U.S. patent number 10,137,826 [Application Number 15/813,202] was granted by the patent office on 2018-11-27 for photoluminescent vehicle appliques.
This patent grant is currently assigned to Ford Global Technologies, LLC. The grantee listed for this patent is Ford Global Technologies, LLC. Invention is credited to Paul Kenneth Dellock, Aaron Bradley Johnson, Talat Karmo, Michael Musleh, Stuart C. Salter.
United States Patent |
10,137,826 |
Dellock , et al. |
November 27, 2018 |
Photoluminescent vehicle appliques
Abstract
A vehicle applique is provided that includes a decorative layer
and an over-mold positioned over the decorative layer. The
over-mold is substantially transparent. A light conversion layer is
positioned on an opposite side of the decorative layer from the
over-mold and configured to convert ambient illumination. A
reflective layer is configured to convert ambient illumination. A
reflective layer is configured to reflect light into the light
conversion layer.
Inventors: |
Dellock; Paul Kenneth
(Northville, MI), Salter; Stuart C. (White Lake, MI),
Johnson; Aaron Bradley (Allen Park, MI), Karmo; Talat
(Waterford, MI), Musleh; Michael (Canton, MI) |
Applicant: |
Name |
City |
State |
Country |
Type |
Ford Global Technologies, LLC |
Dearborn |
MI |
US |
|
|
Assignee: |
Ford Global Technologies, LLC
(Dearborn, MI)
|
Family
ID: |
59580672 |
Appl.
No.: |
15/813,202 |
Filed: |
November 15, 2017 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20180079354 A1 |
Mar 22, 2018 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
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15196482 |
Jun 29, 2016 |
9855888 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
F21K
2/005 (20130101); B60Q 3/14 (20170201); B60Q
1/28 (20130101); B60Q 3/275 (20170201); F21V
13/08 (20130101); B60Q 1/2661 (20130101); F21S
43/16 (20180101); F21S 43/37 (20180101); H05B
33/22 (20130101); B60Q 3/20 (20170201); B60Q
3/267 (20170201); B60Q 3/60 (20170201); F21S
43/245 (20180101); F21S 43/33 (20180101); B60Q
2500/10 (20130101); B60R 13/04 (20130101); F21W
2104/00 (20180101) |
Current International
Class: |
F21S
43/00 (20180101); F21K 2/00 (20060101); B60Q
3/60 (20170101); B60Q 3/20 (20170101); B60Q
1/28 (20060101); H05B 33/22 (20060101); F21S
43/245 (20180101); F21V 13/08 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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4120677 |
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JP |
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WO |
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May 2014 |
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WO |
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2014161927 |
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Oct 2014 |
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WO |
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Primary Examiner: Raleigh; Donald
Attorney, Agent or Firm: Rogers; Jason Price Heneveld
LLP
Parent Case Text
CROSS-REFERENCE TO RELATED APPLICATION
The present application is a divisional of U.S. patent application
Ser. No. 15/196,482, filed Jun. 29, 2016, and entitled
PHOTOLUMINESCENT VEHICLE APPLIQUES, now U.S. Pat. No. 9,855,888,
the entire disclosure of which is hereby incorporated herein by
reference.
Claims
What is claimed is:
1. A vehicle applique, comprising: a decorative layer; an over-mold
positioned over the decorative layer, the over-mold being
substantially transparent; a light conversion layer positioned on
an opposite side of the decorative layer from the over-mold and
configured to convert ambient illumination; and a reflective layer
configured to reflect light into the light conversion layer.
2. The vehicle applique of claim 1, wherein the over-mold comprises
silicone.
3. The vehicle applique of claim 1, wherein the reflective layer
comprises TiO.sub.2.
4. The vehicle applique of claim 3, further comprising: an adhesive
layer positioned on an opposite side of the reflective layer than
the light conversion layer.
5. The vehicle applique of claim 1, wherein the light conversion
layer comprises a plurality of quantum dots.
6. The vehicle applique of claim 5, wherein the plurality of
quantum dots are suspended in polymethylmethacrylate.
7. The vehicle applique of claim 1, wherein the decorative layer is
configured to be at least partially transmissive.
8. A vehicle, comprising: a grille; an applique positioned on the
grille comprising: a decorative layer; a light conversion layer
positioned on the decorative layer; a reflective layer configured
to reflect light into the light conversion layer; and a light
source positioned proximate the applique configured to emit light
onto the applique, wherein the light conversion layer is configured
to be excited by the light from the light source.
9. The vehicle of claim 8, wherein the light conversion layer is
configured to emit light through the decorative layer in response
to excitation by the light from the light source.
10. The vehicle of claim 8, wherein the decorative layer is
configured to be at least partially transmissive.
11. The vehicle of claim 8, wherein the light conversion layer
comprises a plurality of quantum dots.
12. The vehicle of claim 8, further comprising: an over-mold
comprising silicone.
13. The vehicle of claim 8, wherein the decorative layer comprises
a vacuumized metal.
