U.S. patent number 10,115,001 [Application Number 15/496,161] was granted by the patent office on 2018-10-30 for biometric image sensing.
This patent grant is currently assigned to IDEX ASA. The grantee listed for this patent is IDEX ASA. Invention is credited to Fred G. Benkley, III.
United States Patent |
10,115,001 |
Benkley, III |
October 30, 2018 |
Biometric image sensing
Abstract
A novel sensor is provided having a plurality of substantially
parallel drive lines configured to transmit a signal into a surface
of a proximally located object and also a plurality of
substantially parallel pickup lines oriented proximate the drive
lines and electrically separated from the drive lines to form
intrinsic electrode pairs that are impedance sensitive at each of
the drive and pickup proximal locations. A switch is integrated
with the sensor.
Inventors: |
Benkley, III; Fred G. (Andover,
MA) |
Applicant: |
Name |
City |
State |
Country |
Type |
IDEX ASA |
Fornebu |
N/A |
NO |
|
|
Assignee: |
IDEX ASA (Fornebu,
NO)
|
Family
ID: |
46126687 |
Appl.
No.: |
15/496,161 |
Filed: |
April 25, 2017 |
Prior Publication Data
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Document
Identifier |
Publication Date |
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US 20170228574 A1 |
Aug 10, 2017 |
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Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
Issue Date |
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14946040 |
Nov 19, 2015 |
9659208 |
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13620271 |
Feb 23, 2016 |
9268988 |
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13118243 |
Oct 21, 2014 |
8866347 |
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12820100 |
Jul 29, 2014 |
8791792 |
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12688790 |
Apr 16, 2013 |
8421890 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06K
9/00053 (20130101); G06K 9/0002 (20130101); G01N
27/04 (20130101); Y10T 307/766 (20150401) |
Current International
Class: |
G06K
9/00 (20060101) |
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|
Primary Examiner: Deberadinis; Robert
Attorney, Agent or Firm: Rothwell, Figg, Ernst & Manbeck
P.C.
Parent Case Text
RELATED APPLICATIONS
This application is a Continuation of U.S. application Ser. No.
14/946,040, filed Nov. 19, 2015, which is a Continuation of U.S.
application Ser. No. 13/620,271, filed Sep. 14, 2012, now U.S. Pat.
No. 9,268,988, which is a Continuation of U.S. application Ser. No.
13/118,243, filed May 27, 2011, now U.S. Pat. No. 8,866,347, which
is a Continuation-in-Part of U.S. application Ser. No. 12/820,100,
filed Jun. 21, 2010, now U.S. Pat. No. 8,791,792, which is a
Continuation-in-Part of U.S. application Ser. No. 12/688,790, filed
Jan. 15, 2010, now U.S. Pat. No. 8,421,890, the respective
disclosures of which are hereby incorporated by reference.
Claims
What is claimed is:
1. An assembly combining a fingerprint sensor with a switch, the
assembly comprising: a flexible fingerprint sensor comprising: a
flexible dielectric substrate, a plurality of drive lines
configured to transmit a signal, and a plurality of pickup lines
configured to receive at least a portion of the signal transmitted
by the drive lines, wherein the pickup lines are oriented
transversely to the drive lines and are physically separated from
the drive lines by the flexible dielectric substrate to form a
sensing area having a two dimensional array of electrode pairs that
are impedance sensitive to detect ridge and valley features of a
finger proximally located with respect to at least a portion of the
sensing area; and a sensor switch assembly comprising: a base
having a top surface, wherein the sensing area of the flexible
fingerprint sensor is disposed over the top surface of the base,
and a switch below the sensing area, wherein the flexible
fingerprint sensor and the sensor switch assembly are constructed
and arranged to allow a user to contact the switch by placing a
finger on the sensing area over the switch.
2. The assembly of claim 1, wherein the base includes an opening
formed therein and the switch is disposed within the opening of the
base.
3. The assembly of claim 2, wherein a top surface of the switch is
flush with the top surface of the base.
4. The assembly of claim 2, wherein a top surface of the switch is
recessed with respect to the base in the opening formed in the
base.
5. The assembly of claim 1, wherein the flexible fingerprint sensor
further comprises a processor attached to the flexible dielectric
substrate and connected to the drive lines and to the pickup
lines.
6. The assembly of claim 1, wherein the flexible fingerprint sensor
is at least partially folded about the base.
7. The assembly of claim 6, wherein the drive lines and the pickup
lines are disposed on different portions of a first side of the
flexible dielectric substrate, and wherein the flexible fingerprint
sensor is folded over the base so that the portions of the flexible
dielectric substrate on which the drive lines and pickup lines are
disposed overlap each other on the top side of the base.
8. The assembly of claim 1, wherein the switch comprises a switch
base and a plunger.
9. The assembly of claim 1, wherein the switch is a dome
switch.
10. The assembly of claim 1, wherein the switch comprises a plunger
and wherein the flexible fingerprint sensor and the sensor switch
assembly are constructed and arranged so that a finger placed on
the sensing area will simultaneously depress the plunger.
11. The assembly of claim 1, wherein the drive lines are parallel
to one another and the pickup lines are parallel to one
another.
12. The assembly of claim 1, wherein the switch is a mechanical
switch, and the sensor switch assembly is constructed and arranged
to allow the user to actuate the switch by placing a finger on the
sensing area over the switch.
13. The assembly of claim 1, further comprising a host device,
wherein the flexible fingerprint sensor and the sensor switch
assembly are integrated into the host device and the switch is
operatively connected to the host device to enable the switch to
control an operation of the host device.
14. The assembly of claim 13, wherein the host device is a mobile
telephone or a smart phone.
15. The assembly of claim 13, wherein the switch is configured to
function as one or more of a power switch, a selector switch, or a
navigation switch of the host device.
16. The assembly of claim 13, wherein the flexible fingerprint
sensor is configured to authenticate a user to enable the switch to
control an operation of the host device.
17. The assembly of claim 13, wherein the host device comprises a
case, a portion of which is disposed over the top surface of the
base.
18. The assembly of claim 17, wherein an opening is formed in the
case and is positioned over the sensing area of the flexible
fingerprint sensor, and the opening is surrounded by a bezel.
19. A sensing module, comprising: a fingerprint sensor assembly,
comprising: a rigid base having a top surface; and a folded
flexible sensor covering the top surface of the rigid base and at
least partially wrapped around the rigid base to form a sensing
surface, and a switch disposed beneath the sensing surface, wherein
the fingerprint sensor assembly and the switch are constructed and
arranged to enable a finger placed on the sensing surface to
activate the switch.
20. The sensing module of claim 19, wherein a cutout is formed in
the rigid base, and the switch is disposed within the cutout formed
in the rigid base.
Description
BACKGROUND
The embodiment is generally related to electronic sensing devices,
and, more particularly, to sensors for sensing objects located near
or about the sensor.
In the electronic sensing market, there are a wide variety of
sensors for sensing objects at a given location. Such sensors are
configured to sense electronic characteristics of an object in
order to sense presence of an object near or about the sensor,
physical characteristics of the object, shapes, textures on
surfaces of an object, material composition, biological
information, and other features and characteristics of an object
being sensed.
Sensors may be configured to passively detect characteristics of an
object, by measuring such as temperature, weight, or various
emissions such as photonic, magnetic or atomic, of an object in
close proximity or contact with the sensor, or other
characteristic. An example of this is a non-contact infrared
thermometer that detects the black body radiation spectra emitted
from an object, from which its temperature can be computed.
Other sensors work by directly exciting an object with a stimulus
such as voltage or current, then using the resultant signal to
determine the physical or electrical characteristics of an object.
An example of this is a fluid detector consisting of two terminals,
one that excites the medium with a voltage source, while the second
measures the current flow to determine the presence of a conductive
fluid such as water.
Since a single point measurement of an object often does not
provide enough information about an object, it is often
advantageous to collect a two-dimensional array of measurements. A
two dimensional array of impedance may be created by moving a line
sensing array over the surface of an object and then doing a line
by line reconstruction of a two dimensional image like a fax
machine does. An example of this is a swiped capacitive fingerprint
sensor that measures differences in capacitance between fingerprint
ridges and valleys as a finger is dragged across it. Such sensors
reconstruct a two dimensional fingerprint image after the fact
using individual line information.
A simpler way to obtain a two dimensional image is to create a two
dimensional sensing array. Such sensors however can be prohibitive
in cost due to the large number of sensing points needed in the
array. An example of this is a two dimensional capacitive
fingerprint sensor. A number of these are currently manufactured
but use 150 mm.sup.2 or more of silicon area and are therefore cost
prohibitive for many applications.
These different types of electronic sensors have been used in
various applications, such as biometric sensors for measuring
biological features and characteristics of people such as
fingerprints, medical applications such as medical monitoring
devices, fluid measuring monitors, and many other sensor
applications. Typically, the sensing elements of the various
devices are connected to a processor configured to process object
information and to enable interpretations for object features and
characteristics.
There are many applications for two dimensional image sensors as a
particular example, and innovators have struggled with state of the
art technology that has come short of desired features and
functions. Fingerprint sensors, for example, have been in existence
for many years and used in many environments to verify
identification, to provide access to restricted areas and
information, and many other uses. In this patent application,
different types of fingerprint sensors will be highlighted as
examples of sensor applications where the embodiment is applicable
for simplicity of explanations, but other types of applications are
also relevant to this background discussion and will also be
addressed by the detailed description of the embodiment. These
placement sensors may be configured to sense objects placed near or
about the sensor, such as a fingerprint placement sensor that is
configured to capture a full image of a fingerprint from a user's
finger and compare the captured image with a stored image for
authentication. Alternatively, sensors may be configured to sense
the dynamic movement of an object about the sensor, such as a
fingerprint swipe sensor that captures partial images of a
fingerprint, reconstructs the fingerprint image, and compares the
captured image to a stored image for authentication.
In such applications, cost, though always a factor in commercial
products, has not been so critical--accuracy and reliability have
been and still remain paramount factors. Typically, the placement
sensor, a two-dimensional grid of sensors that senses a fingerprint
image from a user's fingerprint surface all at once, was the
obvious choice, and its many designs have become standard in most
applications. Once the fingerprint image is sensed and reproduced
in a digital form in a device, it is compared against a prerecorded
and stored image, and authentication is complete when there is a
match between the captured fingerprint image and the stored image.
In recent years, fingerprint sensors have been finding their way
into portable devices such as laptop computers, hand held devices,
cellular telephones, and other devices. Though accuracy and
reliability are still important, cost of the system components is
very important. The conventional placement sensors were and still
are very expensive for one primary reason: they all used silicon
sensor surfaces. These surfaces are very expensive, as the silicon
material is as expensive as the material to make a computer chip.
Computer chips, of course, have become smaller over the years to
reduce their cost and improve their performance. The reason the
fingerprint silicon could not be made smaller: they need to remain
the size of the average fingerprint, and the requirement for full
scanning of the users' fingerprints simply cannot be compromised.
The full print is required for adequate security in
authentication.
Enter the fingerprint swipe sensor into the market. Swipe sensors
are fundamentally designed with a line sensor configured to sense
fingerprint features as a user swipes their finger in a
perpendicular direction with respect to the sensor line. The cost
saver: swipe sensors need much less silicon, only enough to
configure a line sensor with an array of pixel sensors. The width
is still fixed based on the average fingerprint width, but the
depth is substantially smaller compared to the placement sensor.
Some swipe sensors are capacitive sensors, where capacitance of the
fingerprint surface is measured and recorded line by line. Others
send a small signal pulse burst into the surface of the fingerprint
surface and measure response in a pickup line, again recording
fingerprint features line by line. In either case, unlike the
placement sensors, the full fingerprint image needs to be
reconstructed after the user completes the swipe, and the
individual lines are reassembled and rendered to produce a full
fingerprint image. This image is compared with a fingerprint image
stored in the laptop or other device, and a user will then be
authenticated if there is an adequate match.
For the capacitive swipe sensors, the first generation sensors were
constructed with direct current (DC) switched capacitor technology
(for example U.S. Pat. No. 6,011,859). This approach required using
two plates per pixel forming a capacitor between them, allowing the
local presence of a finger ridge to change the value of that
capacitor relative to air. These DC capacitive configurations took
images from the fingerprint surface, and did not penetrate below
the finger surface. Thus, they were easy to spoof, or fake a
fingerprint with different deceptive techniques, and they also had
poor performance when a user had dry fingers. RF (Radio Frequency)
sensors were later introduced, because some were able to read past
the surface and into inner layers of a user's finger to sense a
fingerprint. Different radio frequencies have been utilized by
various devices along with different forms of detection including
amplitude modulation (AM) and, phase modulation (PM). There are
also differing configurations of transmitters and receivers, one
type (for example U.S. Pat. No. 5,963,679) uses a single
transmitter ring and an array of multiple low quality receivers
that are optimized for on chip sensing. In contrast another type
(for example U.S. Pat. No. 7,099,496) uses a large array of RF
transmitters with only one very high quality receiver in a comb
like plate structure optimized for off chip sensing.
One key impediment to the development of low cost placement sensors
has been the issue of pixel density, and the resultant requirement
for a large number of interconnections between layers of the sensor
device. A typical sensor for a fingerprint application will be on
the order of 10 mm.times.10 mm, with a resolution of 500 dpi. Such
a sensor array would be approximately 200 rows by 200 columns,
meaning there would need to be 200 via connections between layers
in the device. While semiconductor vias can be quite small, the
cost for implementing a sensor in silicon has proven to be
prohibitive, as mentioned above.
In order to produce a placement sensor at a low enough cost for
mass market adoption, lower cost processes such as circuit board
etching must be employed. The current state of the art in circuit
board via pitch is on the order of 200 .mu.m, vs. the 50 .mu.m
pitch of the sensor array itself. Additionally, the added process
steps required to form vias between layers of a circuit board
significantly increase the tolerances for the minimum pitch of
traces on each of the layers. Single-sided circuits may be readily
fabricated with high yield with line pitch as low as 35 .mu.m,
whereas double sided circuits require a minimum line pitch on the
order of 60 .mu.m or more, which is too coarse to implement a full
500 dpi sensor array. One further consideration is that at similar
line densities, double-sided circuits with vias are several times
more expensive per unit area than single sided, making high-density
double sided circuits too expensive for low cost sensor
applications.
