U.S. patent number 10,142,718 [Application Number 14/856,262] was granted by the patent office on 2018-11-27 for integrated temperature sensor in microphone package.
This patent grant is currently assigned to Invensense, Inc.. The grantee listed for this patent is INVENSENSE, INC.. Invention is credited to Baris Cagdaser, Kieran Harney, Aleksey S. Khenkin, Anthony D. Minervini.
United States Patent |
10,142,718 |
Minervini , et al. |
November 27, 2018 |
Integrated temperature sensor in microphone package
Abstract
Various embodiments provide for an integrated temperature sensor
and microphone package where the temperature sensor is located in,
over, or near an acoustic port associated with the microphone. This
placement of the temperature sensor near the acoustic port enables
the temperature sensor to more accurately determine the ambient air
temperature and reduces heat island interference cause by heat
associated with the integrated circuit. In an embodiment, the
temperature sensor can be a thermocouple formed over a substrate,
with the temperature sensing portion of the thermocouple formed
over the acoustic port. In another embodiment, the temperature
sensor can be formed on an application specific integrated circuit
that extends into or over the acoustic port. In another embodiment,
a thermally conductive channel in a substrate can be placed near
the acoustic port to enable the temperature sensor to determine the
ambient temperature via the channel.
Inventors: |
Minervini; Anthony D. (Palos
Hills, IL), Harney; Kieran (Andover, MA), Khenkin;
Aleksey S. (Nashua, NH), Cagdaser; Baris (Sunnyvale,
CA) |
Applicant: |
Name |
City |
State |
Country |
Type |
INVENSENSE, INC. |
San Jose |
CA |
US |
|
|
Assignee: |
Invensense, Inc. (San Jose,
CA)
|
Family
ID: |
55135508 |
Appl.
No.: |
14/856,262 |
Filed: |
September 16, 2015 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20160165330 A1 |
Jun 9, 2016 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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62087716 |
Dec 4, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H04R
1/028 (20130101); H04R 19/04 (20130101); G01K
13/00 (20130101); H04R 19/005 (20130101); B81B
7/0087 (20130101); B81B 2207/012 (20130101); B81B
2201/0257 (20130101); H04R 2231/00 (20130101); B81B
2201/0278 (20130101) |
Current International
Class: |
G01K
13/00 (20060101); G01K 1/14 (20060101); G01K
1/16 (20060101); H04R 19/04 (20060101); H04R
19/00 (20060101); H04R 1/02 (20060101) |
Field of
Search: |
;374/141,142,100 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1400149 |
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Mar 2004 |
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EP |
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8707723 |
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Dec 1987 |
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WO |
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WO 02099384 |
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Dec 2002 |
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WO |
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Other References
European Office Action for European Patent Application No.
15823848.5 dated Jul. 11, 2017, 2 pages. cited by applicant .
International Search Report and Written Opinion for International
Application No. PCT/US2015/063465 dated Jun. 7, 2016, 14 pages.
cited by applicant .
Office Action for European Application Serial No. 15823848.5 dated
Mar. 9, 2018, 5 pages. cited by applicant.
|
Primary Examiner: Verbitsky; Gail Kaplan
Attorney, Agent or Firm: Amin, Turocy & Watson, LLP
Parent Case Text
PRIORITY CLAIM
This patent application is a non-provisional application that
claims priority to U.S. Provisional Patent Application Ser. No.
62/087,716, filed on Dec. 4, 2014, entitled "INTEGRATED TEMPERATURE
SENSOR IN MICROPHONE PACKAGE" the entirety of which is incorporated
by reference herein.
Claims
What is claimed is:
1. A device, comprising: a microphone sensor coupled to a first
side of a substrate; an acoustic port in the substrate that exposes
a portion of the microphone sensor; and a temperature sensor
mounted on a second side of the substrate that overlays a portion
of the port.
2. The device of claim 1, wherein the substrate is a laminate lid
over the microphone sensor.
3. The device of claim 2, wherein the temperature sensor extends
over the acoustic port in the laminate lid.
4. The device of claim 1, wherein the temperature sensor is a
resistance thermometer.
5. The device of claim 1, wherein the temperature sensor is a
thermocouple.
6. The device of claim 1, wherein the microphone sensor is a
microelectromechanical systems sensor.