14. A vehicle, comprising: a surface of the vehicle; an applique
positioned on the surface comprising: a decorative layer; a light
conversion layer positioned on the decorative layer; and a light
source positioned on an opposite side of the light conversion layer
from the decorative layer, the light source configured to emit
light having a wavelength less than about 800 nm into the light
conversion layer; and a light sensor configured to detect a light
output from the light conversion layer and activate the light
source when the light output drops below a predetermined
threshold.
15. The vehicle of claim 14, further comprising: an adhesive layer
positioned between the light source and the surface.
16. The vehicle of claim 15, wherein the surface is an exterior
surface and is located on a grille.
17. The vehicle of claim 14, wherein the decorative layer is
configured to be at least partially transmissive.
18. The vehicle of claim 14, wherein the light conversion layer is
configured to emit light having a wavelength greater than about 400
nm in response to excitation by the light from the light
source.
19. The vehicle of claim 18, wherein the light conversion layer
comprises a plurality of quantum dots.
20. The vehicle of claim 19, further comprising: an over-mold
positioned over the decorative layer.
Description
FIELD OF THE INVENTION
The present disclosure generally relates to vehicle appliques, and
more particularly, to lighting systems and appliques for automotive
vehicles having photoluminescent features.
BACKGROUND OF THE INVENTION
Illumination systems used in vehicles may offer a unique and
attractive viewing experience. It is therefore desired to
incorporate such illumination systems in portions of vehicles to
provide accent and functional lighting.
SUMMARY OF THE INVENTION
According to one aspect of the present invention, a vehicle
applique is provided that includes a decorative layer and an
over-mold positioned over the decorative layer. The over-mold is
substantially transparent. A light conversion layer is positioned
on an opposite side of the decorative layer from the over-mold and
configured to convert ambient illumination. A reflective layer is
configured to convert ambient illumination. A reflective layer is
configured to reflect light into the light conversion layer.
According to another aspect of the present invention, a vehicle is
provided that includes a grille defining a surface. An applique is
positioned on the grille. The applique includes a decorative layer.
A light conversion layer is positioned on the decorative layer. A
reflective layer is configured to reflect light into the light
conversion layer. A light source positioned proximate the applique
is configured to emit light onto the applique. The light conversion
layer is configured to be excited by the light from the light
source.
According to yet another aspect of the present invention, a vehicle
is provided that includes a surface of the vehicle and an applique
positioned on the surface. The applique includes a decorative
layer. A light conversion layer is positioned on the decorative
layer. A light source is positioned on an opposite side of the
light conversion layer from the decorative layer. The light source
is configured to emit light having a wavelength less than about 800
nm into the light conversion layer.
These and other aspects, objects, and features of the present
invention will be understood and appreciated by those skilled in
the art upon studying the following specification, claims, and
appended drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
In the drawings:
FIG. 1 is front perspective view of a vehicle having an exterior
applique, according to one embodiment;
FIG. 2 is a perspective view of an interior of a vehicle having an
applique, according to another embodiment;
FIG. 3 is a cross-sectional view of the applique taken at line III
of FIG. 1, according to one embodiment;
FIG. 4A is a cross-sectional view of the applique taken at line IVA
of FIG. 1, illustrating a light assembly according to one
embodiment;
FIG. 4B is a cross-sectional view of the applique taken at line IVB
of FIG. 1, further illustrating the light assembly, according to
one embodiment;
FIG. 4C is a cross-sectional view of the applique taken at line IVC
of FIG. 1, illustrating an alternate light assembly, according to
one embodiment;
FIG. 4D is a cross-sectional view of the applique taken at line IVD
of FIG. 1, illustrating a light assembly having a luminescent
structure separated by light transmissive portions disposed on the
light source, according to another embodiment;
FIG. 4E is a cross-sectional view of the applique taken at line IVE
of FIG. 1, illustrating an alternate light source having a
luminescent structure disposed on the light source configured to
convert a portion of light emitted from the light source from a
first wavelength to a second wavelength, according to one
embodiment; and
FIG. 5 is a block diagram of the vehicle and the lighting
system.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Additional features and advantages of the invention will be set
forth in the detailed description which follows and will be
apparent to those skilled in the art from the description or
recognized by practicing the invention as described in the
following description together with the claims and appended
drawings.
As used herein, the term "and/or," when used in a list of two or
more items, means that any one of the listed items can be employed
by itself, or any combination of two or more of the listed items,
can be employed. For example, if a composition is described as
containing components A, B, and/or C, the composition can contain A
alone; B alone; C alone; A and B in combination; A and C in
combination; B and C in combination; or A, B, and C in
combination.
In this document, relational terms, such as first and second, top
and bottom, and the like, are used solely to distinguish one entity
or action from another entity or action, without necessarily
requiring or implying any actual such relationship or order between
such entities or actions. The terms "comprises," "comprising," or
any other variation thereof, are intended to cover a non-exclusive
inclusion, such that a process, method, article, or apparatus that
comprises a list of elements does not include only those elements
but may include other elements not expressly listed or inherent to
such process, method, article, or apparatus. An element proceeded
by "comprises . . . a" does not, without more constraints, preclude
the existence of additional identical elements in the process,
method, article, or apparatus that comprises the element.
