U.S. patent application number 15/965574 was filed with the patent office on 2018-08-30 for mask frame assembly and method of manufacturing the same.
The applicant listed for this patent is Samsung Display Co., Ltd.. Invention is credited to Sung Guk An, Hye Dong Kim, Kie Hyun Nam.
Application Number | 20180245199 15/965574 |
Document ID | / |
Family ID | 54869120 |
Filed Date | 2018-08-30 |
United States Patent
Application |
20180245199 |
Kind Code |
A1 |
Nam; Kie Hyun ; et
al. |
August 30, 2018 |
MASK FRAME ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
Abstract
A mask frame assembly for manufacturing a display device, and a
method of manufacturing the mask frame assembly are disclosed. In
one aspect, the mask frame assembly includes a frame having at
least one opening portion defined therein. The mask frame assembly
further includes a polymer film having a plurality of slits defined
therein and combined to the frame.
Inventors: |
Nam; Kie Hyun; (Yongin-si,
KR) ; Kim; Hye Dong; (Yongin-si, KR) ; An;
Sung Guk; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Display Co., Ltd. |
Yongin-si |
|
KR |
|
|
Family ID: |
54869120 |
Appl. No.: |
15/965574 |
Filed: |
April 27, 2018 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14637222 |
Mar 3, 2015 |
9982333 |
|
|
15965574 |
|
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C23C 14/50 20130101;
G03F 1/64 20130101; C23C 16/042 20130101; B32B 37/025 20130101;
H01L 27/3223 20130101; B32B 38/10 20130101; G03F 1/62 20130101;
H01L 51/0011 20130101; G03F 1/50 20130101; G03F 1/60 20130101; G03F
1/68 20130101; C23C 14/042 20130101; H01L 51/56 20130101; G03F 1/86
20130101; B32B 3/266 20130101 |
International
Class: |
C23C 14/04 20060101
C23C014/04; C23C 14/50 20060101 C23C014/50 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 23, 2014 |
KR |
10-2014-0076631 |
Claims
1. A mask frame assembly for manufacturing a display device, the
mask frame assembly comprising: a frame having at least one opening
portion defined therein; and a polymer film having a plurality of
slits defined therein and combined to the frame.
2. The mask frame assembly of claim 1, wherein the frame is formed
at least partially of a metal.
3. The mask frame assembly of claim 1, further comprising an
adhesive layer being interposed between the frame and the polymer
film and adhering the frame and the polymer film.
4. The mask frame assembly of claim 2, further comprising an
adhesive layer being interposed between the frame and the polymer
film and adhering the frame and the polymer film.
5. The mask frame assembly of claim 1, wherein the polymer film
comprises one or more of: polyimide, polyphenylene sulfide,
polyaryletherketone, and liquid crystal polymer.
6. The mask frame assembly of claim 5, wherein the polymer film
comprises a pattern portion and the slits are formed on the pattern
portion.
7. The mask frame assembly of claim 6, wherein the pattern portion
comprises a plurality of pattern portions, wherein the at least one
opening portion comprises a plurality of opening portions, and
wherein the number of the pattern portions is the same as the
number of the opening portions.
8. The mask frame assembly of claim 7, wherein the lengths and
widths of the opening portions are substantially the same.
9. The mask frame assembly of claim 6, wherein the opening portion
is formed in a location corresponding to the pattern portion.
10. The mask frame assembly of claim 9, wherein the opening portion
is formed substantially directly below the pattern portion.
11. The mask frame assembly of claim 1, wherein the thickness of
the polymer film is in the range from about 10 .mu.m to about 50
.mu.m.
12. The mask frame assembly of claim 1, wherein the polymer film
has a coefficient of thermal expansion (CTE) of about 3
ppm/.degree. C. or less.
Description
INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 14/637,222, filed Mar. 3, 2015, which claims priority
under 35 U.S.C. 119 of Korean Patent Application No.
10-2014-0076631, filed on Jun. 23, 2014, in the Korean Intellectual
Property Office, the disclosures of which are incorporated by
reference herein in their entireties.
BACKGROUND
Field
[0002] The described technology generally relates to a mask frame
assembly and a method of manufacturing the same.
Description of the Related Technology
[0003] Of display devices, organic light-emitting diode (OLED)
displays have not only a wide viewing angle and an excellent
contrast, but also a fast response rate, thereby being noted as
next-generation displays.
[0004] An OLED display includes an emission layer between a first
electrode and a second electrode facing each other, and an
intermediate layer including the emission layer. Here, the
electrodes and intermediate layer may be formed in various ways,
one of which is an independent deposition method. In order to
manufacture an OLED display using the independent deposition
method, an organic layer of a predetermined pattern is formed on a
surface of a substrate where the organic layer and the like are to
be formed, by closely adhering fine metal mask (FMM) having the
same pattern as that of the organic layer and the like to be formed
and depositing a deposition material such as the organic layer, on
the surface of the substrate.
