U.S. patent number 10,101,695 [Application Number 15/623,595] was granted by the patent office on 2018-10-16 for image heating apparatus having a temperature detecting element mounted in a supporting member to contact a heat-conductive member.
This patent grant is currently assigned to Canon Kabushiki Kaisha. The grantee listed for this patent is CANON KABUSHIKI KAISHA. Invention is credited to Yuji Fujiwara, Akira Kato, Hideyuki Matsubara, Hisashi Nakahara, Yasuhiro Shimura, Noriaki Tanaka, Hideaki Yonekubo.
United States Patent |
10,101,695 |
Shimura , et al. |
October 16, 2018 |
Image heating apparatus having a temperature detecting element
mounted in a supporting member to contact a heat-conductive
member
Abstract
An image heating apparatus including a supporting member having
(a) a hole in which a temperature detecting element is disposed so
as to contact a second surface of a heat-conductive member, and (b)
an opposing surface that (i) opposes the second surface of the
heat-conductive member, and (ii) includes a contact region
contacting the second surface of the heat-conductive member, the
opposing surface of the supporting member being provided adjacent
to the hole of the supporting member in a longitudinal direction of
the heater. The contact region of the supporting member presses,
toward the heater, a part of the heat-conductive member
corresponding to the contact region of the supporting member, and
the temperature detecting element presses, toward the heater, a
part of the heat-conductive member corresponding to the hole of the
supporting member.
Inventors: |
Shimura; Yasuhiro (Yokohama,
JP), Yonekubo; Hideaki (Suntou-gun, JP),
Nakahara; Hisashi (Numazu, JP), Kato; Akira
(Mishima, JP), Tanaka; Noriaki (Suntou-gun,
JP), Matsubara; Hideyuki (Mishima, JP),
Fujiwara; Yuji (Susono, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
CANON KABUSHIKI KAISHA |
Tokyo |
N/A |
JP |
|
|
Assignee: |
Canon Kabushiki Kaisha (Tokyo,
JP)
|
Family
ID: |
51904776 |
Appl.
No.: |
15/623,595 |
Filed: |
June 15, 2017 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20170285543 A1 |
Oct 5, 2017 |
|
Related U.S. Patent Documents
|
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
Issue Date |
|
|
15091998 |
Apr 6, 2016 |
9715200 |
|
|
|
14541583 |
Nov 14, 2014 |
9342010 |
|
|
|
Foreign Application Priority Data
|
|
|
|
|
Nov 18, 2013 [JP] |
|
|
2013-237909 |
Nov 18, 2013 [JP] |
|
|
2013-237913 |
Sep 29, 2014 [JP] |
|
|
2014-198446 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G03G
15/2053 (20130101); G03G 15/206 (20130101); G03G
15/2042 (20130101); G03G 2215/2035 (20130101); G03G
2215/2016 (20130101) |
Current International
Class: |
G03G
15/20 (20060101) |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
|
|
|
|
|
|
|
101105677 |
|
Jan 2008 |
|
CN |
|
10-144453 |
|
May 1998 |
|
JP |
|
11-84919 |
|
Mar 1999 |
|
JP |
|
H11-84949 |
|
Mar 1999 |
|
JP |
|
2002-50452 |
|
Feb 2002 |
|
JP |
|
2003-007435 |
|
Jan 2003 |
|
JP |
|
2003-317898 |
|
Nov 2003 |
|
JP |
|
2011-018027 |
|
Jan 2011 |
|
JP |
|
Other References
European Search Report issued in counterpart European Patent
Application No. 14193379.6-1560, dated Mar. 24, 2015. cited by
applicant .
Chinese Office Action issued in corresponding Chinese Application
No. 201410655254.7 dated Jul. 29, 2016. cited by applicant .
Office Action dated Jul. 3, 2018, issued in Japanese Patent
Application No. 2014-198446. cited by applicant.
|
Primary Examiner: Brase; Sandra
Attorney, Agent or Firm: Fitzpatrick, Cella, Harper &
Scinto
Parent Case Text
This application is a divisional of U.S. patent application Ser.
No. 15/091,998, filed Apr. 6, 2016, which is a divisional of U.S.
patent application Ser. No. 14/541,583, filed Nov. 14, 2014.
Claims
What is claimed is:
1. An image heating apparatus comprising: a rotatable member; a
heater contacting the rotatable member; a heat-conductive member
having a first surface contacting a surface of the heater opposite
to a surface of the heater contacting the rotatable member, and a
second surface opposite to the first surface; a supporting member
supporting the heater through the heat-conductive member; and a
temperature detecting element configured to detect a temperature of
the heater through the heat-conductive member, wherein a recording
material on which an image is formed is heated by heat from the
heater via the rotatable member, wherein the supporting member has
(a) a hole in which the temperature detecting element is disposed
so as to contact the second surface of the heat-conductive member,
and (b) an opposing surface that (i) opposes the second surface of
the heat-conductive member, and (ii) includes a contact region
contacting the second surface of the heat-conductive member, the
opposing surface of the supporting member being provided adjacent
to the hole of the supporting member in a longitudinal direction of
the heater, and wherein the contact region of the supporting member
presses, toward the heater, a part of the heat-conductive member
corresponding to the contact region of the supporting member, and
the temperature detecting element presses, toward the heater, a
part of the heat-conductive member corresponding to the hole of the
supporting member.
2. The image heating apparatus according to claim 1, wherein the
opposing surface of the supporting member has a recessed region
recessed from the second surface of the heat-conductive member, the
recessed region being provided adjacent to the contact region of
the supporting member in a short direction of the heater
perpendicular to the longitudinal direction of the heater.
3. The image heating apparatus according to claim 2, wherein a
width of the recessed region in the short direction of the heater
is narrower than a width of the hole of the supporting member in
the short direction of the heater.
4. The image heating apparatus according to claim 1, wherein the
heater includes a substrate and a heat generating element formed on
the substrate, and wherein a thermal conductivity of the
heat-conductive member with respect to a surface direction thereof
is higher than a thermal conductivity of the substrate.
5. The image heating apparatus according to claim 1, further
comprising a protecting element contacting the second surface of
the heat-conductive member, the protecting element being configured
to interrupt supply of power to the heater when the temperature of
the heater is abnormally increased, wherein the opposing surface of
the supporting member includes another hole in which the protecting
element is disposed so as to contact the second surface of the
heat-conductive member, and the protecting element presses, toward
the heater, a part of the heat-conductive member.
6. The image heating apparatus according to claim 1, wherein the
rotatable member is a cylindrical film.
7. The image heating apparatus according to claim 6, wherein the
heater contacts an inner surface of the film and forms a nip
portion with the pressing roller via the film.
Description
FIELD OF THE INVENTION AND RELATED ART
The present invention relates to an image heating apparatus
suitable for use as a fixing device (apparatus) to be mounted in an
image forming apparatus such as an electrophotographic copying
machine or an electrophotographic printer, and relates to the image
forming apparatus in which the image heating apparatus is
mounted.
In an image forming apparatus in which the image heating apparatus
is mounted, when continuous printing is performed using a
small-sized recording material having a width smaller than a
maximum-width recording material (sheet) usable in the image
heating apparatus, a non-sheet-passing portion temperature rise is
generated. This is a phenomenon in which the temperature rises in a
region (non-sheet-passing portion) outside of a region through
which the small-sized sheet passes (sheet-passing portion) with
respect to a longitudinal direction of a fixing nip.
As one of methods for suppressing this non-sheet-passing portion
temperature rise, in Japanese Laid-Open Patent Application (JP-A)
2003-317898, a method has been proposed in which a high
heat-conductive member having a high thermal conductivity is
sandwiched between a heater supporting member and a ceramic
heater.
It turned out that the time until the temperature of the image
heating apparatus reaches a predetermined temperature and the
response time of a protecting function in the case where the heater
cannot be controlled vary, depending on the structure in which the
high heat-conductive member is sandwiched.
SUMMARY OF THE INVENTION
A principal object of the present invention is to provide an image
heating apparatus having a short rise time and high reliability,
while having a function of suppressing the temperature rise at a
non-sheet-passing portion.
According to one aspect, the present invention provides an image
heating apparatus that includes a heater including a substrate and
a heat generating element provided on the substrate, a supporting
member for supporting the heater, and a high heat-conductive member
sandwiched between the heater and the supporting member. A
recording material on which an image is formed is heated by heat
from the heater. The supporting member has a bottom region, where
the supporting member supports the heater, including a first region
where the supporting member contacts the high heat-conductive
member so as to apply pressure between the heater and the high
heat-conductive member, and a second region where the supporting
member is recessed from the high heat-conductive member relative to
the first region. At least a part of the first region overlaps,
with respect to a movement direction of the recording material,
with a region where the heat generating element is provided.
According to another aspect, the present invention provides an
image heating apparatus that includes a cylindrical film, a heater
including a substrate and a heat generating element provided on the
substrate, the heater contacting an inner surface of the film, a
supporting member for supporting the heater, and a high
heat-conductive member sandwiched between the heater and the
supporting member. A recording material on which an image is formed
is heated by heat from the heater via the film.
The supporting member has a bottom region, where the supporting
member supports the heater, including a first region where the
supporting member contacts the high heat-conductive member so as to
apply pressure between the heater and the high heat-conductive
member, and a second region where the supporting member is recessed
from the high heat-conductive member relative to the first region.
With respect to a movement direction of the recording material, the
first region is provided in at least two positions including a
first position corresponding to a downstream-most position of a
contact region between the film and the heater, and a second
position upstream of the first position corresponding to the
downstream-most position of the contact region. At least a part of
the second region is provided between the first position and the
second position.
These and other objects, features and advantages of the present
invention will become more apparent upon a consideration of the
following description of the preferred embodiments of the present
invention taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic illustration of an image forming apparatus in
Embodiment 1.
FIG. 2 is a schematic cross-sectional view of a principal part of a
fixing device (image heating apparatus).
FIG. 3 is a schematic first view of the principal part of the
fixing device which is partly omitted in midstream.
In FIG. 4, (a) to (d) are illustrations of a structure of a heater
(heat generating element).
FIG. 5 is a partly enlarged view of FIG. 2.