Referring now to FIGS. 1-5, reference numeral 10 generally
designates a vehicle having an applique 14. The applique 14
includes a decorative layer 18 and an over-mold 22 positioned over
the decorative layer 18. A semiconductor layer 26 is positioned on
an opposite side of the decorative layer 18 from the over-mold 22.
The semiconductor layer 26 is configured to emit light through the
decorative layer 18.
Referring now to FIGS. 1 and 2, the applique 14 may be positioned
in a variety of locations on the exterior and interior of the
vehicle 10. For example, the applique 14 may be positioned on an
exterior body panel of the vehicle 10 (FIG. 1). In the depicted
embodiment, the exterior body panel is a grille 30. It will be
understood that the applique 14 may be positioned in one, or a
plurality, of locations along exterior and interior body panels of
the vehicle 10. For example, the applique 14 may be positioned on
fenders 34, exterior mirrors 36, bumpers 38 or other locations
around the exterior of the vehicle 10. The grille 30 may define a
mesh 30A and a trim 30B on which the applique 14 may be applied.
According to various embodiments, the applique 14 may be configured
to illuminate. In such embodiments, a light sensor 42 may be
positioned proximate the applique 14 (e.g., on or around the grille
30) to monitor the light emitted from the applique 14. In interior
embodiments, the applique 14 may be applied to a vehicle interior
trim piece 40 (FIG. 2). The interior trim pieces 40 may be
positioned around air vents, door handles, the steering wheel,
infotainment screens and other locations within the vehicle 10.
Referring now to the depicted embodiment of FIG. 3, the applique 14
may be a layered structure including the over-mold 22, the
decorative layer 18, a first adhesive layer 44, the semiconductor
layer 26, a second adhesive layer 46, a reflective layer 50 and a
securement layer 54. The decorative layer 18 may define an
indicium. The decorative layer 18 may be embossed, textured,
engraved, or otherwise modified in thickness to produce the
indicium. The indicium may be raised or lowered relative to the
rest of the decorative layer 18. The indicium may include a symbol,
alpha numeric text, a picture, a number, or a combination thereof.
The decorative layer 18 may define one or more discrete indicium
(e.g., multiple separate indicia spaced across the decorative layer
18). The decorative layer 18 may be a polymeric material, a metal,
or combinations thereof. In some examples, the decorative layer 18
may be a metal or metallic foil. In metallic examples of the
decorative layer 18, the decorative layer 18 may have a luster or
shine configured to reflect light. In polymeric examples of the
decorative layer 18, the decorative layer 18 may have a vacuumized
metal surface configured to reflect light. In some embodiments, the
decorative layer 18 includes a plastic substrate 18B with a
vacuumized metal 18A that may both reflect and transmit light. In
such embodiments, the decorative layer 18 may transmit greater than
10%, 20%, 30%, 40%, 50%, 60%, 70%, 80% or 90% of light while
reflecting the rest. The decorative layer 18 may be painted, or
otherwise colored or dyed, to produce aesthetically pleasing
colors. Additionally or alternatively, the decorative layer 18 may
provide a textured appearance to the applique 14. For example, the
decorative layer 18 may appear as wood grain, brushed metal (e.g.,
aluminum and/or nickel), leather, vinyl, or other textured
appearances which may be aesthetically pleasing.
Positioned on, over and/or across the decorative layer 18 is the
over-mold 22. The over-mold 22 may define a first or exterior
surface 22A. The over-mold 22 may have a transparency to light in a
visible spectrum (e.g., about 400 nm to about 700 nm) of greater
than about 50%, 60%, 70%, 80%, 90% or 99%. The over-mold 22 may be
composed of silicone, polyisoprene, polybutadiene, chloroprene,
butyl rubber, nitrile rubber, fluorosilicate, fluoroelastomers,
ethylene vinyl acetate, other soft polymeric materials and/or
combinations thereof. The over-mold 22 may have a thickness, or
greatest diameter, of between about 0.01 mm to about 10.0 mm, or
between about 0.25 mm to about 0.5 mm. In silicone examples, the
over-mold 22 may have a density of about 1150 kg/m.sup.2. Use of
the over-mold 22 may allow for the dampening or reduction of
acoustic energy through the applique 14. For example, use of the
over-mold 22 on the interior or exterior vehicle component may
allow for an acoustic power reduction through the applique 14 of
greater than about 1 dB, 5 dB, 10 dB, or greater than 20 dB. As
such, the over-mold 22 may dampen or otherwise reduce vibrations
and rattle of the vehicle component to which it is applied. In some
examples, the over-mold 22 may include a colorant (e.g., to color
or filter the light passing through or being reflected off of the
applique 14), an ultra violet inhibitor or blocker (e.g., a
hindered amine or benzoyl), or infrared blocking material (e.g.,
aluminosilicates and/or metal oxides). Further, use of the
over-mold 22 provides a protective layer to the applique 14 and/or
the interior or exterior surface to which the applique 14 is
applied. The over-mold 22 may create a slick and hydrophobic
surface which may repel rain, oils, road grime, or other
contaminants found in and around the exterior of the vehicle 10
which will allow the applique 14 to stay cleaner. The over-mold 22
may have a viscoelasticity (i.e., having both viscosity and
elasticity), a low Young's modulus, and/or a high failure strain
compared with other materials, so that the over-mold 22 may protect
the applique 14 and/or vehicle 10 when contact is made thereto
(i.e., to prevent scratches, protect against impact, reduce
vibration, etc.). Further, the viscoelasticity, low Young's
modulus, and/or a high failure strain may provide a soft, elegant
feel to the applique 14 which may make it pleasing to touch or
feel.