For laptop devices, adoption of the swipe sensor was driven by
cost. The swipe sensor was substantially less expensive compared to
the placement sensors, and most manufacturers of laptops adopted
them based solely on price. The cost savings is a result of using
less silicon area. More recently a substitute for the silicon
sensor arose, using plastic Kapton.RTM. tape with etched sensing
plates on it, connected to a separate processor chip (for example
U.S. Pat. No. 7,099,496). This allowed the silicon portion of the
sensor to be separated from the sensing elements and the silicon to
follow Moore's law, shrinking to an optimal size, in length, width
and depth in proportion to advances in process technology. Although
this advance in the art enabled cheap durable Swipe Sensors, it did
not overcome the basic image reconstruction and ergonomics issues
resulting from changing from a simple two dimensional placement
format. In addition to Swipe Sensors being cheaper, they take up
less real estate in a host device, whether it is a laptop or a
smaller device, such as a cellular phone or personal data
device.
In most swipe class sensors, the fingerprint reconstruction process
turned out to be a greater ergonomic challenge to users and more of
a burden to quality control engineers than initially expected.
Users needed to be trained to swipe their finger in a substantially
straight and linear direction perpendicular to the sensor line as
well as controlling contact pressure. Software training programs
were written to help the user become more proficient, but different
environmental factors and the inability of some to repeat the
motion reliably gave Swipe Sensors a reputation for being difficult
to use. Initial data from the field indicated that a large number
of people were not regularly using the Swipe Sensors in the devices
that they had purchased and opted back to using passwords. Quality
control engineers who tried to achieve the optimum accuracy and
performance in the matching process between the captured and
reconstructed image found that the number of False Rejects (FRR),
and False Acceptances (FAR), were much higher in Swipe Sensors than
in placement sensors. Attempts to improve these reconstruction
algorithms failed to produce equivalent statistical performance to
placement sensors.
Other claims of the Swipe Sensor such as the use of less host real
estate did not pan out. Various ramps, wells and finger guides had
to be incorporated into the surfaces of the host devices to assist
the user with finger placement and swiping. These structures ended
up consuming significant space in addition to the actual sensor
area. In the end, swipe sensors ended up taking up almost as much
space as the placement sensors. This was not a big problem for full
size laptops, but is currently a substantial problem for smaller
laptops and netbooks, mobile phones, PDAs, and other small devices
like key fobs.
Real estate issues have become even more of an issue with mobile
device manufacturers who now require that the fingerprint sensor
act also as a navigation device, like a mouse or touch-pad does in
a laptop. The swipe sensor has proved to be a poor substitute for a
mouse or touch pad due to the fact that they are constructed with
an asymmetric array of pixels. Swipe sensors do a good job of
detecting motion in the normal axis of the finger swipe but have
difficulty accurately tracking sideways motion. Off axis angular
movements are even more difficult to sense, and require significant
processor resources to interpolate that movement with respect to
the sensor line, and often have trouble resolving large angles. The
byproduct of all this is a motion that is not fluid and difficult
to use.
It is clear that low cost two dimensional fingerprint sensor arrays
would serve a market need, but present art has not been able to
fill that need. Conventional capacitive fingerprint sensors
typically use distinct electrode structures to form the sensing
pixels array. These electrode structures are typically square or
circular and can be configured in a parallel plate configuration
(for example U.S. Pat. Nos. 5,325,442 and 5,963,679) or a coplanar
configuration (for example U.S. Pat. No. 6,011,859 and U.S. Pat.
No. 7,099,496).
These prior art approaches cannot be configured into a low cost two
dimensional array of sensing elements. Many capacitive fingerprint
sensors (for example U.S. Pat. Nos. 5,963,679 and 6,011,859) have
plate structures that must be connected to the drive and sense
electronics with an interconnect density that is not practical for
implementation other than using the fine line multilayer routing
capabilities of silicon chips and therefore require lots of
expensive silicon die are as stated before. Other sensors (for
example U.S. Pat. No. 7,099,496) use off chip sensing elements on a
cheap polymer film, but the sensor cell architecture is inherently
one dimensional and cannot be expanded into a two dimensional
matrix.
Another application for capacitive sensing arrays has been in the
area of touch pads and touch screens. Because touchpad and touch
screen devices consist of arrays of drive and sense traces and
distinct sense electrodes, they are incapable of resolutions below
a few hundred microns, making this technology unsuitable for
detailed imaging applications. These devices are capable of
detecting finger contact or proximity, but they provide neither the
spatial resolution nor the gray-scale resolution within the body of
the object being sensed necessary to detect fine features such as
ridges or valleys.
Conventional art in the touchpad field utilizes a series of
electrodes, either conductively (for example U.S. Pat. No.
5,495,077) or capacitively (for example US publication
2006/0097991). This series of electrodes are typically coupled to
the drive and sense traces. In operation these devices produce a
pixel that is significantly larger in scale than the interconnect
traces themselves. The purpose is to generally sense presence and
motion of an object to enable a user to navigate a cursor, to
select an object on a screen, or to move a page illustrated on a
screen. Thus, these devices operate at a low resolution when
sensing adjacent objects.
Thus, there exists a need in the art for improved devices that can
provide high quality and accurate placement sensors for use in
different applications, such as fingerprint sensing and
authentication for example, and that may also operate as a
navigation device such as a mouse or touch pad in various
applications. As will be seen, the embodiment provides such a
device that addresses these and other needs in an elegant
manner.
Given the small size and functional demands of mobile devices,
space savings are important. Thus, it would also be useful to be
able to combine the functions of a sensor with that of other
components, such as power switches, selector switches, and other
components, so that multiple functions are available to a user
without the need for more components that take up space.
Still further, it would be also useful for different embodiments of
a touch sensor to provide various alternatives for providing
biometric sensors that are easy to use and feasible in different
applications.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 shows a diagrammatic view of one embodiment showing the
drive and pickup plate structures with an insulating dielectric
layer separating the drive and pickup lines.
FIG. 2 shows a basic diagrammatic view of one embodiment showing
the basic electrical field operation without an object in close
proximity to the drive and pickup plate structures with one drive
plate excited by a voltage source.
FIG. 3 shows a basic diagrammatic view of one embodiment showing
the basic electrical field operation with an object in close
proximity to the drive and pickup plate structures with one drive
plate excited by a voltage source.
FIG. 4 shows a basic diagrammatic view of one embodiment of the
sensor showing the differences in field intensity with and without
an object in close proximity to the drive and pickup plate
structures with one drive plate excited by a voltage source.
FIG. 5 shows a basic diagrammatic view of one embodiment showing
the basic electrical field operation with an object in close
proximity of the drive and pickup plate structures with the
selected pickup plate amplified and all inactive drive and pickup
plates grounded.
FIG. 6A shows a basic diagrammatic view of one embodiment showing
the basic electrical field operation with a finger or object
containing a ridge surface feature in close proximity to the active
electrode pair.
FIG. 6B shows a basic diagrammatic view of one embodiment showing
the basic electrical field operation with a finger or object
containing a valley surface feature in close proximity to the
active electrode pair.
FIG. 7 shows a diagrammatic view of an x-y grid of plate rows and
columns depicted by lumped circuit components that represent the
electric field couplings of the sensor at each drive/pickup
crossover.
FIG. 8 shows an example of an embodiment of the placement
embodiment using a differential amplifier to take the signal from
the selected pickup plate and subtract it from a reference signal
plate for noise reduction purposes.
FIG. 9A shows the drive and sense multiplexing circuitry of an
embodiment that incorporates a tank circuit to compensate for input
loading effects.
FIG. 9B shows the drive and sense multiplexing circuitry of an
embodiment that incorporates cascaded buffers to minimize input
loading effects.
FIG. 9C shows the drive and sense multiplexing circuitry of an
embodiment that incorporates dedicated buffers for each sense to
minimize loading effects.
FIG. 10 shows an embodiment that incorporates an analog receiver to
process the sensed signal, and processing circuitry to perform the
drive and sense line scanning function.
FIG. 11 shows an embodiment that incorporates a direct digital
conversion receiver to process the sensed signal, and processing
circuitry to perform the drive and sense line scanning
function.
FIG. 12A shows one example of a layout of the drive and sense
traces for an embodiment that incorporates the folded aspect of the
embodiment laid out flat prior to folding.
FIG. 12B shows one example of a layout of the drive and sense
traces for an embodiment that incorporates the folded aspect of the
embodiment laid out flat prior to folding.
FIG. 13A shows the layer stack-up of an embodiment that
incorporates the folding aspect subsequent to folding.
FIG. 13B shows an embodiment that incorporates the folding aspect
subsequent to folding and assembly into a rigid module.
FIG. 14 shows a sensor system configured according to the
embodiment for the purpose of sensing features of an object.
FIG. 15 shows an example of the sensing of a fingerprint
features.
FIG. 16 shows the process flow steps required to collect a
2-dimensional image with a sensor system configured according to
one embodiment.
FIG. 17A shows the process flow steps required to authenticate a
user with a fingerprint sensor system configured according one
embodiment.
FIG. 17B shows the process of template extraction from a
fingerprint image typically utilized in user authentication
applications.
FIGS. 18A-18D show an example of a fingerprint sensor system having
an integrated switch to allow a user to contact a fingerprint
sensor and to actuate a switch simultaneously.
FIGS. 19A-J show another example of a fingerprint sensor system
having an integrated switch, a dome switch in this example, to
allow a user to contact a fingerprint sensor and to actuate a
switch simultaneously.
FIG. 20 shows a top view of an embodiment of a switch formed on the
same substrate as the fingerprint sensor.
FIGS. 21A and B are detailed views which show the operation of the
embedded switch depicted in FIG. 20.
FIGS. 22A-26C illustrate other embodiments of the invention.
DETAILED DESCRIPTION
As discussed in the background, there are many applications for a
two dimensional impedance sensor, and the embodiment provides a
broad solution to shortcomings in the prior art for many
applications. Generally, one embodiment is directed to a
two-dimensional sensor, and may also be referred to as a placement
sensor, area sensor, 2D sensor. The sensor may have sensor lines
located on one or more substrates, such as for example a flexible
substrate that can be folded over on itself to form a grid array
with separate sensor lines orthogonal to each other. The sensor
lines may alternatively be formed on separate substrates. In either
or any configuration, the crossover locations of different sensor
lines create sensing locations for gathering information of the
features and/or characteristics of an object, such as a fingerprint
for example.
In one embodiment, the drive lines and pickup lines are not
electrically intersecting or connected in a manner in which they
would conduct with each other, they form an impedance sensing
electrode pair with a separation that allows the drive lines to
project an electrical field and the pickup lines to receive an
electrical field, eliminating the need for distinct electrode
structures. The two lines crossing with interspersed dielectric
intrinsically creates an impedance sensing electrode pair. Thus,
the sensor is configured to activate two one-dimensional sensor
lines to obtain one pixel of information that identifies features
and/or characteristics of an object. Unlike conventional sensors, a
sensor configured according to certain embodiments may provide a
two dimensional grid that is capable of capturing multiple pixels
of information from an object by activating individual pairs of
drive and pickup lines and capturing the resultant signal. This
signal can be processed with logic or processor circuitry to define
features and/or characteristics of an object. For example, the
information may be used to produce renderings of an object, such as
a fingerprint, and compare the renderings to secured information
for authentication.
According to one embodiment, and in contrast to conventional
approaches, a device can utilize the intrinsic impedance sensing
electrode pair formed at the crossings between the drive and pickup
lines. In operation, the electric fields may be further focused by
grounding drive and pickup lines near or about the area being
sensed by the particular crossover location at one time. This
prevents interference that may occur if other drive and pickup
lines were sensing electric fields simultaneously. More than one
electrode pair may be sensed simultaneously. However, where
resolution is an important factor, it may be preferred to avoid
sensing electrode pairs that are too close to each other to avoid
interference and maintain accuracy in sensing object features at a
particular resolution. For purposes of this description, "intrinsic
electrode pair" refers to the use of the impedance sensing
electrode pairs that are formed at each of the drive and pickup
line crossover locations. Due to the fact that the embodiments use
each intrinsic electrode pair at each crossover as a sensing
element, no differentiating geometric features exist at individual
sensing nodes to distinguish them from the interconnect lines. As a
result, the alignment between the drive layers and sense layers is
non-critical, which significantly simplifies the manufacturing
process.
Grounding the adjacent inactive drive and pickup lines restricts
the pixel formed at each intrinsic electrode pair without requiring
complex measures such as the dedicated guard rings employed in
prior art (for example U.S. Pat. No. 5,963,679). Instead, guard
grounds around the pixel are formed dynamically by switching
adjacent inactive drive and pickup lines into ground potential.
This allows the formation of high density pixel fields with
relatively low resolution manufacturing processes, as the minimum
pixel pitch for a given process is identical to the minimum feature
spacing. This, in turn, enables the use of low cost manufacturing
process and materials, which is the key to creating a low cost
placement sensor.
In one example, the sensor lines may consist of drive lines on one
layer and pickup lines on another layer, where the layers are
located over each other in a manner that allows the separate sensor
lines, the drive and pickup lines, to cross over each other to form
impedance sensing electrode pairs at each crossover location. These
crossover locations provide individually focused electrical pickup
locations or pixels, or electrode pairs where a number of
individual data points of features and/or characteristics of an
object can be captured. The high degree of field focus is due to
the small size of the intrinsic electrode pairs, as well as the
high density of the neighboring ground provided by the inactive
plates. The flexible substrate may have a second substrate
configured with logic or processor circuitry for sending and
receiving signals with the sensor lines to electronically capture
information related to the object. Alternatively, there may be two
separate substrates carrying the separate sensor lines and layered
on each other, and yet connected to a third substrate for
connection to logic or processor circuitry.
The utilization of the crossover locations between perpendicular
lines on adjacent layers for the pickup cell greatly reduces the
alignment requirements between the layers. Since there are no
unique features at a sensor pixel location to align, the only real
alignment requirement between the layers is maintaining
perpendicularity. If the sense cell locations had specific
features, such as the parallel plate features typical of prior art
fingerprint sensors, the alignment requirements would include X and
Y position tolerance of less than one quarter a pixel size, which
would translate to less than +/-12 .mu.m in each axis for a 500 DPI
resolution fingerprint application.
In operation, a drive line is activated, with a current source for
example, and a pickup line is connected to a receiving circuit,
such as an amplifier/buffer circuit, so that the resulting electric
field can be captured. An electric field extends from the drive
line to the pickup line through the intermediate dielectric
insulating layer. If an object is present, some or all of the
electric field may be absorbed by the object, changing the manner
in which the electric field is received by the pickup line. This
changes the resulting signal that is captured and processed by the
pickup line and receiving circuit, and thus is indicative of the
presence of an object, and the features and characteristics of the
object may be sensed and identified by processing the signal. This
processing may be done by some form of logic or processing
circuitry.
