U.S. patent application number 13/414730 was filed with the patent office on 2013-07-25 for heat dissipating device and method of manufacturing the same.
The applicant listed for this patent is Han-Lin Chen, Hsuan-Hao Pai, Cheng-En Tsai. Invention is credited to Han-Lin Chen, Hsuan-Hao Pai, Cheng-En Tsai.
Application Number | 20130186599 13/414730 |
Document ID | / |
Family ID | 48796282 |
Filed Date | 2013-07-25 |
United States Patent
Application |
20130186599 |
Kind Code |
A1 |
Chen; Han-Lin ; et
al. |
July 25, 2013 |
HEAT DISSIPATING DEVICE AND METHOD OF MANUFACTURING THE SAME
Abstract
A heat dissipating device includes a base, a heat pipe and a
fixing member. The base includes an accommodating recess and two
restraining portions, wherein the two restraining portions are
located at opposite sides of the accommodating recess and an
opening is between the two restraining portions. A first end of the
heat pipe is disposed in the accommodating recess such that a
bottom surface of the first end is exposed out of the opening,
wherein a width of the opening is smaller than a maximum width of
the first end. The fixing member is disposed on the base such that
the first end of the heat pipe is fixed between the fixing member
and the two restraining portions.
Inventors: |
Chen; Han-Lin; (New Taipei
City, TW) ; Pai; Hsuan-Hao; (New Taipei City, TW)
; Tsai; Cheng-En; (New Taipei City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Chen; Han-Lin
Pai; Hsuan-Hao
Tsai; Cheng-En |
New Taipei City
New Taipei City
New Taipei City |
|
TW
TW
TW |
|
|
Family ID: |
48796282 |
Appl. No.: |
13/414730 |
Filed: |
March 8, 2012 |
Current U.S.
Class: |
165/104.21 ;
29/890.032 |
Current CPC
Class: |
H01L 21/4882 20130101;
H01L 23/3672 20130101; H01L 2924/0002 20130101; H01L 23/427
20130101; F28D 15/0233 20130101; H01L 2924/0002 20130101; F28D
15/0275 20130101; Y10T 29/49353 20150115; H01L 2924/00
20130101 |
Class at
Publication: |
165/104.21 ;
29/890.032 |
International
Class: |
F28D 15/02 20060101
F28D015/02; B21D 53/02 20060101 B21D053/02 |
Foreign Application Data
Date |
Code |
Application Number |
Jan 19, 2012 |
TW |
101102186 |
Claims
1. A heat dissipating device comprising: a base comprising an
accommodating recess and two restraining portions, the two
restraining portions being located at opposite sides of the
accommodating recess, an opening being between the two restraining
portions; a heat pipe, a first end of the heat pipe being disposed
in the accommodating recess such that a bottom surface of the first
end is exposed out of the opening, a width of the opening being
smaller than a maximum width of the first end; and a fixing member
disposed on the base such that the first end of the heat pipe is
fixed between the fixing member and the two restraining
portions.
2. The heat dissipating device of claim 1, wherein the bottom
surface of the first end and a bottom surface of the base are
coplanar.
3. The heat dissipating device of claim 1, wherein the base further
comprises a first half portion, a second half portion and at least
one rib, the accommodating recess is formed between the first half
portion and the second half portion, and the at least one rib
connects the first half portion and the second half portion.
4. The heat dissipating device of claim 3, wherein the at least one
rib and the fixing member are located at one side of the base.
5. The heat dissipating device of claim 3, wherein the at least one
rib and the fixing member are located at opposite sides of the
base.
6. The heat dissipating device of claim 1, wherein a surface of
each of the two restraining portions, which contacts the first end
of the heat pipe, is an arc surface or an oblique surface.
7. The heat dissipating device of claim 1 further comprising a heat
sink disposed on a second end of the heat pipe.
8. The heat dissipating device of claim 1, wherein the heat pipe is
a flat heat pipe.
9. A method of manufacturing a heat dissipating device comprising:
forming a base by a die casting process, wherein the base comprises
an accommodating recess; disposing a first end of a heat pipe in
the accommodating recess; disposing a fixing member on the base so
as to fix the first end of the heat pipe in the accommodating
recess; and milling a bottom surface of the base so as to form an
opening at one side of the accommodating recess such that a bottom
surface of the first end is exposed out of the opening, wherein a
width of the opening is smaller than a maximum width of the first
end.
