U.S. patent number 10,131,766 [Application Number 15/850,486] was granted by the patent office on 2018-11-20 for unsaturated polyester resin system for cured in-place piping.
This patent grant is currently assigned to Interplastic Corporation. The grantee listed for this patent is Interplastic Corporation. Invention is credited to Benjamin R. Hazen, David J. Herzog, Louis R. Ross, Joel R. Weber.
United States Patent |
10,131,766 |
Hazen , et al. |
November 20, 2018 |
Unsaturated polyester resin system for cured in-place piping
Abstract
A process to use an unsaturated polyester resin system
comprising preparing a curable cumene-quat curing system. The
cumene-quat curing system can comprise an unsaturated polyester
resin, a peroxide initiator, a quaternary ammonium salt component,
a 2,4-pentanedione component, and an inhibitor component. The
peroxide initiator can comprise a cumene hydroperoxide component.
The process can further comprise applying the curable cumene-quat
curing system in a cured-in-place pipe rehabilitation process.
Inventors: |
Hazen; Benjamin R. (Roseville,
MN), Herzog; David J. (Maple Grove, MN), Ross; Louis
R. (Cincinnati, OH), Weber; Joel R. (Moundsview,
MN) |
Applicant: |
Name |
City |
State |
Country |
Type |
Interplastic Corporation |
Saint Paul |
MN |
US |
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Assignee: |
Interplastic Corporation (St.
Paul, MN)
|
Family
ID: |
63852222 |
Appl.
No.: |
15/850,486 |
Filed: |
December 21, 2017 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20180305521 A1 |
Oct 25, 2018 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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62489318 |
Apr 24, 2017 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C08K
5/19 (20130101); C08K 5/3415 (20130101); C08K
5/14 (20130101); C08K 5/098 (20130101); C08K
5/07 (20130101); C08K 3/36 (20130101); C08K
3/08 (20130101); C08K 5/14 (20130101); C08L
67/06 (20130101); C08K 5/3415 (20130101); C08L
67/06 (20130101); C08K 5/07 (20130101); C08L
67/06 (20130101); C08K 5/19 (20130101); C08L
67/06 (20130101); C08K 5/098 (20130101); C08L
67/06 (20130101); C08K 2003/0893 (20130101); F16L
55/1656 (20130101); C08K 2003/085 (20130101); C08K
3/36 (20130101); C08L 67/06 (20130101) |
Current International
Class: |
C08K
5/3415 (20060101); C08K 3/36 (20060101); C08K
5/07 (20060101); C08K 5/098 (20060101); C08K
3/08 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
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1034394 |
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Sep 2000 |
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EP |
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2410230 |
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Feb 2012 |
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EP |
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2554359 |
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Jun 2013 |
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EP |
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2004 161814 |
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Jun 2004 |
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JP |
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90/03850 |
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Apr 1990 |
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WO |
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03/040248 |
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May 2003 |
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WO |
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2005/042858 |
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Nov 2004 |
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WO |
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2013/025513 |
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Feb 2013 |
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WO |
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Primary Examiner: Butcher; Robert T
Attorney, Agent or Firm: Dykema Gossett PLLC
Claims
The invention claimed is:
1. A process comprising: preparing a curable cumene-quat curing
system, wherein the cumene-quat curing system comprises an
unsaturated polyester resin, a peroxide initiator, a quaternary
ammonium salt component, a 2,4-pentanedione component, and an
inhibitor component, wherein the peroxide initiator comprises a
cumene hydroperoxide component, wherein the 2,4-pentanedione
component comprises more than 2500 ppm of the curable cumene-quat
curing system, and wherein the curable cumene-quat curing system
has a pot-life of greater than about 18 hours around 25.degree. C.;
applying the curable cumene-quat curing system in a cured-in-place
pipe rehabilitation process.
2. The process according to claim 1, wherein the inhibitor
component comprises a 4-hydroxy-TEMPO solution.
3. The process according to claim 2, wherein the 4-hydroxy-TEMPO
solution comprises more than 1000 ppm of the curable cumene-quat
curing system.
4. The process according to claim 1, wherein the inhibitor
component comprises a Nitroxide.
5. The process according to claim 2, wherein the inhibitor
component comprises more than 1000 ppm of the curable cumene-quat
curing system.
6. The process of claim 1, wherein the curable cumene-quat curing
system further comprises a metal.
7. The process of claim 6, wherein the metal comprises copper.
8. The process of claim 6, wherein the metal comprises iron.
9. A process comprising: preparing a resin curing system, wherein
the resin curing system comprises a resin, a peroxide initiator, a
quaternary ammonium salt component, a 2,4-pentanedione component,
and an inhibitor component, wherein the 2,4-pentanedione component
comprises more than 2500 ppm of the resin curing system, and
wherein the resin curing system has a pot-life of greater than
about 18 hours around 25.degree. C.; applying the resin curing
system in a cured-in-place pipe rehabilitation process.
10. The process of claim 9, wherein the peroxide initiator
comprises a cumene hydroperoxide component.
11. The process of claim 9, wherein the inhibitor component
comprises a 4-hydroxy-tempo solution.
12. The process according to claim 11, wherein the 4-hydroxy-tempo
solution comprises more than 1000 ppm of the curable cumene-quat
curing system.
13. The process according to claim 9, wherein the inhibitor
component comprises a Nitroxide.
14. The process according to claim 11, wherein the inhibitor
component comprises more than 1000 ppm of the resin curing
system.
15. The process of claim 9, wherein the curable cumene-quat curing
system further comprises a metal.
16. The process of claim 15, wherein the metal comprises
copper.
17. A process comprising: preparing a curable cumene-quat curing
system, wherein the cumene-quat curing system comprises an
unsaturated polyester resin, a peroxide initiator, a quaternary
ammonium salt component, a 2,4-pentanedione component, and an
inhibitor component, wherein the peroxide initiator comprises a
cumene hydroperoxide component, wherein the inhibitor component
comprises more than 1000 ppm of the curable cumene-quat curing
system, and wherein the curable cumene-quat curing system has a
pot-life of greater than about 18 hours around 25.degree. C.;
applying the curable cumene-quat curing system in a cured-in-place
pipe rehabilitation process; curing the curable cumene-quat curing
system at 140 F in less than 15 minutes.
Description
FIELD
Embodiments of the present disclosure generally relate to a system,
method, and apparatus for using an unsaturated polyester resin
system with cured in-place piping to repair conduits or
pipelines.
BACKGROUND
Conduits or pipelines, particularly underground pipes, such as
sewer pipes, water lines and gas lines are employed for conducting
fluids and frequently require repair due to fluid leakage. The
leakage from the conduits or pipelines can move in to the pipe from
the environment. Also, the leakage can move outward from the inner
portion of the pipe to the surrounding environment. It is desirable
to avoid leakage in either case.
Pipe leakage can occur for a variety of reasons. In one instance,
the pipe leakage can occur due to improper installation of the
original pipe. In another instance, the pipe leakage can occur due
to deterioration of the pipe itself as a result of normal aging or
the effects of conveying corrosive or abrasive material through the
pipeline. Further, cracks can be caused at or near pipe joints from
environmental conditions. These environmental conditions can
include situations ranging from earthquakes to the movement of
large vehicles on the overhead surface or other natural or manmade
vibrations. Leaks from conduits or pipelines as described above are
undesirable and can result in waste of the fluid being conveyed
within the pipeline, or result in damage to areas surrounding the
pipeline including possible dangerous health hazards. If the
pipeline continues to leak and is not repaired, structural failure
of the existing conduit can occur due to soil loss and support of
the conduit.
BRIEF SUMMARY
The present disclosure relates to a system and method for the
lining of pipelines or passageways, using flexible tubular
materials. In particular, the instant disclosure relates to a
system and method using flexible tubular materials which are
impregnated with a curable unsaturated polyester resin system.
In one embodiment, a process to use an unsaturated polyester resin
system comprising preparing a curable cumene-quat curing system can
comprise an unsaturated polyester resin, a peroxide initiator, a
quaternary ammonium salt component, a 2,4-pentanedione component,
and an inhibitor component. The peroxide initiator can comprise a
cumene hydroperoxide component. The process can further comprise
applying the curable cumene-quat curing system in a cured-in-place
pipe rehabilitation process.
In another embodiment, a process can comprise preparing a curable
cumene-quat curing system. The cumene-quat curing system can
comprise a resin, a peroxide initiator, a quaternary ammonium salt
component, a 2,4-pentanedione component, and an inhibitor
component. The process can further comprise applying the curable
cumene-quat curing system in a cured-in-place pipe rehabilitation
process.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 depicts a diagram of the CIPP process.
FIG. 2 depicts a graph of the cure properties of one embodiment of
an unsaturated polyester resin system with varying levels of
4-hydroxy TEMPO.
FIG. 3 depicts a graph of the temperature time curves of one
embodiment of an unsaturated polyester resin system with varying
levels of 4-hydroxy TEMPO.
DETAILED DESCRIPTION
In one embodiment, this disclosure relates to the lining of
pipelines or passageways, using flexible tubular materials which
are impregnated with a curable unsaturated polyester resin system
which can be placed in a position lining the pipeline or passageway
and can be held by fluid pressure against the pipeline or
passageway surface until the unsaturated polyester resin system
cures to a hard condition leaving a hard lining on the interior of
the pipeline or passageway surface. In other embodiments, the
unsaturated polyester resin system can be used in other methods or
processes using curable resins. This process is known to one of
ordinary skill in the art as Cured In-Place Piping (CIPP). A subset
of the unsaturated polyester resin can comprise a vinyl ester
resin.
Pot-life is the time it takes for a viscosity of a mixed system to
increase by a pre-set number. In many cases the pot-life is the
amount of time it takes for the viscosity to double. However, in
other cases, where the viscosity of the mixed system is very low,
the pot-life can be used to state the amount of time it takes for
the mixed system to triple, quadruple, or more in viscosity. In one
embodiment, the pot-life comprises the amount of time it takes for
the viscosity to double. In other embodiments, the pot-life
comprises the amount of time it takes for the viscosity to triple,
quadruple, or otherwise increase in viscosity. Further, a working
time is the amount of time from the point when component A and
component B are mixed together to the point when the resulting
formulation is no longer usable. Pot-life or an end of a pot-life
is often defined as the point at which the viscosity increases
significantly due to the reaction between component A and component
B. The high viscosity will make it difficult to successfully
complete the CIPP process.
One method of using an unsaturated polyester resin system as
described herein is to impregnate linings as is disclosed in
British Patent No. 1449455, filed 8 Dec. 1972, and issued 15 Sep.