In other embodiments, the signal driving the drive line may be a
complex signal, may be a varying frequency and/or amplitude, or
other signal. This would enable a sensor to analyze the features
and/or characteristics of an object from different perspectives
utilizing a varying or complex signal. The signal may include
simultaneous signals of different frequencies and/or amplitudes
that would produce resultant signals that vary in different manners
after being partially or fully absorbed by the object, indicating
different features and characteristics of the object. The signal
may include different tones, signals configured as chirp ramps, and
other signals. Processing or logic circuitry may then be used to
disseminate various information and data points from the resultant
signal.
In operation, the varying or complex signal may be applied to the
drive line, and the pickup line would receive the resulting
electric field to be processed. Logic or processing circuitry may
be configured to process the resulting signal, such as separating
out different frequencies if simultaneous signals are used, so that
features and/or characteristics of the object may be obtained from
different perspectives.
Given the grid of pixels that can be activated at individual pairs,
each pixel may be captured in a number of ways. In one embodiment,
a drive line may be activated, and pickup lines may be turned on
and off in a sequence to capture a line of pixels. This sequencing
may operate as a scanning sequence. Here a first drive line is
activated by connecting it to a signal source, and then one pickup
line is connected to amplifier/buffer circuitry at a time, the
information from the pixel formed at the crossing of the two lines
is captured, and then disconnected. Then, a next pixel is processed
in sequence, then another, then another, until the entire array of
pickup lines is processed. The drive line is then deactivated, and
another drive line is activated, and the pickup lines are again
scanned with this active drive line. These may be done one at a
time in sequence, several non-adjacent pixels may be processed
simultaneously, or other variations are possible for a given
application. After the grid of pixels is processed, then a
rendering of object information will be possible.
Referring to FIG. 1, a diagrammatic view of one embodiment of a
sensor 100 configured according to one embodiment is illustrated.
In this configuration, pickup lines or top plates 102a[m],
102b[m+1] are located on an insulating dielectric substrate layer
104. Drive lines or bottom plates 106a[n], 106b[n+1] are juxtaposed
and substantially perpendicular to the pickup lines or plates and
configured to transmit a signal into a surface of an object located
in close proximity to the sensor lines and are located on an
opposite side of the a insulating dielectric substrate to form a
type of a grid. The pickup lines are configured to receive the
transmitted electromagnetic fields modified by the impedance
characteristics on an object placed within the range of those
electric fields.
Referring to FIG. 2, a diagrammatic view of a sensor 200 is shown
having pickup lines or top plates 202a, 202b and insulating layer
204, and drive lines or bottom plates 206a, 206b. The Figure
further illustrates how electromagnetic fields 208a, 208b extend
between the drive lines and pickup plates through the substrate.
Without an object within proximity, the electric field lines are
uniform within the sensor structure and between the different
lines. When an object is present, a portion of the electric field
lines are absorbed by the object and do not return to the pickup
plates through the insulating layer.
Referring to FIG. 3, an object 310 is illustrated proximate the
sensor 300. The sensor 300 has pickup lines or top plates 302a,
302b, an insulating dielectric layer 304, and drive lines or bottom
plates 306a, 306b. In operation, the drive lines and pickup lines
of this device example may be individually activated, where a drive
line/pickup line pair is activated to produce an active circuit.
The result is a circuit that transmits electric field from active
drive plate 316 into the combined dielectric of the insulating
layer 304 and object 310 via electric field lines, 306a, 306b, and
received by the active pickup plate. As the illustration shows,
some of the field lines are captured by the object when it is
placed about the active electrode pair. The variations in an
object, such as peaks and valleys and other features of an object
surface, can be detected and captured electronically by capturing
and recording the resulting electric field variations occurring at
different crossover locations of the drive and pickup lines.
Similar to common capacitance based placement sensors, the sensor
can capture a type of image of the object surface electronically,
and generate a representation of the features and characteristics
of an object, such as the features and characteristics of a
fingerprint in the fingerprint sensor example described below.
In this configuration of FIG. 3, only one active electrode pair is
illustrated. However, the embodiment is not limited to this
particular configuration, where one single electrode pair, several
electrode pairs, or even all electrode pairs may be active at one
time for different operations. In practice, it may be desirable for
less than all of the electrode pairs to be active at a given time,
so that any interference that may occur between close-by pixels
would be minimized. In one embodiment, a drive line may be
activated, and the pickup lines may be scanned one or more at a
time so that a line of pixels can be captured along the drive line
and pickup lines as they are paired along a line at the crossover
locations. This is discussed in more detail below in connection
with FIG. 5.
In general, in operation, each area over which a particular drive
line overlaps a pickup line with a separation of the a insulating
dielectric substrate is an area that can capture and establish a
sensing location that defines characteristics or features of a
nearby object about that area. Since there exist multiple sensing
locations over the area of the sensor grid, multiple data points
defining features or characteristics of a nearby object can be
captured by the sensor configuration. Thus, the sensor can operate
as a planar two-dimensional sensor, where objects located on or
about the sensor can be detected and their features and
characteristics determined.
As described in the embodiments and examples below, the embodiment
is not limited to any particular configuration or orientation
described, but is only limited to the appended claims, their
equivalents, and also future claims submitted in this and related
applications and their equivalents. Also, many configurations,
dimensions, geometries, and other features and physical and
operational characteristics of any particular embodiment or example
may vary in different applications without departing from the
spirit and scope of the embodiment, which, again, are defined by
the appended claims, their equivalents, and also future claims
submitted in this and related applications and their
equivalents.
In the following description, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiment. However, it will be apparent to one skilled in the art
that the embodiment can be practiced without these specific
details. In other instances, well known circuits, components,
algorithms, and processes have not been shown in detail or have
been illustrated in schematic or block diagram form in order not to
obscure the embodiment in unnecessary detail. Additionally, for the
most part, details concerning materials, tooling, process timing,
circuit layout, and die design have been omitted inasmuch as such
details are not considered necessary to obtain a complete
understanding of the embodiment and are considered to be within the
understanding of persons of ordinary skill in the relevant art.
Certain terms are used throughout the following description and
claims to refer to particular system components. As one skilled in
the art will appreciate, components may be referred to by different
names. This document does not intend to distinguish between
components that differ in name, but not function. In the following
discussion and in the claims, the terms "including" and
"comprising" are used in an open-ended fashion, and thus should be
interpreted to mean "including, but not limited to . . . ."
Embodiments of the embodiment are described herein. Those of
ordinary skill in the art will realize that the following detailed
description of the embodiment is illustrative only and is not
intended to be in any way limiting. Other embodiments of the
embodiment will readily suggest themselves to such skilled persons
having the benefit of this disclosure. Reference will be made in
detail to implementations of the embodiment as illustrated in the
accompanying drawings. The same reference indicators will be used
throughout the drawings and the following detailed description to
refer to the same or like parts.
In the interest of clarity, not all of the routine features of the
implementations described herein are shown and described. It will,
of course, be appreciated that in the development of any such
actual implementation, numerous implementation-specific decisions
must be made in order to achieve the developer's specific goals.
Moreover, it will be appreciated that such a development effort
might be complex and time-consuming, but would nevertheless be a
routine undertaking of engineering for those of ordinary skill in
the art having the benefit of this disclosure.
In one embodiment, a sensor device includes drive lines located on
or about an insulating dielectric substrate and configured to
transmit a signal onto a surface of an object being sensed. Pickup
lines are located near or about the drive lines and configured to
receive the transmitted signal from the surface of an object. In
order to keep a separation between the drive lines and pickup
lines, the substrate may act as an insulating dielectric or spacing
layer. The substrate may be for example a flexible polymer based
substrate. One example is Kapton.RTM. tape, which is widely used in
flexible circuits such as those used in printer cartridges and
other devices. The package may include such a flexible substrate,
where the drive lines may be located on one side of the substrate,
and the pickup lines may be located on an opposite side of the
substrate.
The drive lines may be orthogonal in direction with respect to the
pickup lines, and may be substantially perpendicular to the pickup
lines. According to one embodiment, a device may be configured with
drive lines and pickup lines located on or about opposite sides of
an insulating dielectric substrate, where the combination of these
three components provides capacitive properties. The drive lines
may be activated to drive an electric field onto, into or about an
object. The pickup lines can receive electronic fields that
originated from the drive lines, and these electronic fields can be
interpreted by processing or logic circuitry to interpret features
or characteristics of the object being sensed.
Thus, in one embodiment the layer separating the drive lines from
the pickup lines can provide a capacitive property to the assembly.
If some or all of the drive lines are substantially perpendicular
to the pickup lines, either entirely or in portions, then a grid
may be formed. In such a configuration, from a three dimensional
view, the drive lines are located and oriented substantially in
parallel with respect to each other about a first plane. One
surface of the substrate is located about the drive lines in a
second plane that is substantially parallel relative to the drive
lines. The pickup lines are located and oriented substantially in
parallel with respect to each other about a third plane that is
substantially parallel to the first and second planes and also
located about another substrate surface that is opposite that of
the drive lines, such that the substrate is located substantially
between the drive lines and the pickup lines.
In this description, including descriptions of embodiments and
examples, there will be references to the terms parallel,
perpendicular, orthogonal and related terms and description. It is
not intended, nor would it be understood by those skilled in the
art that these descriptions are at all limiting. To the contrary,
the embodiment extends to orientations and configurations of the
drive lines, the pickup lines, the substrate or related structure,
and also various combinations and permutations of components, their
placement, distance from each other, and order in different
assemblies of a sensor. Though the embodiment is directed to a
sensor configured with plurality of drive and pickup lines that
generally cross over each other at a pixel location and are
configured to detect presence and other features and
characteristics of a nearby object, the embodiment is not limited
to any particular configuration or orientation, but is only limited
to the appended claims, their equivalents, and also future claims
submitted in this and related applications and their
equivalents.
Also, reference will be made to different orientations of the
geometric planes on which various components will lie, such as the
drive and pickup lines and the substrate that may be placed in
between the sets of drive and pickup lines. If flexible substrates
are used for example, the use of such a structure will allow for
planes to change as a flexible structure is flexed or otherwise
formed or configured. In such embodiment will be understood that
certain aspects of the embodiment are directed to the drive lines
and pickup lines being configured on opposite sides of a substrate
and in a manner that enables the sensing of particular features
and/or characteristics of a nearby object at each crossover
location of a drive line and a pickup line. Thus, the orientation
of the planes (which may be deformable, and thus may be sheets
separated by a substantially uniform distance) of groups of
components (such as drive lines or pickup lines for example) or
substrates may vary in different applications without departing
from the spirit and scope of the embodiment.
Also, reference will be made to pickup lines, pickup plates, drive
lines, drive plate, and the like, but it will be understood that
the various references to lines or plates may be used
interchangeably and do not limit the embodiment to any particular
form, geometry, cross-sectional shape, varying diameter or
cross-sectional dimensions, length, width, height, depth, or other
physical dimension of such components. Also, more sophisticated
components may be implemented to improve the performance of a
device configured according to the embodiment, such as for example
small 65, 45, 32 or 22 nanometer conduction lines or carbon
nano-tubes that may make an assembly more easily adapted to
applications where small size and shape as well as low power are
desired characteristics and features. Those skilled in the art will
understand that such dimensions can vary in different applications,
and even possibly improve the performance or lower power
consumption in some applications, without departing from the spirit
and scope of the embodiment.
Reference will also be made to various components that are
juxtaposed, layered, or otherwise placed on each other. In one
example of an embodiment, a plurality of drive lines are juxtaposed
on one surface of a generally planar substrate, and a plurality of
pickup lines are juxtaposed on an opposite surface of the planar
substrate. The drive lines are substantially orthogonal to the
pickup lines, and may be described as substantially perpendicular
to the pickup lines. The distance between the drive lines and
pickup lines may be filled with a substrate or insulating material
that will provide for a capacitive configuration. Here the drive
lines on one side of the substrate forms one capacitive plate, and
the pickup lines on an opposite side for the corresponding
capacitive plate. In operation, when the drive plate is activated,
an electrical field is generated between the drive lines and pickup
lines and through the substrate to form a plurality of capacitive
elements. These capacitive elements are located at an area at each
cross-section of a drive line and a pickup line with a portion of
the substrate located between the areas. This is a location where
the respective drive lines and pickup lines overlap each other. In
any particular application, these areas in which the three
components interact during operation define a data location at
which a sensor reading can be made.
Reference will also be made to sensor lines, such as sensor drive
lines and sensor pickup lines, and their orientation amongst
themselves and each other. For example, there will be described
substantially parallel drive lines. These drive lines are intended
to be described as parallel conductive lines made up of a
conductive material formed, etched, deposited or printed onto the
surface such as copper, tin, silver and gold. Those skilled in the
art will understand that, with the inherent imperfections in most
any manufacturing process, such conductive lines are seldom
"perfect" in nature, and are thus not exactly parallel in practice.
Therefore, they are described as "substantially parallel".
Different applications may configure some of the drive lines even
non-parallel, such that the lines may occur parallel for a portion
of the line, and the line may necessarily deviate from parallel in
order to connect with other components for the device to operate,
or in order to be routed on or about the substrate on which it is
formed or traced. Similarly, the separate array of lines may be
described as orthogonal or perpendicular, where the drive lines are
substantially orthogonal or perpendicular to the pickup lines.
Those skilled in the art will understand that the various lines may
not be perfectly perpendicular to each other, and they may be
configured to be off-perpendicular or otherwise crossed-over in
different angles in particular applications. They also may be
partially perpendicular, where portions of drive lines may be
substantially perpendicular to corresponding portions of pickup
lines, and other portions of the different lines may deviate from
perpendicular in order to be routed on or about the substrate or to
be connected to other components for the device to operate.
These and other benefits provided by the embodiment will be
described in connection with particular examples of embodiments of
the embodiment and also descriptions of intended operational
features and characteristics of devices and systems configured
according to the embodiment.
In operation, generally, the drive lines can transmit an
electromagnetic field toward an object that is proximal to the
device. The pickup lines may receive a signal originating from the
drive lines and then transmitted through the object and through the
substrate and onto the pickup lines. The pickup lines may
alternatively receive a signal originating from the drive lines
that were then transmitted through the substrate and onto the
pickup lines without passing through the object. This electric
field can vary at different locations on the grid, giving a
resultant signal that can be interpreted by some type of logic or
processor circuitry to define features and/or characteristics of an
object that is proximate the assembly.