FIG. 6 is a block diagram of a control system.
FIG. 7 is a control circuit diagram of the heater.
In FIG. 8, (A) to (E) are illustrations of a pressing method of the
heater and a high heat-conductive member.
In FIG. 9, (A) is a graph showing a relationship between a pressure
and a contact thermal resistance of the heater and the high
heat-conductive member, and (B) is a graph showing a relationship
between a short direction position of the heater and a thermal
stress of a heater substrate.
In FIG. 10, (A) to (C) are illustrations of a response-improving
effect of a temperature detecting element.
In FIG. 11, (A) and (B) are illustrations of a pressing method of a
heater and a high heat-conductive member in Comparison Example.
In FIG. 12, (A) to (D) are illustrations of a modified example of a
heater supporting member.
In FIG. 13, (A) to (E) are illustrations in the case where an
adhesive is used.
In FIG. 14, (A) to (E) are illustrations in the case where a
heat-conductive grease is used.
In FIG. 15, (A) to (D) are illustrations in the case where a heat
generation surface of the heater is a back surface.
In FIG. 16, (A) to (D) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 2.
In FIG. 17, (A) to (E) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 3.
In FIG. 18, (A) to (E) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 4.
In FIG. 19, (A) to (D) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 5.
In FIG. 20, (A) is a graph showing a short direction temperature
distribution of a back surface temperature of a heater substrate,
and (B) is a graph showing a short direction temperature
distribution of a film surface temperature.
In FIG. 21, (A) to (C) are graphs each showing a flow of heat of
the heater, the high heat-conductive member and the heater
supporting member.
In FIG. 22, (A) and (B) are illustrations each showing a modified
example of the heater supporting member in Embodiment 5.
In FIG. 23, (A) to (D) are illustrations in the case where an
adhesive is used in Embodiment 5.
In FIG. 24, (A) to (D) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 6.
In FIG. 25, (A) to (D) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 7.
In FIG. 26, (A) to (D) are illustrations of a pressing method of a
heater and a high heat-conductive member in Embodiment 8.
DESCRIPTION OF THE EMBODIMENTS
[Embodiment 1]
(1) Image Forming Apparatus
FIG. 1 is a schematic cross-sectional view of an example of an
image forming apparatus 100 in which an image heating apparatus
according to the present invention is mounted as a fixing device
200. This image forming apparatus 100 is a laser printer using
electrophotographic recording technology, and forms an image, on a
sheet (sheet-like recording material) P, corresponding to
electrical image information inputted from a host device 500 (FIG.
6) such as a personal computer into a controller 101, and then
prints outs the sheet.
When a print signal is generated, a scanner unit 21 emits laser
light modulated depending on the image information, and scans a
photosensitive member 19, which is electrically charged to a
predetermined polarity by a charging roller 16, and which is
rotationally driven in the counterclockwise direction indicated by
an arrow. As a result, an electrostatic latent image is formed on
the photosensitive member 19. To this electrostatic latent image, a
toner (developer) is supplied from a developing device 17, so that
a toner image depending on the image information is formed on the
photosensitive member 19. On the other hand, the sheets P stacked
in a sheet-feeding cassette 11 are fed one by one by a pick-up
roller 12, and then are fed toward a registration roller pair 14 by
a roller pair 13.
Then, the sheet P is fed to a transfer position from the
registration roller pair 14 in synchronism with the timing when the
toner image on the photosensitive member 19 reaches the transfer
position formed between the photosensitive member 19 and a transfer
roller 20. In a process in which the sheet P passes through the
transfer position, the toner image is transferred from the
photosensitive member 19 onto the sheet P. Therefore, the sheet P
is heated by the fixing device 200, so that the toner image is
heat-fixed on the sheet P. The sheet P carrying thereon the fixed
toner image is discharged onto a tray 31 at an upper portion by
roller pairs 26 and 27.
The image forming apparatus 100 includes a cleaner 18 for cleaning
the photosensitive member 19, and a motor 30 for driving the fixing
device 200 and the like. The photosensitive member 19, the charging
roller 16, the scanner unit 21, the developing device 17, the
transfer roller 20, and the like, which are described above,
constitute an image forming portion. The photosensitive member 19,
the charging roller 16, the developing device 17, and the cleaner
18 are constituted as a process cartridge 15 detachably mountable
to a main assembly of the printer in a collective manner. An
operation and image forming process of the above-described image
forming portion are well known and therefore a detailed description
thereof will be omitted.
The laser printer 100 in this embodiment uses a plurality of sheet
sizes. That is, the laser printer 100 is capable of printing the
image on sheets having the plurality of sheet sizes, including a
letter paper size (about 216 mm x 279 mm), an A4 paper size (210 mm
x 297 mm), and A5 paper size (148 mm x 210 mm).
The printer basically feeds the sheet in a short edge feeding
manner (in which a long edge of the sheet is parallel to a (sheet)
feeding direction) by center-line basis feeding, and the largest
size (in width) of compatible regular sheet sizes (listed in a
catalogue) is about 216 mm in width of the letter paper. This sheet
having the largest width size is defined as a large-sized paper
(sheet). Sheets (A4-sized paper, A5-sized paper and the like)
having paper widths smaller than this sheet are defined as a
small-sized paper.
The center-line basis feeding of the sheet P is such that even when
any large and small (width) sheets capable of being passed through
the printer are used, each of the sheets is passed through the
printer in a manner in which a center line of the sheet with
respect to a widthwise direction is aligned with a center (line) of
a sheet feeding path with respect to the widthwise direction.
(2) Fixing Device (Image Heating Apparatus)
(2-1) Brief Description of Device Structure
FIG. 2 is a schematic cross-sectional view of a principal part of a
fixing device 200 in this embodiment. FIG. 3 is a schematic first
view of the principal part of the fixing device 200 which is partly
omitted in midstream. In FIG. 4, (a) to (d) are illustrations of a
structure of a heater (heat generating element). FIG. 5 is a partly
enlarged view of FIG. 2. FIG. 6 is a block diagram of a control
system.
With respect to the fixing device 200 and constituent elements
thereof in this embodiment, a front side (surface) is a side
(surface) when the fixing device 200 is seen from a sheet entrance
side thereof, and a rear side (surface) is a side (surface) (sheet
exit side) opposite from the front side. Left and right are left
(one end side) and right (the other end side) when the fixing
device 200 is seen from the front side. Further, an upstream (side)
and a downstream (side) are those with respect to a sheet feeding
direction X.
A longitudinal direction (widthwise direction) and a sheet width
direction of the fixing device are directions substantially
parallel to a direction perpendicular to the feeding direction X of
the sheet P (or a movement direction (movable member movement
direction) of a film which is a movable member). A short direction
of the fixing device is a direction substantially parallel to the
feeding direction X of the sheet P (or the movement direction of
the film).
The fixing device 200 in this embodiment is an on-demand fixing
device of a film (belt) heating type and a tension-less type. The
fixing device 200 roughly includes a film unit 203 including a
flexible cylindrical (endless) film (belt) 202 as the movable
member, and includes a pressing roller (elastic roller: rotatable
pressing member) 208, having a heat-resistant property and
elasticity, as a nip-forming member.
The film unit 203 is an assembly of a heater 300 as a heating
member, a high heat-conductive member 220, a heater supporting
member 201, a pressing stay 204, regulating members (flanges) 205
(L, R) for regulating shift (lateral deviation) of the film 202,
and the like.
The film 202 is a member for conducting method to the sheet P, and
has a composite structure consisting of a cylindrical base layer
(base material layer), an elastic layer formed on an outer
peripheral surface of the base layer, a parting layer as a surface
layer formed on an outer peripheral surface of the elastic layer,
and an inner surface coating layer formed on an inner peripheral
surface of the base layer. A material for the base layer is a
heat-resistant resin such as polyimide or metal such as stainless
steel.
Each of the heater 300, the high heat-conductive member 220, the
heater supporting member 201 and the pressing stay 204 is a long
member extending in a left-right direction of the fixing device.
The film 202 is externally fitted loosely onto an assembly of the
stay 204 and the heater supporting member 201 on which the heater
300 and the high heat-conductive member 220 are supported. The
regulating members 205 (L, R) are mounted on one end portion and
the other end portion of the pressing stay 204 in one end side and
the other end side of the film 202, so that the film 202 is
interposed between the left and right regulating members 205L and
205R.
The heater 300 is a ceramic heater in this embodiment. The heater
300 has a basic structure including a ceramic substrate having an
elongated thin plate shape and a heat generating element (heat
generating resistor) which is provided on a surface of this
substrate in one side of the substrate and which generates heat by
energization (supply of electric power) to the heat generating
element, and is a low-thermal-capacity heater increased in
temperature with an abrupt rising characteristic by the
energization to the heat generating element. A specific structure
of the heater 300 will be described in (3) below in detail.
The heater supporting member 201 is a molded member formed of the
heat-resistant resin, and is provided with a heater-fitting groove
201a along a longitudinal direction of the member at a
substantially central portion with respect to a circumferential
direction of the outer surface of the member. The high
heat-conductive member 220 and the heater 300 are fitted (engaged)
into and supported by the heater-fitting groove 201a. In the groove
201a, the high heat-conductive member 220 is interposed between the
heater supporting member 201 and the heater 300. The high
heat-conductive member 220 will be described in (3)
specifically.
The heater supporting member 201 not only supports the high
heat-conductive member 220 and the heater 300 but also functions as
a guiding member for guiding rotation of the film 202 externally
fitted onto the heater supporting member 201 and the pressing stay
204.
The pressing stay 204 is a member having rigidity, and is a member
for providing a longitudinal strength to the heater supporting
member 201 by being pressed against an inside (back side) of the
resin-made heater supporting member 201 and for rectifying the
heater supporting member 201. In this embodiment, the pressing stay
204 is a metal-molded material having an U-shape in cross
section.
Each of the regulating members 205 (L, R) is a molded member formed
of the heat-resistant resin, so that the regulating members 205 (L,
R) have a bilaterally symmetrical shape, and has the functions of
regulating (limiting) movement (thrust movement) along the
longitudinal direction of the heater supporting member 201 during
the rotation of the film 202, and of guiding an inner peripheral
surface of a film end portion during the rotation of the film 202.