1976, which is hereby incorporated by reference as though fully set
forth herein. The impregnated lining can be applied to the pipeline
or passageway surface by eversion of same into the pipeline or
passageway, using fluid pressure. In various embodiments, the fluid
pressure can comprise a heated steam or liquid. In other
embodiments, other heated fluids can be used in the curing
process.
FIG. 1 illustrates one method of installing cured in place piping.
FIG. 1 depicts a truck 101, a winch 103, a first access shaft 105,
a second access shaft 107, a pull wire 109, a previously installed
pipe 111, and a CIPP liner 113. The CIPP liner 113 can be stored
within the truck 101. In some embodiments, the truck 101 can be
refrigerated. By storing the CIPP liner 113 in a truck 101 that can
refrigerate the CIPP liner 113, the pot-life of the CIPP liner 113
can be increased. The pull wire 109 can be coupled to the winch 103
and to the CIPP liner 113. The winch 103 can be used to tension the
pull wire 109 and to pull one end of the CIPP liner 113 from the
truck 101 through the first access shaft 105, and through the
previously installed pipe 111.
In previous resins used in the processes described herein, and
those used commercially today, a cold storage initiator system can
be required. For example, the initiator can comprise a peroxide
that requires cold storage. An initiator that requires cold storage
can comprise an organic peroxide. The organic peroxide can comprise
bis(tert-butylcyclohexyl) peroxydicarbonate (aka
di(4-tert-butylcyclohexyl) peroxydicarbonate AkzoNobel's "Perkadox
16" and United Initiator's "BCHPC") and dimyristyl
peroxydicarbonate (akzo's "Perkadox 26" and UI's "MYPC"). Perk 16
is the least stable and has caused several shop fires due to
inadequate refrigeration or from aged dispersions which were not
added to the resin in time The initiators require cold storage to
minimize hazard risks and for the initiator to maintain full
effectiveness for a desired period of time. Further, the most
commonly used initiators are heat activated initiators and are
solid materials. The solid initiators must be put into solution
immediately before use. The process of adding the initiator in this
manner can be a messy and potentially hazardous process. Further, a
second initiator, which is usually a liquid initiator, must be
added to the process. In other embodiments three initiators, four
initiators, or more can be used. As regulations on shipping and
storage of initiators used during the processes described herein
increase, a new formulation of a curable resin can offer
significant advantages. The unsaturated polyester resin system
described herein comprises several distinct advantages over those
currently in use. In one embodiment, the unsaturated polyester
resin system can comprise a single component, liquid initiator. In
another embodiment, the unsaturated polyester resin system can
comprise a single component, solid initiator. The unsaturated
polyester resin system can further comprise an initiator that does
not require cold storage and that can be less expensive than
initiators currently used. The initiator of the disclosure herein
is also readily available in more markets throughout the world and
can be shipped without worries of fire or other potentially
dangerous incidents as can currently be the case. In one
embodiment, when kept refrigerated, the catalyzed unsaturated
polyester resin system comprises a pot-life that is similar or
substantially similar to those present within the market. In one
embodiment, the unsaturated polyester resin system described herein
can minimize the risk of hot spots in a CIPP liner while the CIPP
liner is curing. In some embodiments, hot spots can be due to
peroxide-rich regions within the wet out liner due to inadequately
dissolved solid peroxide/catalyst. Further, in one embodiment, the
unsaturated polyester resin system used in the CIPP process
described herein can exhibit the same mechanical and corrosion
resistant properties in the cured product as is found in the
currently used commercial systems. In one embodiment, another
advantage of the unsaturated polyester resin system described
herein is that the cost of the resin is the same or lower than
resin systems traditionally used and the requirements for storing
the initiator used in the unsaturated polyester resin system is
less cumbersome and onerous than initiators that are traditionally
used. Further still, in one embodiment, the disclosed unsaturated
polyester resin system can exhibit a lower cure exotherm than those
found in resin systems that are traditionally used in the CIPP
process.
In other embodiments, the unsaturated polyester resin system can
comprise an initiator with more than one component, or at least one
or more of the components can comprise a non-liquid portion.
The formulations described herein can offer a lower cost and safer
system. The unsaturated polyester resin systems described herein
can be cured with steam, hot water, or through other processes as
would be known to one of ordinary skill in the art. Further, the
unsaturated polyester resin systems described herein will cure a
CIPP liner wet out with polyester or vinyl ester resin yet still
maintain sufficient pot-life. The current industry standard uses
"low temperature" peroxides such as Perkadox 16 or Perkadox 26.
Both of these low temperature peroxides can be more expensive than
the peroxides described herein, and further require sub-ambient
storage temperatures. Perkadox 16 or Perkadox 26 are both solid,
which require a predispersion process to be performed in a diluent
and further incorporation into the resin. If the dispersed
peroxide/reactive diluent mixture is stored for too long, which can
be as little as a 2-3 hours, fires can be started by the dispersed
peroxide/reactive diluent mixture. Further, if the refrigerated
storage were to fail or otherwise stop, the dispersed
peroxide/diluent mixture can self-combust and start a fire. Further
still, the peroxide itself can self-combust.
The unsaturated polyester resin systems described herein can
comprise a variety of compounds. In some embodiments, the
unsaturated polyester resin system can comprise a Cumene-quat
curing system for polyester and vinyl ester resins. The cumene-quat
curing system can comprise a redox catalyzed peroxide decomposition
which can initiate free radical polymerization. Similar chemistry
is further described in U.S. Pat. No. 2,740,765, U.S. Pat. No.