The drive lines and pickup lines may be controlled by one or more
processors to enable the transmission of the signal to an object
via the drive lines, to receive a resultant signal from an object
via the pickup lines, and to process the resultant signal to define
an object image. One or more processors may be connected in one
monolithic component, where the drive lines and pickup lines are
incorporated in a package that includes the processor. In another
embodiment, the drive lines, pickup lines and substrate may be
assembled in a package by itself, where the package can be
connected to a system processor that controls general system
functions. This way, the package can be made part of the system by
connecting with a system's input/output connections in order to
communicate with the system. This would be similar in nature for
example to a microphone connected to a laptop, where the audio
signals are received by the system processor for use by the laptop
in receiving sounds from a user. According to this embodiment, the
sensor can be connected as a stand-alone component that
communicates with the system processor to perform sensor operations
in concert with the system processor.
In another embodiment, a sensor may be configured to drive signals
at different frequencies since the impedance of most objects,
especially human tissue and organs, will greatly vary with
frequency. In order to measure complex impedance at one or more
frequencies of a sensed object, the receiver must be able also to
measure phase as well as amplitude. In one embodiment, the
resulting signal generated from a given impedance sensing electrode
pair may result from varying frequencies, known in the art as
frequency hopping, where the receiver is designed to track a
random, pseudo-random or non-random sequence of frequencies. A
variation of this embodiment could be a linear or non-linear
frequency sweep known as a chirp. In such an embodiment one could
measure the impedance of a continuous range frequencies very
efficiently.
In yet another embodiment, a grid sensor as described above may be
configured to also operate as a pointing device. Such a device
could perform such functions as well known touch pads, track balls
or mice used in desktops and laptop computers.
In one example of this embodiment, a two dimensional impedance
sensor that can measure the ridges and valleys of a fingertip may
be configured to track the motion of the fingerprint patterns.
Prior art swiped fingerprint sensors can perform this function, but
due to the physical asymmetry of the array and the need to speed
correct, or "reconstruct" the image in real time make these
implementations awkward at best. The sensor could also double as
both a fingerprint sensor and a high quality pointing device.
One device configured according to the embodiment includes a first
array of sensor lines on a flexible substrate, and a second array
of sensor lines on a flexible substrate, and also a processor
configured to process fingerprint data from the first and second
arrays of sensor lines. When folded upon itself in the case of a
single flexible substrate or when juxtaposed in the case of
separate substrates, the separate sensor lines cross each other
without electrically shorting to form a grid with cross-over
locations that act as pixels from which fingerprint features can be
sensed. In one embodiment, an array of substantially parallel
sensor drive lines is located on a surface of the flexible
substrate. These drive lines are configured to sequentially
transmit signal into a surface of a user's finger activating a line
at a time. A second array of sensor lines is similar to the first,
consisting of substantially parallel sensor pickup lines that are
substantially perpendicular to the drive lines. These pickup lines
are configured to pick up the signal transmitted from the
first.
In the configuration where the first and second set of sensor
lines, the drive and the pickup lines for example, are located on
different sections of an extended surface of the flexible
substrate, the flexible substrate is further configured to be
folded onto itself to form a dual layer configuration. Here, the
first array of sensor drive lines becomes substantially
perpendicular to the second array of pickup sensor lines when the
flexible substrate is folded onto itself. This folding process
creates crossover locations between these separate arrays of sensor
lines--though they must not make direct electrical contact so that
they operate independently. These crossover locations represent
impedance sensing electrode pairs configured to sense pixels of an
object and its sub-features juxtaposed relative to a surface of the
flexible substrate. The scanning of these pixels is accomplished by
activating individual rows and columns sequentially. Once a drive
column is activated with drive signal the perpendicular pickup rows
are scanned one at a time over the entire length of the selected
driver. Only one row is electrically active (high impedance) at a
time, the non-active rows are either shorted to ground or
multiplexed to a state where they do not cross couple signal. When
a finger ridge is placed above an array crossover location that is
active, it interrupts a portion of the electric field that
otherwise would be radiated through the surface film from the
active drive column to the selected row pickup. The placement of an
object's subfeature, such as a ridge or valley in the case of a
fingerprint sensor, over an impedance sensing electrode pair
results in a net signal decrease since some of the electric field
is conducted to ground through the human body. In a case of a
fingerprint sensor the placement of a fingerprint ridge/valley over
an impedance sensing electrode pair, the valley affects the
radiation of electric field from the selected drive line to the
selected pickup line much less than a ridge would. By comparing the
relative intensity of signals between the pixels ridges and
valleys, a two dimensional image of a finger surface can be
created.
Referring again to FIG. 1, this general example of the grid sensor
will be now used to illustrate how such a sensor configured
according to the embodiment can be implemented as a fingerprint
sensor, where the object would simply be the surface of the
fingerprint on the user's finger. This example will be carried
through the following Figures for illustration of the benefits and
novel features of the impedance sensor configured according to the
embodiment. However, it will be appreciated by those skilled in the
art, however, that any object may be sensed by a device configured
according to the embodiment. Again, the example and description are
intended only for illustration purposes.
In operation, the sensor can be configured to detect the presence
of a finger surface located proximate to the sensor surface, where
the drive lines can drive an active electromagnetic field onto the
finger surface, and the pickup lines can receive a resulting
electromagnetic field signal from the pickup lines. In operation,
the drive lines can generate an electric field that is passed onto
the surface of the finger, and the different features of the
fingerprint, such as ridges and valleys of the fingerprint surface
and possibly human skin characteristics, would cause the resulting
signal to change, providing a basis to interpret the signals to
produce information related to the fingerprint features.
In one embodiment of a fingerprint sensor, referring again to FIG.
1 in the context of a fingerprint sensor, a flexible substrate is
used as the insulating dielectric layer 104, to allow for
beneficial properties of durability, low cost, and flexibility. The
drive lines or plates 106a, 106b, are located on the flexible
substrate and configured to transmit a signal into a surface of a
user's fingerprint features and structures, such as ridges and
valleys, placed on or about the sensor lines. The pickup lines
102a, 102b are configured to receive the transmitted signal from
the user's finger surface. A processor (not shown) can be
configured to collect and store a fingerprint image based on the
received signal from the pickup lines.
Referring to FIG. 4, an example sensor 400 configured as an object
sensor, where the top plates or pickup lines 402a, 402b, . . . ,
402n are located on one side of insulating dielectric layer or
substrate 404. Bottom plates or drive lines 406a, 406b, . . . ,
406n are located on an opposite side of the substrate 404. Electric
fields 408a, 408b extend from bottom plates or drive lines 406a,
406b through the insulating layer or substrate 404 and onto active
top plate 402a. According to the embodiment, these drive lines may
be activated one at a time to reduce any interference effects, but
the electric field results illustrated here are intended to
illustrate a contrast between electric fields that are partially or
fully absorbed by the object with electric fields that are not
absorbed by the object at all. This information may be collected
from drive and pickup plate electrode pairs at each crossover
location to sense features and characteristics of the object that
is proximate the sensor lines. Partially covered top plate or
pickup line 402b is connected to voltmeter 417, and uncovered top
plate 402a is connected to voltmeter 418. Active drive line or
bottom plate 406b is connected is connected to AC signal source
416, causing an electric field to radiate from active plate 406b.
According to a particular application, the number of drive lines
and pickup lines can vary depending on the application, and it may
depend on the cost and resolution desired. As can be seen, the
electric field lines 408a is partially captured by the pickup lines
402a and 402b, and part is captured by the object, in this case
finger 410. Also, in order to illustrate that the pickup lines will
exhibit different reading when an object or object feature is
present or not present or proximate to a given crossover location,
volt meter 417 illustrates the response to the top plate or drive
line 402b, and voltmeter 418 illustrates the response of top plate
or drive line 402a. The difference in the deflections of voltmeter
417 in comparison 418 show the delta in electric field intensity
between the two electrode pair locations, one with a finger present
the other without.
Referring to FIG. 5, another example of a sensor configured
according to the embodiment is illustrated for the drive and pickup
configuration when detecting the presence of an object. The sensor
500 is illustrated, where the top plates or pickup lines 502a,
502b, . . . , 502n are located on one side of insulating layer or
substrate 504, and bottom plates or drive lines 506a, 506b, . . . ,
506n are located on an opposite side of the substrate 504. Again,
the pickup lines are shown on the layer closest to the object being
sensed for maximum sensitivity, and the drive lines shown on the
opposite side of the substrate. Electric fields 508a, 508b extend
from bottom plates or drive lines 506a, 506b through the insulating
layer or substrate 504 and onto active top plate 502b. Other
configurations are possible, perhaps having drive plates on the
top, and pickup plates on the bottom. The embodiment, however, is
not limited to any particular configuration that is insubstantially
different than the examples and embodiments disclosed and claimed
herein.
FIG. 5, further shows a snapshot of one selected individual
electrode pair located at the crossover of pickup line 502b and
drive line 506b, where the remaining pickup and drive lines are not
active, shown grounded in FIG. 5. Drive line 506b is connected to
AC voltage source 516, and pickup line 502b is connected to
amplifier/buffer 514. Once activated as shown here, electric field
lines 508a, 508b are generated, and they radiate from drive line
506b and are sensed by pickup line 502b, sending the resultant
signal into amplifier/buffer 514, and are later processed by analog
and digital circuit functions. Grounding the inactive adjacent
drive and pickup lines focuses the electric fields 508a and 508b at
the crossover location between the active the drive and pickup
plates, limiting crosstalk from adjacent areas on the object being
sensed. As the sensing operation proceeds in this embodiment,
different drive line/pickup line crossover pairings may be
activated to capture different pixels of information from the
object. In the case of an object sensor, it can capture information
on the shape of the object, and, if the electrical characteristics
are non-uniform across its surface, it's composition. Again, the
embodiment is not limited to this particular configuration, where
one single electrode pair, several electrode pairs, or even all
electrode pairs may be active at one time for different operations.
In practice, it may be preferable for less than all of the
impedance sensing electrode pairs to be active at a given time, so
that any interference that may occur between close-by pixels would
be minimized. In one embodiment, a drive line may be activated, and
the pickup lines may be scanned one or more at a time so that a
line of pixels can be captured along the drive line and pickup
lines as they are paired along a line at the crossover locations.
Thus, and still referring to FIG. 5, the AC voltage source 516 may
remain connected to drive line 506b, and the connection of the
amplifier/buffer 516 may cycle or scan over to sequential pickup
lines, so that another pixel of information can be captured from
another pickup line crossover paired with drive line 506b. Once
substantially all the pickup lines 506a-n have been scanned drive
line 506b can be deactivated, than another drive line in sequence
can be activated with the AC voltage source, and a new scanning can
commence through the pickup lines. Once substantially all drive
line/pickup line pairings have been scanned to capture the full
two-dimensional array of pixels, then a two dimensional image or
rendering of the object features and characteristics can be made,
such as a rendering of the shape of the object, and potentially a
composition map.
As another example of a sensor that can benefit from the
embodiment, a reduced cost fingerprint swipe sensor could be
configured using the same innovation provided by the embodiment. In
this embodiment, a reduced number of pickup lines could be
configured with a full number of orthogonal drive lines. Such a
configuration would create a multi-line swipe sensor that would
take the form of pseudo two-dimensional sensor, and when a finger
was swiped over it would create a mosaic of partial images or
slices. The benefit of this would be to reduce the complexity of
image reconstruction task, which is problematic for current
non-contact silicon sensors that rely on one full image line and a
second partial one to do speed detection.
The tradeoff would be that this pseudo two dimensional array would
have to be scanned at a much faster rate in order to keep up with
the varying swipe speeds of fingers that have to be swiped across
it.
FIGS. 6A and 6B illustrate the operation of the sensor when
detecting surface features of an object such as fingerprint ridges
and valleys. The sensor is configured identically to the previous
example in FIG. 5, but in this case is interacting with a textured
surface such as a fingerprint.
Referring to FIGS. 6A and B, another example of a sensor configured
according to the embodiment is illustrated. The sensor 600 is
illustrated, where the top plates or pickup lines 602a-n are
located on one side of insulating layer or substrate 604, and
bottom plates or drive lines 606a-n are located on an opposite side
of the substrate 604. For maximum sensitivity pickup lines are
shown on the layer closest to the object being sensed, and the
drive lines shown on the opposite side of the substrate. FIG. 6A
shows electric field lines 620 as they interact with a proximally
located object's valley and FIG. 6B shows electric field lines 621
as the interact with a proximally located object's peaks, extending
from bottom plate drive line 606b through the insulating layer or
substrate 604 and onto active top pickup line 602b. In the case of
sensing a fingerprint, the corresponding ridges and valleys over
the fingerprint surface can be captured by the grid of drive
line/pickup line crossover points, and the resulting data can be
used to render an image of the fingerprint. A stored fingerprint
can then be compared to the captured fingerprint, and they can be
compared for authentication. This is accomplished using any one of
many fingerprint matching algorithms which are available from
vendors as stand-alone products. Such vendors include Digital
Persona, BioKey, and Cogent Systems, to name just a few.
Also illustrated in FIGS. 6A and B, is the individual sensor line
pairing of pickup line 602b and drive line 606b. Their crossover
forms the active electrode pair, and the remaining pickup and drive
lines are not active, and will nominally be grounded by electronic
switches. Drive line 606b is connected to AC voltage source 616,
and pickup line 602b is connected to amplifier/buffer 605. Once
activated as shown here, electric field lines 620 and 621 are
created as shown in FIGS. 6A and 6B respectively, and they emanate
between the drive line 606b and pickup line 602b, sending a
resultant signal that is radiated onto pickup line 602b and
connected to amplifier/buffer 605, and later processed by analog
and digital processing circuitry. As the sensing operation proceeds
in this embodiment, different drive line/pickup line crossover
pairs may be activated to capture different pixels of information
from the object. In the case of a fingerprint, it can capture
information on different features and characteristics of the
fingerprint and even the body of the finger itself. Again, the
embodiment is not limited to this particular configuration, where
one electrode pair, several electrode pairs, or even all electrode
pairs may be active at one time for different operations. In
practice, it may be preferable for less than all of the electrode
pairs to be active at a given time, so that any interference that
may occur between close-by pixels would be minimized. In one
embodiment, a drive line may be activated, and the pickup lines may
be scanned one or more at a time so that a line of pixels can be
captured along the drive line and pickup lines as they are paired
along a line at the crossover points. Thus, and still referring to
FIG. 6A, the voltage source 616 may remain connected to drive line
606b, and the connection to buffer/amplifier 605 may cycle or scan
over to another pickup line, so that another pixel of information
can be captured from another electrode pair using driveline
606b.