10. The method of claim 9, wherein the bottom surface of the first
end and the bottom surface of the base after milling are
coplanar.
11. The method of claim 9, wherein the base further comprises a
first half portion, a second half portion and at least one rib, the
accommodating recess is formed between the first half portion and
the second half portion, and the at least one rib connects the
first half portion and the second half portion.
12. The method of claim 11, wherein the at least one rib and the
fixing member are located at one side of the base.
13. The method of claim 11, wherein the at least one rib and the
fixing member are located at opposite sides of the base.
14. The method of claim 9, wherein the opening is between two
restraining portions, and a surface of each of the two restraining
portions, which contacts the first end of the heat pipe, is an arc
surface or an oblique surface.
15. The method of claim 9 further comprising: disposing a heat sink
on a second end of the heat pipe.
16. The method of claim 9, wherein the heat pipe is a flat heat
pipe.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The invention relates to a heat dissipating device and a
method of manufacturing the same and, more particularly, to a heat
dissipating device with a base formed by a die casting process and
a method of manufacturing the heat dissipating device.
[0003] 2. Description of the Prior Art
[0004] Heat dissipating device is a significant component for
electronic products. When an electronic product is operating, the
current in circuit will generate unnecessary heat due to impedance.
If the heat is accumulated in the electronic components of the
electronic product without dissipating immediately, the electronic
components may get damage due to the accumulated heat. Therefore,
the performance of heat dissipating device is a significant issue
for the electronic product.
[0005] In general, most of the heat dissipating devices are
equipped with heat pipes for conducting heat from electronic
components to a heat sink and then the heat is dissipated out of
the electronic product by the heat sink. So far a base of the
conventional heat dissipating device, which is used for carrying
the heat pipe, has to be processed by several processes and it
wastes much time in transporting the base to each process such that
production efficiency will decrease and production cost will
increase.
SUMMARY OF THE INVENTION
[0006] The invention provides a heat dissipating device with a base
formed by a die casting process and a method of manufacturing the
heat dissipating device so as to solve the aforesaid problems.
[0007] According to an embodiment of the invention, a heat
dissipating device comprises a base, a heat pipe and a fixing
member. The base comprises an accommodating recess and two
restraining portions, wherein the two restraining portions are
located at opposite sides of the accommodating recess and an
opening is between the two restraining portions. A first end of the
heat pipe is disposed in the accommodating recess such that a
bottom surface of the first end is exposed out of the opening,
wherein a width of the opening is smaller than a maximum width of
the first end. The fixing member is disposed on the base such that
the first end of the heat pipe is fixed between the fixing member
and the two restraining portions.
[0008] According to another embodiment of the invention, a method
of manufacturing a heat dissipating device comprises steps of
forming a base by a die casting process, wherein the base comprises
an accommodating recess; disposing a first end of a heat pipe in
the accommodating recess; disposing a fixing member on the base so
as to fix the first end of the heat pipe in the accommodating
recess; and milling a bottom surface of the base so as to form an
opening at one side of the accommodating recess such that a bottom
surface of the first end is exposed out of the opening, wherein a
width of the opening is smaller than a maximum width of the first
end.
[0009] In the aforesaid embodiment, the heat pipe, which is exposed
out of the opening of the accommodating recess, can be attached on
an electronic component so as to dissipate heat from the electronic
component.
[0010] As mentioned in the above, since the base of the heat
dissipating device of the invention is formed by the die casting
process and the die casting process is very simple, production
efficiency can increase and production cost can decrease
accordingly. Furthermore, after disposing the heat pipe in the
accommodating recess of the base, the invention mills the bottom
surface of the base so as to expose the heat pipe and then attaches
the exposed heat pipe on an electronic component, such that the
whole height of the heat dissipating device can be reduced
effectively. Accordingly, the heat dissipating device of the
invention can be designed as thin as possible.
[0011] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] FIG. 1 is a flowchart illustrating a method of manufacturing
a heat dissipating device according to an embodiment of the
invention.
[0013] FIG. 2 is a perspective view illustrating a base.
[0014] FIG. 3 is an assembly view illustrating the base, a heat
pipe and a heat sink.
[0015] FIG. 4 is an assembly view illustrating the base, the heat
pipe, the heat sink and a fixing member.