2,946,770, and U.S. Pat. No. 3,080,351. In one embodiment, the
Cumene-quat curing system can comprise cumene hydroperoxide, CHP,
and quaternary ammonium salts. In this embodiment, the CHP can act
as a peroxide initiator for the unsaturated polyester resin system.
In another embodiment, tert-butyl hydroperoxide can be used. In yet
other embodiments, the peroxide initiator can comprise other
compounds as would be known to one of ordinary skill in the art.
The Cumene-quat curing system can further comprise 2,4-pentanedione
and a high level of inhibitors. In some embodiments, the
2,4-pentanedione can be used at high levels. In one embodiment the
2,4-pentanedione can be used in a range of 1000-6000 ppm. In
another embodiment, the 2,4-pentanedione can be used in a range of
3000-5000 ppm. In yet another embodiment, the 2,4-pentanedione can
be used in a range of 3500-4000 ppm. In yet another embodiment, the
2,4-pentanedione can comprise more than 3500 ppm of the cumene-quat
curing system. In yet other embodiments, other ranges or
concentrations can be used. In other embodiments, the Cumene-quat
curing system can comprise dimethyl acetoacetamide, ethyl
acetoacetate, methyl acetoacetate, and/or AAA. Further, any other
compounds can be used which have similar diketone-forming-enol
functionality. Similar chemistry is further described in U.S. Pat.
No. 3,584,076. In another embodiment, the inhibitor can comprise a
level of over 1000 ppm in the unsaturated polyester resin. In some
embodiments, the inhibitor can comprise 4-hydroxy TEMPO and/or
Arkema's BlocBuilder type inhibitors. In other embodiments,
traditional inhibitors used in the art such as hydroquinione,
para-benzoquinone, and tert-butylcatechol can be used.
Additionally, further inhibitors would be known to one of ordinary
skill in the art. In one embodiment, the inhibitor can comprise
more than 500 ppm. In another embodiment, the inhibitor can
comprise more than 750 ppm. In yet another embodiment, the
inhibitor can comprise more than 1000 ppm. In yet another
embodiment, the inhibitor can comprise between 1000 and 4000 ppm.
In yet other embodiments, the inhibitor can comprise more than 4000
ppm. In some embodiments, the inhibitor can comprise a Nitroxide.
In yet other embodiments, the inhibitor can comprise other similar
components as would be known to one of ordinary skill in the art.
In yet another embodiment, the cumene-quat curing system can
further comprise a metal. In some embodiments this metal can
comprise copper and/or zinc. In another embodiment, the metal can
comprise iron. In other embodiments, the cumene-quat curing system
can comprise other metals as would be known to one of ordinary
skill in the art. In various embodiments, the cumene-quat curing
system can comprise one or more different metals in varying
concentrations as described herein.
An unsaturated polyester resin system as described herein can have
a pot-life of over 24 hours at 77.degree. F. Further, the
unsaturated polyester resin system can have a pot-life of several
weeks when stored in refrigerated area.
Table 1 illustrates the cure properties of an unsaturated polyester
resin at 140 F with different concentrations of 4-hydroxy TEMPO to
determine the effects on gel and cure characteristics. The
unsaturated polyester resin is combined with CHP and at least one
quaternary ammonium salt. The composition comprises an unsaturated
polyester resin at 140 F with 500 ppm benzyltrimethylammonium
(BTMAC), 500 ppm tetrabutyl ammonium bromide (TBABr), and 1% CHP
(K-90) and the ppm of 4-hydroxy TEMPO (4-HT) listed. In another
embodiment, the composition can further comprise 40 ppm copper
naphthenate.
TABLE-US-00001 TABLE 1 Cure Properties of unsaturated polyester
resin with 4-HT concentration varied. The cure system was at 140
F., 500 ppm BTMAC, 500 pm TBABr, and 1% CHP (K-90). 4HT Gel Peak
Gel to Cure Pot-life ppm Times Exo Peak Times (hrs) 1000 1.5 374
1.72 3.41 <24 1100 1.94 363.2 1.03 4.07 <24 2000 4.54 371.29
1.47 6.78 <24 2500 5.23 359.5 2.68 7.91 <24 3000 9.06 363.4
3.08 12.15 24 3100 12.83 351.1 3.93 16.74 >24 3200 14.88 338.2
3.93 18.81 >24 3500 18.33 329.3 4.41 22.74 >48
While the above table shows benzyltrimethylammonium and tetrabutyl
ammonium bromide used in the polyester resin system, other
quaternary ammonium salts can be used. Other quaternary ammonium
salts can comprise one or more of Acetylcarnitine, Acetylcholine,
Aclidinium bromide, Acriflavine, Agelasine, Aliquat 336, Ambenonium
chloride, Ambutonium bromide, Aminosteroid, ANNINE-6plus,
Atracurium besilate, Benzalkonium chloride, Benzethonium chloride,
Benzilone, Benzododecinium bromide, Benzoxonium chloride,
Benzyltrimethylammonium fluoride, Benzyltrimethylammonium
hydroxide, Bephenium hydroxynaphthoate, Berberine, Betaine,
Bethanechol, Bevonium, Bibenzonium bromide, Bis-choline