That is, each of the regulating members 205 (L, R) includes a
flange portion 205a, for receiving (stopping) the film end surface,
as a first regulating (limiting) portion for regulating the thrust
movement of the film 202. Further, each of the regulating members
205 (L, R) includes an inner surface guiding portion 205b as a
second regulating portion for guiding an inner surface of the film
end portion by being fitted into the film end portion.
The pressing roller 208 is an elastic roller having a composite
layer structure including a metal core 209 formed of a material
such as iron or aluminum, an elastic layer 210 formed, of a
material such as a silicone rubber, around the metal core in a
roller shape, and a parting layer (surface layer) 210a coating an
outer peripheral surface of the elastic layer 210.
The pressing roller 208 is provided so that each of rotation center
shaft portions 209a in left and right end portion sides is
rotatably supported in the associated one of left and right side
plates 250 (L, R) of a fixing device frame via the associated one
of bearing members (bearings) 251 (L, R). The right-side shaft
portion 209a is provided concentrically integral with a drive gear
G. To this drive gear G, a driving force of the motor 30 controlled
by a controller 101 via a motor driver 102 is transmitted via a
power transmitting mechanism (not shown). As a result, the pressing
roller 208 is rotationally driven as a rotatable driving member at
a predetermined peripheral speed in the clockwise direction of an
arrow R208 in FIG. 2.
On the other hand, the film unit 203 is disposed on, and in a
direction substantially parallel with, the pressing roller 208
while keeping a heater-disposed portion side of the heater
supporting member 201 downward, and is disposed between the left
and right side plates 250 (L, R). Specifically, a vertical guiding
groove 205c provided in each of the left and right regulating
members 250 (L, R) of the film unit 203 engages with an associated
vertical guiding slit 250a provided in each of the left and right
side plates 250 (L, R).
As a result, the left and right regulating members 205 (L, R) are
supported by the left and right side plates 250 (L, R),
respectively, so as to be vertically slidable (movable) relative to
the left and right side plates 250 (L, R), respectively. That is,
the film unit 203 is supported by and vertically slidable relative
to the left and right side plates 250 (L, R). The heater-disposed
portion of the heater supporting member 201 of the film unit 203
opposes the pressing roller 208 via the film 202.
Further, pressure-receiving portions 205d of the left and right
regulating members 205 (L, R) are pressed at a predetermined
pressing force (pressure) by left and right pressing mechanisms 252
(L, R), respectively. Each of the left and right pressing
mechanisms (L, R) 252 is a mechanism including, e.g., a pressing
spring, a pressing lever or a pressing cam. That is, the film unit
203 is pressed against the pressing roller 208 at the predetermined
pressing force, so that the film 202 on the heater-disposed portion
of the heater supporting member 201 is press-contacted to the
pressing roller 208 against elasticity of the elastic (material)
layer 210 of the pressing roller 208.
As a result, the heater 300 contacts the inner surface of the film
202, so that a nip N having a predetermined width with respect to a
film movement direction (movable member movement direction) is
formed between the film 202 and the pressing roller 208. That is,
the pressing roller 208 forms the nip N via the film 202 in
combination with the heater 300.
The heater 300 exists on the heater supporting member 201 at a
position corresponding to the nip N and extends in the longitudinal
direction of the heater supporting member 201. In the fixing device
200 in this embodiment, the heater 300 and the heater supporting
member 201 constitute a back-up member contacting the inner surface
of the film 202. Further, the pressing roller 208 forms the nip N
via the film 202 in combination with the back-up member (300, 201).
In this way, the heater 300 is provided inside the film 202, and is
press-contacted to the film 202 toward the pressing roller 208 to
form the nip N.
(2-2) Fixing Operation
A fixing operation of the fixing device 200 is as follows. The
controller 101 actuates the motor 30 at predetermined control
timing. From this motor 30 to the pressing roller 208, a rotational
driving force is transmitted. As a result, the pressing roller 208
is rotationally driven at a predetermined speed in the clockwise
direction of the arrow R208.
The pressing roller 208 is rotationally driven, so that at the nip
N, a rotational torque acts on the film 202 by a frictional force
with the film 202. As a result, the film 202 is rotated, by the
rotation of the pressing roller 208, in the counterclockwise
direction of an arrow R202 around the heater supporting member 201
and the pressing stay 204 at a speed substantially corresponding to
the speed of the pressing roller 208 while being slid in close
contact with the surface of the heater 300 at the inner surface
thereof. Onto the inner surface of the film 202, a semisolid
lubrication is applied, thus ensuring a sliding property between
the outer surface of each of the heater 300 and the heater
supporting member 201 and the inner surface of the film 202 in the
nip N.
Further, the controller starts energization (supply of electric
power) from a power supplying portion (power controller) 103 to the
heater 300. The power supply from the power supplying portion 103
to the heater 300 is made is made via an electric connector 104
mounted in a left end portion side of the film unit 203. By this
energization, the heater 300 is quickly increased in
temperature.
The temperature increase (rise) is detected by a thermistor
(temperature detecting element) 211 provided in contact with the
high heat-conductive member 220 contacting the back surface (upper
surface) of the heater 300. The thermistor 211 is connected with
the controller 101 via an A/D converter 105. The film 202 is heated
at the nip N by heat generation of the heater 300 by the
energization.
The controller 101 samples an output from the thermistor 211 at a
predetermined period, and the thus-obtained temperature information
is reflected in temperature control. That is, the controller 101
determines the contents of the temperature control of the heater
300 on the basis of the output of the thermistor 211, and controls
the energization to the heater 300 by the power supplying portion
103 so that a temperature of the heater 300 at a portion
corresponding to the sheet-passing portion is a target temperature
(predetermined set temperature).
In a control state of the fixing device 200 described above, the
sheet P on which an unfixed toner image t is carried is fed from
the image forming portion toward the fixing device 200, and then is
introduced into the nip N. The sheet P is supplied with heat from
the heater 300 via the film 202 in a process in which the sheet P
is nipped and fed through the nip N. The toner image t is
melt-fixed as a fixed image on the surface of the sheet P by the
heat of the heater 300 and the pressure at the nip N. That is, the
toner image on the sheet (recording material) is heated and fixed.
The sheet P coming out of the nip N is curvature-separated from the
film 202 and is discharged from the device 200, and then is
fed.
The controller 101 stops, when the printing operation is ended, the
energization from the power supplying portion 103 to the heater 300
by an instruction to end the fixing operation. Further, the
controller stops the motor 30.
In FIG. 3, A is a maximum heat generation region width of the
heater 300. B is a sheet-passing width (maximum sheet-passing
width) of the large-sized paper, and is a width equal to or
somewhat smaller than the maximum heat generation region width A.
In this embodiment, the maximum sheet-passing width B is about 216
mm (short edge feeding) of the letter paper. A full length of the
nip N formed by the film 202 and the pressing roller 208 (i.e., a
length of the pressing roller 208) is a width larger than the
maximum heat generation region width A of the heater 300.
(3) Heater 300
In FIG. 4, (a) is a schematic plan view of the heater 300 which is
partly cut away in one surface side (front surface side), (b) is a
schematic plan view of the heater 300 in the other surface side
(back surface side), (c) is a sectional view at (c)-(c) position in
(b) of FIG. 4, and (d) is a sectional view at (d)-(d) position in
(b) of FIG. 4.
The heater 300 as the heating member in this embodiment includes a
substrate 303 and heat generating elements 301-1 and 301-2. Each of
the heat generating elements is a heat generating element provided
on the substrate along the longitudinal direction of the substrate,
and the heat generating elements includes a plurality of the heat
generating elements 301-1 and 301-2 which are first and second heat
generating elements provided at different positions with respect to
a short direction of the substrate while extending along the
longitudinal direction of the substrate.
In this embodiment, the heater 300 is the ceramic heater.
Basically, the heater 300 includes a heater substrate 303 formed by
ceramic in an elongated thin plate shape, and first and second
(two) heat generating resistors 301-1 and 301-2 provided along the
longitudinal direction of the substrate in one surface side (front
surface side) of the heater substrate 303. The heater 300 further
includes an insulating (surface) protecting layer 304 which covers
the heat generating resistors.
The heater surface 303 is a ceramic substrate, formed of, e.g.,
Al.sub.2O.sub.3 or AlN in an elongated thin plate shape, extending
in a longitudinal direction crossing with (perpendicular to) a
sheet-passing direction at the nip N. Each of the heat generating
resistors 301-1 and 301-2 is formed by pattern-coating an electric
resistance material paste of, e.g., Ag/Pd (silver/palladium) by
screen printing and then by baking the paste. In this embodiment,
the heat generating resistors 301-1 and 301-2 are formed in strip
shape, and the two heat generating resistors are formed in parallel
with each other along the longitudinal direction of the substrate
with a predetermined interval therebetween on the substrate surface
with respect to the short direction of the substrate.
In one end side (left side) of the heat generating resistors 301-1
and 301-2, the heat generating resistors are electrically connected
to electrode portions (contact portions) C1 and C2, respectively,
via electroconductive members 305. Further, in the other end side
(right side) of the heat generating resistors 301-1 and 301-2, the
heat generating resistors are electrically connected in series by
an electroconductive member 305. Each of the electroconductive
members 305 and the electrode portions C1 and C2 is formed by
pattern-coating the electroconductive material paste such as Ag by
the screen printing or the like and then by baking the paste.
The surface protecting layer 304 is provided so as to cover a whole
of the heater substrate surface except for the electrode portions
C1 and C2. In this embodiment, the surface protecting layer 304 is
formed of glass by pattern-coating a glass paste by the screen
printing or the like and then by baking the paste. The surface
protecting layer 304 is used for protecting the heat generating
resistors 301-1 and 301-2 and for maintaining electrical
insulation.
The electric power is supplied between the electrode portions C1
and C2, so that each of the heat generating resistors 301-1 and
301-2 connected in series generates heat. The heat generating
resistors 301-1 and 301-2 are made to have the same length. The
length region of these heat generating resistors 301-1 and 301-2
constitutes the maximum heat generation region width A. A
center-basis feeding line (phantom line) O for the sheet P is
located at a position substantially corresponding to a bisection
position of the maximum heat generation region width A of the
heater 300.