7. The device of claim 1, wherein the temperature sensor is
integrated onto an application specific integrated circuit that is
embedded into the substrate.
8. The device of claim 7, wherein a portion of the application
specific integrated circuit comprising the temperature sensor
extends into the acoustic port.
9. The device of claim 1, wherein the temperature sensor is
integrated onto an application specific integrated circuit, wherein
the application specific integrated circuit is disposed between the
substrate and the microphone sensor.
10. The device of claim 9, wherein the microphone sensor and the
application specific integrated circuit sensor form an integrated
die.
11. The device of claim 10, wherein a connection between the
integrated die and the substrate is a flip chip connection.
12. The device of claim 1, wherein a width of the temperature
sensor is between 75 and 100 microns.
13. A device, comprising: a microphone sensor coupled to a
substrate; an acoustic port in the substrate that exposes a portion
of the microphone sensor; an application specific integrated
circuit that is embedded into the substrate and wherein a portion
of the application specific integrated circuit extends into the
acoustic port; and a temperature sensor that is integrated into a
portion of the application specific integrated circuit that extends
into the acoustic port.
14. The device of claim 13, wherein the temperature sensor is a
resistance thermometer.
15. The device of claim 13, wherein the temperature sensor is a
thermocouple.
16. The device of claim 13, wherein the microphone sensor is a
microelectromechanical systems sensor.
17. The device of claim 13, wherein the application specific
integrated circuit is less thermally conductive than the
substrate.
18. A device, comprising: a microphone sensor mounted to a first
side of the application specific integrated circuit, wherein the
application specific integrated circuit has an aperture that
exposes a portion of the microphone sensor; a substrate that is
coupled to a second side of the application specific integrated
circuit, that has an acoustic port formed that exposes the
aperture; and a temperature sensor that is integrated into the
application specific integrated circuit, wherein the temperature
sensor overlays a portion of the acoustic port.
19. The device of claim 18, wherein the microphone sensor and the
application specific integrated circuit sensor form an integrated
die.
20. The device of claim 19, wherein a connection between the
integrated die and the substrate is a flip chip connection.
21. The device of claim 18, wherein the application specific
integrated circuit is less thermally conductive than the substrate.
Description
TECHNICAL FIELD
The subject disclosure relates to an integrated temperature sensor
and microphone package where the temperature sensor is placed in or
near an acoustic port to obtain ambient air temperature.
BACKGROUND
Integrated circuits can include temperature sensors to determine
the ambient temperature. The temperature can be recorded for many
reasons, including to calibrate certain functions on the integrated
circuit, determine environmental context as part of a sensor
package on the integrated circuit, and for many other reasons. The
accuracy of the recorded temperature is not only based on the
sensitivity and correct calibration of the temperature sensor, but
also in the placement of the temperature sensor. The temperatures
determined by the temperature sensors when the temperature sensors
are integrated into an integrated circuit can be based not just on
the ambient air temperature, but also on heat that may be
associated with the integrated circuit itself. Reducing this
miniature heat island effect can improve the accuracy and
sensitivity of the temperature sensors.
SUMMARY
The following presents a simplified summary of the specification to
provide a basic understanding of some aspects of the specification.
This summary is not an extensive overview of the specification. It
is intended to neither identify key or critical elements of the
specification nor delineate any scope particular to any embodiments
of the specification, or any scope of the claims. Its sole purpose
is to present some concepts of the specification in a simplified
form as a prelude to the more detailed description that is
presented layer.
In a non-limiting example, a device can comprise a microphone
sensor coupled to a substrate. The device can also include an
acoustic port in the substrate that exposes a portion of the
microphone sensor. The device can also include a temperature sensor
that overlays a portion of the port.
In another non-limiting example, a method for forming an integrated
temperature sensor can include providing a microphone sensor
coupled to a substrate. The method can also include forming a
laminate lid over the microphone sensor and forming a temperature
sensor on the laminate lid. The method can also include ablating
away a portion of the laminate lid over the microphone sensor to
form an acoustic port, wherein the etching does not etch away the
microphone sensor.
In yet another non-limiting example, a device can include a
substrate with an acoustic port and a microphone sensor coupled to
the substrate, wherein the microphone sensor is over the acoustic
port. The device can also include an application specific
integrated circuit adjacent to the microphone, wherein the
application specific integrated circuit is also coupled to the
substrate and comprises a temperature sensing area. The device can
also include a thermally conductive channel in the substrate
bordering the temperature sensing area of the application specific
integrated circuit.