tetrathiomolybdate, Bretylium, Bufothionine, Burgess reagent,
Butyrylcholine, Californidine, Candicine, Candocuronium iodide,
Carbachol, Carbethopendecinium bromide, Carnitine, Cefluprenam,
Cetalkonium chloride, Cetrimonium, Cetrimonium bromide, Cetrimonium
chloride, Cetylpyridinium chloride, Chelerythrine, Chlorisondamine,
Chlormequat, Choline, Choline chloride, Cimetropium bromide,
Cisatracurium besilate, Citicoline, Clidinium bromide, Clofilium,
Cocamidopropyl betaine, Cocamidopropyl hydroxysultaine, Complanine,
Coptisine, Cyanine, Cyclobis(paraquat-p-phenylene), Decamethonium,
3-Dehydrocarnitine, Demecarium bromide, Denatonium, Dequalinium,
Didecyldimethylammonium chloride, Dihydrochandonium,
Dimethyldioctadecylammonium chloride, Dimethylphenylpiperazinium,
Dimethyltubocurarinium chloride, DiOC6, Diphemanil metilsulfate,
Diphthamide, Diquat, Distigmine, Dithiazanine iodide, Domiphen
bromide, Doxacurium chloride, Echothiophate, Edelfosine,
Edrophonium, Emepronium bromide, Ethidium bromide, Ethyl Green,
Euflavine, Fenpiverinium, Fentonium, Fluorocholine, Gallamine
triethiodide, Gantacurium chloride, GelGreen, GelRed, Glycine
betaine aldehyde, Glycopyrronium bromide, Guar
hydroxypropyltrimonium chloride, Hemicholinium-3, Hexafluronium
bromide, Hexamethonium, Hexocyclium, Hydroxyethylpromethazine,
Hyoscine butylbromide, Indacaterol/glycopyrronium bromide,
Ipratropium bromide, Isometamidium chloride, Isopropamide,
Jatrorrhizine, Laudexium metilsulfate, Lucigenin, Meldonium,
Mepenzolate, Methacholine, Methantheline, Methiodide,
Methylatropine, Methylhomatropine, Methylnaltrexone,
Methylscopolamine bromide, Metocurine, Miltefosine, Morphine
methylbromide, Muscarine, Neurine, Obidoxime, Octatropine
methylbromide, Octenidine dihydrochloride, Otilonium bromide,
Oxapium iodide, Oxitropium bromide, Oxyphenonium bromide,
Pahutoxin, Palmatine, Pancuronium bromide, Pararosaniline,
Pentamine, Penthienate, Pentolinium, Perifosine, Phellodendrine,
Phosphocholine, Pinaverium, Pipecuronium bromide, Pipenzolate
bromide, Poldine, PolyDADMAC, Polyquaternium, Polyquaternium-7,
Pralidoxime, Prifinium bromide, Propantheline bromide, Prospidium
chloride, Pyridostigmine, Pyrvinium, Quaternium-15, Quinapyramine,
Rapacuronium, Rhodamine B, Rimazolium, Rocuronium bromide,
Safranin, Sanguinarine, Silane quats, Sinapine, Stearalkonium
chloride, Succinylmonocholine, Suxamethonium chloride, Suxethonium
chloride, Tetra-n-butylammonium bromide, Tetra-n-butylammonium
fluoride, Tetrabutylammonium, Tetrabutylammonium
hexafluorophosphate, Tetrabutylammonium hydroxide,
Tetrabutylammonium tribromide, Tetraethylammonium,
Tetraethylammonium bromide, Tetraethylammonium chloride,
Tetraethylammonium iodide, Tetramethylammonium, Tetramethylammonium
chloride, Tetramethylammonium hydroxide, Tetramethylammonium
pentafluoroxenate, Tetraoctylammonium bromide, Tetrapropylammonium
perruthenate, Thiazinamium metilsulfate, Thioflavin, Thonzonium
bromide, Tibezonium iodide, Tiemonium iodide, Timepidium bromide,
Trazium, Tridihexethyl, Triethylcholine, Trigonelline, Trimethyl
ammonium compounds, Trimethylglycine, Trolamine salicylate,
Trospium chloride, Tubocurarine chloride, Umeclidinium bromide, and
Vecuronium bromide. Further, similar chemistry can occur with
phosphonium salts or other onium salts.
FIG. 2 illustrates a graph of the cure properties of one embodiment
of an unsaturated polyester resin system with varying levels of
4-hydroxy TEMPO. The graph illustrates the time for different
concentrations to reach peak exo 201, the time for different
concentrations to gel 203, the time for different concentrations to
cure 205, and the time for different concentrations to gel to peak
207. As seen in FIG. 2, the peak exo line 201 follows a linear
progression, the gel time line 203 follows an exponential
progression, the cure time line 205 follows an exponential
progression, and the gel to peak line 207 follows a linear
progression.
FIG. 3 illustrates a graph of the temperature time curves of one
embodiment of an unsaturated polyester resin system with varying
levels of 4-hydroxy TEMPO. The graph illustrates the cure profile
for 1000 ppm 4-hydroxy TEMPO 301, 1100 ppm 4-hydroxy TEMPO 303,
2000 ppm 4-hydroxy TEMPO 305, 2500 ppm 4-hydroxy TEMPO 307, 3000
ppm 4-hydroxy TEMPO 309, 3100 ppm 4-hydroxy TEMPO 311, 3200 ppm
4-hydroxy TEMPO 313, and 3500 ppm 4-hydroxy TEMPO 315. As seen in
FIG. 3, the curing profile of the unsaturated polyester resin
system can be changed based on the concentration of 4-hydroxy TEMPO
used within the resin. In general, the gel time lengthens as the
concentration of 4-hydroxy TEMPO increases. Further, there is some
decrease in exotherm temperatures as well, and the gel to peak time
also increases with increasing concentrations of 4-hydroxy TEMPO.
