
outer shell interrupts interference with the wireless signal.
17. The electronic device of claim 16, wherein the transmission
rate is a value selected from 9 gigabytes per second (Gbps) to 11
Gbps.
Description
PRIORITY
This application claims priority under 35 U.S.C. .sctn. 119(a) to
Korean Patent Applications filed in the Korean Intellectual
Property Office on May 7, 2015 and assigned Serial Numbers
10-2015-0064075 and 10-2015-0064076, the contents of both of which
are incorporated herein by reference.
BACKGROUND
1. Field of the Disclosure
The present disclosure relates generally to a connector that
transmits and receives data and an electronic device including the
same.
2. Description of the Related Art
An electronic device such as a smartphone or a tablet includes a
connector, such as a universal serial bus (USB) terminal, for
transmitting and receiving data to and from an external device. The
connector has a plug form, and includes terminals corresponding to
the terminals of the plug. The terminals of the connector transmit
and receive designated electrical signals.
A plurality of components that perform various functions is mounted
in a limited mounting space in such an electronic device. In this
case, interference is generated between adjacent components, and
degrades specific performance of the electronic device.
In the connector mounted on the electronic device, electromagnetic
waves generated as data is transmitted and received through the
connector, and degrade the performances of the components, such as
an antenna for wireless communication, disposed around the
connector. For example, when data communication is performed
through a connector that supports the USB 3.0 or 3.1 Standard, the
radiation performance of the wireless communication antenna
disposed around the connector decreases.
In another example, when data communication by the USB 3.0 or 3.1
Standard is performed while the connector is not separately
shielded, the radiation performance of the wireless antenna
decreases by the electromagnetic waves generated by the connector.
In a data communication standard, including the USB Standards,
through which data communication is performed at a high speed, the
radiation performance also decreases by the electromagnetic waves
generated due to data communication.
Since the connector according to the related art is not shielded
and cannot efficiently interrupt electromagnetic waves even if it
were shielded, the radiation performance of the antenna
decreases.
As such, there is a need in the art for a connector that
efficiently interrupts electromagnetic waves, and improves
radiation performance in the electronic device.
SUMMARY
The present disclosure has been made to address at least the
above-mentioned problems and/or disadvantages and to provide at
least the advantages described below.
Accordingly, an aspect of the present disclosure is to provide a
connector that interrupts electromagnetic waves in two stages by
using an inner shell and an outer shell and minimizes an influence
of electromagnetic waves on a peripheral wireless antenna, for
example.
In accordance with an aspect of the present disclosure, there is
provided a connector which includes a terminal part, an inner shell
surrounding the terminal part and having a plug form inserted from
the outside, and an outer shell surrounding at least a portion of
the inner shell.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other aspects, features, and advantages of certain
embodiments of the present disclosure will be more apparent from
the following description taken in conjunction with the
accompanying drawings, in which:
FIG. 1 is a perspective view of a connector according to
embodiments of the present disclosure;
FIG. 2 is an exploded perspective view of a connector according to
embodiments of the present disclosure;
FIG. 3 is a view of an outer shell of the connector according to
embodiments of the present disclosure;
FIG. 4 illustrates side areas of an outer shell of the connector
according to embodiments of the present disclosure;
FIG. 5 illustrates a rear side area of a connector according to
embodiments of the present disclosure;
FIG. 6 illustrates a rear side area of a connector according to
embodiments of the present disclosure;
FIG. 7 illustrates holes formed in an outer shell of the connector
according to embodiments of the present disclosure;
FIGS. 8A and 8B illustrate an arrangement view of pins in the
interior of a connector according to embodiments of the present
disclosure;
FIG. 9 illustrates irradiation of electromagnetic waves through a
connector according to embodiments of the present disclosure;
FIG. 10 illustrates a pad shape on a printed circuit board (PCB)
according to embodiments of the present disclosure;
FIG. 11 illustrates an electronic device including a connector
according to embodiments of the present disclosure; and
FIG. 12 is a block diagram of an electronic device according to
embodiments of the present disclosure.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE DISCLOSURE
Hereinafter, embodiments of the present disclosure will be
described with reference to the accompanying drawings. Accordingly,
those of ordinary skill in the art will recognize that
modifications, equivalents, and/or alternatives of the embodiments
described herein can be variously made without departing from the
scope and spirit of the present disclosure. With regard to
description of drawings, similar components may be marked by
similar reference numerals. A detailed description of known
configurations and/or functions will be omitted for the sake of
clarity and conciseness.
Herein, the expressions "have", "may have", "include" and
"comprise", "may include" and "may comprise" indicate existence of
corresponding numeric values, functions, operations, or components,
but do not exclude presence of additional features.
The expressions "A or B", "at least one of A or/and B", and "one or
more of A or/and B" may include any and all combinations of one or
more of the associated listed items. For example, the expressions
"A or B", "at least one of A and B", and "at least one of A or B"
may refer to any of (1) when at least one A is included, (2) when
at least one B is included, and (3) when both of at least one A and
at least one B are included.
The terms "first" and "second" used herein may refer to various
elements of embodiments of the present disclosure, but do not limit
the elements. For example, such terms do not limit the order and/or
priority of the elements, and may be used to distinguish one
element from another element. For example, a first user device and
a second user device may represent different user devices
irrespective of sequence or importance, a first element may be
referred to as a second element, and similarly, a second element
may be referred to as a first element.
When an element, such as a first element, is referred to as being
"(operatively or communicatively) coupled with/to" or "connected
to" another element, such as a second element, the first element
can be directly coupled with/to or connected to the second element
or an intervening element, such as a third element, may be present.
In contrast, when the first element is referred to as being
"directly coupled with/to" or "directly connected to" the second
element, it should be understood that there is no intervening third
element.
According to the situation, the expression "configured to" used
herein may be used as, for example, the expression "suitable for",
"having the capacity to", "designed to", "adapted to", "made to",
or "capable of". The expression "configured to" does not indicate
only "specifically designed to" in hardware. Instead, the
expression "a device configured to" indicates that the device is
"capable of" operating together with another device or other
components. A "processor configured to perform A, B, and C"
indicates an embedded processor for performing a corresponding
operation or a generic-purpose processor, such as a central
processing unit (CPU) or an application processor, which performs
corresponding operations by executing one or more software programs
which are stored in a memory device.
Terms in this specification are used to describe specified
embodiments of the present disclosure and are not intended to limit
the scope of the present disclosure. The terms of a singular form
include plural forms unless otherwise specified. Unless otherwise
defined herein, all the terms used herein, which include technical
or scientific terms, have the same meaning that is generally
understood by a person skilled in the art. It will be further
understood that terms, which are defined in a dictionary and
commonly used, should also be interpreted as is customary in the
relevant related art and not in an idealized or overly formal
detect unless expressly so defined herein in embodiments of the
present disclosure. In some cases, even if terms are terms which
are defined in the specification, the terms may not be interpreted
to exclude embodiments of the present disclosure.
Hereinafter, a connector mounted on an electronic device according
to embodiments will be described with reference to the accompanying
drawings. The term "user" used herein may refer to a person who
uses an electronic device or an artificial intelligence electronic
device that uses an electronic device.
FIG. 1 is a perspective view of a connector according to
embodiments of the present disclosure.
Referring to FIG. 1, the connector 101 includes an outer shell 110,
an inner shell 120, and a terminal part 130.
The connector 101 is mounted on a PCB 102, has a plug form 103 that
is inserted into the connector 101 from the outside, and is
electrically connected to the plug 103. In embodiments, the
connector 101 may be a USB connector. In this case, the connector
101 includes a plurality of terminals for data communication
according to the USB 3.1 Standard. Unlike in the existing USB 1.0
or 2.0 Standard, an operation frequency of the USB 3.1 Standard is
similar or identical to a communication frequency of an antenna for
wireless data communication. In this case, the outer shell 110 and
the inner shell 120 prevent deterioration of antenna radiation
performance by interrupting electromagnetic waves generated by a
plurality of terminals.
Although the connector 101 supporting the USB 3.1 Standard will be
mainly described, but the present disclosure is not limited
thereto.
Hereinafter, 1) a surface of the connector 101 that contacts the
PCB 102 will be referred to as a bottom surface, 2) a surface of
the connector 101 that is parallel to the bottom surface but does
not contact the PCB 102 will be referred to as a top surface, 3) a
surface of the connector 101 into which the plug 103 is inserted
will be referred to as a front surface, 4) a surface of the
connector 101 that is parallel to the front surface and into which
the plug 103 is not inserted will be referred to as a rear surface,
and 5) surfaces of the connector 101 that are perpendicular to the
bottom surface (or the top surface) and the front surface (or the
rear surface) will be referred to as left and right side
surfaces.
The outer shell 110 surrounds the outside of the connector 101, is
formed of a metallic material, and interrupts electromagnetic waves
irradiated to the outside of the inner shell 120. The outer shell
110 surrounds the top surface, the left and right surfaces, and the
rear surface of the inner shell 120, except for the front surface
into which the plug 103 is inserted, and is fixed to the PCB
102.
The connector according to the related art has no outer shell 110
that improves performance, and therefore cannot efficiently
interrupt electromagnetic waves generated by the connector. Thus,
the connector of the related art incurs deteriorating antenna
radiation performance because the outer shell is mounted for the
purpose of reinforcing strength. In contrast, the connector 101
according to the present disclosure efficiently interrupts
electromagnetic waves through the outer shell 110 and the inner
shell 120, and minimizes an influence of electromagnetic waves on
an antenna for wireless communication. The inner shell 120
surrounds and protects the terminal part 130, is formed of a
metallic material, interrupts electromagnetic waves generated due
to data communication through the terminal part 130, and is
electrically connected to a ground terminal of the PCB 102. When
the inner shell 120 is connected to the ground terminal, external
noise is interrupted and an electromagnetic wave shielding function
is reinforced.
The inner shell 120 has a shape corresponding to the plug 103, and
fixes the plug 103 to prevent the plug 103 from being separated
during data communication.
The terminal part 130 includes a plurality of terminals which
transmit and receive designated electrical signals. For example,
when the connector 101 is a type C connector that supports the USB
3.1 Standard, the terminal part 130 includes twelve terminals
disposed at an upper end of a mid-plate and twelve terminals
disposed at a lower end of a mid-plate. The plurality of terminals
extends towards the rear surface and the bottom surface of the
connector 101 and is connected at designated locations of the PCB
102, such as by soldering.
The bottom surface of the inner shell 120, the fixing part of the
outer shell 110, and pins that will be connected to the terminal
part 130 are disposed on the bottom surface of the connector 101,
which is fixed onto a surface of the PCB 102 through soldering and
is connected to the PCB 102.
The plug 103 has a form corresponding to the inner shell 120 and
includes terminals corresponding to the terminals of the terminal
part 130, respectively. When the plug 103 is inserted into the
inner shell 120, the corresponding terminals are electrically
connected to each other to transmit and receive data. In
embodiments, the plug 103 supports data communication according to
the USB 3.1 Standard.
FIG. 2 is an exploded perspective view of a connector according to
embodiments of the present disclosure.
Referring to FIG. 2, the connector 101 includes an outer shell 110,
an inner shell 120, a terminal part 130, and fixing axes 140. The
terminal part 130 includes an electromagnetic compatibility (EMC)
pad 131, a support 132, a first row of terminals 133, and a second
row of terminals 134.
The outer shell 110 covers the top surface, the left and right side
surfaces, and the rear surface of the inner shell 110. The front
surface of the outer shell 110, through which the plug 103 is
inserted, and the bottom surface of the outer shell 110, which is
coupled to the PCB 102, are open. The outer shell 110 is integrally
formed by cutting and forming a material, such as a metal
panel.
The outer shell 110 includes coupling parts 111 that are coupled
the inner shell 120 on the left and right side surfaces. The
coupling parts 111 are coupled to, and have shapes corresponding to
shapes of the coupling parts 121 of the inner shell 120.
The outer shell 110 further includes a fixing part 112 that is
fixed to the PCB 102, has a hole at the center thereof, and is
coupled to the PCB 102 through fixing screws or soldering.
The outer shell 110 includes at least one hole 115 that connects
the inside and the outside of the connector 101. The hole 115 is
used to apply a resin to designated pins for preventing corrosion
due to moisture: from the outside, or to inspect pins in the
interior of the connector 101 by the naked eye. Detailed
description of the hole 115 is provided with reference to FIGS. 3
and 7.
The inner shell 120 is disposed in the interior of the outer shell
110. The top surface, left and right side surfaces, and rear
surface of the inner shell 120 are attached and coupled to the
outer shell 110. The front surface of the inner shell 120 is opened
for inserting the plug 103, and the bottom surface of the inner
shell 120 is fixed to the PCB 102. The inner shell 120 has a form
corresponding to the plug 103, and fixes the plug 103 after the
plug 103 is inserted. The inner shell 120 primarily interrupts
electromagnetic waves generated due to data communication through
the terminal part 130, and the outer shell 110 secondarily
interrupts the electromagnetic waves, as will be discussed
below.
The terminal part 130 includes an EMC pad 131, a support 132, a
first row of terminals 133, and a second row of terminals 134.
The EMC pad 131 is a conductive pad, such as a metal pad, and
shields electromagnetic waves radiated from the plurality of
terminals or electromagnetic waves introduced from the outside.
The support 132 supports the first row of terminals 133 and the
second row of terminals 134, includes a mid-plate at the center
thereof, and includes an insulation member that surrounds the
mid-plate. The support 132 is coupled to the EMC pad 131 and the
inner shell 120 through the fixing part 132a.
The first row of terminals 133 and the second row of terminals 134
include a plurality of terminals corresponding to the plug 103. The
first row of terminals 133 are upper terminals that support the USB
3.1 Standard, and the second row of terminals 134 are lower
terminals that support the USB 3.1 Standard. The first row of
terminals 133 and the second row of terminals 134 are arranged to
be symmetrical to each other, and support the USB C-type. The first
row of terminals 133 are coupled to the support 132 through the
fixing part 133a, and the second row of terminals 134 are coupled
to the support 132 through the fixing part 134a.
The first row of terminals 133 and the second row of terminals 134
are configured such that pins that are connected to the terminals
are disposed to face the rear surface of bottom surface of the
connector 101 through the fixing parts 133a and 134b. The first row
of terminals 133 is connected to the pins 133b through the fixing
part 133a, and the second row of terminals 134 is connected to the
pins 134b through the fixing part 134a. The rear surface of the
outer shell 110 includes an opening for preventing electrical
influence with the pins 133b or 134b. A detailed description of the
opening is provided with reference to FIG. 5.
The fixing axes 140 are disposed between the inner shell 120 and
the terminal part 130. The fixing axes 140 fix the inner shell 120
to the terminal part 130.
FIG. 3 is a view of an outer shell of the connector according to
embodiments of the present disclosure.
Referring to FIG. 3, the outer shell 110 includes a top area 310,
bending areas 320, side areas 330, and a rear area 340.
Although the areas are classified in FIG. 3 for convenience of
description, the outer shell 110 may be integrally formed of one
material, such as by partially cutting one plate of a metal
material and bending or coupling the remaining areas.
The top area 310 is coupled to the top surface of the inner shell
120 through at least one soldered part, and includes at least one
hole 115. The hole 115 may be used to inspect the pins in the
connector 101 by, the naked eye or to apply a resin to the
designated pins for preventing corrosion, from the outside of the
connector 101. Because the electromagnetic waves radiated to the
outside of the connector 101 increases as the size of the hole 115
increases, the size of the hole 115 may be restricted to a
designated value or less. Furthermore, the hole 115 may have
various forms, such as a tetragonal shape, a rectangular shape, a
circular shape, or an elliptical shape, according to a design or
manufacturing environment. The bending areas 320 extend from the
left and right sides of the top area 310, respectively, and are
areas in which the plate is bent according to a designated
curvature to correspond to the form of the inner shell 120.
The side areas 330 extend from the bending areas 320 and are
perpendicular to a surface of the PCB 102. The side areas 330
include at least one coupling part 111 coupled to the inner shell
120.
The side areas 330 further include fixing parts 112 that are
coupled to the PCB 102 through screws, for example. The fixing
parts 112 include holes 112a. The form of the fixing parts 112 or
of the holes 112a varies according to the material or manufacturing
environment of the outer shell.
The side areas further include insertion parts 330a that are
coupled to the PCB 102, are inserted into the hole of the PCB 102,
and fix the outer shell 110 to the PCB 102.
The side areas 330 further include interruption parts 330b that
prevent an aperture from being generated between the fixing part
112 and the insertion part 330a. The height of the interruption
parts 330b may be determined in consideration of the thickness of
the fixing part 112 (or the thickness of a metal plate that
realizes the outer shell 110). The interruption part 330b is
disposed at lower ends of the side areas to interrupt
electromagnetic waves radiated from the interior of the connector
101.
The rear areas 340 extend rearwards from the top area 310 and
contacts the bottom surface of the PCB 102 to be perpendicular to
the bottom surface. The rear area 340 interrupts electromagnetic
waves that are leaked to the rear side of the opened inner shell
120. The left and right side surfaces of the rear area 340 are
coupled to ends of the bending areas 320 or the side areas 330. The
rear area 340 includes at least one opening 341 which reduces an
electrical influence between the rear area 340 and the pins 133b or
134b. FIG. 4 illustrates side areas of an outer shell of the
connector according to embodiments of the present disclosure.
Referring to FIG. 4, when the outer shell 110 is connected to the
PCB 102, the side areas 330 of the outer shell 110 may be
implemented such that an unnecessary opening thereof is minimized
for interrupting electromagnetic waves.
The side areas 330 may be fixed to the PCB 102 through the fixing
parts 112 and the insertion parts 330a. The fixing parts 112 are
coupled to the PCB 102 through screws, for example, and the
insertion parts 330a are coupled to the PCB 102 in such a manner
that the insertion parts 330a are inserted into the holes of the
PCB 102. The insertion parts 330a fix the connector 101 while
assisting the fixing parts 112.
The interruption parts 330b block the fixing parts 112 from the
insertion parts 330a and are disposed to contact the PCB 102 so as
to interrupt electromagnetic waves radiated from the interior of
the connector 101.
According to embodiments, gaps 331 having a designated size are
formed between the fixing parts 112 and the interruption parts
330b. The gaps 331 are spaces that are formed to facilitate
deformation when the side areas 330 are manufactured by cutting or
bending one metal plate. The gap 331 are implemented to have a
width of about 0.25 millimeters (mm) or less. Because
electromagnetic waves in the interior of the connector 101 may
radiate even through the gap 331, it is necessary to minimize the
size of the gap 331.
FIG. 5 illustrates a rear side area of a connector according to
embodiments of the present disclosure.
Referring to FIG. 5, the rear area 340 of the connector 110
interrupts electromagnetic waves irradiated to the rear side of the
connector 110. The left and right side surfaces of the rear area
340 are coupled to the bending areas 320 extending to the left and
right side surfaces of the connector 110 and ends of the side areas
330.
The rear area 340 includes openings 510 for reducing an influence
on power pins 520. The openings 510 are areas for maintaining a
designated distance between the rear area 340 and the power pins,
such as V_Bus 520. When the power pins 520 have to maintain a
designated distance from a peripheral metallic material or the
ground while following standards, the openings 510 maintain at
least the distance between the power pins 520 and the rear area
340.
As illustrated in FIG. 5, when the power pins 520 extend to the
bottom surface of the connector 110 to be connected to the PCB 102,
the openings 510 are disposed to contact a lower end of the rear
area 340.
The width of the openings 510 increases when the openings 510
project towards the lower end of the rear area 340. The width 510a,
such as 0.5 millimeters (mm), at upper or middle ends of the
openings 510 is narrower than the width 510b, such as 0.6 mm, at
lower ends of the openings 510. The height 510c, such as 0.3 mm, of
the opening 510 may vary according to the locations of the power
pins 520. The distance between the power pins 520 and the opening
510 is maintained at a designated value, such as at least 0.5
mm.
FIG. 6 illustrates coupling points of a rear side area of a
connector according to embodiments of the present disclosure;
Referring to FIG. 6, the rear area 340 of the connector 101 is
coupled to ends of the bending areas 320 or the side areas 330 of
the connector 101 through the coupling points 610, such as through
laser welding at the coupling points 610. The coupling points 610
are disposed on the left and right side surfaces of the rear area
340 at a specific interval.
Although it is illustrated in FIG. 6 that three coupling points (a
total of six coupling points) 610 are disposed on the left and
right side surfaces of the rear area 340, respectively, the present
disclosure is not limited thereto. For example, four coupling
points (a total of eight points) 610 may be disposed on the left
and right sides of the rear area 340, respectively, or two coupling
points (a total of four coupling points) may be disposed,
respectively. As the number of the coupling points 610 increases,
the coupling force of the rear area 340 increases, which in turn
increases electromagnetic wave interruption efficiency. However, as
the number of the coupling points 610 increases, the number of
processes and manufacturing costs of the connector 101 also may
increase.
FIG. 7 illustrates holes formed in an outer shell of the connector
according to embodiments of the present disclosure. The locations,
the size, and the number of the holes of FIG. 7 are examples, and
the present disclosure is not limited thereto.
Referring to FIG. 7, the holes 115 are disposed in the top area 310
of the outer shell 110 and are used to apply a resin to the
designated pins, such as V_Bus, from the outside of the connector
101 in order to prevent corrosion due to moisture or to inspect the
pins in the connector 101 by the naked eye from the outside of the
connector 101.
Because the electromagnetic waves radiated to the outside of the
connector 101 increases as the hole 115 increases, the size of the
hole 115 is restricted to a designated value or less, and
accordingly, the amount of electromagnetic waves leaked to the
outside of the connector 101 is reduced.
The locations of the holes 115 varies according to the locations
where the pins in the connector 101 are connected to the PCB 102.
The holes include a first line of holes 710 and a second line of
holes 720. The first line of holes 710 corresponds to the locations
of the pins 133b connected to the first row of terminals 133 of
FIG. 2, and the second line of holes 720 corresponds to the
locations of the pins 134b connected to the second row of terminals
134.
The holes 115 include first holes 730 for applying a resin and
second holes 740 for inspection by the naked eye.
The first holes 730 apply a resin to the power pins, such as V_Bus
520. The power pins 520 are vulnerable to peripheral moisture, and
thus are protected from the moisture through application of a
resin.
The method of applying a resin to the power pins 520 includes i)
inserting a nozzle into the first holes 730 and applying a resin,
or ii) injecting a resin around the first holes 730. The first
holes 730 have a form or size that is necessary for a resin
applying method used in the manufacturing process.
For example, in the method of inserting a nozzle and applying a
resin, the first holes 730 have the same size as that of the
inserted nozzle or the minimum size, such as 0.6 mm*0.6 mm, that
allows passage of the nozzle. However, the minimum size varies
according to the amount of electromagnetic waves generated, a
design or manufacturing environment, and a data communication, and
sizes of 0.6 mm*0.5 mm, 0.6 mm, or 0.4 mm may be implemented.
The second holes 740 are for visual inspection for identifying
whether the pins are connected to the PCB 102. The second holes 740
may not be disposed to correspond to all the pins, and may be
formed such that two or three pins are simultaneously
identified.
Although it is illustrated in FIG. 7 that each of the second holes
740 is disposed between two general pins 530 such that two pins are
identified simultaneously and has a rectangular form, such as 0.5
mm*0.3 mm, that extends to the left and right sides of the
connector 101, the present disclosure is not limited thereto. The
form or size of the first holes 740 varies according to a design or
manufacturing environment. The size of the second holes 740 is
smaller than the size of the first holes 730.
FIGS. 8A and 8B illustrate an arrangement view of pins in the
interior of a connector according to embodiments of the present
disclosure.
Referring to FIG. 8A, the pins connected to the terminal part 130
are connected to the PCB 102 behind the connector 101. Although
arrangement of the pins that support the USB 3.1 Standard is
illustrated in FIG. 8A, the present disclosure is not limited
thereto.
A resin is applied to the power pins 520 through the first holes
730 to prevent corrosion by moisture. The power pins 520 are
disposed to have sizes different from those of the general pins 530
or to be spaced apart from the general pins 530 by a designated
distance or more.
The first distance 810 between the general pins 530 is less than
the second distance 820 between the power pins 520 and the general
pins 520, in which case a process of applying a resin to the power
pins 520 is simplified.
The pins 133b are disposed to cross the pins 134b. Through this,
the efficiency for disposition of the pins on the PCB 102 is
enhanced, and an influence by other rows of pins is reduced when a
resin is applied.
Referring to FIG. 8B, the connector 101 includes rows A and B of
pins, and each of the rows includes twelve pins. Although
arrangement of the pins that support the USB 3.1 Standard is
illustrated in FIG. 8B, the present disclosure is not limited
thereto.
Row A includes V_Bus pins (A4 and A9) as the power pins, and
includes other general pins. A resin is applied to the V_Bus pins
A4 and A9 through the holes 730.
Row A further includes USB 2.0 data pins (A6 and A7), a
configuration channel pin (A5), transmit (Tx) and receive (Rx) pin
pairs (A2, A3, A10, and A11), a sideband use pin A8, and ground
pins A1 and A12 as the general pins 530.
Similarly, row B includes V_Bus pins (B4 and B9) as the power pins,
and includes other general pins. A resin is applied to the V_Bus
pins B4 and B9 through the holes 730.
Row B further includes USB 2.0 data pins (B6 and B7), a
configuration channel pin (B5), transmit (Tx) and receive (Rx) pin
pairs (B2, B3, B10, and B11), a sideband use pin B8, and ground
pins B1 and B12 as the general pins 530.
FIG. 9 illustrates irradiation of electromagnetic waves through a
connector according to embodiments of the present disclosure.
Referring to FIG. 9, when the plug 103 is inserted into the
connector 101 and data is transmitted and received, electromagnetic
waves are generated by a plurality of terminals. The electronic
waves are primarily interrupted by the inner shell 120 and are
secondarily interrupted by the outer shell 110. The connector 101
efficiently interrupts leakage of electromagnetic waves through the
outer shell 110 and the inner shell 120.
As illustrated in FIG. 9, in the connector 101, some
electromagnetic waves may be radiated from some opened areas, such
as peripheral areas around the fixing parts 112, of the holes 310a,
and of the openings 510 of the outer shell 110, but electromagnetic
waves radiated from the other areas may be efficiently interrupted.
Although the antenna radiation performance disposed around a
connector decreases by electromagnetic waves generated by the
connector because the outer shell 110 cannot interrupt
electromagnetic waves according to the related art, the connector
according to the present disclosure prevents degrading of the
antenna radiation performance by efficiently interrupting
electromagnetic waves leaked through the outer shell 110 and the
inner shell 120. When the disposition direction of the connector
101 and the locations of openings and the like are determined in
consideration of the location of an antenna for wireless
communication, an influence by electromagnetic waves is efficiently
reduced.
FIG. 10 illustrates a pad shape on a PCB according to embodiments
of the present disclosure.
Referring to FIG. 10, various configurations, such as the inner
shell 120, the outer shell 110, and the plurality of pins disposed
on the bottom surface of the connector 101 may be connected to a
surface of the PCB 102. The pins 133b and 134b are connected to the
first row of terminals 133 and the second row of terminals 134,
respectively, in FIG. 2. The pins 133b and 134b transfer designated
electrical signals, respectively.
The inner shell 120 and the outer shell 110 are disposed around the
pins 133b and 134b to interrupt electromagnetic waves that are
generated by the pins.
The inner shell 120 is disposed on the front side (a side from
which the plug 103 is inserted) of the pins 133b and the pins 134b,
and the outer shell 110 is disposed on the lateral sides and the
rear side of the pins 133b and the pins 134b.
The inner shell 120 includes a front pad area 125 and a side pad
area 126 to be coupled to the PCB 102.
The front pad area 125 extends to the front or rear side of the
connector 101, and allows the inner shell 120 to be firmly mounted
on the PCB 102.
The side pad area 126 extends to the left and right sides of the
connector 101, and is shielded to interrupt electromagnetic waves
discharged towards the front side of the pins 133b and the pins
134b. As the side pad area 126 is expanded, the distance 1010
between the inner shell 120 and the outer shell 110 is additionally
reduced and an electromagnetic wave interrupting function is
reinforced. The distance 1010 between the inner shell 120 and the
outer shell 110 varies according to a design or manufacturing
environment thereof. For example, the distance 1010 may be
manufactured to maintain a value of 0.6 mm or less.
FIG. 11 illustrates an electronic device including a connector
according to embodiments of the present disclosure.
Referring to FIG. 11, the electronic device 1101 such as a
smartphone or a tablet, performs various functions such as
outputting of media, storage of data, and wireless communication.
The electronic device 1101 transmits and receives data to and from
an external device through the connector 101, and includes a
housing 1110, an opening 1111, a connector 101, and a board
102.
A display, a home button, and a volume button are disposed outside
the electronic device 1101, and the electronic device 1101 is
surrounded by an outer case or an inner housing is partially
exposed to the outside to form an external appearance of the
electronic device 1101.
The housing 1110 fixes various modules or devices in the interior
of the electronic device 101. A portion of the housing is exposed
to the outside to form an external appearance of the electronic
device 1101. Although it is mainly described herein that the
housing is partially exposed to the outside, the present disclosure
is not limited thereto, and a separate case could mounted to the
outside of the housing.
The electronic device 1101 includes an opening 1111 formed on one
surface of the housing 1110. The opening 1111 is connected to the
connector 101, and is a movement passage of the plug inserted from
the outside. The electronic device 1101 further includes a separate
cover for protecting the opening 1111.
Although it is illustrated in FIG. 11 that the opening 1111 and the
connector 101 are disposed at a lower end of the electronic device
111, the present disclosure is not limited thereto. For example,
the opening 111 and the connector 101 may be disposed on left and
right side surfaces or an upper end of the electronic device
1101.
The electronic device 1101 further includes a wireless
communication module, such as an antenna disposed in the interior
of the housing 1110 to transmit and receive a wireless signal of a
designated frequency band and at least one processor electrically
connected to the wireless communication module and the connector
101.
When the processor transmits and receives data through the
connector 101 at a designated transmission rate, such as 10
gigabytes per second (Gbps), interference with the wireless signal
is generated according to transmission and reception of data. The
outer shell 110 and the inner shell 120 of the connector 101
prevent degrading of wireless communication performance by
interrupting the interference. The transmission rate is a value
selected from 9 Gbps to 11 Gbps.
FIG. 12 is a block diagram of an electronic device 1201 according
to embodiments of the present disclosure. Referring to FIG. 12, the
electronic device 1201 includes at least one application processor
(AP) 1210, a communication module 1220, a subscriber identification
module (SIM) card 1224, a memory 1230, a sensor module 1240, an
input device 1250, a display 1260, an interface 1270, an audio
module 1280, a camera module 1291, a power management module 1295,
a battery 1296, an indicator 1297, and a motor 1298. The interface
1270 includes the connector of FIGS. 1 to 8.
The processor 1210 controls a plurality of hardware or software
components connected to the processor 1210 by driving an operating
system or an application program and performs a variety of data
processing and calculations. The processor 1210 may be implemented
by a system on chip (SoC). According to an embodiment, the
processor 1210 further includes a graphical processing unit (GPU)
and/or an image signal processor, includes at least some of the
components illustrated in FIG. 12, loads instructions or data,
received from at least one other component, such as a non-volatile
memory, in a volatile memory to process the loaded instructions or
data, and stores various types of data in a non-volatile
memory.
The communication module 1220 includes a cellular module 1221, a
WiFi module 1223, a Bluetooth.TM. module (BT) 1225, and a GNSS
module 1227, such as a global positioning system (GPS) module, a
Glonass module, a Beidou module, or a Galileo module, a near field
communication (NFC) module 1228, and a radio frequency (RF) module
1229.
The cellular module 1221 provides a voice call, a video call, a
text message service, or an Internet service through a
communication network. According to an embodiment, the cellular
module 1221 distinguishes between and authenticate electronic
devices 1201 within a communication network using the SIM card
1224, performs at least some of the functions that the processor
1210 provides, and includes a communication processor (CP).
The Wi-Fi module 1223, the BT module 1225, the GPS module 1227, and
the NFC module 1228 include a processor for processing data
transmitted/received through the corresponding module. According to
some embodiments, at least two of the cellular module 1221, the
WiFi module 1223, the Bluetooth module 1225, the GNSS module 1227,
and the NFC module 1228 may be included in one integrated chip (IC)
or IC package.
The RF module 1229 transmits/receives a communication signal, such
as an RF signal, and includes a transceiver, a power amp module
(PAM), a frequency filter, a low noise amplifier (LNA), or an
antenna. According to another embodiment, at least one of the
cellular module 1221, the WiFi module 1223, the Bluetooth module
1225, the GNSS module 1227, or the NFC module 1228 transmits and
receives an RF signal through a separate RF module.
The SIM card 1224 includes may be an embedded SIM, and further
includes unique identification information, such as an integrated
circuit card identifier (ICCID), or subscriber information, such as
international mobile subscriber identity (IMSI).
The memory 1230 includes an internal memory 1232 or an external
memory 1234. The internal memory 1232 includes at least one of a
volatile memory, such as a dynamic random access memory (DRAM), a
static RAM (SRAM), and a synchronous dynamic RAM (SDRAM), and a
non-volatile memory, such as a one time programmable read only
Memory (OTPROM), a programmable ROM (PROM), an erasable and
programmable ROM (EPROM), an electrically erasable and programmable
ROM (EEPROM), a flash memory, such as a NAND flash memory or a NOR
flash memory), a hard driver, and a solid state drive (SSD).
The external memory 1234 further includes a flash drive such as a
compact flash (CF), a secure digital (SD), a micro secure digital
(Micro-SD), a Mini-SD, an eXtreme digital (xD), or a memory stick.
The external memory 1234 may be functionally and/or physically
connected to the electronic device 1201 through various
interfaces.
The sensor module 1240 measures a physical quantity or detect an
operation state of the electronic device 1201, and converts the
measured or detected information to an electrical signal. The
sensor module 1240 includes at least one of a gesture sensor
1,240A, a gyro sensor 1,240B, an atmospheric pressure sensor 240C,
a magnetic sensor 240D, an acceleration sensor 240E, a grip sensor
240F, a proximity sensor 240G, a color sensor 240H, such as a red,
green, and blue (RGB) sensor, a biometric sensor 240I, a
temperature/humidity sensor 1,240J, an illumination sensor 1,240K,
and a Ultra Violet (UV) sensor 240M. Additionally or alternatively,
the sensor module 1240 includes an E-nose sensor, an
electromyography (EMG) sensor, an electroencephalogram (EEG)
sensor, an electrocardiogram (ECG) sensor, an infrared (IR) sensor,
an iris sensor, and/or a fingerprint sensor.
The sensor module 1240 further includes a control circuit for
controlling one or more sensors included therein. In some
embodiments, the electronic device 1201 further includes a
processor that controls the sensor module 1240 as a part of or
separately from the processor 1210, and controls the sensor module
1240 while the processor 1210 is in a sleep state.
The input device 1250 includes a touch panel 1252, a (digital) pen
sensor 1254, a key 1256, or an ultrasonic input device 1258. The
touch panel 1252 uses at least one of a capacitive type, a
resistive type, an infrared type, and an ultrasonic type. The touch
panel 1252 further includes a control circuit and a tactile layer
which provides a tactile reaction to a user.
The (digital) pen sensor 1254 includes a recognition sheet which is
a part of the touch panel or a separate recognition sheet. The key
1256 includes a physical button, an optical key, or a keypad. The
ultrasonic input device 1258 detects ultrasonic waves generated by
an input tool through a microphone 1288 and identifies data
corresponding to the detected ultrasonic waves.
The display 1260 includes a panel 1262, a hologram 1264, or a
projector 1266. The panel 1262 may be implemented to be flexible,
transparent, or wearable, and is formed as a single module together
with the touch panel 1252. The hologram device 1264 displays a
three dimensional image in the air using interference of light. The
projector 1266 displays an image by projecting light onto a screen,
which is located in the interior of or on the exterior of the
electronic device 1201. According to an embodiment, the display
1260 further includes a control circuit for controlling the panel
1262, the hologram device 1264, or the projector 1266.
The interface 1270 includes a high-definition multimedia interface
(HDMI) 1272, a universal serial bus (USB) 1274, an optical
interface 1276, and a D-subminiature (D-sub) 1278. Additionally or
alternatively, the interface 1270 includes a mobile high-definition
link (MHL) interface, a SD card/multi-media card (MMC) interface,
or an infrared data association (IrDA) standard interface.
The audio module 1280 bilaterally converts a sound and an
electrical signal, and processes voice information input or output
through a speaker 1282, a receiver 1284, earphones 1286, or the
microphone 1288.
The camera module 1291 photographs a still image and a dynamic
image, and includes one or more image sensors, such as a front or
back sensor, a lens, an image signal processor (ISP) and a flash,
such as a light-emitting diode (LED) or xenon lamp.
The power management module 1295 manages power of the electronic
device 1201, and includes a power management integrated circuit
(PMIC), a charger integrated circuit (IC), or a battery gauge. The
PMIC has a wired and/or wireless charging scheme. Examples of the
wireless charging method include a magnetic resonance method, a
magnetic induction method, and an electromagnetic wave method.
Additional circuits, such as a coil loop, a resonance circuit, and
a rectifier, for wireless charging may be further included. The
battery gauge measures a residual quantity of the battery 1296, and
a voltage, a current, or a temperature while charging, and includes
a rechargeable battery and/or a solar battery.
The indicator 1297 indicates a particular status of the electronic
device 1201 or a part thereof a booting status, a message status,
or a charging status, for example. The motor 1298 converts an
electrical signal into mechanical vibrations, and generates a
vibration or haptic effect. The electronic device 1201 includes a
processing device, such as a GPU, for supporting mobile TV. The
processing unit processes media data pursuant to a certain standard
of digital multimedia broadcasting (DMB), digital video
broadcasting (DVB), or media flow (mdiaFlo.TM.).