In the heater 300 in this embodiment, in order to improve an end
portion fixing property of the image, a heat generation
distribution of each of the heat generating resistors 301-1 and
301-2 is set so that an amount of heat generation at an end portion
E in a heat generation region is higher than an amount of heat
generation at a central portion in the heat generation region (end
portion heat generating resistor drawing). This will be described
later.
The heater 300 is fitted into the heater fitting groove 201a of the
heater supporting member 201 so that the front surface thereof is
directed upward and so that the high heat-conductive member 220 is
interposed between the heater back surface and the heater
supporting member 201 in the groove 201a, and thus is supported by
the heater supporting member 201. The high heat-conductive member
220 is a member for suppressing a non-sheet-passing portion
temperature rise during continuous sheet passing of the small-sized
paper, and is interposed between the heater back surface and the
heater supporting member 201 by being sandwiched between the heater
back surface and a bearing surface of the groove 201a.
In FIG. 4, (a) shows a state in which the high heat-conductive
member 220 having a size and a shape such that the high
heat-conductive member 220 covers a range longer than at least the
heat generation region of the heat generating resistors 301-1 and
301-2 is disposed superposedly on the heater substrate back
surface. The high heat-conductive member 220 is disposed at the
heater substrate back surface so as to cover at least a region
corresponding to the maximum heat generation region width A of the
heater 300.
The high heat-conductive member 220 is sandwiched and interposed
between the heater back surface and the bearing surface of the
groove 201a in a state in which the heater 300 is fitted into the
heater fitting groove 201a of the heater supporting member 201 with
the upward front surface and is thus supported by the heater
supporting member 201. Further, the high heat-conductive member 220
is sandwiched and pressed between the heater supporting member 201
and the heater 300 by the pressing force of the above-described
pressing mechanisms 252 (L, R).
FIG. 5 is an enlarged view of FIG. 2 in a region where the film 202
and the pressing roller 208 contact each other. The sheet P and the
pressing roller 208 are omitted from illustration. The inner
surface of the film 202 and the (front) surface of the surface
protecting layer 304 of the heater 300 contact each other to form
the nip N between the film 202 and the pressing roller 208. A
region N (nip) is a contact region between the film 202 and the
pressing roller 208, and a region NA is a contact region between
the film 202 and the heater 300. The region NA is hereinafter
referred to as an inner surface nip.
The high heat-conductive member 220 is a member higher in thermal
conductivity than the heater 300. In this embodiment, as the high
heat-conductive member 220, an anisotropic heat-conductive member
higher in thermal conductivity with respect to a planar (surface)
direction than the heater substrate 303 is used.
Compared with the heater substrate 303, as a material having a high
thermal conductivity with respect to the planar direction, it is
possible to use a flexible sheet-shaped member or the like using,
e.g., graphite. That is, the high heat-conductive member 220 in
this embodiment is the flexible sheet-shaped member using graphite
as the material therefor, and the thermal conductivity with respect
to a sheet surface direction (parallel to the sheet surface)
thereof is higher than the thermal conductivity of the heater
300.
In this embodiment, as the high heat-conductive member 220, the
graphite sheet of 1000 V/mK in thermal conductivity with respect to
the planar direction, 15 W/mK in thermal conductivity with respect
to a thickness direction, 70 .mu.m in thickness and 1.2 g/cm.sup.3
in density was used.
Further, for the high heat-conductive member 220, a thin metal
material such as aluminum higher in thermal conductivity than the
heater 300 (heater substrate 303) may also be used.
A thermistor (temperature detecting element) 211 and a protecting
element 212, such as a thermoswitch, a temperature fuse or a
thermostat, in which a switch is provided are contacted to the high
heat-conductive member 220, and are configured to receive the heat
from the heater 300, via the high heat-conductive member 220,
fitted into and supported by the heater fitting groove 201a of the
heater supporting member 201. The thermistor 211 and the protecting
element 212 are pressed against the high heat-conductive member 212
by an urging member (not shown) such as a leaf spring. The
thermistor 211 contacts the high heat-conductive member 220 through
a first hole ET1 provided in the heater supporting member 201. A
pressure per unit area A to the high heat-conductive member 220 by
the thermistor 211 is smaller than a pressure per unit area applied
to a first region E1 described later. Further, the protecting
element 212 contacts the high heat-conductive member 220 through a
second hole ET2 provided in the heater supporting member 201. Also
a pressure per unit area applied to the protecting element 212 by
the protecting element 212 is smaller than a pressure per unit area
applied to the protecting element 212.
The thermistor 211 and the protecting element 212 are positioned
and disposed in one end side and the other end side, respectively,
with respect to the center basis feeding line O as a boundary as
shown in (b) of FIG. 4. Further, both the thermistor 211 and the
protecting element 212 are disposed in the passing region of a
minimum-sized sheet P capable of passing through the fixing device
200. The thermistor 211 is the temperature detecting element for
temperature-controlling the heater 300 as described above. The
protecting element 212 is connected in series to an energization
circuit to the heater 300 as shown in FIG. 6, and operates when the
heater 300 is abnormally increased in temperature to interrupt an
energization line to the heat generating resistors 301-1 and
301-2.
(4) Electric Power Controller for Heater 300
FIG. 7 shows an electric power controller for the heater 300 in
this embodiment, in which a commercial AC power source 401 is
connected to the printer 100. The electric power control of the
heater 300 is effected by energization and interruption of a triac
416. The electric power supply to the heater 300 is effected via
the electrode portions C1 and C2, so that the electric power is
supplied to the heat generating resistors 301-1 and 301-2 of the
heater 300.
A zero-cross detecting portion 430 is a circuit for detecting
zero-cross of the AC power source 401, and outputs a zero-cross
("ZEROX") signal to the controller (CPU) 101. The ZEROX signal is
used for controlling the heater 300, and as an example of a
zero-cross circuit, a method described in JP-A 2011-18027 can be
used.
An operation of the triac 416 will be described. Resistors 413 and
417 are resistors for driving the triac 416, and a photo-triac
coupler 415 is a device for ensuring a creepage distance for
insulation between a primary side and a secondary side. The triac
416 is turned on by supplying the electric power to a
light-emitting diode of the photo-triac coupler 415. A resistor 418
is a resistor for limiting a current of the light-emitting diode of
the photo-triac coupler 415. By controlling a transistor 419, the
photo-triac coupler 415 is turned on and off.
The transistor 419 is operated by a "FUSER" signal from the
controller 101. A temperature detected by the thermistor 211 is
detected by the controller in such a manner that a divided voltage
between the thermistor 211 and a resistor 411 is inputted as a "TH"
signal into the controller 101. In an inside process of the
controller 101, on the basis of a detection temperature of the
thermistor 211 and a set temperature for the heater 300, the
electric power to be supplied is calculated by, e.g., PI control.
Further, the electric power is converted into control level of a
phase angle (phase control) and wave number (wave number control)
which correspond to the electric power to be supplied, and then the
triac is controlled depending on an associated control
condition.
For example, in the case where the fixing device 200 is in a
thermal runaway state by a breakdown, of the electric power
controller, such as short circuit of the triac 416, the protecting
element 212 operates, and interrupts the electric power supply to
the heater 300. Further, in the case where the controller 101
detects that the thermistor detection temperature ("TH" signal) is
a predetermined temperature or more, the controller 101 places a
relay 402 in a non-energization state, and thus interrupts the
electric power supply to the heater 300.
(5) Pressing Method of Heater and High Heat-Conductive Member
In FIG. 8, (A) to (E) are schematic views for illustrating a
pressing method of the heater 300 and the high heat-conductive
member 220 and a shape of the heater supporting member 201. The
high heat-conductive member 220 is, as described above, sandwiched
between the heater supporting member 201 and the heater 300 in a
pressed state by the pressing force of the pressing mechanisms 252
(L, R).
In a bottom region (region BA in (B) of FIG. 8) where the
supporting member 201 supports the heater 300, the supporting
member 201 in this embodiment has a first region (region E1 in FIG.
8) where the supporting member contacts the high heat-conductive
member so that the pressure is applied between the heater and the
high heat-conductive member and has a second region (region E2)
where the supporting member is recessed from the high
heat-conductive member relative to the first region. Further, at
least a part of the first region E1 overlaps with a region (HE1),
where the heat generating resistor 301-1 or 301-2 is provided, with
respect to a recording material movement direction (direction X). A
region ET1 provided in the supporting member 201 is a first hole in
which the thermistor 211 is disposed, and a region ET2 is a second
hole in which the protecting element 212 is disposed.
This will be specifically described below. In FIG. 8, (A) is the
schematic view of the heater 300 in the front side, and (B) is a
sectional view showing a cross-section of the heater 300 in a
central region B with respect to a longitudinal direction of the
heater 300.
In FIG. 8, (c) is a sectional view showing a cross-section of the
heater 300 in a region C where the protecting element 212 is
contacted to the high heat-conductive member 220 with respect to
the longitudinal direction of the heater 300.
In FIG. 8, (D) is a sectional view showing a cross-section of the
heater 300 in a region D where the thermistor 211 is contacted to
the high heat-conductive member 220 with respect to the
longitudinal direction of the heater 300.
In FIG. 11, (A) is a sectional view showing a cross-section in a
longitudinal central region (corresponding to the region B in (A)
of FIG. 8) in the case where a heater supporting member 701 in
Comparison Example is used. The region E1 of the supporting member
701 does not overlap with the region HE1 where the heat generating
member 301-1 or 301-2 is provided.
In FIG. 11, (B) is a sectional view showing a cross-section in a
longitudinal central region (corresponding to the region B in (A)
of FIG. 8) in the case where a heater supporting member 702 in
Comparison Example is used. The supporting member 701 does not have
a region E2.