As shown in FIGS. 2 and 3, quaternary ammonium salts in combination
with CHP can gel and cure at 140 F in less than 15 minutes, with
exotherms reasonably high, and stability greater than 24 hours.
While the composition used in table 1 comprises two quaternary
ammonium salts, one or more quaternary ammonium salts can be used.
Further, while benzyltrimethylammonium chloride and tetrabutyl
ammonium bromide are used above, other quaternary ammonium salts
can be used. In some embodiments a single quaternary ammonium salt
can be used. In other embodiments, a plurality of quaternary
ammonium salts can be used.
EXAMPLES
Example 1
An unsaturated polyester resin system (Example 1) comprising
TABLE-US-00002 Product Weight % UNSATURATED POLYESTER RESIN 62.407
GLYCERINE 0.075 TWEEN 20 TYPE SURFACTANT 0.075 CAB-O-SIL 1.3 AIR
RELEASE ADDITIVE 0.3 STYRENE 7.7085 ATH, SURFACE MODIFIED 25.8 10%
TERTIARY BUTYL CATECHOL 0.85 IN STYRENE QUATERNARY AMMONIUM
COMPOUND 0.35 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0045
ZINC OCTOATE 8% 0.03 10% 4-HYDROXY-TEMPO IN STYRENE 0.7
Example 2
An unsaturated polyester resin system (Example 2) comprising
TABLE-US-00003 Product Weight % UNSATURATED POLYESTER RESIN 62.407
GLYCERINE 0.075 TWEEN 20 TYPE SURFACTANT 0.075 CAB-O-SIL 1.3 AIR
RELEASE ADDITIVE 0.3 STYRENE 7.5894 ATH, SURFACE MODIFIED 25.8 10%
TERTIARY BUTYL CATECHOL 0.6 IN STYRENE QUATERNARY AMMONIUM 0.4
COMPOUND 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0036 ZINC
OCTOATE 8% 0.05 BlocBuilder RC-50 1
Additional embodiments comprises a styrenated vinyl ester. The
styrenated vinyl ester embodiments can achieve the necessary gel
time reactivity while maintaining greater than 24 hours of
stability at 77.degree. F. Further, the embodiments comprising a
styrenated vinyl ester require a relatively small amount of
inhibitor to increase the stability to greater than 24 hours. While
the below examples comprise a 10% 4-hydroxy TEMPO solution in
styrene as an inhibitor, other inhibitors can be used as discussed
throughout the application, and as would be known to one of
ordinary skill in the art.
Further, an unsaturated polyester resin as described herein can be
more reactive than other formulations and, as a result, lower water
bath temperatures can be used for curing. In some embodiments, a
water bath temperature of 140.degree. F. can be used. In other
embodiments, a water bath temperature of 150.degree. F. can be
used. In yet other embodiments, other water bath temperatures can
be used. The embodiments of the unsaturated polyester resin as
described herein can comprise a faster gelling/curing time, but
still be stable for extended periods of time at 77.degree. F. when
catalyzed. Some embodiments can further comprise
2,4-pentanedione
Example 3
A styrenated vinyl ester (Example 3) comprising
TABLE-US-00004 Product Weight % CORROSION RESISTANT 62.407
UNSATURATED POLYESTER BASE RESIN SURFACTANTS 0.45 FUMED SILICA 1.3
STYRENE 7.5894 ALUMINUM TRIHYDRATE 25.8 10% TERTIARY BUTYL CATECHOL
0.85 IN STYRENE 75% DICOCO DIMETHYL 0.35 AMMONIUM CHLORIDE IN
ISOPROPYL ALCOHOL 2,4-PENTANEDIONE 0.4 8% COPPER NAPHTHENATE 0.0045
8% ZINC OCTOATE 0.03 BlocBuilder RC-50 1
Example 4
A styrenated vinyl ester (Example 4) comprising
TABLE-US-00005 Product Weight % BASE RESIN 87.16 FUMED SILICA 01.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.86 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 4 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 4 are for
illustrative purposes.
Example 5
A styrenated vinyl ester (Example 5) comprising
TABLE-US-00006 Product Weight % BASE RESIN 87.80 FUMED SILICA 1.28
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.93 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 0.55 10% ORGANIC ZINC in MONOMER
0.19
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 5 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 5 are for
illustrative purposes.
Example 6
A styrenated vinyl ester (Example 6) comprising
TABLE-US-00007 Product Weight % BASE RESIN 86.33 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.78 INHIBITOR 0.95
QUAT SALT 0.45 1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC
in MONOMER 0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the inhibitor can
comprise a 10% 4-hydroxy TEMPO solution in styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 6 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
6 are for illustrative purposes.