[0016] FIG. 5 is a cross-sectional view illustrating the base, the
heat pipe and the fixing member along line X-X shown in FIG. 4.
[0017] FIG. 6 is a cross-sectional view illustrating parts of the
base shown in FIG. 5 after milling.
[0018] FIG. 7 is a rear perspective view illustrating a heat
dissipating device manufactured by the method shown in FIG. 1.
[0019] FIG. 8 is a front perspective view illustrating the base
shown in FIG. 7.
[0020] FIG. 9 is a perspective view illustrating a base.
[0021] FIG. 10 is an assembly view illustrating the base, a heat
pipe and a heat sink.
[0022] FIG. 11 is an assembly view illustrating the base, the heat
pipe, the heat sink and a fixing member.
[0023] FIG. 12 is a cross-sectional view illustrating the base, the
heat pipe and the fixing member along line Y-Y shown in FIG.
11.
[0024] FIG. 13 is a cross-sectional view illustrating parts of the
base shown in FIG. 12 after milling.
[0025] FIG. 14 is a rear perspective view illustrating another heat
dissipating device manufactured by the method shown in FIG. 1.
[0026] FIG. 15 is a front perspective view illustrating the base
shown in FIG. 14.
DETAILED DESCRIPTION
[0027] Referring to FIGS. 1 to 8, FIG. 1 is a flowchart
illustrating a method of manufacturing a heat dissipating device
according to an embodiment of the invention, FIG. 2 is a
perspective view illustrating a base 10, FIG. 3 is an assembly view
illustrating the base 10, a heat pipe 12 and a heat sink 14, FIG. 4
is an assembly view illustrating the base 10, the heat pipe 12, the
heat sink 14 and a fixing member 16, FIG. 5 is a cross-sectional
view illustrating the base 10, the heat pipe 12 and the fixing
member 16 along line X-X shown in FIG. 4, FIG. 6 is a
cross-sectional view illustrating parts of the base 10 shown in
FIG. 5 being milled, FIG. 7 is a rear perspective view illustrating
a heat dissipating device 1 manufactured by the method shown in
FIG. 1, and FIG. 8 is a front perspective view illustrating the
base 10 shown in FIG. 7, wherein FIGS. 2 to 6 are used for
illustrating each step shown in FIG. 1 according to an embodiment
of the invention.
[0028] First of all, step S10 is performed to form a base 10 by a
die casting process, wherein the base 10 comprises an accommodating
recess 100, a first half portion 102, a second half portion 104,
two ribs 106 and four riveting portions 108, as shown in FIG. 2.
The accommodating recess 100 is formed between the first half
portion 102 and the second half portion 104. The two ribs 106 are
located at opposite sides of the base 10 and connect the first half
portion 102 and the second half portion 104. It should be noted
that the number and the position of the ribs 106 and the riveting
portions 108 can be determined based on practical applications and
are not limited to the embodiment shown in FIG. 2.
[0029] Afterward, step S12 is performed to dispose a first end 120
of a heat pipe 12 in the accommodating recess 100 and dispose a
heat sink 14 on a second end 122 of the heat pipe 12, as shown in
FIG. 3. The first end 120 of the heat pipe 12 passes through a
through hole 110 (shown in FIG. 2) on one side of the base 10 so as
to be disposed in the accommodating recess 100. In this embodiment,
the heat pipe 12 is a flat heat pipe. However, in another
embodiment, the heat pipe 12 may be a circular heat pipe or other
heat pipes and it depends on practical applications. Furthermore,
the heat sink 14 may consist of, but not limited to, a plurality of
heat dissipating fins.
[0030] Afterward, step S14 is performed to dispose a fixing member
16 on the base 10 so as to fix the first end 120 of the heat pipe
12 in the accommodating recess 100, as shown in FIG. 4. In
practical applications, the fixing member 16 may be, but not
limited to, a metal resilient plate. In this embodiment, the fixing
member 16 may be riveted on the riveting portions 108 of the base
10. Furthermore, if there are no riveting portions 108 formed on
the base 10 in the die casting process, the fixing member 16 may be
disposed on the base 10 by screws, soldering or other fixing
manners. After disposing the fixing member 16 on the base 10, the
ribs 106 and the fixing member 16 are located at the same side of
the base 10. As shown in FIG. 5, a thickness T1 is between a bottom
surface 112 of the base 10 and a bottom surface 114 of the
accommodating recess 100.
