U.S. patent number 10,179,444 [Application Number 14/228,621] was granted by the patent office on 2019-01-15 for machine for optical bonding, system and method of use thereof.
This patent grant is currently assigned to PRECISION VALVE & AUTOMATION, INC.. The grantee listed for this patent is Precision Valve & Automation, Inc.. Invention is credited to William Edward Berkheiser, Andrew John Nally, Jonathan Neal Urquhart, Jeffrey James VanNorden.
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United States Patent |
10,179,444 |
Nally , et al. |
January 15, 2019 |
**Please see images for:
( Certificate of Correction ) ** |
Machine for optical bonding, system and method of use thereof
Abstract
An adhesive application valve comprising an applicator, a Z-axis
actuator operably connected to the applicator, wherein the Z-axis
actuator and the rotation device are each capable of moving
independently of each other to position the applicator in a
position to apply an amount of adhesive to a top substrate prior to
bonding with a bottom substrate is provided. Furthermore, a machine
comprising an end effector, and an adhesive application valve
configured to apply an amount of adhesive onto the top substrate,
the end effector configured to place the top substrate into a
position of engagement with the adhesive application valve, and
place the top substrate onto the bottom substrate to facilitate
initial contact between the adhesive applied to the top substrate
and a fill material applied to the bottom substrate is also
provided. A method of optical bonding is further provided.
Inventors: |
Nally; Andrew John (Greenfield,
NY), Urquhart; Jonathan Neal (Saratoga Springs, NY),
VanNorden; Jeffrey James (Clifton Park, NY), Berkheiser;
William Edward (Albany, NY) |
Applicant: |
Name |
City |
State |
Country |
Type |
Precision Valve & Automation, Inc. |
Cohoes |
NY |
US |
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Assignee: |
PRECISION VALVE & AUTOMATION,
INC. (Cohoes, NY)
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Family
ID: |
46827507 |
Appl.
No.: |
14/228,621 |
Filed: |
March 28, 2014 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20140305574 A1 |
Oct 16, 2014 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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13487448 |
Jun 4, 2012 |
9884475 |
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13009385 |
Jan 19, 2011 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B32B
17/10807 (20130101); B32B 37/12 (20130101); B32B
38/18 (20130101); B32B 37/14 (20130101); B05C
5/0279 (20130101); B32B 2551/00 (20130101); Y10T
156/10 (20150115); Y10T 156/17 (20150115) |
Current International
Class: |
B32B
37/14 (20060101); B32B 38/18 (20060101); B29C
65/52 (20060101); B32B 17/10 (20060101); B32B
37/12 (20060101); B05C 5/02 (20060101) |
Field of
Search: |
;156/99 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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2002126965 |
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May 2002 |
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JP |
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2004314004 |
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Nov 2004 |
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JP |
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2008126893 |
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Oct 2008 |
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WO |
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Other References
Office Action (dated Nov. 19, 2015) for U.S. Appl. No. 13/487,448,
filed Jun. 4, 2012. cited by applicant .
Final Office Action (dated Dec. 22, 2015) for U.S. Appl. No.
13/845,978, filed Mar. 18, 2013. cited by applicant .
Final Office Action (dated Jun. 1, 2016) for U.S. Appl. No.
13/487,448, filed Jun. 4, 2012. cited by applicant .
Office Action (dated Sep. 5, 2014) for U.S. Appl. No. 13/487,448,
filed Jun. 4, 2012. cited by applicant .
Office Action (dated Jul. 19, 2012) for U.S. Appl. No. 13/009,385,
filed Jan. 29, 2011. cited by applicant .
Office Action (dated Jan. 16, 2013) for U.S. Appl. No. 13/009,385,
filed Jan. 29, 2011. cited by applicant .
Office Action (dated Feb. 3, 2014) for U.S. Appl. No. 13/487,448,
filed Jun. 4, 2012. cited by applicant .
Advisory Action (dated Nov. 19, 2014) for U.S. Appl. No.
13/487,448, filed Jun. 4, 2012. cited by applicant .
Office Action (dated Apr. 10, 2015) for U.S. Appl. No. 13/845,978,
filed Mar. 18, 2013. cited by applicant.
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Primary Examiner: Orlando; Michael N
Assistant Examiner: Bradford; Elizabeth
Attorney, Agent or Firm: Schmeiser, Olsen & Watts,
LLP
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional application of U.S. application
Ser. No. 13/487,448, filed Jun. 4, 2012, entitled "Machine for
Optical Bonding, System and Method of Use Thereof," which is a
continuation-in-part of U.S. application Ser. No. 13/009,385, filed
on Jan. 19, 2011, entitled, "Robotic Placement Machine for Optical
Bonding, System, and Method of Use Thereof."
Claims
What is claimed is:
1. A method of optical bonding comprising: dispensing a fill
material across a surface of a first substrate; applying an amount
of adhesive on a surface of a second substrate with an upwardly
vertically oriented adhesive application valve; and contacting the
adhesive on the second substrate with the fill material on the
first substrate to prior to a contact between the second substrate
and the fill material, to optically bond the first substrate and
the second substrate.
2. The method of claim 1, wherein the first substrate and the
second substrate are transparent substrates.
3. The method of claim 1, wherein the adhesive of the second
substrate contacts the fill material of the first substrate prior
to contact between the first substrate and the second
substrate.
4. The method of claim 1, wherein the step of applying an amount of
adhesive includes applying a bead of adhesive by an adhesive
application valve.
5. The method of claim 1, wherein dispensing the fill material on
the surface of the first substrate achieves a largest fill height
proximate a center portion of the first substrate.
6. The method of claim 1, wherein the step of contacting includes
controllably lowering, by an end effector, the second substrate
onto the first substrate to facilitate an initial engagement of the
adhesive and the fill material to prevent and eliminate air bubbles
between the first and second substrates.
7. The method of claim 6, wherein controllably lowering the second
substrate onto the first substrate forces the fill material to
create a capillary effect as it the fill material flows between the
first substrate and the second substrate.
8. The method of claim 1, wherein the fill material is an optically
clear adhesive.
9. The method of claim 1, further including: dispensing a dam
material around a perimeter of the first substrate to form a dam;
tracing the dam material with a UV wand to stabilize the dam
material; treating the surface of the first substrate with a
treatment head prior to dispensing fill material onto the surface
of the first substrate; locating and aligning the second substrate
for placement onto the first substrate; locating tat least one of a
rear edge, a front edge, and the middle portion of the first
substrate with a height sensor; and placing the bonded substrates
into a cure oven.
10. A method comprising: reducing an amount of air pockets formed
between a first substrate and a second substrate when the first
substrate and the second substrate are optically bonded to each
other by applying an adhesive to the second substrate prior to
optically bonding the first substrate and the second substrate,
with an upwardly vertically oriented adhesive application valve;
wherein the adhesive on the second substrate directly contacts a
fill material on the first substrate before any contact between the
second substrate and the fill material.
11. The method of claim 10, wherein the first substrate and the
second substrate are transparent substrates.
12. The method of claim 10, wherein the second substrate is moved
near an adhesive application valve to apply the adhesive.
13. The method of claim 10, wherein the fill material is an
optically clear adhesive.
14. The method of claim 10, wherein the second substrate is
controllably lowered onto the first substrate to force the
dispensed fill material to create a capillary effect as it flows
across a surface of the first substrate.
15. A method of optical bonding comprising: providing a machine
that dispenses a fill material across a surface of a first
substrate, applies an amount of adhesive on a surface of a second
substrate with an upwardly vertically oriented adhesive application
valve, and facilitates contact between the adhesive on the second
substrate and the fill material on the first substrate before any
contact between the second substrate and the fill material that
would optically bond the first substrate and the second substrate
without or with a reduced amount of air pockets therebetween.
16. The method of claim 15, wherein the first substrate and the
second substrate are transparent substrates.
17. The method of claim 15, wherein the machine includes an
adhesive application valve.
18. The method of claim 17, wherein the machine is a gantry
robot.
19. The method of claim 15, wherein the fill material is an
optically clear adhesive.
20. The method of claim 15, wherein the machine, prior to the
bonding of the first substrate and the second substrate, dispenses
a dam material around a perimeter of the first substrate to form a
dam, traces the dam material with a UV wand to stabilize the dam
material, treats the surface of the first substrate with a
treatment head prior to dispensing fill material onto the surface
of the first substrate, locates and aligns the second substrate for
placement onto the first substrate, locates a rear edge of the
first substrate with a height sensor, and places the bonded
substrates into a cure oven.
Description
FIELD OF TECHNOLOGY
The following relates to optical bonding of substrates and more
specifically to embodiments of a machine, system, and method of
automated optical bonding of substrates.
BACKGROUND
Optical bonding of a transparent substrate, such as a sheet of
glass, to another transparent substrate, or to a video screen such
as an electronic display, may improve the ruggedness and enhance
the optical clarity in ambient light. Bonding transparent
substrates to each other presents many difficulties, including
maintaining the structural integrity of the bonded substrates and
manipulating the fill material used to bond the substrates.
Specifically, air pockets may form in the fill material between the
two substrates during the placement and bonding process. One cause
of air pockets is attributed to the placement of a glass sheet onto
another sheet of glass. Another cause is the inability to
manipulate and work with the fill materials used in the optical
bonding processes. The presence of air pockets between the bonded
substrates results in cracks at locations where air pockets are
present.
Accordingly, a need exists for an optical bonding machine, system,
and method that address the difficulties in the art.
SUMMARY
A first general aspect relates to a robotic placement machine
configured to attach to a Y-axis actuator for moving left and right
along an Y-axis and a X-axis actuator for moving back and forth
along an X-axis, the robotic placement machine comprising a base
operably connectable to at least one of the Y-axis actuator and the
X-axis actuator, the base having a first end and a second end, a
first Z axis actuator coupled to the first end of the base, the
first Z axis actuator capable of moving up and down a first Z axis,
a second Z axis actuator coupled to the second end of the base, the
second Z axis actuator capable of moving up and down a second Z
axis, and a pick and place plate operably connected to the first Z
axis actuator and the second Z axis actuator, wherein the first Z
axis actuator and the second Z axis actuator are each capable of
moving independently of each other to tilt the pick and place
plate.
A second general aspect relates to system comprising a first
machine, wherein the first machine includes a valve coupled to a
first end effector, the valve applying a material around a
perimeter of a first substrate to form a dam, a second machine,
wherein the second machine includes a custom head coupled to a
second end effector, the custom head dispensing a fill material
across a surface of the first substrate, wherein the dispensed fill
material has a variable fill height, and a third machine, wherein
the third machine includes a third end effector, the third end
effector configured to pick a second substrate and controllably
lower the second substrate onto the first substrate, wherein each
of the first machine, second machine, and third machine are
operably connected.
A third general aspect relates to an optical bonding method
comprising dispensing dam material around a perimeter of the first
substrate to form a dam, dispensing a fill material across a
surface of the first substrate to achieve a largest fill height
proximate a rear edge of the first substrate and a lowest fill
height proximate a front edge of the first substrate, placing a
second substrate into contact with the fill material proximate the
rear edge of the first substrate at an angle relative to the first
substrate, and controllably lowering the second substrate onto the
first substrate until the second substrate is bonded to the first
substrate to prevent and eliminate air bubbles between the first
and second substrates.
A fourth general aspect relates to an optical bonding method
comprising dispensing dam material around a perimeter of the first
substrate to form a dam, dispensing a fill material across a
surface of the first substrate to achieve a largest fill height
proximate a middle portion of the first substrate, placing a second
substrate into contact with the fill material proximate the middle
portion of the first substrate, and controllably lowering the
second substrate onto the first substrate substantially parallel to
the first substrate until the second substrate is bonded to the
first substrate to prevent and eliminate air bubbles between the
first and second substrates.
A fifth general aspect relates to an adhesive application valve
comprising an applicator, a Z-axis actuator operably connected to
the applicator, and a rotation device operably connected to the
applicator, wherein the Z-axis actuator and the rotation device are
each capable of moving independently of each other to position the
applicator in a position to apply an amount of adhesive to a top
substrate prior to bonding with a bottom substrate.
A sixth general aspect relates to a machine for optical bonding
comprising an end effector, the end effector configured to pick up
a top substrate and controllably lower the top substrate into a
bonding engagement with a bottom substrate, and an adhesive
application valve proximate the machine, the adhesive application
valve configured to apply an amount of adhesive onto the top
substrate, wherein the end effector is configured to place the top
substrate into a position of engagement with the adhesive
application valve, and then place the top substrate onto the bottom
substrate to facilitate initial contact between the adhesive
applied to the top substrate and a fill material applied to the
bottom substrate.