The over-mold 22 may define one or more textures (e.g., an exterior
surface) on the exterior surface 22A. For example, the exterior
surface 22A may define a leather, wood grain, smooth, abrasive
texture and/or other texture. Such a textured surface may provide
the "feel" the appearance of the decorative layer 18 provides. For
example, if the decorative layer 18 visually provides a leather
appearance, the texture of the over-mold 22 may have a leather
texture (e.g., grains and ridges) such that a user of the applique
14 receives the expected tactile stimulation from the over-mold 22
as they expect from the appearance of the applique 14. It will be
understood that the appearance and tactile stimulation provided may
differ from one another without departing from the teachings
provided herein.
The over-mold 22 may be formed by over-molding the decorative layer
18 and/or semiconductor layer 26 using a liquid polymer. The
over-molding liquid polymer may have a viscosity of less than about
2000 pas, less than about 1000 pas, or less than about 100 pas when
over-molded onto the decorative layer 18 and/or semiconductor layer
26. Preferably, forming the over-mold 26 is performed using an
injection molding process. The liquid polymer may then be
solidified to form the over-mold 22. The exterior surface 22A of
the over-mold 22 may have a generally curved shape, or may have a
square, rectangular, polygonal, undulating, or other complex shape.
Further, the exterior surface 22A can be characterized with
portions having planar features and portions having non-planar
features.
The first and second adhesive layers 44, 46 may be used to secure
the decorative layer 18 and/or the reflective layer 50 in place
during formation of the over-mold 22 and/or holding the layers of
the applique 14 in place. The first and second adhesive layers 44,
46 may be a clear pressure sensitive adhesive. It will be
understood that the first and second adhesive layers 44, 46 are
optional. Further, the securement layer 54 may be similar to the
first and second adhesive layers 44, 46 in composition and function
(i.e., to secure the applique 14 to the vehicle 10).
As explained above, the semiconductor layer 26 is configured to
emit light. According to various embodiments, the semiconductor
layer 26 may be configured to emit light in response to receiving
an excitation emission. The semiconductor layer 26 may include a
binder 26A and a photoluminescent semiconductor material 26B. The
binder 26A may be an optically transparent or translucent material
such as polymethylmethacrylate, nylon, polycarbonate, polyester
and/or polyvinyl chloride can also be used. The photoluminescent
semiconductor material 26B may include one or more quantum dots.
Quantum dots are nanoscale semiconductor devices that tightly
confine either electrons or electron holes in all three spatial
dimensions and may be photoluminescent. The photoluminescence of a
quantum dot can be manipulated to specific wavelengths by
controlling the particle diameter of the quantum dots. Quantum dots
may have a radius, or a distance half of their longest length, in
the range of between about 1 nm and about 10 nm, or between about 2
nm and about 6 nm. Larger quantum dots (e.g., radius of 5-6 nm)
emit longer wavelength light resulting in the color of the light
being such colors as orange or red. Smaller quantum dots (e.g.,
radius of 2-3 nm) emit shorter wavelengths resulting in colors such
as blue and green. It will be understood that the wavelength of
light emitted from the quantum dots may vary depending on the exact
composition of the quantum dots. Quantum dots naturally produce
monochromatic light. Exemplary compositions of the quantum dots
include LaF.sub.3 quantum dot nanocrystals that are doped (e.g.,
coated) with Yb--Er, Yb--Ho and/or Yb--Tm. Other types of quantum
dots that can be used include various types of tetrapod quantum
dots and perovskite enhanced quantum dots. It will be understood
that one or more types of quantum dots may be mixed or otherwise
used in the semiconductor layer 26.
The quantum dot embodiments of the photoluminescent semiconductor
material 26B may be configured to emit light in response to an
excitation emission. According to various embodiments, the quantum
dots may be configured to emit light by up-converting excitation
light. Up-conversion works by absorbing two or more photons of a
longer wavelength excitation emission. Once absorbed, the quantum
dots may emit one or more photons having a shorter wavelength than
the wavelengths of the excitation emission. According to various
embodiments, the excitation emission may be infrared light. In such
embodiments, the excitation emission may have a wavelength of
between about 800 nm and about 1000 nm. In the specific embodiment,
the excitation emission may have a wavelength of about 980 nm. A
980 nm wavelength is chosen since red, blue and green emitting
colloidal quantum dots of these species can efficiently absorb this
wavelength of light and LEDs of this wavelength are commercialized
and readily available. This means the semiconductor layer 26 can
emit virtually any color including white, except shades of purple,
when charged or excited with infrared light and the proper sized
quantum dots are used.