SUMMARY OF CERTAIN INVENTIVE ASPECTS
[0005] One inventive aspect is a mask frame assembly for
manufacturing a display device such as an organic light emitting
diode (OLED) display.
[0006] Another aspect is a method of manufacturing the mask frame
assembly.
[0007] Another aspect is a mask frame assembly for depositing a
deposition material onto a substrate, and a method of manufacturing
the same.
[0008] Another aspect is a mask frame assembly which includes a
frame having at least one opening portion, and a polymer film
having plural slits combined to the frame.
[0009] The frame may include a metal.
[0010] The mask frame assembly may further include an adhesive
layer being interposed between the frame and the polymer film and
adhering the frame and the polymer film.
[0011] Also, the polymer film may include at least one selected
from polyimide, polyphenylene sulfide, polyaryletherketone (PAEK),
and liquid crystal polymer.
[0012] Also, the polymer film may include a pattern portion, and
the slit may be formed on the pattern portion.
[0013] Also, the opening portion may be formed in a location
corresponding to the pattern portion.
[0014] Another aspect is a method of manufacturing the mask frame
assembly which includes an operation of coating a polymer solution
on a glass, an operation of forming the polymer film by drying and
hardening the polymer solution, an operation of combining the frame
to the polymer film, an operation of desorbing the glass from the
polymer film, and an operation of processing a slit on the polymer
film.
[0015] The operation of combining the frame to the polymer film may
include an operation of coating an adhesive layer on the polymer
film, and an operation of combining the frame to the adhesive
layer.
[0016] The operation of processing the slit on the polymer film may
use laser patterning to process the slit. The operation of
processing the slit on the polymer film may use light exposure to
process the slit.
[0017] Another aspect is a mask frame assembly for manufacturing a
display device, the mask frame assembly comprising: a frame having
at least one opening portion defined therein; and a polymer film
having a plurality of slits defined therein and combined to the
frame.
[0018] In the above mask frame assembly, the frame is formed at
least partially of a metal. The above mask frame assembly further
comprises an adhesive layer being interposed between the frame and
the polymer film and adhering the frame and the polymer film. The
above mask frame assembly further comprises an adhesive layer being
interposed between the frame and the polymer film and adhering the
frame and the polymer film. In the above mask frame assembly, the
polymer film comprises one or more of: polyimide, polyphenylene
sulfide, polyaryletherketone, and liquid crystal polymer. In the
above mask frame assembly, the polymer film comprises a pattern
portion and the slits are formed on the pattern portion.
[0019] In the above mask frame assembly, the pattern portion
comprises a plurality of pattern portions, wherein the at least one
opening portion comprises a plurality of opening portions, and
wherein the number of the pattern portions is the same as the
number of the opening portions. In the above mask frame assembly,
the lengths and widths of the opening portions are substantially
the same. In the above mask frame assembly, the opening portion is
formed in a location corresponding to the pattern portion. In the
above mask frame assembly, the opening portion is formed
substantially directly below the pattern portion. In the above mask
frame assembly, the thickness of the polymer film is in the range
from about 10 .mu.m to about 50 .mu.m. In the above mask frame
assembly, the polymer film has a coefficient of thermal expansion
(CTE) of about 3 ppm/.degree. C. or less.
[0020] Another aspect is a method of manufacturing a mask frame
assembly for a display device, the method comprising: coating a
polymer solution on a glass; drying and hardening the polymer
solution so as to form a polymer film; combining a frame to the
polymer film; desorbing the glass from the polymer film; and
processing a plurality of slits on the polymer film.
[0021] In the above method, the combining comprises coating an
adhesive layer on the polymer film, and combining the frame to the
adhesive layer. In the above method, the processing uses laser
patterning and/or light exposure to process the slits. In the above
method, the combining is performed while the polymer solution is
being dried and hardened. In the above method, the polymer film has
a plurality of pattern portions defined therein, wherein the frame
has a plurality of opening portions defined therein, and wherein
the number of the pattern portions is the same as the number of the
opening portions. In the above method, the lengths and widths of
the opening portions are substantially the same. In the above
method, the combining comprises aligning the frame with the polymer
film such that each of the opening portions is formed substantially
directly below the corresponding pattern portion. In the above
method, the thickness of the polymer film is in the range from
about 10 .mu.m to about 50 .mu.m.
BRIEF DESCRIPTION OF THE DRAWINGS
[0022] FIG. 1 is a perspective view illustrating a mask frame
assembly according to an embodiment.
[0023] FIG. 2 is a side cross-sectional view of the mask frame
assembly of FIG. 1.