A seventh general aspect relates to a method of optical bonding
comprising dispensing a fill material across a surface of a first
substrate to achieve a largest fill height proximate a center
portion of the first substrate and a lowest fill height proximate
one or more corners of the first substrate, placing a second
substrate into contact with the fill material proximate center
portion of the first substrate, and controllably lowering the
second substrate onto the first substrate until the second
substrate is bonded to the first substrate to prevent and eliminate
air bubbles between the first substrate and second substrates.
An eighth general aspect relates to a method of optical bonding
comprising dispensing a fill material across a surface of the first
substrate, applying an amount of adhesive on a surface of a second
substrate configured to engage the fill material on the surface of
the first substrate, and contacting the adhesive on the second
substrate with the fill material on the first substrate to
optically bond the first substrate and the second substrate.
The foregoing and other features of construction and operation will
be more readily understood and fully appreciated from the following
detailed disclosure, taken in conjunction with accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Some of the embodiments will be described in detail, with reference
to the following figures, wherein like designations denote like
members, wherein:
FIG. 1 depicts a front view of an embodiment of a system having an
embodiment of a first system, second system, and a third
system;
FIG. 2A depicts a top view of an embodiment of a first
substrate;
FIG. 2B depicts a perspective view of an embodiment of the first
substrate;
FIG. 3A depicts a top view of an embodiment of a second
substrate;
FIG. 3B depicts a perspective view of the second substrate;
FIG. 4 depicts a front view of an embodiment of the first
machine;
FIG. 5 depicts a perspective view of an embodiment of a first end
effector;
FIG. 6A depicts a front view of an embodiment of the first end
effector;
FIG. 6B depicts a top view of an embodiment of the first end
effector;
FIG. 6C depicts a side view of an embodiment of the first end
effector;
FIG. 7 depicts a top view of an embodiment of a first substrate
having a dam;
FIG. 8 depicts a front view of an embodiment of a second
machine;
FIG. 9 depicts a perspective view of an embodiment of a second end
effector;
FIG. 10A depicts a top view of an embodiment of the second end
effector;
FIG. 10B depicts a front view of an embodiment of the second end
effector;
FIG. 10C depicts a side view of an embodiment of the second end
effector;
FIG. 11 depicts a top view of an embodiment of the first substrate
having some fill material dispensed within the dam;
FIG. 12 depicts a top view of an embodiment of the first substrate
after fill material has been dispensed across its surface;
FIG. 13A depicts a cross-section view of a first embodiment of the
first substrate after fill material has been dispensed across its
surface;
FIG. 13B depicts a cross-section view of a second embodiment of the
first substrate after fill material has been dispensed across its
surface;
FIG. 14 depicts a front view of an embodiment of a third
machine;
FIG. 15 depicts a perspective view of an embodiment of a third end
effector;
FIG. 16A depicts a top view of an embodiment of the third end
effector a distance above an underside assembly;
FIG. 16B depicts a perspective view of an embodiment of the third
end effector a distance above an underside assembly;
FIG. 16C depicts a front view of an embodiment of the third end
effector a distance above an underside assembly;
FIG. 16D depicts a side view of an embodiment of the third end
effector a distance above an underside assembly;
FIG. 17A depicts a top view of an embodiment of the third end
effector at initial contact with the first substrate;
FIG. 17B depicts a perspective view of an embodiment of the third
end effector at initial contact with the first substrate;
FIG. 17C depicts a front view of an embodiment of the third end
effector at initial contact with the first substrate;
FIG. 17D depicts a side view of an embodiment of the third end
effector at initial contact with the first substrate;
FIG. 18A depicts a top view of an embodiment of the third end
effector lowering at an angle onto the first substrate;
FIG. 18B depicts a perspective view of an embodiment of the third
end effector lowering at an angle onto the first substrate;
FIG. 18C depicts a front view of an embodiment of the third end
effector lowering at an angle onto the first substrate;
FIG. 18D depicts a side view of an embodiment of the third end
effector lowering at an angle onto the first substrate;
FIG. 19A depicts a top view of an embodiment of the third end
effector as the first substrate and the second substrate are
bonded;
FIG. 19B depicts a perspective view of an embodiment of the third
end effector as the first substrate and the second substrate are
bonded;
FIG. 19C depicts a front view of an embodiment of the third end
effector as the first substrate and the second substrate are
bonded;
FIG. 19D depicts a side view of an embodiment of the third end
effector as the first substrate and the second substrate are
bonded;
FIG. 20A depicts a top view of a first embodiment of a second
substrate lowering onto the first substrate causing a capillary
effect on the fill material;
FIG. 20B depicts a top view of a second embodiment of a second
substrate lowering onto the first substrate causing a capillary
effect on the fill material;
FIG. 21 depicts a perspective view of an embodiment of a robotic
placement machine;
FIG. 22 depicts a perspective view of an embodiment of the robotic
placement machine, wherein the pick and place plate is in a
horizontal position;
FIG. 23 depicts a perspective view of an embodiment of the robotic
placement machine, wherein the pick and place plate is in a tilted
position;
FIG. 24 depicts a front view of an embodiment of a system having an
embodiment of more than one machine;
FIG. 25 depicts a perspective view embodiment of a machine having
an embodiment of an end effector and an embodiment of an adhesive
application valve;
FIG. 26A depicts a perspective view of an embodiment of an end
effector;
FIG. 26B depicts a perspective view of an embodiment of the end
effector, an embodiment of the adhesive application valve, and an
embodiment of the adhesive collecting device in the machine with
the frame and other components removed for convenience;
FIG. 27A depicts a top view of an embodiment of the end effector a
distance above an underside assembly;
FIG. 27B depicts a perspective view of an embodiment of the end
effector a distance above an underside assembly;
FIG. 27C depicts a front view of an embodiment of the end effector
a distance above an underside assembly;
FIG. 27D depicts a side view of an embodiment of the end effector a
distance above an underside assembly;
FIG. 28A depicts a perspective view of an embodiments of the end
effector proximate an adhesive application valve;
FIG. 28B depicts a front view of an embodiment of the adhesive
application valve applying a bead of adhesive to an embodiment of
the second substrate;
FIG. 28C depicts a front view of an embodiment of the end effector
proximate an embodiment of the adhesive application valve;
FIG. 29A depicts a perspective view of an embodiment of an adhesive
application valve, wherein an embodiment of the a Z-axis actuator
is actuated;
FIG. 29B depicts a side view of an embodiment of an adhesive
application valve and an embodiment of an adhesive collecting
device;
FIG. 30A depicts a top view of an embodiment of the end effector as
the first substrate and the second substrate are bonded;
FIG. 30B depicts a perspective view of an embodiment of the end
effector as the first substrate and the second substrate are
bonded;
FIG. 30C depicts a front view of an embodiment of the end effector
as the first substrate and the second substrate are bonded;
FIG. 30D depicts a side view of an embodiment of the end effector
as the first substrate and the second substrate are bonded;
FIG. 31 depicts a side view of an embodiment of a top substrate
having an amount of adhesive applied thereto, and an embodiment of
a bottom substrate having fill material dispensed on it according
to a fill pattern;
FIG. 32 depicts a side view of an embodiment of the adhesive
applied to an embodiment of the top substrate contacting the fill
material dispensed on an embodiment of the second substrate;
FIG. 33 depicts a top view of another embodiment of the first
substrate after fill material has been dispensed across its surface
according to an embodiment of a fill pattern;
FIG. 34 depicts a cross-section view of another embodiment of the
first substrate after fill material has been dispensed across its
surface; and
FIG. 35 depicts a top view of an embodiment of a capillary effect
of the fill material between the first substrate and the second
substrate when during bonding.
DETAILED DESCRIPTION
A detailed description of the hereinafter described embodiments of
the disclosed apparatus and method are presented herein by way of
exemplification and not limitation with reference to the Figures.
Although certain embodiments are shown and described in detail, it
should be understood that various changes and modifications may be
made without departing from the scope of the appended claims. The
scope of the present disclosure will in no way be limited to the
number of constituting components, the materials thereof, the
shapes thereof, the relative arrangement thereof, etc., and are
disclosed simply as an example of embodiments of the present
disclosure.
As a preface to the detailed description, it should be noted that,
as used in this specification and the appended claims, the singular
forms "a", "an" and "the" include plural referents, unless the
context clearly dictates otherwise.
Referring to the drawings, FIG. 1 depicts an embodiment of system
100. System 100 may be an optical bonding system, liquid bonding
system, liquid optical bonding system, glass lamination system, a
system for bonding two transparent substrates together, and the
like. System 100 may include a first machine 30, a second machine
50, a third machine 70, and a conveyor system 90 connecting the
first machine 30, the second machine 50, and the third machine 70.
Each machine 30, 50, 70 may perform one or more tasks to accomplish
the bonding of two substrates. However, embodiments of system 100
may include less than three machines and may include more than
three machines depending on the number of tasks to be performed by
each machine. System 100 also includes a first substrate 10 and a
second substrate 20, wherein the second substrate 20 is bonded to
the first substrate 10. The first substrate 10 has a front edge 11
(first end), a middle portion 13, and a rear edge 12 (second end),
as shown in FIGS. 2A and 2B. The second substrate 20 has a front
edge 21 (first end), a middle portion 23, and a rear edge 22
(second end), as shown in FIGS. 3A and 3B. The first and second
substrates 10, 20 may be transparent substrates. Embodiments of the
first and second substrates 10, 20 may be sheets of glass of
varying size (e.g. small and large), plastic, and the like. Further
embodiments of the second substrate 20 may be a protective,
transparent sheet of glass to be placed onto the first substrate
10, for example, the first substrate 10 may be a glass display of
an electronic device, such as a cell phone screen/cover or flat
screen television screen. The first and second substrates 10, 20
may also be opaque or other than transparent, or one of the first
and second substrates 10, 20 may be transparent while the other is
opaque or other than transparent. The first and second substrates
10, 20 are bonded together with a fill material 5. Fill material 5
may be an optically clear adhesive, such as DuPont.RTM. Vertak
family of adhesives, or any clear adhesive that may quickly cure
under UV and efficiently adhere to glass and similar surfaces.
Referring now to FIG. 4, embodiments of a first machine 30 of
system 100 may include a frame 40, an X-axis actuator, a Y-axis
actuator, a Z-axis actuator, and a first end effector 38. The first
machine 30 may utilize a robotic platform to perform automated
tasks with accuracy, precision, and repeatability. For example, the
first machine 30 may be a Gantry robot having three principal axes
(Cartesian coordinates) controlling linear motion, wherein the
horizontal member(s) may be supported at both ends. The first
machine 30 may also be any robotic manipulator such as a selective
compliant assembly robot arm (SCARA) system, linear robot,
multi-axis robot arm system, and the like. However, an embodiment
of the first machine 30 will now be described as utilizing a Gantry
robot for exemplary purposes. The first end effector 38 may refer
to any device(s) attached to a X, Y, Z or other axis of movement to
perform a variety of tasks, such as dispensing, picking and
placing, routing, and the like. For instance, the first end
effector 38 is capable of rotation about the Z axis, and may move
left and right along the Y axis by sliding along the Y axis
actuator, and move back and forth along the X axis by sliding with
the Y axis actuator as it slides along the X axis actuator.
Embodiments of the first end effector 38 may be comprised of a
metal, such as stainless steel, or a combination of metal and
composite materials, plastics, etc. Additionally, the first end
effector 38 may move up and down on the Z-axis by sliding along the
Z-axis actuator. The X-axis actuator, the Y-axis actuator, and the
Z-axis actuator may be a ball screw slide, linear motion slide, a
linear actuator, and the like. Moreover, the frame 40 may provide a
structure surrounding the components of the first machine 30. The
frame 40 may allow for panels to be attached providing an enclosure
for the first machine 30. The panels attached to the frame 40 may
be a combination of both solid panels and see-through panels, such
as Plexiglas.RTM., glass, plastic, and the like, to allow viewing
of the operation of the first machine 30.
FIGS. 4-6C depict an embodiment of a first machine 30 including at
least one vacuum plate 31 coupled to an underside 32, a first end
effector 38, a height sensor 34 coupled to the first end effector,
at least one valve 33 coupled to the first end effector 38, a UV
wand 45 coupled to the first end effector 38, a light source
proximate the first end effector 38, a vision system 39, and a
conveyor system 90 for moving the first substrate 10 to and from
the first machine 30. As the first substrate 10 enters the first
machine 30 on conveyor system 90, a vacuum plate coupled to an
underside, or support substrate, may be raised up to the first
substrate 10. Alternatively, the first substrate 10 may be lowered
to the vacuum plate coupled to the underside. Other methods known
to those skilled in the art may be used to place the first
substrate 10 into physical contact with the vacuum plate of the
first machine 30. When the first substrate 10 is positioned above
the vacuum plate, the vacuum plate may secure the first substrate
10 in a flat position and prevent translational movement, sliding,
shifting, etc., of the first substrate 10. The underside of the
first machine 30 may include one or more vacuum plates, depending
on the size of the first substrate 10. Once the first substrate 10
is held in place by the vacuum plate, a height sensor 34 coupled to
the first end effector 38 may engage the first substrate 10 to
probe the surface of the first substrate 10, such as a target fill
area and the perimeter of the first substrate 10. The height sensor
34 may probe the surface height of the first substrate 10 to detect
warpage or other deformities in the surface of the first substrate
10. In one embodiment, the height sensor 34 may be a contact/touch
probe relying on physical interaction between a probe arm and the
surface of the first substrate 10. In another embodiment, the
height sensor 34 may be a laser probe which avoids physically
contacting the surface of the first substrate 10.