The following description and the drawings contain certain
illustrative aspects of the specification. These aspects are
indicative, however, of but a few of the various ways in which the
principles of the specification may be employed. Other advantages
and novel features of the specification will become apparent from
the following detailed description of the specification when
considered in conjunction with the drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Numerous aspects, embodiments, objects and advantages of the
present invention will be apparent upon consideration of the
following detailed description, taken in conjunction with the
accompanying drawings, in which like reference characters refer to
like parts throughout, and in which:
FIG. 1 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a thermocouple sensor
over an acoustic port of a microphone according to various
non-limiting aspects of the subject disclosure;
FIG. 2 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a temperature sensor
on an application specific integrated circuit embedded in a
substrate according to various non-limiting aspects of the subject
disclosure;
FIG. 3 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a temperature sensor
on an application specific integrated circuit that forms part of an
integrated die according to various non-limiting aspects of the
subject disclosure;
FIG. 4 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a thermally
conductive channel in a substrate according to various non-limiting
aspects of the subject disclosure;
FIG. 5 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a thermally
conductive channel in a substrate according to various non-limiting
aspects of the subject disclosure;
FIG. 6 depicts a non-limiting schematic diagram of an exemplary
integrated sensor and microphone package with a thermally
conductive channel with an air port according to various
non-limiting aspects of the subject disclosure; and
FIG. 7 depicts an exemplary flowchart of non-limiting methods
associated with a forming an integrated sensor and microphone
package according to various non-limiting aspects of the disclosed
subject matter.
DETAILED DESCRIPTION
Overview
While a brief overview is provided, certain aspects of the subject
disclosure are described or depicted herein for the purposes of
illustration and not limitation. Thus, variations of the disclosed
embodiments as suggested by the disclosed apparatuses, systems and
methodologies are intended to be encompassed within the scope of
the subject matter disclosed herein. For example, the various
embodiments of the apparatuses, techniques and methods of the
subject disclosure are described in the context of MEMS sensors.
However, as further detailed below, various exemplary
implementations can be applied to other areas of application
specific integrated circuit board that perform analog to digital
and digital to analog conversion of low amplitude signals, without
departing from the subject matter described herein.
As used herein, the terms MEMS sensor, MEMS accelerometer, MEMS
gyroscope, MEMS inertial sensor, MEMS acoustic sensor(s), MEMS
audio sensor(s), and the like are used interchangeably unless
context warrants a particular distinction among such terms. For
instance, the terms can refer to MEMS devices or components that
can measure acceleration, rate of rotation, a proximity, determine
acoustic characteristics, generate acoustic signals, or the
like.
Additionally, terms such as "at the same time," "common time,"
"simultaneous," "simultaneously," "concurrently," "substantially
simultaneously," "immediate," and the like are employed
interchangeably throughout, unless context warrants particular
distinctions among the terms. It should be appreciated that such
terms can refer to times relative to each other and may not refer
to an exactly simultaneously action(s). For example, system
limitations (e.g., download speed, processor speed, memory access
speed, etc.) can account for delays or unsynchronized actions. In
other embodiments, such terms can refer to acts or actions
occurring within a period that does not exceed a defined threshold
amount of time.
Various embodiments provide for an integrated temperature sensor
and microphone package where the temperature sensor is located in,
over, or near an acoustic port associated with the microphone. This
placement of the temperature sensor near the acoustic port enables
the temperature sensor to more accurately determine the ambient air
temperature and reduces heat island interference cause by heat
associated with the integrated circuit. In an embodiment, the
temperature sensor can be a thermocouple formed over a substrate,
with the temperature sensing portion of the thermocouple formed
over the acoustic port. In another embodiment, the temperature
sensor can be formed on an application specific integrated circuit
that extends into or over the acoustic port. In another embodiment,
a thermally conductive channel in a substrate can be placed near
the acoustic port to enable the temperature sensor to determine the
ambient temperature via the channel.
Various other configurations or arrangements are described herein.