[0024] FIG. 3 is a side cross-sectional view of a mask frame
assembly according to another embodiment.
[0025] FIG. 4 is a flowchart illustrating a method of manufacturing
a mask frame assembly according to an embodiment.
[0026] FIG. 5A is a view illustrating an operation of coating a
polymer solution on a glass.
[0027] FIG. 5B is a view illustrating an operation of forming a
polymer film by drying and hardening the polymer solution.
[0028] FIG. 5C is a view illustrating an operation of combining a
frame with the polymer film.
[0029] FIG. 5D is a view illustrating an operation of desorbing the
glass from the polymer film.
[0030] FIG. 5E is a drawing illustrating an operation of processing
slits on the polymer film.
DETAILED DESCRIPTION OF CERTAIN INVENTIVE EMBODIMENTS
[0031] Reference will now be made in detail to embodiments,
examples of which are illustrated in the accompanying drawings,
wherein like reference numerals refer to like elements throughout,
and thus their repeated description will be omitted.
[0032] It will be understood that when a component, such as a
layer, a film, a region, or a plate, is referred to herein as being
"on" another component, the component can be directly on the other
component or intervening components may be present thereon. Also,
sizes of components in the drawings may be exaggerated for
convenience of explanation. In other words, since sizes and
thicknesses of components in the drawings are arbitrarily
illustrated for convenience of explanation, the following
embodiments are not limited thereto.
[0033] Also, when an embodiment may be implemented differently, a
process order may be performed differently from the described
order. For example, two consecutively described processes may be
performed substantially at the same time or performed in an order
opposite to the described order. In this disclosure, the term
"substantially" includes the meanings of completely, almost
completely or to any significant degree under some applications and
in accordance with those skilled in the art. Moreover, "formed on"
can also mean "formed over." The term "connected" includes an
electrical connection.
[0034] Embodiments will be described with respect to the
accompanying drawings. FIG. 1 is an exploded perspective view
illustrating a mask frame assembly according to an embodiment.
[0035] First, referring to FIG. 1, the mask frame assembly 10
includes a frame 100 and a polymer film 200.
[0036] The frame 100 illustrated in FIG. 1 may be manufactured with
a metal and have at least one opening portion 110 in a rectangular
form, however, the spirit of an embodiment of which is not limited
thereto, and may be formed in various forms, such as a circle or
hexagon. The length and widths of the opening portions 110 can be
substantially the same.
[0037] The polymer film 200 has a pattern portion 210a
corresponding to the opening portion 110 of the frame 100, and
plural slits 210b are formed on the pattern portion 210a so as to
allow a deposition material to pass through the slits in a
deposition process.
[0038] The polymer film 200 may be formed of polymer materials,
such as polyimide (PI), polyphenylene sulfide (PPS),
polyaryletherketone (PAEK), or liquid crystal polymer. The
above-referenced materials have an excellent thermal resistance, a
small change in property from a low temperature to a high
temperature, and a strong chemical resistance and abrasion
resistance, as high-performance plastic, and may maintain stable
performance in poor surroundings. For example, polyimide used to
manufacture the polymer film 200 has a coefficient of thermal
expansion (CTE) of about 3 ppm/.degree. C. or less, which means
that it is possible to perform fine deposition processing even in
the temperature of about 500.degree. C. or higher.
[0039] In some embodiments, the polymer film 200 is manufactured by
coating, drying, and hardening a polymer solution 200a thinly on a
glass 50 (see FIGS. 5A through 5D). In a general deposition
process, such a polymer film 200 becomes closely attached to a
display substrate (not shown) by being pulled by an electrostatic
chuck (not shown) with placing the display substrate (not shown)
between the polymer film 200 and the electrostatic chuck (not
shown).
[0040] Here, about 10 .mu.m to about 50 .mu.m is appropriate for
the thickness of the polymer film 200. If the polymer film 200 is
excessively thinner than needed, when the polymer film 200 becomes
closely attached to the display substrate by the electrostatic
chuck, the polymer film 200 may be torn or transformed. On the
contrary, if the polymer film 200 is excessively thicker than
needed, the polymer film 200 fails to become completely closely
attached to the display substrate by the weight of the polymer film
200 itself, which causes a shadow phenomenon where a deposition
material reaches a region beyond the region that the slit 210b of
the polymer film 200 defines in time of deposition, and a thickness
distortion phenomenon of a deposition film. Accordingly, the
polymer film 200 is formed with an appropriate thickness to provide
an optimum deposition process, in other words, if the polymer film
200 is manufactured in the thickness of about 10 to about 50 .mu.m
as described above, superfine deposition patterning is possible
even on a large-scale substrate without damage, transformation, or
sagging. However, depending on embodiments, it is possible that the
thickness of the polymer film 200 is less than about 10 .mu.m or
greater than about 50 .mu.m.