The height sensor 34 may be connected to a mounting plate 44a,
wherein the mounting plate 44a is connected to an independent Z
actuator 49a, such as a ball screw slide, to allow for movement up
and down along a Z axis. The independent Z actuator 49a may be
connected to the general structure of the first end effector 38.
Thus, the height sensor 34 may be able to move up and down
independent of the first end effector 38 through actuation of the
independent Z actuator 49a associated with the height sensor 34. A
mounting plate, such as mounting plates 44a, 44b, may be any
component(s), rigid or otherwise, that may be used to connect,
secure, attach, etc., a component of the first machine 30 to the
first end effector 38. Likewise, embodiments of a first machine 30
may include at least one valve 33 coupled to the first end effector
38. The first valve 33 (and/or valve assembly) may be connected
directly or indirectly to a mounting plate 44b, wherein the
mounting plate 44b is connected to an independent Z actuator 49b,
such as a ball screw slide, to allow for movement up and down along
a Z axis. The independent Z actuator 49b may be connected to the
general structure of the first end effector 38. Thus, the valve 33
may be able to move up and down independent of the first end
effector 38 through actuation of the independent Z actuator 49b
associated with valve 33. Embodiments of the first valve 33 may be
comprised of a metal, such as stainless steel, or a combination of
metal and composite materials, plastics, etc.
Referring still to FIGS. 4-6C, at least one valve 33 may be coupled
to the first end effector 38 to create a dam 35 along a perimeter
of the first substrate 10. In other words, the dam 35 may be
applied along a perimeter of a predefined area where fill material
5 may be dispensed from a custom head 53 of the second machine 50,
as shown in FIG. 7. The dam 35 may extend to the edges of the first
substrate 10 or may be a distance from the edges of the first
substrate 10. The valve 33 may be a single dispensing valve.
Moreover, movement of the first end effector 38 along the perimeter
of the first substrate 10 while valve 33 is coupled to the first
end effector 38 allows valve 33 to dispense an amount of dam
material necessary to create a dam 35 according to the
required/desired properties and specifications. Dam 35 material may
include UV (ultraviolet) cure adhesive or material. The dam 35 may
act as a spacer between the first substrate 10 and the second
substrate 20 when the first and second substrates 10, 20 are bonded
together. Thus, the height, girth, curvature, etc. of the dam 35
may vary according to the space desired/required between the first
and the second substrates 10, 20 when bonded. Embodiments of dam 35
include a height ranging from 0.1 mm and 0.7 mm high, and a width
ranging from 0.2 mm to 0.5 mm. The dam 35 may be applied as a bead
along the perimeter of the first substrate 10 or may be applied
flat along the perimeter of the first substrate 10, depending on
the desired/required properties and specifications. Additionally,
the dam 35 may act as a retainer, barrier, wall, boundary, and the
like, for the fill material 5 dispensed on the surface of the first
substrate 10 in the second machine 50. The dam 35 may also include
vents 36 to allow air to escape during the placement of the second
substrate 20 onto the first substrate 10. In addition, excess fill
material 5 may also escape through vents 36 during some
applications. Vents 36 may be a gap, break in the dam 35, aperture,
slot, hole, opening, and the like. The number and placement of
vents 36 may vary according to required/desired specifications. In
one embodiment, vents 36 may be placed at the two corners and at
the middle of the dam 35 adjacent to the front edge 11 of the first
substrate 10. In another embodiment, a single vent 36 may be placed
at some point between the corners of the dam 35 adjacent to the
front edge 11. Other embodiments include a combination of vents 36
at the corners of the dam 35 and at points between the corners of
the dam 35. Vents 36 may also be located on the dam 35 adjacent to
the sides of the first substrate 10 to assist the escape of air and
excess fill material 5 if the flow of fill material 5 is irregular
during placement of the second substrate 20.
Embodiments of the first machine 30 may also include a light source
in communication with an ultraviolet (UV) wand 45 coupled to the
first end effector 38. The UV wand 45 may be connected, directly or
indirectly, to a mounting plate 44c, wherein the mounting plate 44c
is connected to an independent Z actuator 49c, such as a ball screw
slide, to allow for movement up and down along a Z axis. The
independent Z actuator 49c may be connected to the general
structure of the first end effector 38. Thus, the UV wand 45 may be
able to move up and down independent of the first end effector 38
through actuation of the independent Z actuator 49c associated with
UV wand 45. A mounting plate, such as mounting plates 44a, 44b, 44c
may be any component(s), rigid or otherwise, that may be used to
connect, secure, attach, etc., a component of system 100 to the
first end effector 38. The UV wand may emit ultraviolet light to
semi-cure, stabilize, seal, and/or freeze the dam 35 material after
application to the surface of the first substrate 10. The dam 35
material may slump or otherwise need to be stabilized after
application; therefore, movement of the first end effector 38 along
the perimeter of the first substrate 10 (i.e. along the dam 35)
while the UV wand 45 is coupled to the first end effector 38 allows
the UV wand to emit UV light to stabilize the dam 35 material. The
emitted/transmitted light from the UV wand 45 may come from a light
source, wherein the UV wand 45 is in communication with and/or
connected to the light source with a guide cable 47. Guide cable 47
may connect the UV wand 45 coupled to the first end effector 38 to
a light source that may be proximate the first end effector 38. The
light source may be a source of ultraviolet radiation. Embodiments
of first machine 30 include a light source suspended from the frame
40 or other structural component of the first machine 30 proximate
the first end effector 38. Other embodiments include a light source
external to the first machine 30, wherein the guide cable 47
connects the UV wand 45 to the external light source. Even further
embodiments include a light source coupled directly to the first
end effector 38. Those skilled in the art should appreciate that
the guide cable 47 may be a liquid filled cable, fiber optic cable,
or similar cables associated with UV wands and UV light
sources.
Further embodiments of the first machine 30 of system 100 may
include a vision system 39 coupled to the first end effector 38.
The vision system 39 may be a camera or other suitable vision
system capable of detecting the orientation, location, position,
etc. of parts, such as the first substrate 10, within the first
machine 30.
After one or more tasks associated with the first machine 30 are
completed, the vacuum plate may release the first substrate 10, and
then the first substrate 10 may be forwarded to the second machine
50 via conveyor system 90, such as a conveyor belt. Those skilled
in the art should appreciate that the first substrate 10 may be
manually loaded in and out of the first machine 30. Furthermore, it
should be understood that each task/component associated with the
first machine 30, including, inter alia, height sensor 34 detecting
surface height of first substrate 10, valve 33 dispensing dam
material to create a dam 35, UV wand 45 to stabilize the dam 35,
vision system 39 to monitor orientation of components, may be
performed in separate machines. For instance, the tasks/components
associated with the first machine 30 may be performed in two or
more machines, wherein the first substrate 10 is transferred to
each machine accordingly.
Referring now to FIG. 8, embodiments of a second machine 50 of
system 100 may include a frame 60, an X-axis actuator, a Y-axis
actuator, a Z-axis actuator, and a second end effector 58. The
second machine 50 may utilize a robotic platform to perform
automated tasks with accuracy, precision, and repeatability. For
example, the second machine 50 may be a Gantry robot having three
principal axes (Cartesian coordinates) controlling linear motion,
wherein the horizontal member(s) may be supported at both ends. The
second machine 50 may also be any robotic manipulator such as a
selective compliant assembly robot arm (SCARA) system, linear
robot, multi-axis robot arm system, and the like. However, an
embodiment of the second machine 50 will now be described as
utilizing a Gantry robot for exemplary purposes. The second end
effector 58 may refer to any device(s) attached to a X, Y, Z or
other axis of movement to perform a variety of tasks, such as
dispensing, picking and placing, routing, and the like. For
instance, the second end effector 58 is capable of rotation about
the Z axis, and may move left and right along the Y axis by sliding
along the Y axis actuator, and move back and forth along the X axis
by sliding with the Y axis actuator as it slides along the X axis
actuator. Embodiments of the second end effector 58 may be
comprised of a metal, such as stainless steel, or a combination of
metal and composite materials, plastics, etc. Additionally, the
second end effector 58 may move up and down on the Z-axis by
sliding along the Z-axis actuator. The X-axis actuator, the Y-axis
actuator, and the Z-axis actuator may be a ball screw slide, linear
motion slide, a linear actuator, and the like. Moreover, the frame
60 may provide a structure surrounding the components of the second
machine 50. The frame 60 may allow for panels to be attached
providing an enclosure for the second machine 50. The panels
attached to the frame 60 may be a combination of both solid panels
and see-through panels, such as Plexiglas.RTM., glass, plastic, and
the like, to allow viewing of the operation of the second machine
50.
Embodiments of the second machine 50 may include at least one
vacuum plate coupled to an underside, or support frame, a second
end effector 58, a treatment head 54 coupled to the second end
effector 58, a custom head 53 coupled to the second end effector
54, a vision system 59, and a conveyor system 90 for moving the
first substrate 10 to and from the second machine 50. As the first
substrate 10 enters the second machine 50 on conveyor system 90, a
vacuum plate coupled to an underside may be raised up to the first
substrate 10. Alternatively, the first substrate 10 may be lowered
to the vacuum plate coupled to the underside. Other methods known
to those skilled in the art may be used to place the first
substrate 10 into physical contact with the vacuum plate. When the
first substrate 10 is positioned above the vacuum plate, the vacuum
plate may secure the first substrate 10 in a flat position and
prevent translational movement, sliding, shifting, etc., of the
first substrate 10. The underside of the second machine 50 may
include one or more vacuum plates, depending on the size of the
first substrate 10.
With continued reference to FIG. 8, and additional reference to
FIGS. 9-10C, the first substrate 10 is held in place by the vacuum
plate, a treatment head 54 coupled to the second end effector 58
may treat the surface of the first substrate 10. In most
embodiments, the treatment head 54 treats only the target fill
area, wherein the target fill area may be defined as the surface
area inside/within the dam 35, or the majority of the surface area
of the first substrate 10. Treating the surface of the first
substrate 10 may require plasma treatment of the surface of the
first substrate 10 to change the surface energy of the first
substrate 10 to improve wetting and adhesion properties of the
surface of the first substrate 10. The treatment head 54 may be
referred to as a plasma head or surface treatment head. Embodiments
of the treatment head 54 may be comprised of a metal, such as
stainless steel, or a combination of metal and composite materials,
plastics, etc. Moreover, movement of the second end effector 58
back and forth across the target area may treat the surface of the
first substrate with the treatment head 54 coupled to the second
end effector 58. The treatment head 54 may be up to 4 inches wide.
Moreover, the treatment head 54 may be connected to a mounting
plate 64a, wherein the mounting plate 64a is connected to an
independent Z actuator 65a, such as a ball screw slide, to allow
for movement up and down along a Z axis. The independent Z actuator
65a may be connected to the general structure of the second end
effector 58. Thus, the treatment head 54 may be able to move up and
down independent of the second end effector 58 through actuation of
the independent Z actuator 65a associated with the treatment head
54. A mounting plate, such as mounting plates 64a, 64b, may be any
component(s), rigid or otherwise, that may be used to connect,
secure, attach, etc., a component of second machine 50 to the
second end effector 58. Likewise, embodiments of a second machine
50 may include a custom head 53 coupled to the second end effector
58. The custom head 53 (and/or valve(s) assembly) may be connected
directly or indirectly to a mounting plate 64b, wherein the
mounting plate 64b is connected to an independent Z actuator 65b,
such as a ball screw slide, to allow for movement up and down along
a Z axis. The independent Z actuator 65b may be connected to the
general structure of the second end effector 58. Thus, the custom
head 53 may be able to move up and down independent of the second
end effector 58 through actuation of the independent Z actuator 65b
associated with the custom head 53. Embodiments of the custom head
53 may be comprised of a metal, such as stainless steel, or a
combination of metal and composite materials, plastics, etc. A
fluid reservoir may be operably attached to the custom head 53
through various means, such as a hose or other tube. The fluid
reservoir may contain fill material 5, such as optically clear
adhesive.