According to various embodiments, the semiconductor layer 26 may be
structurally formed as a film. In a first method of forming the
semiconductor layer 26, the photoluminescent semiconductor material
26B may be blended directly into the binder 26A. Next, the mixture
of semiconductor material 26B and binder 26A may be extruded into a
thin sheet of film. Another exemplary method of producing the
semiconductor layer 26 is to apply a thin coating of the
semiconductor material 26B to a surface. To do this, the
semiconductor material 26B is first blended into a polymer or a
polymerizable mixture of monomers. Next, the mixture is then spin
coated, ink jetted or otherwise applied as a thin layer over a
surface (e.g., of a film, substrate or vehicle component). Monomer
mixtures can be polymerized (cured) on the surface after
application. Using this approach, it may be important to assure
that the polymer or monomer mixture is lipophilic (non-polar) if
organic soluble semiconductor material 26B is being used.
Conversely, if water soluble photoluminescent semiconductor
material 26B is being used, the polymer or monomers may be
hydrophilic (water soluble).
Positioned below the second adhesive layer 46 is the reflective
layer 50. The reflective layer 50 is configured to reflect and
scatter light emitted by the semiconductor layer 26, and ambient
light that has passed through the decorative layer 18 and
semiconductor layer 26 back into the semiconductor layer 26. The
reflective layer 50 may be composed of a reflective component such
as TiO.sub.2 (e.g., rutile), a metal with a high luster finish
and/or other reflective components. According to one embodiment, an
opaque white polymer film using at least 5% by weight of a
TiO.sub.2 pigment and a polymethylmethacrylate that is about 0.02
microns in diameter.
Referring to FIGS. 4A-E, depicted are an embodiments in which the
reflective layer 50 (FIG. 3) is replaced with a light source 70. As
illustrated in FIG. 4A, the light source may 70 have a stacked
arrangement that includes a light-producing assembly 114. The
light-producing assembly 114 may correspond to a thin-film or
printed light emitting diode (LED) assembly and includes a
substrate 122 as its lowermost layer. The substrate 122 may include
a polycarbonate, polymethylmethacrylate (PMMA), or polyethylene
terephthalate (PET) material on the order of 0.005 to 0.060 inches
thick and is arranged over the intended vehicle substrate on which
the light source 70 is to be received (e.g., a panel of the vehicle
10). Alternatively, as a cost saving measure, the substrate 122 may
directly correspond to a preexisting structure (e.g., the vehicle
panel).
The light-producing assembly 114 includes a positive electrode 126
arranged over the substrate 122. The positive electrode 126
includes a conductive epoxy such as, but not limited to, a
silver-containing or copper-containing epoxy. The positive
electrode 126 is electrically connected to at least a portion of a
plurality of LED sources 130 arranged within a semiconductor ink
134 and applied over the positive electrode 126. Likewise, a
negative electrode 138 is also electrically connected to at least a
portion of the LED sources 130. The negative electrode 138 is
arranged over the semiconductor ink 134 and includes a transparent
or translucent conductive material such as, but not limited to,
indium tin oxide. Additionally, each of the positive and negative
electrodes 126, 138 are electrically connected to a controller 142
and a power source 146 via a corresponding bus bar 150, 154 and
conductive elements 158, 162. The bus bars 150, 154 may be printed
along opposite edges of the positive and negative electrodes 126,
138 and the points of connection between the bus bars 150, 154 and
the conductive leads 158, 162 may be at opposite corners of each
bus bar 150, 154 to promote uniform current distribution along the
bus bars 150, 154. It should be appreciated that in alternate
embodiments, the orientation of components within the
light-producing assembly 114 may be altered without departing from
the concepts of the present disclosure. For example, the negative
electrode 138 may be disposed below the semiconductor ink 134 and
the positive electrode 126 may be arranged over the aforementioned
semiconductor ink 134. Likewise, additional components, such as the
bus bars 150, 154, may also be placed in any orientation such that
the light-producing assembly 114 may emit outputted light 166 (FIG.
4B) toward a desired location.
The LED sources 130 may be dispersed in a random or controlled
fashion within the semiconductor ink 134 and may be configured to
emit focused or non-focused light toward the semiconductor layer
26. According to various embodiments, the LED sources 130 may be
configured to emit infrared light. The LED sources 130 may
correspond to micro-LEDs of gallium nitride elements on the order
of about 5 to about 400 microns in size and the semiconductor ink
134 may include various binders and dielectric material including,
but not limited to, one or more of gallium, indium, silicon
carbide, phosphorous, and/or translucent polymeric binders.