Example 7
A styrenated vinyl ester (Example 7) comprising
TABLE-US-00008 Product Weight % BASE RESIN 86.74 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.82 INHIBITOR 0.48
QUAT SALT 0.45 1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC
in MONOMER 0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the inhibitor can
comprise a 10% 4-hyrdoxy TEMPO solution in styrene, the quat salt
can comprise Adogen 462, the organic copper can comprise 8%
elemental copper, and the organic zinc can comprise 8% elemental
zinc. The product can be cured using 1% CHP (K-90). The weights
used in Example 7 can vary depending on the size of resulting
product that is desired. As a result, the weights listed in Example
7 are for illustrative purposes.
Example 8
A styrenated vinyl ester (Example 8) comprising
TABLE-US-00009 Product Weight % BASE RESIN 87.36 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.89 QUAT SALT 0.22
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 8 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 8 are for
illustrative purposes.
Example 9
A styrenated vinyl ester (Example 9) comprising
TABLE-US-00010 Product Weight % BASE RESIN 86.45 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.90 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 9 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 9 are for
illustrative purposes.
Example 10
A styrenated vinyl ester (Example 10) comprising
TABLE-US-00011 Product Weight % BASE RESIN 86.82 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.83 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.76
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 10 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 10 are for
illustrative purposes.
Example 11
A styrenated vinyl ester (Example 11) comprising
TABLE-US-00012 Product Weight % BASE RESIN 86.41 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.45
1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC in MONOMER 0.76
Trigonox C 0.47
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc, and
Trigonox C comprises a peroxide comprising TBPB. The Trigonox C can
be added to the styrenated vinyl ester during the curing process
along with % CHP (K-90). The product can be cured using 1% CHP
(K-90). The weights used in Example 11 can vary depending on the
size of resulting product that is desired. As a result, the weights
listed in Example 11 are for illustrative purposes.
Example 12
A styrenated vinyl ester (Example 12) comprising
TABLE-US-00013 Product Weight % BASE RESIN 86.80 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 0.10 QUAT SALT 0.86
1% ORGANIC COPPER in MONOMER 1.09 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 12 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 12 are for
illustrative purposes.
Example 13
A styrenated vinyl ester (Example 13) comprising
TABLE-US-00014 Product Weight % BASE RESIN 86.39 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.08 10% ORGANIC ZINC in MONOMER 0.38
Trigonox C 0.47
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc, and
Trigonox C comprises a peroxide comprising TBPB. The Trigonox C can
be added to the styrenated vinyl ester during the curing process
along with % CHP (K-90). The product can be cured using 1% CHP
(K-90). The weights used in Example 13 can vary depending on the
size of resulting product that is desired. As a result, the weights
listed in Example 13 are for illustrative purposes.
Example 14
A styrenated vinyl ester (Example 14) comprising
TABLE-US-00015 Product Weight % BASE RESIN 86.09 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.76 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.89 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 14 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 14 are for
illustrative purposes.
Example 15
A styrenated vinyl ester (Example 15) comprising
TABLE-US-00016 Product Weight % BASE RESIN 85.93 FUMED SILICA 1.25
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.74 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.89 10% ORGANIC ZINC in MONOMER 0.38
ACCELERATOR 0.19
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, the organic zinc can comprise 8% elemental zinc, and the
accelerator can comprise a copromoter which can comprise
2,4-pentanedione. The product can be cured using 1% CHP (K-90). The
weights used in Example 15 can vary depending on the size of
resulting product that is desired. As a result, the weights listed
in Example 15 are for illustrative purposes.
Example 16
A styrenated vinyl ester (Example 16) comprising
TABLE-US-00017 Product Weight % BASE RESIN 86.42 FUMED SILICA 1.26
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.79 QUAT SALT 0.85
1% ORGANIC COPPER in MONOMER 1.90
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, and the organic copper can comprise 8%
elemental copper. The product can be cured using 1% CHP (K-90). The
weights used in Example 16 can vary depending on the size of
resulting product that is desired. As a result, the weights listed
in Example 16 are for illustrative purposes.
Example 17
A styrenated vinyl ester (Example 17) comprising
TABLE-US-00018 Product Weight % BASE RESIN 85.23 FUMED SILICA 1.24
#1 SURFACTANT 0.67 #2 SURFACTANT 0.09 MONOMER 8.67 QUAT SALT 0.44
1% ORGANIC COPPER in MONOMER 3.27 10% ORGANIC ZINC in MONOMER
0.37
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 17 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 17 are for
illustrative purposes.
Example 18
A styrenated vinyl ester (Example 18) comprising
TABLE-US-00019 Product Weight % BASE RESIN 84.05 FUMED SILICA 1.23
#1 SURFACTANT 0.66 #2 SURFACTANT 0.09 MONOMER 8.55 QUAT SALT 0.43
1% ORGANIC COPPER in MONOMER 4.61 10% ORGANIC ZINC in MONOMER
0.37
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 18 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 18 are for
illustrative purposes.
Example 19
A styrenated vinyl ester (Example 19) comprising
TABLE-US-00020 Product Weight % BASE RESIN 85.83 FUMED SILICA 1.25
#1 SURFACTANT 0.68 #2 SURFACTANT 0.09 MONOMER 8.73 QUAT SALT 0.22
1% ORGANIC COPPER in MONOMER 2.83 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 19 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 19 are for
illustrative purposes.
Example 20
A styrenated vinyl ester (Example 20) comprising
TABLE-US-00021 Product Weight % BASE RESIN 83.47 FUMED SILICA 1.22
#1 SURFACTANT 0.66 #2 SURFACTANT 0.09 MONOMER 8.49 QUAT SALT 0.21
1% ORGANIC COPPER in MONOMER 5.50 10% ORGANIC ZINC in MONOMER
0.37
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 20 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 20 are for
illustrative purposes.