Furthermore, the custom head 53 may include a single dispensing
valve or a plurality of dispensing valves for dispensing a fill
material 5 onto the first substrate 10. The custom head 53 having a
plurality of valves may speed up the fill process over a larger
substrate due to a wider fill pattern, while a single dispensing
valve may be helpful over smaller substrates due to a narrower fill
pattern. Embodiments of the custom head 53 may include four, one
inch-wide dispensing valves positioned in a side-by-side
configuration, wherein each valve of the plurality of valves is
level or substantially level with respect to the other valves
forming the custom head 53. Those skilled in the art should
appreciate that the configuration and placement of the valves of
the custom head 53 may include other configurations and placement
locations, but may typically remain proximate each other coupled to
the second end effector 58. Further embodiments of custom head 53
may include an outlet block 66 positioned at the nozzle end of the
dispensing valves to help generate the dispense pattern through
each pass across the first substrate 10. Moreover, the second
machine 50 may selectively operate the custom head 53 such that
only one or more of the plurality of valves forming the custom head
53 dispense fill material 5, while the other valves remain unused.
The selective operation of the custom head 53 (e.g. 2 of 4 valves
dispensing fill material 5) may be performed prior to operation of
the second machine 50 and/or during the operation of the second
machine 50. For instance, an embodiment of a custom head 53 having
four or more dispensing valves may operate only three of the four
or more valves of the custom head 53, without the need for
disassembly, and without the need to stop the functioning/operation
of the second machine 50. Because the second machine 50 can
selectively operate individual components of the custom head 53,
the fill pattern may be narrowed or widened depending on the
requirement/specification of the first substrate 10 (e.g. size,
fill area, time, etc).
Furthermore, movement of the second end effector 58 following a
fill pattern across the first substrate 10 may dispense the fill
material 5 across the fill area of the first substrate 10. The fill
pattern of the fill material 5 may start proximate the front edge
11 of the first substrate 10, as shown in FIG. 11. The fill
material 5 dispensed by the custom head 53 may start a distance
from the dam 35 proximate or otherwise near the front edge 11, and
a distance from the sides of the first substrate 10. The direction
of the fill pattern may be from the front edge 11 to the rear edge
12 of the first substrate 10, and generally, the surface of the
fill material 5 on the first substrate 10 should not contain waves,
divots, or other surface irregularities (i.e. the surface of the
fill material 5 may be smooth and continuous). Additionally, the
movement of the second end effector 58 may be to dispense a
rectangular and/or linear pattern from one side to the other side,
wherein one trip by the second end effector 58 from side to side
may be referred to as a pass. After a pass by the second end
effector 58, the second end effector 58 may move a distance towards
the rear edge 12, and make a pass back across (e.g. laterally) the
first substrate 10. The patterned movement of the second end
effector 58 may continue until reaching the dam 35 proximate the
rear edge 12. Those having skill in the requisite art should
appreciate that the second end effector 58 may follow various
patterns and movements to apply the fill material 5. Accordingly,
the fill material 5 may cover a large majority of the surface of
the first substrate 10. For example, the fill material 5 may cover
85% to 95% of the first substrate 10, as shown in FIG. 12. Each
pass of the second end effector 58 may dispense fill material 5
across (e.g. side-to-side) the first substrate 10, between the dam
35 or general target area in embodiments where no dam 35 is formed,
at a width corresponding to the number of operating valves and type
of dispensing valve of the custom head 53. Thus, the custom head 53
may determine the width of fill material 5 being dispensed each
pass of the second end effector 58.
Moreover, with reference to FIGS. 11-13A, the fill material 5 may
be dispensed at a certain fill height, h. Fill height, h, may refer
to the height of the fill material 5 from the surface of first
substrate 10, once dispensed from the custom head 53. The fill
height, h, may be controlled by the speed of the second end
effector 58 during each pass across the first substrate 10. For
example, the slower the second end effector 58 moves as it passes
across the first substrate 10, the more fill material 5 may be
dispensed at that location. The fill height, h, may also be
controlled by the flow rates associated with the custom head 53
(e.g. size of the outlets, types of valves, etc.) and ultimately by
the amount of fill material 5 dispensed from the custom head 53. In
most embodiments, the fill material 5 is dispensed at a varying or
variable fill height, h. In one embodiment, the variable fill
height, h, may increase from the front edge 11 of the first
substrate 10 to a rear edge 12 of the first substrate 10. In other
words, the dispensed fill material 5 may have a largest fill
height, h, proximate or otherwise near the rear edge 12 of the
first substrate 10 and a lowest fill height, h, at the front edge
11 of the first substrate 10. Embodiments of the varying fill
height, h, may require the second end effector 58 to make a first
set of passes across the first substrate 10 at a consistent first
fill speed, then a second set of passes across the first substrate
10 at a consistent second fill speed, and a third set of passes
across the first substrate 10 at a consistent third fill speed,
wherein the first set of passes begins proximate the front edge 11,
the third set of passes occurs proximate the rear edge 12, further
wherein the first fill speed is faster than the second fill speed,
and the third fill speed is the slowest fill speed. Further
embodiments of the varying fill height, h, may include a plurality
of fill zones 67a, 68a, 69a. A fill zone 67a, 68a, 69a may refer to
a portion of the target fill area having a certain fill height, h,
of fill material 5 depending on the fill rate of the custom head
53. Each fill zone 67a, 68a, 69a may have the same fill height, h.
Alternatively, each fill zone 67a, 68a, 69a may have a fill height,
h, which slightly increases in a direction toward the rear edge 12,
as shown in FIG. 13A. Although only three fill zones 67a, 68a, 69a
are shown, those skilled in the art should appreciate that there
may be more or less than three fill zones 67a, 68a, 69a. Fill zone
67a, the fill zone closest to the front edge 11, should have the
lowest fill height, h. Fill zone 68a should have a fill height, h,
greater than the fill zone 67a, but less than fill zone 69a.
Accordingly, fill zone 69a, or fill zone closes to the rear edge 12
should have the greatest fill height, h. Those in the art should
appreciate that first, second, and third set of passes by the end
effector 58 do not necessarily have to be in any particular order,
for example, the third set of passes may be associated with fill
zone 67a, while the first set of passes may be associated with fill
zone 69a, or vice versa.
In another embodiment, with reference to FIG. 13B, the variable
fill height, h, may be a constant height from the front edge 11 of
the first substrate 10 to a middle portion 13 of the first
substrate 10, and constant from the rear edge 12 to the middle
portion 13, wherein the fill height, h, at the middle portion 13 is
larger. In other words, the dispensed fill material 5 may have a
largest fill height, h, proximate or otherwise near middle portion
13 of the first substrate 10 and a lowest fill height, h, proximate
or otherwise near the front edge 11 and rear edge 12 of the first
substrate 10. Embodiments of the varying fill height, h, may
require the second end effector 58 to make a first set of passes
across the first substrate 10 at a consistent first fill speed,
then a second set of passes across the first substrate 10 at a
consistent second fill speed, and a third set of passes across the
first substrate 10 at a consistent third fill speed, wherein the
first set of passes begins/occurs proximate or otherwise near the
front edge 11, the second set of passes occurs proximate or
otherwise near the middle portion 13, the third set of passes
occurs proximate or otherwise near the rear edge 12, further
wherein the first fill speed and the third fill speed is faster
than the second fill speed. Further embodiments of the varying fill
height, h, may include a plurality of fill zones 67b, 68b, 69b, as
shown in FIG. 13B. A fill zone 67b, 68b, 69b may refer to a portion
of the target fill area having a certain fill height, h, of fill
material 5 depending on the fill rate of the custom head 53.
Although only three fill zones 67b, 68b, 69b are shown, those
skilled in the art should appreciate that there may be more or less
than three fill zones 67b, 68b, 69b. Fill zone 67b, can be the fill
zone closest to the front edge 11. Fill zone 68b can be the fill
zone proximate a middle portion 13. Fill zone 69b can be the fill
zone closest to the rear edge 12. The fill zone 68b should have a
fill height, h, greater than the fill height, h, of fill zone 67b
and fill zone 69b. Accordingly, a fill zone proximate or otherwise
near the middle portion 13 of the first substrate 10, such as fill
zone 68b, should have the greatest fill height, h. Those in the art
should appreciate that first, second, and third set of passes by
the end effector 58 do not necessarily have to be in any particular
order, for example, the third set of passes may be associated with
fill zone 67b, while the first set of passes may be associated with
fill zone 69b, or vice versa.
Further embodiments of the second machine 50 of system 100 may
include a vision system 59 coupled to the second end effector 58,
and a heating system to heat the fill material 5. The vision system
59 may be a camera or other suitable vision system capable of
detecting the orientation, location, position, etc. of parts, such
as the first substrate 10, within the second machine 50. Moreover,
the heating system may include a heated valve(s) coupled to the
second end effector 58, a heated fluid hose through which the fill
material 5 travels from the fluid reservoir, or a heated fluid
reservoir. Heating the fill material 5 may help improve the wetting
of the fill material 5 by lowering the viscosity. The temperature
range for heating the fill material may be between 30.degree. C. to
50.degree. C.
After one or more tasks associated with the second machine 50 are
completed, the vacuum plate may release the first substrate 10, and
then the first substrate 10 may be forwarded to the third machine
70 via conveyor system 90, such as a conveyor belt. Those skilled
in the art should appreciate that the first substrate 10 may be
manually loaded in and out of the second machine 50. Furthermore,
it should be understood that each task/component associated with
the second machine 50, including, inter alia, treatment head 54
treating the surface of first substrate 10, custom head 53
dispensing fill material onto the first substrate 10, vision system
39 to monitor orientation of components, may be performed in
separate machines. For instance, the tasks/components associated
with the second machine 50 may be performed in two or more
machines, wherein the first substrate 10 is transferred to each
machine accordingly.
Referring now to FIGS. 14 and 15, embodiments of a third machine 70
of system 100 may include a frame 80, an X axis actuator 81, a Y
axis actuator 82, and a third end effector 78 having at least two
independent Z actuators 84a, 84b. The third machine 70 may utilize
a robotic platform to perform automated tasks with accuracy,
precision, and repeatability. For example, the third machine 70 may
be a Gantry robot having three principal axes (Cartesian
coordinates) controlling linear motion, wherein the horizontal
member(s) may be supported at both ends. The third machine 70 may
also be any robotic manipulator such as a selective compliant
assembly robot arm (SCARA) system, linear robot, multi-axis robot
arm system, and the like. However, an embodiment of the third
machine 70 will now be described as utilizing a Gantry robot for
exemplary purposes. The third end effector 78 may refer to any
device(s) attached to a X, Y, Z or other axis of movement to
perform a variety of tasks, such as dispensing, picking and
placing, routing, and the like. Embodiments of the third end
effector 78 may be a robotic placement system/machine, as described
infra. For instance, the third end effector 78 may move left and
right along the Y axis by sliding along the Y axis actuator 82, and
move back and forth along the X axis by sliding with the Y axis
actuator 82 as it slides along the X axis actuator 81. Embodiments
of the third end effector 78 may be comprised of a metal, such as
stainless steel, or a combination of metal and composite materials,
plastics, etc. Additionally, the third end effector 78 may move up
and down on the Z axis by simultaneously actuating the first
independent Z actuator 84a and the second independent Z actuator
84b. The X axis actuator 81, the Y axis actuator 82, and the first
and second independent Z actuators 84a, 84b may be a ball screw
slide, linear motion slide, a linear actuator, and the like.
Moreover, the frame 80 may provide a structure surrounding the
components of the third machine 70. The frame 80 may allow for
panels to be attached providing an enclosure for the third machine
70. The panels attached to the frame 80 may be a combination of
both solid panels and see-through panels, such as Plexiglas.RTM.,
glass, plastic, and the like, to allow viewing of the operation of
the third machine 70.
Embodiments of the third machine 70 may include at least one vacuum
plate coupled to an underside assembly 72, or support assembly, a
third end effector 78 including a height sensor 74 coupled to the
third end effector 78, a pick and place plate 73 coupled to the
third end effector 78, a vision system 59, and a conveyor system 90
for moving the first substrate 10 to the third machine 70, and for
moving the bonded substrates to a cure oven, such as UV cure oven.
As the first substrate 10 enters the third machine 70 on conveyor
system 90, a vacuum plate coupled to an underside assembly 72 may
be raised up to the first substrate 10. Alternatively, the first
substrate 10 may be lowered to the vacuum plate coupled to the
underside assembly 72. Other methods known to those skilled in the
art may be used to place the first substrate 10 into physical
contact with the vacuum plate. When the first substrate 10 is
positioned above the vacuum plate, the vacuum plate may secure the
first substrate 10 in a flat position and prevent translational
movement, sliding, shifting, etc., of the first substrate 10. The
underside assembly 72 of the third machine 70 may include one or
more vacuum plates, depending on the size of the first substrate
10.