The semiconductor ink 134 can be applied through various printing
processes, including ink jet and silk screen processes, to selected
portion(s) of the positive electrode 126. More specifically, it is
envisioned that the LED sources 130 are dispersed within the
semiconductor ink 134, and shaped and sized such that a substantial
quantity of the LED sources 130 align with the positive and
negative electrodes 126, 138 during deposition of the semiconductor
ink 134. The portion of the LED sources 130 that ultimately are
electrically connected to the positive and negative electrodes 126,
138 may be illuminated by a combination of the bus bars 150, 154,
controller 142, power source 146, and conductive leads 158, 162.
According to one embodiment, the power source 146 may correspond to
a vehicular power source 146 operating at 12 to 16 VDC. Additional
information regarding the construction of light-producing
assemblies 114 is disclosed in U.S. Patent Publication No.
2014/0264396 A1 to Lowenthal et al. entitled "ULTRA-THIN PRINTED
LED LAYER REMOVED FROM SUBSTRATE," filed Mar. 12, 2014, the entire
disclosure of which is incorporated herein by reference.
Referring now to FIG. 4A, the semiconductor layer 26 is arranged
over the negative electrode 138 as a coating, layer, film or other
suitable deposition. The decorative layer 18 is arranged over the
semiconductor layer 26. In some embodiments, the decorative layer
18 is molded over the semiconductor layer 26 and light-producing
assembly 114. As explained above, the decorative layer 18 may be at
least partially light transmissible. In this manner, the decorative
layer 18 will be illuminated by the semiconductor layer 26 whenever
an energy conversion process is underway.
A protective coating 118 is disposed around the light-producing
assembly 114 and/or semiconductor layer 26. The protective coating
118 may protect the light-producing assembly 114 from physical and
chemical damage arising from environmental exposure. The protective
coating 118 may have viscoelasticity (i.e., having both viscosity
and elasticity), a low Young's modulus, and/or a high failure
strain, compared with other materials, so that the protective
coating 118 may protect the light-producing assembly 114 when
contact is made thereto. For example, the protective coating 118
may protect the light-producing assembly 114 from the environmental
contaminants, such as dirt and water, which may come in contact
with the light source 70 during manufacturing.
In some embodiments, the semiconductor layer 26 may be employed
separate and away from the light-producing assembly 114. For
example, the semiconductor layer 26 may be positioned on an
opposite side of the decorative layer 18, another location of the
applique 14, and/or any surface proximate the light-producing
assembly 114.
Referring now to FIG. 4B, an energy conversion process 170 for
producing single color luminescence is illustrated, according to
one embodiment. For purposes of illustration, the energy conversion
process 170 is described below using the light source 70 depicted
in FIG. 4A. In this embodiment, the semiconductor layer 26 includes
a single semiconductor material 26B, which is configured to convert
inputted light 178 received from LED sources 130 into the outputted
light 166 having a wavelength different than that associated with
the inputted light 178. More specifically, the semiconductor
material 26B is formulated to have an absorption spectrum that
includes the emission wavelength of the inputted light 178 supplied
from the LED sources 130. The semiconductor material 26B is also
formulated to convert light and result in the converted visible
outputted light 166 having an emission spectrum expressed in a
desired color, which may vary per lighting application. The
converted visible outputted light 166 is outputted from the light
source 70 via the decorative layer 18, thereby causing the
decorative layer 18 to illuminate in the desired color. The
illumination provided by the decorative layer 18 may offer a
unique, substantially uniform, and/or attractive, viewing
experience that may be difficult to duplicate through
non-photoluminescent means.
Referring to FIG. 4C, a second energy conversion process 190 for
generating multiple colors of light is illustrated, according to
one embodiment. For consistency, the second energy conversion
process 190 is also described below using the light source 70
depicted in FIG. 4A. In this embodiment, the semiconductor layer 26
includes the semiconductor material 26B and a second semiconductor
layer 26C. Alternatively, the semiconductor materials 26B, 26C may
be isolated from each other, if desired.
With respect to the presently illustrated embodiment, the
excitation of semiconductor materials 26B, 26C is mutually
exclusive. That is, semiconductor materials 26B, 26C are formulated
to have non-overlapping absorption spectrums that yield different
emission spectrums. Also, in formulating the semiconductor
materials 26B, 26C, care should be taken in choosing the associated
up-conversions such that the converted outputted light 166 emitted
from one of the semiconductor materials 26B, 26C, does not excite
the other, unless so desired. According to one exemplary
embodiment, a first portion of the LED sources 130, exemplarily
shown as LED sources 130a, is configured to emit an inputted light
178 having an emission wavelength that only excites semiconductor
material 26B and results in the inputted light 178 being converted
into a visible outputted light 166 of a first color (e.g., white).