It is noted that the various embodiments can include other
components and/or functionality. It is further noted that the
various embodiments can be included in larger systems, including,
smart televisions, smart phones or other cellular phones, wearables
(e.g., watches, headphones, etc.), tablet computers, electronic
reader devices (i.e., e-readers), laptop computers, desktop
computers, monitors, digital recording devices, appliances, home
electronics, handheld gaming devices, remote controllers (e.g.,
video game controllers, television controllers, etc.), automotive
devices, personal electronic equipment, medical devices, industrial
systems, cameras, and various other devices or fields.
Exemplary Embodiments
Various aspects or features of the subject disclosure are described
with reference to the drawings, wherein like reference numerals are
used to refer to like elements throughout. In this specification,
numerous specific details are set forth in order to provide a
thorough understanding of the subject disclosure. It should be
understood, however, that the certain aspects of disclosure may be
practiced without these specific details, or with other methods,
components, parameters, etc. In other instances, well-known
structures and devices are shown in block diagram form to
facilitate description and illustration of the various
embodiments.
FIG. 1 illustrates an exemplary integrated sensor and microphone
package 100 with a thermocouple sensor over an acoustic port of a
microphone according to various non-limiting aspects of the subject
disclosure.
In the embodiment shown in FIG. 1, a surface 102 of a integrated
sensor and microphone package 100 can have an acoustic port 104
which facilitates the microphone 114 in the microphone package 100
to sense sound waves. Formed over the acoustic port 104 can be a
thermocouple 106 that has thermocouple terminals 110 and 112 formed
on the surface 102. A temperature sensing portion 108 of the
thermocouple (where the two dissimilar metals form a junction) can
be formed such that it is over the acoustic port. This
configuration allows the temperature sensing portion 108 of the
thermocouple 106 to be in freespace and/or an open area over the
acoustic port and can facilitate an accurate and sensitive
temperature reading without being affected by the thermal mass of
the microphone package 100. In other embodiments, the thermocouple
junction 108 could be placed next to the acoustic port 104 without
spanning the port 104.
In the embodiment shown in FIG. 1, a thermocouple is used to detect
temperature. A thermocouple is a device consisting of two
dissimilar conductors or semiconductors that contact each other at
one or more points. A thermocouple produces a voltage when the
temperature of one of the contact points differs from the
temperature of another, in a process known as the thermoelectric
effect. In other embodiments, other types of temperature sensing
devices can be utilized including resistance thermometers, where
the resistance thermometer is a single homogenous metal alloy that
has a very high temperature coefficient of resistance. When the
temperature changes, the resistance changes which can be measured
to determine changes in temperature.
The surface 102 can be an end of a substrate in which an integrated
circuit comprising the microphone 114 is formed. The acoustic port
104 can thus be formed in the substrate to expose the microphone
114. In other embodiments, the surface 102 can be a laminate lid
formed over the microphone 114. The thermocouple 106 can be formed
on top of the lid after the acoustic port 104 is formed in some
embodiments. In other embodiments, the thermocouple 106 can be
formed in or on the substrate or lid, and then the acoustic port
106 can be formed around the thermocouple 106. In an embodiment,
the acoustic aperture 106 can be formed by laser ablation where the
laser is selected to only ablate the laminate materials forming the
surface 102. This ablation can leave a wire comprising the
thermocouple 106 suspended over the acoustic aperture 104.
In an embodiment, the microphone 114 in the microphone package 100
can be a MEMs microphone. Additionally, in an embodiment, a
thickness of the thermocouple 106 wires can be between 75 and 100
microns in order to minimize the impact on the audio sensitivity
and microphone performance.
Turning now to FIG. 2, illustrated is a non-limiting schematic
diagram of an exemplary integrated sensor and microphone package
200 with a temperature sensor on an application specific integrated
circuit embedded in a substrate according to various non-limiting
aspects of the subject disclosure. In the embodiment shown in FIG.
2, a temperature sensor 212 can be formed on an application
specific integrated circuit 208 that is embedded in a substrate
202. The MEMs microphone sensor 206 can be formed on the substrate
202, with an acoustic port 210 formed in the substrate 202. A lid
or cover 204 can be formed over the MEMs microphone 206 and the
substrate 202.