A second substrate 20 may enter system 100, in particular, the
third machine 70 for optical bonding with the first substrate 10.
The second substrate 20 may be manually loaded in a slide table
proximate or otherwise near the third machine 70 to introduce the
second substrate 20 into system 100. Alternatively, the loading of
the second substrate 20 may be automated, such as a second conveyor
system (e.g. conveyor belt). The location of the slide table for
loading the second substrate 20 may correspond to the location of
the pick and place plate 73 of the third end effector 78. For
instance, the slide table may be positioned such that the second
substrate 20 is loaded into the third machine 70 directly
underneath or substantially underneath the pick and place plate 73
of the third end effector 78. In one embodiment, the slide table is
positioned perpendicular to the third machine 70, wherein entry
into the third machine 70 via slide table is proximate the third
end effector 78. Once the second substrate 20 is loaded proximate
the pick and place plate 73, the third end effector 78 may lower
down to engage the second substrate 20 with the pick and place
plate 73, wherein the pick and place plate 73 utilizes a vacuum
force to secure (i.e. pick) the second substrate 20. Alternatively,
the second substrate 20 may be raised to the pick and place plate
73; however, an automated or mechanical lift may be needed in
addition to the manual loading, especially if the second substrate
is a large sheet of glass. Accordingly, the third end effector 78
may be configured to pick the second substrate 20 via the pick and
place plate 73, wherein the pick and place plate 73 is coupled to
the third end effector 78.
Moreover, a height sensor 74 coupled to the third end effector 78
may be used to locate and monitor alignment the second substrate 20
as it enters the third machine 70. For example, the height sensor
74 may engage the second substrate 20 to locate and align the
second substrate 20 with the pick and place plate 73. The height
sensor 74 may probe the surface of the second substrate 20, and
more specifically, the edges of the second substrate 20 to ensure
proper engagement with the pick and place plate 73. Furthermore,
the height sensor 74 may be used to probe the surface (to determine
the height) of the first substrate 10 to locate the leading edge
(i.e. rear edge 12) of the first substrate 10 and may determine the
spatial location of the contact point between the second substrate
20 and the first substrate 10 (i.e. initial contact between the
rear edge 12 of the first substrate 10 and the front edge 21 of the
second substrate 20). Alternatively, the height sensor 74 may be
used to probe the surface (to determine the height) of the first
substrate 10 to locate at least one the rear edge 12 and the middle
portion 13 of the first substrate 10 and may determine the spatial
location of the contact point between the second substrate 20 and
the first substrate 10 (i.e. initial contact between the middle
portion 13 of the first substrate 10 and the middle portion 23 of
the second substrate 20). In one embodiment, the height sensor 74
may be a contact/touch probe relying on physical interaction
between a probe arm and the surface of the first substrate 10. In
another embodiment, the height sensor 74 may be a laser probe which
avoids physically contacting the surface of the first substrate
10.
Referring now to FIGS. 16A-19D, the third end effector 78 may be
configured to pick and place a second substrate 20 onto the first
substrate 10 and controllably lower the second substrate 20 onto
the first substrate. As shown in FIG. 17D, the third end effector
78 may be configured to place a second substrate 20 onto the first
substrate 10 at a placement angle, O, and controllably lower the
second substrate 20 onto the first substrate 10, wherein an initial
contact between the first and second substrate 10, 20 occurs
proximate the rear edge 12 of the first substrate 10. As shown in
FIG. 16D, the third end effector 78 may be configured to place the
second substrate 10 onto the first substrate 10, wherein the second
substrate 20 is parallel or substantially parallel to the first
substrate 10 (i.e. controllably descend from position shown in FIG.
16D).
With reference to FIGS. 16A-16D, an embodiment of a third end
effector 78 positioned a distance above an underside assembly 72 is
shown. In this position, the third end effector 78 has picked the
second substrate 10 and has moved into position proximate the first
substrate 10, which may be secured to a vacuum plate. FIGS. 17A-17D
show an embodiment of a third end effector 78 tilting to engage the
first substrate 10 at an angle. Through simultaneous actuation of
at least two independent Z axis actuators 84a, 84b, the third end
effector 78 may move up and down along a Z axis to descend towards
the first substrate 10 (or ascend away from the first substrate
10). Through independent actuation of at least two Z-axis actuators
84a, 84b, the third end effector 78 may be able to tilt to achieve
the desired angle of placement in embodiments where the contact
between the first substrate 10 and the second substrate 20 is not
parallel. Because the pick and place plate 73 is coupled to the
third end effector 78, the pick and place plate 73 may also tilt
according to the movement of the third end effector 78. Likewise,
because the second substrate 20 is secured to the pick and place
plate 73, the second substrate 20 may also tilt according to the
movements of the third end effector 78. Therefore, the initial
contact between the first substrate 10 and the second substrate 20
may be proximate the rear edge 12 of the first substrate 10, at an
angle of placement, O, between 0.degree. and 20.degree.. However,
the angle of placement may be larger than 20.degree. if required,
and the capabilities of the two independent Z-axis actuators 84a,
84b may be adjusted accordingly.
Once the second substrate 20 has initially engaged the first
substrate 10, the third end effector 78 may controllably lower the
second substrate 20 onto the first substrate 10, as shown in FIGS.
18A-18D. For instance, from the initial point of contact, the
second substrate 20 may be lowered at a calculated speed/velocity
and angle. Controllably lowering the second substrate 20 onto the
first substrate 10 may be gradual or proportional as the second
substrate 20 is placed onto the first substrate 10. In other
embodiments, controllably lowering the second substrate 20 onto the
first substrate 10 may mean that the speed of placement may vary
according to requirements/specifications of the substrates 10, 20
and/or fill material 5 being used. For example, as the angle
between the second substrate 20 and the first substrate 10
decreases and nears zero degrees, the second substrate 20 may be
controllably slowed to allow proper contact between the second
substrate 20 and the first substrate 10, and to control flow of
fill material 5. Generally, the speed of placement is slow to avoid
disrupting the fill material 5 and inviting air bubbles to form
between the substrates 10, 20 during the bonding process.
Alternatively, controllably lowering the second substrate 20 onto
the first substrate 10 may include a controlled descent of the
third end effector 78 while the second substrate 20 is operably
attached to the third end effector 78 at an angle parallel to the
first substrate 10.
Moreover, controllably lowering the second substrate 20 onto the
first substrate 10 may force the fill material 5 to create a
capillary or wave effect as it flows across the surface of the
first substrate 10 and/or second substrate 20, as shown in FIG.
20A. In a first embodiment, air bubbles, formations, pockets, etc.,
may be prevented or eliminated because at the initial point of
contact between the rear edge 12 of the first substrate 10 and the
front edge 21 of the second substrate 20, the second substrate 20
may immediately contact the fill material 5. Contact with the fill
material 5 may be ensured because the largest fill height, h, is
proximate the rear edge 12 of the first substrate 10. Thus, the
fill height, h, proximate the rear edge 12 of the first substrate
10 may equal the height necessary to make immediate contact with
the second substrate 20 as the third end effector 78 places the
second substrate 20 into an initial contact position, as shown in
FIG. 17D. As the second substrate 20 is controllably lowered onto
the first substrate 10, the fill material 5 may immediately begin
flowing outward and towards the front edge 11 of the first
substrate 10. The varying (or declining fill height, h, from rear
edge 12 to front edge 11) fill height, h, across the surface of the
first substrate 10 may allow the smooth, wavelike flow of the fill
material 5, and may avoid overflow over the dam or fill material 5
passing through the vents 36 in unnecessary excess.
In a second embodiment, air bubbles, formations, pockets, etc., may
be prevented or eliminated because at the initial point of contact
between the first substrate 10 and the second substrate 20, the
second substrate 20 may immediately contact the fill material 5 at
a middle portion 13, 23 of the substrates 10, 20. Contact with the
fill material 5 may be ensured because the largest fill height, h,
is proximate or otherwise near the middle portion 13 of the first
substrate 10. Thus, the fill height, h, proximate the middle
portion 13 of the first substrate 10 may equal the height necessary
to make immediate contact with the second substrate 20 as the third
end effector 78 places the second substrate 20 into an initial
contact position, as shown in FIG. 16D. As the second substrate 20
is controllably lowered onto the first substrate 10, the fill
material 5 may immediately begin flowing outwards towards the front
edge 11 and rear edge 12, the edges, of the first substrate 10. The
varying (or declining fill height, h, from the middle portion 13 to
the front edge 11 in one direction and to the rear edge 12 in an
opposite direction) fill height, h, across the surface of the first
substrate 10 may allow the smooth, wavelike flow of the fill
material 5, and may avoid overflow over the dam or fill material 5
passing through the vents 36 in unnecessary excess.
Accordingly, the capillary effect, or wavelike flow, of the fill
material 5 may prevent and eliminate the formation of air pockets
during the bonding process, regardless of the size of the
substrates 10, 20, as shown in FIG. 20B. The third end effector 78
may controllably lower the second substrate 20 onto the first
substrate 10 until the first and second substrates 10, 20 are
bonded, as shown in FIGS. 19A-19D. In other words, the third end
effector 78 may lower the second substrate 20 onto the first
substrate 10 until the angle between the first substrate 10 and the
second substrate 20 is 0.degree. (i.e. flat), or until no space
exists between the first and second substrates 10, 20.
Further embodiments of the third machine 70 of system 100 may
include a vision system 79 coupled to the third end effector 78 and
a heating system. The vision system 79 may be a camera or other
suitable vision system capable of detecting the orientation,
location, position, etc. of parts, such as the first substrate 10
and the second substrate 20, within the third machine 70. Moreover,
the heating system may include a heated valve(s) or other device
for applying heat to the first and second substrates 10, 20.
Referring now to FIGS. 21-23, an embodiment of a robotic placement
machine 200 is shown. The robotic placement machine 200 may be used
to place a first substrate 10, including a transparent substrate,
onto a second substrate 20. Generally, robotic placement machine
200 is used for optical bonding and similar glass lamination
methods and systems. The robotic placement machine 200 may be
configured to attach to a robotic platform capable of performing
automated tasks with accuracy, precision, and repeatability. For
example, robotic placement machine 200 may be attached to a Gantry
robot, or other robotic manipulator such as a selective compliant
assembly robot arm (SCARA) system, linear robot, multi-axis robot
arm system, and the like. Furthermore, the robotic placement
machine 200 may move left and right along the Y axis by sliding
along the Y axis actuator 282, and move back and forth along the X
axis by sliding with the Y axis actuator 282 as it slides along the
X axis actuator 281. The X axis actuator 281 may be interchangeable
with the Y axis actuator 282. The X axis actuator 81 and the Y axis
actuator 82 may be a ball screw slide, linear motion slide, a
linear actuator, and the like. Embodiments of the robotic placement
machine 200 may be comprised of a metal, such as stainless steel,
or a combination of metal and composite materials, plastics,
etc.
Embodiments of the robotic placement machine 200 may further
include a base 290 operably connected to the Y axis actuator 282,
at least two independent Z actuators 284a, 284b, at least two
mounting plates 295a, 295b, at least two bearing systems 220, 240,
a pick and place plate 250, an underside 251, at least one UV wand
275, a height sensor 274, and a vision system 279. Further
embodiments of the robotic placement machine 200 may be configured
to attach, or may have, a Y-axis actuator 282 for moving left and
right along an Y axis and a X-axis actuator 281 for moving back and
forth along an X axis, and a base 290 operably connectable to at
least one of the Y-axis actuator 281 and the X-axis actuator 281,
the base 290 having a first end 291 and a second end 291, a first Z
axis actuator 284a coupled to the first end 291 of the base 290,
the first Z-axis actuator 284a capable of moving up and down a
first Z axis, a second Z axis actuator 284b coupled to the second
end 292 of the base 290, the second Z axis actuator 284b capable of
moving up and down a second Z axis, and a pick and place plate 250
operably connected to the first Z axis actuator 284a and the second
Z axis actuator 284b, wherein the first Z axis actuator 284a and
the second Z axis actuator 284b are each capable of moving
independently of each other to tilt the pick and place plate
250.