[0031] Finally, step S16 is performed to mill the bottom surface
112 of the base 10 so as to form an opening 116 at one side of the
accommodating recess 100 such that a bottom surface 124 of the
first end 120 of the heat pipe 12 is exposed out of the opening
116, as shown in FIG. 6. In other words, step S16 is to mill the
material with the thickness T1 shown in FIG. 5 so as to expose the
bottom surface 124 of the first end 120 of the heat pipe 12. At
this time, two restraining portions 118 are located at opposite
sides of the accommodating recess 100 respectively and the opening
116 is between the two restraining portions 118. In this
embodiment, a width W1 of the opening 116 is smaller than a maximum
width W2 of the first end 120 of the heat pipe 12 such that the two
restraining portions 118 can support the first end 120 of the heat
pipe 12 in the accommodating recess 100, so as to prevent the first
end 120 of the heat pipe 12 from coming off the opening 116. In
other words, the first end 120 of the heat pipe 12 is fixed between
the fixing member 16 and the two restraining portions 118.
Furthermore, since both sides of the first end 120 of the heat pipe
12 are arc-shaped, a surface of each of the two restraining
portions 118, which contacts the first end 120 of the heat pipe 12,
is an arc surface such that the first end 120 of the heat pipe 12
can be attached to the two restraining portions 118 tightly.
Accordingly, the first end 120 of the heat pipe 12 can be disposed
in the accommodating recess 100 stably. It should be noted that if
both sides of the first end 120 of the heat pipe 12 are oblique, a
surface of each of the two restraining portions 118, which contacts
the first end 120 of the heat pipe 12, will be an oblique surface
correspondingly.
[0032] Therefore, a heat dissipating device 1 shown in FIG. 7 can
be manufactured through the aforesaid steps S10 to S16. In
practical applications, the exposed bottom surface 124 of the first
end 120 of the heat pipe 12 can be attached to an electronic
component (not shown) and then the fixing member 16 can be fixed on
a circuit board of an electronic product (not shown) so as to
dissipate heat from the electronic component. As shown in FIG. 7,
after manufacturing the heat dissipating device 1, the bottom
surface 124 of the first end 120 of the heat pipe 12 and the bottom
surface 112 of the base 10 after milling may be coplanar so as to
increase heat dissipating area of the heat pipe 12 and enhance
stability while the heat dissipating device 1 is attached to the
electronic component. Moreover, the two ribs 106, which connect the
first half portion 102 and the second half portion 104, can enhance
rigidity of the base 10 so as to prevent the heat dissipating
device 1 from being damaged due to over-pressure during
assembly.
[0033] Referring to FIGS. 9 to 15, FIG. 9 is a perspective view
illustrating a base 30, FIG. 10 is an assembly view illustrating
the base 30, a heat pipe 32 and a heat sink 34, FIG. 11 is an
assembly view illustrating the base 30, the heat pipe 32, the heat
sink 34 and a fixing member 36, FIG. 12 is a cross-sectional view
illustrating the base 30, the heat pipe 32 and the fixing member 36
along line Y-Y shown in FIG. 11, FIG. 13 is a cross-sectional view
illustrating parts of the base 30 shown in FIG. 12 after milling,
FIG. 14 is a rear perspective view illustrating another heat
dissipating device 3 manufactured by the method shown in FIG. 1,
and FIG. 15 is a front perspective view illustrating the base 30
shown in FIG. 14, wherein FIGS. 9 to 13 are used for illustrating
each step shown in FIG. 1 according to another embodiment.
[0034] First of all, step S10 is performed to form a base 30 by a
die casting process, wherein the base 30 comprises an accommodating
recess 300, a first half portion 302, a second half portion 304,
two ribs 306 and four riveting portions 308, as shown in FIG. 9.
The accommodating recess 300 is formed between the first half
portion 302 and the second half portion 304. The two ribs 306 are
located at opposite sides of the base 30 and connect the first half
portion 302 and the second half portion 304. It should be noted
that the number and the position of the ribs 306 and the riveting
portions 308 can be determined based on practical applications and
are not limited to the embodiment shown in FIG. 9.