In the snapshot shown in FIGS. 6A and 6B drive plate 606b remains
excited by AC signal source 616 until an entire column of pixels is
scanned, while unused drive plates (606a,c-n etc.), are switched to
ground for isolation purposes. Likewise, in one embodiment only one
pickup plate is active at a time and some or substantially all
other pickup plates are switched to ground to minimize
crosstalk.
The scanning process continues beyond the snapshot shown in FIGS.
6A and 6B, with the next column in sequence being activated, 606c,
(although the sequence could be arbitrary), Once the entire
sequence of Pickup Plates 602a-n is scanned, the next driver line
606d would activated, until all, or substantially all of the drive
lines 606a-n have been sequenced. Once all the drive columns have
been activated and the pickup plates scanned for each column, one
will have collected a complete two dimensional array of pixels
equal to the number of driver rows times the number of pickup
columns. For a 500 DPI sensor that would create a 10.times.10 mm
array or 100 mm.sup.2, consisting of 40,000 individual pixels.
Depending on the application, all of the drive lines may be
sequenced, or possibly some or most of them may be sequenced.
Referring again to FIGS. 6A and 6B, the two conductive layers Drive
layer 606 and Pickup layer 602, are separated by an electrically
insulating layer 604. This insulating layer 604 has high DC
resistance and has a dielectric constant greater than one to allow
the transmission of high frequency electric fields through it. In
one embodiment this layer 602 is created by folding a single sided
flexible printed circuit board back onto itself. In another
embodiment it is created by placing a dielectric layer between two
electrically active layers to form a double sided circuit
board.
FIG. 7 shows an example of an x-y grid of plate rows and columns
depicted by lumped circuit components that represent the electric
field couplings of the sensor at each drive/pickup crossover.
The bottom plates 706a,b,c etc. are driven one at a time by AC
signal source 716 via switch matrix 740a-n. FIG. 7 shows a scan
snapshot where one drive switch 740b in the on condition connecting
the corresponding plate to the signal source. This activates one
entire row 706b with AC signal over the entire length of the plate
that is equal to the sensor width in one dimension. Correspondingly
each top plate 702a,b,c etc. will pick up AC signal through
insulating layer 704 and coupling capacitors 761a,b,c . . . n. Only
one pickup plate at a time is active being switched into the buffer
amplifier 717. Top Plate 702b is shown as the active plate in FIG.
7, while all or substantially all other pickups are shorted to
ground via switch matrix 730a-n, thus the information from one x-y
pixel is captured.
A single row remains active only as long as it takes the entire
number of pickup plates/columns to be scanned. Scan time per pixel
will depend on the frequency of operation and the settling time of
the detection electronics, but there is no need to scan unduly fast
as is typical with prior art swipe sensors. On the other hand prior
art swipe sensors must scan at a very high pixel rate in order not
to lose information due to undersampling relative to the finger
speed that can be greater than 20 cm/sec. This reduction in capture
speed relative to a swipe sensor relaxes the requirements of the
analog electronics and greatly reduces the data rate that a host
processor must capture in real time. This not only reduces system
cost but allows operation by a host device with much less CPU power
and memory. This is critical especially for mobile devices.
Once an entire row 706b has been scanned by all or substantially
all of its corresponding pickup plates 702a-n, then the next row in
the sequence is activated through switch matrix 740. This process
continues until all or substantially all of the rows and columns
are scanned.
The amount of signal that is coupled into the buffer amplifier 717
is a function of how much capacitance is formed by the insulating
layer and the finger ridge or valley in close proximity. The
detailed operation of how these electric fields radiate is shown in
FIGS. 6a and b. The total coupling capacitance is a series
combination of the insulating layer capacitance 704 that is fixed
for a given thickness, and the variable topological capacitance of
the object being sensed. The variable portion of this is shown in
FIG. 7 as a series of variable capacitors numbered 760a-n, 761a-n,
762a-n etc., forming a two dimensional array.
FIG. 8 shows an example of an embodiment of the placement sensor
using a differential amplifier 880 to take the signal from the
selected pickup plate (802a-n), and subtract it from the reference
signal of plate 805. The electrical subtraction of these signals
performs several functions: first wide band common mode is
subtracted out; second, subtracting against reference plate 805
provides a relative reference signal equivalent to an ideal ridge
valley; third, common mode carrier signal that couples into both
plates other than through a finger is also subtracted out. First
order carrier cancellation of etch variation in the pickup plates
also occurs when we subtract out carrier that is coupled in by
other means than through fingers placed on the sensor. This is
critical for high volume manufacturing at a low cost.
Reference plate 805 is intentionally located outside of the finger
contact area of the sensor, separated from pickup plates 802a-n by
Gap 885, Gap 885 is much larger that the nominal gap between the
pickup plates that is typically 50 .mu.m. In a real world
embodiment plate 805 would be positioned under the plastic of a
bezel to prevent finger contact, placing it at least 500 .mu.m
apart from the other pickup plates.
Each one of the pickup plates 802a-n is scanned sequentially being
switched through pickup switches 830a connecting them to
Differential Amplifier 880. During the scanning process of an
entire pickup row, the positive leg of the differential amplifier
remains connected to reference plate 805 to provide the same signal
reference for all of the pickup plates.
FIG. 9A shows a circuit diagram of an example of a front end
circuit 900a for the placement sensor in a topology that uses a
bank of Single Pole Double Throw Switches or SPDTs to scan the
pickup plate rows and a bank of Single Pole Single Throw switches
to multiplex the drive plate columns.
In FIG. 9A we see a snapshot of the analog switches as the scanning
process begins. Only the first SPDT switch 944a is shown in the
"on" position, which allows pickup plate 902a to conduct its plate
signal into Differential Amplifier 980. The remaining pickup plates
are shorted to ground via switches 944, preventing any pickup
signal received by them from entering into differential amplifier
980.
Each SPDT has a Parasitic Capacitance 945, due to the fact that
real world switches do not give perfect isolation. In fact the
amount of isolation decreases with frequency, typically modeled by
a parallel capacitor across the switch poles. By using a SPDT
switch we can shunt this capacitance to ground when an individual
plate is not active. Since there is a large array of switches equal
to the number of pickup plates, typically 200 for a 500 dpi sensor,
the effective shunt capacitance to ground is multiplied by that
number. So if a given switch has 0.5 picofarads of parasitic
capacitance and there were 200 pickups, that would add up to 100
picofarads of total shunt capacitance.
In order to prevent this large capacitance from diverting most of
the received signal from the active pickup to ground, it is
desirable in this example to use a compensating circuit. This is
accomplished by using resonating inductor 939, forming a classic
bandpass filter circuit in conjunction with parasitic capacitors
945 (one per switch) and tuning capacitors 934 and 937. A two-step
null & peak tuning calibration procedure is used where tuning
capacitor 934 and 937 are individually tuned with inductor 939
using the same drive signal on both the plus and minus inputs to
differential amplifier 980. The two bandpass filters formed with
inductor 939 and resonating capacitors 934, and 937 respectively,
will be tuned to the same center frequency when there is zero
signal out of differential amplifier 980. Next capacitors 934 and
937 and inductor 939 are tuned together using a differential input
signal with opposite 180 degrees phases on the plus and minus
inputs to the differential amplifier 980. They are incremented in
lock step until the exact drive carrier frequency is reached, this
occurs when the output of differential amplifier 980 is at its
peak, making the center frequency equal to the exact frequency of
the carrier drive signal 916.
In a systems implementation, a calibration routine would be
performed before each fingerprint scan to minimize drift of this
filter with time and temperature. The resonating inductor 939 needs
to have a Q or Quality Factor of at least 10 to give the filter the
proper bandwidth characteristics necessary to optimize the signal
to noise ratio. Alternately, carrier source 916 may be a variable
frequency source, and capacitors (937 and 934) may be fixed values.
In this embodiment, tuning is accomplished by varying the frequency
of source 916) until peak output is obtained from differential
amplifier 980
FIG. 9B shows an alternate example of a front end circuit 900b
employing multiple banks of plates grouped together, each with
their own differential amplifiers.
Dividing up the large number of parallel pickup plates into groups
each containing a smaller number of plates is an alternate
architecture that would not require the use of a tuned bandpass
filter in the front end because the parasitic switch capacitances
would be greatly reduced. This would have two possible advantages,
first lower cost, and second the ability to have a frequency agile
front end. In this Figure we have a snapshot of the front end where
the first switch 944a of bank 907a is active. All other switch
banks 907b-907n are shown inactive, shorting their respective
plates to ground. Therefore, only voltage or current differential
amplifier 980a has any plate signal conducted into it, voltage or
current differential amplifiers 980b-980n have both their positive
and negative inputs shorted to ground through their respective
switches 945a-n and 945r, preventing any signal from those banks
making a contribution to the overall output.
Each of the differential amplifiers 980a-980n is summed through
resistors 987a-987n into summing amplifier 985. Only the
differential amplifier 980a in this snapshot has plate signal
routed into it, so it independently produces signal to the input of
summing amplifier 985. This process is repeated sequentially until
all or substantially all of the switch banks 907a-n, and switch
plates 944a-n, 945a-n, etc., of the entire array are fully scanned.
In different embodiments, all or substantially all of the array may
be scanned, or less than the entire array may be scanned in
different applications. In some applications, a lower resolution
may be desired, so all of the array may not need to be scanned. In
other applications, a full image may not be necessary, such as a
navigation application, where limited images may be used to detect
movement of speed, distance and/or direction to use as input for a
pointing device, such as directing a cursor on a display similar to
a computer touch-pad or a mouse.
By splitting the pickup array up, the capacitive input load on each
plate is reduced from that of the full array of switches to the
number of switches within a given plate group. If we were to
divide, for example, 196 potential pickup plates into 14 banks of
14 plates, the result would be a capacitance load equal to the
parasitic capacitance of 14 switches (944), plus the capacitive
load of the differential amplifier. If analog switches 944 are
constructed with very low parasitic capacitance then the overall
input load would be small enough not to need a bandpass circuit in
the front end in order to resonate out the load capacitance. As
integrated circuit fabrication techniques improve we would be able
design smaller switches with less parasitic capacitance, making
this approach become more attractive.
FIG. 9C illustrates another example of a front end circuit 900c
using individual plate buffers that are multiplexed into a second
stage differential amplifier.
Buffers 982a through 982n as illustrated are special buffers that
are designed to have very low input capacitance. In one embodiment,
these buffers could be configured as single stage cascaded
amplifiers in order to minimize drain-to-gate Miller capacitance
and die area. To better maximize plate to plate isolation, two sets
of switches could be used for each input. Analog switches 930a-930n
are included in this example to multiplex each selected buffer into
differential amplifier 980. Switches 932a-n are included to shut
down the power simultaneously to all the other input buffers that
are not selected. This effectively puts them at ground potential.
An alternate embodiment would be to put input analog switches in
front of each amplifier to allow a short of the unused plates
directly to ground. One effect of this approach may be an increase
in input load capacitance for each plate.
FIG. 9C shows a snapshot of the scanning process where top plate
902a is being sensed though buffer 982a that has power supplied to
it through switch 932a. Analog switch 930a is closed, routing it to
differential amplifier 980. All other buffer outputs are
disconnected from the differential amplifier 980 via analog
switches 930b-n and power switches 932n
The positive input to differential amplifier 980 is always
connected to the reference plate 902r (through low input
capacitance buffer 982r), providing an "air" signal reference to
the amp. The differential amplifier 980 serves to subtract out
noise and common mode carrier signal in addition to providing a
"air" reference carrier value.
FIG. 10 shows a particular embodiment of a placement sensor
implemented with traditional analog receiver 1000 technology. The
analog front end begins with Differential Amplifier 1080 where
selected Pickup Plate 1002a-n is subtracted from reference pickup
plate 1005, which is located outside the finger contact area
providing a reference signal equivalent to an ideal finger valley.
A programmable gain stage or PGA 1090 follows the Differential
Amplifier 1080, but could be integrated into the same block
providing both gain and subtraction in a single stage. PGA 1090 is
designed to have a gain range wide enough to compensate for
production variations in plate etching and solder mask thickness
between the layers.
Control processor 1030 orchestrates the scanning of the two
dimensional sensor plate array. Drive plates/columns 1006a-1006n
are scanned sequentially by the bottom plate scanning logic 1040 in
the Control Processor 1030 (via drive control lines 1042 connected
to switches coupled to drive plates 1006a-n). When a selected drive
plate is activated it is connected to carrier signal source 1016,
all inactive drive plates are connected to ground. Before
activating the next drive plate in the sequence the active drive
plate remains on long enough for the entire row of pickup plates
1002a-n to be scanned by top plate logic 1045 controlling switches
1030a-n.
Analog mixer 1074 multiplies the gained up plate signal against the
reference carrier 1013. The result is a classic spectrum of base
band plus harmonic products at multiples of the carrier frequency.
An analog low pass filter 1025 is employed to filter out the
unwanted harmonics and must have a sharp enough roll off to
attenuate the information associated with the second harmonic
without losing base band information.
Following the low pass filter are an amplifier 1077 and an A/D
Converter 1076, which must sample at at least twice the pixel rate
to satisfy the Nyquist criteria. Memory buffer 1032 stores the A/D
samples locally with sufficient size to keep up with the worst case
latency of the host controller. The A/D Sample Control Line 1078
provides a sample clock for the converter to acquire the sequential
pixel information that is created by the sequencing of the plate
rows and columns.
FIG. 11 shows an example of one embodiment of a placement sensor
implemented with direct digital conversion receiver 1100
technology. In this example, the analog front end begins with
Differential Amplifier 1180 where selected Pickup Plate 1102a-n is
subtracted from reference pickup plate 1105, which is located
outside the finger contact area providing a reference signal
equivalent to an ideal finger valley. The electrical subtraction of
these signals performs several functions: first wide band common
mode is subtracted out; second, subtracting against reference plate
1105 provides a relative reference signal equivalent to an ideal
ridge valley; third, common mode carrier signal that couples into
both plates other than through a finger is also subtracted out.
Elimination of common mode is particularly important in high RF
noise environments. First order carrier cancellation of etch
variation in the pickup plates also occurs when we subtract out
carrier that is coupled in by other means than through fingers
placed on the sensor. This is critical for high volume
manufacturing at a low cost.
A programmable gain stage or PGA 1190 follows the Differential
Amplifier, which could easily be combined into a single
differential amplifier including programmable gain as is commonly
done in modern integrated circuit design. PGA 1190 is designed to
have a gain range wide enough to compensate for production
variations in plate etching and solder mask thickness between the
layers.
Control processor 1130 orchestrates the scanning of the two
dimensional sensor plate array. Drive plates/columns 1106a-1106n
are scanned sequentially by the bottom plate scanning logic 1140 in
the Control Processor 1130 (via drive control lines 1142 connected
to switches coupled to drive plates 1006a-n). When a selected drive
plate is activated it is connected to carrier signal source 1116,
all inactive drive plates are connected to ground. Before
activating the next drive plate in the sequence the active drive
plate remains on long enough for the entire row of Pickup Plates
1102a-n to be scanned by top plate scanning logic 1145 controlling
switches 1130a, 1130b, etc., and captured by the A/D converter
1125.
The A/D Converter 1125 is sampled at a rate of at least twice the
carrier frequency to satisfy the Nyquist criteria. The A/D Sample
Control Line 1107 provides a sample clock for the converter to
acquire the sequential pixel information that is created by the
sequencing of the plate rows and columns.
Following the A/D converter 1125 is a Digital Mixer 1118 that
digitally multiplies the A/D output that is at the carrier
frequency against the reference carrier generated by the Digitally
Controlled Oscillator 1110. The result is that the signal is down
converted to the base band with the carrier removed. There are
other unwanted spectral components created by this process, namely
a double time carrier side band, but these can easily be filtered
out.
A combination decimator and digital filter 1120 follows the Digital
Mixer 1118. This block performs sampling down conversion, reducing
the sample rate from at least twice the carrier frequency to at
least twice the pixel rate that is much lower. The digital filter
would typically include a Cascaded Integrator Comb, or CIC filter,
which removes the unwanted spectral byproducts of mixing as well as
improving the receiver signal to noise. A CIC filter provides a
highly efficient way to create a narrow passband filter after
mixing the signal down to baseband with the digital mixer. The CIC
filter may be followed by a FIR filter running at the slower
decimated rate to correct passband droop.
With a reduction of sample rate in the order of 100:1 a relatively
small Control Processor Buffer (1132) could be used to capture and
entire fingerprint. For example a 200.times.200 array producing 40
k pixels could be stored in a 40 kb buffer. This is in contrast to
a swipe sensor that must scan the partial image frames at a rate
fast enough to keep up with the fastest allowable swipe speed,
usually around 200 ms. At the same time, a slow swipe of two
seconds must also be accommodated, requiring ten times the amount
of memory as the fastest one. Various techniques have been
developed to throw away redundant sample lines before storage, but
even with that the real time storage requirements are much greater
for swipe sensors. This is a critical factor in Match on Chip
applications where memory capacity is limited. In addition, a
placement sensor has no real-time data acquisition or processing
requirements on the host processor beyond the patience of the user
for holding their finger in place.
Referring to FIG. 12A, and example of a sensor layout 1200
configured according to one embodiment is illustrated in a
configuration that is known in the semiconductor industry as a Chip
on Flex (CoF). Chip on Flex is a configuration where a processor
chip is attached to a flexible substrate, such as Kapton.RTM. tape,
and that is electrically connected to conductive lines and possibly
other components located on the flexible substrate. In this
example, the sensor layout 1200 is shown within the borders of
Kapton.RTM. tape having pitch rails 1202, 1204 with slots 1206
located along both rails. These slots are used in the manufacturing
process to feed the tape through the process while lines and
possibly components are formed on the tape. The pitch of a device
refers to the length of Kapton.RTM. tape required to form a device
on the CoF. The distance "d" 1208, measured here between slots 1207
and 1209, is substantially constant throughout each rail, and the
pitch is a shorthand method of determining the length of flex that
a device covers. For the device shown in this example, the pitch
1212 shows a span between slot 1207 and 1214 of eight slots, and
thus would be characterized as an 8-pitch device. The example
sensor device shown, which may be a fingerprint sensor or other
type of placement, 2D or area sensor, illustrates an integrated
circuit 1210, which may be a logic circuit formed on a silicon
substrate, a microprocessor, or other circuit for processing pixel
information captured from a sensor circuit. The example may also be
formed or otherwise manufactured on a substrate other than flexible
substrate or Kapton.RTM. tape, in fact it may be formed on a
silicon substrate, rigid board, or other substrate configured for
various applications.
If configured as a fingerprint sensor or other placement sensor,
integrated circuit 1210 may be a mixed signal chip that enables all
or some of the functions described in FIG. 16 below. In one
embodiment, it has enough inputs and outputs to drive a 200 by 200
line array of drive and pickup lines, and may have more or less of
either lines. The top layer 1220 is formed by an array of pickup
lines connected directly to integrated circuit 1210. This may be a
flip chip mounted directly to the flex substrate without bond
wires. In this example, the bottom layer is formed by folding the
single layer back onto itself along the folding axis 1230 to a
create double layer active sensor area. The drive lines fold to
create the bottom layer 1225. The drive lines in this example are
split into left and right groups 1240 and 1242 respectively for the
sake of layout balance, but could be all on the left or right side
of the sensing area. The left drive plate bundles 1240, and right
drive plate bundles 1242 are inter-digitated with alternating left
and right feeds to form a continuous line array on bottom layer
1225.
Flexible substrate based connector 1235 routes power, ground and
interface signals out to an external host or onto another substrate
that contains system level components, such as those illustrated in
FIG. 16 and described below. These components may include but are
not limited to a processor with memory, logic enabling imbedded
matching algorithm(s) and encrypting/decrypting functions. In an
alternative example, connector 1235 may be attached to the host
substrate using conductive adhesive otherwise known as anisotropic
conductive film (ACF attach), which may be labeled as "high
density" in some products.
Referring to FIG. 12B, another example of a sensor 1250 is shown
having a different orientation and configuration on a substrate.
Similar to the above example, the sensor 1250 is a placement
sensor, and is configured to be folded onto itself along the
folding axis 1251 to create two layers, the bottom layer 1252 with
drive lines 1256, and top layer 1254, with pickup lines 1257,
integrated circuit 1258, flex external connections 1262, and
processor connections 1260 that may be used to connect the
integrated circuit to external devices, such as for manufacturing
testing for example. This configuration, however, has a much
smaller pitch, again where the distance "d" is the distance between
each pair of slots 1206, and the pitch in this example is between
slots 1270 and 1272, making this device a 5-pitch device. This
example device takes up 5 pitches of Kapton.RTM. tape compared to
the other example device 1200 (FIG. 12A) taking up 8 pitches of
Kapton.RTM. tape. This device performs substantially the same
function as that of example 1200, FIG. 12A, yet takes up less
Kapton.RTM. tape, saving in material costs. The device may take up
even less pitches of tape if the size of the resulting sensor
surface were reduced, allowing the space needed to accommodate the
pickup lines, drive lines, and other components to be reduced. In
this example, the effective sensor surface may be ten square
millimeters, and could be reduced to nine or even eight
millimeters, and the structures could be reduced accordingly to
reduce the overall area of the device, likewise reducing the area
of substrate required to accommodate the overall device.
As will be appreciated by those skilled in the art, given these
examples, different designs may be accomplished to optimize
different aspects of the invention, including size of the substrate
used for a device, and both the size and pixel density of the
sensing area. The invention, however, is not limited to a
particular optimization done by others, and indeed the invention
should inspire others to improve upon the design using well known
and alternative processes, materials, and know-how available to
them. The scope of the invention is only limited by claims that are
either appended or submitted for examination in the future, and not
by information that is extemporaneous to this specification.
Referring to FIG. 13A, an illustration of a flex layout structure
1300 is illustrated. As shown, the flex layer structure 1300
includes an imaging area 1350, in which drive lines form crossover
locations with pickup lines, where the crossover locations are
formed by folding the top layer 1371 over bottom layer 1375,
folding the flexible substrate upon itself about flex bend radius
1374. From a side view, the top flex 1364 is layered over top
soldermask 1362, which is layered upon top copper or pickup lines
1360. Bottom layer solder mask 1370 is folded under top copper
1360, and bottom copper 1372 is formed under solder mask 1370 and
over bottom flex 1375.
Referring to FIG. 13B, an example of a module structure 1301 is
shown for mounting the flex layer structure 1300 of FIG. 13A. Those
skilled in the art will understand that the structure of a
particular module may vary according to the embodiment, and that
this example, though it shows a substantially complete example of a
module that can be used to base a practical implementation, is but
one example and is not intended and should not be considered as
limiting the embodiment in any way. The example structure 1301
includes rigid substrate 1330 that receives the flex top layer 1371
on its top layer with flex locating pins or plastic frame 1337
configured to ensure alignment of the drive plates with the pickup
plates. Because the sensing electrode pairs are formed by
crossovers of the drive and pickup lines on the two layers, the x-y
alignment tolerance requirements may be on the order of several
pixels, rather than the sub-pixel alignment tolerances that would
be required if there were features to be matched between the two
layers. The four mounting holes (1337) on each layer are sufficient
to ensure angular and x-y alignment. Also illustrated is driver
chip 1310 and imaging area 1350.
Referring to FIG. 14, an illustration is provided of an example
system 1400 incorporating a sensor system 1402 generally configured
according to the embodiment. A sensor device may be incorporated
into a system, or may be configured as a stand-alone product. As a
stand-alone product, the sensor components may be encased in a
housing (not shown), and electrical connections exposed for
connection to a device or system that would utilize such a device.
Those skilled in the art will immediately see how a sensor
configured according to the embodiment as described herein can be
incorporated into a housing such as those widely used in different
industry sectors. Thus, for example, in a system, the mechanical
connections, designs and structures may necessarily vary according
to a particular application. For example, if incorporated into a
laptop for use as a fingerprint sensor, a surface mounting module
would need to be employed to expose the sensor grid lines to a
user. If incorporated into a mobile phone, personal data assistant
(PDA) or the like, another type of mounting module would be needed
to conform to the particular device design while providing the
operational capability of the sensor. Again, FIG. 14 illustrates a
diagrammatic representation of a system 1400 that incorporates a
sensor 1402 configured according to the embodiment with the folded
flexible or rigid substrate 1404 having a top layer 1406 and a
bottom layer 1408, and each having either pickup lines or plates
and drive lines or plates respectively depending on the
application, though not shown here. The two-dimensional sensing
area 1411 is shown with an object 1410 on top, which may be a
finger in the case of a fingerprint sensor, or another object in
another application. The top layer's pickup plates or lines (not
shown) communicate with top plate processing circuitry 1409 via
communication link 1412 to send resultant signals received. Drive
lines or plates are located but not shown here on bottom layer
1408, and receive drive signals from bottom plate processing
circuitry 1414 via communication line 1416. The top plate
processing circuitry 1409 includes front end buffers and amplifiers
1416 configured to receive, amplify and/or buffer or store a
resultant signal received from the pickup plates or lines. A switch
array 1418 such as illustrated in FIGS. 9A-9C is configured to
receive the signal from the front end 1416 and send the switched
signal to analog to digital (A/D) converter 1420 for conversion to
a digital signal. Digital signal processor (DSP) 1422 is configured
to receive the digital signal from A/D converter 1420 and process
the signal for transmission.
Bottom plate processing circuitry 1414 is configured to produce a
drive signal for use by drive plates or lines located on the bottom
layer 1408 of the sensor substrate 1404, and includes drivers and
scanning logic 1462 for producing the signal, and programmable
frequency generator 1426 for programmably setting the frequency in
which the drive signal is set. The bottom plate processing
circuitry 1414 includes communication link 1428, likewise, top
plate circuitry has communication link 1430 for communicating with
system buss 1432 for sending and receiving communications among the
system, such as to processors, memory modules, and other
components. System buss 1432 communicates with persistent memory
1434 via communication link 1436 for storing algorithms 1438,
application software 1440, templates 1442, and other code for
persistent and frequent use by processor 1444. Processor 1444
includes processor logic 1448 having logic and other circuitry for
processing signals received from the system buss and originating
from the sensor 1402, and also includes arithmetic logic unit 1450
configured with logical circuits for performing basic and complex
arithmetic operations in conjunction with the processor. Processor
memory 1452 is configured for local storage for the processor 1444,
for example for storing results of calculations and retrieval for
further calculations.
In operation, drive signals are controlled by processor 1444, and
parameters for the drive signals originating from bottom plate
processing circuitry 1414 are set in the bottom plate processing
circuitry 1414 by the processor 1444. Drive signals are generated
by logic 1462 within the parameters set in generator 1426 and sent
to bottom plate 1408 via communication link 1516. These signals
generate electromagnetic fields that extend to pickup lines on top
layer 1406 about the sensing area 1411. These signals are cycled
through different pixel electrode pairs on the sensor grid (not
shown here, but described above.), and some of these
electromagnetic fields are absorbed by the object 1410 (such as a
fingerprint for example). The resultant signal is picked up by the
pickup plates or lines located on top layer 1406 about the sensing
area (not shown here, but described above). The resultant signal is
then transmitted to top plate processing circuitry 1409 via
communication line 1412, and the signal is processed and
transmitted to storage or processor 1444 for further processing.
Once the drivers and scanning logic have cycled through the pixels
on the grid sensor, data related to features and characteristics of
the object can be defined and utilized by the system. For example,
in a fingerprint sensor system, the image may be a fingerprint
image that can be compared to a stored fingerprint image, and, if
there is a match, it can be used to validate a user.