Referring still to FIGS. 21-23, embodiments of a robotic placement
machine 200 may include a base 290 operably connected to the Y axis
actuator 282. The base 290 may be directly or indirectly connected
to the Y axis actuator 282. The base 290 may be rigidly fixed to
the Y axis actuator 282 or dynamically coupled to the Y axis
actuator 282. Alternatively, the base 290 may be suspended from the
Y axis actuator 282. The base 290 may be a single structural
component or a combination of structural components formed by rigid
materials or by a combination of rigid and flexible materials that
may provide structural integrity to the robotic placement machine
200. The base 290 may have a first end 291 and a second end 292.
The first Z axis actuator 284a may be coupled to the first end 291
of the base 290. Similarly, the second Z axis actuator 284b may be
coupled to the second end 292 of the base 290. Embodiments of the
first and second Z axis actuators 284a, 284b may be a ball screw
slide, linear motion slide, a linear actuator, and the like. The
first Z-axis actuator 284a may operate independently of the second
Z-axis actuator 284b, but may function in unison as required.
Accordingly, each Z axis actuator 284a, 284b may be actuated at
different times, different speeds, etc. Thus, the first Z axis
actuator 284a and the second Z axis actuator 284b are each capable
of moving independently of each other to tilt the pick and place
plate 250, and return the pick and place plate 250 back to a
horizontal or substantially horizontal position.
Through simultaneous actuation of the first and second Z axis
actuators 284a, 284b, the robotic placement machine 200 may move up
and down, while keeping the pick and place plate 250 horizontal or
substantially horizontal. Additionally, simultaneous actuation of
the first and second Z axis actuators 284a, 284b may move the
robotic placement machine 200 up and down, while the pick and place
plate 250 is tilted at an angle, maintaining the tilt angle during
movement. Through independent actuation of the first and second Z
axis actuators 284a, 284b, the robotic placement machine 200 may
move or tilt the pick and place plate 250 from 0.degree. to
20.degree. with respect to a horizontal position. In some
embodiments, independent actuation of the first and second Z axis
actuators 284a, 284b may achieve tilt of the pick and place plate
250 and movement up and down along a Z axis.
Embodiments of robotic placement machine 200 may also include a
first mounting plate 295a coupled to the first Z-axis actuator
284a, wherein the first Z-axis actuator 284a is coupled to a second
surface 297a of the mounting plate 295a. Similarly, embodiments of
robotic placement machine 200 may include a second mounting plate
295b coupled to the second Z-axis actuator 284b, wherein the second
Z-axis actuator 284b is coupled to a second surface 297b of the
second mounting plate 295b. A mounting plate, such as mounting
plates 295a, 295b may be any component(s), rigid or otherwise, that
may be used to connect, secure, attach, etc., the first and second
Z axis actuator 284a, 284b to a first and second bearing system
220, 240, respectively. For instance, a first bearing system 220
may be coupled to a first surface 296a of the first mounting plate
295a. Similarly, a second bearing system 240 may be coupled to a
first surface 296b of the second mounting plate 295b. The operable
communication between the first and second Z-axis actuators 284a,
284b may allow the robotic placement machine 200 to tilt as a
single unit. In other words, the first and second bearing systems
220, 240 may mechanically allow and/or facilitate the tilt of the
pick and place plate 250. Furthermore, first and second bearing
systems 220, 240 may improve the efficiency and reduce the friction
resulting from the actuation of the first and second Z axis
actuators 284a, 284b. Embodiments of the first and second bearing
systems 220, 240 may include a bearing fitted within a housing
fastened to the underside, capable of supporting a shaft to
facilitate the tilt of the pick and place plate 250. Those skilled
in the requisite art should appreciate that other bearing systems
may be employed to facilitate the tilting of the robotic placement
machine 200, and should not be limited to the embodiments disclosed
herein.
Moreover, the first and second bearing systems 220, 240 may also be
coupled to an underside 251 or support substrate of the robotic
placement machine 200. The underside 251 may be coupled, or in
mechanical communication with a pick and place plate 250. In some
embodiments, the robotic placement machine 200 may include more
than one pick and place plate 250 coupled to the underside 251. The
pick and place plate 250 may be configured to pick, secure, grab,
attach to, etc. a transparent substrate, such as second substrate
10. The pick and place plate 250 may be a vacuum plate configured
to lock onto a substrate for controllable placement onto another
substrate, such as first substrate 10.
Further embodiments of robotic placement machine 200 may include at
least one UV wand 275 positioned on the underside 251. The UV wands
245 may have the same structure and function of UV wand 45,
described supra. Embodiments of robotic placement machine 200 may
include a plurality of UV wands 245 positioned proximate the edges
of the underside 251 at locations where vents, such as vents 36,
may exist on a dam, such as dam 35, wherein the dam is along a
perimeter of a substrate configured to be bonded to another
substrate placed by robotic placement machine 200. The UV wands 245
may stabilize UV material used as dam and/or fill material, and may
function when the robotic placement machine 200 has placed a
substrate onto another substrate having a dam, wherein the bonding
may disrupt the dam material. Embodiments of robotic placement
machine 200 may also include a height sensor 274 to detect a
surface height of a substrate. Height sensor 274 may share the same
function and structure as height sensor 74, described supra.
Further embodiments of robotic placement machine 200 may include a
vision system 279 to detect an orientation of components associated
with the robotic placement machine 200. The vision system 279 may
share the same function and structure as vision system 79,
described supra.
With reference to FIGS. 1-23, a first method of optical bonding is
now described. The method of optical bonding may include the steps
of dispensing a fill material 5 across a surface of the first
substrate 10 to achieve a largest fill height, h, proximate a rear
edge 12 of the first substrate 10 and a lowest fill height, h,
proximate a front edge 11 of the first substrate 10, placing a
second substrate 20 into contact with the fill material 5 proximate
the rear edge 12 of the first substrate 10 at an angle relative to
the first substrate 10, and controllably lowering the second
substrate 20 onto the first substrate 10 until the second substrate
20 is bonded to the first substrate 10 to prevent and eliminate air
bubbles between the first and second substrates 10, 20. Further
steps may include tracing providing a first substrate 10,
dispensing dam material around a perimeter of the first substrate
10 to form a dam 35 (although some embodiments of the method may
not include forming a dam; the frame may act as a dam), the dam
material with a UV wand 45 to stabilize the dam material, treating
the surface of the first substrate 10 with a treatment head 53
prior to dispensing fill material 5 onto the surface of the first
substrate 10, locating and aligning the second substrate 20 for
placement onto first substrate 10, locating the rear edge 12 of the
first substrate 10 with a height sensor 74, and placing the bonded
substrates into a cure oven.
Referring again to FIGS. 1-23, a second method of optical bonding
is now described. The method of optical bonding may include the
steps of dispensing a fill material 5 across a surface of the first
substrate 10 to achieve a largest fill height, h, proximate a
middle portion 13 of the first substrate 10, placing a second
substrate 20 into contact with the fill material 5 proximate the
middle portion 13 of the first substrate 10 substantially parallel
or parallel to the first substrate 10, and controllably lowering
the second substrate 20 onto the first substrate 10 until the
second substrate 20 is bonded to the first substrate 10 to prevent
and eliminate air bubbles between the first and second substrates
10, 20. Further steps may include tracing providing a first
substrate 10, dispensing dam material around a perimeter of the
first substrate 10 to form a dam 35 (although some embodiments of
the method may not include forming a dam; the frame may act as a
dam), the dam material with a UV wand 45 to stabilize the dam
material, treating the surface of the first substrate 10 with a
treatment head 53 prior to dispensing fill material 5 onto the
surface of the first substrate 10, locating and aligning the second
substrate 20 for placement onto first substrate 10, locating a rear
edge 12 of the first substrate 10 with a height sensor 74, and
placing the bonded substrates into a cure oven.
With continued reference to the drawings, FIGS. 24-26B depict an
embodiment of a machine 700 as a part of system 1000. Embodiments
of system 1000 may include first machine 30, second machine 50, and
machine 700. Embodiments of machine 700 may include a frame 780, an
X axis actuator 781, a Y axis actuator 782, and an end effector 778
having at least two independent Z actuators 784a, 784b. The machine
700 may utilize a robotic platform to perform automated tasks with
accuracy, precision, and repeatability. For example, the machine
700 may be a Gantry robot having three principal axes (Cartesian
coordinates) controlling linear motion, wherein the horizontal
member(s) may be supported at both ends. The machine 700 may also
be any robotic manipulator such as a selective compliant assembly
robot arm (SCARA) system, linear robot, multi-axis robot arm
system, and the like. However, an embodiment of the machine 700
will now be described as utilizing a Gantry robot for exemplary
purposes. The end effector 778 may refer to any device(s) attached
to a X, Y, Z or other axis of movement to perform a variety of
tasks, such as dispensing, picking and placing, routing, and the
like. Embodiments of the end effector 778 may be a robotic
placement system/machine, such as robotic placement machine 200
described supra. For instance, the end effector 778 may move left
and right along the Y axis by sliding along the Y axis actuator
782, and move back and forth along the X axis by sliding with the Y
axis actuator 782 as it slides along the X axis actuator 781.
Embodiments of the end effector 778 may be comprised of a metal,
such as stainless steel, or a combination of metal and composite
materials, plastics, etc. Additionally, the end effector 778 may
move up and down on the Z axis by simultaneously actuating the
first independent Z actuator 784a and the second independent Z
actuator 784b. The X axis actuator 781, the Y axis actuator 782,
and the first and second independent Z actuators 784a, 784b may be
a ball screw slide, linear motion slide, a linear actuator, and the
like. Moreover, the frame 780 may provide a structure surrounding
the components of the machine 700. The frame 780 may allow for
panels to be attached providing an enclosure for the machine 700.
The panels attached to the frame 780 may be a combination of both
solid panels and see-through panels, such as Plexiglas.RTM., glass,
plastic, and the like, to allow viewing of the operation of the
machine 700.
Embodiments of machine 700 may share the same structural and
functional aspects of the third machine 70, as described supra. For
example, the machine 700 may be operably connected to the first
machine 30 and second machine 50 through a conveyor system, and may
be configured to pick and place a second substrate into a bonding
engagement with the first substrate 10. However, embodiments of
machine 700 may also include an adhesive application valve 600,
wherein the adhesive application valve 600 is configured to apply
an amount of adhesive onto the second substrate 20 prior to being
placed into a bonding engagement with the first substrate 10. The
adhesive application valve 600, described in greater detail infra,
may be disposed inside or outside the frame 780 of the machine 700,
such that the adhesive application valve 600 is proximate the
machine 700 and/or located sufficiently close for the end effector
778, or robotic placement machine 200, to facilitate the
application of adhesive onto the second substrate 20.
With continued reference to FIGS. 24-26B, and additional reference
to FIGS. 27A-27D, similar to the third machine 70, embodiments of
machine 700 may include at least one vacuum plate coupled to an
underside assembly 772, or support assembly, an end effector 778
including a height sensor 774 coupled to the end effector 778, a
pick and place plate 773 coupled to the end effector 778, a vision
system 759, and a conveyor system 90 for moving the first substrate
10 to the machine 700, and for moving the bonded substrates to a
cure oven, such as UV cure oven. As the first substrate 10 enters
the machine 700 on conveyor system 90, a vacuum plate coupled to an
underside assembly 772 may be raised up to the first substrate 10.
Alternatively, the first substrate 10 may be lowered to the vacuum
plate coupled to the underside assembly 772. Other methods known to
those skilled in the art may be used to place the first substrate
10 into physical contact with the vacuum plate. When the first
substrate 10 is positioned above the vacuum plate, the vacuum plate
may secure the first substrate 10 in a flat position and prevent
translational movement, sliding, shifting, etc., of the first
substrate 10. The underside assembly 772 of the machine 700 may
include one or more vacuum plates, depending on the size of the
first substrate 10.
A second substrate 20 may enter machine 700 for optical bonding
with the first substrate 10. The second substrate 20 may be
manually loaded in a slide table proximate or otherwise near the
machine 700 to introduce the second substrate 20 into system 1000.
Alternatively, the loading of the second substrate 20 may be
automated, such as a second conveyor system (e.g. conveyor belt).
The location of the slide table for loading the second substrate 20
may correspond to the location of the pick and place plate 773 of
the end effector 778, or robotic placement machine 200. For
instance, the slide table may be positioned such that the second
substrate 20 is loaded into the machine 700 directly underneath or
substantially underneath the pick and place plate 773 of the end
effector 778. In one embodiment, the slide table is positioned
perpendicular to the machine 700, wherein entry into the machine
700 via slide table is proximate the end effector 778. Once the
second substrate 20 is loaded proximate the pick and place plate
773, the end effector 778 may lower down to engage the second
substrate 20 with the pick and place plate 773, wherein the pick
and place plate 773 utilizes a vacuum force to secure (i.e. pick)
the second substrate 20. Alternatively, the second substrate 20 may
be raised to the pick and place plate 773. However, an automated or
mechanical lift may be needed in addition to the manual loading,
especially if the second substrate is a large sheet of glass.
Accordingly, the end effector 778 may be configured to pick the
second substrate 20 via the pick and place plate 773, wherein the
pick and place plate 773 is coupled to the end effector 778.
Moreover, a height sensor 774 coupled to the end effector 778 may
be used to locate and monitor alignment the second substrate 20 as
it enters the machine 700. For example, the height sensor 774 may
engage the second substrate 20 to locate and align the second
substrate 20 with the pick and place plate 773. The height sensor
774 may probe the surface of the second substrate 20, and more
specifically, the edges of the second substrate 20 to ensure proper
engagement with the pick and place plate 773. Furthermore, the
height sensor 774 may be used to probe the surface (to determine
the height) of the first substrate 10 to locate the leading edge
(i.e. rear edge 12) of the first substrate 10 and may determine the
spatial location of the contact point between the second substrate
20 and the first substrate 10 (i.e. initial contact between the
rear edge 12 of the first substrate 10 and the front edge 21 of the
second substrate 20). Alternatively, the height sensor 774 may be
used to probe the surface (to determine the height) of the first
substrate 10 to locate at least one the rear edge 12 and the middle
portion 13 of the first substrate 10 and may determine the spatial
location of the contact point between the second substrate 20 and
the first substrate 10 (i.e. initial contact between the middle
portion 13 of the first substrate 10 and the middle portion 23 of
the second substrate 20). In one embodiment, the height sensor 774
may be a contact/touch probe relying on physical interaction
between a probe arm and the surface of the first substrate 10. In
another embodiment, the height sensor 774 may be a laser probe
which avoids physically contacting the surface of the first
substrate 10.
Referring to FIGS. 28A-28C, the end effector 778 may be configured
to pick and place a second substrate 20 into engagement with the
adhesive application valve 600. For instance, the end effector 778
may bring the second substrate 20 proximate the adhesive
application valve 600 to allow an application of an amount of
adhesive onto a surface of the second substrate configured to
engage the fill material 5 dispensed on the first substrate 10. The
amount of adhesive 8 applied by the adhesive application valve 600
may be a bead of adhesive. Embodiments of the adhesive application
valve may apply the bead of adhesive 8 proximate or otherwise near
a center or middle portion 23 of the second substrate 20. The end
effector 778 may lower or otherwise place the second substrate in a
position of engagement with the applicator 620 of the adhesive
application valve 600 for application of the adhesive 8. The
position of engagement may be a distance from physical contact with
the applicator 620 of the adhesive application valve 600, wherein
the applicator 620 may automatedly protrude or extend the distance
towards the second substrate 20 to apply an amount of adhesive 8
onto the second substrate 20, and then may retract to an original
position. Because the adhesive application valve 600 may be
moveable along a Z-axis, the location of the second substrate 20,
via movement of the end effector 778, may vary with respect to the
adhesive application valve 600. For example, the end effector 778
may place the second substrate 20 into a position of engagement
with the adhesive application valve 600, which is a distance beyond
the reach of the retractable applicator 620, and the Z-axis
actuator 650 of the adhesive application valve 600 may be actuated
to close the distance sufficient for the retractable applicator 620
to apply the adhesive 8. The adhesive application valve 600 may
then apply the adhesive 8 directly (without extension) or through
an automated and/or mechanical extension of the applicator 620 from
the base portion 640. Furthermore, the angle of the second
substrate 20 with respect to the adhesive application valve 600 may
vary because the adhesive application valve 600 may tiltable or
rotatable about a central axis 605 of the adhesive application
valve 600. Because the adhesive application valve 600 is moveable
along a Z-axis, and independently tiltable or rotatable about the
central axis 605, various movements of the end effector 778 may be
programmed according to the size of the second substrate 20, the
size of the machine 700, or any other constraints of the machine
700, second substrate 20, or other components within the machine
700. Accordingly, spatial locations of the second substrate 20 in
the machine 700 or proximate the machine 700 with respect to the
adhesive application valve 600 may be achieved due to the
versatility of the adhesive application valve 600. Alternatively,
the adhesive application valve 600 may be remain in a fixed
position, including the applicator 620 of the adhesive application
valve 600, and allow the end effector 778 to advance the second
substrate 20 into physical contact with the applicator 620 to apply
the adhesive 8.
Referring to FIG. 26B, with additional reference to FIG. 29,
embodiments of machine 700 may further include an adhesive
collecting device 800 proximate the adhesive application valve 600.
Embodiments of the adhesive collecting device 800 may be placed
underneath or approximately underneath the adhesive application
valve 600, or in a position to collect dripping or excess adhesive
8 that may have fallen off of the second substrate 20 during
application of the adhesive 8. Moreover, the adhesive application
valve 600 may be tilted or rotated, after application of the
adhesive 8 to the second substrate 20, until the applicator 620 may
engage and/or enter the adhesive collecting device 800 to remove
excess adhesive 8 from a tip of the applicator 620. Embodiments of
the adhesive collecting device 800 may include a basin 830, a
mounting plate 820, and a coupling element 840. Embodiments of the
basin 830 may include an opening 810 through which the applicator
620, or tip of the applicator 620, may enter and dispose of the
excess adhesive 8, or falling adhesive 8 may be collected. The
basin 830 may be a cup, tub, container, and the like, and may
include an opening at the bottom of the basin 830 to empty or
displace the collected adhesive 8. Embodiments of the mounting
plate 820 may be mounted to the frame 780 of the machine 700, and
may secure the basin 830 in place. Embodiments of the coupling
element 840 may be connected to a line, and positioned underneath
the basin 830 to displace the collected adhesive 8 to another
location through the line; the line may be in communication with
the basin 830 via an opening on the bottom of the basin 830.
Referring back to FIGS. 27A-27D, and FIGS. 31-32, after an amount
of adhesive 8 has been applied, dispensed, placed, etc., onto the
second substrate 20, the end effector 778 may move, place, carry,
etc., the second substrate 20 into a position within machine 700 to
controllably lower the second substrate 20 onto the first substrate
10. As shown in FIG. 27D, the end effector 778 may be configured to
place a second substrate 20 onto the first substrate 10 at a
placement angle, O, and controllably lower the second substrate 20
onto the first substrate 10, facilitating initial contact between
the adhesive 8 applied to the second substrate 20 and a fill
material 5 applied to the first substrate 10. In other words, the
end effector 778 may be configured to controllably lower the second
substrate 20, or controllable descend from the position shown in
FIG. 27D and FIG. 31, such that initial contact can be made between
the amount of adhesive 8 applied on the second substrate 20 and the
fill material 5 prior to engagement between a surface of the second
substrate 20 and the fill material 5 on the first substrate 10, as
shown in FIG. 32. The placement angle, O, may be 0.degree.,
approximately 0.degree., 180.degree., approximately 180.degree.,
such that the first and second substrates 10, 20 are parallel or
substantially parallel with respect to each other.
With further reference to FIGS. 27A-27D, an embodiment of an end
effector 778, such as robotic placement machine 200, is positioned
a distance above an underside assembly 772. In this position, the
end effector 778 has picked the second substrate 20 and has moved
into position proximate the first substrate 10, which may be
secured to a vacuum plate. Through simultaneous actuation of at
least two independent Z axis actuators 784a, 784b, the end effector
778 may move up and down along a Z axis to descend towards the
first substrate 10 (or ascend away from the first substrate 10) to
position the adhesive 8 into contact with the fill material 5. Once
the adhesive 8 on the second substrate 20 has initially engaged the
fill material 5 on the first substrate 10, the end effector 778 may
further controllably lower the second substrate 20 onto the first
substrate 10 into a bonding engagement, as shown in FIGS. 30A-30D.
For instance, from the initial point of contact, the second
substrate 20 may be lowered at a calculated speed/velocity.
Controllably lowering the second substrate 20 onto the first
substrate 10 may be gradual or proportional as the second substrate
20 is placed onto the first substrate 10. In other embodiments,
controllably lowering the second substrate 20 onto the first
substrate 10 may mean that the speed of placement may vary
according to requirements/specifications of the substrates 10, 20
and/or fill material 5 and adhesive 8 being used. For example, as
the distance between the second substrate 20 and the first
substrate 10 decreases and nears initial contact, the lowering of
the second substrate 20 may be controllably slowed to allow proper
contact between the adhesive 8 and the fill material 5, and to
control flow of fill material 5 between the substrates 10, 20.
Generally, the speed of placement can be slow to avoid disrupting
the fill material 5 and inviting air bubbles to form between the
substrates 10, 20 during the bonding process; the acceleration and
deceleration rates may be variable, and custom to the specific
project(s) requirement. Alternatively, controllably lowering the
second substrate 20 onto the first substrate 10 may include a
controlled descent of the end effector 778 while the second
substrate 20 is operably attached to the third end effector 778 at
an angle parallel to the first substrate 10, until the second
substrate 20 is bonded to the first substrate 10.
Referring now to FIGS. 33-34 an additional fill pattern may be
performed by the movement of the second end effector 58 of the
second machine 50, which may be operably connected to machine 700
or alternatively to the third machine 70. The second end effector
58, following an additional fill pattern across the first substrate
10, may dispense fill material 5 across a fill area of the first
substrate 10. The fill pattern of the fill material 5 may start
proximate the center or middle portion 13 of the first substrate
10, and may extend towards the corners 15 of the first substrate
10, as shown in FIG. 31. The fill material 5 dispensed by the
custom head 53 may start a distance from the dam 35 proximate or
otherwise near the edges of the first substrate proximate the
middle portion 13. Generally, the surface of the fill material 5 on
the first substrate 10 should not contain waves, divots, or other
surface irregularities (i.e. the surface of the fill material 5 may
be smooth and continuous). Those having skill in the requisite art
should appreciate that the second end effector 58 may follow
various patterns and movements to apply the fill material 5. The
fill material 5 of the fill pattern, as shown in FIG. 31, may cover
a less amount of the surface of the first substrate 10, which can
save on material costs and time during operation, compared to the
fill pattern shown in FIG. 12. Each pass of the second end effector
58 may dispense fill material 5 across (e.g. side-to-side) the
first substrate 10, between the edges of the dam 35 or within a
general target area in embodiments where no dam 35 is formed, at a
width corresponding to the number of operating valves and type of
dispensing valve of the custom head 53. Thus, the custom head 53
may determine the width of fill material 5 being dispensed each
pass of the second end effector 58.
Moreover, with continued reference to FIGS. 33-34, the fill
material 5 may be dispensed at a certain fill height, h. Fill
height, h, may refer to the height of the fill material 5 from the
surface of first substrate 10, once dispensed from the custom head
53. The fill height, h, may be controlled by the speed of the
second end effector 58 during each pass across the first substrate
10. For example, the slower the second end effector 58 moves as it
passes across the first substrate 10, the more fill material 5 may
be dispensed at that location. The fill height, h, may also be
controlled by the flow rates associated with the custom head 53
(e.g. size of the outlets, types of valves, etc.) and ultimately by
the amount of fill material 5 dispensed from the custom head 53. In
most embodiments, the fill material 5 is dispensed at a varying or
variable fill height, h. In one embodiment, the variable fill
height, h, may be a constant height proximate a middle portion 13
of the first substrate 10, wherein the fill height, h, at the
middle portion 13 is largest, while the fill height may be constant
proximate the corners of the substrate 10, but lower than the fill
height at the middle portion 13. The dispensed fill material 5 may
have a largest fill height, h, proximate or otherwise near middle
portion 13 of the first substrate 10 and a lowest fill height, h,
proximate or otherwise near the corners 15 of the first substrate
10. Embodiments of the varying fill height, h, may require the
second end effector 58 to make a first set of passes across the
first substrate 10 at a consistent or gradually increasing first
fill speed, then a second set of passes across the first substrate
10 at a consistent or gradually increasing second fill speed, and a
third set of passes across the first substrate 10 at a consistent
or gradually increasing third fill speed, wherein the first set of
passes begins/occurs proximate or otherwise near middle portion 13,
the second set of passes occurs proximate or next to on either side
of the fill material 5 dispensed at the middle portion 13, the
third set of passes occurs as the end effector 58 moves from the
middle portion 13 to the corners 15 of the first substrate 10, as
shown in FIG. 31. The third set of passes, moving from the middle
portion 13 towards the corners 15 of the first substrate 10 avoids
covering large portions of the substrate while still dispensing
enough fill material 5 at proper areas of the first substrate 10 to
achieve a capillary, wave-like effect of the fill material when
optically bonded to the second substrate 20. Further embodiments of
the varying fill height, h, may include a plurality of fill zones
67c, 68c, 69c, as shown in FIG. 33. A fill zone 67c, 68c, 69c may
refer to a portion of the target fill area having a certain fill
height, h, of fill material 5 depending on the fill rate of the
custom head 53. Although only three different types of fill zones
67c, 68c, 69c are shown, those skilled in the art should appreciate
that there may be more or less than three types of fill zones 67c,
68c, 69c. Fill zone 67c can be the fill zone closest to the middle
portion 13. Fill zone 68c can be the fill zone next to or
side-by-side with fill zone 67c. Fill zone 69c can be the fill zone
extending from fill zone 68c to the corners 15. The fill zone 67c
should have a fill height, h, greater than the fill height, h, of
fill zone 68c and fill zone 69c, and fill zone 68c may have a
greater fill height, h, than fill zone 69c. Accordingly, a fill
zone proximate or otherwise near the middle portion 13 of the first
substrate 10, such as fill zone 67c, should have the greatest fill
height, h. Those in the art should appreciate that first, second,
and third set of passes by the end effector 58 do not necessarily
have to be in any particular order, for example, the third set of
passes may be associated with fill zone 67c, while the first set of
passes may be associated with fill zone 69c, or vice versa.