[0035] Afterward, step S12 is performed to dispose a first end 320
of a heat pipe 32 in the accommodating recess 300 and dispose a
heat sink 34 on a second end 322 of the heat pipe 32, as shown in
FIG. 10. The first end 320 of the heat pipe 32 is disposed in the
accommodating recess 300 from the top of the base 30 downwardly. In
this embodiment, the heat pipe 32 is a flat heat pipe. However, in
another embodiment, the heat pipe 32 may be a circular heat pipe or
other heat pipes and it depends on practical applications.
[0036] Afterward, step S14 is performed to dispose a fixing member
36 on the base 30 so as to fix the first end 320 of the heat pipe
32 in the accommodating recess 300, as shown in FIG. 11. In
practical applications, the fixing member 36 may be, but not
limited to, a metal resilient plate. In this embodiment, the fixing
member 36 may be riveted on the riveting portions 308 of the base
30. Furthermore, if there are no riveting portions 308 formed on
the base 30 in the die casting process, the fixing member 36 may be
disposed on the base 30 by screws, soldering or other fixing
manners. After disposing the fixing member 36 on the base 30, the
ribs 306 and the fixing member 36 are located at opposite sides of
the base 30. As shown in FIG. 12, a thickness T2 is between a
bottom surface 312 of the base 30 and a bottom surface 314 of the
accommodating recess 300.
[0037] Finally, step S16 is performed to mill the bottom surface
312 of the base 30 so as to form an opening 316 at one side of the
accommodating recess 300 such that a bottom surface 324 of the
first end 320 of the heat pipe 32 is exposed out of the opening
316, as shown in FIG. 13. In other words, step S16 is to mill the
material with the thickness T2 shown in FIG. 12 so as to expose the
bottom surface 324 of the first end 320 of the heat pipe 32. At
this time, two restraining portions 318 are located at opposite
sides of the accommodating recess 300 respectively and the opening
316 is between the two restraining portions 318. In this
embodiment, a width W3 of the opening 316 is smaller than a maximum
width W4 of the first end 320 of the heat pipe 32 such that the two
restraining portions 318 can support the first end 320 of the heat
pipe 32 in the accommodating recess 300, so as to prevent the first
end 320 of the heat pipe 32 from coming off the opening 316. In
other words, the first end 320 of the heat pipe 32 is fixed between
the fixing member 36 and the two restraining portions 318.
Furthermore, since both sides of the first end 320 of the heat pipe
32 are arc-shaped, a surface of each of the two restraining
portions 318, which contacts the first end 320 of the heat pipe 32,
is an arc surface such that the first end 320 of the heat pipe 32
can be attached to the two restraining portions 318 tightly.
Accordingly, the first end 320 of the heat pipe 32 can be disposed
in the accommodating recess 300 stably. It should be noted that if
both sides of the first end 320 of the heat pipe 32 are oblique, a
surface of each of the two restraining portions 318, which contacts
the first end 320 of the heat pipe 32, will be an oblique surface
correspondingly.
[0038] Therefore, a heat dissipating device 3 shown in FIG. 14 can
be manufactured through the aforesaid steps S10 to S16. In
practical applications, the exposed bottom surface 324 of the first
end 320 of the heat pipe 32 can be attached to an electronic
component (not shown) and then the fixing member 36 can be fixed on
a circuit board of an electronic product (not shown) so as to
dissipate heat from the electronic component. As shown in FIG. 14,
after manufacturing the heat dissipating device 3, the bottom
surface 324 of the first end 320 of the heat pipe 32 and the bottom
surface 312 of the base 30 after milling may be coplanar so as to
increase heat dissipating area of the heat pipe 32 and enhance
stability while the heat dissipating device 3 is attached to the
electronic component. Moreover, the two ribs 306, which connect the
first half portion 302 and the second half portion 304, can enhance
rigidity of the base 30 so as to prevent the heat dissipating
device 3 from being damaged due to over-pressure during
assembly.
[0039] Compared with the prior art, since the base of the heat
dissipating device of the invention is formed by the die casting
process and the die casting process is very simple, production
efficiency can increase and production cost can decrease
accordingly. Furthermore, after disposing the heat pipe in the
accommodating recess of the base, the invention mills the bottom
surface of the base so as to expose the heat pipe and then attaches
the exposed heat pipe on an electronic component, such that the
whole height of the heat dissipating device can be reduced
effectively. Accordingly, the heat dissipating device of the
invention can be designed as thin as possible.
[0040] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *