U.S. patent number 10,205,284 [Application Number 15/825,108] was granted by the patent office on 2019-02-12 for high-low frequency mixed connector.
This patent grant is currently assigned to DONGGUAN TAISOL ELECTRONICS CO., LTD.. The grantee listed for this patent is Dongguan Taisol Electronics Co., Ltd.. Invention is credited to Jinyan Wang, Chaotao Zhang.
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United States Patent |
10,205,284 |
Wang , et al. |
February 12, 2019 |
High-low frequency mixed connector
Abstract
The present invention relates to a high-low frequency mixed
connector, includes an insulator and high frequency pins and low
frequency pins set on the insulator, the low frequency pins
includes large current pins and small current pins; wherein, the
high frequency pins are installed on the insulator by means of
shrapnel or hot bar welding, the low frequency pins are installed
on the insulator by means of crimping, and the high frequency pins
and the low frequency pins are arranged in different directions.
The high-low frequency mixed connector in the present invention
contains the high frequency pins and the low frequency pins in the
terminal, and the high frequency pins and the low frequency pins
are arranged in different directions, thus, it is convenient for
users to use high frequency and high current connectors with low
cost and high efficiency.
Inventors: |
Wang; Jinyan (Dongguan,
CN), Zhang; Chaotao (Dongguan, CN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Dongguan Taisol Electronics Co., Ltd. |
Dongguan |
N/A |
CN |
|
|
Assignee: |
DONGGUAN TAISOL ELECTRONICS CO.,
LTD. (Dongguan, CN)
|
Family
ID: |
65241868 |
Appl.
No.: |
15/825,108 |
Filed: |
November 29, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01R
13/50 (20130101); H01R 13/6461 (20130101); H01R
12/585 (20130101); H01R 13/2471 (20130101); H01R
12/57 (20130101); H01R 13/646 (20130101); H01R
12/712 (20130101) |
Current International
Class: |
H01R
13/646 (20110101); H01R 13/50 (20060101); H01R
13/24 (20060101) |
Field of
Search: |
;439/345,541.5,540.1,607.11,607.32,607.4,607.35,620.06 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Patel; Harshad C
Attorney, Agent or Firm: Wayne & Ken, LLC Hom; Tony
Claims
What is claimed is:
1. A high-low frequency mixed connector, includes an insulator and
high frequency pins and low frequency pins set on the insulator,
said low frequency pins includes large current pins and small
current pins; wherein, said high frequency pins are installed on
said insulator by means of shrapnel or hot bar welding, said low
frequency pins are installed on said insulator by means of
crimping, and said high frequency pins and said low frequency pins
are arranged in different directions.
2. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim wherein also includes a metal shell, said mental
shell covers said insulator; said insulator is provided with a
first terminal group, a second terminal group and a third terminal
group; pins of said first terminal group, pins of said second
terminal group and pins of said third terminal group lead out said
mental shell from both sides and back of said metal shell; among
said pins, at least one group contains both said high frequency
pins and said low frequency pins, and which are set perpendicular
to each other.
3. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said first terminal group, said
second terminal group and said third terminal group are SMT type
terminals, DIP type terminals, or DIP and SMT type terminals.
4. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said first terminal group, said
second terminal group and said third terminal group are SMT type
terminals.
5. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said first terminal group, said
second terminal group and said third terminal group are DIP type
terminals.
6. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said first terminal group and said
second terminal group are SMT type terminals, which are lead out
both sides of the metal shell from the insulator, said third
terminal group are DIP type terminals, which is lead out back of
said metal shell from said insulator.
7. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said first terminal group and said
second terminal group are DIP type terminals, which are lead out
both sides of said metal shell from said insulator, said third
terminal group are SMT type terminals, which is lead out back of
said metal shell from said insulator.
8. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein said pins are installed on the PCB
board in the manner of SMT, DIP or DIP and SMT.
9. A high-low frequency.quadrature. mixed .quadrature. connector
according to claim 2, wherein a riveting face of said metal shell
is upwards, said riveting face rivets said shielding shell.
10. A high-low frequency.quadrature. mixed.quadrature. connector
according to claim 2, wherein includes a number of terminal groups
arranged on both sides of said insulator; said terminal groups
contains said high frequency pins and said low frequency pins, and
which are set perpendicular to each other.
Description
FIELD OF THE INVENTION
The invention relates to the technology field of decanters, more
particularly relates to a decanter assembly.
BACKGROUND OF THE INVENTION
With the development of the electronic industry, all kinds of
electronic products are constantly innovated. Especially personal
computers, tablet PCs and smart phones, etc. are widely used in the
life of the general public at a very high speed because of their
convenience and powerful.
In recent years, with the popularity of the Universal Serial Bus
(USB) connectors, almost all kinds of electronic devices are
equipped with USB connectors. With USB connectors, User of
electronic devices can easily transfer data. At present, the most
widely used USB connectors are USB2.0 specification that can
supports high speed transmission (Hi-Speed, 480 Mbps) and USB3.0
specification that can supports super high speed transmission
(Super-Spee, 5 Gpbs). However, with the improvement of the digital
data quality (for example undistorted audio signal and high
resolution image signal), the capacity of digital archives is
surged, traditional USB2.0 connectors and USB3.0 connectors offer
the speed of transmission that has gradually been unable to meet
the needs of existing users. As for this, USB3.1 specification are
introduced on the market, among which, the Type-C connectors are
the most impressive. Concretely, USB Type-C connector not only
overcomes the problem that traditional USB connector can not
simultaneously plug in and anti-plug in with the structure of 24
terminals on top and bottom, but also provides data transmission
speed up to 10 Gbps.
At present, among of the commonly used USB Type-C connectors in the
market, most of the low frequency and the high frequency are used
alone. Sometimes, to improve the efficiency of data transmission,
it is necessary to assemble high frequency pin and low frequency
pin on the shell of the same connector. CN201220648930.4 discloses
high-low frequency mixed connector and its assembly, the front end
of the high-low frequency mixed connector is inserted end,
including metal connector housings, high frequency accessories and
low-frequency accessories fixed on the rear side of the connector
housing. The High frequency accessories include high frequency
housings, the low frequency accessories include low frequency
housings, both of the high frequency housings and the low frequency
housings are metal housing. The font ends of the high frequency
housings and the low high frequency housings are separately fixed
on the connector housings by flange, and at least one of the front
end faces of the high frequency housings and the low frequency
housings has an annular shielding groove around its inner hole, a
shielding ring corresponding to the shielding groove is arranged on
the connector housings, and the shielding ring protrudes from the
connector housing to the shielding groove corresponding to it. The
utility model has the advantages that the high-low frequencies
mixed connectors resolves the high and low frequency signals from
interfering with each other at the condition that the high-low
accessories can be replaced. However, in the patent, the high
frequency and the low frequency are arranged side by side in
parallel, causing that the user can not distinguish between high
and low frequency, and it is not convenient to use.
Therefore, it is necessary to develop a mixed connector, which
enables the user to distinguish between high and low frequency,
thus the users can use high-low frequency mixed connector with low
cost and high efficiency.
SUMMARY OF THE INVENTION
To overcome the above shortcomings, the present invention provides
a kind of high-low frequency mixed connector, the high frequency
and low frequency are installed in the different way, so that users
can distinguish between the high frequency and the low frequency.
It is easy to use and it has simple structure.
The technical proposal in the present invention are as followings:
a kind of high-low frequency mixed connector, includes an insulator
and high frequency pins and low frequency pins set on the
insulator, the low frequency pins includes large current pins and
small current pins; the high frequency pins are installed on the
insulator by means of shrapnel or hot bar welding, the low
frequency pins are installed on the insulator by means of crimping,
and the high frequency pins and the low frequency pins are arranged
in different directions.
The kind of high-low frequency mixed connector also includes metal
shell, the metal shell covers the insulator, the insulator is
provided with a first terminal group, a second terminal group and a
third terminal group; pins of the first terminal group, pins of the
second terminal group and pins of the third terminal group lead out
from both sides and back of the metal shell; among the terminal
groups, at least one group contains both the high frequency pins
and the low frequency pins, and which are set perpendicular to each
other.
The first terminal group, the second terminal group and the third
terminal group are SMT type terminals, DIP type terminals, or DIP
and SMT type terminals.
All of the first terminal group, the second terminal group and the
third terminal group are SMT type terminals.
All of the first terminal group, the second terminal group and the
third terminal group are DIP type terminals.
The first terminal group and the second terminal group are SMT type
terminals, which are lead out both sides of the metal shell from
the insulator, the third terminal group are DIP type terminals,
which is lead out back of the metal shell from the insulator.
The first terminal group and the second terminal group are DIP type
terminals, which are lead out both sides of the metal shell from
the insulator, the third terminal group are SMT type terminals,
which is lead out back of the metal shell from the insulator.
The pins are installed on the PCB board in the manner of SMT, DIP
or DIP and SMT.
The riveting face of the metal shell is upwards, the riveting face
rivets a shielding shell; the metal shell is provided with an iron
tray, the iron tray is provided with an insulator, the first
terminal group and the second terminal group leads out from both
sides or back of the insulator, the third terminal group leads out
from back or both sides of the insulator.
The kind of high-low frequency mixed connector includes a number of
terminal groups arranged on both sides of the insulator; the
terminal groups contains the high frequency pins and the low
frequency pins, and which are set perpendicular to each other.
The advantages of the invention are as follows: The high-low
frequency mixed connector, the high frequency pins are installed on
the insulator by means of shrapnel or hot bar welding, the low
frequency pins are installed on the insulator by means of crimping,
and the high frequency pins and the low frequency pins are arranged
in different directions, thus, it is convenient for users to
distinguish the high frequency pin and the low frequency pin, and
it is easy to use.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows the schematic structure of the high-low frequency
mixed connector in present invention.
FIG. 2 shows the other schematic structure of the high-low
frequency mixed connector in present invention.
FIG. 3 shows the third schematic structure of the high-low
frequency mixed connector in present invention.
FIG. 4 shows the fourth schematic structure of the high-low
frequency mixed connector in present invention.
EMBODIMENTS
In order to make the purpose of the invention, the technical scheme
and technical effect are more clear, the followings will further
descript the present invention with the embodiments. It should be
understand that the embodiments described herein are only used to
interpret the present invention and are not intended to limit the
invention.
Refer to FIG. 1 and FIG. 4, a kind of high-low frequency mixed
connector, includes an insulator 2 (2'), and the low frequency pins
6 (6') and the high frequency pins 7 (7') set on the insulator 2
(2'), the low frequency pins 6(6') includes large current pins and
small current pins. The high frequency pins 7 (7') are installed on
the insulator 2 (2') by means of shrapnel or hot bar welding, the
low frequency pins are installed on the insulator 2 (2') by means
of crimping, and the high frequency pins 7 (7') and the low
frequency pins 6 (6') are arranged in different directions.
Refer to FIG. 1, FIG. 2, FIG. 3, the USB Type-C connector is used
as an example to explain the high-low frequency mixed connector in
the invention. The USB Type-C connector includes a metal shell 1,
an insulator 2 and the first terminal group 3, the second terminal
group 4 and the third terminal group 5 that are set on the
insulator 2, the metal shell 1 covers the insulator 2. The pins of
the first terminal group 3, the pins of the second terminal group 4
and the pins of the third terminal group 5 lead out the metal shell
1 from both sides and back of the metal shell, therefor it is
convenience to wiring.
Among the pins of the first terminal group 3, the pins of the
second terminal group 4 and the pins of the third terminal group 5,
at least one of them contains both the low frequency pins 6 and the
high frequency pins 7, and which are set perpendicular to each
other.
In the present invention, the first terminal group 3, the second
terminal group 4 and the third terminal group 5 are SMT type
terminals, DIP type terminals, or DIP and SMT type terminals.
In one of the embodiments in the invention, the first terminal
group 3, the second terminal group 4 and the third terminal group 5
are SMT type terminals.
In the other of the embodiments in the invention, the first
terminal group 3, the second terminal group 4 and the third
terminal group 5 are DIP type terminals.
In another of the embodiments in the invention, the first terminal
group 3 and the second terminal group 4 are SMT type terminals,
which are lead out both sides of the metal shell from the insulator
2; the third terminal group 5 are DIP type terminals, which are
lead out back of the metal shell from the insulator 2.
In another of the embodiments in the invention, the first terminal
group 3 and the second terminal group 4 are DIP type terminals,
which are lead out both sides of the metal shell from the insulator
2; the third terminal group 5 are DIP type terminals, which are
lead out back of the metal shell from the insulator 2.
The pin s are installed on the PCB board in the manner of SMT, DIP
or DIP and SMT.
In one of the embodiments in the invention, the pins of the high
frequency is welded on PCB board by means of DIP.
In the other of the embodiments in the invention, the pins of the
high frequency is welded on PCB board by means of SMT.
In another of the embodiments in the invention, the pins of the
high frequency is welded on PCB board by means of DIP and SMT.
Preferably, the riveting face 8 of the metal shell 1 is upwards,
the riveting face 8 rivets a shielding shell; the shielding shell
is used for sealing the electronic components on the circuit
board.
Preferably, the metal shell 1 is provided with an iron tray 9, the
iron tray 9 is provided with an insulator, The first terminal group
3 and the second terminal group 4 leads out from both sides or back
of the insulator, the third terminal group 5 leads out from back or
both sides of the insulator. The first terminal group 3 and the
second terminal group 4 is welded on PCB, the third terminal group
5 is welded on PCB.
Preferably, referring to FIG. 4, the kind of high-low frequency
mixed connector can be backplane connector, includes an insulator
2' and a number of terminal groups arranged on both sides of the
insulator 2'; the terminal groups contains the high frequency pins
7' and the low frequency pins, 6' and which are set perpendicular
to each other.
The above content is further elaborated the invention combined with
the preferred embodiment of the invention, which can not be
identified that the embodiments of the invention are only confined
to these instructions. For general technical personnel belonging to
the technical field of the invention, without departing from the
inventive concept, the architecture can be flexible and be derived
a series of products. If it just makes some simple deduction or
replacement, it should be regarded as belonging to protection scope
that is determined by the submitted claims in the invention.
* * * * *