Example 21
A styrenated vinyl ester (Example 21) comprising
TABLE-US-00022 Product Weight % BASE RESIN 86.75 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.82 QUAT SALT 0.48
1% ORGANIC COPPER in MONOMER 1.52 10% ORGANIC ZINC in MONOMER
0.38
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, the organic copper can comprise 8% elemental
copper, and the organic zinc can comprise 8% elemental zinc. The
product can be cured using 1% CHP (K-90). The weights used in
Example 21 can vary depending on the size of resulting product that
is desired. As a result, the weights listed in Example 21 are for
illustrative purposes.
Example 22
A styrenated vinyl ester (Example 22) comprising
TABLE-US-00023 Product Weight % BASE RESIN 87.08 FUMED SILICA 1.27
#1 SURFACTANT 0.69 #2 SURFACTANT 0.10 MONOMER 8.86 QUAT SALT 0.48
1% ORGANIC COPPER in MONOMER 1.53
The base resin can comprise bisphenol-A epoxy based vinyl ester
resin, the fumed silica can comprise Cabot CAB-O-SIL M-5, the #1
surfactant can comprise BYK R-605, the #2 surfactant can comprise
BYK A-555, the monomer can comprise styrene, the quat salt can
comprise Adogen 462, and the organic copper can comprise 8%
elemental copper. The product can be cured using 1% CHP (K-90). The
weights used in Example 22 can vary depending on the size of
resulting product that is desired. As a result, the weights listed
in Example 22 are for illustrative purposes.
As described above all of the Examples discussed throughout this
application can be cured at various temperatures. In some
embodiments, a water bath temperature of 140.degree. F. can be
used. In other embodiments, a water bath temperature of 150.degree.
F. can be used. In yet other embodiments, other water bath
temperatures can be used. Further, other methods of curing can be
used with the above compounds as would be known to one of ordinary
skill in the art.
Embodiments are described herein of various apparatuses, systems,
and/or methods. Numerous specific details are set forth to provide
a thorough understanding of the overall structure, function,
manufacture, and use of the embodiments as described in the
specification and illustrated in the accompanying drawings. It will
be understood by those skilled in the art, however, that the
embodiments may be practiced without such specific details. In
other instances, well-known operations, components, and elements
have not been described in detail so as not to obscure the
embodiments described in the specification. Those of ordinary skill
in the art will understand that the embodiments described and
illustrated herein are non-limiting examples, and thus it can be
appreciated that the specific structural and functional details
disclosed herein may be representative and do not necessarily limit
the scope of the embodiments, the scope of which is defined solely
by the appended claims.
Reference throughout the specification to "various embodiments,"
"some embodiments," "one embodiment," or "an embodiment", or the
like, means that a particular feature, structure, or characteristic
described in connection with the embodiment(s) is included in at
least one embodiment. Thus, appearances of the phrases "in various
embodiments," "in some embodiments," "in one embodiment," or "in an
embodiment," or the like, in places throughout the specification,
are not necessarily all referring to the same embodiment.
Furthermore, the particular features, structures, or
characteristics may be combined in any suitable manner in one or
more embodiments. Thus, the particular features, structures, or
characteristics illustrated or described in connection with one
embodiment may be combined, in whole or in part, with the features,
structures, or characteristics of one or more other embodiments
without limitation given that such combination is not illogical or
non-functional.
It will be further appreciated that for conciseness and clarity,
spatial terms such as "vertical," "horizontal," "up," and "down"
may be used herein with respect to the illustrated embodiments.
However, these terms are not intended to be limiting and
absolute.
Although at least one embodiment for an unsaturated polyester resin
system for cured in-place piping system, method, and apparatus has
been described above with a certain degree of particularity, those
skilled in the art could make numerous alterations to the disclosed
embodiments without departing from the spirit or scope of this
disclosure. All directional references (e.g., upper, lower, upward,
downward, left, right, leftward, rightward, top, bottom, above,
below, vertical, horizontal, clockwise, and counterclockwise) are
only used for identification purposes to aid the reader's
understanding of the present disclosure, and do not create
limitations, particularly as to the position, orientation, or use
of the devices. Joinder references (e.g., affixed, attached,
coupled, connected, and the like) are to be construed broadly and
can include intermediate members between a connection of elements
and relative movement between elements. As such, joinder references
do not necessarily infer that two elements are directly connected
and in fixed relationship to each other. It is intended that all
matter contained in the above description or shown in the
accompanying drawings shall be interpreted as illustrative only and
not limiting. Changes in detail or structure can be made without
departing from the spirit of the disclosure as defined in the
appended claims.
Any patent, publication, or other disclosure material, in whole or
in part, that is said to be incorporated by reference herein is
incorporated herein only to the extent that the incorporated
materials does not conflict with existing definitions, statements,
or other disclosure material set forth in this disclosure. As such,
and to the extent necessary, the disclosure as explicitly set forth
herein supersedes any conflicting material incorporated herein by
reference. Any material, or portion thereof, that is said to be
incorporated by reference herein, but which conflicts with existing
definitions, statements, or other disclosure material set forth
herein will only be incorporated to the extent that no conflict
arises between that incorporated material and the existing
disclosure material.
* * * * *