As described above with reference to (B) to (D) of FIG. 8, the
region E1 of the supporting member 201 overlaps with the region
HE1, where the heat generating member 301-1 or 301-2 is provided,
with respect to the recording material movement direction. That is,
the high heat-conductive member 220 is pressed against the heater
300 at a position very close to the position where the heat
generating member 301-1 or 301-2 is provided. For that reason, the
influence of heat resistance of the heater substrate 303 until the
heat generated by the heat generating members reaches the high
heat-conductive member can be reduced, so that the heat generated
by the heat generating resistors 301-1 and 301-2 can be efficiently
conducted to the high heat-conductive member 220.
Further, at least a part of the second region E2 is provided at a
position opposing the high heat-conductive member 220, and at least
a part of the second region E2 opposes a region out of the region
HE1, where the heat generating member of the heater 300 is
provided, with respect to the recording material movement direction
X. For that reason, it is possible to suppress heat dissipation
from the high heat-conductive member 220 into the heater supporting
member 201. In this embodiment, all the first regions E1 excluding
the end portion regions E overlap with the regions HE1. Further,
all the second regions E2 oppose heater regions out of the regions
E1. Further, as shown in (B) of FIG. 8, the respective regions are
constituted so as to decrease the contact area between the high
heat-conductive member 220 and the heater supporting member 201.
For that reason, it is possible to reduce the heat dissipation into
the heater supporting member 201, so that a rise time of the image
heating apparatus can also be improved simultaneously.
A longitudinal heat generation distribution of each of the heat
generating resistors 301-1 and 301-2 of the heater 300 is set so
that an amount of heat generation at the end portion E ((A) of FIG.
8) in the heat generation region is higher than an amount of heat
generation at the central portion in the heat generation region.
Hereinafter, an operation of increasing the heat generation amount
of each of the heat generating resistors 301-1 and 301-2 at the end
portion E in the heat generation region is referred to as the end
portion heat generating member drawing.
In FIG. 8, (E) is a sectional view showing a cross-section of the
heater 300 of (A) in FIG. 8 in the longitudinal end portion region
E. As shown in (E) of FIG. 8, the heater 300 and the high
heat-conductive member 220 are contacted to each other at the whole
surface. The heat generation amount at the end portion E in the
heat generation region is high, and therefore thermal stress
generated at a heater substrate portion corresponding to the end
portion E in the heat generation region when the heater 300 is in
the thermal runaway state is larger than the heat generation amount
at the heater substrate central portion B and the like in some
cases.
In such a cases, at the end portion E in the heat generation
region, the thermal stress generated in the heater substrate 303
can be alleviated increasing a region where the high
heat-conductive member 220 and the heater 300 are pressed by the
heater supporting member 201 to be contacted to each other.
In this way, a width of the first region E1 at the longitudinal end
portion E of the heater is larger than a width of the first region
E1 at the longitudinal central portion of the heater. That is, with
respect to the longitudinal direction of the supporting member, a
constitution in which there is no second region E2 at the end
portion E in the bottom region or in which the second region E2 is
narrower at the end portion E than at the central portion B is
employed.
As a constitution other than the constitution as shown in (E) of
FIG. 8 in which the heater 300 and the high heat-conductive member
220 are contacted to each other at the whole surface, e.g., a
constituting using a heater supporting member 802 shown in (B) of
FIG. 12 may also be employed. That is, at the end portion E, the
region E2 is provided, and in addition, the region R1 may be made
broader than the region HE1.
Further, even in the case of a heater, in which the end portion
heat generating member drawing is not made, as in the case of a
heater 900 in a modified example of Embodiment 1 shown in (A) of
FIG. 13 described later, the thermal stress at the end portion E is
larger than the thermal stress at the central portion in the heater
heat generation region in some cases. For that reason, also with
respect to the case where the end portion heat generating member
drawing is not made as in the case of the heater 900 shown in (A)
of FIG. 13, in the end portion region E in the heat generation
region, the region E1 is increased. As a result, an effect of
alleviating the thermal stress of the heater substrate 303 is
obtained.
Incidentally, as shown in (E) of FIG. 8, at the end portion E in
the heat generation region, even when the region E1 is increased, a
position of the end portion E is spaced from the thermistor 211 and
the protecting element 212. For that reason, even when the amount
of the heat dissipation into the supporting member becomes large at
the end portion E, the large heat dissipation amount little
influence response properties of the protecting element 212 and the
thermistor 211.
Accordingly, the above-described effect of improving the response
properties of the protecting element 212 and the thermistor 211 and
the above-described effect of alleviating the thermal stress of the
heater 300 at the end portion E in the heat generation region can
be obtained concurrently. The response properties of the protecting
element and the thermistor are improved, and therefore when the
heater 300 causes the thermal runaway, it is possible to interrupt
the electric power supply to the heater 300 early and to prolong a
time until the heater 300 is broken by the thermal stress, so that
reliability of the image heating apparatus 200 can be further
enhanced.
In FIG. 9, (A) is a graph showing a relationship between the
pressure (pressing force) between the heater 300 and the high
heat-conductive member 220, and a contact thermal resistance
between the heater 300 and the high heat-conductive member 220, and
(B) is a graph showing the influence of the contact thermal
resistance between the heater 300 and the high heat-conductive
member 220 on the stress in the heater substrate 303 during the
thermal runaway.
Each of (A) and (B) of FIG. 8 is a result of simulation.
In a graph of (A) of FIG. 8 plotted by black (close) circles
(".circle-solid.") shows the relationship between the contact
thermal resistance and the pressure in the case where grease or the
like for increasing a degree of heat conduction is not provided
between the high heat-conductive member 220 and the heater 300.
This graph shows that the heat conduction cannot be obtained in
most cases in the region E2 where the high heat-conductive member
220 and the heater 300 are in a non-pressure state. That is, a
predetermined pressure is required to obtain the heat conduction
between the high heat-conductive member 220 and the heater 300. For
that reason, the heater supporting member 201 in this embodiment is
constituted so that the heat from the heat generating member is
easily conducted to the high heat-conductive member by causing at
least the part of the first region E1 to overlap with the region
HE1, where the heat generating member is provided, with respect to
the recording material movement direction X. On the other hand, the
contact thermal resistance between the heater and the high
heat-conductive member in the region E2 is large, and therefore the
heat from the heat generating member is not readily conducted to
the high heat-conductive member. That is, in the region E2, the
heat is also not readily conducted from the high heat-conductive
member to the supporting member. Accordingly, at least the part of
the region E2 is provided in the region out of the region HE1 with
respect to the recording material movement direction X, whereby an
increase in time required for rising the fixing device (i.e., a
time until the heater temperature reaches a fixable temperature)
can be suppressed.
Incidentally, at a position of the supporting member 201 shown in
(B) of FIG. 8, the contact area (area of the region E1) between the
heater 300 and the high heat-conductive member 220 is about 30% of
the heater width. For that reason, compared with the case where the
region E1 is provided at the whole surface of the heater, it is
possible to increase the pressure between the heater 300 and the
high heat-conductive member 220.
The pressure in the case where the heater supporting member 702
((B) of FIG. 11) in Comparison Example in which a proportion of the
region E1 to the heater width is 100% is about 300 gf/cm.sup.2
(shown by (1) in (A) of FIG. 9). In the case where the pressure
applied to the whole of the heater 300 is constant, when the heater
supporting member 201 in this embodiment (in which the proportion
of the region E1 is 30%) is used, the pressure becomes about 1000
gf/cm.sup.2 (shown by (2) in (A) of FIG. 9), and therefore the
contact thermal resistance between the heater 300 and the high
heat-conductive member 220 can be reduced by about 30%.
By providing not only the region E1 but also the region E2, an
effect of decreasing the contact thermal resistance per unit area
between the heater 300 and the high heat-conductive member 220 is
obtained. For that reason, the heat generated by the heat
generating resistors 301-1 and 301-2 can be efficiently conducted
to the high heat-conductive member 220.
Further, in a graph of (B) of FIG. 8 plotted by white (open)
circles (".smallcircle.") shows the relationship between the
contact thermal resistance and the pressure in the case where
heat-conductive grease as an adhesive material (heat-conductive
material) is applied between the high heat-conductive member 220
and the heater 300. This graph shows that by interposing the
adhesive material such as the grease, the contact thermal
resistance between the high heat-conductive member 220 and the
heater 300 can be decreased. For that reason, depending on
necessity for decreasing the contact thermal resistance, the
adhesive material such as the grease may also be applied between
the high heat-conductive member 220 and the heater 300.
For example, in the case where the pressure for bringing the
protecting element 212 and the thermistor 211 into contact with the
high heat-conductive member 220 cannot be made high, constitutions
shown in (C) and (D) of FIG. 14 may be employed. That is, a
heat-conductive grease 1000 may also be applied onto only a region
where the protecting element 212 is contacted to the high
heat-conductive member 220 and a region where the thermistor 211 is
contacted to the high heat-conductive member 220. Further, as shown
in (E) of FIG. 14, the grease 10000 may also be applied onto a
limited place, where the stress is exerted on the heater substrate
303 when the heater 300 causes the thermal runaway, such as a
region where the heat generation amount of the heater 300 is large
or the heat generation region end portion E of the heater 300.
Further, as the adhesive material, in place of the grease 10000, an
adhesive (heat-conductive adhesive) having high thermal
conductivity may also be used. As shown in FIG. 14, by selectively
applying the grease 1000, it is possible to decrease a necessary
amount of the grease 1000 while satisfying a necessary performance,
and therefore the selective application of the grease 1000 is
advantageous in that a cost of the fixing device 200 is
reduced.
In FIG. 9, (B) is a graph showing a result of simulation of the
thermal stress generated in the heater substrate 303 after a lapse
of a predetermined time when the heater 300 exhibits the thermal
runaway. In (B) of FIG. 9, the thermal stress with respect to a
short direction of the heater substrate 303 in the case of (E) of
FIG. 8 and the thermal stress with respect to the short direction
of the heater substrate 303 in the case where the adhesive material
such as the grease 1000 is applied between the high heat-conductive
member 220 and the heater 300 as shown in (E) of FIG. 14 are
shown.
In the case where the adhesive material such as the grease 1000 is
applied between the high heat-conductive member 220 and the heater
300, the contact thermal resistance between the high
heat-conductive member 220 and the heater 300 can be decreased. For
that reason, the effect of alleviating the thermal stress of the
heater 300 can be enhanced by the high heat-conductive member 220.