Referring back to FIGS. 27A-27D and 30A-30D, controllably lowering
the second substrate 20 onto the first substrate 10 may force the
fill material 5 to create a capillary or wave effect as it flows
across the surface of the first substrate 10 and/or second
substrate 20, as shown in FIG. 35. Because the fill material 5
first contacts an amount of adhesive 8 applied to the second
substrate 20 air bubbles, formations, pockets, etc., may be
prevented or eliminated. Contact between the adhesive 8 and the
fill material 5 may be ensured because the largest fill height, h,
may be proximate the middle portion 13 of the first substrate 10,
while the adhesive 8 has been applied proximate the middle portion
23 of the second substrate 20. Thus, the fill height, h, proximate
the middle portion 13 of the first substrate 10 may equal the
height necessary to make immediate contact with the adhesive 8
applied on the second substrate 20 as the end effector 778 places
the second substrate 20 into a bonding engagement. As the second
substrate 20 is controllably lowered onto the first substrate 10,
the fill material 5 may immediately begin flowing outwards towards
the front edge 11 and rear edge 12, and corners 15, of the first
substrate 10. The varying fill height (or declining fill height, h,
from the middle portion 13 to the front edge 11 or corners 15 in
one direction and to the rear edge 12 in an opposite direction), h,
across the surface of the first substrate 10 may allow the smooth,
wavelike flow of the fill material 5, and may avoid overflow over
the dam or fill material 5 passing through the vents 36 in
unnecessary excess. Accordingly, the capillary effect, or wavelike
flow, of the fill material 5 may prevent and eliminate the
formation of air pockets during the bonding process, regardless of
the size of the substrates 10, 20, as shown in FIG. 33. The end
effector 778 may controllably lower the second substrate 20 onto
the first substrate 10 until the first and second substrates 10, 20
are bonded, as shown in FIGS. 30A-30D.
Further embodiments of machine 700 of system 1000 may include a
vision correction system 779 coupled to the end effector 778 and a
heating system. The vision correction system 779 may be a camera or
other suitable vision system capable of detecting the orientation,
location, position, etc. of parts, such as the first substrate 10
and the second substrate 20, within machine 700. Embodiments of the
vision correction system 779 may correctly and precisely align both
the top substrate 20 and the bottom substrate 10 prior to optically
bonding the substrates 10, 20. Moreover, the heating system may
include a heated valve(s) or other device for applying heat to the
first and second substrates 10, 20.
FIGS. 29A and 29B depicts an embodiment of an adhesive application
valve 600. Embodiments of the adhesive application valve 600 may be
a valve, dispenser, applicator, or comparable device that is
configured to apply, dispose, introduce, provide, dispense, place,
smear, etc., an amount of adhesive to a substrate. Adhesive, such
as adhesive 8, may be an optically clear adhesive, such as
DuPont.RTM. Vertak family of adhesives, or any clear adhesive that
may quickly cure under UV and/or efficiently adheres a glass
substrates, such as LCD display, and similar surfaces.
Generally, adhesive application valve 600 is used for optical
bonding and similar glass lamination methods and systems. The
adhesive application valve 600 may be configured to perform
automated tasks with accuracy, precision, and repeatability.
Embodiments of the adhesive application valve 600 may be disposed
within machine 700, proximate machine 700, and/or proximate the end
effector 778. Embodiments of the adhesive application valve 600 may
include a mounting device 680, a mounting plate 670, a Z-axis
actuator 650, a rotation device 660, a base portion 640, an
applicator 620, and an extension 690. Embodiments of the adhesive
application valve 600 may include a base portion 640 operably
connected to a rotation device 660, an applicator 620 operably
connected to the base portion 640, and a Z-axis actuator 650
operably connected to the rotation device 660, wherein the Z-axis
actuator 650 and the rotation device 660 are each capable of moving
independently of each other to position the applicator 620 in a
position to apply an amount of adhesive 8 to a top substrate 20
prior to bonding with a bottom substrate 10. Moreover, embodiments
of the adhesive application valve 600 may be comprised of a metal,
such as stainless steel, or a combination of metal and composite
materials, plastics, etc.
Embodiments of the mounting device 680 may be mounted to a frame of
a machine, such as frame 780 of machine 700. The mounting device
680 may secure the adhesive application valve 600 to the frame 780
of machine 700, or to any other machine or frame that requires the
use of the adhesive application valve 600. The mounting device 680
may include one or more rails 685 and one or more opening 683 for
mounting to the frame 780 and for mounting/fastenting the mounting
plate 670 to the mounting device 680. Moreover, the mounting device
680 may be formed of a metal or rigidly formed plastic or composite
for fixed securement to the frame 780. Embodiments of the mounting
plate 670 may be any component(s), rigid or otherwise, that may be
used to connect, secure, attach, etc., the Z-axis actuator 650 to
the mounting device 680. Embodiments of the mounting plate 670 may
be L-shaped, defined by a horizontal bottom plate 675 and a
vertical plate 673 connected thereto. For instance, the horizontal
bottom plate 675 may be configured to be fastened, secured, mounted
to the mounting device 680, while the vertical plate 673 may be
configured to be fastened, secured, mounted to the Z-axis actuator
650.
Embodiments of the Z axis actuator 650 may be coupled to the
mounting plate 670. Embodiments of the Z-axis actuator 650 may be a
ball screw slide, linear motion slide, a linear actuator, and the
like. Embodiments of the Z-axis actuator 650 may include an
attachment portion 655 which may be coupled to a rotation device
660. The Z-axis actuator 650 may be capable of up and down movement
along a Z-axis, thus allowing up and down movement of the
applicator 620 along a Z-axis during operation. In other words,
through actuation of the Z-axis actuator 650, the applicator 620
may be raised or lowered into a position of engagement with the
second substrate 20 to apply an amount of adhesive 8 during
operation. Thus, the Z-axis actuator 650 can be operably connected
to the applicator 620; vertical movement of the Z-axis actuator 650
may translate into vertical movement of the applicator 620.
In addition to movement up and down along a Z-axis, the adhesive
application valve 600 may include a rotation device 660 configured
to rotate or tilt the adhesive application valve 600, in
particular, the applicator 620, the base portion 640, and the
extension 690. The rotation device 600 may provide/allow for
rotation or tilt to achieve a more efficient or more effective
position of engagement between the second substrate 20 and the
applicator 620, and/or more provide/allow for rotation to
facilitate cooperation between the adhesive collecting device 800
and the applicator 620. Embodiments of the rotation device 660 may
facilitate tilting and/or rotating action through use of a bearing
system, or any similar or comparable mechanical or
electromechanical device. Thus, the rotation device 660 may be
operably connected to the applicator 620; rotation of the rotation
device 660 may translate into rotation or tilting of the applicator
620.
Embodiments of the adhesive application valve 600 may further
include a base portion 640, wherein the base portion 640 may be
operably connected to at least one of the rotation device 660 and
the Z-axis actuator 650. The applicator 620 may be coupled to the
base portion 640 to enhance stability and damage resistance to the
components. Embodiments of the applicator 620 may be a valve, an
applicator, a dispensing valve, and the like, that may apply,
dispense, etc. adhesive 8 to a substrate. For instance, the
adhesive 8 may flow through the extension 690 and up through the
applicator 620 to apply a bead of adhesive 8 onto the second
substrate 20. The applicator 620 may include a tip 621, which can
directly contact the second substrate 20 to apply the bead of
adhesive 8. Furthermore, the applicator 620 may be retractable. For
example, when the end effector 778 places the second, or top,
substrate 20 into a position of engagement with the adhesive
application valve 600, the applicator 620 may extend or protrude a
distance toward the second substrate 20 to apply a bead of adhesive
8, and then may retract back to its original position. The
applicator 620 may include an inner opening that can be in
communication with an inner opening in the base portion 640 and the
extension 690, which is ultimately in communication with a source
of adhesive 8. The inner openings of the applicator 620, the base
portion 640, and the extension 690 may be a flow path of the
adhesive 8 from an adhesive source (not shown) to the tip 621 of
the applicator 620. The inner openings, or the surfaces of the
inner openings defining a flow path may be coated in a material
that prevents or hinders adhesion of the adhesive to the surfaces
of the inner openings, such as linear polyoxymethylene acetal
resin, polyetherimide, and polytetrafluoroethylene; however, the
adhesive 8, especially in liquid form, tends to not adhere in an
adverse way to a stainless steel construction embodiment of the
adhesive application valve 600, in particular the inner surfaces of
the adhesive application valve 600, and no coating may be needed.
Furthermore, embodiments of the adhesive application valve 600 may
include an extension coupled to the base portion 640. The extension
690 may include a plurality of coupling members 691, 692, 693, 694,
and 695. The coupling member 691, 692, and 693 may be coupled to
various lines. Coupling members 691, 692, 692, 694 may be a coupled
to a line that communicated with a source of adhesive. The various
lines attached to the coupling members 691, 692, 693, 694 may be
somewhat flexible and/or bendable to accommodate for the versatile
movement of the adhesive application valve 600, and may also be
coated with linear polyoxymethylene acetal resin, polyetherimide,
and/or polytetrafluoroethylene. Coupling member 695 may couple the
extension 690 to the base portion 640 and the applicator 620.
Embodiments of the coupling members 691, 692, 693, 694, 695 may be
fluid couplings or similar coupling element that is resistant to
leaks and adhesion of the adhesive. Furthermore, having a plurality
of coupling members 691, 692, 693, 694 can allow multiple different
adhesives, or multiples sources of the same adhesive to accommodate
various applications and project requirements.
Referring now to FIGS. 1-35, a third method of optical bonding is
now described. Embodiments of the third method of optical bonding
may include the steps of dispensing a fill material 5 across a
surface of a first substrate 10 to achieve a largest fill height,
h, proximate a center portion 13 of the first substrate 10 and a
lowest fill height, h, proximate one or more corners 15 of the
first substrate 10, placing a second substrate 20 into contact with
the fill material 5 proximate the center portion 13 of the first
substrate 10, and controllably lowering the second substrate 20
onto the first substrate 10 until the second substrate 20 is bonded
to the first substrate 10 to prevent and eliminate air bubbles
between the first substrate 10 and second substrate 20. Embodiments
of the third method of optical bonding may be used in association
with system 100 or with system 1000.
Referring now to FIGS. 1-35, a fourth method of optical bonding is
now described. Embodiments of the fourth method of optical bonding
may include the steps of dispensing a fill material 5 across a
surface of the first substrate 10, applying an amount of adhesive 8
on a surface of a second substrate 20 configured to engage the fill
material 5 on the surface of the first substrate 10, and contacting
the adhesive 8 on the second substrate 20 with the fill material 5
on the first substrate 10 to optically bond the first substrate 10
and the second substrate 20. In embodiments of the fourth method of
optical bonding, the adhesive 8 of the second substrate 20 can
contact the fill material 5 of the first substrate 10 prior to
contact between the first substrate 10 and the second substrate 20.
Moreover, the step of dispensing the fill material 5 on the surface
of the first substrate 10 can achieve a largest fill height
proximate a center portion 13 of the first substrate 10, and a
lower fill height proximate the corners 15 of the first substrate
10. Embodiments of the step of contacting may include controllably
lowering, by an end effector 778 or robotic placement machine 200,
the second substrate 20 onto the first substrate 10 to facilitate
an initial engagement of the adhesive 8 and the fill material 5 to
prevent and eliminate air bubbles between the first and second
substrates 10, 20 when in a final, bonding engagement.
While this disclosure has been described in conjunction with the
specific embodiments outlined above, it is evident that many
alternatives, modifications and variations will be apparent to
those skilled in the art. Accordingly, the preferred embodiments of
the present disclosure as set forth above are intended to be
illustrative, not limiting. Various changes may be made without
departing from the spirit and scope of the invention, as required
by the following claims. The claims provide the scope of the
coverage of the invention and should not be limited to the specific
examples provided herein.
* * * * *