In an embodiment, the temperature sensing portion 212 can be formed
on the top or bottom of the ASIC 208 (i.e., the near or far side of
the ASIC 208 relative to the MEMs microphone 206. In an embodiment,
the area of the ASIC 208 near the temperature sensor 212 can be
thermally conductive. In some embodiments, portions of the ASIC 208
that are embedded in the substrate 202 can be selected to be
relatively less thermally conductive so that heat from the
substrate 202 does not conduct through the ASIC 208 to affect the
temperature measurements by the temperature sensing portion 212 of
the ASIC 208.
The ASIC 208 can be formed or embedded in the substrate 202 during
formation of the substrate 202, and then the acoustic port 210 can
be formed via laser ablation or etching of the substrate 202,
leaving the ASIC 208 and the temperature sensor 212 exposed in the
acoustic port 210. The materials forming the substrate 202 can be
selected to facilitate etching and/or ablation of the substrate
material to expose the ASIC.
In an embodiment, the temperature sensing portion 212 can be a
thermocouple. In other embodiments, other types of temperature
sensing devices can be utilized including resistance thermometers,
where the resistance thermometer is a single homogenous metal alloy
that has a very high temperature coefficient of resistance. When
the temperature changes, the resistance changes which can be
measured to determine changes in temperature. In other embodiments,
other types of temperature sensors such as thermostats and/or
thermistors.
Turning now to FIG. 3, illustrated is a non-limiting schematic
diagram of an exemplary integrated sensor and microphone package
with a temperature sensor on an application specific integrated
circuit that forms part of an integrated die according to various
non-limiting aspects of the subject disclosure.
In an embodiment, a temperature sensing area 312 of an application
specific integrated circuit 306 can be formed on a substrate 302 of
an integrated die. Instead of the ASIC 306 being embedded into the
substrate 302 (as shown in FIG. 2) the ASIC 306 can form a part of
an integrated die with the microphone 308, and a aperture can be
formed in the ASIC 306 congruent with the acoustic port 310 in the
substrate 302 to facilitate the microphone functionality. The
temperature sensor 312 that is integrated into the circuitry of the
ASIC 306 can be formed on either the top or the bottom of the ASIC
306 relative to the microphone and substrate in various
embodiments.
In an embodiment, the microphone 308 and the ASIC 306 can be part
of an integrated die, and in some embodiments, the microphone 308
can have a flip-chip connection to the ASIC 306 which can also have
a flip-chip connection to the substrate 302. A lid 304 can be
formed over the package 300.
Turning now to FIG. 4, depicted is a non-limiting schematic diagram
of an exemplary integrated sensor and microphone package 400 with a
thermally conductive channel in a substrate according to various
non-limiting aspects of the subject disclosure. The thermally
conductive channel 412 can be formed in the substrate 402 to
facilitate the temperature sensing portion on the ASIC 408 to
accurately detect the ambient air temperature even without being
exposed to the air. The thermally conductive channel 412 can
equalize in temperature to the ambient temperature of the
surroundings, and then be coupled to a contact 414 of the ASIC 408
that is flip-chip mounted to the substrate 402. The temperature
sensing portion of the ASIC 408 can be located adjacent to or near
to the contact point 414. The ASIC 408 can be mounted next to a
microphone 406 that is mounted over an acoustic port 410. A lid 404
can be formed over the package 400.
In an embodiment, the thermally conductive channel 412 can be
formed from copper or another material that has low thermal
resistance in order to quickly equalize in temperature with the
surroundings.
Turning now to FIG. 5, illustrated is a non-limiting schematic
diagram of an exemplary integrated sensor and microphone package
500 with a thermally conductive channel in a substrate according to
various non-limiting aspects of the subject disclosure
The embodiment shown in FIG. 5 is a variation of the embodiment
shown in FIG. 4. In FIG. 5, the thermally conductive channel 512
can be formed in the substrate 502 to facilitate the temperature
sensing portion on the ASIC 508 to accurately detect the ambient
air temperature even without being exposed to the air. The
thermally conductive channel 512 can equalize in temperature to the
ambient temperature of the surroundings, and then be coupled to a
contact 514 of the ASIC 508 that is flip-chip mounted to the
substrate 502. The temperature sensing portion of the ASIC 508 can
be located adjacent to or near to the contact point 514. The ASIC
508 can be mounted next to a microphone 506 that is mounted over an
acoustic port 510. A lid 504 can be formed over the package
500.