Therefore, as described above, when the heater 300 exhibits the
thermal runaway, the application of the grease 1000 particularly at
the place where the stress is exerted on the heater substrate 303
is advantageous in that reliability of the image heating apparatus
300 is enhanced.
In FIG. 10, (A) to (C) are illustrations of a response-improving
effect of the thermistor 211 and the protecting element 212. In (A)
of FIG. 10, a flow (arrows) of heat generated in the heat
generating resistors 301-1 and 301-2 is added to the sectional view
of (B) of FIG. 8.
Particularly, in the case where the graphite sheet is used as the
high heat-conductive member, the thermal conductivity of the heater
substrate 303 is lower than the thermal conductivity of the high
heat-conductive member in the planar direction. Accordingly, when
the region E1 and the region HE1 are caused to overlap with each
other, the generated heat of the heat generating resistors 301-1
and 301-2 is conducted to the high heat-conductive member 220 via
the heater substrate 303 in a shortest distance. In this case, the
heat of the heat generating members is conducted inside the heater
substrate in a substrate width direction, and therefore, a heat
conduction speed is higher than in a route in which the heat is
conducted to the protecting element and the thermistor via the high
heat-conductive member, so that the response properties of the
protecting element and the thermistor are improved.
In FIG. 10, (B) is a bird's-eye view showing a portion (shown in
the sectional view of (C) of FIG. 8) where the high heat-conductive
member 220 contacts the protecting element 212. A flow of heat
generated in the heat generating resistors 301-1 and 301-2 is
indicated by arrows. The figure shows that the heat generated in
the heat generating resistors 301-1 and 301-2 is conducted to the
protecting element 212 via the high heat-conductive member 220 in
the longitudinal direction and the short direction of the heater
300.
In a non-pressure region E2 shown in (A) of FIG. 10, heat
dissipation from the high heat-conductive member 220 to the heater
supporting member 201 is prevented. As a result, when the heater
300 exhibits the thermal runaway, an effect of concentrating the
heat generated in the heat generating resistors 301-1 and 301-2 at
the protecting element 212 is enhanced.
In FIG. 10, (C) is a bird's-eye view showing a portion (shown in
the sectional view of (D) of FIG. 8) where the high heat-conductive
member 220 contacts the thermistor 211. A flow of heat generated in
the heat generating resistors 301-1 and 301-2 is indicated by
arrows. As the thermistor 211 in this embodiment, a member having
low thermal capacity compared with the protecting element 212, so
that the figure shows the case where the influence of the heat
conduction via the high heat-conductive member 220 in the
longitudinal direction of the heater is small.
Also in this case, in the non-pressure region E2 shown in (D) of
FIG. 8, heat dissipation from the high heat-conductive member 220
to the heater supporting member 201 is prevented. As a result, when
the heater 300 exhibits the thermal runaway, an effect of
concentrating the heat generated in the heat generating resistors
301-1 and 301-2 at the thermistor 211 is enhanced.
In FIG. 12, (A) to (D) show modified examples of the heater
supporting member 201 in Embodiment 1. Each of a heater supporting
member 801 in (A), a heater supporting member 802 in (B), a heater
supporting member 803 in (C) and a heater supporting member 804 in
(D) has a pressure region E1 and a non-pressure region E2.
Further, in these modified example, the heat generating member 801,
802 or 803 has both of the above-mentioned pressure region and
non-pressure region at least one common position with respect to
the longitudinal direction thereof.
In the modified examples in FIG. 12, compared with the heater
supporting member 201 in Embodiment 1, an effect of efficiently
conducting the heat generated in the heat generating resistors
301-1 and 301-2 to the high heat-conductive member 220 is decreased
in some cases. Further, in some cases, an effect of suppressing the
heat dissipation from the high heat-conductive member 220 into the
heater supporting member is decreased. However, compared with the
heater supporting member 701 in (A) of FIG. 11, it is possible to
obtain the effect of efficiently conducting the heat generated in
the heat generating resistors 301-1 and 301-2 to the high
heat-conductive member 220. Incidentally, in FIG. 12, (D) shows the
case where the width of the high heat-conductive member in narrower
than in the case of (A) of FIG. 12 (i.e., the width of the high
heat-conductive member is narrower than the substrate width of the
heater). In this way, the width of the high heat-conductive member
may also be narrower than the heater width.
Further, compared with the heater supporting member 702, it is
possible to obtain the effect of suppressing the heat dissipation
from the high heat-conductive member 220 into the heater supporting
member. That is, it is possible to compatibly realize shortening of
a time until the temperature of the image heating apparatus reaches
a predetermined temperature and shortening of response times of the
protecting element and the thermistor.
In FIG. 13, (A) to (E) shows a modified embodiment of Embodiment 1,
and show an example of the case where a heater 900 and the high
heat-conductive member 220 are bonded to each other. This modified
embodiment satisfies the conditions that an adhesive has a poor
heat-conductive property and an elongation of an adhesive is poor
to generate a stepped portion. For that reason, in this modified
embodiment, an adhesive 910 is provided between the heater and the
high heat-conductive member in a region corresponding to the second
region E2, but is not provided between the heater and the high
heat-conductive member in a region corresponding to the first
region E1. The heater 900 includes heat generating resistors 901-1
and 901-2.
In FIG. 15, (A) to (D) shows a modified embodiment of Embodiment 1,
and shows that the present invention is also applicable to the case
where the heat generation surface of the heater 900 is disposed in
the non-sheet-passing side. That is, a constitution is employed in
which the heater 900 is fitted into the heater fitting groove 201a
and is supported by the heater supporting member 201 in a state in
which the film sliding surface is disposed so as to be exposed to
an outside of the heater supporting member 201 in the heater
substrate back surface side opposite from the front surface side,
of the heater substrate 304, where the heat generating resistors
901-1 and 902-2 are provided.
[Embodiment 2]
Embodiment 2 in which the heater mounted in the fixing device 200
is modified will be described. Constituent elements similar to
those in Embodiment 1 will be omitted from illustration.
In FIG. 16, (A) to (D) are illustrations of a pressing method of a
heater 1200 and the high heat-conductive member 220 in this
embodiment. In (A) of FIG. 16, to a heat generating resistor 1201
provided along a longitudinal direction of a substrate of the
heater 1200, electric power is supplied from the electrode portions
C1 and C2 via the electroconductive member 305. The heater 1200 in
this embodiment includes the single heat generating resistor 1201.
In FIG. 16, (B), (C) and (D) are sectional views of the heater 1200
at positions of B, C and D, respectively, shown in (A) of FIG.
16.
In the cross-section of each of (B) to (D) of FIG. 16, the first
region E1 and the second region E2 are provided. The whole of the
first region E1 overlaps with the region HE1 of the heat generating
member. Further, the whole of the second region E2 opposes an
associated region out of the region HE1 of the heater 1200. The
heater 1200 includes a heater supporting member 1202.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1200 including the
single heat generating resistor.
[Embodiment 3]
Embodiment 3 in which the heater mounted in the fixing device 200
is modified will be described. Constituent elements similar to
those in Embodiment 1 will be omitted from illustration.
In FIG. 17, (A) to (E) are illustrations of a pressing method of a
heater 1300 and the high heat-conductive member 220 in this
embodiment. In (A) of FIG. 17, to electroconductive members 305-1
and 305-2 provided along a longitudinal direction of a substrate of
the heater 1300 and to a heat generating resistor 1301 provided
between the two electroconductive members, electric power is
supplied from the electrode portions C1 and C2 via the
electroconductive members 305-1 and 305-2. The heater 1300 in this
embodiment is a heater in which electric power is supplied to the
heat generating resistor 1301, and as the heat generating resistor
1301, a heat generating resistor having a positive temperature
coefficient (PTC) of resistance is used. In FIG. 17, (B), (C), (D)
and (E) are sectional views of the heater 1200 at positions of B,
C, D and E, respectively, shown in (A) of FIG. 17.
In the cross section cross section of each of (B) to (D) of FIG.
17, the first region E1 and the second region E2 are provided. The
whole of the first region E1 overlaps with the region HE1 of the
heat generating member. Further, the second region E2 not only
opposes an associated region out of the region HE1 of the heater
1300 but also extends to a position opposing the region HE1.
A resistance value of each of the electroconductive members 305-1
and 305-2 is very small but is not zero. Accordingly, a
longitudinal heat generation distribution of the heat generating
resistor 1301 of the heater 1300 is influenced by the resistance
values of the electroconductive members 305-1 and 305-2, to that
the heat generation amount of the heat generating resistor 1301 at
the end portion E is higher than the heat generation amount of the
heat generating resistor 1301 at the central portion in some cases.
When the heat generation amount at the end portion E in the heat
generation region becomes large, the thermal stress generated at
the end portion E of the heater substrate 303 when the heater 1300
is in the thermal runaway state is larger than at the central
portion of the heat generation region of the heater 1300.
For that reason, as shown in (E) of FIG. 17, at the end portion E
in the heat generation region, a contact area is increased by
pressing the high heat-conductive member 220 and the heater 1300 by
the heater supporting member 1302. As a result, the thermal stress
exerted on the heater substrate 303 can be alleviated, so that
reliability of the image heating apparatus 200 can be enhanced.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1300 in which the
electric power is supplied to the heat generating resistor 1301 in
the sheet feeding direction.
[Embodiment 4]
Embodiment 4 in which the heater mounted in the fixing device 200
is modified will be described. Constituent elements similar to
those in Embodiment 1 will be omitted from illustration.
In FIG. 18, (A) to (E) are illustrations of a pressing method of a
heater 1400 and the high heat-conductive member 220 in this
embodiment. A heat generating resistor 1401 of the heater 1400 in
this embodiment includes three heat generating resistors 1401-1,
1401-2 and 1401-3.
The heat generating resistors 1401-1 to 1401-3 are electrically
connected in parallel, and the electric power is supplied from the
electrode portions C1 and C2 via the electroconductive members 305.