Likewise, a second portion of the LED sources 130, exemplarily
shown as LED sources 130b, is configured to emit an inputted light
178 having an emission wavelength that only excites the second
semiconductor material 26C and results in the inputted light 178
being converted into a visible outputted light 166 of a second
color (e.g., red). Preferably, the first and second colors are
visually distinguishable from one another. In this manner, LED
sources 130a and 130b may be selectively activated using the
controller 142 to cause the semiconductor layer 26 to luminesce in
a variety of designable colors. For example, the controller 142 may
activate only LED sources 130a to exclusively excite semiconductor
material 26B resulting in the decorative layer 18 illuminating in
the first color. Alternatively, the controller 142 may activate
only LED sources 130b to exclusively excite the second
semiconductor material 26C, resulting in the decorative layer 18
illuminating in the second color.
Alternatively still, the controller 142 may activate LED sources
130a and 130b in concert, which causes both of the semiconductor
materials 26B, 26C to become excited, resulting in the decorative
layer 18 illuminating in a third color, which is a color mixture of
the first and second colors (e.g., pinkish). The intensities of the
inputted light 178 emitted from each portion of the LED sources
130a, 130b may also be proportionally varied to one another such
that additional colors may be obtained. For semiconductor layers 26
containing more than two distinct semiconductor materials 26B, 26C,
a greater diversity of colors may be achieved. Contemplated colors
include red, green, blue, and combinations thereof, including
white, all of which may be achieved by selecting the appropriate
semiconductor materials 26B, 26C and correctly manipulating the
corresponding LED sources 130a, 130b.
Referring to FIG. 4D, a third energy conversion process 198
includes the light-producing assembly 114, such as the one
described in reference to FIG. 4A, and the semiconductor layer 26
disposed thereon, according to an alternate embodiment. The
semiconductor layer 26 is configured to convert inputted light 178
received from LED sources 130 into a visible outputted light 166
having a wavelength different than that associated with the
inputted light 178. More specifically, the semiconductor layer 26
is formulated to have an absorption spectrum that includes the
emission wavelength of the inputted light 178 supplied from the LED
sources 130. The semiconductor material 26B is also formulated to
have an up-conversion resulting in the converted visible outputted
light 166 having an emission spectrum expressed in a desired color,
which may vary per lighting application.
The semiconductor layer 26 may be applied to a portion of the
light-producing assembly 114, for example, in a stripped manner.
Between the semiconductor layers 26 may be light transmissive
portions 202 that allow inputted light 178 emitted from the LED
sources 130 to pass therethrough at the first wavelength. The light
transmissive portions 202 may be an open space, or may be a
transparent or translucent material. The inputted light 178 emitted
through the light transmissive portions 202 may be directed from
the light-producing assembly 114 towards the decorative layer 18
such that the decorative layer 18 may emit a colored light
corresponding to the inputted light 178 that is directed through
the light transmissive portions 202.
Referring to FIG. 4E, a fourth energy conversion process 206 for
generating multiple colors of light utilizing the light-producing
assembly 114, such as the one described in reference to FIG. 4A,
and the semiconductor layer 26 disposed thereon is illustrated. In
this embodiment, the semiconductor layer 26 is disposed over a top
portion of the light-producing assembly 114. The excitation of
semiconductor material 26B is formulated such that a portion of
inputted light 178 emitted from LED sources 130c, 130d passes
through the semiconductor layer 26 at the first wavelength (i.e.,
the inputted light 178 emitted from the light-producing assembly
114 is not converted by the semiconductor layer 26). The intensity
of the emitted light (i.e., the combination of the inputted light
178 and outputted light 166) may be modified by pulse-width
modulation or current control to vary the amount of inputted light
178 emitted from the LED sources 130c, 130d that pass through the
semiconductor layer 26 without converting to a second, outputted
light 166 wavelength. For example, if the light-producing assembly
114 is configured to emit inputted light 178 at a low level,
substantially, all of the inputted light 178 may be converted to
outputted light 166. In this configuration, a color of outputted
light 166 corresponding to the semiconductor layer 26 may be
emitted from the light-producing assembly 114. If the
light-producing assembly 114 is configured to emit inputted light
178 at a high level, only a portion of the first wavelength may be
converted by the semiconductor layer 26. In this configuration, a
first portion of the emitted light may be converted by the
semiconductor layer 26 and a second portion of the emitted light
may be emitted from the light-producing assembly 114 at the first
wavelength towards additional semiconductor layers disposed
proximately to the light source 70. The additional semiconductor
layers may luminesce in response to the inputted light 178 emitted
from the light source 70.
According to one exemplary embodiment, a first portion of the LED
sources 130, exemplarily shown as LED sources 130c, is configured
to emit an inputted light 178 having a wavelength that excites the
semiconductor material 26B within the semiconductor layer 26 and
results in the inputted light 178 being converted into a visible
outputted light 166 of a first color (e.g., white). Likewise, a
second portion of the LED sources 130, exemplarily shown as LED
sources 130d, are configured to emit an inputted light 178 having a
wavelength that passes through the semiconductor layer 26 and
excites additional semiconductor layers disposed proximately to the
applique 14, thereby illuminating in a second color. The first and
second colors may be visually distinguishable from one another. In
this manner, LED sources 130c and 130d may be selectively activated
using the controller 142 to cause the decorative layer 18 to
luminesce in a variety of colors.