FIG. 15 Illustrates how a device configured according to the
embodiment may be applied to a fingerprint sensing application. A
user places a finger with fingerprint (1510) over the sensor grid,
which is formed by the crossover locations of the drive plates
(1506a-1506n) and the pickup plates (1502a-1502m). Image pixel
1561a senses the fingerprint area above the electrode pair of drive
plate 1506a and pickup plate 1502a, pixel 1561a senses the
crossover of drive 1506n and pickup 1502a, and pixel 1562n senses
the area above the crossover of drive 1506n and pickup 1502m
FIG. 16 illustrates the steps required to collect the fingerprint
image as shown in FIG. 15, using the embodiment shown in FIGS. 11
and 14. Image capture begins at step 1601. As part of the
initialization a row counter is initialized to 1 at step 1602. Step
1603 is the beginning of a row scan sequence. At the beginning of
each row, a column counter is set to 1 at step 1603. In step 1604,
the top plate scanning logic 1145 activates the appropriate analog
switch (one of 1103a through 1103n) for the selected row. In Step
1605 the sense of an individual pixel begins when the bottom plate
scanning logic 1140 activates the appropriate drive plate (one of
1106a through 1106n) with the carrier signal 1116. At step 1606 the
signal from differential amplifier 1180 is sampled repeatedly by
A/D converter 1125 after processing through programmable gain
amplifier 1190. Digital mixer 1118 mixes the samples down to the
baseband frequency set by digital oscillator 1110. The baseband
signal is then filtered by digital decimating filter 1120 to
produce a signal level value for the current pixel. The functions
performed for this step in the embodiment of FIG. 11 could
alternatively be performed by the corresponding analog receiver
shown in FIG. 10, or other functionally similar arrangements. In
step 1607 the signal level value derived in step 1606 is stored in
the appropriate position in memory buffer 1132 that corresponds to
the currently selected row and column. In step 1608 the column
number is incremented, and in step 1609 the column number is tested
to determine whether the current row collection has been completed.
If the row has not been completed, we return to step 1605 to
collect the next pixel in the row. If the row is complete, we
proceed to step 1610 and increment the row number. In step 1611, we
test the row number to determine if all the rows have been scanned.
If not, flow returns to 1603 to start the next row back at the
first column. Once all the rows have been scanned, image capture is
complete, and we proceed to step 1612, at which point the image is
ready for further processing or transfer to long term storage.
Those skilled in the art will recognize that row and column
scanning order may not correspond directly to physical position in
the array, as some implementations may more optimally be sampled in
interleaved fashions.
In FIG. 17, an example of the example as shown in FIG. 14 in a user
authentication application. In step 1701a system level application
1440 on processor 1444 requires user authentication. At step 1702
the user is prompted to provide a finger for verification. The
system waits for finger presence to be detected in step 1703. This
can be performed by collecting a reduced size image as described in
FIG. 16 and testing for finger image, or via other dedicated
hardware. Once finger presence is detected, a complete image is
collected in step 1704, using the method described in FIG. 16 or
other substantially similar method. This image is then stored and
in step 1705 converted into a template 1712 as shown in FIG. 17B,
typically consisting of a map of minutia point locations and types
(such as bifurcations 1710, and terminations 1711), or possibly of
ridge frequency and orientation, or some combination of both. In
step 1707 the template is then compared against one or more
enrollment templates that were retrieved from persistent template
storage 1142 in step 1706. If a match is found, the user is
authenticated in step 1708 and granted access to the application.
If no match is found, the user is rejected in step 1709, and access
is denied.
In an authentication system such as described by FIGS. 16 and
17A-B, there can be a tradeoff between security and operational
speed. A device such as a smartphone may have differing security
and convenience (speed) requirements for differing operating modes,
as well. These tradeoffs may be governed by the value of security
for different types of information. As an example, users may place
a low value on security for simply powering up their smartphone or
other device. But, they may place a much higher value on performing
a financial transaction or other sensitive transfer. They may want
to lock out the ability to access personal contact information or
customer lists, or may also want to lock out the ability for others
to make local calls, long distance calls, access personal photos,
access social networking websites, sent and receive text messages
or emails, and they may want to have different security protocols
for the access to different information. Users having conventional
systems without the benefit of biometrics will typically lock their
telephone handset with a four-digit PIN, which is a fairly low
level of security. Securing a financial transaction over the same
device, a new development that is desired in the industry, would
cause a user to desire a much higher level of security. Conversely,
the amount of time a user would find acceptable to unlock the phone
for a simple call would be much shorter than the time they would
wait to secure a high value transaction, where a user may be more
tolerant of a higher time demand for authenticating the user for a
financial transaction.
Embodiments described herein facilitate supporting both of these
requirements by providing variable captured image resolution and
matching algorithm security level. In one example, when operating
in high security mode (such as when enrolling a user or validating
a high-value transaction) the image capture procedure described in
FIG. 16 and the match procedure described in FIG. 17A-B may operate
in full resolution mode. When operating in convenience' mode (such
as unlocking the phone, looking at photos, surfing the internet or
switching users), the fingerprint image may be acquired in a
half-resolution mode by skipping every other column and every other
row--for example where steps 1608 and 1610 would increment the
Column and Row counters, respectively, by two instead of one. This
may result in an image with half the resolution in each axis
compared to the high security mode, and one-fourth the size. This
could cut by a factor of four both the time required to acquire the
image (FIG. 16) and the time required to extract the template from
the image (step 1705). Due to the reduced resolution of the image,
and the relaxed security requirements for this convenience mode,
the matching threshold applied in step 1707 may be accordingly
reduced.
Referring to FIGS. 18A-D, another embodiment of a sensor module or
assembly is illustrated as a sensor 1800, first shown in an
expanded view in FIG. 18A, made up of a folded flex sensor 1802
having a sensor area 1803, a module folding base 1804 and mounting
board 1806. In this embodiment, a switch having a plunger 1812 and
base 1813 is incorporated into a sensor assembly that allows the
integration of the sensor operations, such as fingerprint sensor
operations, together with other operations of a device. Still
further, this assembly allows for the configuration of a
personalization switch for use on a device, such as a mobile
telephone or smart phone for example, that has extended functions
including biometric operations. If used together with a power or
selector switch, such as for example a modular replacement for the
main selection switch on an iPhone.RTM. manufactured by Apple
Computer Corporation or a navigation selection switch used on a
BlackBerry.RTM. smartphone manufactured by Research in Motion
(RIM.RTM.) next to the display screen of these devices, a
fingerprint sensor can be used for authentication while using these
personal devices. The authentication can be used to access the
device entirely, access different levels of information such as
different information that a user wishes to protect, or could be
used for authentication of the user for financial transactions that
require a higher level of security. These settings maybe preset by
the manufacturer, may be reset by the user, may be set by a
financial institution associated with the user or the device, or
may be configurable by anyone with an interest in protecting the
information.
Still referring to FIG. 18A, the folded flex sensor 1802 may be
folded at 1805 and 1807 respectively to fit about the module
folding base 1804 at mounting locations loop brace 1805-A and
folding edge 1807-A respectively, along with placement holes 1808
to aid in placing the flex about the module and holding it in
place. If the embodiments of the flex sensor circuit formed or
otherwise configure on a substrate according to the examples of
FIG. 12A or 12B, different mounting operations may be required to
accommodate these or other designs that requires a different
folding or forming of the substrate. The sensor 1802 may include
processor 1810 as described in similar embodiments above. Mounting
board 1806 includes the switch having the plunger 1812 and base
1813 mounted about switch opening 1811 to accommodate plunger 1812,
and may also have a processor opening 1814 configured to
accommodate processor 1810.
Referring to FIG. 18B, another expanded view of the sensor of FIG.
18A is shown from another angle, where one side of the flex sensor
1802 shows more clearly the openings 1808 and processor 1810, where
the openings 1808 are configured to receive placement or mounting
pegs 1816 for holding the sensor 1802 substrate in place and then
received by mounting openings 1818. The placement or mounting pegs
1820 are received by mounting openings 1822. A switch base opening
1824 is configured to receive switch base 1813. In another
embodiment, the opening for the plunger 1812 and the base 1813 may
be a single sized opening that will accept the entire switch, or
the switch may have a base with the same diameter as the plunger so
that a single cylindrical or rectangular or other shaped opening
may be sufficient to accommodate the switch.
FIG. 18C shows a side cut away view of the assembled sensor
assembly with the sensor substrate 1802 mounted on module folding
base 1804 and mounted on base 1806, and with the openings 1811 and
1824 accommodating the switch plunger 1812 and switch base 1813
respectively. FIG. 18D shows a close-up view of the side view of
FIG. 18C.
FIGS. 19A-J show an alternative sensor/switch assembly where a dome
switch is used for the underlying switch that is integrated in the
assembly. Referring to FIG. 19A, the assembly 1900 includes a dome
switch 1912 disposed within an opening 1911 of a module folding
base 1904 mounted on mounting board 1906. Opening 1911 may be
beveled as at 1915 and may be covered by a cover 1903 (FIG. 19B).
In this embodiment, a switch having a domed shaped plunger 1912 and
switch base 1913 (FIG. 19D) is incorporated into a sensor assembly
that allows the integration of the sensor operations, such as
fingerprint sensor operations, together with other operations of a
device.
Referring to FIGS. 19A, B and C, a folded flex sensor 1902 may be
folded at 1905 and 1907 respectively to fit about the module
folding base 1904 at mounting locations loop brace 1905-A and
folding edge 1907-A respectively, along with placement holes 1908
(FIG. 19D) to aid in placing the flex about the module and holding
it in place. If the embodiments of the flex sensor circuit formed
or otherwise configure on a substrate according to the examples of
FIG. 12A or 12B, different mounting operations may be required to
accommodate these or other designs that requires a different
folding or forming of the substrate. The sensor 1902 may include
processor 1910 as described in similar embodiments above. Mounting
board 1906 includes a switch base 1913 mounted below plunger 1912,
and may also have a processor opening 1914 configured to
accommodate processor 1910 (FIG. 19D).
Referring to FIGS. 19G, H and I, side views of the sensor is shown,
showing the flex sensor 1902 and the openings 1908 and processor
1910, where the openings 1908 are configured to receive placement
or mounting pegs 1916 for holding the sensor 1902 substrate in
place and then received by mounting openings 1918. The placement or
mounting pegs 1920 are received by mounting openings 1922.
FIGS. 19E,F, and J show a normal, cutaway, and expanded cut away
views of the sensor assembly mounted in a device such as a
smartphone, with the sensor substrate 1902 mounted on module
folding base 1904 and mounted on base 1906, and with the opening
1911 accommodating the switch dome plunger 1912 and switch base
1913. A sensor area 1901 is accessed by a bezel opening 1909 which
is incorporated into the finished case 1925 of the device. When the
user places a finger on the surface of the sensor area 1901 they
will simultaneously depress switch plunger 1912.
FIG. 20 illustrates a perspective view of one embodiment of an
embedded switch 2000 that can provide a means to electronically
connect a top conductive layer 2002 through insulating layer 2004
to conductive layer 2006 upon the touch of a user on the surface of
the sensor, not shown here, but it may be a layer above conductor
2002. The three layers may be embedded within a fingerprint sensor
as described above, allowing for a switch located within the
double-layered fingerprint sensor, so that a user can activate a
function upon touch, such as power, select, initiate, enter, or
other switch functions in a device. The three layers may be placed
on a surface 2006 of module 2008, where the module is located on
the surface 2010 of a substrate 2012.
FIGS. 21A and 21B FIG. 21A shows an embodiment where a switch is
formed on the same substrate as the sensor. The figures show the
folded flex stack-up consisting of flex substrates 2102 and 2103,
typically but not limited to Kapton.RTM., metalized layers 2104 and
2105 are typically etched or formed copper traces and insulating
layers 2106 and 2107 are typically solder mask. Insulating layers
2106 and 2107 have a cutout section 2110 out exposing the
conductive layers 2104 and 2105. When no vertical pressure is
applied over the gap 2110 conductive layers 2104 and 2105 are not
electrically in contact with each other and are in the off
position.
FIG. 21B shows the flex top layer 2103 and conductive layer 2112
mechanically depressed by a contacting object such as a finger. Top
conductive layer 2107 can be pushed physically into electrical
contact with conductive layer 2106 at pressure focal point 2112.
This forms an embedded flex switch, which is shown in the on
position.
FIGS. 22-26 illustrate alternative embodiments and further
examples. These examples may be configured using different
materials and structures, and they may further be oriented or
integrated in different structures such as power buttons in mobile
devices, stationary devices, computers, laptops, access devices
(doorknobs, entryways, or the like). Note that in these figures and
the number of plates is greatly reduced to simplify the drawings,
and the size of individual drive and pickup plates are increased
for simplicity as well. In practice, both drive and pickup plates
may be formed at fixed or variable pitch, and unlike the drawings,
the spacing between plates may be greater or less than the
individual plate size.
FIGS. 22A-B depict an embodiment where the drive and detection
electronics are implemented on separate silicon components. This
configuration minimizes interconnect between layers by directly
mounting the drive die on the substrate layer for the drive lines,
and directly mounting the pickup die on the substrate for the
pickup plates. The rigid substrate for the drive plates also serves
as a common base layer which provides interconnect for
synchronizing signals between the two subsystems, as well as power
and communications to the host device.
In this particular example, the common substrate (2201) is a two
layer rigid circuit board, which also provides a mechanical base
for the sensor. The drive circuitry is implemented in integrated
circuit die (2204) which is mounted on rigid drive substrate
(2201). The die is connected to the circuit on the rigid substrate
by a number of bonding pads (2206) using standard flip-chip
mounting processes. A large number of drive lines (typically more
than 100) are connected to the drive plates (2209), which are
formed on the top side of the rigid substrate.
A dielectric layer (2208) separates drive plates (2209) from pickup
plates (2210). In this instance dielectric layer (2208) is provided
by a solder mask layer applied to the drive plates (2209) and rigid
substrate (2201).
Pickup substrate assembly (2202) with pre-attached pickup circuit
die (2205) is mounted on top of drive substrate (2201). The die is
connected to the circuit on the flexible substrate by a number of
bonding pads (2216) using standard flip-chip mounting processes.
Because substrate (2202) is flexible, attach pads (2211) can mate
with their corresponding pads (2212) on base substrate (2201). A
cutout (2203) is provided in base substrate (2201) to accommodate
pickup chip (2205) so the assembly lies flat. Attach pads (2211)
provide interconnect to the mating pads (2212) on the substrate
layer (2201).
Interconnect traces (2214) formed on the top layer of base
substrate (2201) provide synchronizing signals between the
integrated circuits (2204) and (2205).
Interconnect traces (2215) in the base substrate (2201) route
signals to interconnect pads (2213) for power, ground, and
communications interconnect to the host system.
FIGS. 23A-G illustrate an example of an assembly stackup of the
two-chip. FIG. 23A shows the rigid base (2201) with the drive
plates (2209), host interconnect traces (2215) and contact pads
(2213), pickup communications traces (2214) and contact pads
(2212). Cutout (2203) is mad in base (2201) to accommodate the
pickup IC which will be attached in a subsequent step.