Further, the heat generating resistor 1401-2, the electric power is
supplied from the electric portions C3 and C2 via the
electroconductive members 305. The heat generating resistors 1401-1
and 1401-3 always generates heat at the same time, and the heat
generating resistor 1401-2 is controlled independently of the heat
generating resistors 1401-1 and 1401-3.
Each of the heat generating resistors 1401-1 and 1401-3 has a heat
generation distribution such that the heat generation amount at the
longitudinal end portion of the heater 1400 is smaller than the
heat generation amount at the longitudinal central portion of the
heater 1400. The heat generating resistor 1401-2 has a heat
generation distribution such that the heat generation amount at the
longitudinal end portion of the heater 1400 is larger than the heat
generation amount at the longitudinal central portion of the heater
1400. In FIG. 18, (B), (C), (D) and (E) are sectional views of the
heater 1200 at positions of B, C, D and E, respectively, shown in
(A) of FIG. 18.
In the cross section of each of (B) to (D) of FIG. 18, the first
region E1 and the second region E2 are provided. The whole of the
first region E1 overlaps with the region HE1 of the heat generating
member. Further, the whole of the second region E2 opposes an
associated region out of the region HE1 of the heater 1400, or not
only opposes the associated region but also extends to a position
opposing the region HE1.
As described above, the heat generation amount of the heat
generating resistor 1401 of the heater 1400 at the end portion E is
higher than the heat generation amount at the central portion. When
the heat generation amount at the end portion E in the heat
generation region becomes large, the thermal stress generated at
the end portion E of the heater substrate 303 when the heater 1400
is in the thermal runaway state is larger than at the central
portion of the heat generation region of the heater 1400. For that
reason, as shown in (E) of FIG. 18, at the end portion E in the
heat generation region, a contact area is increased by pressing the
high heat-conductive member 220 and the heater 1400 by the heater
supporting member 1402. As a result, the thermal stress exerted on
the heater substrate 303 can be alleviated, so that reliability of
the image heating apparatus 200 can be enhanced.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1400 including three or
more heat generating resistors (1401-1, 1401-2, 1401-3) with
respect to the short direction of the heater 1400.
[Embodiment 5]
In FIG. 19, (A) to (E) are schematic views for illustrating a
pressing method of the heater 300 and the high heat-conductive
member 220 and a shape of a heater supporting member 2201. The high
heat-conductive member 220 is, as described above, sandwiched
between the heater supporting member 2201 and the heater 300 in a
pressed state by the pressing force of the pressing mechanisms 252
(L, R).
In a bottom region, of the supporting member 2201, corresponding to
the region B of the heater 300, first regions (regions E11, E12,
E13) where the supporting member contacts the high heat-conductive
member so that the pressure is applied between the heater and the
high heat-conductive member, and second regions (regions E21, E22,
E23, E24) where the supporting member is recessed from the high
heat-conductive member relative to the first regions are provided.
The first regions includes at least two portions consisting of a
first portion E11 corresponding to a downstream-most position of
the contact region NA between the film and the heater with respect
to the recording material movement direction X and a second portion
E12 upstream of the first portion E11 in the contact region NA with
respect to the recording material X. Further, at least one second
region E22 is provided between the first portion E11 and the second
portion E12. Hereinafter, the first portion E11 and the second
portion E12 are also referred to as a pressure region 1 and a
pressure region 2, respectively.
The pressure region 1 is disposed so as to include a portion
positioned downstream-most of the nip (inner surface nip) with
respect to the direction X. The pressure region 2 is disposed at a
portion positioned upstream of the pressure region 1 with respect
to the direction X. A non-pressure region E22 is provided between
the regions E11 and E12. The pressure region 2 (E12) is provided at
the substantially central portion of the heater with respect to the
direction X. With respect to the position of E12 as a reference
position, E13 is provided at a position symmetrical to the position
of E11.
The above-mentioned constitution will be described specifically. In
FIG. 19, (A) is a schematic view of the heater 300 in the front
surface side. In FIG. 19, (B), (C) and (D) are sectional views of
the heater 300 at positions B, C and D, respectively, shown in (A)
of FIG. 19.
The pressure region 1 (E11) is formed so as to include a
downstreammost portion of the region NA of the inner surface nip,
and the pressure region 2 (E12) is formed sufficiently inside the
inner surface nip. Further, a pressure region 3 (E13) is disposed
so as to be symmetrical with the pressure region 1 with respect to
a short direction center line as a reference line.
Next, in this embodiment, a principle in which the rise time of the
fixing device 200 can be shortened will be described with reference
to FIGS. 20 and 21.
In FIG. 20, (A) is a graph showing a short direction temperature
distribution of the heater 300 at the back surface (oppose from the
surface where the heat generating resistors 301-1 and 301-2 are
provided) of the heater substrate 303 in Embodiment 5 (this
embodiment), Comparison Example 1 (FIG. 11) and Comparison Example
2 (FIG. 11). In FIG. 20, (A) shows a state after a lapse of 4
seconds from rotation drive of the pressing roller 208 at a speed
of 300 mm/sec simultaneously with supply of electric power of 1000
W to the heater 300 in a state of 25.degree. C. which is a room
temperature.
As shown in (A) of FIG. 20, in each of Embodiment 5, Comparison
Example 1 and Comparison Example 2, at the back surface of the
heater 300, a temperature distribution such that the temperature is
high is obtained in a downstream side. Particularly, in a
downstream-most side of the region of the inner surface nip, a
highest temperature position exists. This is because the heat
supplied from the heater 300 to the film 202 at the inner surface
nip in the upstream side is moved toward the downstream side by
rotational movement.
As shown in the graph of (A) of FIG. 20, when an upstream-most
position of the inner surface nip is x1, a central portion position
of the heater 300 is x2, and the downstream-most position of the
inner surface is x3, a back surface temperature of the heater 300
at each of the positions is as shown in Table 1.
TABLE-US-00001 TABLE 1 x1 (US).sup.*1 x2 (CT.sup.*2) x3 (DS.sup.*3)
EMB. 5 313.degree. C. 290.degree. C. 329.degree. C. COMP.EX. 1
315.degree. C. 281.degree. C. 348.degree. C. COMP.EX. 2 284.degree.
C. 272.degree. C. 317.degree. C. .sup.*1: "US" is upstream.
.sup.*2: "CT" is central. .sup.*3: "DS" is downstream.
From Table 1, when the back surface temperatures of the heater 300
are compared between Embodiment 5 and Comparison Example 1, the
temperature at x3 (downstream) is higher in Comparison Example 1,
the temperature at x2 is higher in Embodiment 5, and the
temperature at x1 is somewhat higher in Comparison Example 1.
Further, the temperatures in Comparison Example 2 are lower than
those in Embodiment 5 and Comparison Example 1 at all the positions
x1, x2 and x3. The reason for this will be described later. Further
such a tendency of the temperature distribution with respect to the
short direction is true for another place, of the heater 300, such
as the surface protecting layer 304 which is the (front) surface of
the heater 300.
In FIG. 20, (B) is a graph showing a short direction temperature
distribution of the film 202 at the (front) surface in Embodiment
5, Comparison Example Comparison Example 2. The film 202
rotationally moves from the upstream side toward the downstream
side and is supplied with heat from the heater 300 by contact with
the heater 300 in the inner surface nip NA. For that reason, the
(front) surface temperature of the film 202 gradually increases
from the upstream side toward the downstream side in the inner
surface nip. A degree of this temperature rise depends on the short
direction temperature of the heater 300 described above with
reference to (A) of FIG. 20. That is, with a higher temperature of
the heater 300 in the inner surface nip, the surface temperature of
the film 202 more easily increases in the inner surface nip.
As shown in the graph of (B) of FIG. 20, when an upstream-most
position of the inner surface nip is x1, a central portion position
of the heater 300 is x2, and the downstream-most position of the
inner surface is x3, a back surface temperature of the film 202 at
each of the positions is as shown in Table 2. Further, in Table 2,
as a rise time of the fixing device 200, a time until the (front)
surface temperature of the film 202 reaches 225.degree. after the
electric power of 1000 W is supplied to the heater 300 in the state
of 25.degree. C. which is the room temperature is shown.
TABLE-US-00002 TABLE 2 x1 (US).sup.*1 x2 (CT.sup.*2) x3 (DS.sup.*3)
RT.sup.*4 EMB. 5 177.degree. C. 207.degree. C. 234.degree. C. 3.7
sec COMP.EX. 1 175.degree. C. 202.degree. C. 222.degree. C. 4.1 sec
COMP.EX. 2 170.degree. C. 195.degree. C. 214.degree. C. 4.4 sec
.sup.*1: "US" is upstream. .sup.*2: "CT" is central. .sup.*3: "DS"
is downstream. .sup.*4: "RT" is a rise time.
From Table 2, the surface temperature of the film 202 in Embodiment
5 is highest, and a heat quantity given to the sheet P and the
toner is largest, and therefore Embodiment 5 has a constitution in
which the rise time of the fixing device 200 can be shortened
earliest.
In FIG. 21, (A), (B) and (C) are schematic sectional views of the
heaters 300 in Embodiment 5, Comparison Example 1 and Comparison
Example 2, respectively, in which a flow of heat principally
delivered by the high heat-conductive member 220 is indicated by
arrows.
In Embodiment 5, as shown in (A) of FIG. 21, the heat of the heater
300 moves to the high heat-conductive member 220 in a place of the
pressure region 1 (E11) as indicated by an arrow a. This is because
the heater 300 has a high temperature in the downstream most side
of the inner surface nip as described above with reference to (A)
of FIG. 20 and the contact thermal resistance between the high
heat-conductive member 220 and the heater 300 in the pressure
region 1 (E11) as described above with reference to FIG. 9.
Thereafter, the heat of the arrow a moves to the central portion of
the heater 300 via the high heat-conductive member 220 as indicated
by arrows b and c. This is because the heater 300 has a lower
temperature in the inner surface nip than in another place as
described above with reference to (A) of FIG. 20 and the contact
thermal resistance between the high heat-conductive member 220 and
the heater 300 in the pressure region 2 (E12) as described above
with reference to FIG. 9.