Referring now to FIG. 5, a block diagram of the vehicle 10 is shown
in which the decorative layer 18 is positioned within the applique
14. The vehicle 10 includes the controller 142 in communication
with the light source 70. The controller 142 may include a memory
210 having instructions contained therein that are executed by a
processor 214 of the controller 142. The controller 142 may provide
electrical power to the light source 70 via the power source 146
located onboard the vehicle 10. In addition, the controller 142 may
be configured to control the light output of the light source 70
based on feedback received from one or more vehicle control
modules. The controller 142 may be configured to operate the LED
sources 130 (FIGS. 4A-4E), the first portion of LEDs 130a and/or
the second portion of LEDs 130b separately and/or in an alternating
manner (e.g., via current direction manipulation) in order to
achieve a specific lighting appearance for the applique 14. In some
embodiments, the light source 70 may be operated such that portions
of the light-producing assembly 114 (FIGS. 4A-E) are activated and
other portions are not such that the decorative layer 18 appears to
be multicolored, has a pulsing effect, a specific feature is/isn't
illuminated and/or has a gradient to the color or intensity of
light. By activating the light-producing assembly 114, the color of
the illumination from the decorative layer 18 may change from a
first color to a second color. The change in color of the
decorative layer 18 may serve to communicate information (e.g.,
speed, transmission state, occupancy, indicate a turn), provide
aesthetic lighting (e.g., pulse with music, provide warm ambient
lighting, pulse with a sensed heartbeat) or to provide large area
ambient illumination to an exterior of the vehicle 10. The
controller 142 may further be connected to the light sensor 42 such
that the light source 70 may be activated upon sensing that the
applique 14 is not outputting a desired level of light.
Use of the present disclosure may offer several advantages. First,
as the semiconductor material 26A, 26B, allows for the use of
infrared light as an excitation source, ultraviolet light may not
be used. The use of near visible infrared light may not degrade
paints, plastics or cause damage to the interior of a vehicle the
way other light sources may. Second, use of infrared light as an
excitation source for the applique 14 means that ambient lighting
may charge and excite the semiconductor layer 26 such that minimal
power requirements are placed on the vehicle 10.
Modifications of the disclosure will occur to those skilled in the
art and to those who make or use the disclosure. Therefore, it is
understood that the embodiments shown in the drawings and described
above are merely for illustrative purposes and not intended to
limit the scope of the disclosure, which is defined by the
following claims as interpreted according to the principles of
patent law, including the doctrine of equivalents.
It will be understood by one having ordinary skill in the art that
construction of the described disclosure, and other components, is
not limited to any specific material. Other exemplary embodiments
of the disclosure disclosed herein may be formed from a wide
variety of materials, unless described otherwise herein.
For purposes of this disclosure, the term "coupled" (in all of its
forms: couple, coupling, coupled, etc.) generally means the joining
of two components (electrical or mechanical) directly or indirectly
to one another. Such joining may be stationary in nature or movable
in nature. Such joining may be achieved with the two components
(electrical or mechanical) and any additional intermediate members
being integrally formed as a single unitary body with one another
or with the two components. Such joining may be permanent in
nature, or may be removable or releasable in nature, unless
otherwise stated.
It is also important to note that the construction and arrangement
of the elements of the disclosure, as shown in the exemplary
embodiments, is illustrative only. Although only a few embodiments
of the present innovation have been described in detail in this
disclosure, those skilled in the art who review this disclosure
will readily appreciate that many modifications are possible (e.g.,
variations in sizes, dimensions, structures, shapes and proportions
of the various elements, values of parameters, mounting
arrangements, use of materials, colors, orientations, etc.) without
materially departing from the novel teachings and advantages of the
subject matter recited. For example, elements shown as integrally
formed may be constructed of multiple parts, or elements shown as
multiple parts may be integrally formed, the operation of the
interfaces may be reversed or otherwise varied, the length or width
of the structures and/or members or connector or other elements of
the system may be varied, and the nature or number of adjustment
positions provided between the elements may be varied. It should be
noted that the elements and/or assemblies of the system may be
constructed from any of a wide variety of materials that provide
sufficient strength or durability, in any of a wide variety of
colors, textures, and combinations. Accordingly, all such
modifications are intended to be included within the scope of the
present innovations. Other substitutions, modifications, changes,
and omissions may be made in the design, operating conditions, and
arrangement of the desired and other exemplary embodiments without
departing from the spirit of the present innovations.
It will be understood that any described processes, or steps within
described processes, may be combined with other disclosed processes
or steps to form structures within the scope of the present
disclosure. The exemplary structures and processes disclosed herein
are for illustrative purposes and are not to be construed as
limiting.
It is also to be understood that variations and modifications can
be made on the aforementioned structures and methods without
departing from the concepts of the present disclosure, and further,
it is to be understood that such concepts are intended to be
covered by the following claims, unless these claims, by their
language, expressly state otherwise. Further, the claims, as set
forth below, are incorporated into and constitute part of this
Detailed Description.
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