In an embodiment, the thermally conductive channel 512 can be
formed from copper or another material that has low thermal
resistance in order to quickly equalize in temperature with the
surroundings. An airgap 516 can also be formed around the thermally
conductive channel 512 in order to further insulate the thermally
conductive channel from the heat sink substrate 502. Thus the
thermally conductive channel can be thermally and electrically
isolated from the substrate 502 further improving the accuracy and
sensitivity of temperature measurements by the temperature sensor
on the ASIC 508. The thermally conductive channel 512 can be a via
that is formed in the substrate and then the area around the via
can be ablated away. This ablation can remove organic material
(that which usually constitutes substrates based on PCB
manufacturing).
Turning now to FIG. 6, illustrated is a non-limiting schematic
diagram of an exemplary integrated sensor and microphone package
600 with a thermally conductive channel with an air port according
to various non-limiting aspects of the subject disclosure.
The embodiment shown in FIG. 6 is a variation of the embodiment
shown in FIG. 5. In FIG. 6, the thermally conductive channel 612
can be formed in the substrate 602 to facilitate the temperature
sensing portion on the ASIC 608 to accurately detect the ambient
air temperature even without being exposed to the air. The
thermally conductive channel 612 can equalize in temperature to the
ambient temperature of the surroundings, and then be coupled to a
contact 614 of the ASIC 608 that is flip-chip mounted to the
substrate 602. The temperature sensing portion of the ASIC 608 can
be located adjacent to or near to the contact point 614. The ASIC
608 can be mounted next to a microphone 606 that is mounted over an
acoustic port 610. A lid 604 can be formed over the package 600.
The acoustic port 610 can be formed such that a portion of the
acoustic port extends over to the thermally conductive channel
612.
Exemplary Methods
In view of the subject matter described supra, methods that can be
implemented in accordance with the subject disclosure will be
better appreciated with reference to the flowchart of FIG. 7. While
for purposes of simplicity of explanation, the methods are shown
and described as a series of blocks, it is to be understood and
appreciated that such illustrations or corresponding descriptions
are not limited by the order of the blocks, as some blocks may
occur in different orders and/or concurrently with other blocks
from what is depicted and described herein. Any non-sequential, or
branched, flow illustrated via a flowchart should be understood to
indicate that various other branches, flow paths, and orders of the
blocks, can be implemented which achieve the same or a similar
result. Moreover, not all illustrated blocks may be required to
implement the methods described hereinafter.
FIG. 7 depicts an exemplary flowchart of a non-limiting method 700
associated with a forming an integrated sensor and microphone
package according to various non-limiting aspects of the disclosed
subject matter. As a non-limiting example, exemplary method 700 can
facilitate forming an integrated sensor and microphone package. The
method 700 can start at 702 where the method includes providing a
microphone sensor coupled to a substrate. The microphone sensor can
be a MEMs microphone in some embodiments, and in some embodiments
can be flip-chip attached to the substrate. In other embodiments,
the MEMs microphone can be mounted (e.g., flip-chipped) to an ASIC
that is mounted to the substrate. In other embodiments, the ASIC
can be embedded into the substrate.
At 704, the method includes forming a laminate lid over the
microphone sensor. The laminate lid can be formed from materials
that make the laminate lid susceptible to laser ablation or
etching.
At 706, the method includes forming a temperature sensor on the
laminate lid. In an embodiment, the temperature sensor can be a
thermocouple. In other embodiments, other types of temperature
sensing devices can be utilized including resistance thermometers,
where the resistance thermometer is a single homogenous metal alloy
that has a very high temperature coefficient of resistance. When
the temperature changes, the resistance changes which can be
measured to determine changes in temperature. In other embodiments,
other types of temperature sensors such as thermostats and/or
thermistors.
At step, 708, the method includes ablating away a portion of the
laminate lid over the microphone sensor to form an acoustic port,
wherein the etching does not etch away the microphone sensor or the
temperature sensor.
It is to be appreciated that various components described herein
can include electrical circuit(s) that can include components and
circuitry elements of suitable value in order to implement the
embodiments of the subject innovation(s). Furthermore, it can be
appreciated that many of the various components can be implemented
on one or more integrated circuit (IC) chips. For example, in one
embodiment, a set of components can be implemented in a single IC
chip. In other embodiments, one or more of respective components
are fabricated or implemented on separate IC chips.