Further, in the non-pressure region (E22) which is a region where
the heat of the arrow a passes, the contact thermal resistance
between the high heat-conductive member 220 and the heater
supporting member 2201 is high, and therefore, the heat dissipation
into the heater supporting member 2201 is prevented. For that
reason, the heat can be further efficiently moved toward the inner
surface nip of the heater 300 in the direction X.
In Comparison Example 1, as shown in (B) of FIG. 21, the heat of
the heater 300 moves to the high heat-conductive member 220 as
indicated by an arrow a'. This is because the heater 300 has a high
temperature in the downstream most side of the inner surface nip as
described above with reference to (A) of FIG. 20 and the contact
thermal resistance between the high heat-conductive member 220 and
the heater 300 in the pressure region as described above with
reference to FIG. 9.
Thereafter, the heat of the arrow a moves to the upstream side
(further upstream of the upstream-most position of the inner
surface nip) of the heater 300 via the high heat-conductive member
220 as indicated by arrows b' and c'. In this way, in Comparison
Example 1, a movement distance of the heat indicated by the arrow
b& is long, and a destination of the movement of the heat
indicated by the arrow c' is not the inner surface nip, so that the
temperature of the heater 300 at the inner surface nip is lower
than in Embodiment 5.
In Comparison Example 2, as shown in (C) of FIG. 21, the amount of
heat dissipation from the heater 300 into the heater supporting
member 702 via the high heat-conductive member 220 becomes large.
For that reason, the temperature of the whole of the heater 300
with respect to the short direction becomes low, so that the rise
time of the image heating apparatus 100 becomes long.
As described above, the heater supporting member 2201 in Embodiment
5 has the pressure region 1, where the high heat-conductive member
220 and the heater 300 are pressed against and contacted to each
other, in a region including the downstream-most side of the inner
surface nip, and has the pressure region 2 at the central portion
of the inner surface nip. As a result, the flow of the heat from
the downstream side of the heater 300 toward the inner surface nip
is created via the high heat-conductive member 220, so that the
temperature of the heater 300 at the inner surface nip is raised.
Further, places other than the pressure regions 1 to 3 are
constituted as the non-pressure regions, so that the heat
dissipation into the heater supporting member 2201 is suppressed to
facilitate the temperature rise of the heater 300.
In Embodiment 5, by employing the above-described constitution, the
inner surface nip temperature of the heater 300 is increased to
increase the (front) surface of the film 202, so that the time of
the fixing device 200 can be shortened.
(Modified Examples of Heater Supporting Member 2201)
In FIG. 22, (A) and (B) show modified examples of the heater
supporting member 2201 in Embodiment 5. Both of a heater supporting
member 2801 in (A) of FIG. 22 and a heater supporting member 2802
in (B) of FIG. 22 have constitutions in which the rise time of the
fixing device 200 can be shortened than in Comparison Examples 1
and 2. The pressure region 1 where the high heat-conductive member
220 and the heater 300 are pressed against and contacted to each
other is provided in the downstream-most side of the inner surface
nip, and the pressure region 2 is provided so as to overlap with at
least a part of the inner surface nip.
In FIG. 23, (A) to (E) are illustrations showing a modified
embodiment of Embodiment 5, and show an example of the case where
the heater 300 and the high heat-conductive member 220 are bonded
to each other by an adhesive 910. This modified embodiment is
characterized in that non-pressure regions E22 and E23 where the
high heat-conductive member 220 and the heater 300 are not pressed
by the heater supporting member 2201 are provided at positions
other than the heat generation regions of the heat generating
resistors 301-1 and 301-2, and the adhesive material is provided in
the non-pressure regions E22 and E23. In other words, the adhesive
(material) is provided between the heater and the high
heat-conductive member in regions corresponding to the second
regions E22 and E23 but is not provided between the heater and the
high heat-conductive member in regions corresponding to the first
regions E11 and E12. In this way, the adhesive is provided in the
non-pressure regions, so that the effect of Embodiment 5 can be
obtained also in the case where the adhesive having poor thermal
conductivity is used or a stepped portion is formed due to poor
elongation of the adhesive.
[Embodiment 6]
Embodiment 6 in which the heater mounted in the fixing device 200
is changed will be described. Constituent elements similar to those
in Embodiment 5 will be omitted from illustration.
In FIG. 24, (A) to (D) are illustrations of a pressing method of a
heater 1200 and the high heat-conductive member 220 in Embodiment
6. In (A) of FIG. 24, to a heat generating resistor 1201 provided
on the heater 1200 along the longitudinal direction of the heater
substrate, the electric power is applied from the electrode
portions C1 and C2 via the electroconductive members 305. The
heater 1200 in this embodiment includes only a single heat
generating resistor 1201.
Next, in this embodiment, where the pressure region positioned in
the downstream side should be provided will be described. In this
embodiment, a heater supporting member 3201 is used. In Embodiment
5, as described above with reference to FIG. 19, the heat
generating resistor exists at the end portion position of the inner
surface nip with respect to the direction X. In such a case, as
described above with reference to FIG. 20, the back surface
temperature of the heater 1200 at the downstream-most portion of
the inner surface nip becomes high. For that reason, in Embodiment
5, the pressure region was provided at the downstream-most portion
of the inner surface nip.
On the other hand, in this embodiment, as shown in FIG. 24, the
downstream end portion position of the inner surface nip is
positioned outside the region where the heat generating resistor is
provided. Also in such a constitution in Embodiment 6, the
rotational speed of the film 202 is 300 mm/sec, and therefore an
amount of heat moved to the downstream side is large, so that the
back surface temperature of the heater 1200 at the downstream-most
portion of the inner surface nip becomes high. For that reason,
also in this embodiment, the pressure region may preferably be
provided at the downstream-most portion of the inner surface nip
similarly as in Embodiment 5. Incidentally, in FIG. 24, (B), (C)
and (D) are sectional views of the heater 1200 at positions of B, C
and D, respectively, shown in (A) of FIG. 24.
In the cross section of (B) of FIG. 24, the pressure region 1 (E11)
is formed so as to include the downstream-most side of the inner
surface nip region, and the pressure region 2 (E12) is formed
sufficiently inside the inner surface nip. The pressure region 3
(E13) is disposed so as to be symmetrical with the pressure region
1 (E11) with respect to the short direction center line of the
heater 1200 as a reference line. Also, in the cross section of each
of (C) and (D) of FIG. 24, the pressure 1 (E11) is formed so as to
include the downstream-most side of the inner surface nip region.
Further, the pressure region 3 (E13) is disposed s as to be
symmetrical with the pressure region 1 (E11) with respect to the
short direction center line of the heater 1200 as the reference
line.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1200 including only the
single heat generating resistor 1201.
[Embodiment 7]
Embodiment 7 in which the heater mounted in the fixing device 200
is changed will be described. Constituent elements similar to those
in Embodiment 5 will be omitted from illustration.
In FIG. 25, (A) to (D) are illustrations of a pressing method of a
heater 1300 and the high heat-conductive member 220 in Embodiment
7. The constitution of the heater 1300 is the same as in FIG. 17,
and therefore will be omitted from illustration. Incidentally, in
FIG. 25, (B), (C) and (D) are sectional views of the heater 1300 at
positions of B, C and D, respectively, shown in (A) of FIG. 25. In
these figures, a heater supporting member 4301 is provided.
In the cross section of (B) of FIG. 25, the pressure region 1 (E11)
is formed so as to include the downstream-most side of the inner
surface nip region, and the pressure region 2 (E12) is formed
sufficiently inside the inner surface nip. The pressure region 3
(E13) is disposed so as to be symmetrical with the pressure region
1 (E11) with respect to the short direction center line of the
heater 1300 as a reference line. Also in the cross-section of each
of (C) and (D) of FIG. 25, the pressure 1 (E11) is formed so as to
include the downstream-most side of the inner surface nip region.
Further, the pressure region 3 (E13) is disposed s as to be
symmetrical with the pressure region 1 (E11) with respect to the
short direction center line of the heater 1300 as the reference
line.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1200 in which the
electric power is supplied to the 1301 with respect to the
recording material feeding direction.
[Embodiment 8]
Embodiment 8 in which the heater mounted in the fixing device 200
is changed will be described. Constituent elements similar to those
in Embodiment 5 will be omitted from illustration.
In FIG. 26, (A) to (D) are illustrations of a pressing method of a
heater 1400 and the high heat-conductive member 220 in Embodiment
8. The constitution of the heater 1400 is the same as in FIG. 18,
and therefore will be omitted from illustration. Incidentally, in
FIG. 26, (B), (C) and (D) are sectional views of the heater 1400 at
positions of B, C and D, respectively, shown in (A) of FIG. 26. In
these figures, a heater supporting member 5401 is provided.
In the cross section of (B) of FIG. 26, the pressure region 1 (E11)
is formed so as to include the downstream-most side of the inner
surface nip region, and the pressure region 2 (E12) is formed
sufficiently inside the inner surface nip. The pressure region 3
(E13) is disposed so as to be symmetrical with the pressure region
1 (E11) with respect to the short direction center line of the
heater 1400 as a reference line. Also in the cross section of each
of (C) and (D) of FIG. 26, the pressure 1 (E11) is formed so as to
include the downstream-most side of the inner surface nip region.
Further, the pressure region 3 (E13) is disposed s as to be
symmetrical with the pressure region 1 (E11) with respect to the
short direction center line of the heater 1400 as the reference
line.
As shown in this embodiment, the constitution of the present
invention is applicable to also the heater 1200 including three or
more heat generating resistors 1401-1, 1401-2 and 1401-3.
The image heating apparatus in the present invention includes, in
addition to the apparatus for heating the unfixed toner image
(visualizing agent image, developer image) to fix or temporarily
fix the image as a fixed image, an apparatus for heating the fixed
toner image again to improve a surface property such as
glossiness.
While the invention has been described with reference to the
structures disclosed herein, it is not confined to the details set
forth and this application is intended to cover such modifications
or changes as may come within the purpose of the improvements or
the scope of the following claims.
This application claims priority from Japanese Patent Applications
No. 2013-237909 filed Nov. 18, 2013, 2013-237913 filed Nov. 18,
2013 and 2014-198446 filed Sep. 29, 2014, which are hereby
incorporated by reference.
* * * * *