Rigid base (2201) could be fabricated from standard circuit board
materials, such as FR4, in which case plates (2209), interconnect
(2213 and 2214) and pads (2213 and 2212) would typically be formed
from copper by use of circuit board etching techniques. Rigid base
(2201) could also be formed from glass, in which case plates
(2209), interconnect traces (2213 and 2214), and pads (2212 and
2213) would typically be formed from a transparent conductive
material such as Indium-Tin Oxide (ITO).
FIG. 23B shows drive electronics die (2204) attached to the traces
on the assembly from FIG. 23A. The die is shown attached to the
traces via standard flip-chip mounting processes.
FIG. 23C shows the exemplary assembly after the addition of
dielectric layer 2208. This dielectric layer may be formed by a
standard soldermask process, such as LPI, or by applying a piece of
dielectric such as Kapton.RTM. film.
FIG. 23D shows a cutaway view of the exemplary flexible substrate
(2202) with pickup plates (2210) and pickup communications pads
(2211) formed on it. Flexible substrate (2202) may be formed from a
Kapton.RTM. film, in which case the plates (2210), traces, and pads
(2211) would likely be formed of copper by standard etching
techniques. Flexible substrate (2202) could also be made of a
transparent material, such as polyester, with plates, traces, and
pads formed from by depositing a film of a transparent conductive
material such as ITO.
FIG. 23F shows the cutaway view of the exemplary flexible substrate
with the addition of pickup electronics die (2205). Electrical
connections between the die and elements on the flex are made by
bonding interconnect bumps (2216) on the die to contacts (2217) on
the flex assembly, as shown in FIG. 23E. Interconnect bumps (2216)
are typically made of gold, while contacts (2217) are features
formed of the same material as the plates and traces.
FIG. 23G shows a cutaway view of the exemplary completed assembly,
as the flex assembly is mounted onto the rigid assembly. Electrical
connection between the two sub-assemblies is made by mating flex
assembly pads (2211) to rigid assembly pads (2212).
FIG. 24 shows an example of steps required to assemble the
exemplary embodiment shown in FIGS. 22A-B and 23A-G. In Step 2401
traces 2214 and 2215, host contact pads 2213, layer interconnect
pads 2212, and drive plates 2209 are all formed by an etching
process on substrate 2201. A number of instances of the substrate
assemblies may be formed at the same time by repeating the pattern
across a large panel of base material. In Step 2402 cutout 2203 is
formed in substrate 2203 by a standard circuit board routing
process. This may take place at the same time that the multiple
instances of substrate 2201 are separated by cutting out the
substrate outline from the common panel. In Step 2403 dielectric
layer 2208 is created by applying a layer of material such as LPI
solder mask to substrate 2201 and drive plates 2209. In Step 2404
pickup plates 2210, interconnect pads 2211, and bonding pads 2217
are formed on substrate 2202 by an etching process. In Step 2405,
drive electronics die 2204 is mounted onto the substrate assembly
2201 using a standard chip-on-board flip-chip bonding process. In
Step 2406, pickup electronics die 2205 is mounted onto substrate
assembly 2202 using standard flip-clip chip-on-flex bonding
process. In Step 2407, flex substrate assembly 2202 is mounted onto
base substrate assembly 2201. In Step 2408 pads 2211 and 2212 are
electrically connected using an anisotropic conducting film (ACF)
attach process.
FIGS. 25A-F show an embodiment where the drive and detection
electronics are implemented on separate structures, such as
separate silicon components for example. This configuration
minimizes interconnect between layers by directly mounting the
drive die on the substrate layer for the drive lines, and directly
mounting the pickup die on the substrate for the pickup plates. The
drive and pickup layers may be both connected to a common base
layer which provides interconnect for synchronizing signals between
the two subsystems, as well as power and communications to the host
device. In this particular example, the common substrate (2500) may
be a two layer rigid circuit board, which may also provide a
mechanical base for the sensor. The drive circuitry may be
implemented in integrated circuit die (2504) that is mounted on
flexible drive substrate (2501). The die may be connected to the
circuit on the flexible substrate by a number of bonding pads
(2506) using standard flip-chip mounting processes or other
mounting processes known in the art. A large number of drive lines
(possibly 100 or more) may be connected to the drive plates (2509),
which may or may not be formed on the same flexible substrate.
Attach pads (2511) can provide interconnect to the mating pads
(2512) on the substrate layer (2500). Substrate (2500) may
incorporate a cutout (2513). In one example, the cutout may be
configured so that when the drive substrate (2501) is attached
drive electronics chip (2504) will not contact substrate (2501),
and the assembly lies flat or planar. In another embodiment, a
surface may not be entirely planar or even molded over an object
such as a power button, the different layers may have a cutout to
accommodate different structures such as the drive electronics.
Pickup substrate assembly (2502) with pre-attached pickup circuit
die (2505) may be mounted on top of both drive substrate (2501) and
base substrate (2500). In this embodiment, drive substrate (2501)
provides the dielectric layer between the drive and pickup plates,
without the need for a separate dielectric layer as in previously
discussed embodiments. If substrate (2502) is flexible, attach pads
(2507a) may be able to mate with their corresponding pads (2507b)
on base substrate (2500). A cutout (2503) may be provided in base
substrate (2500) to accommodate pickup chip (2505) so the assembly
lies flat. Interconnect traces (2514) formed on the top layer of
base substrate (2500) may be included to provide synchronizing
signals between the integrated circuits (2504) and (2505). Vias
(2507c) or other openings in the base substrate (2500) may be used
to route signals to the bottom layer, where lower layer traces
(2509) may connect the signals to interconnect pads (2508) for
possibly power, ground, communications interconnect to the host
system, and other connections.
FIGS. 26A-C show an exemplary embodiment where the drive and
detection electronics are both provided by a single integrated
circuit. In one example, substrate (2601) may be composed of a
dielectric material which separates the drive (2602) and pickup
(2603) plates. Substrate (2601) may be a flexible material, such as
Kapton.RTM., or a thin rigid material, such as an aramid laminate
layer in a FlipChip package, or it may be another material.
Integrated circuit die (2604) incorporates contact pads (2611)
which are mounted onto bonding pads (2605) the bottom layer of the
substrate. The bonding pads provide connections from die (2604) to
interconnect traces (2606), drive plates (2602), and pickup
interconnect traces (2607). A number of vias (2609) electrically
connect pickup interconnect (2607) on the bottom layer to pickup
plates (2603), which may be located on the top layer. As shown in
FIG. 26A, conductive traces (2612) on the top layer fan out from
the ends of the pickup plates (2603) to the vias (2609). Each
conductive trace (2612) connects an associated pickup plate (2603)
to an associated via (2609). In the illustrated embodiment, the
pickup plates (2603) are straight and parallel to each other along
their entire length. The conductive traces (2612) are not straight
or parallel to each other along their entire length. The spacing
between adjacent vias (2609) is greater than the spacing between
adjacent pickup plates (2603). Interconnect traces (2606) may
connect die (2604) to host connector pads (2608). A dielectric
layer (2610) may be formed atop pickup plated (2603) to prevent
direct contact of the finger with the pickup plates. The dielectric
layer (2610) may be formed from a number of materials, including
but not limited to an LPI soldermask material, an ink, or a top
Kapton.RTM. coversheet. In another embodiment, a surface may not be
entirely planar or even molded over an object such as a power
button,
While certain exemplary embodiments have been described and shown
in the accompanying drawings, it is to be understood that such
embodiments are merely illustrative of and not restrictive on the
broad embodiment, and that this embodiment is not limited to the
specific constructions and arrangements shown and described, since
various other modifications may occur to those ordinarily skilled
in the art. Hence, alternative arrangements and/or quantities of,
connections of various sorts, arrangements and quantities of
transistors to form circuits, and other features and functions can
occur without departing from the spirit and scope of the
embodiment. Similarly, components not explicitly mentioned in this
specification can be included in various embodiments of this
embodiment without departing from the spirit and scope of the
embodiment. Also, different process steps and integrated circuit
manufacture operations described as being performed to make certain
components in various embodiments of this embodiment can, as would
be apparent to one skilled in the art, be readily performed in
whole or in part to make different components or in different
configurations of components not explicitly mentioned in this
specification without departing from the spirit and scope of the
embodiment. Accordingly, the specification and drawings are to be
regarded in an illustrative rather than a restrictive sense.
While certain exemplary embodiments have been described and shown
in the accompanying drawings, it is to be understood that such
embodiments are merely illustrative of and not restrictive on the
broad embodiment, and that this embodiment is not limited to the
specific constructions and arrangements shown and described, since
various other modifications may occur to those ordinarily skilled
in the art. Accordingly, the specification and drawings are to be
regarded in an illustrative rather than a restrictive sense.
Again, the embodiment has application in many areas, particularly
in biometric sensors. Fingerprint sensors, for example, and other
biometric sensors are gaining increasing acceptance for use in a
wide variety of applications for security and convenience reasons.
Devices, systems and methods configured according to the embodiment
will have improved security of the biometric verification process
without increasing the cost of the system. Furthermore, the
embodiment may extend to devices, systems and methods that would
benefit from validation of components. As discussed above, the
embodiment includes the ability for the host and sensor to include
any combination or subset of the above components, which may be
arranged and configured in the manner most appropriate for the
system's intended application. Those skilled in the art will
understand that different combinations and permutations of the
components described herein are possible within the spirit and
scope of the embodiment, which is defined by the appended Claims,
their equivalents, and also Claims presented in related
applications in the future and their equivalents.
The embodiment may also involve a number of functions to be
performed by a computer processor, such as a microprocessor. The
microprocessor may be a specialized or dedicated microprocessor
that is configured to perform particular tasks according to the
embodiment, by executing machine-readable software code that
defines the particular tasks embodied by the embodiment. The
microprocessor may also be configured to operate and communicate
with other devices such as direct memory access modules, memory
storage devices, Internet related hardware, and other devices that
relate to the transmission of data in accordance with the
embodiment. The software code may be configured using software
formats such as Java, C++, XML (Extensible Mark-up Language) and
other languages that may be used to define functions that relate to
operations of devices required to carry out the functional
operations related to the embodiment. The code may be written in
different forms and styles, many of which are known to those
skilled in the art. Different code formats, code configurations,
styles and forms of software programs and other means of
configuring code to define the operations of a microprocessor in
accordance with the embodiment will not depart from the spirit and
scope of the embodiment.
Within the different types of devices, such as laptop or desktop
computers, hand held devices with processors or processing logic,
and also possibly computer servers or other devices that utilize
the embodiment, there exist different types of memory devices for
storing and retrieving information while performing functions
according to the embodiment. Cache memory devices are often
included in such computers for use by the central processing unit
as a convenient storage location for information that is frequently
stored and retrieved. Similarly, a persistent memory is also
frequently used with such computers for maintaining information
that is frequently retrieved by the central processing unit, but
that is not often altered within the persistent memory, unlike the
cache memory. Main memory is also usually included for storing and
retrieving larger amounts of information such as data and software
applications configured to perform functions according to the
embodiment when executed by the central processing unit. These
memory devices may be configured as random access memory (RAM),
static random access memory (SRAM), dynamic random access memory
(DRAM), flash memory, and other memory storage devices that may be
accessed by a central processing unit to store and retrieve
information. During data storage and retrieval operations, these
memory devices are transformed to have different states, such as
different electrical charges, different magnetic polarity, and the
like. Thus, systems and methods configured according to the
embodiment as described herein enable the physical transformation
of these memory devices. Accordingly, the embodiment as described
herein is directed to novel and useful systems and methods that, in
one or more embodiments, are able to transform the memory device
into a different state. The embodiment is not limited to any
particular type of memory device, or any commonly used protocol for
storing and retrieving information to and from these memory
devices, respectively.
The term "machine-readable medium" should be taken to include a
single medium or multiple media (e.g., a centralized or distributed
database, and/or associated caches and servers) that store the one
or more sets of instructions. The term "machine-readable medium"
shall also be taken to include any medium that is capable of
storing, encoding or carrying a set of instructions for execution
by the machine and that causes the machine to perform any one or
more of the methodologies of the present embodiment. The
machine-readable medium includes any mechanism that provides (i.e.,
stores and/or transmits) information in a form readable by a
machine (e.g., a computer, PDA, cellular telephone, etc.). For
example, a machine-readable medium includes memory (such as
described above); magnetic disk storage media; optical storage
media; flash memory devices; biological electrical, mechanical
systems; electrical, optical, acoustical or other form of
propagated signals (e.g., carrier waves, infrared signals, digital
signals, etc.). The device or machine-readable medium may include a
micro-electromechanical system (MEMS), nanotechnology devices,
organic, holographic, solid-state memory device and/or a rotating
magnetic or optical disk. The device or machine-readable medium may
be distributed when partitions of instructions have been separated
into different machines, such as across an interconnection of
computers or as different virtual machines.
While certain exemplary embodiments have been described and shown
in the accompanying drawings, it is to be understood that such
embodiments are merely illustrative of and not restrictive on the
broad embodiment, and that this embodiment not be limited to the
specific constructions and arrangements shown and described, since
various other modifications may occur to those ordinarily skilled
in the art. Accordingly, the specification and drawings are to be
regarded in an illustrative rather than a restrictive sense.
Reference in the specification to "an embodiment," "one
embodiment," "some embodiments," or "other embodiments" means that
a particular feature, structure, or characteristic described in
connection with the embodiments is included in at least some
embodiments, but not necessarily all embodiments. The various
appearances "an embodiment," "one embodiment," or "some
embodiments" are not necessarily all referring to the same
embodiments. If the specification states a component, feature,
structure, or characteristic "may", "might", or "could" be
included, that particular component, feature, structure, or
characteristic is not required to be included. If the specification
or Claim refers to "a" or "an" element, that does not mean there is
only one of the element. If the specification or Claims refer to
"an additional" element, that does not preclude there being more
than one of the additional element.
The methods, systems and devices include improved security
operations and configurations with a novel approach to biometric
systems. Such systems would greatly benefit from increased security
features, particularly in financial transactions. Although this
embodiment is described and illustrated in the context of devices,
systems and related methods of validating biometric devices such as
fingerprint sensors, the scope of the embodiment extends to other
applications where such functions are useful. Furthermore, while
the foregoing description has been with reference to particular
embodiments of the embodiment, it will be appreciated that these
are only illustrative of the embodiment and that changes may be
made to those embodiments without departing from the principles of
the embodiment, the scope of which is defined by the appended
Claims and their equivalents.
* * * * *
References