What has been described above includes examples of the embodiments
of the present disclosure. It is, of course, not possible to
describe every conceivable combination of components or
methodologies for purposes of describing the claimed subject
matter, but it is to be appreciated that many further combinations
and permutations of the subject innovation are possible.
Accordingly, the claimed subject matter is intended to embrace all
such alterations, modifications, and variations that fall within
the spirit and scope of the appended claims. Moreover, the above
description of illustrated embodiments of the subject disclosure,
including what is described in the Abstract, is not intended to be
exhaustive or to limit the disclosed embodiments to the precise
forms disclosed. While specific embodiments and examples are
described herein for illustrative purposes, various modifications
are possible that are considered within the scope of such
embodiments and examples, as those skilled in the relevant art can
recognize. Moreover, use of the term "an embodiment" or "one
embodiment" throughout is not intended to mean the same embodiment
unless specifically described as such.
In particular and in regard to the various functions performed by
the above described components, devices, circuits, systems and the
like, the terms used to describe such components are intended to
correspond, unless otherwise indicated, to any component which
performs the specified function of the described component (e.g., a
functional equivalent), even though not structurally equivalent to
the disclosed structure, which performs the function in the herein
illustrated exemplary aspects of the claimed subject matter. In
this regard, it will also be recognized that the innovation
includes a system as well as a computer-readable storage medium
having computer-executable instructions for performing the acts
and/or events of the various methods of the claimed subject
matter.
The aforementioned diagrams/systems/circuits/modules have been
described with respect to interaction between several
components/blocks. It can be appreciated that such systems/circuits
and components/blocks can include those components or specified
sub-components, some of the specified components or sub-components,
and/or additional components, and according to various permutations
and combinations of the foregoing. Sub-components can also be
implemented as components communicatively coupled to other
components rather than included within parent components
(hierarchical). Additionally, it should be noted that one or more
components may be combined into a single component providing
aggregate functionality or divided into several separate
sub-components, and any one or more middle layers, such as a
management layer, may be provided to communicatively couple to such
sub-components in order to provide integrated functionality. Any
components described herein may also interact with one or more
other components not specifically described herein but known by
those of skill in the art.
In addition, while a particular feature of the subject innovation
may have been disclosed with respect to only one of several
implementations, such feature may be combined with one or more
other features of the other implementations as may be desired and
advantageous for any given or particular application. Furthermore,
to the extent that the terms "includes," "including," "has,"
"contains," variants thereof, and other similar words are used in
either the detailed description or the claims, these terms are
intended to be inclusive in a manner similar to the term
"comprising" as an open transition word without precluding any
additional or other elements.
As used in this application, the terms "component," "module,"
"system," or the like are generally intended to refer to a
computer-related entity, either hardware (e.g., a circuit), a
combination of hardware and software, software, or an entity
related to an operational machine with one or more specific
functionalities. For example, a component may be, but is not
limited to being, a process running on a processor (e.g., digital
signal processor), a processor, an object, an executable, a thread
of execution, a program, and/or a computer. By way of illustration,
both an application running on a controller and the controller can
be a component. One or more components may reside within a process
and/or thread of execution and a component may be localized on one
computer and/or distributed between two or more computers. Further,
a "device" can come in the form of specially designed hardware;
generalized hardware made specialized by the execution of software
thereon that enables the hardware to perform specific function;
software stored on a computer readable medium; or a combination
thereof.
Moreover, the words "example" or "exemplary" are used herein to
mean serving as an example, instance, or illustration. Any aspect
or design described herein as "exemplary" is not necessarily to be
construed as preferred or advantageous over other aspects or
designs. Rather, use of the words "example" or "exemplary" is
intended to present concepts in a concrete fashion. As used in this
application, the term "or" is intended to mean an inclusive "or"
rather than an exclusive "or". That is, unless specified otherwise,
or clear from context, "X employs A or B" is intended to mean any
of the natural inclusive permutations. That is, if X employs A; X
employs B; or X employs both A and B, then "X employs A or B" is
satisfied under any of the foregoing instances. In addition, the
articles "a" and "an" as used in this application and the appended
claims should generally be construed to mean "one or more" unless
specified otherwise or clear from context to be directed to a
singular form.
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