Each of the elements described in the specification includes one or
more components, and the terms of the elements may be changed
according to the type of the electronic device. In embodiments of
the present disclosure, the electronic device includes at least one
of the elements described in the specification, and some elements
may be omitted or additional elements may be further included. Some
of the elements of the electronic device according to embodiments
are coupled to form one entity, and perform the same functions of
the corresponding elements before they are coupled.
The connector according to embodiments includes a terminal part, an
inner shell surrounding the terminal part and having a plug form
inserted from the outside, and an outer shell surrounding at least
a portion of the inner shell to interrupt electromagnetic waves
generated as data is transmitted and received through the terminal
part.
The outer shell includes a top area, bending areas extending from
the top area to left and right side surfaces thereof, side areas
extending from the bending areas and being perpendicular to a
bottom surface thereof, and a rear area disposed on an opposite
side to a surface, through which the plug is inserted, and being
perpendicular to the bottom surface. The top area, the bending
areas, the side areas, and the rear area may be integrally formed
of one metallic material. The bending areas may be bent and adhered
to an outer surface of the inner shell.
The side areas include at least one coupling part that is coupled
to the inner shell and an insertion part that is inserted into a
hole formed in a PCB. The side areas further include a fixing part
that couples the outer shell to a PCB, and an interruption part
that is disposed adjacent to the fixing part and contacts a surface
of the PCB.
The rear area includes at least one opening for maintaining a
specific distance or more from a designated pin connected to the
terminal part. The opening is disposed between a lower end of the
rear area and a surface of the PCB. The opening increases as
towards the lower end of the rear area.
The rear area is coupled to ends of the bending areas and the side
areas through a designated number or more of coupling points.
The inner shell has a form corresponding to the plug, and the top
area, the bending areas, and the side areas are disposed to be
adhered to a surface of the inner shell. The terminal part includes
a plurality of terminals based on the USB 3.1 Standard.
The outer shell includes at least one hole through which the pin
connected to the terminal part is approached. The hole includes a
first hole for applying a resin to the pin, and a second hole for
identifying connection of the pin and a board, on which the
connector is mounted. The first hole is disposed at a location
where a power pin of the pins is connected the board. The first
hole has a size or a form corresponding to the size or form of a
nozzle that applies a resin to the power pin.
The hole is disposed such that a first line and a second line
including at least one first hole and at least one second hole are
formed, and the first hole is disposed between the second holes in
the first line and the second line.
The size of the first hole may be larger than the size of the
second hole. The number of the second holes is less than the number
of the general pins except for the power pin. The centers of the
second holes are disposed between the general pins except for the
power pin.
The electronic device according to embodiments includes a
connector, and the connector includes a terminal part, an inner
shell surrounding the terminal part and having a plug form inserted
from the outside, and an outer shell surrounding at least a portion
of the inner shell.
The electronic device according to embodiments includes a housing,
an opening formed on a surface of the housing, a board disposed in
the housing to be substantially perpendicular to the surface of the
housing, and a connector connected through the opening and mounted
on the board, and the connector includes a designated number or
more of pins connected to or mounted on the board, an inner shell
surrounding the pins from at least three sides, and an outer shell
surrounding at least a portion of an outer surface of the inner
shell. Three or more pins may be provided. The inner shell
surrounds at least three sides of the pins around the opening, when
viewed from the top of one surface of the housing.
The electronic device according to embodiments further includes a
wireless communication module disposed in the interior of the
housing to transmit and receive a wireless signal of a designated
frequency band, and at least one processor connected to the
wireless communication module and the connector. When the processor
transmits and receives data through at least one of the pins at a
designated transmission rate, the inner shell or the outer shell
interrupts interference with the wireless signal. The transmission
rate is selected from 9 Gbps to 11 Gbps.
The electronic device according to embodiments includes a first
metal pad mounted on the board and a second metal pad spaced apart
from the first metal pad by a first distance, at least one
periphery of the inner shell or the outer shell may make electrical
contact with the first metal pad and the second metal pad, and the
first distance may be a designated value or less.
The term "module" used in the specification indicates a unit
including one or at least two of hardware, software, and firmware.
The module may be interchangeably used with a unit, a logic, a
logical block, a component, or a circuit. The module may be a
minimum unit or a part of an integrally configured part. The module
may be a minimum unit or a part which performs one or more
functions. The module may be implemented mechanically or
electromagnetically. For example, the module may include at least
one of an application-specific integrated circuit (ASIC) chip, a
field-programmable gate array, or a programmable-logic device,
which is known or will be developed in the future.
The connector according to embodiments of the present disclosure
efficiently interrupts electromagnetic waves generated in the
terminals through the separate outer shell that is distinguished
from the inner shell.
The electronic device including the connector according to
embodiments of the present disclosure prevents degradation of an
antenna radiation performance by interrupting electromagnetic waves
that influences a wireless communication antenna disposed around
the connector.
The embodiments disclosed in the specification are provided to
describe the technical contents or for understanding of the
technical contents, and the technical scope of the present
disclosure is not limited thereto. Accordingly, the scope of the
present disclosure should be construed to include all changes or
embodiments based on the technical spirit of the present
disclosure.
While the present disclosure has been shown and described with
reference to certain embodiments thereof, it will be understood by
those skilled in the art that various changes in form and details
may be made therein without departing from the spirit and scope of
the present disclosure as defined by the appended claims and their
equivalents.
* * * * *