[0041] Hereinafter, a combined structure of the frame 100 and the
polymer film 200 will be described with reference to FIG. 2.
[0042] FIG. 2 is a side cross-sectional view of the mask frame
assembly of FIG. 1.
[0043] Referring to FIG. 2, the mask frame assembly 10 is arranged
so that the opening portions 110 of the frame 100 correspond to
(e.g., located substantially directly below) the pattern portions
210a of the polymer film 200. The frame 100 and the polymer film
200 may be combined in many ways, and the mask frame assembly 10
illustrated in FIG. 2 shows the state where the frame 100 has been
combined with the polymer film 200 during the drying and hardening
of the polymer film 200.
[0044] FIG. 3 is a side cross-sectional view illustrating a mask
frame assembly according to another embodiment.
[0045] Referring to FIG. 3, the mask frame assembly 10 illustrates
the state where the frame 100 is adhered on the polymer film 200 by
further including an adhesive layer 300 between the frame 100 and
the polymer film 200. For a material of the adhesive layer 300,
silicone may be used.
[0046] Generally, as an organic material deposition process is
repeatedly performed, an organic material gets accumulated and
remains on the mask frame assembly 10. If the organic material
deposition process continues to be performed leaving the organic
material accumulated on the mask frame assembly 10 as such, the
above-referenced shadow phenomenon or the deposition film thickness
distortion phenomenon appears. Here, if the frame 100 and the
polymer film 200 are combined with silicone, the attachment and
detachment of the frame 100 and the polymer film 200 becomes
facilitated, therefore, it is possible to perform an efficient
organic material deposition process by rapidly attaching or
detaching the polymer film 200 to or from the frame 100.
[0047] Hereinafter, a method of manufacturing the mask frame
assembly 10 according to an embodiment will be described with
reference to FIGS. 4, and 5A through 5E. Depending on the
embodiment, additional states (operations) can be added, others
removed, or the order of the states (operations) changed in FIG.
4.
[0048] Referring to the flowchart of FIG. 4, the method of
manufacturing the mask frame assembly 10 may include coating the
polymer solution 200a on the glass 50 in operation S401, drying and
hardening the polymer solution 200a in operation S402, combining
the frame 100 to the polymer film 200 in operation S403, desorbing
the glass 50 in operation S404, and processing a plurality of slits
210b on the pattern portions 210a of the polymer film 200 in
operation S405.
[0049] In coating the polymer solution 200a in operation S401,
polymer materials, such as PI, PPS, PEEK, or liquid crystal polymer
as recited above may be used as the material of the polymer
solution 200a.
[0050] If the coating of the polymer solution 200a on the glass 50
in operation S401 (see FIG. 5A) is followed by the drying and
hardening of the polymer solution 200a in operation S402, the
polymer film 200 is formed on the glass 50 (see FIG. 5B).
[0051] The frame 100 and the polymer film 200 can be combined in
two ways.
[0052] First, the frame 100 may be combined to the polymer solution
200a before the polymer solution 200a becomes substantially
completely dried, and FIG. 5C is a view illustrating the form of
the frame 100 and the polymer film 200 combined as such.
[0053] Otherwise, after the polymer solution 200a coated on the
frame 100 becomes substantially completely dried and hardened and
turns into the polymer film 200, as illustrated in FIG. 3, the
frame 100 and the polymer film 200 may be combined by coating the
adhesive layer 300 on the polymer film 200 and then combining the
frame 100 to the adhesive layer 300. Silicone may be used as the
material of such an adhesive layer 300, which has been described
above, and therefore, detailed explanations thereof are omitted
herein.
[0054] After the frame 100 and the polymer film 200 are combined to
each other as such, it is prepared to form the slits 210b on the
pattern portions 210a of the polymer film 200 by desorbing the
glass 50 in operation S404.
[0055] Finally, after the glass 50 is desorbed, the slits 210b are
formed on the polymer film 200 in operation S405. Here, the slits
210b of the polymer film 200 may be formed in various ways, but it
is preferable to form the slits 210b by a laser patterning method
or a light exposure method.
[0056] As described above, according to at least one of the above
embodiments, the mask frame assembly and the method of
manufacturing the same enables superfine deposition patterning and
has the effect of improving the deposition film thickness
distortion phenomenon by the sagging of a substrate or a mask. The
mask frame assembly can be used to deposit deposition materials to
a display substrate to manufacture a display device such as
OLEDs.
[0057] While the inventive technology has been described with
reference to the figures, it will be understood by those of
ordinary skill in the art that various changes in form and details
may be made therein without departing from the spirit and scope of
the present invention as defined by the following claims.
* * * * *